JP2010069516A - Connection structure of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a connection structure of electronic equipment, by which variance of welding condition is reduced and by which deterioration of insulation is suppressed that is due to degeneration of a resin insulating member. <P>SOLUTION: The connection structure of electronic equipment includes a container 13 composed of a resin insulating member and provided with a storage space 12 for an electronic circuit board 11, a connector terminal 15 held on the container 13, and a bus bar 16 that is held by an insulating connecting member 14 made of resin and that is connected to the electronic circuit board 11, wherein the connector terminal 15 and the bus bar 16 are lap welded by a beam heat source. The lap welding is performed by protruding the tip ends of the bus bar 16 and the connector terminal 15 in one direction from the resin container 13 and the insulating connecting member 14. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connection structure for an electronic device, and more particularly to a connection structure for an electronic device having a container made of an insulating member made of resin.

  Electronic devices contain electronic circuits in which substrates or electronic components are connected to each other by conductive members such as bus bars and terminals. The structure is formed while the conductive members are insulated and retained by an insulating mold made of resin. is doing. Since the connection part between these conductive members is often provided at a complicated place, welding using a beam heat source that is non-contact and has a narrow heat-affected region is used (for example, see Patent Document 1). .

JP 2007-144436 A (FIG. 3)

  In the connection structure of the electronic device disclosed in the patent document, the welded portion is surrounded by a resin insulating member such as a control module or an insulating mold. In general, since the resin insulating member has a low evaporation temperature, the heat influence of the resin insulating member may be increased particularly in the case of a beam heat source having a high energy density.

  The problem of the conventional electronic device connection structure will be described in more detail with reference to FIG. In FIG. 9, a copper alloy bus bar 16 has one end connected to an electronic circuit board (not shown) and the other end connected to a copper alloy connector terminal 15, and the connector terminal 15 protrudes outside the device to allow other devices or circuits ( (Not shown). The bus bar 16 and the connector terminal 15 are each inserted and held in a connecting member 14 made of an insulating resin, and a resin container 13 having openings 17 and 18 formed in two directions. The bus bar 16 is irradiated with a laser beam 20 and welded.

  Here, a center line 21 (indicated by a one-dot chain line in the figure) of the laser light 20 is a fiber (not shown) that reflects the reflected light 22 (indicated by a dotted line in the figure) back to the laser emission port and guides the laser light 20 from an oscillator. In order to prevent damage to the optical fiber, an incident angle 24 is provided between the perpendicular line 23 (shown by a broken line in the figure) with respect to the bus bar 16 so as to have a reflection angle 25 so that the reflected light 22 is re-applied to the fiber. The incident is prevented.

  The laser light 20 is irradiated with the beam shape adjusted by an optical system such as a lens, but the reflected light 22 tends to have a larger distribution than the incident light due to surface conditions of the irradiated surface and variations in shape. Further, the welded portion is provided at a complicated and intricate place, and the reflected light 22 may interfere with the vicinity of the welded portion of the resin container 13, and as a result, the resin container 13 is baked to generate steam and generate laser. Since the light 20 is scattered, the welding state varies. In addition, there is a concern that the resin insulating member may be altered and the insulating performance necessary for the electronic device may be reduced.

  In order to ensure the bonding strength between the bus bar 16 and the connector terminal 15 in consideration of the variation in the welding state, the laser condition is often set as a condition for shifting to the high energy input side. However, when the laser condition is set to a condition on the high energy input side, there is a concern that the occurrence of sputtering increases. In electronic equipment, spatter adheres between terminals of electronic circuit boards and electronic components, which can cause electrical abnormalities such as short circuits, and if it adheres to connectors, etc., it can reduce connection reliability such as entrapment of foreign matter. There is a problem that causes it.

  The present invention has been made to solve the above-described problems, and provides an electronic device connection structure that reduces variations in welding state and suppresses deterioration in insulation due to deterioration of a resin insulating member. It is.

  The connection structure of the electronic device according to the present invention includes a resin insulation member, a container having a storage space for an electronic circuit, a first conductive member held by the resin insulation member, and the electronic circuit. A connection structure of an electronic apparatus, wherein the first conductive member and the second conductive member are welded together using a beam heat source, wherein the first conductive member The member and the second conductive member protrude from the resin insulating member in the same direction and are welded together.

