JP2009197286A - Film-forming apparatus, film-forming method, functional film and film roll - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a film-forming apparatus which is inexpensive and can prevent malfunctions from occurring when winding up a long substrate; a film-forming method thereof; a functional film; and a film roll. <P>SOLUTION: The film-forming apparatus is directed at forming a predetermined film on the surface of the substrate in a vacuum chamber while transporting the long substrate to the longitudinal direction, and comprises: an evacuation means for controlling the inside of the vacuum chamber to a predetermined degree of vacuum; an end-forming section which is arranged in the vacuum chamber, folds ends in a width direction of the substrate and crimps the ends to form thick parts that are thicker than the central part of the substrate at the both ends of the substrate along the transportation direction of the substrate; and a film-forming section which is arranged in the vacuum chamber and forms the predetermined film on the surface of the substrate by using a vapor deposition film-forming method. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming apparatus, a film forming method, a functional film, and a film roll that can suppress the occurrence of problems when winding a long substrate, and in particular, to wind a long substrate at a low cost. The present invention relates to a film forming apparatus, a film forming method, a functional film, and a film roll that can suppress the occurrence of problems when removing the film.

  When winding a long substrate that has been transported in a vacuum device and subjected to processing such as surface treatment or film formation, transfer of the back surface (back surface) or contamination of foreign matter such as winding misalignment or dust This may cause scratches on the processed surface of the substrate or the surface that has been surface-treated. In particular, since air does not exist between the substrates that have been wound and stacked in a vacuum, damage due to winding misalignment and foreign matter is larger than in the atmosphere, and damage to the surface of the substrate due to scratches is large. In view of this, a method for suppressing the occurrence of scratches on the surface of the substrate when winding the substrate has been proposed (see Patent Document 1).

In Patent Document 1, (meth) acrylic compounds are aggregated in vacuum at both ends in the width direction of the polymer resin base material, and then irradiated with an electron beam or plasma to cure the acrylic compounds and cure active energy rays. A method for producing a protective film for producing a resin layer is disclosed.
In the protective film of Patent Document 1, layers thicker than portions (gas barrier layers) to be products are formed at both ends in the film width direction.
According to this Patent Document 1, an organic thin film having excellent adhesion is produced at both ends of the surface of the polymer resin base material, and the effect equivalent to that of the narlink treatment is obtained, that is, the winding tension is concentrated on both end treatment surfaces. By doing so, stress concentration and winding deviation on the film formation surface due to dust entrainment are prevented, and stable winding film formation and conveyance are realized without damaging the surface of the polymer substrate.

JP 2006-36904 A

  However, in the protective film of Patent Document 1, it is necessary to change the manufacturing conditions such as the amount of evaporation so that the film thickness at both ends and the film thickness at the center are different. There is a problem that an extra material is required for the part, resulting in an increase in cost. Furthermore, since the manufacturing process becomes complicated, it takes time to manufacture and the production efficiency is lowered.

  An object of the present invention is to solve the problems based on the above-described prior art, and at low cost, can suppress the occurrence of problems when winding a long substrate, a film forming apparatus, a film forming method, and a functional film And providing a film roll.

  In order to achieve the above object, a first aspect of the present invention is a film forming apparatus for forming a predetermined film on the surface of a substrate in a vacuum vessel while conveying a long substrate in the longitudinal direction. A vacuum exhaust means for setting the inside of the vacuum vessel to a predetermined degree of vacuum, and a thick-walled portion provided in the vacuum vessel, bent and crimped in the width direction end of the substrate, and thicker than the central portion of the substrate Are formed in the vacuum vessel, and a predetermined film is formed on the surface of the substrate by a vapor deposition method. A film forming apparatus characterized by having a portion.

  The second aspect of the present invention is a film forming apparatus for forming a predetermined film on the surface of a substrate in a vacuum vessel while conveying a long substrate in the longitudinal direction, A vacuum evacuation unit for providing a predetermined degree of vacuum, an organic layer forming unit that is provided in the vacuum container and forms an organic layer on the surface of the substrate, and is provided in the vacuum container and the organic layer is formed An end forming portion that bends and crimps an end portion in the width direction of the substrate to form a thicker portion thicker than a central portion of the substrate at both ends of the substrate along the transport direction of the substrate; And a film forming unit for forming a predetermined film on the surface of the organic layer by a vapor phase film forming method.

In this invention, it is preferable that the said edge part formation part forms an unevenness | corrugation in the surface of the said bent part, when crimping | bonding the said board | substrate or after crimping | bonding.
Furthermore, in this invention, it is preferable that the said edge part formation part has a heat roll which crimps | bonds the said board | substrate.
Furthermore, in the present invention, the organic layer preferably exhibits adhesiveness when heated to a predetermined temperature.

  According to a third aspect of the present invention, there is provided a film forming method for forming a predetermined film on the surface of the substrate in a vacuum while conveying a long substrate in the longitudinal direction, wherein the end of the substrate in the width direction is formed. Forming a thick portion thicker than the central portion of the substrate along both sides of the substrate along the transport direction of the substrate, and forming a predetermined thickness on the surface of the substrate by a vapor deposition method And a step of forming the film.

  In this invention, it is preferable that the edge part of the width direction of the said board | substrate is bend | folded to the film-forming surface side in which the said film | membrane is formed.

Moreover, in this invention, it has the process of forming an organic layer on the surface of the said board | substrate before forming the said thick part in the both ends of the said board | substrate, or after forming the said thick part in the both ends of the said board | substrate. Is preferred.
Furthermore, in the present invention, it is preferable to form irregularities on the surface of the bent portion when the substrate is pressure bonded or after pressure bonding to form the thick portion.
Further, in the present invention, it is preferable that the substrate is heated to the predetermined temperature for pressure bonding when the substrate is pressure bonded or after pressure bonding in order to form the thick portion.

  In the present invention, the organic layer preferably exhibits adhesiveness when heated to a predetermined temperature.

  A fourth aspect of the present invention has a long substrate and a functional film formed on the surface of the substrate, and the substrate is bent and crimped by bending its end in the width direction. The present invention provides a functional film characterized in that thick portions thicker than the central portion are formed at both ends of the substrate along a longitudinal direction perpendicular to the width direction of the substrate.

In the present invention, an organic layer is preferably formed between the substrate and the functional film.
In the present invention, it is preferable that the thick portion has irregularities on the surface on which the functional film is formed.

  According to a fifth aspect of the present invention, there is provided a film roll comprising the functional film of the fourth aspect of the present invention and a roll, wherein the functional film is wound around the roll. Is.

