JP2010104977A - Film pattern, its film pattern forming method, conductive film wiring and electro-optic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film pattern forming method which enables the formation of a thicker film pattern than the film pattern formed by the conventional methods. <P>SOLUTION: The film pattern 215 forming method includes the surface treatment step of forming a photosensitive film B which can repel liquids by photosensitization and exhibits the liquid-repellent properties against a functional liquid containing structural components of a second film pattern 214 on the surface of a substrate 101 and the surface of a first film pattern 112, the step of repelling liquids of having the photosensitive film B liquid-repellent by exposing the substrate 101 from the rear surface of the substrate 101, and the film pattern forming step of forming the second film pattern 214 by discharging a drop of the functional liquid on the first film pattern 112 after the step of repelling liquids. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a film pattern, a film pattern forming method, a conductive film wiring, and an electro-optical device.

  Conventionally, for example, a photolithography method is used to form a conductive film wiring used for an electronic circuit or an integrated circuit. In this photolithography method, a photosensitive material called a resist is applied to a uniform conductive film on a substrate previously formed by sputtering, and a circuit pattern is irradiated and developed using a mask. The wiring pattern of the conductive film is formed by etching. This photolithography method requires large-scale equipment such as a vacuum apparatus and complicated processes, and the material use efficiency is about several percent, and most of the material must be discarded, and the manufacturing cost is high.

  On the other hand, a method of forming a wiring pattern on a substrate by using a droplet discharge method in which a functional liquid, which is a liquid material, is discharged in the form of droplets using an inkjet device, a so-called inkjet method has been proposed. In this method, a wiring pattern ink, which is a functional liquid in which conductive fine particles such as metal fine particles are dispersed, is directly arranged on a substrate, and then converted into a thin film conductive pattern by heat treatment or laser irradiation. According to this method, there is an advantage that photolithography is not required, the process is greatly simplified, and the amount of raw materials used is small.

  By the way, in recent years, with an increase in the size of a display device such as a liquid crystal television, the wiring connecting the driving circuit and the TFT in the pixel region tends to be long. The extension of the wiring is accompanied by an increase in wiring resistance, which causes a problem that the driving waveform becomes dull. For example, a pixel located far from the drive circuit has a longer wiring than a pixel located near, and thus the wiring resistance increases. For this reason, in the pixel far from the drive circuit, the drive waveform is dull and desired luminance cannot be obtained.

  Furthermore, recent display devices tend to increase the number of frames in order to smooth the movement. However, as described above, there is also a problem that a sufficient drive waveform cannot be obtained within one frame due to the dull drive waveform.

  Such dullness of the driving waveform is caused by an increase in the wiring resistance accompanying the extension of the wiring, and therefore it is important to reduce the wiring resistance. In order to reduce the wiring resistance, it is necessary to form a film pattern with high purity and capable of realizing a thick wiring.

  Therefore, Patent Document 1 proposes a film pattern forming method having a uniform film thickness and a thick film. FIG. 7 is a schematic view showing each step constituting the film pattern forming method described in Patent Document 1.

  The film pattern forming method disclosed in Patent Document 1 includes three steps: a surface treatment step, a material placement step, and a heat treatment or light treatment step.

  The first surface treatment step is further roughly divided into a lyophobic treatment step and a lyophilic treatment step. The lyophobic treatment process is a process of forming a lyophobic self-assembled film 402 on the substrate 401 as shown in FIG. Thereby, the surface of the substrate 401 is made liquid repellent with respect to the functional liquid 403.

  The next lyophilic process is a process of lyophilizing and patterning a portion where the film pattern is to be formed by irradiating the substrate 401 with ultraviolet light using a mask (not shown) according to the film pattern. is there. As a result, as shown in FIG. 7B, a lyophilic region H1 and a lyophobic region H2 are formed on the surface of the substrate 401. The subsequent material placement step is a step of discharging the droplet 404 of the functional liquid 403 to the lyophilic region H1 on the substrate 401 using the inkjet apparatus 420 as shown in FIG. At this time, the ejected droplets 404 accumulate on the lyophilic region H1 in accordance with the contact angle difference between the lyophilic region H1 and the lyophobic region H2. In addition, since the liquid repellent area H2 is provided with liquid repellency, even if a part of the ejected droplet 404 falls on the liquid repellent area H2, the liquid repellent area H2 is repelled from the liquid repellent area H2 and becomes lyophilic. Absorbed in the region H1. As a result, as shown in FIG. 7D, the functional liquid 403 accumulates in the lyophilic area H1 surrounded by the liquid repellent area H2.

  The final heat treatment or light treatment step is a step of removing the dispersion medium or coating agent contained in the functional liquid 403 disposed on the substrate 401 by baking or the like. Thereby, the electrical contact between the electroconductive fine particles which are film | membrane pattern formation components is ensured.

  As described above, by using the difference in the contact angle between the lyophilic region H1 and the liquid repellent region H2 formed on the substrate 401, it is possible to form a thick film pattern with a uniform film thickness. it can.

JP 2004-351305 A (released on December 16, 2004)

  However, the film pattern formed by the method described in Patent Document 1 is a single layer film as shown in FIG. And it depends only on the difference in the contact angle of the functional liquid 403 with respect to the liquid repellent region H2. Therefore, a thick film pattern exceeding the difference in contact angle cannot be formed. Therefore, there is a problem that a film pattern having a necessary film thickness cannot be obtained in order to prevent the above-described dull driving waveform from occurring.

  Note that Patent Document 1 describes that the contact angle of the liquid repellent region H2 is 40 degrees or more, but depending on the component of the functional liquid 403 used, the contact angle of the liquid repellent region H2 is less than 40 degrees. Therefore, the film thickness that can be formed is further reduced.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to form a film pattern forming method capable of forming a film pattern thicker than a film pattern formed by a conventional method and the forming method. It is to provide a film pattern. Another object of the present invention is to provide a conductive film wiring composed of the film pattern and an electro-optical device including the conductive film wiring as a method of using the film pattern.

  In order to solve the above-described problem, the film pattern forming method of the present invention ejects functional liquid droplets containing the constituent components of the second film pattern onto the first film pattern formed on the surface of the substrate. Thus, a film pattern forming method for forming a second film pattern on the first film pattern, wherein the surface of the substrate and the surface of the first film pattern are exposed to light to make the liquid repellent, A surface treatment process for forming a photosensitive film B exhibiting liquid repellency to the functional liquid, a liquid repellent process for repelling the photosensitive film B by exposing the substrate from the back surface of the substrate, and the liquid repellency. And a film pattern forming step of forming a second film pattern by discharging a droplet of the functional liquid onto the first film pattern after the process.

  According to the above invention, the photosensitive film B is formed on the surface of the substrate and the surface of the first film pattern formed on the surface of the substrate in the surface treatment process, and the photosensitive film B is formed in the liquid repellent process. The substrate is exposed from the back side. Thereby, the first film pattern serves as a mask, and the photosensitive film B formed on the surface of the first film pattern is not irradiated with light. For this reason, the photosensitive film B formed on the first film pattern is not exposed to light and maintains a state of not exhibiting liquid repellency with respect to the functional liquid.

  On the other hand, the region other than the surface of the first film pattern, that is, the photosensitive film B formed on the surface of the substrate is exposed to light to be sensitized, so that it exhibits liquid repellency to the functional liquid.

  Thereby, the photosensitive film B (liquid-repellent photosensitive film B) formed on the substrate functions more than the photosensitive film B (non-liquid-repellent photosensitive film B) formed on the first film pattern. Increases liquid repellency to liquid. That is, the first film pattern can be in a state of lower liquid repellency than the surrounding area (the liquid repellent photosensitive film B area). Further, since the first film pattern acts as a mask, the photosensitive film B having relatively low liquid repellency can be formed on the first film pattern without using a mask.

  In the subsequent film pattern forming step, functional liquid droplets are ejected onto the first film pattern having such a low liquid repellency. At this time, the functional liquid discharged on the first film pattern is formed on the substrate due to the difference in liquid repellency with respect to the functional liquid between the photosensitive film B formed on the first film pattern and the substrate. Spreading in the direction of the photosensitive film B can be prevented.

