JP2010080527A - Wiring-substrate manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a copper wiring pattern on a resin layer, not including a filler, by plating with a higher adhesion force. <P>SOLUTION: A wiring-substrate manufacturing method includes: a step of depositing first metallic particles on the surface of a resin layer covering a substrate; a step of changing the surface of the resin layer and the surfaces of the first metallic particles to have hydrophilic properties by exposing them to ultraviolet light excited ozone or oxygen plasma; a step of processing the surface of the resin layer and the surfaces of the first metallic particles, respectively changed to have hydrophilic properties, by a silane coupling agent having any one of a vinyl group, a styryl group, a methacryloxy group, and an acryloxy group; a step of depositing second metallic particles made of palladium atoms on the surface of the resin layer and the surfaces of the first metallic particles respectively processed by the silane coupling agent; and a step of forming a copper layer by electroless plating by covering the surface of the resin layer and the surfaces of the first metallic particles respectively processed by the silane coupling agent and the surfaces of the second metallic particles. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention generally relates to copper plating technology, and more particularly to a method of manufacturing a wiring board using copper plating.

  In manufacturing a wiring board, it is necessary to form a conductor film on the surface of the resin substrate. Since the resin substrate surface is generally insulative, such a conductor film is formed by electroless plating. When a conductor film is formed on the resin surface, the adhesion between the two becomes a major issue.

  In a general wiring board, the resin layer constituting the resin substrate includes a filler such as ceramic particles. Therefore, in forming the conductive layer, surface treatment is performed on the resin substrate, and the ceramic particles exposed on the surface of the resin substrate are etched to form fine irregularities. The conductive layer formed on the surface of the resin substrate having such fine irregularities fills the irregularities, and as a result, the adhesion of such a conductive layer is improved by a so-called anchor effect. In general, in the case of a wiring board having a copper pattern on a resin substrate, it is said that the adhesive force between the copper pattern and the resin substrate is 1.0 kg / cm or more.

In addition, in the case of a resin substrate using a resin having a resin filler having a specific functional group, before the copper pattern is formed by electroless copper plating, the resin substrate surface is subjected to a hydrophilic treatment, and further continued. By performing the treatment with the silane coupling agent, an adhesive force of 1.0 kg / cm can be realized between the formed copper pattern and the resin substrate.
JP 2008-41720 A Kobayashi Tadashi "Prin and Banjuku IV" 2nd edition, page 8, Japan Printed Circuit Industry Association, 2004

  On the other hand, some of the wiring boards have a type in which the surface of the resin substrate is covered with a thin resin layer.

  For example, in a wiring board carrying a highly heat-generating semiconductor element, a laminated board reinforced with carbon fiber may be used instead of conventional glass fiber in order to suppress thermal expansion of the board and improve the elastic modulus. Carbon fiber is conductive, and in such laminates, a thin resin layer is used to cover the entire surface of the core substrate and to insulate the through holes and other openings formed in the core substrate. For example, by electrodeposition.

  However, it is generally difficult to include a filler in the resin layer deposited by the electrodeposition method, the conventional anchor effect cannot be used, and the functional group on the resin filler and the electroless plating layer A strong chemical bond between them cannot be used, and there arises a problem that the adhesive force is insufficient between the electroless copper plating layer formed on the substrate surface and the build-up substrate.

  According to one embodiment, a method of manufacturing a wiring board includes a step of depositing first metal particles on a surface of a resin layer covering a substrate, and a surface of the resin layer and a surface of the first metal particles are made by ultraviolet light-excited ozone or The step of changing to hydrophilic by exposing to oxygen plasma, and the surface of the resin layer changed to hydrophilic and the surface of the first metal particles are any of vinyl group, styryl group, methacryloxy group, and acryloxy group. A step of treating with a silane coupling agent having the following: depositing second metal particles made of palladium on the surface of the resin layer and the surface of the first metal particles treated with the silane coupling agent; and Covering the surface of the resin layer treated with the silane coupling agent, the surface of the first metal particles, and the surface of the second metal particles, for electroless plating Characterized in that it comprises a step of forming a Ridoso, the.