According to the film forming apparatus and the film forming method of the present invention, the end in the width direction of the substrate is bent and pressure-bonded, and thick portions thicker than the central portion of the substrate are formed at both ends of the substrate along the transport direction of the substrate. By forming the gap, a gap can be generated between the films of the substrate when the substrate is wound up during transportation, and the film of the substrate is brought into a non-contact state. For this reason, the film can be brought into a non-contact state even when a long substrate is wound up during winding. For this reason, even if foreign matter such as dust adheres to the surface of the substrate film after film formation, or foreign matter such as dust enters the surface of the substrate film during winding, a gap is formed. Generation | occurrence | production of a film | membrane being damaged, and also a film | membrane cracking is suppressed. In this way, the film can be protected without causing problems during winding.
Moreover, the thick portion is formed by bending and crimping the end portion of the substrate, and another member is bonded to form the thick portion, or applied to form the thick portion, No complicated process such as exposure is used. As described above, since the material is not formed by using a simple process and supplying materials from the outside, the apparatus configuration and the manufacturing process can be simplified, and an increase in material cost can be suppressed.

Further, in the functional film of the present invention, the thick part thicker than the central part of the substrate is one obtained by bending and crimping the end portion in the width direction of the substrate. This film can be in a non-contact state. For this reason, a film | membrane can be protected, without producing a malfunction at the time of conveyance and winding.
Furthermore, even in the film roll of the present invention, a thick part thicker than the central part of the substrate is formed at the end in the width direction of the substrate, and the film is not contacted even if a long substrate is wound up during winding State.

Hereinafter, a film forming apparatus, a film forming method, a functional film, and a film roll of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
FIG. 1 is a schematic view showing a film forming apparatus according to the first embodiment of the present invention.

The film forming apparatus 10 shown in FIG. 1 is a roll-to-roll film forming apparatus. If an organic layer is formed on the surface Zf of the substrate Z or the surface Zf of the substrate Z, the film forming apparatus 10 shown in FIG. A film having a predetermined function is formed on the surface and used for the production of a functional film such as an optical film or a gas barrier film.
The film forming apparatus 10 is an apparatus that continuously forms a film on a long substrate Z (web-like substrate Z), and basically includes a supply chamber 12 for supplying the long substrate Z, A film forming chamber 14 for forming a film f on the substrate Z; a winding chamber 16 for winding the long substrate Z on which the film f is formed; a vacuum exhausting unit (vacuum exhausting means) 32; a control unit 36; And an end portion forming portion 50. The operation of each element in the film forming apparatus 10 is controlled by the control unit 36.
In the film forming apparatus 10, the wall 15 a that partitions the supply chamber 12 and the film forming chamber 14 and the wall 15 b that partitions the film forming chamber 14 and the winding chamber 16 are slit-shaped through which the substrate Z passes. The opening 15c is formed.

In the film forming apparatus 10, a vacuum exhaust unit 32 is connected to the supply chamber 12, the film forming chamber 14, and the winding chamber 16 through a pipe 34. The inside of the supply chamber 12, the film formation chamber 14, and the winding chamber 16 is set to a predetermined degree of vacuum by the vacuum exhaust unit 32.
The supply chamber 12, the film formation chamber 14, and the winding chamber 16 are each provided with a valve (not shown) for opening the atmosphere (venting) or adjusting the exhaust amount. The supply chamber 12, the film formation chamber 14, and the winding chamber 16 are opened to the atmosphere.

The evacuation unit 32 evacuates the supply chamber 12, the film formation chamber 14, and the take-up chamber 16 to maintain a predetermined degree of vacuum, and includes a vacuum pump such as a dry pump and a turbo molecular pump.
The supply chamber 12, the film formation chamber 14, and the take-up chamber 16 are each provided with a pressure sensor (not shown) that measures the pressure inside the supply chamber 12, the film formation chamber 14, and the take-up chamber 16. ing.
In addition, there is no limitation in the ultimate vacuum degree of the supply chamber 12, the film formation chamber 14, and the winding chamber 16 by the vacuum exhaust part 32, and it should just maintain sufficient vacuum degree according to the film-forming method etc. to implement. . The evacuation unit 32 is controlled by the control unit 36.

The supply chamber 12 is a part that supplies a long substrate Z, and is provided with a substrate roll 20 and a guide roller 21.
The substrate roll 20 is for continuously sending out a long substrate Z in the longitudinal direction thereof. For example, the substrate Z is wound counterclockwise.
For example, a motor (not shown) is connected to the substrate roll 20 as a drive source. By this motor, the substrate roll 20 is rotated in the direction r to rewind the substrate Z, and in this embodiment, the substrate roll 20 is rotated clockwise to continuously send out the substrate Z along the longitudinal direction. The transport direction D of the substrate Z is the same as the longitudinal direction of the substrate Z.

The guide roller 21 guides the substrate Z to the end forming unit 50 through a predetermined transport path. The guide roller 21 is a known guide roller.
In the film forming apparatus 10 of the present embodiment, the guide roller 21 may be a driving roller or a driven roller. Further, the guide roller 21 may be a roller that acts as a tension roller that adjusts the tension when the substrate Z is transported.

Here, FIG. 2 is a schematic perspective view showing the end portion forming unit 50 of the film forming apparatus according to the first embodiment of the present invention.
The end portion forming portion 50 forms thick portions α that are thicker than other portions, for example, the central portion Zc, at both ends Zv (see FIG. 2) in the width direction W orthogonal to the longitudinal direction of the substrate Z. And has a bent portion 52 and a crimping portion 54.
As shown in FIG. 2, the bent portion 52 folds both end portions Ze in the width direction W of the substrate Z toward the center portion Zc of the substrate Z in the width direction W. The bent portion 52 is provided in the transport path of the substrate Z. The bent portion 52 includes a trapezoidal base 52a whose length in the width direction W is sequentially shortened along the transport direction D, that is, a trapezoidal base 52a whose width is sequentially narrowed along the transport direction D, and the base A guide plate 52b is provided along each remaining side of 52a that is not parallel.

  The substrate Z is inserted through the wide end 53a of the base 52a between the two guide plates 52b with the surface Zf of the substrate Z facing away from the base 52a. At this time, the end portions Ze on both sides of the substrate Z are in contact with the guide plates 52b, respectively, and when the substrate Z is further transported in the transport direction D, the end portions Ze are formed along the guide plates 52b. It is bent toward the central portion Zc of the surface Zf. And it discharges | emits in the state which edge part Ze of the board | substrate Z touched the surface Zf of the board | substrate Z from the edge part 53b of the narrow side of the base 52a of the bending part 52 (refer Fig.3 (a)).

The crimping part 54 fixes and integrates the bent end Ze to the surface Zf of the substrate Z.
The crimping part 54 uses, for example, thermocompression bonding, and has a roller pair including a heat roller 56 and a pressure roller 58. By passing the end Zv of the substrate Z with the end portion Ze bent between the heat roller 56 and the pressure roller 58, the end portion Ze is fixed to the surface Zf of the substrate Z and integrated into the thick portion α Is formed (see FIG. 3B).

The heat roller 56 can be heated to a required predetermined temperature and maintained at the time of thermocompression bonding, and is provided with heating means (not shown) therein. The start of heating of the heat roller 56, the holding temperature, and the like are also controlled by the control unit 36.
The pressure roller 58 conveys the substrate Z together with the heat roller 56, and presses the end Ze of the substrate Z against the heat roller 56 when the substrate Z is conveyed.
In the present embodiment, the thick portion α is formed on the substrate Z in this way. Since the end portion Ze is folded, it is necessary to prepare a substrate Z larger than the finally obtained size by the amount of bending.
From this crimping part 54, it is conveyed to the film-forming chamber 14 (guide roller 24).