  Further, the lyophobic photosensitive film B is formed in a region on the substrate where the first film pattern is not formed. For this reason, there is a level difference between the photosensitive film B that has not been made liquid-repellent and the photosensitive film B that has been made liquid-repellent by the thickness of the first film pattern. As a result, when the functional liquid is discharged onto the photosensitive film B on the first film pattern, the functional liquid is less likely to contact the photosensitive film B formed on the substrate. The discharged functional liquid is further prevented from spreading in the direction of the photosensitive film B formed on the substrate. Thereby, since the amount of the functional liquid that can be held on the first film pattern can be increased, a thick second film pattern can be formed.

  In this way, in addition to forming the second film pattern on the first film pattern, the second film pattern itself can be formed thick. Therefore, it is possible to form a film pattern that is thicker than before.

  In the film pattern forming method of the present invention, the photosensitive film B is preferably lyophilic with respect to the functional liquid in a non-photosensitive state.

  According to the above invention, the photosensitive film B before exposure exhibits lyophilicity with respect to the functional liquid. Thus, the photosensitive film B on the first film pattern is lyophilic with respect to the functional liquid, while the photosensitive film B around the first film pattern is liquid repellent with respect to the functional liquid. Showing gender. For this reason, the contrast between the first film pattern and the surrounding area is further increased. Therefore, a thicker second film pattern can be formed.

  Here, the liquid repellency means a state where the affinity for the functional liquid is low. That is, the liquid repellency indicates a state in which the contact angle with respect to the functional liquid is relatively increased by forming the photosensitive film B on the surface of the substrate as compared with the case where the photosensitive film B is not formed. For example, the liquid repellency means that the contact angle with respect to the functional liquid is 20 degrees or more, preferably 30 degrees or more.

  On the other hand, lyophilic means a state having high affinity for the functional liquid. That is, the lyophilic property indicates a state in which the contact angle with respect to the functional liquid is relatively smaller by forming the photosensitive film B on the surface of the substrate than when the photosensitive film B is not formed. For example, the lyophilic property means that the contact angle with respect to the functional liquid is less than 20 degrees, preferably 10 degrees or less.

  The film pattern forming method of the present invention preferably includes a first removal step of removing the photosensitive film B on the first film pattern that has not been made liquid-repellent by the liquid-repellent step.

  According to the above invention, since the photosensitive film B on the first film pattern is removed by the first removal step, the surface of the first film pattern is exposed. As a result, in the subsequent film pattern forming step, the functional liquid is directly discharged onto the exposed first film pattern, so that the second film pattern is formed directly on the first film pattern. . That is, the first film pattern and the second film pattern are in contact with each other. Accordingly, since a film pattern with higher purity can be formed, a change in resistance value can be reduced. Further, if the first film pattern is more lyophilic with respect to the functional liquid than the photosensitive film B, a more lyophobic contrast can be obtained.

  In the film pattern forming method of the present invention, in the first removal step, it is preferable to remove the non-repellent photosensitive film B using, for example, isopropyl alcohol.

  Thereby, the photosensitive film B on the first film pattern that has not been made liquid-repellent can be suitably removed.

  In the film pattern forming method of the present invention, the first removing step includes a washing step of removing the photosensitive film B on the first film pattern by washing, and after the washing step, on the first film pattern. And a second removal step of removing the remaining photosensitive film B.

  According to the above invention, in the first removal step, first, the photosensitive film B on the first film pattern is removed by the cleaning step. That is, in the cleaning process, the photosensitive film B that has not been made liquid-repellent formed on the first film pattern is removed. However, the photosensitive film B cannot be removed only by the cleaning process.

  Therefore, according to the above-described invention, the photosensitive film B on the first film pattern, which could not be removed by the cleaning process, is removed by performing the second removal process that follows the cleaning process. As a result, the photosensitive film B remaining on the first film pattern without being completely removed in the cleaning process is surely (completely) removed. As a result, the photosensitive film B does not exist between the first film pattern and the second film pattern, and the first film pattern and the second film pattern are in contact with each other. Accordingly, since a thicker film pattern with higher purity can be formed, a change in resistance value can be prevented. Further, if the first film pattern is more lyophilic with respect to the functional liquid than the photosensitive film B, the contrast of the lyophilic liquid can be further increased.

  In the film pattern forming method of the present invention, in the second removal step, the substrate may be exposed from the surface of the substrate with respect to at least the first film pattern.

  According to the above invention, in the second removal step, the first film pattern is exposed from the surface of the substrate. Thereby, the photosensitive film B on the first film pattern is decomposed by exposure. Therefore, the photosensitive film B which has not been completely removed in the cleaning process and remains on the first film pattern can be surely (completely) removed.

  In the film pattern forming method of the present invention, the second removing step may expose the substrate from the surface of the substrate with respect to the first film pattern and the substrate.

  According to the above invention, in the second removal step, the first film pattern and the substrate are exposed from the surface of the substrate. Thereby, the photosensitive film B on the first film pattern is decomposed by exposure. Therefore, the photosensitive film B which has not been completely removed in the cleaning process and remains on the first film pattern can be surely (completely) removed.

  Further, according to the above invention, the photosensitive film B on the substrate is also exposed, so that the photosensitive film B on the substrate is again exposed to light and is made liquid repellent. Thereby, the lyophobic contrast between the first film pattern and the photosensitive film B on the substrate can be further increased. Therefore, a thicker second film pattern can be formed.

  The film pattern forming method of the present invention preferably includes a third removal step of removing the photosensitive film B on the substrate that has been made liquid-repellent by the liquid-repellent step.

  According to the above invention, in the third removing step, the lyophobic photosensitive film B formed on the substrate is removed, so that the substrate is exposed. As a result, a new film or functional element can be formed on the exposed substrate.

  In the film pattern forming method of the present invention, the photosensitive film B is made of an organic material, and the third removing step removes the lyophobic photosensitive film B by heating the substrate. Is preferred.

  According to the above invention, since the photosensitive film B is made of an organic material, when the substrate is heated in the third removal step, the organic material is combined with oxygen and decomposed by the heating. Thereby, the photosensitive film B can be easily removed.

  In the film pattern forming method of the present invention, the photosensitive film B is made of an organic material, and the third removing step removes the lyophobic photosensitive film B by irradiating the substrate with ultraviolet rays. It is preferable to do.

  According to the above invention, since the photosensitive film B is made of organic matter, when the substrate is irradiated with ultraviolet rays in the third removal step, the organic matter is decomposed by ozone generated by the ultraviolet rays. Thereby, the photosensitive film B can be easily removed.

  In the film pattern forming method of the present invention, the first film pattern is formed by ejecting droplets of a functional liquid containing the components of the first film pattern onto the substrate. A process may be included.

  According to the above invention, the first film pattern is formed by ejecting a droplet of the functional liquid. That is, the first film pattern is formed by the ink jet method. Therefore, the film pattern can be easily formed at low cost without using expensive and complicated equipment such as a vacuum apparatus.

  In the film pattern forming method of the present invention, in the first film pattern forming step, a photosensitive film A having liquid repellency is formed on the substrate with respect to a functional liquid containing the components of the first film pattern. In addition, it is preferable to eject droplets of the functional liquid onto the photosensitive film A.

  According to the above invention, droplets of the functional liquid are ejected in a pattern on the photosensitive film A that exhibits liquid repellency to the functional liquid formed on the substrate, and the first film is formed on the photosensitive film A. A pattern is formed. At this time, since the photosensitive film A having liquid repellency with respect to the functional liquid is formed on the substrate, the spread of the ejected droplets in the surface direction is prevented. Therefore, a first film pattern having a narrow line width (narrow width) can be formed. Accordingly, it is possible to form a thick film pattern with a narrow width.

  In the film pattern forming method of the present invention, the first film pattern forming step is decomposed on the substrate by exposing the functional liquid containing the constituent components of the first film pattern to liquid repellency. A photosensitive film A that loses liquid repellency is formed, the photosensitive film A in the region where the first film pattern is to be formed is removed by exposure, and droplets of the functional liquid are ejected onto the exposed substrate. It is preferable to do.

  According to the above invention, the region where the first film pattern is formed is decomposed and the substrate is exposed because the photosensitive film A is exposed. This increases the contrast between the region where the substrate is exposed (the region where the first film pattern is formed) and the region where the surrounding photosensitive film A remains. Then, functional liquid droplets are ejected onto the region where the substrate is exposed. As a result, the contrast between the region where the first film pattern is formed and the surrounding region is increased. Therefore, it is possible to form a high-purity film pattern that is narrower and does not contain the components of the photosensitive film A.