  In such a configuration, the second metal particles are efficiently captured on the surface of the resin layer and the surface of the first metal particles by a vinyl group, a styryl group, a methacryloxy group, or an acryloxy group contained in the silane coupling agent. The On the other hand, the silane coupling agent is efficiently adsorbed on the surface of the first metal particles and the surface of the resin layer by performing a hydrophilic treatment after depositing the first metal particles on the resin layer. . Therefore, when a copper layer is formed by electroless plating so as to cover the surface of the resin layer, the surface of the first metal particle, and the surface of the second metal particle, the second layer made of palladium trapped in a large amount. The metal particles serve as a catalyst, the electroless copper plating layer is efficiently deposited, and a strong adhesive force is generated between the electroless copper plating layer and the resin layer.

[First Embodiment]
1A to 1H are views showing a manufacturing process of a wiring board according to the first embodiment.

  Referring to FIG. 1A, through holes 11A and 11B are formed in a core substrate 11 in which resin layers 11a to 11d are laminated via a carbon fiber layer 12, and the through-holes 11A and 11B are formed on the surface of the core substrate 11. The electrodeposition resin layer 14 including the side wall surfaces of the holes 11A and 11B is uniformly formed with a thickness of, for example, 1 μm to 100 μm via the copper layer 13 serving as an electrode.

  Next, first metal particles 15 made of metal atoms selected from nickel (Ni), palladium (Pd), tin (Sn), gold (Au), and the like are electrolessly formed on the core substrate 11 in the state shown in FIG. 1A. By plating, a metal layer having a film thickness of 100 nm or less is deposited to obtain the structure shown in FIG. 1B. Thus, the metal layer formed with a film thickness of 100 nm or less on the electrodeposition resin layer 14 has an island-like structure, and the surface of the electrodeposition resin layer 14 is not completely covered with the metal layer. Since the first metal particles do not completely cover the electrodeposited resin layer 14 as described above, a copper layer can be formed later by electroless plating. In addition, as the electrodeposition resin layer, for example, a novolak resin marketed as a registered trademark “Insuled” by Nippon Paint Co., Ltd. can be used.

  In the step of depositing the first metal particles 15 shown in FIG. 1B, since uniform dispersion of the metal particles 15 on the surface of the electrodeposited resin layer 14 is promoted, palladium is particularly used as the first metal particles 15. It is advantageous to use. The first metal particles 15 may aggregate to form an island-shaped metal pattern. Such island-shaped metal patterns have a particle size of about 0.1 nm to 100 nm. Each of the first metal particles 15 may be a single metal atom, or may be an atomic group in which a plurality of metal atoms are aggregated.

  Next, in this embodiment, the step of irradiating ultraviolet light-excited ozone shown in FIG. 1C (UV ozone treatment) is performed on the structure of FIG. 1B, and the exposed surface of the electrodeposition resin layer 14 and the exposure of the metal particles 15 are performed. The surface is made hydrophilic. By such a hydrophilic treatment, a hydroxyl group, a carboxyl group, a carbonyl group, or the like is easily bonded to the exposed surface, and the exposed surface exhibits hydrophilicity by the action of the hydroxyl group, the carboxyl group, the carbonyl group, or the like. . In particular, the progress of hydrophilization on the exposed surface of the metal particles 15 is remarkable, and the presence of the metal particles 15 on the surface of the electrodeposited resin layer 14 allows the entire exposed surface to be compared with the case of the electrodeposited resin layer 14 alone. Hydrophilization proceeds further, and the contact angle with water further decreases. For this reason, it becomes possible to improve the adhesiveness with respect to a silane coupling agent in the case of the silane coupling agent process performed following the process of FIG. 1C.