  In the film forming apparatus of the present invention, the substrate Z is not particularly limited, and any of various substrates capable of forming a film by a vapor phase film forming method can be used. As the substrate Z, for example, various resin films such as a PET film can be used. Furthermore, an organic layer may be formed on the surface of the resin film.

As shown in FIG. 1, the film formation chamber 14 functions as a vacuum chamber, and continuously transfers the substrate Z onto the surface Zf of the substrate Z by, for example, plasma. This is a part where a predetermined film f is formed by CVD.
The film forming chamber 14 is configured by using materials used in various vacuum chambers such as stainless steel, aluminum, or aluminum alloy.

In the film forming chamber 14, two guide rollers 24 and 28, a drum 26, and a film forming unit 40 are provided.
The guide roller 24 and the guide roller 28 are arranged in parallel so as to face each other at a predetermined interval. The guide roller 24 and the guide roller 28 are arranged with respect to the transport direction D of the substrate Z. The longitudinal directions are arranged orthogonally.

  The guide roller 24 transports the substrate Z transported from the transport device 50 provided in the supply chamber 12 to the drum 26. For example, the guide roller 24 has a rotation axis in a direction orthogonal to the transport direction D of the substrate Z and is rotatable, and the guide roller 24 has an axial length longer than a length of the substrate Z in the width direction W. Also long.

The guide roller 28 conveys the substrate Z wound around the drum 26 to a guide roller 31 provided in the winding chamber 16. For example, the guide roller 28 has a rotation shaft in the axial direction and is rotatable, and the guide roller 28 has an axial length longer than the width of the substrate Z.
Further, the guide roller 24 and the guide roller 28 may be a driving roller or a driven roller. Furthermore, the guide roller 24 and the guide roller 28 may be rollers that act as tension rollers for adjusting the tension during conveyance of the substrate Z.

The drum 26 is provided below the space H between the guide roller 24 and the guide roller 28. The drum 26 is arranged with its longitudinal direction parallel to the longitudinal directions of the guide roller 24 and the guide roller 28. Furthermore, the drum 26 is grounded.
The drum 26 has, for example, a cylindrical shape, has a rotation shaft in the axial direction, and is rotatable. The length of the drum 26 in the axial direction is longer than the width of the substrate Z. In the drum 26, when the center in the width direction of the substrate Z and the center in the axial direction of the drum 26 are aligned, and the substrate Z is wound around the surface (circumferential surface), the end portions on both sides of the substrate Z are This is a region where Z is not applied.
The drum 26 is configured to transport the substrate Z in the transport direction D while holding the substrate Z at a predetermined film forming position by rotating the substrate Z around the surface (circumferential surface).

As shown in FIG. 1, the film forming unit 40 is provided below the drum 26. With the substrate Z wound around the drum 26, the drum 26 rotates and the substrate Z moves in the transport direction D. The film f is formed on the surface Zf of the substrate Z while being conveyed. Note that the substrate Z on which the film f is formed on the surface Zf is also referred to as a functional film F.
The film forming unit 40 forms a film using, for example, plasma CVD among vapor phase film forming methods, and includes a film forming electrode 42, a high frequency power supply 44, a source gas supply unit 46, and a partition unit 48. The high frequency power supply 44 and the source gas supply unit 46 of the film forming unit 40 are controlled by the control unit 36.

In the film forming unit 40, a film forming electrode 42 is provided below the film forming chamber 14 so as to face a region where the substrate Z is wound around the drum 26 with a predetermined gap S. The film forming electrode 42 is formed in, for example, a rectangular plate shape in plan view, and a plurality of holes (not shown) are formed at equal intervals on a wide surface. The film forming electrode 42 is arranged with this wide surface facing the drum 26. The film forming electrode 42 is generally called a shower electrode.
The film forming electrode 42 is connected to a high frequency power supply 44, and a high frequency voltage is applied to the film forming electrode 42 by the high frequency power supply 44.

The source gas supply unit 46 supplies, for example, a source gas for forming a film into the gap S through a plurality of holes of the film formation electrode 42 via a pipe 47. A gap S between the drum 26 and the film forming electrode 42 becomes a plasma generation space.
In the present embodiment, for example, when forming a SiO ₂ film, the source gas uses TEOS gas and oxygen gas as the active species gas.

As the source gas supply unit 46, various gas introduction means used in a plasma CVD apparatus can be used.
Further, in the source gas supply unit 46, not only the source gas but also various gases used in plasma CVD such as an inert gas such as an argon gas or a nitrogen gas and an active species gas such as an oxygen gas are used as the source gas. You may supply to the clearance gap S with gas. As described above, when a plurality of types of gases are introduced, each gas is formed through a different pipe even if the gases are mixed in the same pipe and supplied to the gap S through the plurality of holes of the film formation electrode 42. The gap 42 may be supplied through a plurality of holes in the electrode 42.
Further, the types or introduction amounts of the source gas or other inert gas and active species gas may be appropriately selected / set according to the type of film to be formed, the target film formation rate, or the like.

The partition 48 partitions the film forming electrode 42 in the film forming chamber 14.
The partition 48 includes, for example, a pair of partition plates 48a, and is disposed so that the film formation electrode 42 is sandwiched between the pair of partition plates 48a.
Each partition plate 48 a is a plate-like member extending in the length direction of the drum 26, and an end portion on the drum 26 side is bent to the opposite side to the film forming electrode 42. The partition 48 divides the gap S, that is, the plasma generation space in the film forming chamber 14.

The film forming electrode 42 is not limited to a flat plate shape. For example, various film forming electrodes can be used as long as the film can be formed by plasma CVD, such as a configuration in which a plurality of electrodes divided in the axial direction of the drum 26 are arranged. An electrode configuration is available. In view of uniformity of the electric field and plasma with respect to the substrate Z, the film-forming electrode 42 is preferably a flat-plate shower electrode having a rectangular shape in plan view as in the present embodiment.
In addition, the film forming electrode 42 and the high frequency power supply 44 may be connected via a matching box for impedance matching, if necessary.

The drum 26 may be provided with a temperature adjusting unit (not shown) for adjusting the temperature. This temperature adjustment unit is, for example, a heater provided at the center of the drum 26.
The high frequency power supply 44 can be a known high frequency power supply used for film formation by plasma CVD. Further, the high-frequency power supply 44 is not particularly limited in the maximum output and the like, and may be appropriately selected / set according to the film to be formed or the film formation rate.

  The winding chamber 16 is a part for winding the substrate Z having a film formed on the surface Zf in the film forming chamber 14, and is provided with a winding roll 30 and a guide roller 31.

