JP2010073291A - Cutting method of layered product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting method of a layered product which can cut, without generating a crack of a hard thin film, a layered product wherein the thin hard film harder than its substrate is formed on the surface of a lengthy substrate. <P>SOLUTION: Cutting is performed by rotating a circular blade 42 in which a tip angle θ is 20-45 degrees and a curvature radius of a tip 42a is 0.5 μm or less in the same direction as the conveyance direction of the layered product 10 from a face side of the hard thin film 14 of the layered product 10. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for cutting a laminate, and more particularly, to a method for cutting a laminate in which a long thin support is formed with a hard thin film that is harder and thinner than the support.

  In various devices such as optical devices, display devices such as liquid crystal displays and organic EL displays, semiconductor devices, and thin film solar cells, as functional films (functional sheets), gas barrier films, protective films, optical filters, antireflection films, etc. Optical films are used. As an example of such a functional film, an organic film mainly composed of a polymer is formed on a flexible substrate such as a plastic film, and an inorganic film made of an inorganic material is formed thereon by a vacuum film forming method. A functional film (laminate) formed as a hard thin film is known.

Thus, the laminated body in which the hard thin film was formed on the flexible base material has been conventionally cut by shear cutting (including a gobber), guillotine, Thomson, punching, or the like. Moreover, in the film manufacturing apparatus which manufactures a laminated body, the cutting process cut | judged in a longitudinal direction according to a product width is performed. This cutting process is generally performed by passing a long film between the rotating lower blade and the rotating upper blade (for example, Patent Documents 1 to 3).
JP-A-6-168444 JP-A-8-279148 JP-A-9-153212

  However, in such cutting, when a laminated body having a hard thin film such as the inorganic film described above is cut, the hard thin film may break. When the hard thin film is cracked, there is a problem that the quality of the product is deteriorated or the broken pieces are reattached to the film surface.

  This invention is made in view of such a situation, and it aims at providing the cutting method of the laminated body which can cut a laminated body, without generating the crack of a hard thin film.

  In order to achieve the above object, the invention of claim 1 is a method of cutting a laminate in which a hard thin film that is harder and thinner than the support is formed on the surface of the elongated support, and the tip angle is A circular blade having a radius of curvature of 20 to 45 ° and having a radius of curvature of 0.5 μm or less is cut from the hard thin film surface side of the laminate in the same direction as the transport direction of the laminate. Features.

  The inventor of the present invention has obtained the knowledge that, as a cause of occurrence of cracking of the hard thin film in the cutting process, the support is greatly deformed at the time of cutting, and the hard thin film cannot catch up with the deformation of the support. And the inventor of this invention is the conveyance direction of this laminated body from the hard thin film surface side of a laminated body for the circular blade whose tip angle is 20-45 degrees and the curvature radius of a front-end | tip is 0.5 micrometer or less. It has been found that it is only necessary to rotate and cut in the same direction.

  According to claim 1, a circular blade having a tip angle of 20 to 45 ° and a radius of curvature of the tip of 0.5 μm or less is the same as the transport direction of the laminate from the hard thin film surface side of the laminate. By rotating in the direction and cutting, it is possible to provide a method for cutting a laminate in which cracking of the hard thin film is suppressed.

  According to a second aspect of the present invention, in the first aspect of the invention, the hard thin film is provided in a plurality of layers.

  According to claim 2, even when a plurality of hard thin films are provided, a laminate in which cracking of the hard thin film is suppressed can be obtained.

  A third aspect of the invention is characterized in that, in the first or second aspect of the invention, the laminate has a buffer layer softer than the hard thin film as a lower layer of the hard thin film.

  According to the third aspect, since the buffer layer is provided in the lower layer of the hard thin film, a laminated film in which cracking of the hard thin film is further suppressed can be obtained.

  The invention of claim 4 is the invention according to any one of claims 1 to 3, wherein the laminated body is supported by a cylindrical roller on which the circular blade enters a groove on which the hard thin film is not formed. The cutting is performed.

  In the present invention, the laminate can be cut in the air, but the back side of the laminate that is not formed with a hard thin film is cut while being supported by a cylindrical roller into which a circular blade enters a groove. It is preferable.

  According to the present invention, there is provided a laminate in which a laminate in which a hard thin film that is harder and thinner than the support is formed on the surface of a long support can be cut without causing cracks in the hard thin film. A cutting method can be provided.

  Preferred embodiments of the laminate cutting method of the present invention will be described below with reference to the accompanying drawings. First, the laminated body suitable for cutting with the cutting method of the laminated body of this invention is demonstrated.

  FIG. 1 is a conceptual diagram of a laminate. In the laminate 10 shown in the figure, an organic film 12 mainly composed of a predetermined polymer is formed (formed) on the surface of a base material F (film raw fabric), and a vacuum film is formed on the organic film 12. An inorganic film 14 is formed by a film method.