  Next, the core substrate 11 after the UV ozone treatment shown in FIG. 1C is immersed in a bath of the silane coupling agent 16 as shown in FIG. In this embodiment, a silane coupling agent having a vinyl group, a styryl group, a methacryloxy group, an acryloxy group, or the like is used as the silane coupling agent 16 in particular. This makes it possible to efficiently capture palladium (Pd) atoms that act as a catalyst during the electroless plating process of the Cu layer in subsequent steps. Since the exposed surfaces of the electrodeposition resin layer 14 and the first metal particles 15 are converted to hydrophilic by UV ozone treatment in the step of FIG. 1C, the silane coupling agent is used in the step of FIG. 1D. Are continuously adsorbed or bound to each other.

  Next, the core substrate 11 is lifted from the bath 16 of the silane coupling agent, dried, and then treated with a palladium deposition bath, which is one of the electroless copper plating processes. As shown in FIG. 1E, second metal particles 17 made of palladium are deposited on the metal particles 15.

  As described above, in the structure of FIG. 1E, the surfaces of the electrodeposition resin layer 14 and the first metal particles 15 are treated with a silane coupling agent having a vinyl group, a styryl group, a methacryloxy group, an acryloxy group, or the like. Therefore, a large amount of palladium atoms are adsorbed as the second metal particles 17. Each of the second metal particles 17 may be a single palladium atom, but may be an atomic group in which a plurality of palladium atoms are aggregated.

  FIG. 2 is a diagram showing an outline of an adsorption mechanism of the second metal particles 17, that is, palladium atoms, in the step of FIG. 1E.

  Referring to FIG. 2, Si atoms in the silane coupling agent are firmly bonded to the first metal particles 15 on the electrodeposition resin layer 14, for example, palladium atoms via oxygen atoms, Moreover, it superposes | polymerizes through another Si atom and another oxygen atom. Here, the metal particles 15 may form an island-shaped metal layer on the surface of the electrodeposited resin layer 14 as described above.

A CH ₂ group is double-bonded to the Si atom through a CH group, but when a palladium atom approaches such a portion, the palladium atom breaks the double bond, and the C—H group It is thought that it is bonded to the carbon atom that constitutes.

  Furthermore, in this embodiment, the structure of FIG. 1E is immersed in a copper plating bath, and an electroless copper plating layer 18 is deposited on the structure of FIG. 1E to a film thickness of, for example, 0.1 μm to 10 μm as shown in FIG. 1F. . At this time, the second metal particles 17 made of palladium act as a catalyst for the deposition reaction of electroless copper, and the electroless copper plating layer 18 encloses the second metal particles 17 or this. Is replaced by a copper atom.

  As a result, according to this embodiment, it is possible to obtain a uniform and high adhesive copper layer as the electroless copper plating layer 18 even though the electrodeposition resin layer 14 as a base does not contain a filler. I can do it. At that time, the first metal particles 15 form an island-shaped metal layer having a film thickness of 100 nm or less, and a continuous metal film is not formed. Therefore, when the electroless copper plating layer 18 is formed, Copper precipitation is not hindered.

  Further, an electrolytic copper plating layer 19 is formed on the structure of FIG. 1F by electrolytic plating to obtain the structure of FIG. 1G. In the electrolytic plating treatment step according to FIG. 1F, although not shown, a resist pattern is formed on the electroless copper plating layer 18 by photolithography, and by performing the electrolytic plating treatment using the resist pattern as a mask, A copper wiring pattern is formed on the electroless copper plating layer 18 by the electrolytic copper plating layer 19.

  Further, by removing the electroless copper plating layer 18 exposed between the copper wiring patterns by etching, a wiring substrate 10 having a copper wiring pattern 19A as shown in FIG. 1H is obtained.

  Hereinafter, this embodiment will be described with reference to examples.

  In Example 1, the step of depositing the first metal particles described in FIG. 1B was performed by applying a palladium deposition bath used in an electroless copper plating process.

  More specifically, the product name Cataposit 44 of Rohm and Haas is used as the palladium deposition bath, and the structure of FIG. 1A is immersed in the palladium deposition bath at a temperature of 55 ° C. for 3 minutes. As an activation process, a process using an accelerator 19E manufactured by Rohm and Haas was performed at room temperature for 6 minutes. Thereby, palladium is deposited on the surface of the electrodeposited resin layer 14 as the first metal particles 15 including the through holes and the side wall surfaces of the 11B with a thickness of 100 nm or less.