The winding roll 30 is for winding the film-formed substrate Z in a roll shape, for example, clockwise.
For example, a motor (not shown) is connected to the winding roll 30 as a drive source. The take-up roll 30 is rotated by this motor, and the film-formed substrate Z is taken up.
The take-up roll 30 is rotated in the direction R for taking up the substrate Z by a motor. In this embodiment, the take-up roll 30 is rotated clockwise to continuously wind the film-formed substrate Z, for example, clockwise. take.

  The guide roller 31 guides the substrate Z transported from the film forming chamber 14 to the take-up roll 30 through a predetermined transport path. The guide roller 31 is a known guide roller. The guide roller 31 may be a driving roller or a driven roller, and the guide roller 31 may be a roller that acts as a tension roller.

In the present embodiment, thick portions α having a predetermined thickness are formed along the longitudinal direction of the substrate Z at both ends Zv in the width direction W on the surface Zf side to be formed.
When the substrate Z having this configuration is wound around the winding roll 30 with the surface Zf of the substrate Z facing the surface 30a of the winding roll 30, the thick wall portion α causes the gap between the substrate Z and the winding roll 30. And a gap β is generated between the substrate Z and the film f of the substrate Z and the back surface Zb of the substrate Z are not in direct contact (see FIG. 3D).

Next, the operation of the film forming apparatus 10 of this embodiment will be described.
In the film forming apparatus 10, after passing a long substrate Z through a predetermined path from the supply chamber 12 through the film formation chamber 14 to the winding chamber 16, the supply chamber 12, the film formation chamber 14, and the winding chamber 16 are passed. The inside of the chamber is kept at a predetermined degree of vacuum by the evacuation unit 32, and in this state, a film is deposited on the substrate Z in the deposition chamber 14 while being transported from the supply chamber 12 to the winding chamber 16 through the long substrate Z. To form.

In the film forming apparatus 10, the insides of the film forming chamber 14 and the winding chamber 16 are brought to a predetermined degree of vacuum by the vacuum exhaust unit 32.
Next, the long substrate Z is transferred from the substrate roll 20 wound, for example, counterclockwise to the film forming chamber 14 via the transfer device 50. In the film forming chamber 14, the film is conveyed to the winding chamber 16 through the guide roller 24, the drum 26, and the guide roller 28. In the winding chamber 16, the long substrate Z is wound around the winding roll 30 through the guide roller 31.

At the time of film formation, in the end portion forming unit 50, the substrate Z is inserted between the two guide plates 52b from the wide end portion 53a of the base portion 52a of the bent portion 52, and the end portion Ze of the substrate Z is guided. As shown in FIG. 3A, the plate 52b is bent toward the surface Zf of the substrate Z, and from the narrow end 53b of the base 52a of the bent portion 52 to the end Ze of the substrate Z. Is discharged in contact with the surface Zf of the substrate Z.
Then, as shown in FIG. 3B, the end Zv of the substrate Z is passed between the heat roller 56 and the pressure roller 58 of the pressure-bonding portion 54 in a state where the end Ze is bent. Ze is fixed to the surface Zf of the substrate Z and integrated to form the thick portion α.

In this way, with the thick portion α thicker than the central portion Zc of the substrate Z formed at the end Zv of the substrate Z, next, in the film forming unit 40, a high frequency voltage is applied to the film forming electrode 42 from the high frequency power supply 44. While being applied, a raw material gas for forming a predetermined film f is supplied from the raw material gas supply unit 46 to the gap S through the pipe 47.
When electromagnetic waves are radiated around the film forming electrode 42, plasma localized in the vicinity of the film forming electrode 42 is generated in the gap S, and the source gas is excited and dissociated. As a result, as shown in FIG. 3C, a predetermined film f is formed on the surface Zf of the central portion Zc sandwiched between the thick portions α in the substrate Z.

  Sequentially, the substrate roll 20 on which the long substrate Z is wound counterclockwise is rotated clockwise by the motor, and the long substrate Z is continuously fed out, and the drum 26 generates plasma on the substrate Z. The film 26 is continuously formed on the surface Zf of the central portion Zc sandwiched between the thick portions α in the substrate Z by rotating the drum 26 at a predetermined speed while maintaining the position. Then, through the guide roller 28 and the guide roller 31, the long substrate Z formed on the take-up roll 30 is taken up with the film f formed on the surface 30a of the take-up roll 30 being directed, As shown in FIG.3 (d), the winding member (film roll) 100 is obtained. Even if the long substrate Z (functional film F) wound around the winding member 100 and having the film f formed thereon is used as a final product such as the functional film F as it is, Further, processing such as film formation and cutting may be performed. When processed, it is provided to the next step as a functional film roll.

In the film forming apparatus 10 of this embodiment, after the substrate Z formed on the surface Zf is wound on the winding roll 30, the winding chamber 16 is in a vacuum state in order to take out the obtained winding member 100. From the atmosphere. Thereafter, after the winding chamber 16 reaches atmospheric pressure, the winding member 100 is taken out.
In this way, the end portion Ze of the substrate Z is bent and pressure-bonded to form the thick portion α at the end Zv of the substrate Z, and the predetermined film f is formed on the surface Zf of the central portion Zc. A film F is obtained, and the functional film F is further wound to obtain a winding member (film roll) 100.

In this embodiment, by forming the thick part α at the end Zv of the substrate Z, the film f is rubbed by contact with a guide roller, a pass roller, and the like when being transported after the film f is formed. Sticking is suppressed.
Further, by forming the thick portion α at the end Zv of the substrate Z, gaps β are formed between the substrate Z and the surface 30a of the take-up roll 30, and between the substrates Z. Is in a non-contact state. For this reason, the film f can be brought into a non-contact state even when the long substrate Z is wound at the time of winding. For this reason, even if foreign matter such as dust adheres to the surface of the film f of the substrate Z after film formation or foreign matter such as dust enters the surface of the film f of the substrate Z during winding, a gap β is formed. Generation | occurrence | production of the film | membrane f being damaged by foreign materials, such as dust, and also the film | membrane f cracking is suppressed.

Moreover, in the present embodiment, the thick portion α is formed by bending and crimping the end portion Ze of the substrate Z, and another member is bonded to form the thick portion α, Or, complicated processes such as coating and exposure are not used to form the thick portion α.
Thus, since it is not formed by using a simple process and supplying materials from the outside, it is possible to simplify the apparatus configuration and to suppress an increase in material cost. In this embodiment, the film f formed on the surface Zf of the substrate Z is formed with a thick portion α in a simple process without incurring costs, and after film formation and winding as described above. Sometimes the film f can be protected without causing problems.

  Thus, since it is possible to suppress problems at the time of transportation or winding at low cost, for example, when producing an optical film by forming a thin film on the surface of a resin film, due to scratches or deformation, Generation of light scattering and a decrease in transmittance can be prevented, and an optical film having a predetermined quality can be manufactured.

In the present embodiment, the thick portion α is simply thick. However, the present invention is not limited to this. For example, it may have air permeability in the width direction W.
What has air permeability in this width direction W can be formed by the 2nd crimping | compression-bonding part 54a as shown to Fig.4 (a) and (b), for example.