  The type of the substrate F is not particularly limited, and the organic film 12 and the inorganic film 14 can be formed by vacuum film formation, such as various resin films such as a PET film, various metal sheets such as an aluminum sheet. If it is, all the various base materials (base film) currently utilized for various functional films, such as a gas barrier film, an optical film, and a protective film, can be utilized. Moreover, the base material F may have a surface on which various films such as a protective film and an adhesive film are formed.

  The organic film 12 is a film mainly composed of a radiation curable monomer or oligomer. Specifically, the monomer or oligomer used is preferably a monomer or oligomer that has two or more ethylenically unsaturated double bonds and undergoes addition polymerization upon irradiation with light. Examples of such monomers and oligomers include compounds having at least one addition-polymerizable ethylenically unsaturated group in the molecule and having a boiling point of 100 ° C. or higher at normal pressure. Examples include monofunctional acrylates and monofunctional methacrylates such as polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate and phenoxyethyl (meth) acrylate; polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) ) Acrylate, trimethylolethane triacrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane diacrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, di Pentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, hexane All di (meth) acrylate, trimethylolpropane tri (acryloyloxypropyl) ether, tri (acryloyloxyethyl) isocyanurate, tri (acryloyloxyethyl) cyanurate, glycerin tri (meth) acrylate; multifunctional such as trimethylolpropane and glycerin Polyfunctional acrylates and polyfunctional methacrylates such as those obtained by adding ethylene oxide or propylene oxide to alcohol and then (meth) acrylated can be mentioned.

  Further, urethane acrylates described in JP-B-48-41708, JP-B-50-6034 and JP-A-51-37193; JP-A-48-64183, JP-B-49-43191 And polyester acrylates described in JP-B-52-30490; polyfunctional acrylates and methacrylates such as epoxy acrylates which are reaction products of epoxy resin and (meth) acrylic acid.

  Among these, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and dipentaerythritol penta (meth) acrylate are preferable. In addition, “polymerizable compound B” described in JP-A-11-133600 can also be mentioned as a preferable example.

  Examples of the photoinitiator or photoinitiator system used include vicinal polyketaldonyl compounds disclosed in US Pat. No. 2,367,660 and acyloin described in US Pat. No. 2,448,828. Ether compounds, aromatic acyloin compounds substituted with α-hydrocarbons described in US Pat. No. 2,722,512, polynuclear quinone compounds described in US Pat. Nos. 3,046,127 and 2,951,758, US Pat. No. 3549367, a combination of a triarylimidazole dimer and a p-aminoketone, a benzothiazole compound and a trihalomethyl-s-triazine compound described in JP-B-51-48516, US Pat. No. 4,239,850 Trihalomethyl-triazine compounds described, USA And tri halomethyl oxadiazole compounds as described in Patent No. 4,212,976 A1. In particular, trihalomethyl-s-triazine, trihalomethyloxadiazole, and triarylimidazole dimer are preferable.

In addition, “polymerization initiator C” described in JP-A-11-133600 can also be mentioned as a preferable example. The amount of the photopolymerization initiator used is preferably 0.01 to 20% by mass, more preferably 0.5 to 10% by mass, based on the solid content of the coating solution. Light irradiation for the polymerization of the liquid crystalline compound is preferably performed using ultraviolet rays. The irradiation energy ^is preferably ^{20mJ / cm 2 ~50J / cm 2} , further preferably 100 to 2000 mJ / cm ^2. In order to accelerate the photopolymerization reaction, light irradiation may be performed under heating conditions.

  Examples of a method for forming the organic film 12 include a normal solution coating method, a vacuum film forming method, and the like. Examples of the solution coating method include a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, a slide coating method, or a hopper described in US Pat. No. 2,681,294. It can apply | coat by the extrusion-coating method which uses-. After coating, it is preferable to dry the coating solution with a heater or hot air, and then to irradiate with UV (ultraviolet rays) to polymerize the radiation curable monomer or oligomer.

In addition, acrylate and methacrylate are subject to polymerization inhibition by oxygen in the air. Therefore, in the present invention, when these are used as the organic film 12, it is preferable to lower the oxygen concentration or oxygen partial pressure during polymerization. When the oxygen concentration during polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less. When the oxygen partial pressure during polymerization is reduced by the decompression method, the total pressure is preferably 1000 Pa or less, and more preferably 100 Pa or less. In addition, it is particularly preferable to perform ultraviolet polymerization by irradiating energy of ² J / cm ² or more under a reduced pressure condition of 100 Pa or less.

  In the present invention, the polymerization rate of the monomer is preferably 80% or more, more preferably 85% or more, and further preferably 90% or more. The polymerization rate here means the ratio of the reacted polymerizable groups among all polymerizable groups in the monomer mixture (for example, acrylate and methacrylate, acryloyl group and methacryloyl group).

