JP2010062794A - Piezoelectric vibration piece, method of manufacturing piezoelectric vibration piece, piezoelectric device, and method of manufacturing piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of obtaining crystal vibration pieces by separating the crystal vibration pieces from a crystal vibration wafer by breaking a connection portion connecting the crystal wafer and respective crystal vibration pieces, a part of the connection portion being prevented from being left as breakage waste on a crystal vibration piece. <P>SOLUTION: Since the connection portion 2 is formed in contact with two notch portions 12 on either one of a top surface 1A or a reverse surface 1B of the crystal vibration piece 1, the top surface 1A of the crystal vibration piece 1 and the connection portion 2, and the reverse surface 1B and the connection portion 2 are connected in mutually different states, and then the breaking state of the connection portion 2 varies depending on directions in which a load is applied to the crystal vibration piece 1. Consequently, the broken connection portion 2 is prevented from being left on the crystal vibration piece 1 which has been separated from the crystal wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibrating piece, a method for manufacturing a piezoelectric vibrating piece, a piezoelectric device, and a method for manufacturing a piezoelectric device.

Conventionally, a quartz crystal wafer made of a kind of piezoelectric quartz crystal is formed with a plurality of quartz crystal vibrating pieces and a connecting portion for connecting the quartz crystal wafer and each quartz crystal vibrating piece. There is a method of separating a piece from a quartz wafer to obtain a quartz vibrating piece.
Then, the width of the crystal vibrating piece side of the connecting portion is formed narrower than the width of the crystal wafer side, and by applying a load to the crystal vibrating piece, the connecting portion of the narrow crystal vibrating piece side is broken, and the crystal wafer Has disclosed a method of separating a quartz crystal vibrating piece from a substrate (for example, see Patent Document 1).

Japanese Patent Laying-Open No. 2006-186847 (pages 5 to 7, FIG. 1)

  However, in the above-described method, the portion where the surface of the quartz crystal vibrating piece comes into contact with the connecting portion on the side of the narrow quartz crystal vibrating piece starts and breaks, but the connecting portion on the side of the quartz crystal vibrating piece with the narrow width corresponding to the back side of the starting point It is difficult to break at the part where the back surface of the crystal vibrating piece comes into contact, and a part of the connecting part on the side of the narrow crystal vibrating piece and a part of the connecting part on the side of the wide crystal wafer are left as broken debris on the crystal vibrating piece. There is a problem.

  The present invention has been made to solve at least a part of the above problems. It can be realized by the following forms or application examples.

  Application Example 1 A piezoelectric vibrating piece according to this application example includes a piezoelectric vibrating piece formed of a piezoelectric wafer, and a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece. A plurality of notch portions formed on either the front surface or the back surface, in contact with the front surface and the back surface of the piezoelectric vibrating piece, and formed in contact with two of the notch portions; Is summarized as follows.

  According to this, since the connecting portion is formed in contact with the two notches on either the front surface or the back surface of the piezoelectric vibrating piece, the front surface and the connecting portion, or the back surface and the connecting portion of the piezoelectric vibrating piece. Since the connection state is different, the rupture state of the connecting portion differs depending on the direction in which the load is applied to the piezoelectric vibrating piece. For this reason, it can suppress that the fracture | ruptured connection part remains in a piezoelectric vibrating piece, and can isolate | separate a piezoelectric vibrating piece from a piezoelectric wafer. In addition, since the broken connection portion is prevented from being left on the piezoelectric vibrating piece, it is possible to prevent the piezoelectric vibrating piece from being damaged such as a crack due to the breaking of the connecting portion. It is possible to obtain a piezoelectric vibrating piece in which fluctuations in vibration frequency and CI (Crystal Impedance) values due to breakage of the piezoelectric vibrating piece are suppressed.

  Application Example 2 In the piezoelectric vibrating piece according to the application example described above, it is preferable that two or more connection portions are provided.

  According to this, it is possible to suppress the broken connecting portion from being left on the piezoelectric vibrating piece and to separate the piezoelectric vibrating piece from the quartz wafer. And the intensity | strength which a connection part cannot easily be fractured | ruptured in manufacturing processes, such as external shape formation of a piezoelectric vibrating piece, can be maintained.