The second pressure-bonding portion 54a is different from the heat-roller 56 of the pressure-bonding portion 54 only in that a heat roller 60 in which a convex portion 62 having a triangular cross section as viewed from the axial direction is formed on the surface 60a. Other than that, the configuration is the same as that of the crimping portion 54.
As shown in FIG. 4C, the surface of the bent end Z of the substrate Z, that is, the thick portion α, is formed by the second crimping portion 54a (the surface Zf side of the substrate Z). ), A concave / convex pattern 64 reflecting the shape of the convex portion 62 is formed along the longitudinal direction. When this jagged pattern 64 is formed in the thick part α, when the substrates Z are stacked, the jagged tips prevent contact between the substrates Z and form a gap β (see FIG. 3D). Further, the concave portion of the jagged pattern 64 communicates with the gap β. For this reason, the air permeability in the width direction W is ensured, the gas G passes through the gap β between the concave portion and the substrate Z, and the winding member 100 has air permeability in the width direction W.
In addition, the uneven | corrugated pattern 64 is not limited to a thing with a triangular cross section as shown in FIG.4 (b). For example, uneven patterns 64a and 64b as shown in FIGS. 5A and 5B may be used.

5 (a), a convex / concave pattern 64a having a rectangular cross section and a concave section 66b having a rectangular cross section are continuously provided along the transport direction D of the substrate Z, that is, along the longitudinal direction of the substrate Z. It may be formed.
In this pattern 64a, the projections 66a prevent the substrates Z from contacting each other, and the recesses 66b ensure the air permeability in the width direction W. The gas G is supplied from the recess 66b to the gap β between the substrates Z, and the winding member 100 has air permeability in the width direction W.

  Furthermore, as shown in FIG. 5B, a pattern 64b having a plurality of quadrangular pyramidal projections 68 may be used. In this case, the projections 68 prevent the substrates Z from contacting each other. In addition, since a gap is generated between the inclined surfaces of the respective quadrangular pyramidal projections 68, the gas G passes through the gap, thereby ensuring the air permeability in the width direction W. The gas G is supplied from the gap between the convex portions 68 to the gap β between the substrates Z, and the winding member 100 has air permeability in the width direction W.

  In the pattern 64b shown in FIG. 5B, the convex portion 68 has a quadrangular pyramid shape, but is not limited thereto, and may be a triangular pyramid, a cone, or the like. In the case of a prism, each convex portion is arranged with a gap.

  In the present embodiment, as described above, the substrate Z is wound in the winding chamber 16 maintained at a predetermined degree of vacuum by adopting a configuration in which the winding member 100 has air permeability in the width direction W. When the take-up member 100 is taken out from the vacuum after being wound on the roll 30 and released to the atmosphere, the gas G may pass through the gap β of the substrate Z when the take-up chamber 16 is released from the vacuum to the atmosphere. it can. For this reason, the grade by which the pressure of the clearance gap β of the winding member 100 becomes lower than the pressure outside the winding member 100 is suppressed. For this reason, the central portion Zc of the substrate Z in the winding member 100 is prevented from falling to the surface 30a side of the winding roll 30 due to the pressure fluctuation outside the winding member 100 when the atmosphere is released. For this reason, generation | occurrence | production of the wrinkle in the board | substrate Z, the generation | occurrence | production of a crack in the formed film | membrane f, etc. are suppressed. In this way, deformation and damage of the substrate Z when the atmosphere is released can be suppressed.

Next, a second embodiment of the present invention will be described.
FIG. 6 is a schematic view showing a film forming apparatus according to the second embodiment of the present invention.
In the present embodiment, the same components as those in the film forming apparatus of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, in the film forming apparatus 10 a of this embodiment, the arrangement position of the end forming unit 50 is different from the film forming apparatus 10 of the first embodiment (see FIG. 1) in the transport direction D. Is formed immediately downstream of the guide roller 31 provided in the take-up chamber 16, not immediately downstream of the guide roller 21, and the thick portion α is formed on the substrate Z on the surface Zf of the substrate Z. The difference is that after f is formed, and the rest of the configuration is the same as that of the film forming apparatus 10 of the first embodiment, and a detailed description thereof will be omitted.

In the film forming apparatus 10 of the present embodiment, the film forming method is different in that the thick part α is formed after the film f is formed on the surface Zf of the substrate Z. Since the film forming method is the same as that of the first embodiment, detailed description thereof is omitted.
In the present embodiment, the only difference is that the thick part α is formed after the film f is formed on the surface Zf of the substrate Z. Therefore, the film forming apparatus and the film forming method of the first embodiment are the same. An effect can be obtained.
In the present embodiment, since the film f is formed before the thick part α is formed, the end part Ze of the substrate Z is bent in a state where the film f is formed. Therefore, a mask may be provided in the film forming unit 40 so that the film f is not formed on the end portion Ze of the substrate Z.

Next, a third embodiment of the present invention will be described.
FIG. 7 is a schematic view showing a film forming apparatus according to the third embodiment of the present invention.
In the present embodiment, the same components as those of the film forming apparatus of the first embodiment shown in FIGS.

  As shown in FIG. 7, the film forming apparatus 10 b of this embodiment is organic between the supply chamber 12 and the film forming chamber 14 as compared with the film forming apparatus 10 of the first embodiment (see FIG. 1). The layer forming chamber 70 and the end forming chamber 72 are provided, and the layout of each element in the supply chamber 12, the film forming chamber 14, and the winding chamber 16 is different. Since it is the same structure as the film-forming apparatus 10 of 1 embodiment, the detailed description is abbreviate | omitted.

  In the present embodiment, the supply chamber 12 is arranged so that the substrate Z is drawn downward from the substrate roll 20, except that the guide roller 21 is not provided. The configuration is the same as in the first embodiment.

The supply chamber 12 and the organic layer forming chamber 70 are partitioned by a wall 74, and a slit-shaped opening 74a through which the substrate Z passes is formed.
The organic layer forming chamber 70 is for forming an organic layer (organic film) 90 mainly composed of a polymer on the surface Zf of the substrate Z, and includes a guide roller 21 a and an organic layer forming unit 80.
The organic layer forming unit 80 forms an organic layer 90 by flash vapor deposition, and includes a polymer nozzle 82 and a UV irradiation device 84. For this reason, the inside of the organic layer forming chamber 70 is evacuated, and is connected to the vacuum exhaust part 32.
The flash vapor deposition method of this embodiment is particularly useful because it has the effect of reducing dissolved oxygen in the monomer and can increase the polymerization rate.

  The guide roller 21 a conveys the substrate Z wound up by the substrate roll 20 to the organic layer forming unit 80. The guide roller 21a has the same configuration as the guide roller 21 of the first embodiment, and detailed description thereof is omitted.

When forming the organic layer 90, the inside of the organic layer forming chamber 70 is depressurized to a predetermined pressure (degree of vacuum) by the vacuum exhaust part 32.
The monomer nozzle 82 applies a paint containing a monomer, which will be described later, prepared in advance to the surface of the substrate Z under such a reduced pressure. Thereby, the coating film by flash vapor deposition is formed on the surface of the substrate Z.