  According to the connection structure of the electronic device according to the present invention, the region where the reflected light affects the resin insulating member can be reduced by separating the distance between the beam irradiation part and the resin insulating member. Thereby, the influence of resin vapor | steam can be reduced, while the dispersion | variation in a welding state can be reduced, and the fall of the insulation by the quality change of a resin insulation member can be suppressed.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a connection structure for an electronic device according to the invention will be described with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
1 is a cross-sectional view showing a connection structure of an electronic device according to Embodiment 1 of the present invention. In FIG. 1, an electronic device 10 stores an electronic circuit board 11 or the like that is an electronic circuit, and a first conductive member is connected to a resin container 13 having a storage space 12 or an insulating connecting member 14 made of resin. The copper alloy connector terminal 15 or the copper alloy bus bar 16 as the second conductive member is integrally held in advance by a method such as insert molding.

  The bus bar 16 is held by the insulating connecting member 14, and one end is connected to the electronic circuit board 11 and the other end is connected to the connector terminal 15. The connector terminal 15 is held by a resin container 13 having an insulating property and forming an outer frame. The connector terminal 15 protrudes outside the device and is connected to another device or circuit (not shown). The front ends of the bus bar 16 and the connector terminal 15 protrude from the resin container 13 and the insulative connecting member 14 in the same direction, and are welded by irradiating the bus bar 16 with laser light as described later.

  Here, the resin container 13 has openings 17 and 18 formed in two opposing directions, and the electronic circuit board 11 is attached after laser welding of the bus bar 16 and the connector terminal 15. The bus bar 16 and the connector terminal 15 may be inserted into the resin container 13 and held at the same time.

  The connection structure of electronic device 10 according to the first embodiment will be described in more detail with reference to FIG. In FIG. 2, a center line 21 (indicated by a dashed line in the figure) of the laser light 20 is a fiber (not shown) that reflects the reflected light 22 (indicated by a dotted line in the figure) back to the laser emission port and guides the laser light 20 from the oscillator. In order to prevent damage, the incident angle 24 is provided between the perpendicular line 23 to the bus bar 16 and the reflection angle 25 is provided so that the reflected light 22 does not re-enter the fiber.

  Here, the incident angle 24 is provided so as to be inclined toward the insulating connecting member 14 with respect to the perpendicular 23 so that the reflected light 22 returns to the side opposite to the insulating connecting member 14. The laser beam 20 on the incident side is formed into a predetermined beam shape by the optical system, and the laser beam 20 is separated from the insulating connecting member 14 by providing a predetermined distance between the irradiation position and the insulating connecting member 14. It is possible to prevent interference with the resin container 13.

  The reflected light 22 has a larger distribution than the incident light due to the surface condition and shape variation of the irradiated surface. By adopting such a structure, an insulating connecting member 14 is formed in the region affected by the reflected light 22. Or since there is no resin container 13, the beam scattering by the influence of resin vapor | steam decreases, and welding dispersion | variation can be made small. In addition, it is possible to suppress a decrease in insulation performance due to the effect of resin burning in the insulating connecting member 14 or the resin insulating member such as the resin container 13. Furthermore, it is not necessary to set a higher energy input condition, and sputtering can be reduced. Note that the bus bar 16 may be disposed on the back side of the connector terminal 15 so that the laser light 20 is applied to the connector terminal 15.

  As described above, according to the connection structure of the electronic device 10 according to the first embodiment, the bus bar 16 and the connector terminal 15 are overlapped with each other by protruding the distal end portion of the bus bar 16 and the connector terminal 15 from the insulating connecting member 14 in the same direction. For welding, the distance between the laser irradiation site and the insulating connecting member 14 or the resin container 13 can be increased, and the region where the reflected light 22 affects the insulating connecting member 14 or the resin container 13 can be reduced. The impact can be reduced. Therefore, it is possible to reduce the variation in the welding state and to suppress the deterioration of the insulating property due to the alteration of the resin insulating member. Furthermore, when laser welding is performed, it is possible to set a low energy input condition, and it is possible to reduce spatter.

Embodiment 2. FIG.
Next, the connection structure of the electronic device according to the second embodiment will be described. FIG. 3 is a cross-sectional view showing a connection structure of an electronic device according to the second embodiment.

