JP2010077378A - Double-faced adhesive film and electronic component module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-faced adhesive film which suppresses the influence of foreign matter occurring together with processing, such as perforating, when used as an adhesive film for adhering plural elements to a substrate and of which the deformation by heating is suppressed. <P>SOLUTION: The double-faced adhesive film comprises a support film 10, two adhesive layers 21 and 22 laminated on both sides of the support film 10, and cover films 31 and 32 which are laminated to the adhesive layers 21 and 22, each of the cover films on the side reverse to the support film 10. The double-faced adhesive film is used for bonding a semiconductor element and/or an MEMS element to a substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a double-sided adhesive film, a semiconductor package using the same, and an electronic component module such as a MEMS (Micro Electro Mechanical Systems) module.

  In recent years, semiconductor packages have been highly integrated and diversified, and as shown in Patent Documents 1 and 2, etc., there are increasing cases in which two or more of the same or different semiconductor elements are mounted in one package. For example, in a package having two or more types of semiconductor elements mounted on the same surface, such as SIP (System In Package), it is necessary to make the distance between the elements as close as possible in order to mount them at higher density. is there. Further, when two or more semiconductor elements are stacked and laminated, it is necessary to keep the thickness of the adhesive film constant.

  On the other hand, in mounting a sensor element or a MEMS element on a substrate, the accuracy of the mounting position of the element may be important. Further, when two or more elements such as a sensor element and a MEMS element are mounted on a substrate, it is important to control the difference between the adjacent elements and the mounting height with high accuracy.

  For example, when two or more image sensor elements are mounted on the same surface of the substrate, it is necessary to minimize variations in the distance between adjacent elements and the mounting height of the elements. For this reason, it is necessary not only to mount the element on the substrate with high positional accuracy, but also to prevent the mounting height and the positional relationship between the elements from changing in the subsequent heating process.

JP 2006-307055 A JP 2007-277522 A

  However, when a plurality of elements are bonded on the same surface of the substrate using a conventional adhesive film, the distance between elements and the mounting height of the elements change due to the deformation of the adhesive film accompanying heating. There was a problem. The adhesive film is heated while being attached to a substrate or an element for curing, wire bonding, sealing, or the like. Conventional adhesive films have a problem that when heated, they tend to cause deformation such as thermal expansion, thermal contraction, cure shrinkage, and expansion due to volatilization of volatile components and moisture absorption. In particular, in the manufacture of a module in which a plurality of elements are arranged at high density, it is required to control the distance between elements and the mounting height of the elements with higher accuracy, so that deformation of the adhesive film can be suppressed. It turned out to be very important.

  Furthermore, an adhesive film used for bonding a plurality of elements to a substrate is often required to be processed in shape by drilling before use, and a variability generated by such processing is required. The presence of foreign substances such as these can cause a decrease in adhesive strength and peeling of elements, so that it has also been desired to suppress the influence of foreign substances.

  Therefore, when the present invention is used as an adhesive film for adhering a plurality of elements to a substrate, it can suppress the influence of foreign matter that occurs during processing such as drilling, and the deformation due to heating is suppressed. The main purpose is to provide a double-sided adhesive film.

  The present invention provides a double-sided adhesive comprising a support film, an adhesive layer laminated on both sides of the support film, and a cover film laminated on the surface of the adhesive layer opposite to the support film. Related to film. The double-sided adhesive film according to the present invention is used for bonding a semiconductor element and / or a MEMS element to a substrate.

  The double-sided adhesive film according to the present invention is a method of forming a semiconductor element and / or a MEMS element on a substrate by a method including a step of perforating a double-sided adhesive film and a step of removing a cover film from the perforated double-sided adhesive film. It is particularly useful when used to adhere to. In this case, it is preferable to remove the cover film from the double-sided adhesive film that has been punched together with the foreign matter produced by the punching.

  When the element is bonded by a method including the drilling process as described above, by using the double-sided adhesive film according to the present invention, the adhesive strength is reduced due to foreign matters such as burrs generated in the drilling process. In addition, problems such as a decrease in reliability are sufficiently suppressed. For example, remove the cover film before removing the foreign material generated by drilling to one adherend, and remove the other cover film before heat-pressing the other adherend. By removing the foreign matter, problems caused by the foreign matter can be prevented.

  The support film preferably has a linear expansion coefficient of 100 ppm or less. By using a support film with little change in characteristics during heating, the shrinkage and expansion of the adhesive film itself due to heating in the curing process, wire bonding process, sealing process, etc. after mounting the device on the substrate is further effective Can be suppressed. Silicon (Si), which is a material constituting a semiconductor element or a MEMS element, has a coefficient of linear expansion of several ppm, and a general substrate such as a glass epoxy substrate or a BT substrate has a coefficient of linear expansion of several tens of ppm. On the other hand, the linear expansion coefficient of the conventional adhesive film is generally several hundred ppm, and the warpage caused by the difference in the linear expansion coefficient between the substrate and the element or the difference in the linear expansion coefficient between the substrate, the element and the adhesive film is reduced. Is difficult. When warping occurs, the distance between elements and the mounting height of the elements may change. Warpage can be effectively reduced by setting the linear expansion coefficient of the support film to 100 ppm or less.

  The cured adhesive layer preferably has a glass transition temperature (Tg) of less than 100 ° C. When the glass transition temperature of the adhesive layer is low, the temperature when the adhesive film is pressure-bonded to the adherend can be lowered. For example, when an element is mounted on a substrate by a method in which an adhesive film is pressure-bonded to one adherend (element or substrate) and then the other adherend (substrate or element) is further pressure-bonded, the adhesive film is attached to one adherend. When pressure-bonding to the adherend, it is generally necessary to apply sufficient pressure while heating the adhesive film to a temperature equal to or higher than Tg after curing. Since the surface of the adhesive film opposite to the adherend is in contact with the crimping jig, when the heating temperature is high, the adhesive film in contact with the jig is deformed, and fine irregularities are formed on the surface. End up. If fine irregularities are formed on the surface of the adhesive film, it is difficult not only to adhere the other adherend to the surface with high precision, but also the adhesive strength may be lowered. Generation | occurrence | production of such a problem can be prevented because Tg of the adhesive bond layer after hardening is less than 100 degreeC.

  The support film is preferably from the group consisting of aromatic polyimide, aromatic polyamideimide, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetherketone, polyethylene naphthalate and liquid crystal polymer. A film of the polymer chosen.

  Each of the adhesive layers preferably has the same composition. Moreover, it is preferable that each said adhesive bond layer contains the thermoplastic resin which has a glass transition temperature of 100 degrees C or less, a thermosetting resin, and a filler.

  In another aspect, the present invention relates to an electronic component module comprising a substrate, a plurality of elements selected from semiconductor elements and MEMS elements mounted on the substrate, and an adhesive layer interposed between the substrate and the elements. . The adhesive layer of the electronic component module according to the present invention is formed from the double-sided adhesive film according to the present invention from which the cover film has been removed.

  The electronic component module according to the present invention can achieve high reliability and can be manufactured with high productivity.

  When the double-sided adhesive film according to the present invention is used as an adhesive film for adhering a plurality of elements to a substrate, it can suppress the influence of foreign matter that occurs during processing such as drilling, and can be deformed by heating. It is suppressed.

