JP2010082562A - Pattern forming method, device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method, a device and electronic equipment for forming a pattern having a cross section shape with a narrow width and a uniform thickness. <P>SOLUTION: The pattern forming method includes: a first stage that heats a substrate to a prescribed temperature; a second stage that, holding the substrate at the prescribed temperature, drips a liquid material with pattern forming materials dispersed or dissolved, on the substrate and dries it; a third stage that makes the evaporation speed slower than the evaporation speed when the liquid material is dripped on the substrate of the prescribed temperature; and a fourth stage that drips the liquid material on the dried body which is formed by drying the liquid material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a pattern forming method, a device, and an electronic apparatus using a liquid material in which a pattern forming material is dispersed or dissolved, and more particularly to a pattern forming method, a device, and an electronic apparatus having a narrow width and a uniform thickness.

Conventionally, techniques such as a photolithography method, a transfer method, a mask printing method, and plating are used as a method for manufacturing a wiring pattern of a printed wiring board. Recently, attention has been paid to a method of directly printing a conductive fine particle paste in which conductive fine particles are dispersed by an ink jet method.
However, ink that can be ejected by the ink jet method has a low viscosity and tends to spread, and it has been difficult to draw a fine line pattern. In addition, after drying the ink, the coffee stain phenomenon occurs due to non-uniform evaporation rates at the edge and center of the liquid, and particles accumulate at the edge, resulting in uneven film thickness at the center. There is a problem. Therefore, a film forming method for suppressing nonuniform film thickness has been proposed (see Patent Document 1).

  Patent Document 1 is a film forming method including a discharge step of forming a film pattern by discharging droplets made of a liquid material containing a film forming component onto a substrate, and the liquid material discharged onto the substrate It has a drying process for drying the film pattern so that the film forming component moves to the edge of the film pattern, and a second discharge process for discharging droplets between the edges protruding by the movement of the film forming component. is there. As described above, in Patent Document 1, after a liquid droplet is ejected to form a wiring pattern, a drying process for promoting the coffee stain phenomenon is provided. It is said that the wiring pattern can be flattened by ejecting the liquid again into the concave shape.

Japanese Patent No. 4042460

  However, in the film forming method of Patent Document 1, the droplets are further ejected inside the concave shape formed by drying the droplets, but when the temperature of the substrate or the like at this time is high, the droplets were ejected inside. When the droplet dries, it becomes concave again. For this reason, there is a problem that the cross-sectional shape of the formed wiring pattern has a non-uniform thickness. If the thickness of the wiring pattern is non-uniform, there is a possibility of disconnection due to non-uniform current density.

  An object of the present invention is to provide a pattern forming method, a device, and an electronic apparatus that have a cross-sectional shape that is narrow in width and uniform in thickness, solving the problems based on the above-described prior art.

  In order to achieve the above object, according to a first aspect of the present invention, there is provided a first step of heating a substrate to a predetermined temperature, and dispersing or dissolving a pattern forming material while maintaining the substrate at a predetermined temperature. A second step of dropping the dried liquid material onto the substrate and drying; a third step of lowering the evaporation rate than the evaporation rate when the liquid material is dropped onto the substrate at the predetermined temperature; And a fourth step of dropping the liquid material onto a dried body obtained by drying the liquid material.

In the present invention, it is preferable that the third step of slowing down the evaporation rate includes a step of lowering the temperature of the substrate to a temperature lower than that of the second step.
In the present invention, it is preferable that the third step of slowing down the evaporation rate includes a step of increasing the humidity of the dry body.

Furthermore, in this invention, it is preferable that the dripping amount of the liquid material in the said 2nd process differs from the dripping amount of the liquid material in the said 4th process.
Furthermore, in the present invention, it is preferable that the dropping density of the liquid material in the second step is different from the dropping density of the liquid material in the fourth step.

In the present invention, it is preferable that the liquid material is dropped by an ink jet type or dispenser type discharging means.
In the present invention, the pattern forming material is preferably fine particles of a metal, an oxide or alloy of the metal.
In the present invention, the metal is preferably gold, silver, copper, platinum, nickel, palladium, or tin.