  In the film pattern forming method of the present invention, it is preferable that the first film pattern forming step removes the photosensitive film A in a region where the first film pattern is not formed.

  According to the above invention, since the photosensitive film A in the region where the first film pattern is not formed is removed, the substrate is exposed in the removed region. As a result, a new film or functional element can be formed on the substrate.

  In the film pattern forming method of the present invention, the photosensitive film A may be a self-assembled monomolecular film.

  According to the above invention, since the photosensitive film A is a self-assembled film made of organic molecules, a monomolecular film can be easily formed. Accordingly, the photosensitive film A exhibiting uniform liquid repellency can be realized.

  In the film pattern forming method of the present invention, the first film pattern can be formed by patterning a film formed on a substrate by photolithography.

  According to the above invention, since the first film pattern is formed by photolithography, a fine first film pattern that cannot be formed by the inkjet method can be formed. Therefore, a fine and thick film pattern can be formed.

  In the film pattern forming method of the present invention, the film formed on the substrate can be formed using physical vapor deposition or chemical vapor deposition.

  Thereby, the film | membrane patterned by photolithography can be formed suitably on a board | substrate.

  The film pattern of the present invention is formed by any one of the above film pattern forming methods. As a result, it is possible to provide a multilayer film pattern that is thicker than before.

  Further, the film pattern of the present invention may have conductivity. Thereby, the film | membrane pattern which has electroconductivity can be provided.

  The conductive film wiring of the present invention is characterized by comprising the conductive film pattern.

  According to the above invention, since the film pattern is thicker than the conventional one, the resistance of the wiring is reduced. Accordingly, dullness of the driving waveform can be prevented.

  The electro-optical device of the present invention includes the conductive film wiring.

  Examples of such an electro-optical device include a liquid crystal display device, an organic electroluminescence display device, and a plasma display device.

  According to the above invention, since the conductive film wiring of the present invention is provided, the wiring resistance between the pixel and the drive circuit is lowered. Thereby, luminance variation due to dullness of the drive signal applied to the pixel can be suppressed. Therefore, an electro-optical device without display unevenness can be provided.

  As described above, the film pattern forming method of the present invention makes the surface of the substrate and the surface of the first film pattern lyophobic by exposure to light, and the photosensitive film B exhibits liquid repellency to the functional liquid. Forming a surface treatment step, exposing the substrate from the back side of the substrate to make the photosensitive film B liquid repellent, and after the liquid repellent step, the function on the first film pattern. A film pattern forming step of discharging a liquid droplet to form a second film pattern.

  Therefore, there is an effect that a film pattern thicker than the film pattern formed by the conventional method can be formed.

It is the schematic which shows each process of the film | membrane pattern formation method of this Embodiment. It is a graph which shows the relationship between the intensity of the energy irradiated with respect to the photosensitive film | membrane B used for this Embodiment, and the contact angle with respect to the functional liquid after irradiation. It is the schematic which shows each process of the film | membrane pattern formation method in case the shape of a 1st film | membrane pattern differs from FIG. It is the schematic which shows the film | membrane pattern formation method at the time of abbreviate | omitting the 1st removal process in FIG. It is the schematic which shows each process of the 1st film | membrane pattern formation method. 1 is a schematic diagram of a liquid crystal display device according to an embodiment of the present invention. It is the schematic which shows each process of the film | membrane pattern formation method of patent document 1. FIG.

  The embodiment of the present invention will be described below with reference to FIGS.

  In the present embodiment, a conductive wiring film provided with the film pattern of the present invention will be described. FIG. 1 is a cross-sectional view showing each step of a film pattern forming method to be a conductive wiring film of the present embodiment.

  As shown in FIG. 1G, the film pattern (conductive wiring film) 215 of this embodiment has a structure in which a first film pattern 112 and a second film pattern 214 are stacked on a substrate 101. is there.

  As the substrate 101, various kinds of materials such as glass, quartz glass, and plastic can be used. In addition, a material in which various films such as a semiconductor film, a metal film, a dielectric film, and an organic film, a functional material, and a functional element are formed on the surface of these various material substrates may be used. However, as will be described later, in order to perform exposure from the back surface of the substrate 101, the substrate 101 uses a material that transmits at least radiation such as light and X-rays.

  The first film pattern 112 and the second film pattern 214 are conductive films made of conductive fine particles. Details of the first film pattern 112 and the second film pattern 214 will be described later.

  The film pattern (conductive wiring film) 215 of this embodiment is formed by laminating the second film pattern 214 on the first film pattern 112 formed on the surface of the substrate 101. That is, the film pattern (conductive wiring film) 215 is formed on the first film pattern 112 by discharging droplets of functional liquid containing the constituent components of the second film pattern 214 onto the first film pattern 112. Then, the second film pattern 214 is formed. Specifically, in the film pattern (conductive wiring film) 215 formation method, the surface of the substrate 101 and the surface of the first film pattern 112 are exposed to light so that the liquid repellency is obtained. On the first film pattern 112 after the surface treatment process for forming the photosensitive film B shown in the drawing, the liquid repellent process for repelling the photosensitive film B by exposing the substrate 101 from the back surface of the substrate 101, and the liquid repellent process. A film pattern forming step of forming the second film pattern 214 by discharging droplets of the functional liquid. Hereinafter, each step will be described.

(Surface treatment process)
In the surface treatment step, as shown in FIG. 1A, a photosensitive film B202 is formed so as to cover the substrate 101 and the first film pattern 112 formed on the substrate 101.

  Here, the photosensitive film B202 is a film that exhibits liquid repellency by undergoing a physical or chemical change under the action of radiation such as light or X-rays.

  The photosensitive film B202 is not particularly limited, and a photosensitive substance that exhibits photosensitivity and exhibits liquid repellency generally used in the technical field of the present invention can be used. For example, a surface of the substrate 101 can be obtained by applying a photosensitive material that has a contact angle with water of 100 ° or more to the surface of the substrate 101 by spin coating and drying by irradiating an ultra-high pressure mercury lamp. A photosensitive film B202 can be formed on the entire surface.

  Table 1 below shows the relationship between the intensity of energy irradiated to the photosensitive film B202 used in the present embodiment and the contact angle with the functional liquid after irradiation.

  FIG. 2 is a graph showing the relationship between the intensity of energy applied to the photosensitive film B202 shown in Table 1 above and the contact angle with the functional liquid after irradiation. In FIG. 2, the horizontal axis represents the intensity of irradiation energy, and the vertical axis represents the contact angle (degree) of the organic solvent (functional liquid). As shown in FIG. 2, the stronger the irradiation energy, the lower the affinity for the organic solvent, and the photosensitive film B202 exhibits liquid repellency. Therefore, by irradiating the energy shown in Table 1 above, the affinity of the photosensitive film B202 for the organic solvent (functional liquid) can be adjusted to a desired value.

  By forming the photosensitive film B202, it is possible to easily perform patterning without using an exposure mask that has been necessary for patterning the lyophobic liquid as in the prior art in the next liquid repellent step. become.

  The photosensitive film B202 is preferably made of a lyophilic substance in a non-photosensitive state.

  By using a lyophilic substance for the photosensitive film B202, when the photosensitive film B202 on the substrate 101 is exposed to liquid repellency in the next liquid repellency step, the difference in the contact angle of the lyophilic area increases. Therefore, a finer and thicker second film pattern 214 can be formed.

(Liquid repellent process)
As shown in FIG. 1B, the lyophobic step is a step of exposing the back surface of the substrate 101 to make the photosensitive film B202 on the substrate 101 lyophobic. At this time, by exposing from the back surface of the substrate 101, the first film pattern 112 acts as a mask to block light. Therefore, the photosensitive film B202 on the first film pattern 112 is not lyophobic because it is not exposed to light. On the other hand, other than that, that is, the photosensitive film B202 formed on the substrate 101 is exposed to light and thus is made liquid repellent. For this reason, the non-liquid-repellent region h1 and the portion surrounding it can be easily patterned on the liquid-repellent region h2 on the first film pattern 112 without using a mask as in the prior art. Thereby, highly accurate patterning can be realized in a short work time.

