JP5672649B2 - Double-sided adhesive film and electronic component module using the same - Google Patents

Description

  The present invention relates to a double-sided adhesive film, a semiconductor package using the same, and an electronic component module such as a MEMS (Micro Electro Mechanical Systems) module.

  In recent years, in the field of semiconductor packages, there are increasing cases in which two or more of the same or different semiconductor elements are mounted in one package. For example, in the case of a package having two or more types of semiconductor elements mounted on the same plane such as SIP (System In Package), it is necessary to make the distance between the elements as close as possible in order to mount them at higher density. . When two or more semiconductor elements are stacked on top of each other, it is important to keep the thickness of the adhesive film constant. In addition, when mounting sensor elements and MEMS elements on a substrate, the mounting position of the element itself is important, or the difference in distance and mounting height between functional parts located at different locations within the same element. May be important. Furthermore, the difference in the distance between adjacent elements and the mounting height may be important. For example, when two or more image sensor elements are mounted on the same plane, it is important to suppress variations in the distance between adjacent elements or the mounting height between elements. Further, in LED printer head applications, it is necessary to arrange an infinite number of LEDs at regular intervals.

JP 2006-282773 A JP 2003-060127 A

  However, the conventional adhesive film used for bonding the element to the substrate has a problem that deformation due to heating is large, and further improvement has been demanded in this respect.

  For example, when an element is bonded to a substrate by a method including a step of pressing an adhesive film on one adherend (substrate or element) and then pressing the other adherend (substrate or element), It is necessary to apply a sufficient pressure at a temperature equal to or higher than the glass transition temperature (Tg) after curing of the adhesive film when pressure-bonding to the adherend. The adhesive film surface on the side not in contact with the surface, that is, on the side in contact with the jig for pressure bonding may be deformed by heat and pressure, and fine irregularities may be formed on the surface. If fine irregularities are formed on the surface of the adhesive film before the other adherend is pressure-bonded, it is difficult not only to adhere the other adherend with high accuracy but also to cause a decrease in adhesive strength. There is also sex.

  In addition, the adhesive film is subjected to thermal expansion, thermal contraction, curing contraction, volatile components in the adhesive film and moisture absorption moisture in a process involving heating of the adhesive film performed after non-adhering pressure bonding, wire bonding, sealing, etc. Deformation such as expansion may occur due to volatilization. If this deformation is large, there arises a problem that the position of the mounted element is shifted. In particular, when two or more elements are bonded on the same surface of a continuous adhesive film formed on the substrate, the distance and height between the elements change due to heating.

  Further, there is a problem that warpage occurs when the substrate and the element are bonded with an adhesive film. This warpage may also cause a change in distance and height between functional parts in the same element or between elements.

  Then, an object of this invention is to provide the double-sided adhesive film by which the deformation | transformation and curvature when heated were fully suppressed.

  The double-sided adhesive film according to the present invention includes a support film, a first adhesive layer laminated on one side of the support film, and a second adhesive layer laminated on the other side of the support film, Is provided. The glass transition temperature after curing of the first adhesive layer and the second adhesive layer is 100 ° C. or less, and the glass transition temperature after curing of the first adhesive layer is after curing of the second adhesive layer. 10 ° C. or higher than the glass transition temperature. The support film has a linear expansion coefficient of 100 ppm or less.

  According to the double-sided adhesive film of the present invention, deformation and warping when heated are sufficiently suppressed. By making Tg after hardening of a 1st adhesive bond layer 10 degreeC or more higher than Tg after hardening of a 2nd adhesive bond layer, a deformation | transformation of the adhesive film by the heat | fever at the time of crimping | compression-bonding can be suppressed. For example, in the step of first pressing the second adhesive layer side of the adhesive film to the element or the substrate, the Tg after curing of the first adhesive layer is higher than the Tg after curing of the second adhesive layer. High, in other words, the temperature required to deform and bond the first adhesive layer is higher than the temperature required to deform and bond the second adhesive layer. The second adhesive layer can be pressure-bonded at a temperature at which deformation is unlikely to occur. As a result, deformation of the first adhesive layer can be suppressed.

  In addition, by setting the linear expansion coefficient of the support film to 100 ppm or less, in other words, using a material with little characteristic change during heating as the support film, the curing process of the adhesive film after mounting the element on the substrate, wire bonding Shrinkage and expansion of the adhesive film itself in a heating process such as a process or a sealing process can be suppressed. As a result, the position of the mounted element is suppressed from shifting during these heating steps.

  Furthermore, the Tg after hardening of a 1st adhesive bond layer and a 2nd adhesive bond layer shall be 100 degrees C or less, and the process of crimping | bonding a board | substrate and an element can be performed at low temperature. By performing the pressure bonding at a low temperature, the influence of the difference in linear expansion coefficient between the substrate and the element is reduced, and as a result, warpage can be suppressed.

  The first adhesive layer and the second adhesive layer preferably contain a thermoplastic resin, a thermosetting resin, and a filler.

  The support film is from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyacetal, polycarbonate, polyethersulfone, polyphenylene sulfide, polyphenylene ether, polyetheretherketone, polyarylate, and liquid crystal polymer. A film of the selected polymer is preferred.

  In another aspect, the present invention relates to an electronic component module comprising a substrate, a plurality of elements selected from semiconductor elements and MEMS elements mounted on the substrate, and an adhesive layer interposed between the substrate and the elements. . The adhesive layer is formed from the double-sided adhesive film according to the present invention.

  The electronic component module according to the present invention can achieve high performance and high reliability by mounting the element on the substrate using the double-sided adhesive film according to the present invention.

  According to the double-sided adhesive film of the present invention, deformation and warping when heated are sufficiently suppressed. Furthermore, the adhesive film according to the present invention has sufficient adhesive strength as an adhesive for an electronic component module such as a semiconductor package and a MEMS module.

  By using the adhesive film of the present invention in a semiconductor package or a MEMS module, the semiconductor element or the MEMS element can be mounted with high positional accuracy and high density and with sufficient adhesive strength. Therefore, a high-performance and highly reliable semiconductor package or MEMS module can be obtained.

It is sectional drawing which shows one Embodiment of a double-sided adhesive film. It is sectional drawing which shows one Embodiment of an electronic component module. It is a schematic diagram which shows one Embodiment of exposure by a LED printer head. It is a schematic diagram which shows one Embodiment of exposure by a LED printer head. It is a schematic diagram which shows one Embodiment of exposure by a LED printer head.

  Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

  FIG. 1 is a cross-sectional view showing an embodiment of a double-sided adhesive film. The double-sided adhesive film 1 shown in FIG. 1 is opposite to the support film 10, the first adhesive layer 21 formed on one surface of the support film 10, and the first adhesive layer 21 of the support film 20. The cover film 31 laminated | stacked on the surface on the opposite side to the 2nd adhesive bond layer 22 formed on the surface of the side, and the support film 10 of each of the 1st adhesive bond layer 21 and the 2nd adhesive bond layer 22. , 32 and a laminate having a five-layer structure.

  The first adhesive layer 21 and the second adhesive layer 22 are cured by heating. The glass transition temperature (Tg) after curing of these adhesive layers is preferably 100 ° C. or lower. When Tg after hardening of these adhesive layers is 100 ° C. or less, warpage caused by a difference in linear expansion coefficient between the substrate and the element is reduced.

  The glass transition temperature after curing of the first adhesive layer 21 is preferably higher by 10 ° C. or more than the glass transition temperature after curing of the second adhesive layer 22. Thereby, the effect of suppressing deformation when the element is mounted on the substrate is remarkably exhibited.

  The first adhesive layer 21 and the second adhesive layer 22 are configured by appropriately combining, for example, components described in detail below, so that the above Tg is easily achieved.

  The adhesive layers 21 and 22 contain, for example, a thermoplastic resin and a thermosetting resin, respectively.

  The Tg of the thermoplastic resin constituting the adhesive layer is preferably less than 100 ° C, more preferably less than 90 ° C, and even more preferably less than 80 ° C. By using a thermoplastic resin having a low Tg, an adhesive layer having a low Tg can be easily formed. The thermoplastic resin is at least one selected from the group consisting of acrylic resin, polyimide resin, polyamideimide resin, polyethersulfone resin, polyacrylate resin, polyetherketone resin, polyarylate, polyetherketone, and polyethylene naphthalate. May be.

  The chemical structure of the polyimide resin constituting the adhesive layer is not particularly limited, but in order to make the Tg of the adhesive layer after curing 100 ° C. or less, the polyimide resin is a main chain skeleton selected from alkylene, alkylene oxide and siloxane. It is preferable to contain.