It is sectional drawing which shows one Embodiment of a double-sided adhesive film. It is sectional drawing which shows one Embodiment of an electronic component module.

  Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

  FIG. 1 is a cross-sectional view showing an embodiment of a double-sided adhesive film. A double-sided adhesive film 1 shown in FIG. 1 includes a support film 10, two adhesive layers 21 and 22 laminated on both sides of the support film 10, and the support films 10 of the two adhesive layers 21 and 22, respectively. It is a laminated body of a 5 layer structure provided with the cover films 31 and 32 laminated | stacked on the surface of the other side.

  The double-sided adhesive film according to the present embodiment includes, for example, a step of punching the double-sided adhesive film 1, and removing one cover film 31 from the double-sided adhesive film 1 that has been punched and removing one adhesive layer 21. The process of thermocompression bonding to one adherend (substrate), the other cover film 32 is removed from the punched double-sided adhesive film 1, and the other adhesive layer 22 is attached to the other adherend (semiconductor element and substrate). And / or the MEMS element) is used to bond the semiconductor element and / or the MEMS element to the substrate. Even if one cover film 31 is removed and one adherend is thermocompression bonded to the double-sided adhesive film 1, the other cover film 32 is removed and the other adherend is thermocompression bonded to the double-sided adhesive film 1. Alternatively, both the cover films 31 and 32 may be removed, and both adherends may be thermocompression bonded to the double-sided adhesive film at the same time.

  Examples of the punching process for the double-sided adhesive film include drilling by a machine and drilling by a laser or plasma. Through holes are formed through the cover films 31 and 32 together with the support film 10 and the adhesive layers 21 and 22.

  The support film 10 is preferably formed from a material with little characteristic change due to heating. Thereby, the heat shrinkage and expansion of the double-sided adhesive film itself due to heating in the curing process, the wire bonding process, the sealing process and the like of the adhesive film after mounting the element on the substrate can be more effectively suppressed.

  From such a viewpoint, the Tg of the support film 10 is preferably 100 ° C. or higher, more preferably 150 ° C. or higher, and further preferably 200 ° C. or higher. The linear expansion coefficient of the support film 10 is preferably 100 ppm or less, more preferably 70 ppm or less, and further preferably 50 ppm or less.

  In order to achieve the above characteristics, the support film 10 is made of aromatic polyimide, aromatic polyamideimide, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetherketone, polyethylene naphthalene. A polymer film selected from the group consisting of phthalates and liquid crystal polymers is preferred.

  As the cover films 31 and 32, for example, a polymer film selected from the group consisting of polyethylene terephthalate, polyethylene, and polypropylene is used.

  If the Tg after curing of the adhesive layers 21 and 22 is low, the temperature at the time of thermocompression bonding is lowered to avoid excessive application of heat to the adhesive film and to suppress the deformation of the adhesive film more remarkably. Can do. Specifically, the Tg of the cured adhesive layers 21 and 22 is preferably less than 100 ° C, more preferably less than 90 ° C, and even more preferably less than 80 ° C.

  The adhesive layers 21 and 22 contain, for example, a thermoplastic resin, a thermosetting resin, and a filler, respectively. The compositions of the two adhesive layers 21 and 22 may be the same or different from each other, but are preferably the same from the viewpoint of preventing deformation and warping.

  The Tg of the thermoplastic resin is preferably less than 100 ° C, more preferably less than 90 ° C, and even more preferably less than 80 ° C. By using a thermoplastic resin having a low Tg, an adhesive layer having a low Tg can be easily formed. The thermoplastic resin is at least one selected from the group consisting of polyimide resin, polyamideimide resin, polyethersulfone resin, polyacrylate resin, polyetherketone resin, polyarylate, polyetherketone, and polyethylene naphthalate. Also good.

  A thermosetting resin is a compound that can form a three-dimensional network structure. The thermosetting resin is usually cured by forming a three-dimensional network structure by the action of a curing agent and / or a curing accelerator. By using a thermosetting resin, the shear adhesive strength at high temperatures tends to increase. However, when a thermosetting resin is used, the peel adhesive strength at a high temperature may be reduced, and therefore it is preferable to appropriately select whether or not to use the thermosetting resin according to the purpose of use.

  The amount of the thermosetting resin is preferably 1 to 100 parts by mass, more preferably 1 to 50 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the amount of the thermosetting resin exceeds 100 parts by mass, the film formability tends to decrease.

  The thermosetting resin is preferably selected from an epoxy resin and an imide compound having two thermosetting imide groups.

  The epoxy resin is not particularly limited as long as it is a compound having one or more epoxy groups in one molecule. Examples of the epoxy resin include alkyl monoglycidyl ether, phenyl glycidyl ether, alkylphenol monoglycidyl ether, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 1- (3-glycidoxypropyl). ) -1,1,3,3,3-pentamethyldisiloxane, alkyl monoglycidyl ester, bisphenol A type epoxy resin [AER-X8501 (Asahi Kasei Epoxy Co., Ltd., trade name), R-301 (Mitsui Chemicals, Inc.) ), Trade name), YL-980 (Japan Epoxy Resin Co., Ltd., trade name)], bisphenol F type epoxy resin [YDF-170 (Toto Kasei Co., Ltd., trade name)], bisphenol AD type epoxy resin [R -1710 (Mitsui Chemicals, Inc., trade name)], F Enol novolak type epoxy resin [N-730S (Dainippon Ink and Chemicals, trade name), Quatrex-2010 (Dow Chemical Co., trade name)], bisphenol S type epoxy resin, cresol novolak type epoxy resin [YDCN -702S (Toto Kasei Co., Ltd., trade name), EOCN-100 (Nippon Kayaku Co., Ltd., trade name)], polyfunctional epoxy resin [EPPN-501 (Nippon Kayaku Co., Ltd., trade name), TACTIX -742 (Dow Chemical Company, trade name), VG-3010 (Mitsui Chemicals, trade name), 1032S (Japan Epoxy Resin Co., trade name)], epoxy resin having a naphthalene skeleton [HP-4032 (Dainippon Ink Chemical Co., Ltd., trade name)], dicyclo type epoxy resin [EP-4088S (Asahi Denka Kogyo Co., Ltd., quotient) Name), XD-1000-L (Nippon Kayaku Co., Ltd., trade name)], alicyclic epoxy resin [EHPE-3150, CEL-3000 (Daicel Chemical Industries, trade name), DME-100 ( Shin Nippon Rika Co., Ltd., trade name), EX-216L (Nagase ChemteX Corporation, trade name)], aliphatic epoxy resin [W-100 (New Nippon Rika Co., Ltd., trade name), YH-300 (Toto Kasei Co., Ltd., trade name)], epoxidized polybutadiene [PB-3600 (Daicel Chemical Industries, trade name), E-1000-3.5 (Nippon Petrochemical Co., Ltd., trade name)] Epoxidized vegetable oil [S-300K, L-500 (Daicel Chemical Industries, Ltd., trade name)], amine type epoxy resin [ELM-100 (Sumitomo Chemical Co., Ltd., trade name), YH-434L (Tokyo) Kasei Co., Ltd., trade name), ETRAD-X, TETRAD-C (Mitsubishi Gas Chemical Co., Ltd., trade name), GOT, GAN (Nippon Kayaku Co., Ltd., trade name)], ethylene / propylene glycol modified bisphenol type epoxy resin [EP-4000S (Asahi) Denka Kogyo Co., Ltd., trade name), BEO-60E (New Nippon Rika Co., Ltd., trade name)], hydrogenated bisphenol type epoxy resin [EXA-7015 (Nippon Kayaku Co., Ltd., trade name), ST- 5080 (Toto Kasei Co., Ltd., trade name)], resorcin-type epoxy resin [Denacol EX-201 (Nagase ChemteX Corporation, trade name)], epoxy resin having a catechol skeleton [EXA-7120 (Dainippon Ink Chemical Co., Ltd.) Kogyo Co., Ltd., trade name)], neopentyl glycol type epoxy resin [Denacol EX-211 (Nagase ChemteX Corporation, trade name) )], Hexane dinel glycol type epoxy resin [Denacol EX-212 (Nagase ChemteX Corp., trade name)], ethylene / propylene glycol type epoxy resin [Denacol EX-810, 811, 850, 851, 821, 830] 832, 841, 861 (Nagase ChemteX Corp., trade name)], biphenyl type epoxy resin [YX-4000H (Japan Epoxy Resin Co., Ltd., trade name)], the following general formula (I)