  In FIG. 3, the electronic device 30 according to the second embodiment has the electronic circuit board 11 disposed below the resin container 13 to secure the storage space 12 for the electronic circuit board 11, and the resin container on the electronic circuit board 11 side. A necessary height is provided from the opening 18 of the thirteen to the position of the welded portion of the bus bar 16 and the connector terminal 15. In this case, the welded portion between the bus bar 16 and the connector terminal 15 is disposed in the vicinity of the opening 17 side of the other resin container 13 different from the electronic circuit board 11 side, as shown in FIG. When the laser beam 20 is incident from the opening 17, the region where the incident laser beam 20 affects the insulating connecting member 14 and the region where the reflected light 22 affects the resin container 13 become extremely small, resulting in variations in welding quality. Can be significantly reduced.

  Further, as shown in FIG. 3, the resin container 13 is installed so that the opening 17 side of the other resin container 13 different from the electronic circuit board 11 side is on the upper side, and the laser beam 20 is irradiated from above in the vertical direction. In this case, even if metal vapor or resin vapor is generated, the vapor rises upward and is not transported in the direction of the storage space 12 of the electronic circuit board 11. It is possible to avoid the contamination of the connection portion with the substrate 11. Alternatively, the connector terminal 15 may be disposed on the back side of the bus bar 16 and the bus bar 16 may be irradiated with the laser light 20.

Here, as shown in FIG. 4, the bus bar 16 and the connector terminal 15 are overlapped with the bus bar 16 and the connector terminal 15 projecting from the resin container 13 and the insulating connecting member 14 in the same direction as in the first embodiment. By performing laser welding together, it is possible to obtain the electronic device 40 that further reduces the influence on the resin.

  3 and FIG. 4, the same reference numerals as those in FIG. 2 showing the first embodiment denote the same or corresponding parts, and duplicate descriptions are omitted.

Embodiment 3 FIG.
Next, an electronic device connection structure according to Embodiment 3 will be described. According to the connection structure of the electronic device according to the first embodiment or the second embodiment described so far, it is possible to reduce the variation in the welding state due to the beam heat source. Therefore, as shown in FIG. 5, non-through welding that does not melt the welding of the connector terminal 15 protruding from the resin container 13 and the bus bar 16 connected to the electronic circuit board 11 side to the lower surface of the connector terminal 15 that is the lower member. Even in the melted portion 50, since the variation in incident energy is small, there is little variation in the size of the melted portion 50, and a stable non-penetrating weld can be formed. By using non-penetrating welding, the influence of spatter generated from the back side of the welded portion can be significantly reduced.

  Here, when determining whether or not the welded state of the welded portion is possible, it is possible to estimate the joining state based on the molten shape of the upper surface and the rear surface in through welding. Therefore, the determination of the bonding state must be determined by the molten shape of the upper surface. However, since there is not much correlation between the molten shape of the upper surface and the molten shape of the joint surface, it is difficult to determine whether or not it is possible only from the molten shape of the upper surface.

  Therefore, as shown in FIG. 6, when the laser beam 20 is irradiated from the bus bar 16 side, the width 60 a near the laser irradiation portion 60 of the bus bar 16 is formed smaller than the width 61 a of the portion 61 where the connector terminal 15 is welded. . As described above, when welding is performed so that the width 50a of the melted portion 50 at the joint surface of the connector terminal 15 is larger than the reduced width 60a of the bus bar 16, the connector terminal 15 is melted as shown in FIG. As shown in the perspective view or the top view around the welded portion in FIG. 6C, the melted portion 50 spreads on the surface of the connector terminal 15, so that the state can be confirmed from the top by visual observation or an image processing apparatus. . Therefore, not only can the quality variation of the welded state be further reduced, but in particular, the electronic equipment has a large number of welded portions of bus bars and connector terminals, so that the productivity can be improved if the quality judgment becomes easy. Industrial value is high.

  In addition, as shown to Fig.7 (a)-(c), you may make the width | variety 70a of the front-end | tip part 70 of the bus-bar 16 small.