  Application Example 3 A method for manufacturing a piezoelectric vibrating piece according to this application example includes a piezoelectric vibrating piece formed from a piezoelectric wafer, and a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece. The portion is in contact with the front and back surfaces of the piezoelectric vibrating piece, includes a plurality of cutout portions formed on either the front surface or the back surface, and is formed in contact with two of the cutout portions, The gist of the invention is to provide a separation step of breaking the connecting portion and separating the piezoelectric vibrating piece from the piezoelectric wafer by applying a load to the front or back surface of the piezoelectric vibrating piece in contact with the connecting portion.

  According to this, since the broken connecting portion is prevented from remaining on the piezoelectric vibrating piece, it is possible to provide a method of manufacturing a piezoelectric vibrating piece that does not hinder downsizing of the piezoelectric vibrating piece by the connecting portion.

  Application Example 4 A piezoelectric device according to this application example includes a piezoelectric vibrating piece formed from a piezoelectric wafer and a package that houses the piezoelectric vibrating piece, and the piezoelectric vibrating piece is hermetically sealed in the package. In the piezoelectric device, the piezoelectric wafer includes a connecting portion connected to the piezoelectric vibrating piece, is in contact with a front surface and a back surface of the piezoelectric vibrating piece, and is formed on either the front surface or the back surface. The gist is provided with a plurality of cutout portions and formed in contact with two of the cutout portions, and the connecting portion is broken and separated from the piezoelectric wafer.

  According to this, since the broken connecting portion is prevented from remaining on the piezoelectric vibrating piece, the piezoelectric vibrating piece contacts the package even if the gap between the package and the piezoelectric vibrating piece is small in the package. The package can be made smaller as the piezoelectric vibrating piece is made smaller without being damaged, and the piezoelectric device can be made smaller.

  Application Example 5 A method of manufacturing a piezoelectric device according to this application example includes a piezoelectric vibrating piece formed from a piezoelectric wafer, a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece, and the piezoelectric vibrating piece. And a piezoelectric device in which the piezoelectric vibrating piece is hermetically sealed in the package, wherein the piezoelectric vibrating piece is in contact with a front surface and a back surface of the piezoelectric vibrating piece, and is either the front surface or the back surface. A plurality of notches formed on one side and formed in contact with two of the notches, and applying the load to the front or back surface of the piezoelectric vibrating piece in contact with the connecting portion; A separation step of breaking the portion and separating the piezoelectric vibrating piece from the piezoelectric wafer

  According to this, since the broken connecting portion is prevented from remaining on the piezoelectric vibrating piece, the piezoelectric vibrating piece contacts the package even if the gap between the package and the piezoelectric vibrating piece is small in the package. Accordingly, it is possible to provide a method for manufacturing a piezoelectric device that can reduce the package with the size reduction of the piezoelectric vibrating piece without being damaged, and can realize the size reduction of the piezoelectric device.

  In the following embodiments, as a piezoelectric wafer, a piezoelectric vibrating piece, and a piezoelectric device, a quartz crystal wafer, a quartz vibrating piece, and a quartz crystal resonator that are a kind of piezoelectric material will be described as an example.

(First embodiment)
Hereinafter, the quartz crystal resonator element according to the first embodiment will be described with reference to FIGS. 1 to 4.
FIG. 1 is a schematic plan view showing a crystal wafer provided with a crystal vibrating piece. FIG. 2 is a schematic partial enlarged view of a quartz wafer provided with a quartz crystal vibrating piece. FIG. 3 is a partially enlarged view of the connecting portion connected to the crystal vibrating piece. FIG. 4 is a schematic perspective view of the quartz crystal vibrating piece.

  As shown in FIG. 1, the quartz wafer 10 includes a plurality of quartz vibrating pieces 1 as piezoelectric vibrating pieces. The crystal vibrating piece 1 is formed in a rectangular shape.

  FIG. 2A is a partially enlarged plan view of the crystal wafer 10. FIG. 2B is a cross-sectional view taken along the line XX of FIG. 2A and shows a cross section of the crystal wafer 10.

  As shown in FIG. 2A, the crystal vibrating piece 1, the connecting portion 2, and the holding portion 3 are formed from a crystal wafer 10. For example, the crystal wafer 10 is formed by wet etching. Two connecting portions 2 are provided for one crystal vibrating piece 1 and are connected to the crystal vibrating piece 1. The connecting portion 2 is connected to the holding portion 3. Thus, the crystal vibrating piece 1 is connected to the crystal wafer 10 by the connecting portion 2 and the holding portion 3.