  In Example 1, the above-mentioned Nippon Paint Insuled is used as the electrodeposition resin layer 14. The electrodeposition resin layer 14 does not contain a filler. In the structure of FIG. 1A, the core resin layers 11a to 11d are made of an epoxy resin layer, and contain inorganic fillers such as silica powder and talc powder having an average particle diameter of 0.1 to 5.0 μm. As the carbon fiber layer 12, a woven fabric (film thickness of about 0.15 μm) with 1000 carbon fibers as one yarn was used. However, in this embodiment, the core resin layers 11a to 11d are not limited to the epoxy resin, and it is also possible to use, for example, polyimide resin or BT resin.

  Next, the UV ozone treatment described with reference to FIG. 1C was performed on the core substrate 11 thus formed by driving a commercially available UV ozone irradiation apparatus with an output of 40 W for 10 minutes. As a result of analyzing the surface after the UV ozone treatment by an X-ray spectroscopic analysis (XPS) method, it was confirmed that hydroxyl groups (hydroxy groups, hydroxyl groups) and carboxyl groups were generated.

  Next, the core substrate 11 treated in this way is immersed in an aqueous solution of vinyl silane having a trade name of KBM1003 under the trade name KBM1003 at a concentration of about 1.0 wt% at a temperature of about 70 ° C. After 1 minute. The substrate was pulled up, washed sufficiently with water, and dried at 120 ° C. for 1 hour, whereby the treatment described above with reference to FIG. 1D was performed.

  FIG. 3 shows the results of XPS analysis performed on the sample thus obtained. In FIG. 3, scanning of the photoelectron spectrum is performed in a constrained energy band of 94 to 114 eV (narrow scan). In the figure, the horizontal axis represents the binding energy, and the vertical axis represents the relative intensity of the excited photoelectrons.

Referring to FIG. 3, the binding energy of the Si2p orbital is 99.2 eV, whereas in the figure, about 103.3 corresponding to the R—Si—O ₃ bond or the R ₂ —Si—O ₂ bond. Chemical shifts of 5 eV and 102.5 eV were observed, and as a result of the treatment shown in FIG. 1D, it was confirmed that vinylsilane was adsorbed or bonded to the surface of the core substrate 11.

  Next, corresponding to the process described with reference to FIG. 1E, a palladium deposition bath is applied to the core substrate 11 thus obtained at a temperature of 55 ° C. using the catalyst deposit 44 of Rohm and Haas. Run for a minute to deposit palladium as the second metal particles 17 and bond with vinylsilane double bonds present on the surface of the core substrate 11, that is, on the exposed surfaces of the electrodeposition resin layer 14 and the first metal particles 15. Let

  Further, after the treatment by the accelerator 19E was performed for 6 minutes at room temperature, the structure of FIG. 1E was immersed in an electroless copper plating bath to deposit an electroless copper plating layer 18. More specifically, the product name Coppermix of Rohm and Haas was used as the electroless copper plating bath, and precipitation was performed at room temperature for 20 minutes. Further, after the electroless copper plating layer 18 is formed, the obtained structure of FIG. 1F is subjected to a drying process at a temperature of 120 ° C. to 150 ° C. for about 30 minutes.

  As a result of observing the structure thus obtained with an optical microscope, the electroless copper plating layer 18 is uniform on the surface of the electrodeposited resin layer 14 including the side wall surfaces of the through holes 11A and 11B. It was confirmed that it was formed.

Further, an electrolytic copper plating layer 19 was formed to a thickness on the structure thus obtained by electrolytic plating. More specifically, the structure shown in FIG. 1F has a structure in which copper sulfate pentahydrate is 50 g / L to 100 g / L, sulfuric acid is 150 g / L to 300 g / L, and additives such as a brightener and a smoothing agent are 0.00. It is immersed in an electrolytic copper plating solution containing a concentration of 1% to 2%, energized at a current density of 3 A / cm ^{2 using} the electroless plated layer 18 as a conductive layer, and the electrolytic copper plated layer 19 is formed to a thickness of 30 μm. Formed. Further, the structure thus obtained was heat-treated at 180 ° C. for 1 hour.