  In order to further improve the adhesion and heat resistance as an adhesive film, the polyimide resin preferably has a weight average molecular weight measured by GPC (Gel Permeation Chromatography) of 10,000 to 200,000, more preferably 50,000 to 100,000. preferable.

  When combining the polyimide resin with other resins, the adhesive layer preferably contains 30% by mass or more of the polyimide resin based on the total mass in consideration of the adhesive film's adhesive properties, heat resistance, Tg and the like. 50% by mass or more is more preferable, and 70% by mass or more is more preferable.

  Although the chemical structure of the acrylic resin constituting the adhesive layer is not particularly limited, the acrylic resin is, for example, a homopolymer of (meth) acrylic acid ester, (meth) acrylic acid ester, (meth) acrylic acid, acrylonitrile, It may be a copolymer with a monomer selected from acrylamide, vinyl monomer, styrene, vinyl ether, butadiene and maleimide. In particular, a copolymer of ethyl (meth) acrylate, glycidyl (meth) acrylate and acrylonitrile, and a copolymer of butyl (meth) acrylate, glycidyl (meth) acrylate and acrylonitrile are preferable. As a commercially available product of such an acrylic resin, for example, HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd. is available.

  The epoxy resin constituting the adhesive layer is not particularly limited as long as it is a compound having one or more epoxy groups in one molecule. Examples of the epoxy resin include alkyl monoglycidyl ether, phenyl glycidyl ether, alkylphenol monoglycidyl ether, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 1- (3-glycidoxypropyl). ) -1,1,3,3,3-pentamethyldisiloxane, alkyl monoglycidyl ester, bisphenol A type epoxy resin [AER-X8501 (Asahi Kasei Epoxy Co., Ltd., trade name), R-301 (Mitsui Chemicals, Inc.) ), Trade name), YL-980 (Japan Epoxy Resin Co., Ltd., trade name)], bisphenol F type epoxy resin [YDF-170 (Toto Kasei Co., Ltd., trade name)], bisphenol AD type epoxy resin [R -1710 (Mitsui Chemicals, Inc., trade name)], F Enol novolak type epoxy resin [N-730S (Dainippon Ink and Chemicals, trade name), Quatrex-2010 (Dow Chemical Co., trade name)], bisphenol S type epoxy resin, cresol novolak type epoxy resin [YDCN -702S (Toto Kasei Co., Ltd., trade name), EOCN-100 (Nippon Kayaku Co., Ltd., trade name)], polyfunctional epoxy resin [EPPN-501 (Nippon Kayaku Co., Ltd., trade name), TACTIX -742 (Dow Chemical Company, trade name), VG-3010 (Mitsui Chemicals, trade name), 1032S (Japan Epoxy Resin Co., trade name)], epoxy resin having a naphthalene skeleton [HP-4032 (Dainippon Ink Chemical Co., Ltd., trade name)], dicyclo type epoxy resin [EP-4088S (Asahi Denka Kogyo Co., Ltd., quotient) Name), XD-1000-L (Nippon Kayaku Co., Ltd., trade name)], alicyclic epoxy resin [EHPE-3150, CEL-3000 (Daicel Chemical Industries, trade name), DME-100 ( Shin Nippon Rika Co., Ltd., trade name), EX-216L (Nagase ChemteX Corporation, trade name)], aliphatic epoxy resin [W-100 (New Nippon Rika Co., Ltd., trade name), YH-300 (Toto Kasei Co., Ltd., trade name)], epoxidized polybutadiene [PB-3600 (Daicel Chemical Industries, trade name), E-1000-3.5 (Nippon Petrochemical Co., Ltd., trade name)] Epoxidized vegetable oil [S-300K, L-500 (Daicel Chemical Industries, Ltd., trade name)], amine type epoxy resin [ELM-100 (Sumitomo Chemical Co., Ltd., trade name), YH-434L (Tokyo) Kasei Co., Ltd., trade name), ETRAD-X, TETRAD-C (Mitsubishi Gas Chemical Co., Ltd., trade name), GOT, GAN (Nippon Kayaku Co., Ltd., trade name)], ethylene / propylene glycol modified bisphenol type epoxy resin [EP-4000S (Asahi) Denka Kogyo Co., Ltd., trade name), BEO-60E (New Nippon Rika Co., Ltd., trade name)], hydrogenated bisphenol type epoxy resin [EXA-7015 (Nippon Kayaku Co., Ltd., trade name), ST- 5080 (Toto Kasei Co., Ltd., trade name)], resorcin-type epoxy resin [Denacol EX-201 (Nagase ChemteX Corporation, trade name)], epoxy resin having a catechol skeleton [EXA-7120 (Dainippon Ink Chemical Co., Ltd.) Kogyo Co., Ltd., trade name)], neopentyl glycol type epoxy resin [Denacol EX-211 (Nagase ChemteX Corporation, trade name) )], Hexane dinel glycol type epoxy resin [Denacol EX-212 (Nagase ChemteX Corporation, trade name)], ethylene / propylene glycol type epoxy resin [Denacol EX-810, 811, 850, 851, 821, 830] 832, 841, 861 (Nagase ChemteX Corp., trade name)], biphenyl type epoxy resin [YX-4000H (Japan Epoxy Resin Co., Ltd., trade name)], the following general formula (I):

（式中、ａは０〜５の整数を表す）
で表されるエポキシ樹脂［Ｅ−ＸＬ−２４、Ｅ−ＸＬ−３Ｌ（三井化学（株）、商品名）］、ウレタン変性エポキシ樹脂［ＥＰＵ−１５、ＥＰＵ−１８（旭電化工業（株）、商品名）］、ゴム変性エポキシ樹脂［ＥＰＲ−４０３２、ＥＰＲ−１３０９（旭電化工業（株）、商品名）］、キレート変性エポキシ樹脂［ＥＰ−４９−１０、ＥＰＵ−７８−１１（旭電化工業（株）、商品名）］、グリシジルエステル型エポキシ樹脂［ＹＤ−１７１、ＹＤ−１７２（東都化成（株）、商品名）、ＡＫ−６０１（日本化薬（株）、商品名）］などが挙げられる。

(Wherein, a represents an integer of 0 to 5)
[E-XL-24, E-XL-3L (Mitsui Chemicals, Inc., trade name)], urethane-modified epoxy resin [EPU-15, EPU-18 (Asahi Denka Kogyo Co., Ltd.), Product name)], rubber-modified epoxy resin [EPR-4032, EPR-1309 (Asahi Denka Kogyo Co., Ltd., product name)], chelate-modified epoxy resin [EP-49-10, EPU-78-11 (Asahi Denka Kogyo) (Trade name)], glycidyl ester type epoxy resin [YD-171, YD-172 (Toto Kasei Co., Ltd., trade name), AK-601 (Nippon Kayaku Co., Ltd., trade name)] and the like. Can be mentioned.

  Among these, at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and alicyclic epoxy resins. It is preferable to use an epoxy resin. These epoxy resins can be used alone or in combination of two or more.

  The adhesive layers 21 and 22 may contain a curing agent used in combination with the epoxy resin. Examples of the curing agent include phenol novolac resin [H-1 (Maywa Kasei Co., Ltd., trade name), VR-9300 (Mitsui Chemicals, trade name)], phenol aralkyl resin [XL-225 (Mitsui Chemicals). (Trade name)], allylated phenol novolak resin [AL-VR-9300 (Mitsui Chemicals, trade name)], the following general formula (II):