(First removal step [cleaning step])
The first removal step is a step of removing the non-liquid-repellent region h1 on the first film pattern 112 as shown in FIG. For example, a process (cleaning process) of removing the non-liquid-repellent area h1 is performed by cleaning using a cleaning solvent that dissolves the non-liquid-repellent area h1 (photosensitive film B that has not been made liquid-repellent). As a method of removing the non-liquid-repellent region h1, for example, there is a method of cleaning using isopropyl alcohol as a cleaning solvent. By washing with isopropyl alcohol, the non-liquid repellent area h1 on the first film pattern 112 is washed away, and only the liquid repellent area h2 on the substrate 101 remains. Accordingly, the surface of the first film pattern 112 is exposed, and a region surrounding it is a liquid repellent region h2.

  In this way, by exposing the surface of the first film pattern 112, in the subsequent film pattern forming process, the functional liquid 210 of the second film pattern 214 does not pass through the non-liquid-repellent region h1. The ink is directly discharged onto the surface of the film pattern 112. Thus, when the functional liquid 210 on the first film pattern is baked or the like, the decomposed components of the photosensitive film B202 constituting the non-liquid-repellent region h1 are diffused into the second film pattern 214 and have a resistance value. It is possible to reduce the change. Accordingly, it is possible to form a multilayer film pattern 215 that does not contain impurities and has high purity, and a conductive film wiring having a lower resistance can be formed.

  In the present embodiment, since the first film pattern 112 is a metal film, it exhibits high lyophilicity. In this case, removing the non-liquid-repellent region h1 on the first film pattern 112 to expose the surface of the first film pattern 112 increases the difference in contact angle with the liquid-repellent region h2 surrounding the first film pattern 112. be able to. Thus, depending on the material of the non-liquid-repellent region h1 or the first film pattern, the contact angle difference may become larger when the non-liquid-repellent region h1 is removed.

(Second removal step)
In the above-described cleaning process, if the non-liquid repellent area h1 is cleaned with isopropyl alcohol, the non-liquid repellent area h1 on the first film pattern 112 can be substantially removed. However, it is difficult to completely remove the non-liquid-repellent region h1 only by the cleaning process. Therefore, as shown in FIG. 1D, it is preferable to perform a second removal step for removing the non-liquid-repellent region h1 remaining on the first film pattern 112 after the cleaning step.

  Specifically, as shown in FIG. 1D, the first film pattern 112 and the substrate 101 are exposed from the surface of the substrate 101 in the second removal step. Thereby, the non-liquid-repellent region h1 on the first film pattern 112 is decomposed by exposure. Therefore, the non-liquid-repellent region h1 that remains on the first film pattern 112 without being completely removed by the cleaning step can be surely (completely) removed.

  Further, since the liquid repellent area h2 on the substrate 101 is also exposed, the liquid repellent area h2 on the substrate 101 is exposed again to be further liquid repellent. Thereby, the contrast of the lyophobic liquid repellent between the first film pattern 112 and the liquid repellent area h <b> 2 on the substrate 101 can be further increased. Therefore, finally, a thicker second film pattern 214 (multilayer film pattern 215) can be formed.

  In the second removal step shown in FIG. 1D, the entire surface of the substrate 101 is exposed from the surface of the substrate 101. However, in the second removal step, at least the first film pattern 112 may be exposed from the surface of the substrate 101. Thereby, the non-liquid-repellent region h1 on the first film pattern 112 is decomposed by exposure. Therefore, the non-liquid-repellent region h1 that remains on the first film pattern 112 without being completely removed in the cleaning process can be surely (completely) removed.

  The conditions for exposing the substrate 101 are preferably, for example, the same conditions as in the lyophobic process or irradiating ultraviolet rays having a wavelength with high absorbance in the non-lyophobic region h1.

  Thus, if the cleaning process and the second removal process are performed in the first removal process, the photosensitive film B (non-liquid-repellent region h1) on the first film pattern 112 is reliably (completely) removed. can do. As a result, in the film pattern 215 formed by the film pattern forming process described later, the photosensitive film B does not exist between the first film pattern 112 and the second film pattern 214. That is, the film pattern 215 has a configuration in which the first film pattern 112 and the second film pattern 214 are in contact with each other. Therefore, a thicker film pattern 215 with higher purity can be formed, and a change in resistance value can be prevented.

  Further, if the first film pattern 112 is more lyophilic with respect to the functional liquid than the photosensitive film B, the contrast of the lyophobic liquid can be further increased.

  In this embodiment, the case of performing the first removal step (cleaning step and second removal step) is described. However, the first removal step (cleaning step and second removal step) It can be omitted as necessary. In this case, as shown in FIG. 4, the second film pattern is formed on the non-liquid-repellent region h1. Thereby, cost can be held down by reduction of the number of processes.

(Film pattern forming process)
The film pattern forming process is roughly divided into a discharge process and a drying process.

  First, the discharge process will be described. As shown in FIG. 1E, the discharging step is a step of discharging the functional liquid 210 onto the surface of the first film pattern 112 by the ink jet method to dispose the functional liquid 210 that forms the second film pattern. It is.

  In the ejection step, the functional liquid 210 is ejected by the inkjet device 220 onto the first film pattern 112 surrounded by the liquid repellent area h2. At this time, due to the liquid repellency of the liquid repellent area h <b> 2 surrounding the first film pattern 112, the droplets 211 ejected on the first film pattern 112 remain without overflowing from the first film pattern 112. As a result, the functional liquid 210 is disposed on the first film pattern 112.

  The functional liquid 210 used in the discharging step is a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium. In the present embodiment, as the conductive fine particles, for example, metal fine particles containing any one of gold, silver, copper, palladium, and nickel, these oxides, and fine particles of conductive polymers and superconductors. Etc. are used.

  These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility.

  The particle diameter of the conductive fine particles is preferably 1 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, there is a possibility that clogging will occur in the discharge nozzle of the inkjet head described later. On the other hand, if it is smaller than 1 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.

  Other examples of conductive fine particles include resists, acrylic resins as linear insulating materials, and silane compounds that become silicon when heated (for example, trisilane, pentasilane, cyclotrisilane, 1,1′-biscyclobutasilane, etc. ), Metal complexes and the like. These may be dispersed as fine particles in a liquid, or may be dissolved.

  The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydro Hydrocarbon compounds such as naphthalene and cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2- Methoxyethyl) ether, ether compounds such as p-dioxane, propylene carbonate, γ- Butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, can be exemplified polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred from the viewpoints of fine particle dispersibility, dispersion stability, and ease of application to the inkjet method, and more preferred dispersion media , Water, and hydrocarbon compounds.

  The viscosity of the dispersion is preferably 1 mPa · s or more and 50 mPa · s or less. When discharging the functional liquid as droplets using the inkjet method, if the viscosity is less than 1 mPa · s, the periphery of the discharge nozzle is easily contaminated by the outflow of ink, and if the viscosity is greater than 50 mPa · s, the discharge is performed. The frequency of clogging in the nozzle holes increases, and it becomes difficult to smoothly discharge droplets.

Examples of the ink jet method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. In the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode to be discharged from a discharge nozzle. In addition, the pressure vibration method is a method in which an ultra-high pressure of about 30 kg / cm ² is applied to the material to discharge the material to the tip side of the discharge nozzle. When no control voltage is applied, the material moves straight and the discharge nozzle When a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. In addition, the electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) deforms in response to a pulsed electric signal, and the piezoelectric element is deformed through a flexible substance in the space where the material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.

  In addition, the electrothermal conversion method is a method in which a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the functional liquid in the space is discharged by the pressure of the bubbles. . In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid due to an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. In addition, the amount of one drop of the functional liquid ejected by the inkjet method is, for example, 1 to 300 nanograms.

  Here, the smaller the contact angle of the surface of the first film pattern 112 is, the more lyophilic, the easier the functional liquid 210 spreads along the first film pattern 112, and the functional liquid 210 can be disposed with a uniform film thickness. . Further, the larger the contact angle of the liquid repellent region h2 with respect to the first film pattern 112 is, the more liquid repellent the liquid 210 is less likely to overflow from the first film pattern 112. Therefore, the larger the difference in the contact angle between the surface of the first film pattern 112 and the liquid repellent area h2, the larger the liquid retention amount of the functional liquid 210 on the first film pattern 112, the second The film pattern 214 can be thickened. Therefore, when the lyophilicity of the surface of the first film pattern 112 is low, the non-lyophobic region h1 is formed using the photosensitive film B202 made of a material exhibiting lyophilicity in the non-photosensitive state, and the first film pattern 112 is formed. By omitting this cleaning step, the surface of the first film pattern 112 can be made lyophilic. As a result, the amount of liquid retained on the first film pattern 112 can be increased, which is effective for increasing the film thickness.