According to a second aspect of the present invention, there is provided a device having a portion formed by using the pattern forming method according to the first aspect of the present invention.
The part is, for example, a wiring pattern.

  According to a third aspect of the present invention, there is provided an electronic apparatus comprising the device according to the second aspect of the present invention.

According to the pattern forming method of the present invention, it is possible to form a pattern having a cross-sectional shape with a narrow width and a uniform thickness. In this way, by making the wiring pattern thinner, high-density wiring becomes possible. Furthermore, since the thickness of the wiring pattern is uniform, the current density becomes uniform and the possibility of disconnection is suppressed. .
According to the device of the present invention, the device can be miniaturized and thinned, and defects such as disconnection and short-circuiting are unlikely to occur.
According to the electronic device of the present invention, the electronic device can be reduced in size and thinned, and defects such as disconnection and short circuit are hardly generated.

Hereinafter, a pattern forming method, a device, and an electronic apparatus of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
In the present invention, a substrate is heated, and a liquid material in which a pattern forming material is dispersed or dissolved is dropped onto the heated substrate and dried. When the liquid material is dropped on the substrate, the evaporation rate is made slower than when the liquid material is dropped on the heated substrate. Then, a pattern is formed by further dropping the liquid material onto a dried body obtained by drying the liquid material.

The present invention has been made on the basis of the following knowledge. First, this knowledge will be described.
Here, FIG. 1 is a graph showing the dependence of the line width of the dry body on the substrate on the substrate temperature, with the line width on the vertical axis and the substrate temperature on the horizontal axis.
The inventor first examined the wet spreadability of the liquid material when the liquid material was dropped on the substrate. As a result, as shown in FIG. 1, it was found that the higher the substrate temperature, the more the evaporation of the solvent is promoted and the line width becomes narrower. The higher the substrate temperature, the more effective the spread suppression.
In the plot shown in FIG. 1, the cross-sectional shape after the liquid material was dropped onto a substrate having a substrate temperature of 25 ° C. and a substrate temperature of 60 ° C. and dried to obtain a dry body was measured. The results are shown in FIGS. 2 (a) and 2 (b).

FIG. 2A is a cross-sectional profile of a dry body when a liquid material is dropped at a substrate temperature of 60 ° C. with the horizontal axis taking the distance in the width direction and the vertical axis taking the height, and FIG. The cross-sectional profile of the dry body when the liquid material is dropped at a substrate temperature of 25 ° C. with the horizontal axis being the distance in the width direction and the vertical axis being the height.
As shown in FIGS. 2 (a) and 2 (b), the higher the substrate temperature, the more the convection of the solvent is promoted, the cross-sectional height difference in the dry body becomes larger, the end in the width direction becomes higher, and the cross-sectional shape becomes larger. It became almost concave.
In such a temperature range, for example, the liquid material was dropped again on the dry body having the cross-sectional shape shown in FIG. That is, the liquid material was dropped again on the dried body with the substrate temperature kept at 60 ° C., and dried.
In this case, as shown to Fig.3 (a), a recessed part is further formed in the recessed part of a dry body, and cross-sectional shape does not become a rectangle.
Next, the liquid material was dropped again and dried at the substrate temperature of 25 ° C. on the dried body (FIG. 2B) when the liquid material was dropped at the substrate temperature of 25 ° C. In this case, as shown in FIG.3 (b), it turned out that a cross-sectional shape approximates a rectangular shape, without forming a recessed part further in a recessed part.
As described above, when the liquid material is dropped again with the substrate temperature kept constant, the present inventors show that as the substrate temperature is higher and the line width is narrower, the cross-sectional shape after dropping again is separated from the rectangle. Found.

Furthermore, as a result of intensive studies, the present inventor has found that when the liquid material is dropped again, the cross-sectional shape after dropping again is separated from the rectangle due to the evaporation amount.
Therefore, in order to adjust the evaporation amount of the liquid material to be dropped again, in addition to the substrate temperature, the cross-sectional shape after dropping again can be made closer to a rectangular shape by adjusting the humidity around which the liquid material is dropped. I understood.
In the present invention, by dropping the liquid material at a temperature lower than the temperature at which the liquid material is first dropped, the height difference generated when the liquid material to be dropped next is dried is reduced, and the rectangular shape becomes more rectangular. A pattern having a cross-section close to 1 can be formed.
Furthermore, in the present invention, in the environment where the temperature is higher than the temperature at which the liquid material is first dropped, by dropping the liquid material next, it becomes difficult to dry the liquid material to be dropped next. The generated height difference can be reduced, and a pattern having a cross section closer to a rectangle can be formed.