（式中、Ｒ１はメチル基、エチル基等の炭素数１〜６のアルキル基を示し、Ｒ２は水素又はメチル基、エチル基等の炭素数１〜６のアルキル基を示し、ｂは２〜４の整数を示す。）で表される特殊フェノール樹脂［ＰＰ−７００−３００（日本石油化学（株）製、商品名）］、ビスフェノールＦ、ビスフェノールＡ、ビスフェノールＡＤ、ビスフェノールＳ、アリル化ビスフェノールＦ、アリル化ビスフェノールＡ、アリル化ビスフェノールＡＤ、アリル化ビスフェノールＳ、多官能フェノール［ｐ−ＣＲ、ＴｒｉｓＰ−ＰＨＢＡ、ＭＴＰＣ、ＴｒｉｓＰ−ＲＳ（本州化学工業（株）、商品名）］等のフェノール化合物、ｏ−フェニレンジアミン、ｍ−フェニレンジアミン、ｐ−フェニレンジアミン、３，３’−ジアミノジフェニルエーテル、３，４’−ジアミノジフェニルエーテル、４，４’−ジアミノジフェニルエーテル、３，３’−ジアミノジフェニルメタン、３，４’−ジアミノジフェニルメタン、４，４’−ジアミノジフェニルメタン、３，３’−ジアミノジフェニルジフルオロメタン、３，４’−ジアミノジフェニルジフルオロメタン、４，４’−ジアミノジフェニルジフルオロメタン、３，３’−ジアミノジフェニルスルホン、３，４’−ジアミノジフェニルスルホン、４，４’−ジアミノジフェニルスルホン、３，３’−ジアミノジフェニルスルフイド、３，４’−ジアミノジフェニルスルフイド、４，４’−ジアミノジフェニルスルフイド、３，３’−ジアミノジフェニルケトン、３，４’−ジアミノジフェニルケトン、４，４’−ジアミノジフェニルケトン、２，２−ビス（３−アミノフェニル）プロパン、２，２’−（３，４’−ジアミノジフェニル）プロパン、２，２−ビス（４−アミノフェニル）プロパン、２，２−ビス（３−アミノフェニル）ヘキサフルオロプロパン、２，２−（３，４’−ジアミノジフェニル）ヘキサフルオロプロパン、２，２−ビス（４−アミノフェニル）ヘキサフルオロプロパン、１，３−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（３−アミノフェノキシ）ベンゼン、１，４−ビス（４−アミノフェノキシ）ベンゼン、３，３’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、３，４’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、４，４’−（１，４−フェニレンビス（１−メチルエチリデン））ビスアニリン、２，２−ビス（４−（３−アミノフェノキシ）フェニル）プロパン、２，２−ビス（４−（４−アミノフェノキシ）フェニル）プロパン、２，２−ビス（４−（３−アミノフェノキシ）フェニル）ヘキサフルオロプロパン、２，２−ビス（４−（４−アミノフエノキシ）フェニル）ヘキサフルオロプロパン、ビス（４−（３−アミノフェノキシ）フェニル）スルフィド、ビス（４−（４−アミノフェノキシ）フェニル）スルフィド、ビス（４−（３−アミノフェノキシ）フェニル）スルホン、ビス（４−（４−アミノフェノキシ）フェニル）スルホン、１，２−ジアミノエタン、１，３−ジアミノプロパン、１，４−ジアミノブタン、１，５−ジアミノペンタン、ジエチレントリアミン、トリエチレンテトラミン、ジエチルアミノプロピルアミン、１，１，３，３−テトラメチル−１，３−ビス（４−アミノフェニル）ジシロキサン、１，１，３，３−テトラフェノキシ−１，３−ビス（４−アミノエチル）ジシロキサン、１，１，３，３−テトラフェニル−１，３−ビス（２−アミノエチル）ジシロキサン、１，１，３，３−テトラフェニル−１，３−ビス（３−アミノプロピル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（２−アミノエチル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（３−アミノプロピル）ジシロキサン、１，１，３，３−テトラメチル−１，３−ビス（３−アミノブチル）ジシロキサン、１，３−ジメチル−１，３−ジメトキシ−１，３−ビス（４−アミノブチル）ジシロキサン、１，１，３，３，５，５−ヘキサメチル−１，５−ビス（４−アミノフェニル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメトキシ−１，５−ビス（４−アミノブチル）トリシロキサン、１，１，５，５−テトラフェニル−３，３−ジメトキシ−１，５−ビス（５−アミノペンチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（２−アミノエチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（４−アミノブチル）トリシロキサン、１，１，５，５−テトラメチル−３，３−ジメトキシ−１，５−ビス（５−アミノペンチル）トリシロキサン、１，１，３，３，５，５−ヘキサメチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，３，３，５，５−ヘキサエチル−１，５−ビス（３−アミノプロピル）トリシロキサン、１，１，３，３，５，５−ヘキサプロピル−１，５−ビス（３−アミノプロピル）トリシロキサン、トリエチルアミン、ベンジルジメチルアミン、α−メチルベンジルジメチルアミン、トリスジメチルアミノメチルフェノール、ピペリジン、メンタンジアミン、ボロントリフルオライドモノエチルアミン、１，８−ジアザビシクロ［５．４．０］−ウンデセン−７、６−ブチル−１，８−ジアザビシクロ［５．４．０］−ウンデセン−７、１，５−ジアザビシクロ［４．３．０］−ノネン−５等のアミン化合物、ジシアンジアミド、下記一般式（ＩＩＩ）：

(In the formula, R1 represents an alkyl group having 1 to 6 carbon atoms such as a methyl group and an ethyl group, R2 represents a hydrogen or alkyl group having 1 to 6 carbon atoms such as a methyl group and an ethyl group, and b represents 2 to 2) A special phenol resin [PP-700-300 (trade name) manufactured by Nippon Petrochemical Co., Ltd.]], bisphenol F, bisphenol A, bisphenol AD, bisphenol S, allylated bisphenol F , Phenol compounds such as allylated bisphenol A, allylated bisphenol AD, allylated bisphenol S, polyfunctional phenol [p-CR, TrisP-PHBA, MTPC, TrisP-RS (Honshu Chemical Industry Co., Ltd., trade name)], o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenyldifluoromethane, 3,4′-diaminodiphenyldifluoromethane, 4,4′-diaminodiphenyldifluoromethane, 3,3′-diaminodiphenylsulfone, 3,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 3,3 '-Diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl ketone, 3,4'-diaminodiphenyl ketone, 4, 4′-diaminodiphenyl ketone, 2,2-bis (3-amino Enyl) propane, 2,2 ′-(3,4′-diaminodiphenyl) propane, 2,2-bis (4-aminophenyl) propane, 2,2-bis (3-aminophenyl) hexafluoropropane, 2, 2- (3,4'-diaminodiphenyl) hexafluoropropane, 2,2-bis (4-aminophenyl) hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3 -Aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 3,3 '-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 3,4'-(1,4- Phenylenebis (1-methylethylidene)) bisaniline, 4,4 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 2,2-bis (4- ( 3-aminophenoxy) phenyl) propane, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 2,2-bis (4- (3-aminophenoxy) phenyl) hexafluoropropane, 2,2 -Bis (4- (4-aminophenoxy) phenyl) hexafluoropropane, bis (4- (3-aminophenoxy) phenyl) sulfide, bis (4- (4-aminophenoxy) phenyl) sulfide, bis (4- (3 -Aminophenoxy) phenyl) sulfone, bis (4- (4-aminophenoxy) phenyl) sulfone, 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, Diethylenetriamine, triethylenetetramine, diethylaminopropylamine, 1,1,3,3 Tetramethyl-1,3-bis (4-aminophenyl) disiloxane, 1,1,3,3-tetraphenoxy-1,3-bis (4-aminoethyl) disiloxane, 1,1,3,3- Tetraphenyl-1,3-bis (2-aminoethyl) disiloxane, 1,1,3,3-tetraphenyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3- Tetramethyl-1,3-bis (2-aminoethyl) disiloxane, 1,1,3,3-tetramethyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3- Tetramethyl-1,3-bis (3-aminobutyl) disiloxane, 1,3-dimethyl-1,3-dimethoxy-1,3-bis (4-aminobutyl) disiloxane, 1,1,3,3 , 5,5-Hexamethyl-1,5-bis 4-aminophenyl) trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,5,5-tetraphenyl- 3,3-dimethoxy-1,5-bis (4-aminobutyl) trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis (5-aminopentyl) trisiloxane 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis (2-aminoethyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1 , 5-bis (4-aminobutyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis (5-aminopentyl) trisiloxane, 1,1,3, 3,5,5-hexame Til-1,5-bis (3-aminopropyl) trisiloxane, 1,1,3,3,5,5-hexaethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,3, 3,5,5-hexapropyl-1,5-bis (3-aminopropyl) trisiloxane, triethylamine, benzyldimethylamine, α-methylbenzyldimethylamine, trisdimethylaminomethylphenol, piperidine, menthanediamine, boron trifluoride Monoethylamine, 1,8-diazabicyclo [5.4.0] -undecene-7, 6-butyl-1,8-diazabicyclo [5.4.0] -undecene-7, 1,5-diazabicyclo [4.3. .0] -Nonene-5 and the like, dicyandiamide, the following general formula (III):