  When the adhesive strength (peel strength) of the electrolytic copper plating layer 19 obtained in this example was measured by a peel strength test, an adhesive strength exceeding 1.1 kg / cm, which is 1.1 kg / cm, was realized. It was confirmed that

  In this embodiment, as the silane coupling agent, other vinyl silanes such as vinyl triacetoxy silane, vinyl tris (methoxyethoxy) silane, vinyl trimethoxy silane, vinyl triethoxy silane, vinyl triisopropoxy silane, acrylic trimethoxy silane. Even when using the above, an adhesive force exceeding 1.0 kg / cm was obtained for the electrolytic copper plating layer 19.

  In Example 1, the silane coupling agent has a methacryloxypropyltrimethoxysilane having a methacryloxy group as a functional group, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, and an acryloxy group. Even when acryloxypropyltrimethoxysilane was used and when p-styryltrimethoxysilane having a styryl group was used, an adhesive force exceeding 1.0 kg / cm was obtained for the electrolytic copper plating layer 19. All of the above-mentioned silane coupling agents contain a double bond.

(Comparative example)
On the other hand, as a comparative example with respect to Example 1, in Example 1 above, the structure of FIG. 1A is immediately subjected to the silane coupling agent treatment, palladium deposition treatment, electroless copper plating treatment and electrolysis of FIGS. 1D to 1G. An experiment was conducted in which the copper plating treatment was performed under the same conditions.

  However, in this experiment, the electroless copper plating layer 18 was deposited unevenly on the surface of the electrodeposited resin layer 14 and easily peeled off in a peel strength test. The adhesion of the electrolytic copper plating layer obtained in this comparative example was only 0 kg / cm.

  Thus, according to the present embodiment, the first metal particles 15 are deposited on the surface of the resin layer 14 covering the substrate, and the surface of the resin layer 14 and the surface of the first metal particles 15 are excited by ultraviolet light. Silane coupling agent having a vinyl group, a styryl group, a methacryloxy group, or an acryloxy group on the surface of the resin layer 14 and the surface of the first metal particles 15 that have been changed to hydrophilicity by exposure to ozone. The second metal particles 17 made of palladium are deposited on the surface of the resin layer 14 and the surface of the first metal particles treated with the silane coupling agent 16 and bonded to the silane coupling agent. Due to the vinyl group, the styryl group, the methacryloxy group, and the acryloxy group, the second metal particles 17 are formed on the surface of the resin layer 14 and the first metal particles 1. Then, the surface of the resin layer 14 treated with the silane coupling agent, the surface 15 of the first metal particles, and the surface of the second metal particles 17 are covered. When the copper layer 18 is formed by electroless plating, the second metal particles 17 made of palladium supplemented in large quantities serve as a catalyst, and the electroless copper plating layer 18 encloses the second metal particles 17. Alternatively, when the copper atoms in the electroless copper plating layer 18 replace the second metal particles 17, a strong bond is generated between the electroless copper plating layer 18 and the resin layer 17. As a result, according to the present embodiment, it is possible to form the electroless copper plating layer with high adhesive force even on the resin layer 14 that does not contain the filler.

  In the present embodiment, the resin layer 14 need not be an electrodeposited resin layer. For example, as shown in FIG. 4, the core substrate 11 is formed by simply immersing and pulling up the core substrate 11 in a molten resin, for example, a molten epoxy resin. It may be a resin layer. Also in this case, the electroless and electrolytic copper plating layers 18 and 19 having a large adhesive force can be obtained by executing the processes described in FIGS. 1B to 1G.

[Second Embodiment]
Next, a method of manufacturing a wiring board according to the second embodiment will be described with reference to FIGS. 5 and 6A to 6D. However, in the figure, the same reference numerals are assigned to portions corresponding to the portions described above, and description thereof is omitted.

  FIG. 5 corresponds to the process described with reference to FIG. 1C, and the exposed surfaces of the electrodeposition resin layer 14 and the first metal particles 15 are changed to be hydrophilic. In this embodiment, instead of UV ozone treatment, FIG. Next, oxygen plasma irradiation is performed.