（式中、ａは０〜５の整数を表す。）
で表されるエポキシ樹脂［Ｅ−ＸＬ−２４、Ｅ−ＸＬ−３Ｌ（三井化学（株）、商品名）］、ウレタン変性エポキシ樹脂［ＥＰＵ−１５、ＥＰＵ−１８（旭電化工業（株）、商品名）］、ゴム変性エポキシ樹脂［ＥＰＲ−４０３２、ＥＰＲ−１３０９（旭電化工業（株）、商品名）］、キレート変性エポキシ樹脂［ＥＰ−４９−１０、ＥＰＵ−７８−１１（旭電化工業（株）、商品名）］、グリシジルエステル型エポキシ樹脂［ＹＤ−１７１、ＹＤ−１７２（東都化成（株）、商品名）、ＡＫ−６０１（日本化薬（株）、商品名）］が挙げられる。

(Wherein, a represents an integer of 0 to 5)
[E-XL-24, E-XL-3L (Mitsui Chemicals, Inc., trade name)], urethane-modified epoxy resin [EPU-15, EPU-18 (Asahi Denka Kogyo Co., Ltd.), Product name)], rubber-modified epoxy resin [EPR-4032, EPR-1309 (Asahi Denka Kogyo Co., Ltd., product name)], chelate-modified epoxy resin [EP-49-10, EPU-78-11 (Asahi Denka Kogyo) (Trade name)], glycidyl ester type epoxy resin [YD-171, YD-172 (Toto Kasei Co., Ltd., trade name), AK-601 (Nippon Kayaku Co., Ltd., trade name)]. It is done.

  Among these, at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and alicyclic epoxy resins. It is preferable to use an epoxy resin. These epoxy resins can be used alone or in combination of two or more.

  The adhesive layers 21 and 22 may contain a curing agent used in combination with the epoxy resin. Examples of the curing agent include phenol novolac resin [H-1 (Maywa Kasei Co., Ltd., trade name), VR-9300 (Mitsui Chemicals, trade name)], phenol aralkyl resin [XL-225 (Mitsui Chemicals). (Trade name)], allylated phenol novolak resin [AL-VR-9300 (Mitsui Chemicals, trade name)], the following general formula (II)