（式中、Ｒ３はｍ−フェニレン基、ｐ−フェニレン基等の２価の芳香族基、炭素数２〜１２の直鎖又は分岐鎖のアルキレン基を示す。）で表される二塩基酸ジヒドラジド［ＡＤＨ、ＰＤＨ、ＳＤＨ（いずれも日本ヒドラジン工業（株）製、商品名）］、エポキシ樹脂とアミン化合物の反応物からなるマイクロカプセル型硬化剤［ノバキュア（旭化成工業（株）製、商品名）］、Ｕ−ＣＡＴ３５０２Ｔ、Ｕ−ＣＡＴ３５０３Ｎ（サンアプロ（株）、商品名）等の尿素化合物、無水フタル酸、無水マレイン酸、無水シトラコン酸、無水イタコン酸、無水コハク酸、無水ドデシルコハク酸、無水テトラヒドロフタル酸、無水ヘキサヒドロフタル酸、３又は４−メチル−１，２，３，６−テトラヒドロ無水フタル酸、３又は４−メチルヘキサヒドロ無水フタル酸、ビシクロ［２．２．１］へプト−５−エン−２，３−ジカルボン酸無水物、メチルビシクロ［２．２．１］へプト−５−エン−２，３−ジカルボン酸無水物、ピロメリット酸二無水物、３，３’，４，４’−ジフェニルテトラカルボン酸二無水物、２，２’，３，３’−ジフェニルテトラカルボン酸二無水物、２，２−ビス（３，４−ジカルボキシフェニル）プロパン二無水物、２，２−ビス（２，３−ジカルボキシフェニル）プロパン二無水物、１，１−ビス（２，３−ジカルボキシフェニル）エタン二無水物、１，１−ビス（３，４−ジカルボキシフェニル）エタン二無水物、ビス（２，３−ジカルボキシフェニル）メタン二無水物、ビス（３，４−ジカルボキシフェニル）メタン二無水物、ビス（３，４−ジカルボキシフェニル）スルホン二無水物、３，４，９，１０−ペリレンテトラカルボン酸二無水物、ビス（３，４−ジカルボキシフェニル）エーテル二無水物、ベンゼン−１，２，３，４−テトラカルボン酸二無水物、３，４，３’，４’−ベンゾフェノンテトラカルボン酸二無水物、２，３，２’，３−ベンゾフェノンテトラカルボン酸二無水物、２，３，３’，４’−ベンゾフェノンテトラカルボン酸二無水物、１，２，５，６−ナフタレンテトラカルボン酸二無水物、２，３，６，７−ナフタレンテトラカルボン酸二無水物、１，２，４，５−ナフタレンテトラカルボン酸二無水物、１，４，５，８−ナフタレンテトラカルボン酸二無水物、２，６−ジクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、２，７−ジクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、２，３，６，７−テトラクロルナフタレン−１，４，５，８−テトラカルボン酸二無水物、フエナンスレン−１，８，９，１０−テトラカルボン酸二無水物、ピラジン−２，３，５，６−テトラカルボン酸二無水物、チオフエン−２，３，４，５−テトラカルボン酸二無水物、２，３，３’，４’−ビフェニルテトラカルボン酸二無水物、３，４，３’，４’−ビフェニルテトラカルボン酸二無水物、２，３，２’，３’−ビフェニルテトラカルボン酸二無水物、ビス（３，４−ジカルボキシフェニル）ジメチルシラン二無水物、ビス（３，４−ジカルボキシフェニル）メチルフェニルシラン二無水物、ビス（３，４−ジカルボキシフェニル）ジフェニルシラン二無水物、１，４−ビス（３，４−ジカルボキシフェニルジメチルシリル）ベンゼン二無水物、１，３−ビス（３，４−ジカルボキシフェニル）−１，１，３，３−テトラメチルジシクロヘキサン二無水物、ｐ−フェニレンビス（トリメリテート無水物）、エチレンテトラカルボン酸二無水物、１，２，３，４−ブタンテトラカルボン酸二無水物、デカヒドロナフタレン−１，４，５，８−テトラカルボン酸二無水物、４，８−ジメチル−１，２，３，５，６，７−ヘキサヒドロナフタレン−１，２，５，６−テトラカルボン酸二無水物、シクロペンタン−１，２，３，４−テトラカルボン酸二無水物、ピロリジン−２，３，４，５−テトラカルボン酸二無水物、１，２，３，４−シクロブタンテトラカルボン酸二無水物、ビス（エキソビシクロ［２，２，１］ヘプタン−２，３−ジカルボン酸二無水物）スルホン、ビシクロ−（２，２，２）−オクト（７）−エン２，３，５，６−テトラカルボン酸二無水物、２，２−ビス（３，４−ジカルボキシフェニル）ヘキサフルオロプロパン二無水物、２，２−ビス［４−（３，４−ジカルボキシフェノキシ）フェニル］ヘキサフルオロプロパン二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルスルフイド二無水物、４，４’−（４，４’イソプロピリデンジフェノキシ）−ビス（フタル酸無水物）、４，４’−［デカン−１，１０ジイルビス（オキシカルボニル）］ジフタル酸無水物、１，４−ビス（２−ヒドロキシヘキサフルオロイソプロピル）ベンゼンビス（トリメリット酸二無水物）、１，３−ビス（２−ヒドロキシヘキサフルオロイソプロピル）ベンゼンビス（トリメリット酸二無水物）、５−（２，５−ジオキソテトラヒドロフリル）−３−メチル−３−シクロヘキセン−１，２−ジカルボン酸二無水物、テトラヒドロフラン−２，３，４，５−テトラカルボン酸二無水物等の酸無水物、KT−９９０、ＣＰ−７７（旭電化工業（株）、商品名）、ＳＩ−Ｌ８５、ＳＩ−Ｌ１４５（三新化学工業（株）、商品名）等のカチオン重合触媒、ポリメルカプト化合物、ポリアミド化合物が挙げられる。これらの硬化剤を２種以上適宜組み合わせて用いてもよい。

(Wherein R3 represents a divalent aromatic group such as an m-phenylene group or a p-phenylene group, or a linear or branched alkylene group having 2 to 12 carbon atoms). [ADH, PDH, SDH (Nippon Hydrazine Kogyo Co., Ltd., trade name)], microcapsule type curing agent consisting of a reaction product of epoxy resin and amine compound [NovaCure (Asahi Kasei Kogyo Co., Ltd., trade name) ] U-CAT3502T, U-CAT3503N (San Apro Co., Ltd., trade name) and other urea compounds, phthalic anhydride, maleic anhydride, citraconic anhydride, itaconic anhydride, succinic anhydride, dodecyl succinic anhydride, tetrahydro anhydride Phthalic acid, hexahydrophthalic anhydride, 3 or 4-methyl-1,2,3,6-tetrahydrophthalic anhydride, 3 or 4-methylhexahydro Phthalic acid, bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic anhydride, methylbicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic anhydride , Pyromellitic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-diphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride Bis (3,4-dicarboxyphenyl) Sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, benzene-1,2,3,4-tetracarboxylic acid Anhydride, 3,4,3 ′, 4′-benzophenone tetracarboxylic dianhydride, 2,3,2 ′, 3-benzophenone tetracarboxylic dianhydride, 2,3,3 ′, 4′-benzophenone tetra Carboxylic dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, 1,2,4,5-naphthalene tetracarboxylic acid Dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene -1,4,5 8-tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic acid bis Anhydride, pyrazine-2,3,5,6-tetracarboxylic dianhydride, thiophene-2,3,4,5-tetracarboxylic dianhydride, 2,3,3 ', 4'-biphenyltetracarboxylic Acid dianhydride, 3,4,3 ′, 4′-biphenyltetracarboxylic dianhydride, 2,3,2 ′, 3′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ) Dimethylsilane dianhydride, bis (3,4-dicarboxyphenyl) methylphenylsilane dianhydride, bis (3,4-dicarboxyphenyl) diphenylsilane dianhydride, 1,4-bis (3,4 Dicarboxypheny Dimethylsilyl) benzene dianhydride, 1,3-bis (3,4-dicarboxyphenyl) -1,1,3,3-tetramethyldicyclohexane dianhydride, p-phenylenebis (trimellitic anhydride), ethylene Tetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1, 2,3,5,6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine-2 , 3,4,5-tetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, bis (exobicyclo [2,2,1] heptane-2,3-dicarboxylic acid Water) sulfone, bicyclo- (2,2,2) -oct (7) -ene 2,3,5,6-tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) Hexafluoropropane dianhydride, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropane dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) diphenylsulfur Fluid dianhydride, 4,4 ′-(4,4′isopropylidenediphenoxy) -bis (phthalic anhydride), 4,4 ′-[decane-1,10diylbis (oxycarbonyl)] diphthalic anhydride 1,4-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic dianhydride), 1,3-bis (2-hydroxyhexafluoroisopropyl) benzenebis ( Rimellitic dianhydride), 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, tetrahydrofuran-2,3,4,5-tetra Acid anhydrides such as carboxylic dianhydrides, KT-990, CP-77 (Asahi Denka Kogyo Co., Ltd., trade name), SI-L85, SI-L145 (Sanshin Chemical Co., Ltd., trade name), etc. Cation polymerization catalyst, polymercapto compound, and polyamide compound. Two or more of these curing agents may be used in appropriate combination.