  As described in the first removal step, in this embodiment, the liquid repellent portion is formed so as to surround the first metal film pattern. For this reason, the contrast of the lyophobic / repellent liquid is large compared to the case where a pattern of the lyophobic / liquid repellent is formed on the glass as in the case of the conventional single layer film pattern, and the liquid retention amount when the liquid is applied by the ink jet method is increased. To do. Thereby, the second film pattern 214 can be thickened.

  In the present embodiment, the thickness of the first film pattern 112 is about 500 nm, and the thickness of the photosensitive film B202 is about 10 nm. For this reason, the surface of the first film pattern 112 has a level difference higher than the liquid repellent region h2 on the substrate 101 surrounding the first film pattern 112. Therefore, even if the functional liquid 210 discharged onto the first film pattern 112 spreads to the boundary with the liquid repellent area h2, the functional liquid 210 does not come into contact with the liquid repellent area h2 on the substrate 101 because of the above steps. Due to the edge effect due to the step, the surface tension of the functional liquid 210 is enhanced, and the amount of liquid retained on the first film pattern 112 is increased. As described above, in the present embodiment, in addition to the retention of the functional liquid 210 due to the difference in contact angle, the edge effect due to the boundary step also acts on the increase in the retained amount of the functional liquid 210 on the first film pattern 112. For this reason, compared with the case where the pattern of the repellent area is formed on the conventional flat substrate and the functional liquid 210 is retained only by the difference in the contact angle, the liquid retention amount can be increased.

  Further, if the pattern of the lyophobic region is formed on the same plane as in the prior art, the functional liquid that has protruded from the lyophilic region due to a deviation or deformation of the landing position of the droplets is the liquid repellent region. Contact. For this reason, even when trying to return to the lyophilic region due to the surface tension of the functional liquid, the liquid partially remains in the lyophobic part, causing a problem that the boundary of the film pattern with the lyophobic region becomes wavy. .

  On the other hand, in the present embodiment, the step is generated between the first film pattern 112 and the liquid repellent region h <b> 2 on the substrate 101. For this reason, even if the functional liquid 210 protrudes from the first film pattern 112, the functional liquid 210 does not contact the liquid repellent area h2 on the substrate 101. As a result, the effect of the surface tension of the functional liquid 210 is increased, so that the protruding functional liquid 210 can return to the first film pattern 112. In this way, by discharging the functional liquid 210 onto the first film pattern 112 having a height, the protruding functional liquid 210 is pulled back by the surface tension, and therefore the first film pattern 112 and the second film pattern The boundary with 214 is formed in a beautiful straight line.

  Next, the drying step (f) will be described. A drying process is divided roughly into a drying process and a baking process.

  First, the drying process will be described. The drying process is a process for evaporating the dispersion medium and the coating agent contained in the functional liquid 210 arranged in the above-described discharge process to form a solid.

  For the evaporation method, for example, a hot plate, an oven, a light source, or hot air can be used. Further, plasma may be irradiated as a method other than heating.

  In the drying process, the substrate 101 is heated to evaporate the dispersion medium from the functional liquid 210, thereby forming the second film pattern precursor 213 as shown in FIG.

  Next, the firing process will be described. The firing process is a process for bonding the conductive fine particles as the film pattern forming component in the present embodiment. The second film pattern precursor 213 needs to be heated to about 350 degrees because the electrical contact between the conductive fine particles is insufficient as it is.

  In the main drying step, the conductive second film pattern 214 in which the electrical contact between the conductive fine particles is ensured is formed by removing the dispersion medium and the coating material on the surface of the conductive fine particles.

  The temperature of the baking treatment is appropriately determined depending on the boiling point of the dispersion medium, the component and the amount of the coating material. For example, conductive fine particles dispersed in an organic solvent need to be fired at about 350 degrees.

(Third removal step)
The third removal step is a step of removing the liquid repellent region h2 surrounding the multilayer film pattern 215 as shown in FIG. As a removal method, there is a method of heating using a hot plate or an oven. As a method other than heating, there is a method of irradiating with plasma or ultraviolet rays.

  When removing the liquid repellent area h2 by heating, it is necessary to heat to a temperature at which the photosensitive film B202 constituting the liquid repellent area h2 is decomposed. When the photosensitive film B202 is made of an organic material, it is heated to about 250 to 350 ° C. The substrate 101 can be exposed by removing the liquid-repellent region h2 by decomposing it by heating. In this way, in the third removal step, by exposing the surface of the substrate 101 on which the multilayer film pattern 215 is formed, the film pattern forming method of the present invention can be repeatedly performed. A film pattern can be formed.

  Moreover, when removing the liquid repellent area | region h2 with an ultraviolet-ray, a UV / ozone cleaning apparatus can be used. Ultraviolet light having a short wavelength irradiated by a low-pressure mercury lamp or an excimer lamp having a wavelength of 172 nm used in this apparatus reacts with oxygen to generate ozone, and the photosensitive film B is decomposed by the generated ozone. This is effective for removing the lyophobic photosensitive film B which is not decomposed by heating.

  In addition, when heat-processing in this 3rd removal process, depending on temperature, the drying process in the above-mentioned film | membrane pattern formation process may be reverse order, and may be performed simultaneously.

  As described above, according to the film pattern forming method of the present embodiment, the second film pattern 214 can be easily overlapped and formed on the first film pattern 112 by using the ink jet method. Thereby, a multilayer film pattern 215 having a film thickness can be formed.

  Furthermore, as described above, the second film pattern 214 has a lower resistance value because the film thickness can be further increased by the edge effect as compared with the film pattern formed on the conventional substrate using the inkjet method. A conductive film wiring can be obtained.

  Depending on the shape of the first film pattern 112, the photosensitive film B202 formed on the side surface of the first film pattern 112 may not be exposed. FIG. 3 is a schematic view showing each step when the shape of the first film pattern 112 is different from that of the present embodiment. For example, when the cross-sectional shape of the first film pattern 112 is a trapezoid, the bottom surface of the first film pattern 112 acts as a mask to block light as shown in FIG. Therefore, the photosensitive film B202 formed on the side surface of the first film pattern 112 is not exposed to light and is not liquid repellent. Even in this case, since the above-described edge effect acts as in the present embodiment, the effects of the present invention, that is, the thick film pattern 215 can be easily formed by performing the steps described above. be able to. Thus, according to the present invention, the second film pattern 214 can be stacked on the first film pattern 112 having any shape.

  Further, the method for forming the first film pattern 112 is not particularly limited. For example, as shown in FIG. 5, the first film pattern 112 can be easily formed by a method using an ink jet apparatus. FIG. 5 is a cross-sectional view showing each step of the first film pattern 112 forming method.

  Specifically, the first film pattern 112 can be formed on the substrate 101 by, for example, an inkjet method. That is, as shown in FIG. 5, a first film pattern 112 is formed on a substrate 101, and a first surface treatment step for adjusting the surface of the substrate 101 to a desired liquid repellency, A first film pattern forming step of forming the first film pattern 112 by discharging droplets made of a liquid containing a component for forming the film pattern 112, and the first film pattern 112 was formed And a heating step of heating the substrate 101. Hereinafter, each process will be described.

(First surface treatment step)
The first surface treatment step is roughly divided into a lyophobic treatment and a lyophilic treatment.

  The liquid repellency process is a process for forming a liquid repellent photosensitive film A102 on the surface of the substrate 101 as shown in FIG.