  The organic film 12 is preferably smooth and has a high film hardness. The smoothness of the organic film 12 is preferably 10 nm or less, and more preferably 2 nm or less, as an average roughness (Ra value) of 10 μm square.

Furthermore, the film hardness of the organic film 12 preferably has a certain degree of hardness. The preferable hardness is preferably 100 N / mm ² or more, and more preferably 200 N / mm ² or more as the indentation hardness when measured by the nanoindentation method. The pencil hardness is preferably HB or higher, more preferably H or higher.

  The kind of the inorganic film 14 is not particularly limited, and various inorganic materials can be used. The method for producing the inorganic film 14 is not particularly limited, but it is preferably formed by a vacuum film forming method, and for example, CVD, plasma CVD, sputtering, vacuum deposition, ion plating, or the like is used.

  The hardness of the inorganic film 14 is preferably HRC 70 or higher. Since the inorganic film 14 having such hardness is likely to be cracked at the time of cutting, the effect of the present invention becomes remarkable. Further, the thickness of the inorganic film 14 is preferably 100 nm or less, and particularly preferably 50 nm or less. Since the thin inorganic film 14 is easily cracked at the time of cutting, the effect of the present invention becomes remarkable.

  When manufacturing protective films for various devices and devices such as display devices such as organic EL displays and liquid crystal displays, a silicon oxide film or the like is formed as the inorganic film 14.

  Further, when an optical film such as a light reflection preventing film, a light reflection film, or various filters is manufactured, a film made of a material having or exhibiting a desired optical characteristic is formed as the inorganic film 14.

  In addition, the structure of a laminated body is not limited to three layers of the base material F, the organic film 12, and the inorganic film 14, The two layers of the base material F and the inorganic film 14 may be sufficient. Moreover, the structure which provided the organic film 12 of the multiple layer between the base material F and the inorganic film | membrane 14 may be sufficient. Furthermore, a configuration in which a plurality of layers including the organic film 12 and the inorganic film 14 are provided may be employed.

  FIG. 2 is a perspective view schematically showing an example of the configuration of a laminate cutting apparatus 40 to which the laminate cutting method of the present invention is applied. The cutting device 40 shown in the figure is a device that cuts the long laminate 10 with the product width. The laminated body 10 travels in the direction of the arrow in FIG. 2 by traveling means such as a feed roller 34, and a cutting device 40 is disposed on the upstream side in the traveling direction of the laminated body 10.

  FIG. 3 is a front view showing the cutting device 40 of FIG. As shown in the figure, the cutting device 40 includes a circular blade 42. The circular blade 42 is provided on the hard thin film surface side of the laminate 10. As the material of the circular blade 42, SK material, SUS material or the like is used, and tungsten carbide or the like is also preferably used.

  The circular blade 42 is formed in a thin disk shape. The circular blade 42 is rotatably supported by an apparatus main body (not shown) via a shaft 46, and the shaft 46 is disposed in parallel to the surface of the laminate. Note that the shaft 46 may be driven or rotated by a motor (not shown). The rotational direction of the circular blade 42 is the same as the traveling direction of the laminate 10. Moreover, the circumferential speed of the circular blade 42 is not particularly limited, but is set to rotate at a circumferential speed equal to the traveling speed of the laminated body 10, for example.

  And in the cutting method of the laminated body of this invention, the circular blade 42 uses the front-end | tip angle (theta) which is an acute angle of the range of 20-45 degrees, and the curvature radius of the circular blade front-end | tip 42a is 0.5 micrometer or less. .

  As described above, the present invention provides a circular blade having a tip angle of 20 to 45 ° and a radius of curvature of the tip of 0.5 μm or less from the hard thin film surface side of the laminate in the transport direction of the laminate. By rotating and cutting in the same direction, it is possible to provide a method for cutting a laminate in which cracking of the hard thin film is suppressed.

  Further, as shown in the cutting device 40 of FIGS. 2 and 3, in the present invention, a cylindrical roller having a groove 49 in which a circular blade 42 enters the back surface side of the laminate 10 on which the hard thin film is not formed. It is preferable to perform cutting while supporting at 44.

    The cylindrical roller 44 is formed in a cylindrical shape, and is rotatably supported by an apparatus main body (not shown) via a shaft 48. The cylindrical roller 44 is connected to a motor (not shown) via a shaft 48 and is rotationally driven by this motor. Although the rotation direction and peripheral speed of the cylindrical roller 44 are not particularly limited, for example, the cylindrical roller 44 is controlled to rotate in the same direction as the traveling direction of the laminated body 10 and at a peripheral speed equal to the traveling speed of the laminated body 10. .

  The circular blade 42 is disposed so that the lower end portion thereof enters the groove processing 49 (that is, overlaps when viewed from the side). For example, the overlap amount is set to be about 0.5 mm when the cylindrical roller 44 is φ10 to 12 inches.