（式中、Ｒ１はメチル基、エチル基等の炭素数１〜６のアルキル基を示し、Ｒ２は水素又はメチル基、エチル基等の炭素数１〜６のアルキル基を示し、ｂは２〜４の整数を示す。）で表される特殊フェノール樹脂［ＰＰ−７００−３００（日本石油化学（株）製、商品名）］、ビスフェノールＦ、ビスフェノールＡ、ビスフェノールＡＤ、ビスフェノールＳ、アリル化ビスフェノールＦ、アリル化ビスフェノールＡ、アリル化ビスフェノールＡＤ、アリル化ビスフェノールＳ、多官能フェノール［ｐ−ＣＲ、ＴｒｉｓＰ−ＰＨＢＡ、ＭＴＰＣ、ＴｒｉｓＰ−ＲＳ（本州化学工業（株）、商品名）］等のフェノール化合物、ｏ−フェニレンジアミン、ｍ−フェニレンジアミン、ｐ−フェニレンジアミン、３，３’−ジアミノジフェニルエーテル、３，４’−ジアミノジフェニルエーテル、４，４’−ジアミノジフェニルエーテル、３，３’−ジアミノジフェニルメタン、３，４’−ジアミノジフェニルメタン、４，４’−ジアミノジフェニルメタン、３，３’−ジアミノジフェニルジフルオロメタン、３，４’−ジアミノジフェニルジフルオロメタン、４，４’−ジアミノジフェニルジフルオロメタン、３，３’−ジアミノジフェニルスルホン、３，４’−ジアミノジフェニルスルホン、４，４’−ジアミノジフェニルスルホン、３，３’−ジアミノジフェニルスルフイド、３，４’−ジアミノジフェニルスルフイド、４，４’−ジアミノジフェニルスルフイド、３，３’−ジアミノジフェニルケトン、３，４’−ジアミノジフェニルケトン、４，４’−ジアミノジフェニルケトン、２，２−ビス（３−アミノフェニル）プロパン、２，２’−（３，４’−ジアミノジフェニル）プロパン、２，２−ビス（４−アミノフェニル）プロパン、２，２−ビス（３−アミノフェニル）ヘキサフルオロプロパン、２，２−（３，４’−ジアミノジフェニル）ヘキサフルオロプロパン、２，２−ビス（４−アミノフェニル）ヘキサフルオロプロパン、１，３−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（４−アミノフェノキシ）ベンゼン、３，３’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、３，４’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、４，４’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、２，２−ビス（４−（３−アミノフェノキシ）フェニル）プロパン、２，２−ビス（４−（４−アミノフェノキシ）フェニル）プロパン、２，２−ビス（４−（３−アミノフェノキシ）フェニル）ヘキサフルオロプロパン、２，２−ビス（４−（４−アミノフエノキシ）フェニル）ヘキサフルオロプロパン、ビス（４−（３−アミノフェノキシ）フェニル）スルフィド、ビス（４−（４−アミノフェノキシ）フェニル）スルフィド、ビス（４−（３−アミノフェノキシ）フェニル）スルホン、ビス（４−（４−アミノフェノキシ）フェニル）スルホン、１，２−ジアミノエタン、１，３−ジアミノプロパン、１，４−ジアミノブタン、１，５−ジアミノペンタン、ジエチレントリアミン、トリエチレンテトラミン、ジエチルアミノプロピルアミン、１，１，３，３−テトラメチル−１，３−ビス（４−アミノフェニル）ジシロキサン、１，１，３，３−テトラフェノキシ−１，３−ビス（４−アミノエチル）ジシロキサン、１，１，３，３−テトラフェニル−１，３−ビス（２−アミノエチル）ジシロキサン、１，１，３，３−テトラフェニル−１，３−ビス（３−アミノプロピル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（２−アミノエチル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（３−アミノプロピル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（３−アミノブチル）ジシロキサン、１，３−ジメチル−１，３−ジメトキシ−１，３−ビス（４−アミノブチル）ジシロキサン、１，１，３，３，５，５−ヘキサメチル−１，５−ビス（４−アミノフェニル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメトキシ−１，５−ビス（４−アミノブチル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメトキシ−１，５−ビス（５−アミノペンチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（２−アミノエチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（４−アミノブチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（５−アミノペンチル）トリシロキサン、１，１，３，３，５，５−ヘキサメチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，３，３，５，５−ヘキサエチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，３，３，５，５−ヘキサプロピル−１，５−ビス（３−アミノプロピル）トリシロキサン、トリエチルアミン、ベンジルジメチルアミン、α−メチルベンジルジメチルアミン、トリスジメチルアミノメチルフェノール、ピペリジン、メンタンジアミン、ボロントリフルオライドモノエチルアミン、１，８−ジアザビシクロ［５．４．０］−ウンデセン−７、６−ブチル−１，８−ジアザビシクロ［５．４．０］−ウンデセン−７、１，５−ジアザビシクロ［４．３．０］−ノネン−５等のアミン化合物、ジシアンジアミド、二塩基酸ジヒドラジド［ＡＤＨ、ＰＤＨ、ＳＤＨ（いずれも日本ヒドラジン工業（株）製、商品名）］、エポキシ樹脂とアミン化合物の反応物からなるマイクロカプセル型硬化剤［ノバキュア（旭化成工業（株）製、商品名）］、Ｕ−ＣＡＴ３５０２Ｔ、Ｕ−ＣＡＴ３５０３Ｎ（サンアプロ（株）、商品名）等の尿素化合物、無水フタル酸、無水マレイン酸、無水シトラコン酸、無水イタコン酸、無水コハク酸、無水ドデシルコハク酸、無水テトラヒドロフタル酸、無水ヘキサヒドロフタル酸、３又は４−メチル−１，２，３，６−テトラヒドロ無水フタル酸、３又は４−メチルヘキサヒドロ無水フタル酸、ビシクロ［２．２．１］へプト−５−エン−２，３−ジカルボン酸無水物、メチルビシクロ［２．２．１］へプト−５−エン−２，３−ジカルボン酸無水物、ピロメリット酸二無水物、３，３’，４，４’−ジフェニルテトラカルボン酸二無水物、２，２’，３，３’−ジフェニルテトラカルボン酸二無水物、２，２−ビス（３，４−ジカルボキシフェニル）プロパン二無水物、２，２−ビス（２，３−ジカルボキシフェニル）プロパン二無水物、１，１−ビス（２，３−ジカルボキシフェニル）エタン二無水物、１，１−ビス（３，４−ジカルボキシフェニル）エタン二無水物、ビス（２，３−ジカルボキシフェニル）メタン二無水物、ビス（３，４−ジカルボキシフェニル）メタン二無水物、ビス（３，４−ジカルボキシフェニル）スルホン二無水物、３，４，９，１０−ペリレンテトラカルボン酸二無水物、ビス（３，４−ジカルボキシフェニル）エーテル二無水物、ベンゼン−１，２，３，４−テトラカルボン酸二無水物、３，４，３’，４’−ベンゾフェノンテトラカルボン酸二無水物、２，３，２’，３−ベンゾフェノンテトラカルボン酸二無水物、２，３，３’，４’−ベンゾフェノンテトラカルボン酸二無水物、１，２，５，６−ナフタレンテトラカルボン酸二無水物、２，３，６，７−ナフタレンテトラカルボン酸二無水物、１，２，４，５−ナフタレンテトラカルボン酸二無水物、１，４，５，８−ナフタレンテトラカルボン酸二無水物、２，６−ジクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、２，７−ジクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、２，３，６，７−テトラクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、フエナンスレン−１，８，９，１０−テトラカルボン酸二無水物、ピラジン−２，３，５，６−テトラカルボン酸二無水物、チオフエン−２，３，４，５−テトラカルボン酸二無水物、２，３，３’，４’−ビフェニルテトラカルボン酸二無水物、３，４，３’，４’−ビフェニルテトラカルボン酸二無水物、２，３，２’，３’−ビフェニルテトラカルボン酸二無水物、ビス（３，４−ジカルボキシフェニル）ジメチルシラン二無水物、ビス（３，４−ジカルボキシフェニル）メチルフェニルシラン二無水物、ビス（３，４−ジカルボキシフェニル）ジフェニルシラン二無水物、１，４−ビス（３，４−ジカルボキシフェニルジメチルシリル）ベンゼン二無水物、１，３−ビス（３，４−ジカルボキシフェニル）−１，１，３，３−テトラメチルジシクロヘキサン二無水物、ｐ−フェニレンビス（トリメリテート無水物）、エチレンテトラカルボン酸二無水物、１，２，３，４−ブタンテトラカルボン酸二無水物、デカヒドロナフタレン−１，４，５，８−テトラカルボン酸二無水物、４，８−ジメチル−１，２，３，５，６，７−ヘキサヒドロナフタレン−１，２，５，６−テトラカルボン酸二無水物、シクロペンタン−１，２，３，４−テトラカルボン酸二無水物、ピロリジン−２，３，４，５−テトラカルボン酸二無水物、１，２，３，４−シクロブタンテトラカルボン酸二無水物、ビス（エキソビシクロ［２，２，１］ヘプタン−２，３−ジカルボン酸二無水物）スルホン、ビシクロ−（２，２，２）−オクト（７）−エン２，３，５，６−テトラカルボン酸二無水物、２，２−ビス（３，４−ジカルボキシフェニル）ヘキサフルオロプロパン二無水物、２，２−ビス［４−（３，４−ジカルボキシフェノキシ）フェニル］ヘキサフルオロプロパン二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルスルフイド二無水物、４，４’−（４，４’イソプロピリデンジフェノキシ）−ビス（フタル酸無水物）、４，４’−［デカン−１，１０ジイルビス（オキシカルボニル）］ジフタル酸無水物、１，４−ビス（２−ヒドロキシヘキサフルオロイソプロピル）ベンゼンビス（トリメリット酸二無水物）、１，３−ビス（２−ヒドロキシヘキサフルオロイソプロピル）ベンゼンビス（トリメリット酸二無水物）、５−（２，５−ジオキソテトラヒドロフリル）−３−メチル−３−シクロヘキセン−１，２−ジカルボン酸二無水物、テトラヒドロフラン−２，３，４，５−テトラカルボン酸二無水物等の酸無水物、KT−９９０、ＣＰ−７７（旭電化工業（株）、商品名）、ＳＩ−Ｌ８５、ＳＩ−Ｌ１４５（三新化学工業（株）、商品名）等のカチオン重合触媒、ポリメルカプト化合物、ポリアミド化合物が挙げられる。これらの硬化剤を２種以上適宜組み合わせて用いてもよい。