In all of the experiments (see FIGS. 1 to 3A and 3B) for obtaining the knowledge of the present invention, an ink jet head was used for dropping the liquid material. For this inkjet head, DMC-28310 head DMC-11610 (product model number) manufactured by FUJIFILM DIMATIX was used. Moreover, Harima Kasei NPS-J (product name) was used for the liquid material, and quartz glass was used for the substrate.
The formation conditions were a discharge frequency of 1.7 kHz, a droplet ejection pitch of 60 μm, a discharge speed of 10 m / second, and a distance between the head and the substrate of 0.5 mm.
Further, the line width of the dry body on the plate shown in FIG. 1 and the cross-sectional profiles shown in FIGS. 2 (a) and 2 (b) and FIGS. 3 (a) and 3 (b) are the ultra deep color 3D shape measuring microscope VK manufactured by Keyence. Measured using -9510.

Next, the pattern formation method of this embodiment is demonstrated.
FIG. 4 is a schematic view showing an example of a pattern forming apparatus used in the pattern forming method according to the embodiment of the present invention.
The pattern forming apparatus 10 shown in FIG. 4 includes a pair of guides 12 a and 12 b, a stage 14, a drive unit 16, a heater 18, a cooling unit 20, a temperature adjustment unit 22, and a discharge unit (discharge unit) 24. And a control unit 26.
The control part 26 is connected to the discharge part 24, the drive part 16, and the temperature control part 22, and controls these.

In the pattern forming apparatus 10, long guides 12a and 12b are arranged with a predetermined interval. The guides 12a and 12b are provided with a stage 14 that is movable in the longitudinal direction of the guides 12a and 12b (hereinafter referred to as X direction).
A heater 18 is provided between the guides 12a and 12b, and a cooling unit 20 is provided at a predetermined interval from the heater 18 in the X direction.
Above the guides 12 a and 12 b, the discharge unit 20 is disposed so as to match the distance between the heater 18 and the cooling unit 20. For example, linear guides are used for the guides 12a and 12b.

The stage 14 is provided on the guides 12a and 12b so as to be movable in the X direction, and a substrate 30 on which a pattern is formed is placed on the surface 14a of the stage 14.
The stage 14 is provided with a moving mechanism (not shown) that can move in the X direction. The moving mechanism is provided with a driving unit 16, and the stage 14 is moved in the X direction via the driving unit 16. The stage 14 is moved by the control unit 26 via the driving unit 16.
The configuration of the driving unit 16 is not particularly limited as long as the driving unit 16 can move the unit on the linear guide.
In the present embodiment, ink is ejected from the ejection section 24 onto the surface 30a of the substrate 30 in a predetermined pattern as will be described later. For this reason, the drive part 16 has the moving resolution which can form a pattern.

The heater 18 is composed of, for example, a carbon heater or a silicon heater. The heater 18 is connected to a temperature adjustment unit 22, and the temperature of the heater 18 is adjusted by the temperature adjustment unit 22.
The stage 14 is arranged on the heater 18, and the substrate 30 is heated to a predetermined temperature together with the stage 14 and is held at that temperature.

The cooling unit 20 is constituted by, for example, a Peltier element or a cooling fan.
The cooling unit 20 is connected to a temperature adjusting unit 22, and the temperature adjusting unit 22 adjusts the temperature of the cooling unit 20. Further, when the cooling unit 20 has a cooling fan, the number of rotations of the cooling fan is adjusted.
The stage 14 is disposed on the cooling unit 20, and the substrate 30 is cooled to a predetermined temperature together with the stage 14 and is held at that temperature.
In the present embodiment, the temperature of the heater 18 and the cooling unit 20 is adjusted by the control unit 26 via the temperature adjustment unit 22. Thereby, the temperature of the substrate 30 is set to a predetermined temperature.