  In the above-described embodiment, the cutting for cutting off the ear portion has been described as an example, but the same holds true for the cutting for trimming to a predetermined length.

  In the embodiment, the example in which the laminated body 10 including the base material F, the organic film 12, and the inorganic film 14 is cut is described. However, in the present invention, the present invention can be applied to cutting of a laminated body in which a plurality of inorganic films are provided. And this invention is realized also in the cutting | judging of the laminated body by which the laminated body which consists of an organic film and an inorganic film was provided in the base material F in multiple layers. That is, a circular blade having a tip angle of 20 to 45 ° and a tip radius of curvature of 0.5 μm or less is rotated from the hard thin film surface side of the laminate in the same direction as the transport direction of the laminate. By cutting, it is possible to provide a method for cutting a laminate in which cracking of the hard thin film is suppressed.

The laminated body in which conditions such as the material and thickness of the support (base material), buffer layer (organic film), and hard thin film (inorganic film) were changed was cut with the cutting device 40 of FIGS. . And about the laminated body 10 cut, the presence or absence of the crack of a hard thin film was evaluated on the following reference | standard.
X: Hard film cracks are observed with the naked eye.
(Triangle | delta): Although it cannot confirm with the naked eye, a crack is recognized with an optical microscope (x500).
○: No cracking or separation was observed even with an optical microscope (× 500).

  Table 1 shows the conditions of the laminated film and the evaluation results.

  In addition, as a condition other than Table 1, for a laminate (other than Example 4) having a support thickness of 70 μm and a buffer layer, the buffer layer material is DPHA (dipentaerythritol hexaacrylate), and the buffer layer hardness is Was Hc83, and the thickness of the buffer layer was 1.0 μm. In Table 1, PC means polycarbonate, and PET means polyethylene terephthalate.

  The cutting conditions are as follows: the tip angle θ of the circular blade 42 is 30 °, the diameters of the circular blade 42 and the cylindrical roller 44 are φ150, the thickness of the circular blade 42 is 1.0 mm, and the groove processing width of the cylindrical roller 44 is 2.0 mm. The groove processing depth of the cylindrical roller 44 is 2.0 mm, the overlap amount of the circular blade 42 and the cylindrical roller 44 is 0.25 mm, the conveying speed of the laminated body and the peripheral speed of the cylindrical roller 44 are 10 mm / min, circular The peripheral speed of the blade 42 was 10.5 m / min.

  As can be seen from Table 1, by cutting a circular blade having a tip angle of 30 ° and a radius of curvature of the tip of 0.5 μm or less from the hard thin film surface side of the laminate, the evaluation becomes “good”. Yes.

  Although not shown in the table, the same experiment was performed on the circular blade 42 having tip angles of 20 °, 45 °, and 50 °. When the tip angle was 20 ° and 45 °, the evaluation results were the same as in Table 1. However, when the tip angle was 50 °, Δ was obtained under all the conditions of Examples 1 to 4 and Comparative Examples 1 and 2. The evaluation was as follows.

  Accordingly, a circular blade having a tip angle of 20 to 45 ° and a radius of curvature of the tip of 0.5 μm or less is rotated from the hard thin film surface side of the laminate in the same direction as the transport direction of the laminate. It turned out that the crack of a hard thin film can be suppressed by cutting.

Conceptual diagram showing a laminate The perspective view which shows typically the structure of the cutting apparatus of a laminated body Front view showing the configuration of the laminate cutting apparatus

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Laminated body, 12 ... Organic film (buffer layer), 14 ... Inorganic film (hard thin film) 34 ... Feed roller, 40 ... Cutting device, 42 ... Circular blade, 42a ... Circular blade tip, 44 ... Cylindrical roller, 46, 48 ... shaft, 49 ... groove processing, F ... base material (support)

Claims (4)

A method of cutting a laminate in which a hard thin film that is harder and thinner than the support is formed on the surface of a long support,
A circular blade having a tip angle of 20 to 45 ° and a tip radius of curvature of 0.5 μm or less is rotated from the hard thin film surface side of the laminate in the same direction as the transport direction of the laminate. A method for cutting a laminate, characterized by:   The said hard thin film is provided with two or more layers, The cutting method of the laminated body of Claim 1 characterized by the above-mentioned.   The said laminated body has a buffer layer softer than this hard thin film as a lower layer of the said hard thin film, The cutting method of the laminated body of Claim 1 or 2 characterized by the above-mentioned.   The back surface side where the hard thin film of the said laminated body is not formed is supported by the cylindrical roller to which the groove process in which the said circular blade enters was performed, and the said cutting is performed, The any one of Claims 1-3 characterized by the above-mentioned. The cutting method of the laminated body as described in 2.

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