  As shown in FIG. 2B, the quartz crystal vibrating piece 1 includes a front surface 1 </ b> A, a back surface 1 </ b> B, and a notch 12. An excitation electrode 11 and an extraction electrode 11a are formed on the front surface 1A, the back surface 1B, and the cutout portion 12 as shown in FIG.

  FIG. 3A is a partially enlarged plan view of the connecting portion 2 connected to the crystal vibrating piece 1. FIG. 3B is a cross-sectional view taken along the line XX in FIG. 3A, and shows a cross section of the connecting portion 2.

As shown in FIGS. 3A and 3B, the connecting portion 2 is in contact with the front surface 1 </ b> A and the back surface 1 </ b> B of the crystal vibrating piece 1. And the outer periphery of the back surface 1B is provided with the notch part 12 which contact | connects the connection part 2. FIG. The connecting portion 2 is in contact with the back surface 1B of the crystal vibrating piece 1 and is in contact with two cutout portions 12 among the cutout portions 12 formed on the back surface 1B. The holding part 3 is provided with a step part 32 in contact with the connecting part 2. The length C from the front surface 1A of the quartz crystal vibrating piece 1 to the holding unit 3 and the length D from the back surface 1B of the quartz crystal vibrating piece 1 to the holding unit 3 shown in FIG. That is, the length D is longer than the length C. Thereby, the notch 12 is formed in the back surface 1 </ b> B of the crystal vibrating piece 1. A step portion 32 is formed on the back surface of the holding portion 3.
Then, the crystal vibrating piece 1 shown in FIG. 4 is obtained by breaking the connecting portion 2.

  Hereinafter, a method for manufacturing the quartz crystal resonator element according to the first embodiment will be described with reference to FIGS. 3 and 5 to 7. FIG. 5 is a flowchart showing a method for manufacturing the quartz crystal resonator element. FIG. 6 is a schematic process diagram showing a method for manufacturing a quartz crystal resonator element. FIG. 7 is a schematic process diagram illustrating a method for separating a quartz crystal vibrating piece.

First, an outer shape patterning step (S1) is performed. As a result, as shown in FIG. 6A, the outer shape pattern 30 </ b> A is formed on the surface of the crystal wafer 10, and the outer shape pattern 30 </ b> B is formed on the back surface of the crystal wafer 10. The external patterns 30A and 30B are made of a resist film, an Au film, and a Cr film. Hereinafter, the external patterning step (S1) will be described.
A Cr film made of chromium (Cr) and an Au film made of gold (Au) are sequentially formed on the front surface and the back surface of the quartz wafer 10 by vacuum deposition. Subsequently, a resist is applied on the Au film to form a resist film. Here, a positive type resist in which the exposed portion is dissolved is used. An example of this resist is a photoresist material containing a novolac resin. Thereafter, an exposure process is performed using a mask. The resist film is exposed by exposure through the mask. The exposed resist film is dissolved and removed using a developer. The Au film exposed by the removal is removed using an etching solution. Subsequently, the Cr film exposed by removing the Au film is removed using an etching solution. And it wash | cleans using a pure water. Thereby, the front surface and the back surface of the crystal wafer 10 are partially exposed. In this way, as shown in FIG. 6A, an external pattern 30A composed of a resist film, an Au film, and a Cr film in a non-photosensitive portion is formed on the surface of the quartz wafer 10. Then, the outer shape pattern 30 </ b> B is formed on the back surface of the crystal wafer 10.

  Here, in FIG. 6A, the outline pattern 30A is indicated by a solid line, and the portion where the outline pattern 30B is different from the outline pattern 30A is indicated by a broken line. Specifically, the length AY of the outer shape pattern 30A and the length BY of the outer shape pattern 30B are different. That is, as shown in FIGS. 3A and 3B, the length AY of the outer pattern 30A is formed longer than the length BY of the outer pattern 30B.