(In the formula, R1 represents an alkyl group having 1 to 6 carbon atoms such as a methyl group and an ethyl group, R2 represents a hydrogen or alkyl group having 1 to 6 carbon atoms such as a methyl group and an ethyl group, and b represents 2 to 2) A special phenol resin [PP-700-300 (trade name) manufactured by Nippon Petrochemical Co., Ltd.]], bisphenol F, bisphenol A, bisphenol AD, bisphenol S, allylated bisphenol F , Phenol compounds such as allylated bisphenol A, allylated bisphenol AD, allylated bisphenol S, polyfunctional phenol [p-CR, TrisP-PHBA, MTPC, TrisP-RS (Honshu Chemical Industry Co., Ltd., trade name)], o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenyldifluoromethane, 3,4′-diaminodiphenyldifluoromethane, 4,4′-diaminodiphenyldifluoromethane, 3,3′-diaminodiphenylsulfone, 3,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 3,3 '-Diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl ketone, 3,4'-diaminodiphenyl ketone, 4, 4′-diaminodiphenyl ketone, 2,2-bis (3-amino Enyl) propane, 2,2 ′-(3,4′-diaminodiphenyl) propane, 2,2-bis (4-aminophenyl) propane, 2,2-bis (3-aminophenyl) hexafluoropropane, 2, 2- (3,4'-diaminodiphenyl) hexafluoropropane, 2,2-bis (4-aminophenyl) hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3 -Aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 3,3 '-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 3,4'-(1,4- Phenylenebis (1-methylethylidene)) bisaniline, 4,4 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 2,2-bis (4- ( 3-aminophenoxy) phenyl) propane, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 2,2-bis (4- (3-aminophenoxy) phenyl) hexafluoropropane, 2,2 -Bis (4- (4-aminophenoxy) phenyl) hexafluoropropane, bis (4- (3-aminophenoxy) phenyl) sulfide, bis (4- (4-aminophenoxy) phenyl) sulfide, bis (4- (3 -Aminophenoxy) phenyl) sulfone, bis (4- (4-aminophenoxy) phenyl) sulfone, 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, Diethylenetriamine, triethylenetetramine, diethylaminopropylamine, 1,1,3,3 Tetramethyl-1,3-bis (4-aminophenyl) disiloxane, 1,1,3,3-tetraphenoxy-1,3-bis (4-aminoethyl) disiloxane, 1,1,3,3- Tetraphenyl-1,3-bis (2-aminoethyl) disiloxane, 1,1,3,3-tetraphenyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3- Tetramethyl-1,3-bis (2-aminoethyl) disiloxane, 1,1,3,3-tetramethyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3- Tetramethyl-1,3-bis (3-aminobutyl) disiloxane, 1,3-dimethyl-1,3-dimethoxy-1,3-bis (4-aminobutyl) disiloxane, 1,1,3,3 , 5,5-Hexamethyl-1,5-bis 4-aminophenyl) trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,5,5-tetraphenyl- 3,3-dimethoxy-1,5-bis (4-aminobutyl) trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis (5-aminopentyl) trisiloxane 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis (2-aminoethyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1 , 5-bis (4-aminobutyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis (5-aminopentyl) trisiloxane, 1,1,3, 3,5,5-hexame Til-1,5-bis (3-aminopropyl) trisiloxane, 1,1,3,3,5,5-hexaethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,3, 3,5,5-hexapropyl-1,5-bis (3-aminopropyl) trisiloxane, triethylamine, benzyldimethylamine, α-methylbenzyldimethylamine, trisdimethylaminomethylphenol, piperidine, menthanediamine, boron trifluoride Monoethylamine, 1,8-diazabicyclo [5.4.0] -undecene-7, 6-butyl-1,8-diazabicyclo [5.4.0] -undecene-7, 1,5-diazabicyclo [4.3. .0] -nonene-5 and other amine compounds, dicyandiamide, dibasic acid dihydrazide [ADH, PDH, SDH] All are made by Nippon Hydrazine Kogyo Co., Ltd., trade name)], microcapsule type curing agent consisting of a reaction product of epoxy resin and amine compound [NovaCure (Asahi Kasei Kogyo Co., Ltd. trade name)], U-CAT3502T, U -Urea compounds such as CAT3503N (San Apro Co., Ltd., trade name), phthalic anhydride, maleic anhydride, citraconic anhydride, itaconic anhydride, succinic anhydride, dodecyl succinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride Acid, 3 or 4-methyl-1,2,3,6-tetrahydrophthalic anhydride, 3 or 4-methylhexahydrophthalic anhydride, bicyclo [2.2.1] hept-5-ene-2,3 -Dicarboxylic acid anhydride, methylbicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid anhydride, pyromellitic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-diphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) Propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3 , 4-Dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxy) Phenyl) sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, benzene-1,2,3,4-tetracarboxylic Acid dianhydride, 3,4,3 ′, 4′-benzophenone tetracarboxylic dianhydride, 2,3,2 ′, 3-benzophenone tetracarboxylic dianhydride, 2,3,3 ′, 4′-benzophenone tetracarboxylic dianhydride Anhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1, 4,5,8-tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10- Tetracarboxylic dianhydride, pyra -2,3,5,6-tetracarboxylic dianhydride, thiophene-2,3,4,5-tetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride 3,4,3 ′, 4′-biphenyltetracarboxylic dianhydride, 2,3,2 ′, 3′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) dimethylsilane Dianhydride, bis (3,4-dicarboxyphenyl) methylphenylsilane dianhydride, bis (3,4-dicarboxyphenyl) diphenylsilane dianhydride, 1,4-bis (3,4-dicarboxyphenyl) Dimethylsilyl) benzene dianhydride, 1,3-bis (3,4-dicarboxyphenyl) -1,1,3,3-tetramethyldicyclohexane dianhydride, p-phenylenebis (trimellitate anhydride) Ethylenetetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl- 1,2,3,5,6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine -2,3,4,5-tetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, bis (exobicyclo [2,2,1] heptane-2,3-dicarboxylic acid Acid dianhydride) sulfone, bicyclo- (2,2,2) -oct (7) -ene 2,3,5,6-tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyl) Phenyl) hexafluoropropane dianhydride 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropane dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 4 , 4 ′-(4,4′isopropylidenediphenoxy) -bis (phthalic anhydride), 4,4 ′-[decane-1,10diylbis (oxycarbonyl)] diphthalic anhydride, 1,4-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic dianhydride), 1,3-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic dianhydride), 5- (2,5- Dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, tetrahydrofuran-2,3,4,5-tetracar Acid anhydrides such as acid dianhydrides, KT-990, CP-77 (Asahi Denka Kogyo Co., Ltd., trade name), SI-L85, SI-L145 (Sanshin Chemical Co., Ltd., trade name), etc. Cation polymerization catalyst, polymercapto compound, and polyamide compound. Two or more of these curing agents may be used in appropriate combination.

  The adhesive layers 21 and 22 may contain an epoxy resin curing accelerator as necessary. Examples of curing accelerators include, but are not limited to, organic boron salt compounds [EMZ · K, TPPK (Hokuko Chemical Co., Ltd., trade name)], imidazoles [Cureazole, 2P4MHZ, C17Z, 2PZ-OK ( Shikoku Kasei Co., Ltd., trade name)].