  The oxygen plasma is generated, for example, by supplying microwaves into the air, and acts on the exposed surfaces of the electrodeposition resin layer 14 and the first metal particles 15, so that hydroxyl groups, carboxyl groups, and carbonyl groups are formed on the exposed surfaces. And so on. As a result, the exposed surface exhibits hydrophilicity by the action of these hydroxyl groups, carboxyl groups, carbonyl groups, and the like. As described above, the progress of hydrophilization is particularly remarkable on the exposed surface of the metal particles 15, and the presence of the metal particles 15 on the surface of the electrodeposited resin layer 14 allows only the electrodeposited resin layer 14 to be present. Compared to the case, the entire exposed surface becomes more hydrophilic, and the contact angle with water is further reduced. For this reason, it becomes possible to improve the adhesiveness with respect to a silane coupling agent in the case of the silane coupling agent process performed following the process of FIG. 1C.

  By the way, in this embodiment, such hydrophilic treatment is performed by oxygen plasma treatment. For example, such oxygen plasma treatment is performed by holding the core laminate 11 in the state shown in FIG. 1A in the air or in an oxygen atmosphere and driving a commercially available oxygen plasma irradiation apparatus.

  As a result of the oxygen plasma irradiation, the electrodeposition resin layer 14 is partially etched, and the first metal particles 15 serve as a mask, and the surface of the electrodeposition resin layer 14 is enlarged as shown in FIG. 6A. As shown in the figure, the recess 14A is typically formed to a depth of about 0.1 μm to 1 μm. In the example of FIG. 6A, the first metal particles 15 form an island-shaped metal pattern 15A having a diameter of about 0.1 nm to 100 nm on the surface of the electrodeposited resin layer 14. Etching of the electrodeposited resin layer 14 with oxygen plasma proceeds substantially isotropically, and the recess 14A has a shape that partially bites into the lower part of the adjacent metal pattern 15A.

  Therefore, the structure of FIG. 6A is immersed in a bath of silane coupling agent 16 as shown in the enlarged view of FIG. 6B corresponding to the process described in relation to the structure of FIG. Corresponding to the steps described in relation to the structure, as shown in the enlarged view of FIG. 6C, the second metal particles 17 made of palladium are deposited on the structure of FIG. 6B.

  Further, corresponding to the process described with reference to FIG. 1F, an electroless copper plating layer 18 is deposited on the structure of FIG. 6C by electroless plating using the second metal particles 17 as a catalyst. At that time, as shown in the enlarged view of FIG. 6D, the electroless copper plating layer 18 encloses the second metal particles 17 or the second metal particles 17 are replaced with Cu atoms. Precipitate. The electroless copper plating layer 18 thus formed is formed so as to fill the concave portion 14A, and as a result, exhibits an excellent adhesive force to the electrodeposited resin layer 14 due to the anchor effect.

  Further, as described in FIG. 1G, the electrolytic copper plating layer 19 is formed on the structure of FIG. At that time, the electrolytic copper plating layer 19 is formed using a resist pattern as a mask, and the exposed electroless copper plating layer 18 is removed by etching, as described in FIG. The wiring board 10 having the copper wiring pattern 19A can be obtained.

  Thus, in this embodiment, although the electrodeposition resin layer 14 does not contain a filler, a recess 14A that generates an anchor effect is formed in the electrodeposition resin layer 14, and the electroless copper plating layer 18, And the outstanding adhesive force is implement | achieved about the electrolytic copper plating layer 19 formed on it.

  In Example 2, the hydrophilization treatment in Example 1 was changed from UV ozone treatment to oxygen plasma irradiation treatment, and the electroless copper plating layer 18 was formed. Other than the above, the second embodiment is the same as the first embodiment.