  The discharge unit 24 drops a liquid material in which a pattern forming material is dispersed or dissolved onto the surface 30a of the substrate 30 in a predetermined pattern, and a positioning mechanism (not shown) for adjusting the dropping position. Is provided.

The structure of the discharge unit 24 is not particularly limited as long as the liquid material in which the pattern forming material is dispersed or dissolved can be dropped. An ink jet head is preferably used for the discharge unit 24. When an inkjet head is used, the amount of liquid material to be discharged, the discharge frequency of the liquid material, and the landing position of the liquid material can be accurately controlled.
As the inkjet head, for example, various types of inkjet heads such as a piezoelectric method, a thermal method, an electrostatic actuator method, and an electrostatic suction method can be used.
Further, the discharge unit 24 may be a dispenser. This dispenser has a larger discharge amount than an ink jet and can form a larger pattern.

  The pattern forming material of the liquid material is preferably fine particles of a metal or an oxide or alloy of the metal. Examples of the metal include gold, silver, copper, platinum, nickel, palladium, and tin. Moreover, it is preferable that the particle diameter of the fine particle of a metal or its metal oxide or alloy is 10 nm or less.

  When the pattern forming material of the liquid material is fine particles of the above-mentioned metal or an oxide and alloy of the metal, conductivity can be obtained when heat-firing treatment is performed.

In the present invention, the liquid pattern forming material may be another conductive material such as a conductive polymer material.
As the liquid material in which the pattern forming material is dispersed or dissolved, for example, NSP-J (trade name) manufactured by Harima Kasei can be used.
Examples of the dispersion medium or solvent for dispersing or dissolving the pattern forming material include, in addition to water, alcohols such as methanol, ethanol, propanol, and butanol, n-heptane, n-octane, decane, tetradecane, toluene, xylene, Hydrocarbon compounds such as cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl Ethers such as ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, p-dioxane, etc. Ether-based compounds, propylene carbonate, .gamma.-butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, may be mentioned polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred and more preferred dispersions in terms of fine particle dispersibility, dispersion stability, and ease of application to the droplet discharge method. Examples of the medium or solvent include water and hydrocarbon compounds. These dispersion media or solvents can be used singly or as a mixture of two or more.

Next, a pattern forming method will be described using the pattern forming apparatus 10.
In the present embodiment, the substrate 30 can be a plate-like member formed of various materials such as a glass substrate, a ceramic substrate, and a plastic substrate.
The substrate 30 may be a flexible film material, that is, a bendable film material. In this case, the substrate 30 includes, for example, a polyethylene terephthalate film, a polybutylene terephthalate film, a polycycloolefin film, a biaxially stretched polypropylene film, a polycarbonate film, a polyamide film, a polyvinyl chloride film, a methacryl-styrene resin film, a polyimide film, Various plastic films such as a silicone resin film and a fluororesin film can be used.

  In the present embodiment, as the liquid material, for example, a metal fine particle dispersed ink 40 (hereinafter simply referred to as ink 40) in which metal fine particles are dispersed in a solvent is used, and this ink 40 is transferred from the ejection unit 24 to the substrate 30. For example, a wiring pattern is formed by discharging.

  FIGS. 5A to 5E are schematic views showing the pattern forming method according to the embodiment of the present invention in the order of steps. 5A to 5E, the substrate 30 is shown, and the illustration of the configuration of the pattern forming apparatus 10 is omitted.

First, as shown in FIG. 4, the stage 14 on which the substrate 30 is placed is moved above the heater 18.
Next, the heater 18 is heated to a predetermined temperature to bring the substrate 30 together with the stage 14 to a predetermined temperature.