The UV irradiation device 84 is for irradiating UV light (ultraviolet rays) onto the flash-deposited coating film to polymerize the monomer and form the organic layer 90.
The available light sources and irradiation energy are as described later. Further, the monomer polymerization method is not limited to the UV irradiation of the present embodiment, and various methods can be used.

Here, the organic layer 90 is a film containing a polymer as a main component.
Specifically, as the polymer used for the organic layer 90, polyester, acrylic resin, methacrylic resin (hereinafter, acrylic resin and methacrylic resin are also referred to as acrylate polymer), methacrylic acid-maleic acid copolymer, polystyrene, Transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamideimide, polyetherimide, cellulose acylate, polyurethane, polyetheretherketone, polycarbonate, alicyclic polyolefin, polyarylate, polyethersulfone, polysulfone, fluorene ring-modified polycarbonate A film of thermoplastic resin such as alicyclic modified polycarbonate, fluorene ring modified polyester, acryloyl compound, or polysiloxane or other organic silicon compound.
The organic layer 90 may be made of a single material or a mixture. Two or more organic films may be stacked. In this case, each layer may have the same composition or a different composition. Further, as disclosed in US Patent Publication No. 2004-46497, a film in which the interface with the inorganic layer is not clear and the composition continuously changes in the film thickness direction may be used.

The organic layer 90 is preferably smooth and has a high film hardness. The smoothness of the organic layer 90 is preferably 10 nm or less, and more preferably 2 nm or less, as an average roughness (Ra value) of 10 μm square.
It is preferable that the film hardness of the organic layer 90 has a certain degree of hardness. Preferred hardness, 100 N / mm ² or more is preferable as the indentation hardness as measured by nanoindentation method, 200 N / mm ² or more is more preferable. The pencil hardness is preferably HB or higher, more preferably H or higher.
The thickness of the organic layer 90 is not particularly limited, but if it is too thin, it will be difficult to obtain film uniformity, and if it is too thick, cracks will be generated due to external forces and the barrier performance will be reduced. From this viewpoint, the thickness of the organic layer 90 is preferably 10 nm to 2 μm, and more preferably 100 nm to 1 μm.

The method for forming the organic layer 90 is not particularly limited, and a normal solution coating method, a vacuum film forming method, or the like can also be used.
Examples of the solution coating method include a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, a slide coating method, or a hopper described in US Pat. No. 2,681,294. It can apply | coat by the extrusion-coating method which uses-. The organic layer can also be formed by applying and curing a commercially available polymerizable adhesive.
Although there is no restriction | limiting in particular as a vacuum film-forming method, Film-forming methods, such as vapor deposition and plasma CVD, are preferable. Also in the flash vapor deposition method, the methods described in US Pat. No. 4,842,893, US Pat. No. 4,954,371 and US Pat. No. 5,034,461 are particularly preferable.
In the present invention, as a method for forming the organic layer 90, a polymer may be formed by applying a solution, or as disclosed in JP 2000-323273 A and JP 2004-25732 A. A hybrid coating method containing an inorganic substance may be used. Further, the organic layer 90 may be formed by a method of forming a polymer layer by polymerizing a polymer precursor, for example, a monomer, after forming the film.

In the present invention, preferred monomers that can be used for forming the organic layer 90 include acrylates and methacrylates, and commercially available adhesives. That is, in the present invention, the organic layer 90 is preferably composed mainly of a polymer obtained by polymerizing an acrylate monomer and / or a methacrylate monomer having an ethylenically unsaturated bond. In particular, when an acrylate monomer and / or a methacrylate monomer are used for the purpose of avoiding inconvenience in a vacuum described later, it is preferable to use a monomer having a molecular weight of 700 or less, particularly 150 to 600.
Examples of commercially available adhesives include Nagase ChemteX XNR-5000 series.
Preferable examples of acrylates and methacrylates include, for example, compounds described in US Pat. No. 6,083,628 and US Pat. No. 6,214,422.

Although there is no particular limitation on the monomer polymerization method, heat polymerization, light (ultraviolet ray, visible light) polymerization, electron beam polymerization, plasma polymerization, or a combination thereof is preferably used. When performing heat polymerization, the substrate B needs to have appropriate heat resistance. In this case, at least the glass transition temperature (Tg) of the substrate B needs to be higher than the heating temperature.
When carrying out photopolymerization, it is preferable to use a photopolymerization initiator in combination. As the photopolymerization initiator, Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 819, etc., commercially available from Ciba Specialty Chemicals. ), Darocure series (eg, Darocur TPO, Darocur 1173, etc.), Quantacure PDO, Ezacure series (eg, Ezacure TZM, Ezacure TZT, etc.) commercially available from Sartomer. Similarly, oligomer type Ezacure KIP series and the like can be mentioned.

In the UV irradiation device 84, the light to be irradiated is usually ultraviolet light from a high pressure mercury lamp or a low pressure mercury lamp. The irradiation energy is preferably 0.5 J / cm ² or more, and more preferably ² J / cm ² or more.
In addition, acrylate and methacrylate are subject to polymerization inhibition by oxygen in the air. Therefore, in the present invention, when these are used as the organic layer 90, it is preferable to lower the oxygen concentration or oxygen partial pressure during polymerization. When the oxygen concentration during polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less. When the oxygen partial pressure during polymerization is reduced by the decompression method, the total pressure is preferably 1000 Pa or less, and more preferably 100 Pa or less. In addition, it is particularly preferable to perform ultraviolet polymerization by irradiating energy of ² J / cm ² or more under a reduced pressure condition of 100 Pa or less.

  In the present invention, the polymerization rate of the monomer is preferably 80% or more, more preferably 85% or more, and further preferably 90% or more. The polymerization rate here means the ratio of the reacted polymerizable groups among all polymerizable groups in the monomer mixture (for example, acrylate and methacrylate, acryloyl group and methacryloyl group).

  Here, when the organic layer 90 formed by polymerizing an acrylate monomer and / or a methacrylate monomer is formed as the organic layer 90, it is preferable to reduce the oxygen concentration during the polymerization. It is as follows.

  The organic layer 90 is not limited to a single layer and may be two or more layers. In this case, each organic layer 90 may have the same composition or a different composition. When two or more organic layers 90 are formed, it is preferable that each organic film is within the above-described preferable range.

  The substrate Z on which the organic layer 90 is formed in the organic layer forming chamber 70 is then transferred to the end portion forming chamber 72. The organic layer forming chamber 70 and the end portion forming chamber 72 are partitioned by a wall 76, and a slit-like opening 76a through which the substrate Z passes is formed.

The end portion forming chamber 70 is provided with a guide roller 21 b and an end portion forming portion 50.
The guide roller 21 b conveys the substrate Z on which the organic layer 90 is formed to the bent portion 52 of the end portion forming unit 50. The guide roller 21b has the same configuration as the guide roller 21 of the first embodiment, and a detailed description thereof is omitted.
The end portion forming portion 50 is different from the first embodiment only in the layout of the bent portion 52 and the crimping portion 54, and the other configurations of the bent portion 52 and the crimping portion 54 are the first. Since it is the structure similar to the edge part formation part 50 of this embodiment, the detailed description is abbreviate | omitted.