  The adhesive layers 21 and 22 may contain an epoxy resin curing accelerator as necessary. Examples of curing accelerators include, but are not limited to, organic boron salt compounds [EMZ · K, TPPK (Hokuko Chemical Co., Ltd., trade name)], imidazoles [Cureazole, 2P4MHZ, C17Z, 2PZ-OK ( Shikoku Kasei Co., Ltd., trade name)].

  The first adhesive layer 21 and / or the second adhesive layer 22 may contain a filler. Examples of the filler include particles of gold, silver, copper, nickel, iron, aluminum, stainless steel, silicon oxide, silicon carbide, boron nitride, aluminum oxide, aluminum borate, or aluminum nitride. Among these, when electrical conductivity is required for the adhesive layer due to the structure of the semiconductor package, it is possible to use conductive fillers such as gold, silver, copper, nickel, iron, aluminum, and stainless steel. preferable. When electrical insulation is required for the adhesive layer, it is preferable to use an electrically insulating filler such as silicon oxide, silicon carbide, boron nitride, aluminum oxide, aluminum borate, and aluminum nitride.

  The particle size of the filler is not particularly limited, but usually the average particle size is preferably 0.001 to 50 μm, more preferably 0.005 to 10 μm.

  Although the compounding quantity of a filler does not have a restriction | limiting in particular, 3-70 mass% is preferable with respect to the total mass of an adhesive bond layer, and it is more preferable that it is 5-40 mass%. If the blending amount is less than 3% by mass, the adhesive strength during heating tends to decrease, and if it exceeds 70% by mass, the surface roughness increases and the thermocompression bonding property of the adhesive film tends to decrease. .

  The first adhesive layer 21 and / or the second adhesive layer 22 may further contain a coupling agent. The coupling agent is not particularly limited, and examples thereof include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, and vinyl-tris. (2-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, methyltri (methacryloxyethoxy) silane, γ-acryloxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane Γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, -Β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, 3- (4 5-dihydroimidazolyl) propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycid Xylpropylmethyldiisopropenoxysilane, methyltriglycidoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, trimethylsilyl isocyanate, dimethyl Silane coupling agents such as rusilyl isocyanate, phenylsilyl triisocyanate, tetraisocyanate silane, methylsilyl triisocyanate, vinylsilyl triisocyanate, ethoxysilane triisocyanate, tetramethyl titanate, tetraethyl titanate, tetrapropyl titanate, tetraisopropyl titanate, tetra Butyl titanate, tetraisobutyl titanate, tetra 2-ethylhexyl titanate, tetrastearyl titanate, tetraoctylene glycol titanate, isopropyl triisostearoyl titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl Ruisostearoyl diacryl titanate, isopropyl tris (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethylaminoethyl) titanate, tetraisopropyl bis (dioctyl phosphite) ) Titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (di-tridecyl) phosphite titanate, dicumylphenyloxyacetate titanate, bis (dioctyl pyrophosphate) ) Oxyacetate titanate, diisostearoyl ethylene titanate, bis (dioctylpyrophosphate) ethylene Examples thereof include titanium coupling agents such as titanate, polyalkyl titanate, polyaryl titanate, polyacyl titanate, and polyphosphate titanate.

  0.1-10 mass parts is preferable with respect to the total mass of each adhesive bond layer, and, as for the compounding quantity of a coupling agent, 0.5-5 mass parts is more preferable. When the blending ratio is less than 0.1 parts by mass, the effect of improving the adhesive strength is inferior, and when it exceeds 10 parts by mass, the volatile matter increases and foaming tends to occur in the heating process.

  The adhesive layers 21 and 22 may contain a flexible material. As the flexible material, various liquid rubbers and thermoplastic resins are used. For example, polybutadiene, maleated polybutadiene, acrylated polybutadiene, methacrylated polybutadiene, epoxidized polybutadiene, acrylonitrile butadiene rubber, carboxy-terminated acrylonitrile butadiene rubber, amino Examples thereof include terminal acrylonitrile butadiene rubber, vinyl terminal acrylonitrile butadiene rubber, styrene butadiene rubber, polyvinyl acetate, polymethyl acrylate, ε-caprolactone-modified polyester, phenoxy resin, and polyimide.

  As for the molecular weight of a flexible material, it is preferable that a number average molecular weight is 500-500000 normally, and it is more preferable that it is 1000-200000.

  The blending amount of the flexible material is preferably 1 to 50 parts by mass, and more preferably 5 to 30 parts by mass with respect to the total mass of each adhesive layer. When the amount is less than 1 part by mass, the flexibility effect tends to be small, and when it exceeds 50 parts by mass, the tackiness is increased and the handleability and workability of the adhesive film tend to be reduced.

  Adhesive layers 21 and 22 are made of hygroscopic agents such as calcium oxide and magnesium oxide, fluorine-based surfactants, nonionic surfactants, wetting improvers such as higher fatty acids, antifoaming agents such as silicone oil, and inorganic ion exchangers. One or more additives such as flame retardants such as ion trapping agents, bromine compounds, metal hydrates and the like may be included.

  The thicknesses of the adhesive layers 21 and 22 are not particularly limited, but are preferably 1 to 100 μm and more preferably 5 to 50 μm. When the thickness of the adhesive layer is less than 1 μm, it is difficult to keep the thickness uniform, and the adhesiveness tends to decrease. On the other hand, when the thickness of the adhesive layer exceeds 100 μm, deformation of the adhesive film itself tends to increase when the substrate and the element are bonded with the adhesive film or in the subsequent heating step.

  The support film (base substrate) 10 is preferably formed from a material with little characteristic change due to heating. Thereby, the heat shrinkage and expansion of the double-sided adhesive film itself due to heating in the curing process, the wire bonding process, the sealing process and the like of the adhesive film after mounting the element on the substrate can be more effectively suppressed.

  From such a viewpoint, the Tg of the support film 10 is preferably 100 ° C. or higher, and more preferably 150 ° C. or higher. The linear expansion coefficient of the support film 10 is preferably 100 ppm or less, and more preferably 50 ppm or less.

  The material of the support film 10 is not particularly limited, and various polymer films, organic / inorganic composite materials, metals, and the like can be used. In order to achieve the above characteristics, the support film 10 is made of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyacetal, polycarbonate, polyethersulfone, polyphenylene sulfide, polyphenylene ether, polyether. It is preferably any of ether ketone, polyarylate, and liquid crystal polymer.

  As the cover films 31 and 32, for example, a polymer film selected from the group consisting of polyethylene terephthalate, polyethylene, and polypropylene is used.

  The support film 10 may have a surface subjected to plasma treatment or corona treatment or chemical treatment with a coupling agent or the like in order to improve adhesion to the adhesive layers 21 and 22.

  Although there is no restriction | limiting in particular in the thickness of the support film 10, It is preferable that it is 5-150 micrometers, It is more preferable that it is 10-100 micrometers, It is further more preferable that it is 15-75 micrometers. When the thickness of the support film 10 is smaller than 5 μm, the handleability during the production of the adhesive film tends to decrease. When the thickness of the support film 10 exceeds 150 μm, the variation in the thickness of the support film itself tends to increase.

  The cured adhesive layers 21 and 22 and the Tg of the support film 10 are preferably measured by TMA (Thermo Mechanical Analysis) or DMA (Dynamic Mechanical Analysis).

  The linear expansion coefficient of the support film 10 is preferably measured by TMA (Thermo Mechanical Analysis).

  The double-sided adhesive film 1 includes, for example, a step of forming the first adhesive layer 21 on one surface of the support film 10 and a step of forming the second adhesive layer 22 on the other surface of the support film 10. And a step of bonding the cover films 31 and 32 to the opposite surfaces of the first adhesive layer and the second adhesive layer from the support film 10.

  The adhesive layers 21 and 22 apply, for example, an adhesive composition (varnish) containing a thermoplastic resin, a thermosetting resin, a filler, and a solvent to the support film 10 and dry the applied adhesive composition. It can be formed by a method or a method in which an adhesive layer formed on another base film is thermally transferred to the support film 10. The method of forming the two adhesive layers 21 and 22 may be the same or different.

  FIG. 2 is a cross-sectional view showing an embodiment of an electronic component module. The electronic component module 2 shown in FIG. 2 includes a substrate 40, a plurality of elements 45 selected from semiconductor elements and MEMS elements mounted on the substrate 40, and an adhesive layer 1 a interposed between the substrate 40 and the elements 45. Is provided. The adhesive layer 1a is formed from the double-sided adhesive film 1 from which the cover films 31 and 32 have been removed. In other words, the adhesive layer 1a is composed of a support film and two cured adhesive layers provided on both sides of the support film.