Next, in a state where the substrate 14 is held at a predetermined heated temperature, the stage 14 is moved in the direction D by the driving unit 16 relative to the ejection unit 24 via the control unit 26, While changing the relative position with respect to the substrate 30 in the direction D, the ink 40 is discharged from the discharge portion 24 onto the surface 30a of the substrate 30 in a predetermined pattern as shown in FIG.
At this time, the substrate 30 is set to 60 ° C., for example, and as shown in FIG. 5B, the ejected ink 40 evaporates and is dried before the ink 40 is completely spread.
As a result of the coffee stain phenomenon, a dry body 42 having a concave cross-sectional shape is formed as shown in FIG. The dry body 42 has a greater difference in film thickness than a dry body obtained by discharging ink onto a substrate at room temperature and drying it.

Next, the stage 14 is moved in the direction D and moved above the cooling unit 20 (see FIG. 4).
Then, the temperature of the cooling unit 20 is adjusted by the control unit 26 via the temperature adjustment unit 22 so that the cooling unit 20 reaches the set temperature of the substrate 30 when the ink 40a is discharged for the second time.

Next, in a state where the substrate 14 is held at a predetermined cooled temperature, the stage 14 is moved to the direction R, that is, the ejection unit 24 side by the driving unit 16.
And while changing the relative position in the direction R of the discharge part 24 and the board | substrate 30, it is the same position as the pattern formed in the board | substrate 30 with the ink 40, ie, the recessed part of the dry body 42 shown in FIG.5 (c). Ink 40a is ejected onto 42a. Thereby, as shown in FIG. 5D, the recess 42a is filled with the ink 40a.
At this time, since the temperature of the substrate 30 is about room temperature, the evaporation amount is small, the coffee stain phenomenon hardly occurs, and a concave shape is not formed inside the concave portion 42a even after the ink 40a is dried. Thereby, as shown in FIG.5 (e), the dry body 44 which fills the inside of the recessed part 42a of the dry body 42 is formed. Therefore, it is possible to form a wiring pattern having a wiring portion 46 (see FIG. 5E) that is thin and has a uniform thickness and has a cross-sectional shape close to a rectangle.

  In the present embodiment, the ink 40 is discharged in a predetermined pattern and dried while being transported in the direction D while the substrate 30 is heated. Thereafter, the stage 14 is moved to the cooling unit 20 side. For this reason, the conveyance direction of the board | substrate 30 becomes reverse. As a result, the discharge pattern of the first ink 40 and the discharge pattern of the second ink 40a in the discharge unit 24 are reversed. Therefore, the control unit 26 reverses the discharge pattern of the first ink 40 after the discharge pattern of the first ink 40 to generate the discharge pattern of the second ink 40a to generate the second ink 40. 40a is discharged.

Next, after the pattern is formed, the wiring pattern having a rectangular cross section that is thin and uniform in thickness is formed by heating and baking for a certain period of time, fusing the particles together and imparting conductivity to the pattern.
In this embodiment, by reducing the wiring pattern in this way, high-density wiring is possible. Further, since the thickness of the wiring pattern is uniform, the current density is uniform, and disconnection is caused. The possibility is also suppressed.
In the pattern forming apparatus 10, a heat treatment heater may be provided above the heater 18 for performing a heating and baking process. In this case, an infrared lamp or the like used for the rapid heat treatment is used as the heat treatment heater.
Moreover, you may provide the heat-firing furnace for performing a heat-firing process. In this case, it is preferable to provide a transport means so that the stage 12 can be transported to the heating and firing furnace.

  In the pattern forming apparatus 10 of the present embodiment, the temperature of the substrate 30 is lowered and the evaporation speed of the ink 40a is decreased before the second ink 40a is ejected. However, the present invention is not limited to this. Is not to be done. For example, by changing the temperature of the substrate 30 to lowering the temperature by the cooling unit 20, the humidity around the substrate 30 may be increased and the humidity of the dry body 42 may be increased. In this case, in order to increase the humidity around the substrate 30, vapor obtained by evaporating the dispersion medium component of the ink 40a may be ejected from the humidifier.