  As the photosensitive film A102, a self-assembled monomolecular film made of an organic molecular film or the like can be used. The organic molecular film has a functional group capable of binding to the substrate 101 on one end side, and a functional group that modifies the surface property of the substrate 101 to liquid repellency or the like (controls the surface energy) on the other end side. A carbon linear chain or a partially branched carbon chain that connects these functional groups is provided, and is bonded to the substrate 101 to self-assemble to form a molecular film, for example, a monomolecular film. The self-assembled film is a compound having a binding functional group capable of reacting with constituent atoms such as the substrate 101 such as the substrate 101 and other linear molecules, and having extremely high orientation due to the interaction of the linear molecules. Is a film formed by orienting. Since this self-assembled monomolecular film is formed by orienting single molecules, the film thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, uniform and excellent liquid repellency can be imparted to the surface of the film. In a self-assembled monomolecular film composed of an organic molecular film or the like, a raw material compound such as an organic silane molecule and a substrate are placed in the same sealed container and left at room temperature for about 2 to 3 days. Formed on top. Further, by holding the entire sealed container at 100 ° C., it is formed on the substrate 101 in about 3 hours. What has been described above is the formation method from the gas phase, but the self-assembled monolayer can also be formed from the liquid phase. For example, the substrate 101 is immersed in a solution containing a raw material compound, washed, and dried to obtain a self-assembled monolayer on the substrate. Note that before the self-assembled monolayer is formed, it is desirable to perform pretreatment by irradiating the surface of the substrate 101 with ultraviolet light or washing with a solvent. By performing the above processing, the surface of the substrate 101 can be made uniform liquid repellency.

  Next, in the lyophilic process, as shown in FIG. 5B, the liquid-repellent photosensitive film A 102 on the surface of the substrate 101 is irradiated with ultraviolet rays using a mask 103. Thereby, the photosensitive film A102 in the region where the first film pattern 112 is to be formed can be decomposed to make the region lyophilic relative to the peripheral region. Therefore, as shown in FIG. 5C, a lyophilic region H1 where the first film pattern 112 should be formed and a lyophobic region H2 surrounding the lyophilic region H1 can be formed on the surface of the substrate 101. .

  As a method of lyophilic treatment, a method of irradiating ultraviolet light of 170 to 400 nm can be mentioned. At this time, ultraviolet light is irradiated using the mask 103 corresponding to the first film pattern 112. Accordingly, by exposing only the region where the first film pattern 112 is to be formed and partially decomposing it, the liquid repellency can be relaxed and patterned. That is, the substrate 101 on which the liquid-repellent photosensitive film A102 is formed is irradiated with ultraviolet rays through the mask 103 having a hole having the same shape as the first film pattern 112. As a result, the photosensitive film A102 in the region where the first film pattern 112 is to be formed is decomposed and loses liquid repellency, so that the lyophilic region H1 is formed. The degree of relaxation of the liquid repellency is the degree of decomposition of the photosensitive film A102, and can be adjusted by the irradiation time, intensity, and wavelength of ultraviolet light.

  Alternatively, the lyophilic pattern may be formed by scanning the shape of the first film pattern 112 with an ultraviolet laser instead of using the mask 103. Other methods of lyophilic treatment include plasma using oxygen as a reactive gas and a method of irradiating ozone.

  As described above, by disassembling and removing the photosensitive film A102, the substrate 101 is exposed, so that it becomes relatively lyophilic and the functional liquid 110 is disposed directly on the exposed substrate 101. Become. This prevents the photosensitive film A102 from being decomposed when heated in the next first heating step, and the decomposed components are diffused into the first film pattern 112 to prevent the resistance value from changing. Can do.

  In addition, the lyophilic process can be omitted as necessary. However, when it is desired to draw a finer pattern, it is effective to perform patterning in order to increase the difference in contact angle due to the contrast between the repellency and the renewal process.

(First film pattern forming step)
In the first film pattern forming step, as shown in FIGS. 5D and 5E, the droplet 111 of the functional liquid 110 is ejected onto the substrate 101 by the ink jet method to form the first film pattern 112. It is a process to do.

  Here, the functional liquid 110 is preferably composed of the same components as the functional liquid 210 used in the above-described film pattern forming step. Thereby, the partial change of resistance value can be suppressed. Moreover, the inkjet apparatus 120 and its discharge method can use the thing similar to what was used at the film | membrane pattern formation process in the film | membrane pattern formation method mentioned above.

  First, a case where the lyophilic process shown in FIG. When the droplets 111 of the functional liquid 110 are ejected into the shape of the first film pattern 112 using the inkjet device 120, the functional liquid 110 is deposited on the substrate 101 as shown in FIG. 5E. Stays in 112 shape. The substrate 101 is uniformly lyophobic by the first surface treatment process. For this reason, when the droplet 111 of the functional liquid 110 is dropped, the landed liquid does not spread, and a fine line can be drawn by landing repeatedly. At this time, it is necessary to control the degree of overlap of the droplets 111 dropped on the substrate 101 so that a liquid pool (bulge) does not occur. As one of the means, it is possible to adopt a discharge method in which the droplets 111 after landing are discharged separately so as not to contact each other in the first discharge, and the space is filled by the second and subsequent discharges. . Thereby, a uniform film thickness can be realized.

  Next, the case where the said lyophilic process shown in FIG.5 (d) is implemented is demonstrated. In this case, as shown in FIG. 5D, the functional liquid 110 is discharged to the lyophilic region H1 formed by performing the lyophilic process in the first surface treatment process. By performing the lyophilic treatment, the contact angle difference between the lyophobic regions increases, so that the functional liquid 110 remains in the lyophilic region H1 without overflowing its shape. Thereby, the finer and thicker first film pattern 112 can be formed.

(First heating step)
The first heating step is a step of removing the dispersion medium or coating agent contained in the functional liquid 110 disposed on the substrate 101. That is, the functional liquid 110 disposed on the substrate 101 needs to completely remove the dispersion medium in order to improve electrical contact between the fine particles. In addition, when the surface of the conductive fine particles is coated with a coating agent such as an organic substance in order to improve dispersibility, it is also necessary to remove this coating agent.

  Here, a hot plate, an oven, a light source, plasma, or the like can be used as a heating method. By heating the substrate 101, the dispersion medium evaporates from the functional liquid 110 and becomes a solid. However, as it is, the electrical contact between the conductive fine particles, which are the components for forming the first film pattern 112, in the present embodiment is insufficient, and the heating is further performed to about 350 degrees. Thereby, the dispersion medium and the coating material on the surface of the conductive fine particles are removed, and the conductive first film pattern 112 in which the electrical contact between the conductive fine particles is ensured is formed. Further, by heating to 350 degrees, as shown in FIG. 5F, the photosensitive film A102 on the substrate 101 is decomposed, so that the surface of the substrate 101 is exposed. Thereby, a multilayer film pattern can be formed by continuing the above-mentioned film pattern formation method.

  Through the above steps, the first film pattern 112 can be formed on the substrate 101.

  In the present embodiment, the ink-jet method has been described as the method for forming the first film pattern 112, but this does not limit the method for forming the first film pattern 112.

  For example, as in the past, a film forming process by physical vapor deposition or chemical vapor deposition, a photolithography process for forming a pattern on the formed conductive film, and the formed pattern It can also be formed by etching the conductive film to form the first film pattern 112. Accordingly, the first film pattern formed in the conventional process such as photolithography is easily thickened by applying the above-described film pattern forming method to overlap the second film pattern. Can be

  Further, a fine film pattern that cannot be formed by the ink jet method is formed as a first film pattern by photolithography or the like, and only the portion having a large line width in the first film pattern is subjected to the above film pattern forming method. Then, a second film pattern is formed. Thereby, a film pattern having both a fine pattern and a thick pattern can be formed.

[Embodiment 2]
In this embodiment, a liquid crystal display device including the conductive film wiring of Embodiment 1 will be described as an example of the electro-optical device of the invention. FIG. 6 is a schematic diagram of the liquid crystal display device of the present embodiment. A liquid crystal display device 300 according to the present embodiment is roughly configured from a liquid crystal substrate 301, a substrate having data lines, a data line driving circuit, and a counter electrode (not shown), and a liquid crystal sealed between these two substrates. Yes. In a display area D surrounded by a broken line, pixel areas 302 schematically shown as squares are arranged in a matrix. In each pixel region 302, a TFT (not shown) is formed, and the gate electrodes of the TFTs in the pixel region 302 adjacent to the left and right are connected by a scanning line 303. The scanning line 303 is connected to a scanning line driving circuit 304 disposed on the left side of the display area D via a lead line 305. Then, the scanning line driver circuit 304 sends a signal to the scanning line 303 in a pulse manner at a predetermined timing, and turns on the TFTs in the pixel area 302 for a certain period of time, whereby each pixel area 302 performs display at a predetermined level.