  Examples of the filler include particles of gold, silver, copper, nickel, iron, aluminum, stainless steel, silicon oxide, silicon carbide, boron nitride, aluminum oxide, aluminum borate, or aluminum nitride. Among these, when electrical conductivity is required for the adhesive layer due to the structure of the semiconductor package, it is possible to use conductive fillers such as gold, silver, copper, nickel, iron, aluminum, and stainless steel. preferable. When electrical insulation is required for the adhesive layer, it is preferable to use an electrically insulating filler such as silicon oxide, silicon carbide, boron nitride, aluminum oxide, aluminum borate, and aluminum nitride.

  The particle size of the filler is not particularly limited, but usually the average particle size is preferably 0.001 to 50 μm, more preferably 0.005 to 10 μm.

  Although the compounding quantity of a filler does not have a restriction | limiting in particular, 3-70 mass% is preferable with respect to the total mass of an adhesive bond layer, and it is more preferable that it is 5-40 mass%. If the blending amount is less than 3% by mass, the adhesive strength during heating tends to decrease, and if it exceeds 70% by mass, the surface roughness increases and the thermocompression bonding property of the adhesive film tends to decrease. .

  The adhesive layers 21 and 22 may further contain a coupling agent. The coupling agent is not particularly limited, and examples thereof include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, and vinyl-tris. (2-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, methyltri (methacryloxyethoxy) silane, γ-acryloxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane Γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, -Β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, 3- (4 5-dihydroimidazolyl) propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycid Xylpropylmethyldiisopropenoxysilane, methyltriglycidoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, trimethylsilyl isocyanate, dimethyl Silane coupling agents such as rusilyl isocyanate, phenylsilyl triisocyanate, tetraisocyanate silane, methylsilyl triisocyanate, vinylsilyl triisocyanate, ethoxysilane triisocyanate, tetramethyl titanate, tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetra Butyl titanate, tetraisobutyl titanate, tetra 2-ethylhexyl titanate, tetrastearyl titanate, tetraoctylene glycol titanate, isopropyl triisostearoyl titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl Ruisostearoyl diacryl titanate, isopropyl tris (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl aminoethyl) titanate, tetraisopropyl bis (dioctyl phosphite) ) Titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (di-tridecyl) phosphite titanate, dicumylphenyloxyacetate titanate, bis (dioctyl pyrophosphate) ) Oxyacetate titanate, diisostearoyl ethylene titanate, bis (dioctylpyrophosphate) ethylene Examples thereof include titanium coupling agents such as titanate, polyalkyl titanate, polyaryl titanate, polyacyl titanate, and polyphosphate titanate.

  0.1-10 mass parts is preferable with respect to the total mass of each adhesive bond layer, and, as for the compounding quantity of a coupling agent, 0.5-5 mass parts is more preferable. When the blending ratio is less than 0.1 parts by mass, the effect of improving the adhesive strength is inferior, and when it exceeds 10 parts by mass, the volatile matter increases and foaming tends to occur in the heating process.

  The adhesive layers 21 and 22 may contain a flexible material. As the flexible material, various liquid rubbers and thermoplastic resins are used. For example, polybutadiene, maleated polybutadiene, acrylated polybutadiene, methacrylated polybutadiene, epoxidized polybutadiene, acrylonitrile butadiene rubber, carboxy-terminated acrylonitrile butadiene rubber, amino Examples thereof include terminal acrylonitrile butadiene rubber, vinyl terminal acrylonitrile butadiene rubber, styrene butadiene rubber, polyvinyl acetate, polymethyl acrylate, ε-caprolactone-modified polyester, phenoxy resin, and polyimide.

  As for the molecular weight of a flexible material, it is preferable that a number average molecular weight is 500-500000 normally, and it is more preferable that it is 1000-200000.

  The blending amount of the flexible material is preferably 1 to 50 parts by mass, and more preferably 5 to 30 parts by mass with respect to the total mass of each adhesive layer. When the amount is less than 1 part by mass, the flexibility effect tends to be small, and when it exceeds 50 parts by mass, the tackiness is increased and the handleability and workability of the adhesive film tend to be reduced.

  Adhesive layers 21 and 22 are made of hygroscopic agents such as calcium oxide and magnesium oxide, fluorine-based surfactants, nonionic surfactants, wetting improvers such as higher fatty acids, antifoaming agents such as silicone oil, and inorganic ion exchangers. One or more additives such as flame retardants such as ion trapping agents, bromine compounds, metal hydrates and the like may be included.

  The thicknesses of the adhesive layers 21 and 22 are not particularly limited, but are preferably 1 to 100 μm and more preferably 5 to 50 μm. When the thickness of the adhesive layer is less than 1 μm, it is difficult to keep the thickness uniform, and the adhesiveness tends to decrease. On the other hand, when the thickness of the adhesive layer exceeds 100 μm, deformation of the adhesive film itself tends to increase when the substrate and the element are bonded with the adhesive film or in the subsequent heating step.

  The double-sided adhesive film 1 includes, for example, a step of forming adhesive layers 21 and 22 on both sides of the support film 10, and a cover film 31 on the opposite side of the support layers 19 of the respective adhesive layers 21 and 22. 32 can be obtained by a manufacturing method including the step of bonding the two.

  The adhesive layers 21 and 22 may be formed by applying an adhesive composition containing a thermoplastic resin, a thermosetting resin, a filler, and a solvent to the support film 10 and drying the applied adhesive composition. The adhesive layer formed on the base film can be formed by a method of thermally transferring to the support film 10. The method of forming the two adhesive layers 21 and 22 may be the same or different.

  FIG. 2 is a cross-sectional view showing an embodiment of an electronic component module. The electronic component module 2 shown in FIG. 2 includes a substrate 40, a plurality of elements 45 selected from semiconductor elements and MEMS elements mounted on the substrate 40, and an adhesive layer 1 a interposed between the substrate 40 and the elements 45. Is provided. The adhesive layer 1a is formed from the double-sided adhesive film 1 from which the cover films 31 and 32 have been removed. In other words, the adhesive layer 1a is composed of a support film and two cured adhesive layers provided on both sides of the support film.

  The electronic component module according to the present invention is not limited to the above embodiment, and can be appropriately modified without departing from the gist of the present invention. For example, the electronic component module according to the present invention may be a semiconductor package including a plurality of semiconductor elements, a MEMS module including a MEMS element, or a module including both a semiconductor element and a MEMS element. There may be.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

Production Example 1 of Adhesive Layer Forming Varnish
To a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 1,3-bis (3-aminopropyl) tetramethyldisiloxane (0.03 mol) and 1,12-diaminododecane (0 0.08 mol) and 150 g of N-methyl-2-pyrrolidone as a solvent were added and stirred at 60 ° C.

  After dissolution of the diamine, 1,10- (decamethylene) bis (trimellitate dianhydride) (0.02 mol) and 4,4 ′-(4,4′-isopropylidenediphenoxy) bis (phthalic dianhydride) ( 0.08 mol) was added in small portions and reacted at 60 ° C. for 3 hours.

Then heated to 170 ° C. while blowing N ₂ gas, the water in over 3 hours system was removed by azeotropic together with part of the solvent to obtain a polyimide resin NMP solution.