  The electronic component module according to the present invention is not limited to the above embodiment, and can be appropriately modified without departing from the gist of the present invention. For example, the electronic component module according to the present invention may be a semiconductor package including a plurality of semiconductor elements, a MEMS module including a MEMS element, or a module including both a semiconductor element and a MEMS element. There may be.

  The electronic component module 2 includes, for example, a step of removing the cover film 32 from the double-sided adhesive film 1 and thermocompression bonding the second adhesive layer 22 to one adherend (the substrate 40 or the element 45); The cover film 31 can be removed from 1 and the first adhesive layer 21 can be manufactured by a method including the step of thermocompression bonding to the other adherend (the substrate 40 or the element 45) in this order.

  The temperature at the time of thermocompression bonding the adhesive layer is preferably within 140 ° C higher than the Tg after curing of the adhesive layer to be thermocompression bonded, more preferably within 100 ° C higher temperature, 80 ° C. More preferably, it is within a high temperature. When this temperature exceeds a temperature 140 ° C. higher than the Tg of the adhesive layer to be thermocompression bonded, the Tg after curing of the first adhesive layer is obtained by being higher than the Tg after curing of the second adhesive layer. The deformation suppressing effect of the first adhesive layer when the element is mounted tends to be small. In addition, the effect of suppressing warpage due to the difference in linear expansion coefficient between the substrate and the element tends to be small.

  The pressure during thermocompression bonding is not particularly limited, but is preferably 0.02 to 20 MPa. If this pressure is less than 0.02 MPa, the adhesive strength tends to decrease, and if it exceeds 20 MPa, the deformation of the adhesive film tends to increase.

  Necessary for thermo-compression bonding of double-sided adhesive film to a substrate or element to suppress the moisture absorption of the substrate and / or double-sided adhesive film from volatilizing during thermocompression bonding and the formation of bubbles in the adhesive layer. Depending on the case, the substrate and / or the double-sided adhesive film can be dried in advance.

  After thermocompression bonding a single double-sided adhesive film to a substrate, a method of thermocompression bonding a plurality of elements to a thermobonded double-sided adhesive film, after thermally bonding a plurality of double-sided adhesive films to a substrate, respectively. It is possible to employ a method in which the element is thermocompression bonded, or a method in which a double-sided adhesive film is preliminarily thermocompression bonded to each element and then the double-sided adhesive film thermocompression bonded to the element is thermocompression bonded to the substrate. In order to shorten the production process, a method in which a double-sided adhesive film is thermocompression bonded to a predetermined portion on a substrate and then a plurality of elements are thermocompression bonded to the thermocompression-bonded double-sided adhesive film is preferable.

  After the double-sided adhesive film is thermocompression bonded to the substrate and the element, the first and second adhesive layers may be cured by heating as necessary. Although there is no restriction | limiting in particular as the temperature added in that case, It is preferable that it is 200 degrees C or less, It is more preferable that it is 180 degrees C or less, It is further more preferable that it is 160 degrees C or less. When the temperature of the curing process of the adhesive film exceeds 200 ° C., there is a tendency that the deformation of the adhesive film itself due to the thermal expansion / contraction of the adhesive film itself or the volatilization of the volatile component or moisture absorption moisture contained in the adhesive film increases.

  When the element 45 is an LED chip, the electronic component module 2 can constitute an LED printer head. FIG. 3 is a schematic diagram showing an embodiment of exposure by an LED printer head. In the embodiment shown in FIG. 3, the photosensitive drum 7 is exposed in a predetermined pattern by the LED printer head 5.

  The LED printer head 5 includes an electronic component module 2 and a lens 3 disposed on the element (LED chip) 45 side of the electronic component module 2. The LED printer head 5 is disposed to face the photosensitive drum 7 that rotates in the direction of arrow A. The light 50 emitted from the LED chip 45 is focused at a predetermined position 60 on the photosensitive drum 7 by the lens 3. As a result, a predetermined position 60 of the photosensitive drum 7 is exposed.

  In order to expose a desired position of the photosensitive drum 7 with high accuracy, it is necessary to accurately control the positions and heights of the plurality of LED chips. For example, as shown in FIG. 4, when the adhesive layer 1 a is deformed and the distance between adjacent LED chips 45 increases in the direction of arrow B, an unexposed portion is generated on the surface of the photosensitive drum 7, and an unprinted portion is generated. Will do. On the other hand, when the distance between the LED chips is reduced, an excessively exposed portion is generated and printing is blurred. Further, as shown in FIG. 5, when the height of the LED chip 45 is changed, a portion that is excessively exposed due to a defocus may be generated or an underexposed portion may be generated. This also causes printing blur.

  By mounting the element (LED chip) 45 on the substrate 40 using the double-sided adhesive film according to the present embodiment, it is possible to effectively prevent printing defects due to the above deformation.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

Production example 1 of adhesive varnish
To a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 1,3-bis (3-aminopropyl) tetramethyldisiloxane (0.03 mol) and 1,12-diaminododecane (0 0.08 mol) and 150 g of N-methyl-2-pyrrolidone (NMP) as a solvent were added and stirred at 60 ° C.

  After dissolution of the diamine, 1,10- (decamethylene) bis (trimellitate dianhydride) (0.02 mol) and 4,4 ′-(4,4′-isopropylidenediphenoxy) bis (phthalic dianhydride) ( 0.08 mol) was added in small portions and reacted at 60 ° C. for 3 hours.

Then heated to 170 ° C. while blowing N ₂ gas, the water in over 3 hours system was removed by azeotropic together with part of the solvent to obtain a polyimide resin NMP solution.

  6 parts by mass of cresol novolac type epoxy resin (trade name YDCN-702, manufactured by Tohto Kasei Co., Ltd.) and 4,4 ′-(1- (4- (1- (4-hydroxyphenyl) -1-methylethyl) phenyl) ethylidene) bisphenol (Honshu Chemical Co., Ltd., trade name Tris-P-PA) 3 parts by mass, tetraphenylphosphonium tetraphenylborate (Tokyo Kasei) Manufactured, trade name TPPK) 0.5 part by mass and boron nitride filler (made by Mizushima alloy iron, trade name HP-P1) 10 parts by mass were added to the solution and kneaded well to obtain a varnish.

Production Example 2
In a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 1,3-bis (3-aminopropyl) tetramethyldisiloxane (0.07 mol) and 4,9-dioxadecane-1, 12-diamine (0.03 mol) and 150 g of NMP were added and stirred at 60 ° C.

  After dissolution of the diamine, 1,10- (decamethylene) bis (trimellitate dianhydride) (0.03 mol) and 4,4′-oxydiphthalic dianhydride (0.07 mol) were added in small portions, Reacted for hours.

Then heated at 170 ° C. while blowing N ₂ gas, the water in over 3 hours system was removed by azeotropic together with part of the solvent to obtain a polyimide resin NMP solution.

  6 parts by mass of cresol novolac type epoxy resin (trade name YDCN-702, manufactured by Tohto Kasei Co., Ltd.) and 4,4 ′-(1- 2 parts by mass of (4- (1- (4-hydroxyphenyl) -1-methylethyl) phenyl) ethylidene) bisphenol (trade name, Tris-P-PA, manufactured by Honshu Chemical), and tetraphenylphosphonium tetraphenylborate (Tokyo) Kasei, trade name TPPK) 0.5 parts by mass, 12% by mass boron nitride filler (made of Mizushima alloy iron) with respect to the total solid content, and 2% by mass Aerosil with respect to the total solid content ( Silica) filler (manufactured by Nippon Aerosil Co., Ltd., trade name R972) was added to the solution and kneaded well to obtain a varnish.

Production Example 3
In a four-necked flask equipped with a stirrer and a calcium chloride tube, an ortho-cresol / novolac type epoxy resin (13.2% by mass, manufactured by Tohto Kasei, trade name YDCN703), xylene-modified phenolic resin (11.1% by mass) in a nitrogen atmosphere. %, Mitsui Chemicals, trade name XLC-LL), fine silica filler (7.8% by weight, made by Nippon Aerosil, trade name R972V), mercapton coupling agent (0.4% by weight, made by Nihon Unicar, product) Name A189), ureidosilane coupling agent (0.8% by mass, manufactured by Nihon Unicar, product name A-1160), 1-cyanoethyl-2-phenylimidazole (0.025% by mass, manufactured by Shikoku Chemicals, product name 2PZ) -CN) and epoxy-containing acrylic rubber (66.6% by mass, manufactured by Teikoku Chemical Industry, trade name HTR-860P-3) Kneaded to obtain a varnish.