In the present embodiment, the bent portion 52 is disposed so that the guide plate 52b (see FIG. 2) faces upward.
Further, in the crimping portion 54, the heat roller 56 is disposed on the upper side and the pressure roller 58 is disposed on the lower side as compared with the first embodiment.

  In the present embodiment, the end portion Ze of the substrate Z on which the organic layer 90 is formed on the surface Zf by the bent portion 52 of the end portion forming portion 50 is changed to the film formation surface side of the substrate Z (the surface 90a of the organic layer 90). The end Ze of the substrate Z is allowed to pass through the crimping part 54 in this state, whereby the end Ze is fixed to the surface Zf of the substrate Z and integrated to form the thick part α.

  The substrate Z on which the thick portion α is formed in the end portion forming chamber 72 is transferred to the film forming chamber 14. The edge forming chamber 72 and the film forming chamber 14 are partitioned by a wall 78, and a slit-shaped opening 78a through which the substrate Z passes is formed.

The film forming chamber 14 is a place where a predetermined film f is formed on the surface 90a of the organic layer 90 by a vacuum film forming method.
In the film forming chamber 14 of the present embodiment, two guide rollers 24a and 28a, a drum 26, and a film forming unit 40 are provided as in the first embodiment. Since the guide rollers 24a and 28a, the drum 26, and the film forming unit 40 have the same configuration as that of the first embodiment, detailed description thereof is omitted.

The two guide rollers 24a and 28a are spaced apart in the vertical direction, and the drum 26 is disposed on the side of the space H between the two guide rollers 24a and 28a.
In the film forming chamber 14 of the present embodiment, the substrate Z is transported and wound around the drum 26 in the horizontal direction, and the film is formed on the side of the film forming chamber 14. For this reason, the film-forming electrode 42a and the partition part 48 are provided not on the lower side of the film-forming chamber 14 but on the side as in the first embodiment.

  In the present embodiment, plasma localized in the vicinity of the deposition electrode 42 is generated in the gap S, and the source gas is excited and dissociated. Thereby, in the substrate Z, a predetermined film f is formed on the surface 90a of the organic film 90 of the surface Zf of the central portion Zc of the substrate Z sandwiched between the thick portions α.

  The substrate Z on which the predetermined film f is formed on the surface 90 a of the organic film 90 in the film forming chamber 14 is transferred to the winding chamber 16. The film forming chamber 14 and the winding chamber 16 are partitioned by a wall 15b, and a slit-shaped opening 15d through which the substrate Z passes is formed. The substrate Z is taken up by the take-up roll 30 while being guided by the guide roller 31 a in the take-up chamber 16. In this case, the back surface Zb of the substrate Z is wound toward the front surface 30a of the winding roll 30, and a winding member (film roll) 102 (see FIG. 8D) is obtained. Even if the long substrate Z (functional film F) wound around the winding member 102 and having the film f formed thereon is used as a final product such as the functional film F as it is, Further, processing such as film formation and cutting may be performed. When processed, it is provided to the next step as a functional film roll.

  In this embodiment, after forming the organic layer 90 on the surface Zf of the substrate Z, the thick portions α are formed on both ends Zv of the substrate Z, and the film f is formed on the surface 90a of the organic layer 90. Since the only difference is that the conductive film F is obtained, the same effects as those of the film forming apparatus and the film forming method of the first embodiment can be obtained.

  In the film forming method of the present embodiment, as shown in FIG. 8A, after the organic layer 90 is formed on the surface Zf of the substrate Z, the end Ze of the substrate Z is disposed on the side where the organic layer 90 is formed. Bend to the surface Zf side of the substrate Z. Then, as shown in FIG. 8B, thick portions α are formed at both ends Zv of the substrate Z by the crimping portion 54. And as shown in FIG.8 (c), the film | membrane f is formed in the surface 90a of this organic layer 90, and the functional film F is obtained. And the back surface Zb of the board | substrate Z of this functional film F is wound toward the surface 30a of the roll 30, and the winding member (film roll) 102 (refer FIG.8 (d)) is obtained.

  In the present embodiment, if the organic layer 90 is formed on the surface Zf of the substrate Z and the organic layer 90 exhibits adhesiveness due to the heat of the heat roller 56, the adhesion of the end Ze is high. The thickness is increased, and the thickness uniformity of the thick portion α is increased. For this reason, in this embodiment, it is preferable that the organic layer 90 exhibits adhesiveness when heated to a predetermined temperature.

  Examples of materials that exhibit adhesiveness when heated to a predetermined temperature include commercially available adhesives such as Daizonichimo Epotech series and ThreeBond 3000 series. The Ezonec series made by Daizonichimori has a UV curing and heating combined curing type, and the ThreeBond 3000 series has a heating curing type. In the case where the organic layer 90 is formed using these, after applying an adhesive to the surface Zf of the substrate Z, the adhesive Z is transported in an uncured state, and the end portion Ze of the substrate Z is further transferred. Must be folded to form the thick portion α. In this case, there is a possibility that the adhesive adheres to the roller or the like during conveyance. For this reason, when using the 3000 series made of heat-curing type three bond, the configuration of the organic forming portion 80 and the end portion forming portion 50 of the present embodiment is changed, and the organic layer is formed in the region where the end portion Ze of the substrate Z is bent. The substrate Z coated with the adhesive is conveyed by the step roller without applying the adhesive 90, and the end portion Ze is bent by the bent portion 52, and then the thick portion α is formed by the crimping portion 54. .

  Furthermore, also when using the EPOTEC series made by Daizonichimori, which is a combined curing type of UV irradiation and heating, the configuration of the organic forming unit 80 and the end forming unit 50 of the present embodiment is changed, and the end Ze of the substrate Z is changed. The substrate Z to which the adhesive is applied is conveyed by the step roller without applying the adhesive that becomes the organic layer 90 to the region to be bent, and the end portion Ze is bent at the bent portion 52, and then the crimping portion 54 The thick part α is formed while the adhesive is irradiated with UV.

Also in this embodiment, the thick portion α is formed after the organic layer 90 is formed, but the present invention is not limited to this. After the organic layer 90 is formed and the film f is formed on the surface 90a, the end portion Ze of the substrate Z can be bent to form the thick portion α as in the second embodiment.
Furthermore, also in this embodiment, as in the first embodiment, in the thick portion α, the uneven pattern reflecting the shape of the convex portion 62 on the surface on the film forming side (the surface 90a side of the organic layer 90). 64 may be formed along the longitudinal direction.

  In any of the first to third embodiments described above, the film f to be formed is not particularly limited, and the functionality to be manufactured is as long as it can be formed by a vacuum film forming method. What has the function requested | required according to the film F can be formed suitably. Further, the thickness of the film f is not particularly limited, and a necessary film thickness may be appropriately determined according to performance required according to the film f and the functional film F to be formed.