  6 parts by mass of cresol novolac type epoxy resin (trade name YDCN-702, manufactured by Tohto Kasei Co., Ltd.) and 4,4 ′-(1- (4- (1- (4-hydroxyphenyl) -1-methylethyl) phenyl) ethylidene) bisphenol (Honshu Chemical Co., Ltd., trade name Tris-P-PA) 3 parts by mass, tetraphenylphosphonium tetraphenylborate (Tokyo Kasei) Manufactured, trade name TPPK) 0.5 part by mass and boron nitride filler (made by Mizushima alloy iron, trade name HP-P1) 10 parts by mass were added to the solution and kneaded well to obtain a varnish.

Production Example 2
In a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 1,3-bis (3-aminopropyl) tetramethyldisiloxane (0.07 mol) and 4,9-dioxadecane-1, 12-diamine (0.03 mol) and 150 g of NMP were added and stirred at 60 ° C.

  After dissolution of the diamine, 1,10- (decamethylene) bis (trimellitate dianhydride) (0.03 mol) and 4,4′-oxydiphthalic dianhydride (0.07 mol) were added in small portions, Reacted for hours.

Then heated at 170 ° C. while blowing N ₂ gas, the water in over 3 hours system was removed by azeotropic together with part of the solvent to obtain a polyimide resin NMP solution.

  6 parts by mass of cresol novolac type epoxy resin (trade name YDCN-702, manufactured by Tohto Kasei Co., Ltd.) and 4,4 ′-(1- 2 parts by mass of (4- (1- (4-hydroxyphenyl) -1-methylethyl) phenyl) ethylidene) bisphenol (trade name, Tris-P-PA, manufactured by Honshu Chemical), and tetraphenylphosphonium tetraphenylborate (Tokyo) Kasei, trade name TPPK) 0.5 parts by mass, 12% by mass boron nitride filler (made of Mizushima alloy iron) with respect to the total solid content, and 2% by mass Aerosil with respect to the total solid content ( Silica) filler (made by Nippon Aerosil Co., Ltd., trade name R972) was added to the solution and kneaded well to obtain a varnish.

Production Example 3
In a four-necked flask equipped with a stirrer and a calcium chloride tube, an ortho-cresol / novolac type epoxy resin (13.2% by mass, manufactured by Tohto Kasei, trade name YDCN703), xylene-modified phenolic resin (11.1% by mass) in a nitrogen atmosphere. %, Mitsui Chemicals, trade name XLC-LL), fine silica filler (7.8% by weight, made by Nippon Aerosil, trade name R972V), mercapton coupling agent (0.4% by weight, made by Nihon Unicar, product) Name A189), ureidosilane coupling agent (0.8% by mass, manufactured by Nihon Unicar, product name A-1160), 1-cyanoethyl-2-phenylimidazole (0.025% by mass, manufactured by Shikoku Chemicals, product name 2PZ) -CN) and epoxy-containing acrylic rubber (66.6% by mass, manufactured by Teikoku Chemical Industry, trade name HTR-860P-3) Kneaded to obtain a varnish.

Production Example 4
In a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 258.3 g (0.63 mol) of 1,2-bis [4- (4aminophenoxy) phenyl] propane and 1, 10.4 g (0.042 mol) of 3-bis (3-aminopropyl) -tetramethyldisiloxane was added and dissolved in 1450 g of NMP.

  Further, this solution was cooled to 0 ° C., and 180.4 g (0.857 mol) of trimellitic anhydride chloride was added. After the trimellitic anhydride chloride was dissolved, 130 g of trimethylamine was added. After stirring at room temperature for 2 hours, the temperature was raised to 180 ° C. and reacted for 5 hours to complete imidization.

  The obtained reaction solution was put into methanol to precipitate a polymer. This was dried and then dissolved in NMP, and the NMP solution was put into methanol to precipitate the polymer again. The precipitated polymer was dried under reduced pressure to obtain polyetheramideimide powder. 120 g of the obtained polyetheramideimide powder and 6 g of a silane coupling agent (trade name SH6040, manufactured by Toray Dow Corning Co., Ltd.) were dissolved in NMP to obtain an aromatic polyetheramideimide varnish.

Glass Transition Temperature of Adhesive Layer The varnish obtained in Production Examples 1 to 4 was applied onto a polyethylene terephthalate film that had been subjected to a release treatment, heated at 80 ° C. for 30 minutes, then at 150 ° C. for 30 minutes, and then at room temperature (25 The polyethylene terephthalate film was peeled off at 25 ° C. to obtain an adhesive layer having a thickness of 25 μm.

  The obtained adhesive layer was cured by heating at 180 ° C. for 1 hour, and a sample having a size of 4 × 20 mm was cut out therefrom. Using this sample, TMA120 manufactured by Seiko Electronics Co., Ltd. measured the amount of displacement of the sample under the conditions of Extension, temperature rising speed: 5 ° C./min, sample measurement length: 10 mm, and shows the relationship between the amount of displacement and the temperature. A curve was obtained. The glass transition temperature (Tg) was determined from the obtained curve. The results are shown in Table 1.

Example 1
A polyimide film having a thickness of 50 μm (Upilex SGA manufactured by Ube Industries, Ltd., linear expansion coefficient: 30 ppm) was prepared and used as “support film 1”. The varnish of Production Example 1 is applied to one side of the support film 1 and heated at 80 ° C. for 30 minutes and then at 150 ° C. for 30 minutes to form a first adhesive layer having a thickness of 25 μm on one side of the support film 1. It was.

  Next, the varnish of Production Example 2 was applied to the surface of the support film 1 opposite to the first adhesive layer, heated at 80 ° C. for 30 minutes, and then at 150 ° C. for 30 minutes to obtain a thickness of 25 μm. A second adhesive layer was formed.

  Further, a polyethylene terephthalate film (manufactured by Teijin DuPont Films, trade name GE-50) was laminated on both sides at 140 ° C./0.2 MPa, 1.0 m / min. Thus, a double-sided adhesive film having a five-layer structure in which polyethylene terephthalate films were laminated as cover films on both sides of the double-sided adhesive film was obtained.

Example 2
A double-sided adhesive film having a five-layer structure was obtained through the same steps as in Example 1 except that both the first adhesive layer and the second adhesive layer were formed using the varnish of Production Example 1.

Example 3
A double-sided adhesive film having a 5-layer structure was obtained through the same steps as in Example 1 except that the first adhesive layer and the second adhesive layer were formed using the varnish of Production Example 3.

Example 4
Instead of the support film 1, a double-sided adhesive film having a five-layer structure is obtained through the same steps as in Example 1 except that a polyethylene naphthalate film (made by Teijin DuPont Film) having a thickness of 50 μm is used as the “support film 2”. Got.

Example 5
It replaced with the support film 1 and passed through the process similar to Example 1 except having used the 50-micrometer-thick polyethylene film (The product made from Tamapoly, brand name NF-15, a linear expansion coefficient: 160 ppm) as "support film 3." A double-sided adhesive film having a five-layer structure was obtained.

Example 6
Instead of the support film 1, a polypropylene film having a thickness of 50 μm (Toray, Trefan, linear expansion coefficient: 115 ppm) was used as the “support film 4”, and the same process as in Example 1 was carried out to obtain 5 layers. A double-sided adhesive film having a constitution was obtained.

Example 7
A double-sided adhesive film having a 5-layer structure was obtained through the same steps as in Example 1 except that the first adhesive layer and the second adhesive layer were formed using the varnish of Production Example 4.