Production Example 4
In a 500 ml four-necked flask equipped with a thermometer, a stirrer and a calcium chloride tube, 258.3 g (0.63 mol) of 1,2-bis [4- (4aminophenoxy) phenyl] propane and 1, 10.4 g (0.042 mol) of 3-bis (3-aminopropyl) -tetramethyldisiloxane was added and dissolved in 1450 g of NMP.

  Further, this solution was cooled to 0 ° C., and 180.4 g (0.857 mol) of trimellitic anhydride chloride was added. After the trimellitic anhydride chloride was dissolved, 130 g of trimethylamine was added. After stirring at room temperature for 2 hours, the temperature was raised to 180 ° C. and reacted for 5 hours to complete imidization.

  The obtained reaction solution was put into methanol to precipitate a polymer. This was dried and then dissolved in NMP, and the NMP solution was put into methanol to precipitate the polymer again. The precipitated polymer was dried under reduced pressure to obtain polyetheramideimide powder. 120 g of the obtained polyetheramideimide powder and 6 g of a silane coupling agent (trade name SH6040, manufactured by Toray Dow Corning Co., Ltd.) were dissolved in NMP to obtain an aromatic polyetheramideimide varnish.

Glass Transition Temperature of Adhesive Layer The varnish obtained in Production Examples 1 to 4 was applied onto a polyethylene terephthalate film that had been subjected to a release treatment, heated at 80 ° C. for 30 minutes, then at 150 ° C. for 30 minutes, and then at room temperature (25 The polyethylene terephthalate film was peeled off at 25 ° C. to obtain an adhesive layer having a thickness of 25 μm.

  The obtained adhesive layer was cured by heating at 180 ° C. for 1 hour, and a sample having a size of 4 × 20 mm was cut out therefrom. Using this sample, TMA120 manufactured by Seiko Electronics Co., Ltd. measured the amount of displacement of the sample under the conditions of Extension, temperature rising speed: 5 ° C./min, sample measurement length: 10 mm, and shows the relationship between the amount of displacement and the temperature. A curve was obtained. The glass transition temperature (Tg) was determined from the obtained curve. The results are shown in Table 1.

Example 1
A polyimide film having a thickness of 50 μm (Upilex SGA manufactured by Ube Industries, Ltd., linear expansion coefficient: 30 ppm) was prepared and used as “support film 1”. The varnish of Production Example 2 is applied to one side of the support film 1 and heated at 80 ° C. for 30 minutes and then at 150 ° C. for 30 minutes to form a second adhesive layer having a thickness of 25 μm on one side of the support film 1. Formed.

  Next, the varnish of Production Example 1 was applied to the surface of the support film 1 opposite to the second adhesive layer, heated at 80 ° C. for 30 minutes, and then at 150 ° C. for 30 minutes, to a thickness of 25 μm. A first adhesive layer was formed.

Example 2
A double-sided adhesive film having a three-layer structure was obtained through the same steps as in Example 1 except that the second adhesive layer was formed using the varnish of Production Example 3.

Example 3
Instead of the support film 1, a double-sided adhesive film having a three-layer structure is obtained through the same steps as in Example 1 except that a polyethylene naphthalate film (made by Teijin DuPont Film) having a thickness of 50 μm is used as the “support film 2”. Got.

Comparative Example 1
The varnish of Production Example 1 was applied to a polyethylene terephthalate film that had been subjected to a release treatment, and heated at 80 ° C. for 30 minutes and then at 150 ° C. for 30 minutes to form an adhesive layer having a thickness of 50 μm. In the same manner, an adhesive layer having a thickness of 50 μm was formed on the polyethylene terephthalate film using the varnish of Production Example 2. Subsequently, these two types of adhesive layers were bonded at 80 ° C., 10 N / cm, and 2 m / min, and the outer polyethylene terephthalate film was peeled off to obtain a double-sided adhesive film having a thickness of 100 μm.

Comparative Example 2
A double-sided adhesive film having a three-layer structure was obtained through the same steps as in Example 1 except that both the first adhesive layer and the second adhesive layer were formed using the varnish of Production Example 1.

Comparative Example 3
The first adhesive layer was formed using the varnish of Production Example 4, and the second adhesive layer was formed using the varnish of Production Example 1 and then passed through the same steps as in Example 1 to form 3 layers. A double-sided adhesive film having a constitution was obtained.

Example 3
Instead of the support film 1, a polypropylene film having a thickness of 50 μm (Toray, Trefan, linear expansion coefficient: 115 ppm) was used as the “support film 3”, and the same process as in Example 1 was carried out to obtain 5 layers. A double-sided adhesive film having a constitution was obtained.

Linear Expansion Coefficient of Support Film A sample having a size of 4 × 20 mm was cut out from each support film used in Examples and Comparative Examples. With respect to this sample, a linear expansion coefficient was obtained by measuring the amount of displacement of the sample using TMA120 manufactured by Seiko Electronics under the conditions of Extension, temperature rising speed: 5 ° C./min, and sample measurement length: 10 mm. Table 2 shows the linear expansion coefficient of each support film.

Evaluation of double-sided adhesive film Heat Shrinkage A test piece of 80 mm × 80 mm size was cut out from the double-sided adhesive film obtained in each of the examples and comparative examples. A score was placed at the center of each side of the cut specimen, and the length between the opposing scores was measured to the nearest 0.001 mm.

  Next, the test piece was heated for 1 hour in a state where free shrinkage was possible in a furnace maintained at 180 ° C. The length between the same scores as before the heating of the test piece after heating was measured to the unit of 0.001 mm. The ratio of the difference in length between the scores before and after heating to the length between the scores before heating was defined as the heat shrinkage rate (%).

2. Chip Warp A test piece of 12 mm × 12 mm size was accurately cut out from the double-sided adhesive film obtained in each Example and Comparative Example. The cut test piece was heat-pressed on a silver-plated copper lead frame so that the second adhesive layer was on the copper lead frame side. The thermocompression bonding was performed under the following conditions using a thermocompression bonding tester manufactured by Nikka Equipment.
-Temperature of the hot platen: glass transition temperature of the second adhesive layer + 60 ° C (for example, when the second adhesive layer is formed by the varnish of Production Example 2, the temperature of the hot platen is 112 ° C (= 52 ° C) + 60 ° C.)).
-Crimping conditions: 10N x 10sec

Next, a silicon wafer having a thickness of 100 μm was cut into 10 × 10 mm. The cut silicon wafer was placed on the first adhesive layer, and using a thermocompression tester (manufactured by Nikka Equipment Co., Ltd.), the silicon chip was heat bonded to the copper lead frame under the following conditions.
-Temperature of hot platen: glass transition temperature on the first adhesive layer side + 60 ° C (for example, when the first adhesive layer is formed of the varnish of Production Example 1, the temperature of the hot platen is 131 ° C (= 71 ° C + 60 ° C)).
-Crimping conditions: 10N x 10sec

  Thereafter, the laminate composed of the silicon chip, the adhesive film and the silver-plated copper lead frame is heated in a furnace maintained at 180 ° C. for 1 hour, and the warpage of the silicon chip generated after standing to cool is contacted. It measured by the method of scanning on the diagonal of a silicon chip over 12 mm using the roughness measuring machine (made by Keyence).

3. Flow amount The second adhesive layer of the double-sided adhesive film obtained in each Example and Comparative Example was completely wiped off with a cloth moistened with acetone, and the support film and the first adhesive layer 2 A layered film was obtained. The two-layer film is accurately cut into a size of 10 mm × 10 mm, and sandwiched between two slide glasses (made by MATSANAMI, 76 mm × 26 mm × 1.0-1.2 mmt), and thermocompression bonded by Tester Sangyo Co., Ltd. Using a tester, heat pressing was performed on a hot plate under conditions of 10 MPa and 20 sec. The temperature of the hot plate at this time is the glass transition temperature of the second adhesive layer + 60 ° C. (for example, when the second adhesive layer is formed of the varnish of Production Example 2, the temperature of the hot plate is 112 ° C. (= 52 ° C. + 60 ° C.)). Then, the maximum protrusion amount of the adhesive layer from the 10 mm × 10 mm support film was measured using an Olympus metal microscope and an image analyzer. Regarding the adhesive film obtained in Comparative Example 2, since only the second adhesive layer cannot be wiped off with acetone, the varnish of Production Example 1 is applied onto the peeled polyethylene terephthalate film and dried. The flow amount was determined using an adhesive film having a thickness of 50 μm. At that time, the maximum protrusion amount of the adhesive layer from a polyethylene terephthalate film having a size of 10 mm × 10 mm was measured instead of the support film.