In the present embodiment, it is necessary to adjust the discharge amount (drop amount) of the second ink 40a to an amount that fills the concave portion 42a of the dry body 42 and flattens the upper surface of the wiring portion 46 after drying. For this reason, it is preferable to adjust the discharge amount (drop amount) of the first ink 40 by changing the discharge amount of the second ink 40a. In addition to the discharge amount, it is preferable to adjust the discharge density (droplet density) of the second ink 40a by changing the discharge density (droplet density) of the second ink 40a. More preferably, the discharge amount (drop amount) and discharge density (drop density) of the second ink 40a are changed with respect to the discharge amount (drop amount) and discharge density (drop density) of the first ink 40. It is preferable to adjust.
These vary depending on the pattern to be formed and the ink to be used, and the second ink with respect to the ejection amount (drop amount) and / or the ejection density (drop density) of the first ink 40 after an experiment in advance. The discharge amount and / or discharge density (drop density) of 40a is determined in advance. The discharge density (drop density) can be adjusted by the discharge frequency.

In the pattern forming apparatus 10 according to the present embodiment, the heater 18 and the cooling unit 20 are arranged with the discharge unit 24 interposed therebetween, but the present invention is not limited to this.
For example, a pattern forming apparatus 10a as shown in FIG. 6 may be used. Compared to the pattern forming apparatus 10 shown in FIG. 1, the pattern forming apparatus 10 a includes two discharge units 24 and 24 a, and the discharge unit 24 is provided between the heater 18 and the cooling unit 20. The part 24a is different in that it is provided at the end of the cooling unit 20 on the opposite side of the space between the heater 18 and the cooling unit 20, and the rest of the configuration is the same as that of the pattern forming apparatus 10 shown in FIG. Therefore, the detailed description is abbreviate | omitted. The discharge unit 24 a has the same configuration as the discharge unit 24.

In the pattern forming apparatus 10 a, while the substrate 30 is moved in one direction D, the ink 40 is ejected by the ejection unit 24 onto the substrate 30 heated by the heater 20, and then the substrate 30 is ejected by the cooling unit 20. The ink 40a is ejected by the ejection part 24a while the predetermined temperature is maintained, thereby forming a wiring pattern.
Similarly to the pattern forming apparatus 10a, the pattern forming apparatus 10a has a thin and uniform cross-sectional shape as shown in FIG. 5 (e) by the steps shown in FIGS. 5 (a) to 5 (e). A wiring pattern having the wiring portion 46 can be formed. In this way, by making the wiring pattern thinner, high-density wiring becomes possible. Furthermore, since the thickness of the wiring pattern is uniform, the current density becomes uniform and the possibility of disconnection is suppressed. .

  In the pattern forming apparatus 10a, since the substrate 30 is moved only in one direction D, the first ink 40 ejection pattern in the ejection unit 24 and the second ink 40a ejection pattern in the ejection unit 24a are as follows. The same. Therefore, unlike the pattern forming apparatus 10, the control unit 26 reverses the discharge pattern of the first ink 40 after the discharge pattern of the first ink 40 and changes the discharge pattern of the second ink 40a. There is no need to generate.

  Also in this pattern forming apparatus 10a, the temperature of the substrate 30 is lowered to lower the evaporation rate of the ink 40a before discharging the ink 40a for the second time. However, the present invention is limited to this. is not. For example, by changing the temperature of the substrate 30 to lowering the temperature by the cooling unit 20, the humidity around the substrate 30 may be increased and the humidity of the dry body 42 may be increased. In this case, in order to increase the humidity around the substrate 30, vapor obtained by evaporating the dispersion medium component of the ink 40a may be ejected from the humidifier.

Also in this pattern forming apparatus 10a, it is necessary to adjust the discharge amount (drop amount) of the ink 40a for the second time so that the concave portion 42a of the dry body 42 is filled and the upper surface of the wiring portion 46 is flattened. Therefore, it is preferable to adjust the discharge amount (drop amount) of the first ink 40 by changing the discharge amount of the second ink 40a. In addition to the discharge amount, it is preferable to adjust the discharge density (droplet density) of the second ink 40a by changing the discharge density (droplet density) of the second ink 40a. More preferably, the discharge amount (drop amount) and discharge density (drop density) of the second ink 40a are changed with respect to the discharge amount (drop amount) and discharge density (drop density) of the first ink 40. It is preferable to adjust.
These vary depending on the pattern to be formed and the ink to be used, and the second ink with respect to the ejection amount (drop amount) and / or the ejection density (drop density) of the first ink 40 after an experiment in advance. The discharge amount and / or discharge density (drop density) of 40a is determined in advance. The discharge density (drop density) can be adjusted by the discharge frequency.