  By the way, when the display area D becomes larger, the scanning line 303 in the pixel area 302 far from the scanning line driving circuit 304 becomes longer. When the resistance of the scan line 303 is large, the pulse signal transmitted from the scan line driver circuit 304 becomes dull with respect to the pixel region 302 close to the scan line driver circuit 304. For this reason, there is a problem that it is impossible to obtain the target on-time of the TFT and a predetermined display level cannot be obtained. Further, since the pulse interval becomes shorter as the number of frames increases, individual pulse waveforms cannot be obtained if the pulse signal becomes dull. This causes a problem that a predetermined display level cannot be obtained. In the present embodiment, the scanning line 303 and the lead line 305 are formed by the film pattern forming method in the above-described embodiment.

  Therefore, according to the liquid crystal display device 300 of the present embodiment, the resistance values of the scanning lines 303 and the lead lines 305 can be lowered. For this reason, even if the display area D becomes large, the pulse signal applied to each pixel area 302 does not become dull. Therefore, a predetermined display level can be obtained even in the pixel region 302 far from the scanning line driver circuit 304, and the liquid crystal display device 300 without uneven luminance can be obtained. Similarly, the above problem associated with increasing the number of frames can be solved.

  Even if the present invention is applied not only to the scanning line 303 but also to the data line, the same effect can be obtained. Further, the present invention is not limited to the liquid crystal display device 300, and may be applied to wirings used in other display devices such as a plasma display device and an organic EL display device.

  The present invention can also be expressed as follows.

  That is, the film pattern of the present invention is a film pattern formed on the substrate, and the first film pattern formed on the substrate and the liquid repellency by photosensitivity formed on the first film pattern. A lyophilic film, a lyophobic film surrounding the first film pattern that is exposed to light from the back surface of the substrate, and the lyophilic film is sandwiched between the lyophilic film. It can be said that the second film pattern is characterized by having a second film pattern formed by ejecting droplets made of a liquid containing a pattern forming component on the first film pattern.

  In addition, the film pattern of the present invention includes the first film pattern formed on the substrate and the lyophilic film that becomes lyophobic when exposed to light from the back surface of the substrate. A liquid repellent film surrounding the film pattern, and a second film pattern formed by ejecting droplets made of a liquid containing a pattern forming component on the first film pattern. It can be said that.

  Furthermore, it can be said that the film pattern of the present invention is characterized in that the liquid-repellent film is deteriorated in liquid repellency after the film pattern is formed.

  In addition, the film pattern forming method of the present invention includes a surface treatment step of lyophilicizing the surface using a lyophilic material that becomes lyophobic when exposed to light with respect to the substrate on which the first film pattern is formed. After the surface treatment step, the surface of the substrate that has been surface-treated is exposed from the back surface of the substrate through the first film pattern to make it liquid-repellent, and after the liquid-repellent step, the first film pattern It can also be said that it has a film pattern forming step of discharging a droplet made of a liquid containing a pattern forming component to form a second film pattern.

  According to the above film pattern and film pattern forming method, the first film pattern is exposed from the back surface by exposing the substrate having the first film pattern surface-treated with a lyophilic material that becomes lyophobic when exposed to light. Acts as a mask. Thereby, the lyophilic property is maintained on the first film pattern that is not irradiated with light, and the other regions are exposed to light and become liquid repellent. Accordingly, the first film pattern on which the second film pattern is formed can be easily patterned without using a mask in a lyophilic manner and the region surrounding the first film pattern without using a mask.

  Further, depending on the thickness of the first film pattern, a step is generated between the lyophilic region on the surface of the first film pattern and the lyophobic region on the substrate surface surrounding the lyophilic region. As a result, when the liquid applied on the first film pattern spreads to the boundary with the liquid repellent part, the liquid repellent area is low, so that the liquid stays at the boundary (edge) due to the surface tension of the liquid and enters the liquid repellent part. Spreading is further prevented. Therefore, the thickness of the second film pattern is increased by overlapping the second film pattern on the first film pattern, and the film thickness of the second film pattern forms a lyophilic / repellent pattern on the flat substrate. It can be formed thicker than when a liquid is applied. This is because forming a lyophilic / lyophobic pattern along the first film pattern and applying a liquid on the lyophilic first film pattern causes the liquid to flow due to the difference in the contact angle between the lyophilic part and the lyophobic part. In addition to the holding, it is possible to hold more liquid in the lyophilic portion by the above-described boundary step action (edge effect), and the film thickness can be increased.

  Further, since the first film pattern is high, even if the liquid protrudes near the edge of the first film pattern due to the deviation of the landing position of the ink jet or the deformation of the droplet at the time of landing, the protruding liquid There is no contact with the liquid repellent part of the surface of the film. Thereby, since the surface tension of the liquid is increased by the edge effect, the protruding liquid droplet can return to the first film pattern. If the lyophilic pattern is flat, the liquid protruding from the lyophilic part comes into contact with the lyophobic part before returning to the lyophilic part due to the surface tension of the liquid, and the edge effect cannot be obtained. In this case, the liquid remains in the liquid repellent portion, which causes a problem that the boundary is formed in a wave shape. However, since the liquid is drawn back to the lyophilic portion by the edge effect by applying on the first film pattern having a height, it is possible to form a beautiful line along the lyophilic / repellent boundary.

  Further, the film pattern forming method of the present invention is characterized in that it includes a second removal step of removing the photosensitive film B on the first film pattern that has not been completely removed in the first removal step. I can say that.

  According to the above invention, the photosensitive film B remaining on the first film pattern is completely removed by the second removing step. As a result, the second film pattern is formed directly on the exposed first film pattern. That is, the photosensitive film B does not exist between the first film pattern and the second film pattern, and the first film pattern and the second film pattern are in contact with each other. Therefore, a film pattern with higher purity can be formed. Further, if the first film pattern is more lyophilic than the photosensitive film B, a more lyophilic contrast can be obtained.

  Furthermore, it can be said that the film pattern forming method of the present invention is characterized in that, in the second removing step, the photosensitive film B which has not been made liquid-repellent is removed by irradiating with ultraviolet rays.

  According to the above invention, the photosensitive film B which has not been made liquid-repellent is generally removed by the first removing step, but cannot be completely removed. Therefore, a part of the photosensitive film B remains by irradiating the surface of the substrate with ultraviolet rays. The photosensitive film B can be removed. That is, the photosensitive film B on the first film pattern that has not been made liquid-repellent can be suitably removed by irradiating with ultraviolet rays.

  Furthermore, it can be said that the film pattern forming method of the present invention is further characterized in that the photosensitive film B on the substrate, which has been made liquid-repellent by the liquid-repellent step, is further made liquid-repellent by irradiating the ultraviolet rays.

  According to the above invention, the photosensitive film B on the substrate, which has been made liquid repellent on the first film pattern, can be made more liquid repellent by irradiating with ultraviolet rays in the removing step. Thereby, higher lyophobic contrast can be obtained.

  Further, it can be said that the film pattern forming method of the present invention is characterized by having a third removal step for deteriorating the liquid repellency of the substrate after the second film pattern is formed.

According to the film pattern forming method, the substrate can be returned to the state before the second film pattern is formed except that the second film pattern is formed by the third removing step. Accordingly, since the substrate is not liquid repellent, a uniform film can be formed.
Further, since another material can be stacked on the material on the substrate without sandwiching a liquid repellent material, a film or a functional element can be continuously formed on the substrate.

  Furthermore, it can be said that the film pattern forming method of the present invention is characterized in that the third removal step heats the substrate.

  According to the film pattern forming method, when the liquid repellent material is made of an organic material, the liquid repellent property can be deteriorated by combining the organic material with oxygen and decomposing by heating.

  Furthermore, it can be said that the film pattern forming method of the present invention is characterized by having a first removal step of washing away the material treated in the first surface treatment step that is not liquid-repellent after the liquid repellency step. .

  According to the film pattern forming method, the lyophilic material on the first film pattern is washed away by the first removing step, and the surface of the first film pattern is exposed. For this reason, both can be contacted, without the lyophilic material used as an impurity entering between the 1st film pattern and the 2nd film pattern. Thereby, favorable characteristics can be obtained for the film pattern in which the first film pattern and the second film pattern are stacked. Furthermore, since the metal surface such as the wiring pattern has a small contact angle, a sufficient difference in the contact angle of the lyophilic / repellent pattern can be obtained even if the lyophilic material is washed away. Further, when liquid is applied to the lyophilic portion of the lyophilic / repellent pattern formed on the glass as in the past, the lyophilic portion is glass, and the liquid is held by the difference in the contact angle between the glass and the lyophobic portion. However, in the present invention, the difference in contact angle between the metal having a smaller contact angle than glass and the liquid-repellent portion can be increased, and the difference in contact angle can be increased. it can.