Next, an outer shape etching step (S2) is performed.
The crystal wafer 10 is wet-etched using the external patterns 30A and 30B as a mask. As a result, the front and back surfaces of the partially exposed quartz crystal wafer 10 are removed. Thereafter, the external patterns 30A and 30B are removed. Thereby, as shown in FIG. 6B, the crystal vibrating piece 1, the connecting part 2, the holding part 3, the notch part 12, and the step part 32 are formed from the crystal wafer 10. Here, in FIG. 6B, the connecting portion 2 is different from the length B of the back surface 1 </ b> B of the crystal vibrating piece 1 and the length A of the front surface 1 </ b> A of the crystal vibrating piece 1. The length A of the front surface 1A is formed longer than the length B of the back surface 1B. Here, the sum of the length A and the length C of the front surface 1A is longer than the sum of the length B and the length D of the back surface 1B, and it is illustrated that the step portion 32 is formed on the back surface of the crystal wafer 10. However, the stepped portion 32 may not be formed. That is, the length D from the back surface 1 </ b> B of the crystal vibrating piece 1 to the holding unit 3 is reduced. In this case, the sum of the length A and the length C is equal to the sum of the length B and the length D.

Then, an electrode patterning step (S3) is performed.
A Cr film made of chromium (Cr) and an Au film made of gold (Au) are sequentially formed on the quartz wafer 10 by vacuum deposition. Subsequently, a resist is applied on the Au film to form a resist film. Here, as in the external patterning step (S1), a positive type resist in which the exposed portion is dissolved is used. An example of this resist is a photoresist material containing a novolac resin.
Thereafter, an exposure process is performed using a mask. The resist film is exposed by exposure through the mask. The exposed resist film is dissolved and removed using a developer. The Au film exposed by the removal is removed using an etching solution. Subsequently, the Cr film exposed by removing the Au film is removed using an etching solution. And it wash | cleans using a pure water.
In this way, as shown in FIG. 6 (c), the electrode pattern 31 and the extraction electrode pattern 31a made of the resist film, the Au film, and the Cr film, which are not exposed to light, are transferred to the front surface 1A, the back surface 1B, And formed in the notch 12.

Next, an electrode etching step (S4) is performed.
A wet etching process is performed to remove the electrode pattern 31 and the extraction electrode pattern 31a. Thereby, as shown in FIG. 6D, the excitation electrode 11 and the extraction electrode 11 a are formed on the front surface 1 </ b> A, the back surface 1 </ b> B, and the cutout portion 12 of the crystal vibrating piece 1.

Then, a separation step (S5) is performed.
As shown in FIG. 7, the connecting portion 2 and the holding portion 3 are fixed by being pressed by a fixing member 40. Then, using the breaker member 50, a load F indicated by an arrow is applied to the surface 1 </ b> A of the crystal vibrating piece 1. The direction in which the load F is applied is a direction from the front surface 1A side of the crystal vibrating piece 1 toward the back surface 1B side. As shown by a broken line in FIG. 7, the breaker member 50 may be hollow and include a mechanism for adsorbing the crystal vibrating piece 1. Thus, the crystal vibrating piece 1 is separated from the crystal wafer 10 and the holding unit 3 by breaking the connecting portion 2. In this way, the crystal vibrating piece 1 shown in FIG. 4 is obtained.

  Therefore, according to the present embodiment, since the connecting portion 2 is formed in contact with the two notches 12 on either the front surface 1A or the back surface 1B of the crystal vibrating piece 1, the surface of the crystal vibrating piece 1 is Since the state where 1A is connected to the connecting portion 2 and the back surface 1B is connected to the connecting portion 2 are different, the fracture state of the connecting portion 2 is different depending on the direction in which the load is applied to the crystal vibrating piece 1. For this reason, it is possible to suppress the broken connecting portion 2 from being left on the crystal vibrating piece 1 and to separate the crystal vibrating piece 1 from the crystal wafer 10. Further, since the broken connecting portion 2 is prevented from being left on the crystal vibrating piece 1, it is possible to prevent the quartz vibrating piece 1 from being damaged such as a crack due to the breaking of the connecting portion 2. it can. It is possible to obtain the quartz crystal vibrating piece 1 in which the fluctuation of the vibration frequency and the fluctuation of the CI (Crystal Impedance) value due to the breakage of the quartz crystal vibrating piece 1 are suppressed.