  Further, as shown in FIGS. 8A to 8D, by shifting the front end portion 16a of the bus bar 16 and the front end portion 18a of the connector terminal 15, the shape of the melted portion 50 is not limited to the width 50a but 8 (b ) Or a top view of the periphery of the welded portion in FIGS. 8C and 8D, the tip 50b extends from the tip 16a of the bus bar 16 toward the tip 15a of the connector terminal 15. Since it can also be seen from the upper surface, it becomes easier to determine whether or not the molten state exists, and the quality variation in the welded state can be further reduced. 7 and 8, the same reference numerals as those in FIG. 6 denote the same or corresponding parts.

  In each of the above embodiments, the laser beam 20 is applied to the joint between the bus bar 16 and the connector terminal 15 to perform laser welding. However, the welding of the joint is a non-contact heat source having a small heat-affected region. What is necessary is just to use plasma arc welding or electron beam welding in addition to the laser beam.

  In each of the above embodiments, the welding of the joint portion between the bus bar 16 and the connector terminal 15 is illustrated and described. However, the present invention is not limited to the joint between the bus bar 16 and the connector terminal 15, and the electronic device such as a power module, a capacitor, and a coil is used. You may apply to the terminal of components.

  The connection structure for an electronic device according to the present invention can be used as a connection structure for an electronic device having a container made of an insulating member made of resin.

It is sectional drawing which shows the connection structure of the electronic device which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the connection part vicinity of the connection structure of the electronic device which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the connection structure of the electronic device which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the other example of the connection structure of the electronic device which concerns on Embodiment 2 of this invention. It is sectional drawing of the welding part which shows the connection structure of the electronic device which concerns on Embodiment 3 of this invention. It is a figure explaining the welding method in the connection structure of the electronic device which concerns on Embodiment 3 of this invention. It is a figure explaining the other example of the welding method in the connection structure of the electronic device which concerns on Embodiment 3 of this invention. It is a figure explaining the further another example of the welding method in the connection structure of the electronic device which concerns on Embodiment 3 of this invention. It is sectional drawing which shows the connection structure of the conventional electronic device.

Explanation of symbols

10, 30, 40 Electronic device 11 Electronic circuit board 12 Storage space 13 Resin container 14 Connecting member 15 Connector terminal 16 Bus bar 17, 18 Opening 20 Laser beam 21 Center line 22 Reflected light 23 Vertical line 24 Incident angle 25 Reflection angle 50 Melting part 50a Width of the melted portion 60 Near the laser irradiated portion 60a Width near the laser irradiated portion 61 A portion to be welded 61a A width of the welded portion 70 A bus bar tip 70a A bus bar tip width

Claims (5)

A container having a storage space for an electronic circuit, and a resin insulation member;
A first conductive member held by the resin insulating member;
A second conductive member connected to the electronic circuit,
A connection structure for an electronic device in which the first conductive member and the second conductive member are overlap-welded using a beam heat source,
A connection structure for an electronic device, wherein the first conductive member and the second conductive member protrude from the resin insulating member in the same direction and are overlapped and welded. A container having a storage space for an electronic circuit, which is made of a resin insulating member and has openings in two opposing directions;
A first conductive member held by the resin insulating member;
A second conductive member connected to the electronic circuit,
A connection structure for an electronic device in which the first conductive member and the second conductive member are overlap-welded using a beam heat source,
The overlay weld is provided in the vicinity of one opening of the container, and a storage space for the electronic circuit is provided between the overlap weld and the other opening of the container.
A connection structure for an electronic device, wherein a beam from the beam heat source is incident from the one opening to form the overlap weld.   The overlap welding portion is a non-penetrating weld portion in which the molten portion does not reach the back surface of the lower conductive member to which the beam from the beam heat source is irradiated. The connection structure of the electronic device according to 2.   The width near the beam irradiation portion of the conductive member irradiated with the beam from the beam heat source is configured to be smaller than the width near the welded portion of the lower conductive member irradiated with the beam. 4. The electronic apparatus according to claim 1, wherein the width of the melted portion of the conductive member is larger than the width of the conductive member irradiated with the beam in the vicinity of the beam irradiation portion. Connection structure.   5. The electronic apparatus according to claim 4, wherein a tip of the welding portion of the lower conductive member on a protruding direction side is outside a tip of the conductive member on the side irradiated with the beam on the protruding direction side. Connection structure.

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