Comparative Example 1
A double-sided adhesive film having a three-layer structure was produced through the same steps as in Example 1 except that the cover film was not laminated on both sides.

Comparative Example 2
A double-sided adhesive film having a three-layer structure was produced through the same process as in Example 2 except that the cover film was not laminated on both sides.

Comparative Example 3
A double-sided adhesive film having a three-layer structure was produced through the same steps as in Example 3 except that the cover film was not laminated on both sides.

Comparative Example 4
A double-sided adhesive film having a three-layer structure was produced through the same steps as in Example 4 except that the cover film was not laminated on both sides.

Comparative Example 5
The varnish of Production Example 1 was coated on a polyethylene terephthalate film that had been subjected to a release treatment, heated at 80 ° C. for 30 minutes, then at 150 ° C. for 30 minutes, and then peeled off at a room temperature (25 ° C.) to remove the polyethylene terephthalate film. An adhesive layer having a thickness of 100 μm was formed. Further, a polyethylene terephthalate film (manufactured by Teijin DuPont Films, trade name GE-50) was laminated on both sides at 140 ° C./0.2 MPa, 1.0 m / min. Thus, a double-sided adhesive film having a three-layer structure in which polyethylene terephthalate films were laminated as cover films on both sides of a single adhesive layer was obtained.

Linear Expansion Coefficient of Support Film A sample having a size of 4 × 20 mm was cut out from each support film used in Examples and Comparative Examples. With respect to this sample, a linear expansion coefficient was obtained by measuring the amount of displacement of the sample using TMA120 manufactured by Seiko Electronics under the conditions of Extension, temperature rising speed: 5 ° C./min, and sample measurement length: 10 mm. Table 2 shows the linear expansion coefficient of each support film.

Evaluation of double-sided adhesive film External appearance foreign material A sample of 100 mm × 100 mm was cut out from the double-sided adhesive film obtained in each of Examples and Comparative Examples, and a hole of 0.5 to 10 mm was formed at 10 positions of the sample using a punch or a cutter knife.

  Then, if there is a cover film, peel it off, then observe the appearance of the double-sided adhesive film using an Olympus metal microscope and an image analyzer, and foreign matter such as whiskers and burrs of 500 μm or more on the film or at the processing point The presence or absence was confirmed.

2. Thermal shrinkage From the double-sided adhesive films obtained in each Example and Comparative Example, if there was a cover film, it was peeled off, and then a test piece of 80 mm × 80 mm size was cut out. A score was placed at the center of each side of the cut specimen, and the length between the opposing scores was measured to the nearest 0.001 mm.

  Next, the test piece was heated for 1 hour in a state where free shrinkage was possible in a furnace maintained at 180 ° C. The length between the same scores as before the heating of the test piece after heating was measured to the unit of 0.001 mm. The ratio of the difference in length between the scores before and after heating to the length between the scores before heating was defined as the heat shrinkage rate (%).

3. Chip Warp From the double-sided adhesive film obtained in each Example and Comparative Example, if there was a cover film, it was peeled off, and then cut into a 12 mm × 12 mm size test piece accurately. The cut specimen was placed on a 42A lead frame.

Next, a silicon wafer having a thickness of 100 μm was cut into a size of 10 mm × 10 mm. Using a thermocompression bonding tester (manufactured by Nikka Equipment Engineering Co., Ltd.), a silicon chip was heat-bonded onto the lead frame under the conditions shown below. The silicon chip warpage generated during the thermocompression bonding was measured using a non-contact type roughness measuring machine (manufactured by Keyence).
Temperature of hot platen: glass transition temperature after curing of second adhesive layer + 80 ° C. (for example, in the case of a double-sided adhesive film in which the second adhesive layer is formed using the varnish of Production Example 2) Was set to 52 ° C. + 60 ° C. = 112 ° C.)
Crimping condition of silicon chip: 10N × 10sec

表３に、両面接着フィルムの構成と評価結果を示す。表中、第一の接着剤層及び第二の接着剤層の番号１、２、３及び４は、それぞれ、製造例１、２、３及び４のワニスを用いて形成されたものであることを示す。

In Table 3, the structure and evaluation result of a double-sided adhesive film are shown. In the table, numbers 1, 2, 3, and 4 of the first adhesive layer and the second adhesive layer are formed using the varnishes of Production Examples 1, 2, 3, and 4, respectively. Indicates.

  In the double-sided backing film of each example, the presence of foreign matter due to drilling was not recognized, and it was confirmed that the foreign matter was removed together with the cover film. In addition, the double-sided adhesive films of the examples also achieved a low heat shrinkage, and could suppress deformation due to heating. In particular, Examples 1 to 4 and 7 using a support film having a linear expansion coefficient of 100 ppm or less achieved a low linear expansion coefficient of less than 0.3. Moreover, Examples 1-6 whose Tg of the adhesive bond layer after hardening is less than 100 degreeC exhibited the characteristic outstanding also at the point of chip | tip curvature suppression.

  On the other hand, in the double-sided adhesive films of Comparative Examples 1 to 4 that did not use the cover film, the presence of foreign matters accompanying the drilling process was recognized. Moreover, the comparative example 5 which did not use a support film had a large thermal contraction rate, and was easy to produce the deformation | transformation by heating.

  DESCRIPTION OF SYMBOLS 1 ... Double-sided adhesive film, 1a ... Adhesion layer, 2 ... Electronic component module, 10 ... Support film, 21,22 ... Adhesive layer, 31, 32 ... Cover film, 40 ... Substrate, 45 ... Element.

Claims (8)

A support film;
Adhesive layers respectively laminated on both sides of the support film;
A cover film laminated on the surface of each adhesive layer opposite to the support film,
A double-sided adhesive film used for bonding a semiconductor element and / or a MEMS element to a substrate.   Claims used to bond a semiconductor element and / or a MEMS element to a substrate by a method comprising the steps of perforating a double-sided adhesive film and removing the cover film from the perforated double-sided adhesive film. Item 2. The double-sided adhesive film according to item 1.   The double-sided adhesive film according to claim 2, wherein the cover film is removed from the double-sided adhesive film that has been subjected to perforation processing together with the foreign matter produced by the perforation processing.   The double-sided adhesive film according to any one of claims 1 to 3, wherein the support film has a linear expansion coefficient of 100 ppm or less, and the cured adhesive layer has a glass transition temperature of less than 100 ° C.   The support film is selected from the group consisting of aromatic polyimide, aromatic polyamideimide, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetherketone, polyethylene naphthalate and liquid crystal polymer. The double-sided adhesive film according to claim 1, which is a polymer film.   The double-sided adhesive film according to claim 1, wherein each of the adhesive layers has the same composition.   Each double-sided adhesive film as described in any one of Claims 1-6 in which each said adhesive bond contains the thermoplastic resin which has a glass transition temperature of 100 degrees C or less, a thermosetting resin, and a filler. .   A substrate, a plurality of elements selected from a semiconductor element and a MEMS element mounted on the substrate, and an adhesive layer interposed between the substrate and the element, wherein the adhesive layer removes the cover film The electronic component module currently formed from the double-sided adhesive film as described in any one of Claims 1-7.

Images