  As a result of the peel strength test, it was confirmed that the electrolytic copper plating layer 19 obtained in this example had an adhesive force (peel strength) of 1.3 kg / cm with respect to the electrodeposited resin layer 14. It was. This is larger than that of Example 1, indicating that the anchor effect is actually obtained. Also, since such an anchor effect is obtained, the metal atoms constituting the first metal particles 15 on the surface of the electrodeposited resin layer 14 are effectively separated by the electroless copper plating layer 18 in the recess 14A. It is inferred that the island-shaped metal pattern 15A having a diameter of about 0.1 nm to 100 nm is formed so as to be gripped.

  As mentioned above, although this invention was described about preferable embodiment, this invention is not limited to this specific embodiment, A various deformation | transformation and change are possible within the summary described in the claim.

It is a figure (the 1) which shows the manufacturing method of the wiring board by 1st Embodiment. FIG. 8 is a diagram (part 2) illustrating the method for manufacturing the wiring board according to the first embodiment; FIG. 8 is a diagram (part 3) illustrating the method for manufacturing the wiring board according to the first embodiment; FIG. 8 is a diagram (part 4) illustrating the method for manufacturing the wiring board according to the first embodiment; FIG. 8 is a diagram (No. 5) for illustrating the method for manufacturing the wiring board according to the first embodiment; FIG. 6 is a view (No. 6) illustrating the method for manufacturing the wiring board according to the first embodiment; FIG. 7 is a view (No. 7) for explaining the method for manufacturing the wiring board according to the first embodiment; FIG. 8 is a view (No. 8) for illustrating a method of manufacturing the wiring board according to the first embodiment; It is the schematic which shows the effect | action of the silane coupling agent which has a double bond. It is an XPS spectrum figure which shows presence of a silane coupling agent. It is a figure which shows one modification of 1st Embodiment. It is a figure which shows the manufacturing method of the wiring board by 2nd Embodiment. It is an enlarged view (the 1) which shows the manufacturing method of the wiring board by 2nd Embodiment. It is an enlarged view (the 2) which shows the manufacturing method of the wiring board by 2nd Embodiment. It is an enlarged view (the 3) which shows the manufacturing method of the wiring board by 2nd Embodiment. It is an enlarged view (the 4) which shows the manufacturing method of the wiring board by 2nd Embodiment.

Explanation of symbols

11 Core resin substrate 11A, 11B Through hole 11a, 11b, 11c Laminated plate constituting resin layer 12 Carbon fiber 13 Copper layer 14 Electrodeposition resin layer 14A Recess 15 First metal particle 15A Insular metal layer pattern 16 Silane coupling agent 17 Second metal particle (palladium atom)
18 Electroless copper plating layer 19 Electrolytic copper plating layer 19A Copper wiring pattern 141 Resin layer

Claims (5)

Depositing first metal particles on the surface of the resin layer covering the substrate;
Changing the surface of the resin layer and the surface of the first metal particles to hydrophilicity by exposing them to ultraviolet light-excited ozone or oxygen plasma; and
Treating the surface of the resin layer changed to hydrophilic and the surface of the first metal particles with a silane coupling agent having any of a vinyl group, a styryl group, a methacryloxy group, and an acryloxy group;
Depositing second metal particles made of palladium on the surface of the resin layer and the surface of the first metal particles treated with the silane coupling agent;
Covering the surface of the resin layer treated with the silane coupling agent, the surface of the first metal particles, and the surface of the second metal particles, and forming a copper layer by electroless plating;
A method for manufacturing a wiring board, comprising:   2. The method for manufacturing a wiring board according to claim 1, wherein the first metal particles are atoms selected from the group consisting of nickel, palladium, tin, and gold.   3. The method of manufacturing a wiring board according to claim 1, wherein the first metal particles are deposited on the surface of the resin layer by electroless plating.   The step of changing the surface of the resin layer to hydrophilic is performed by exposing the surface of the resin layer and the surface of the first metal particles to oxygen plasma, and the surface of the resin layer is exposed to the first metal. 4. The method of manufacturing a wiring board according to claim 1, wherein a concave shape is formed by using particles as a mask.   The said resin layer does not contain a filler, The manufacturing method of the wiring board as described in any one of Claims 1-4 characterized by the above-mentioned.

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