  Further, in the film pattern forming method of the present invention, the first removal step is washed with isopropyl alcohol, and the lyophilic material can be preferably washed away.

  In the film pattern forming method of the present invention, the first film pattern includes a first surface treatment step for adjusting the surface of the substrate to a desired liquid repellency and a liquid material containing a first film pattern forming component. Formed by a first film pattern forming process for discharging the liquid droplets to form the first film pattern and a first heating process for heating the substrate on which the first film pattern is formed. It can be said that it is characterized by.

  According to the film pattern forming method described above, by making the substrate liquid-repellent in the first surface treatment step, it is possible to prevent the droplets discharged on the substrate from spreading and to draw thin lines. . Further, by forming the lyophobic pattern on the substrate, it is possible to draw a thinner and thicker film line. In the first surface treatment step, since the inkjet method is used, the first film pattern can be easily formed at low cost without using expensive and complicated equipment such as a vacuum apparatus. Furthermore, the liquid discharged by the first heating process is dried, and the solid content is baked to form a film, and the liquid-repellent film obtained by the first surface treatment process is decomposed, Since the substrate returns to the initial state except that the first film pattern is formed, the film and the functional element can be continuously formed.

  Further, the first surface treatment step is a process of forming a self-assembled monolayer on the surface of the substrate, and the monolayer can be easily formed by using a self-assembled film made of organic molecules, and is uniform. Liquid repellency is obtained.

  Furthermore, it can be said that the film pattern forming method of the present invention is characterized in that the first film pattern is formed by a film forming process, a photolithography process, and an etching process.

  According to the above film pattern forming method, it is possible to easily increase the thickness of the first film pattern formed by a conventional process such as photolithography. Further, a fine film pattern that cannot be formed by the ink jet method is formed as a first film pattern by a process such as conventional photolithography, and the second film pattern is formed by the ink jet method only on a portion having a large line width in the first film pattern. By forming the film, both a fine pattern and a film thickness pattern can be achieved.

  In addition, as the film forming process, a film forming process using physical vapor deposition or chemical vapor deposition can be suitably employed.

  It can be said that the conductive film wiring of the present invention is characterized by being composed of any one of the above-described film patterns having conductivity. Thereby, since the film thickness is large, the resistance of the wiring is reduced, and the dullness of the driving waveform can be prevented.

  It can be said that the electro-optical device of the present invention includes the conductive film wiring. Examples of the electro-optical device employed in the present invention include a liquid crystal display device, an organic electroluminescence display device, and a plasma display device. According to these inventions, since the wiring resistance between the pixel and the drive circuit is low, it is possible to suppress luminance variation due to the dullness of the drive signal applied to the pixel, and to provide an electro-optical device free from display unevenness. it can.

  As described above, according to the present invention, a film pattern is further formed on an existing film pattern using an ink jet method, so that a film can be formed in comparison with an existing film pattern or a film pattern formed only by an ink jet method. Can be thicker. In addition, the existing film pattern can be adjusted to the lyophilic portion and the others can be adjusted to the lyophobic portion without using a mask, and the liquid discharged on the existing film pattern adjusted to the lyophilic portion can be maintained. The amount of the liquid is larger than the amount of liquid retained on the lyophilic portion of the lyophilic / repellent pattern formed on the substrate, and the film can be made thicker.

  In addition, when the existing film pattern is highly lyophilic, the lyophilic part of the existing film pattern is adjusted to be lyophilic by adjusting only the region other than the existing film pattern to be lyophobic. Since the difference in the contact angle between the lyophobic part and the liquid repellent part is increased, the amount of liquid retained in the lyophilic part is increased and the film can be made thicker. Since there are no components other than the film forming component between the patterns, a higher quality film can be formed.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and can be obtained by appropriately combining technical means disclosed in different embodiments. Embodiments are also included in the technical scope of the present invention.

  The film pattern forming method according to the present invention can be suitably used when it is desired to obtain a film pattern used for wiring used in a display device such as a liquid crystal display device, a plasma display device, an organic EL display device, or other electronic devices.

101 Substrate 102 Photosensitive film A (self-assembled monomolecular film)
110 functional liquid 111 droplet 112 first film pattern 202 photosensitive film B
210 Functional liquid 214 Second film pattern 215 Film pattern (conductive film wiring)
300 Liquid crystal display device (electro-optical device)
h1 Non-liquid repellent area h2 Liquid repellent area

Claims (21)

A second film pattern is formed on the first film pattern by discharging droplets of a functional liquid containing the components of the second film pattern onto the first film pattern formed on the surface of the substrate. A film pattern forming method comprising:
A surface treatment step of forming a photosensitive film B that is lyophobic by exposure to light on the surface of the substrate and the surface of the first film pattern, and exhibits liquid repellency with respect to the functional liquid;
By exposing the substrate from the back side of the substrate to make the photosensitive film B liquid repellent;
A film pattern forming method comprising: forming a second film pattern by discharging droplets of the functional liquid onto the first film pattern after the liquid repellency process.   2. The film pattern forming method according to claim 1, wherein the photosensitive film B exhibits lyophilicity to the functional liquid in a non-photosensitive state.   3. The film pattern forming method according to claim 1, further comprising a first removal step of removing the photosensitive film B on the first film pattern that has not been made liquid-repellent by the liquid-repellent step. .   4. The film pattern forming method according to claim 3, wherein in the first removing step, the photosensitive film B which has not been made liquid-repellent is removed using isopropyl alcohol. The first removing step includes a washing step of removing the photosensitive film B on the first film pattern by washing;
4. The film pattern forming method according to claim 3, further comprising a second removal step of removing the photosensitive film B remaining on the first film pattern after the cleaning step.   6. The film pattern forming method according to claim 5, wherein the second removing step exposes the substrate from the surface of the substrate with respect to at least the first film pattern.   6. The film pattern forming method according to claim 5, wherein in the second removing step, the substrate is exposed from the surface of the substrate with respect to the first film pattern and the substrate.   The film pattern forming method according to claim 1, further comprising a third removal step of removing the photosensitive film B on the substrate that has been made liquid-repellent by the liquid-repellent step. . The photosensitive film B is made of an organic material,
9. The film pattern forming method according to claim 8, wherein in the third removing step, the liquid-repellent photosensitive film B is removed by heating the substrate. The photosensitive film B is made of an organic material,
9. The film pattern forming method according to claim 8, wherein the third removing step removes the lyophobic photosensitive film B by irradiating the substrate with ultraviolet rays.   The method includes a first film pattern forming step of forming the first film pattern by discharging droplets of a functional liquid containing the constituent components of the first film pattern onto the substrate. Item 11. The film pattern forming method according to any one of Items 1 to 10. The first film pattern forming step includes
Forming on the substrate a photosensitive film A that exhibits liquid repellency to the functional liquid containing the constituent components of the first film pattern, and discharging droplets of the functional liquid onto the photosensitive film A. The film pattern forming method according to claim 11, wherein The first film pattern forming step includes
On the substrate, a photosensitive film A that decomposes and loses liquid repellency is formed by sensitizing the functional liquid containing the constituent components of the first film pattern with light repellency, and the first film pattern is formed. The film pattern forming method according to claim 11, wherein the photosensitive film A in a region where the film is formed is removed by exposure, and droplets of the functional liquid are ejected onto the exposed substrate.   14. The film pattern forming method according to claim 12, wherein the first film pattern forming step removes the photosensitive film A in a region where the first film pattern is not formed.   The film pattern forming method according to claim 12, wherein the photosensitive film A is a self-assembled monomolecular film.   The film pattern forming method according to any one of claims 1 to 10, wherein the first film pattern is formed by patterning a film formed on a substrate by photolithography.   The film pattern forming method according to claim 16, wherein the film formed on the substrate is formed using a physical vapor deposition method or a chemical vapor deposition method.   It forms with the film | membrane pattern formation method of any one of Claims 1-17, The film | membrane pattern characterized by the above-mentioned.   The film pattern according to claim 18, wherein the film pattern has conductivity.   A conductive film wiring comprising the film pattern according to claim 19.   An electro-optical device comprising the conductive film wiring according to claim 20.

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