4. Film thickness change A test piece having a size of 10 mm × 10 mm was accurately cut out from the double-sided adhesive films obtained in the examples and comparative examples. The thickness of the test piece was measured five points by a dial gauge, and the average value was used as the H _0. Thereafter, the test piece was sandwiched between Teflon sheets and hot-pressed on a hot plate using a thermocompression tester manufactured by Tester Sangyo Co., Ltd. under the conditions of 1 MPa and 20 sec. The temperature of the hot plate at that time is the glass transition temperature of the first adhesive layer + 60 ° C. (for example, when the first adhesive layer is formed of the varnish of Production Example 1, the temperature of the hot plate is 131 ° C. ( = 71 ° C. + 60 ° C.)). The thickness of the double-sided adhesive film after hot pressing was measured five points by a dial gauge, and the average value was used as the H _1. The change in film thickness was calculated according to the following formula.
Film thickness change = H ₁ −H ₀

5. Surface roughness (Ra)
A test piece having a size of 10 mm × 10 mm was accurately cut out from the double-sided adhesive film obtained in each example and comparative example. The second adhesive layer side of this test piece was applied to a slide glass (manufactured by MATUNAMI, 76 mm × 26 mm × 1.0-1.2 mmt), and in that state, using a thermocompression tester manufactured by Tester Sangyo Co., Ltd., 1 MPa For 20 seconds. The temperature of the hot plate at that time is the glass transition temperature of the second adhesive layer + 60 ° C. (for example, when the second adhesive layer is formed by the varnish of Production Example 2, the temperature of the hot plate is 112 ° C. (= 52 ° C. + 60 ° C.) The arithmetic average roughness (Ra) of the surface of the second adhesive layer after hot pressing was scanned 10 mm using a contact-type roughness measuring machine (manufactured by Keyence). It was measured.

6. Void A test piece of 10 mm × 10 mm size was accurately cut out from the double-sided adhesive film obtained in each Example and Comparative Example. The test piece is sandwiched between two slide glasses (manufactured by MATSANAMI, 76 mm × 26 mm × 1.0-1.2 mmt), and the conditions are 1 MPa and 20 sec on a hot plate using a thermocompression tester manufactured by Tester Sangyo Co., Ltd. And hot pressed. The temperature of the hot plate at that time is the glass transition temperature of the first adhesive layer + 60 ° C. (for example, when the first adhesive layer is formed of the varnish of Production Example 1, the temperature of the hot plate is 131 ° C. ( = 71 ° C. + 60 ° C.)). For each of the first adhesive layer and the second adhesive layer after hot pressing, the presence or absence of voids in the adhesive layer was confirmed with an optical microscope.

7. Peel strength From the double-sided adhesive films obtained in each Example and Comparative Example, a 6 mm × 6 mm size test piece was accurately cut out. This test piece was thermocompression bonded to a 42 alloy lead frame with the second adhesive layer facing the lead frame. The thermocompression bonding was performed using a thermocompression bonding tester (manufactured by Nikka Equipment) under the following conditions.
-Temperature of the hot platen: glass transition temperature of the second adhesive layer + 60 ° C (for example, when the second adhesive layer is formed by the varnish of Production Example 2, the temperature of the hot platen is 112 ° C (= 52 ° C) + 60 ° C.)).
-Crimping conditions: 10N x 10sec

A silicon wafer having a thickness of 400 μm is cut to a depth of 250 μm from the back surface side, and then divided by applying force from the front surface side, thereby having a protruding portion having a thickness of 150 μm at the end on the wafer surface side, 5 × 5 mm A silicon chip separated into pieces of size was prepared. This silicon chip was placed on the first adhesive layer, and the silicon chip was heat-bonded to the lead frame under the following conditions using a thermocompression tester (manufactured by Nikka Equipment).
-Temperature of hot platen: glass transition temperature on the first adhesive layer side + 60 ° C (for example, when the first adhesive layer is formed of the varnish of Production Example 1, the temperature of the hot platen is 131 ° C (= 71 ° C + 60 ° C)).
-Crimping conditions: 10N x 10sec

  A laminate composed of a silicon chip, an adhesive film, and a 42 alloy lead frame obtained by thermocompression bonding was heated in a furnace maintained at 180 ° C. for 1 hour. Thereafter, the peel strength of the chip was measured when the laminate was heated on a hot plate at 260 ° C. for 20 seconds.

  The double-sided adhesive film of Comparative Example 1 has a total thickness of 100 μm as in Examples 1 to 3, but does not include a support film, so the heat shrinkage rate is very large at 17%, and the flow amount The film thickness change is also large. For this reason, there is a possibility that a positional shift when the element is mounted on the substrate and a positional shift of the element in the heating process of the adhesive film after the element is mounted on the substrate may occur. Since the double-sided adhesive film of Comparative Example 2 has no Tg difference between the two adhesive layers, the flow amount of the first adhesive layer at the bonding temperature of the second adhesive layer, that is, the deformation amount is large. Moreover, the surface roughness of the first adhesive layer is large. For this reason, not only does the adhesive layer flow more easily when the element is mounted and the positional deviation is likely to occur, but the surface of the adhesive layer becomes rough, and there is a possibility that stable adhesive strength cannot be obtained after the element is mounted. In the double-sided adhesive film of Comparative Example 3, although the difference in Tg between the two adhesive layers is 10 ° C. or higher, the Tg of the first adhesive layer exceeds 100 ° C. It is necessary to crimp. Therefore, the chip warpage is large, and voids are generated when the second adhesive layer is exposed to a high temperature, and the thickness change of the adhesive layer is large. For this reason, there is a possibility that the element is displaced due to chip warpage. Furthermore, the variation in the mounting height of the element may increase due to the thickness change caused by the void. The double-sided adhesive film of Comparative Example 4 has a thermal contraction rate as large as 1.5% because the linear expansion coefficient of the support film is 100 ppm or more. For this reason, there is a possibility that the element is displaced in the heating process of the adhesive film after the element is mounted on the substrate.

  On the other hand, according to the double-sided adhesive film of Example 1-3, the influence of the difference in coefficient of linear expansion of the element was suppressed, and as a result, warpage could be suppressed. In addition, deformation of the double-sided adhesive film due to heat during crimping was also suppressed. Furthermore, shrinkage and expansion of the adhesive film itself in the heating process of the adhesive film after mounting the element on the substrate could be suppressed. And from the value of peel strength, it was also confirmed that the adhesive film of Example 1-3 has a necessary adhesive strength when used for a semiconductor package or a MEMS module.

  The double-sided adhesive film according to the present invention includes one or both of a semiconductor element such as an IC, LSI, LED, and discrete semiconductor, and a MEMS element as a lead frame, a ceramic substrate, a glass epoxy substrate, a BT substrate, a polyimide substrate, and a liquid crystal polymer. It can be suitably used for bonding to a substrate such as a substrate.

  DESCRIPTION OF SYMBOLS 1 ... Double-sided adhesive film, 1a ... Adhesion layer, 2 ... Electronic component module, 3 ... 10 ... Support film, 11 ... Hot plate, 12 ... 42 Alloy frame fixing jig, 13 ... Sample fixing part, 21 ... First Adhesive layer, 22 ... second adhesive layer, 31, 32 ... cover film, 40 ... substrate, 45 ... element.

Claims (4)

A support film;
A first adhesive layer laminated on one side of the support film;
A second adhesive layer laminated on the other side of the support film;
With
The glass transition temperature after curing of the first adhesive layer and the second adhesive layer is 100 ° C. or less,
The glass transition temperature after curing of the first adhesive layer is 10 ° C. higher than the glass transition temperature after curing of the second adhesive layer,
The support film have a coefficient of linear expansion below 100 ppm,
The support film is made of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyacetal, polycarbonate, polyethersulfone, polyphenylene sulfide, polyphenylene ether, polyetheretherketone, polyarylate and liquid crystal polymer. A polymer film selected from
The first adhesive layer contains a curing agent for polyimide resin, epoxy resin and epoxy resin,
The second adhesive layer contains a polyimide resin, an epoxy resin and an epoxy resin curing agent, or contains an epoxy resin, an epoxy resin curing agent and an epoxy-containing acrylic rubber,
Double-sided adhesive film. It said first adhesive layer further contains a full filler, double-sided adhesive film of claim 1. The second adhesive layer further contains a full filler, double-sided adhesive film of claim 1. A substrate, a plurality of elements selected from a semiconductor element and a MEMS element mounted on the substrate, and an adhesive layer interposed between the substrate and the element, wherein the adhesive layer comprises: An electronic component module formed from the double-sided adhesive film according to claim 3 .

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