An example of the film f is an inorganic film.
For example, when a gas barrier film (water vapor barrier film) is manufactured as the functional film F, an inorganic film such as a silicon nitride film, an aluminum oxide film, or a silicon oxide film is formed as the film f.
When manufacturing protective films for various devices or devices such as display devices such as organic EL displays and liquid crystal displays as the functional film F, an inorganic film such as a silicon oxide film is formed as the film f. To do.
Further, when an optical film such as a light reflection preventing film, a light reflection film, and various filters is manufactured as the functional film F, the film f has a film having a desired optical characteristic or a desired optical characteristic. A film made of a material that expresses is formed.
Among them, in particular, due to the excellent surface smoothness and surface properties of the organic layer 90, it is possible to form an inorganic film that is dense and has very few cracks and missing, and that is excellent in smoothness and gas barrier properties. The present invention is optimal for the production of gas barrier films.

  Furthermore, the film f to be formed is not limited to a single layer, and may be a plurality of layers. When a plurality of layers of the film f are formed, each layer may be the same or different from each other.

  The film forming apparatus 10 of the present embodiment has been described by taking plasma CVD as an example, but is not limited to plasma CVD. As long as the film-forming part of this invention uses a vapor-phase film-forming method, various physical vapor deposition methods (PVD: Physical Vapor Deposition), chemical vapor deposition method (CVD: Chemical Vapor Deposition), A sputtering method, a vapor deposition method, an ion plating method, or the like can also be used.

  As described above, the film forming apparatus, the film forming method, the functional film, and the film roll of the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments, and various types can be made without departing from the gist of the present invention. Of course, improvements and changes may be made.

It is a schematic diagram which shows the film-forming apparatus which concerns on the 1st Embodiment of this invention. It is a typical perspective view which shows the edge part formation part of the film-forming apparatus which concerns on the 1st Embodiment of this invention. (A)-(d) is a schematic diagram which shows the film-forming process by the film-forming apparatus which concerns on the 1st Embodiment of this invention in process order. (A) is a schematic diagram which shows the 2nd crimping | compression-bonding part of the film-forming apparatus of the 1st Embodiment of this invention, (b) is 2nd of the film-forming apparatus of the 1st Embodiment of this invention. It is a typical side view which shows this crimping | compression-bonding part, (c) is a typical perspective view which shows the pattern formed by the 2nd crimping | compression-bonding part of the film-forming apparatus of the 1st Embodiment of this invention. (A) is a typical perspective view which shows an example of the pattern formed by the crimping | compression-bonding part of the film-forming apparatus of the 1st Embodiment of this invention, (b) is the 1st Embodiment of this invention. It is a typical perspective view which shows the other example of the pattern formed by the crimping | compression-bonding part of the film-forming apparatus. It is a schematic diagram which shows the film-forming apparatus which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the film-forming apparatus which concerns on the 3rd Embodiment of this invention. (A)-(d) is a schematic diagram which shows the film-forming process by the film-forming apparatus which concerns on the 3rd Embodiment of this invention in process order.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Film-forming apparatus 12 Supply chamber 14 Film-forming chamber 16 Wind-up chamber 20 Substrate roll 21, 21a, 24, 24a, 28, 28a, 31, 31a Guide roller 30 Wind-up roll 32 Vacuum exhaust part 36 Control part 40 Film-forming part DESCRIPTION OF SYMBOLS 42 Film-forming electrode 44 High frequency power supply 46 Source gas supply part 50 End part formation part 52 Bending part 54 Crimp part 70 Organic layer formation room 72 End part formation room 80 Organic layer formation part 82 Monomer nozzle 84 UV irradiation part 100 Winding member D Transport direction Z Substrate

Claims (15)

A film forming apparatus for forming a predetermined film on the surface of the substrate in a vacuum vessel while conveying a long substrate in the longitudinal direction,
Vacuum evacuation means for making the inside of the vacuum vessel a predetermined degree of vacuum;
An end that is provided in the vacuum vessel and that is bent and crimped in the widthwise end portion of the substrate to form thicker portions thicker than the center portion of the substrate along the transport direction of the substrate at both ends of the substrate. A part forming part;
A film forming apparatus, comprising: a film forming unit which is provided in the vacuum container and forms a predetermined film on the surface of the substrate by a vapor phase film forming method. A film forming apparatus for forming a predetermined film on the surface of the substrate in a vacuum vessel while conveying a long substrate in the longitudinal direction,
Vacuum evacuation means for making the inside of the vacuum vessel a predetermined degree of vacuum;
An organic layer forming part that is provided in the vacuum vessel and forms an organic layer on the surface of the substrate;
The end portion in the width direction of the substrate on which the organic layer is formed provided in the vacuum vessel is bent and pressure-bonded, and thick portions thicker than the center portion of the substrate are provided at both ends of the substrate in the transport direction of the substrate. An end forming part formed along
A film forming apparatus, comprising: a film forming unit which is provided in the vacuum container and forms a predetermined film on a surface of the organic layer by a vapor phase film forming method.   3. The film forming apparatus according to claim 1, wherein the end portion forming portion forms irregularities on a surface of the bent portion when the substrate is pressure-bonded or after pressure-bonding. 4.   The said edge part formation part is a film-forming apparatus of any one of Claims 1-3 which has a heat roll which crimps | bonds the said board | substrate.   The film forming apparatus according to claim 2, wherein the organic layer exhibits adhesiveness when heated to a predetermined temperature. A film forming method for forming a predetermined film on the surface of the substrate in a vacuum while conveying a long substrate in the longitudinal direction,
Bending and crimping the widthwise end of the substrate, and forming thick portions thicker than the central portion of the substrate at both ends of the substrate along the transport direction of the substrate;
And a step of forming a predetermined film on the surface of the substrate by a vapor deposition method.   The film forming method according to claim 6, wherein an end in the width direction of the substrate is bent toward a film forming surface on which the film is formed.   8. The method according to claim 6, further comprising a step of forming an organic layer on a surface of the substrate before the thick portion is formed on both ends of the substrate or after the thick portion is formed on both ends of the substrate. Film forming method.   The film forming method according to claim 6, wherein unevenness is formed on a surface of the bent portion when the substrate is pressure-bonded to form the thick-walled portion or after the substrate is pressure-bonded.   The film forming method according to claim 6, wherein the substrate is heated at the predetermined temperature for pressure bonding when the substrate is pressure-bonded or formed after pressure bonding in order to form the thick portion.   The film formation method according to claim 6, wherein the organic layer exhibits adhesiveness when heated to a predetermined temperature. Having a long substrate and a functional film formed on the surface of the substrate;
The substrate is formed such that a thick portion thicker than a central portion of the substrate is formed at both ends of the substrate along a longitudinal direction perpendicular to the width direction of the substrate. A functional film characterized by   The functional film according to claim 12, wherein an organic layer is formed between the substrate and the functional film.   The functional film according to claim 12 or 13, wherein the thick part has irregularities formed on the surface on which the functional film is formed.   A film roll comprising the functional film according to any one of claims 12 to 14 and a roll, wherein the functional film is wound around the roll.

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