  In the pattern forming apparatus 10a, the discharge amount (drop amount) and / or discharge density (drop density) of the first ink 40 determined for the discharge portion 24 is used, and the second ink 40a determined for the discharge portion 24a is used. The discharge amount and / or discharge density (droplet density) can be set.

  In addition, for example, a wiring pattern of a device is formed by the pattern forming method of the present embodiment.

In the present embodiment, the device is, for example, an image display device such as a liquid crystal display device, an organic EL display device, and a plasma display device, a printed wiring board, an antenna circuit, and the like. It is not limited.
Moreover, examples of the electronic apparatus provided with this device include a television, a personal computer, a mobile phone, and an RFID. However, in the present invention, the electronic apparatus is not limited to these.

  The pattern forming method, device, and electronic apparatus of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiment, and various improvements and modifications are made without departing from the gist of the present invention. Of course, you may.

It is a graph which shows the dependence of substrate temperature of the line width of the dry body on a board | substrate, taking a line | wire width on a vertical axis | shaft and taking a substrate temperature on a horizontal axis | shaft. (A) is a cross-sectional profile of a dry body when a liquid material is dropped at a substrate temperature of 60 ° C. with a distance in the width direction on the axis and a height on the vertical axis, and (b) is a horizontal axis. 5 is a cross-sectional profile of a dry body when a distance in the width direction is taken, a height is taken on the vertical axis, and a liquid material is dropped at a substrate temperature of 25 ° C. In (a), the distance in the width direction is taken on the horizontal axis, and the height is taken on the vertical axis, and the liquid material is again dropped onto the dried body shown in FIG. (B) is a later cross-sectional profile, and the horizontal axis is the distance in the width direction, the vertical axis is the height, and the dry material shown in FIG. It is a cross-sectional profile after dropping again and drying. It is a schematic diagram which shows an example of the pattern formation apparatus used for the pattern formation method which concerns on embodiment of this invention. (A)-(e) is a schematic diagram which shows the pattern formation method which concerns on embodiment of this invention in process order. It is a schematic diagram which shows the other example of the pattern formation apparatus used for the pattern formation method which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Pattern formation apparatus 12a, 12b Guide 14 Stage 16 Drive part 18 Heater 20 Cooling unit 22 Temperature control part 24 Discharge part (discharge means)
26 Control unit 30 Substrate 40 Metal fine particle dispersed ink (ink)
42, 44 Dry body 42a Recess 46 Wiring part

Claims (10)

A first step of heating the substrate to a predetermined temperature;
A second step in which a liquid material in which a pattern forming material is dispersed or dissolved is dropped onto the substrate while being held at a predetermined temperature, and is dried;
A third step of causing the evaporation rate to be slower than the evaporation rate when the liquid material is dropped onto the substrate at the predetermined temperature;
And a fourth step of dropping the liquid material onto a dried body obtained by drying the liquid material.   The pattern forming method according to claim 1, wherein the third step of slowing down the evaporation rate includes a step of lowering the temperature of the substrate to a temperature lower than that of the second step.   The pattern forming method according to claim 1, wherein the third step of slowing down the evaporation rate includes a step of increasing the humidity of the dry body.   The pattern formation method according to any one of claims 1 to 3, wherein a dripping amount of the liquid material in the second step is different from a dripping amount of the liquid material in the fourth step.   5. The pattern formation method according to claim 1, wherein a dropping density of the liquid material in the second step is different from a dropping density of the liquid material in the fourth step.   The pattern forming method according to claim 1, wherein the liquid material is dropped by an ink jet type or a dispenser type discharging unit.   The pattern forming method according to claim 1, wherein the pattern forming material is a fine particle of a metal, an oxide or an alloy of the metal.   The pattern forming method according to claim 7, wherein the metal is gold, silver, copper, platinum, nickel, palladium, or tin.   A device having a portion formed by using the pattern forming method according to claim 1.   An electronic apparatus comprising the device according to claim 9.

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