  According to this, the connecting portion 2 has a back surface contact length B and a second contact length b in contact with the crystal wafer 10 as compared with the surface contact length A and the first contact length a in contact with the crystal vibrating piece 1. Since it is short or the same, it can improve that the fracture | ruptured connection part 2 suppresses generating in the crystal vibrating piece 1. FIG. It is possible to obtain a crystal resonator element 1 with high accuracy in which fluctuations in vibration frequency and CI (Crystal Impedance) values due to breakage of the crystal resonator element 1 are suppressed.

  And it can suppress that the fracture | ruptured connection part 2 remains in the quartz crystal vibrating piece 1, and can isolate the quartz crystal vibrating piece 1 from the quartz wafer 10. FIG. And in manufacturing processes, such as the external shape etching process (S2) of the crystal vibrating piece 1, the intensity | strength in which the connection part 2 cannot be fractured easily can be maintained.

  Further, since the broken connecting portion 2 is prevented from remaining on the crystal vibrating piece 1, a manufacturing method of the crystal vibrating piece 1 in which the downsizing of the crystal vibrating piece 1 is not hindered by the connecting portion 2. Can be provided.

  In addition, the deformation | transformation in the range which can solve at least one part of the said subject, improvement, etc. are contained in above-mentioned embodiment.

  For example, in the above-described embodiment, the notch 12 is shown in a step shape as shown in FIG. 4, but the present invention is not limited to this, and may be a modified example of the connecting part 2 shown in FIG. 8.

(Modification)
FIG. 8 is a partially enlarged view showing a modified example of the connecting portion 2. As shown in FIG. 8A, the notch 12 may be inclined. Moreover, the notch part 12 should just be in contact with the two notch parts 12, and as shown in FIG. Two each may be formed.
The notch 12 has been described as being formed on the back surface 1 </ b> B of the crystal vibrating piece 1, but may be formed on the front surface 1 </ b> A of the crystal vibrating piece 1.

  Further, although the crystal vibrating piece 1 is connected to the two connecting portions 2 extending from the holding portion 3, the crystal vibrating piece 1 may be connected to the one connecting portion 2. Further, if the crystal vibrating piece 1 can be easily separated from the crystal wafer 10 and the strength is difficult to separate in the manufacturing process such as the outer shape formation of the crystal vibrating piece 1, the number of the connecting portions 2 can be appropriately selected. . When the quartz crystal resonator element 1 is connected to two or more connecting portions 2, the shape of the connecting portion is not limited to any one shown in FIG. 3 or FIG. 8, and any one of them may be used in combination. Good. Furthermore, although the crystal wafer 10 and the crystal vibrating piece 1 have been described as being connected by the holding unit 3 and the connecting unit 2, the present invention is not limited thereto, and the crystal wafer 10 and the crystal vibrating piece 1 are connected by the connecting unit. It may be connected only by two. In this case, the holding part 3 may not be formed or may be formed integrally with the crystal wafer 10.

  And although it demonstrated that the isolation | separation process (S5) was implemented after an electrode etching process (S4), not only this but a isolation | separation process (S5) may be implemented after an external shape etching process (S2).

(Second Embodiment)
Hereinafter, a crystal resonator will be described as an example of the piezoelectric device of the second embodiment.

  The piezoelectric device of the second embodiment is a crystal resonator using the crystal resonator element of the first embodiment. For this reason, since the quartz crystal vibrating piece used for the piezoelectric device of the second embodiment has the same configuration as the quartz crystal vibrating piece of the first embodiment, the same reference numerals are given and description of the configuration is omitted.

9 and 10 show the crystal resonator of the second embodiment. FIG. 9 is a schematic plan view of the crystal unit with the internal structure exposed except for the lid. FIG. 10 is a schematic XX cross-sectional view of FIG. 9, in which a lid is arranged.
As shown in FIGS. 9 and 10, the crystal resonator 30 has the crystal resonator element 1 housed in a package 36. Specifically, as shown in FIG. 10, the crystal resonator 30 includes a crystal resonator element in a package 36 including a first substrate 34 and a second substrate 35 laminated on the first substrate 34. 1 is stored.

The first substrate 34 constituting the package 36 is an insulating base, and the electrode part 32 is formed thereon. A pair of electrode portions 32 is provided at both ends of the width direction of the first substrate 34 at the end portion of the package 36.
The first substrate 34 and the second substrate 35 are formed of an insulating material, and ceramic is suitable. In particular, a material having a thermal expansion coefficient that matches or is very close to that of the crystal vibrating piece 1 or the lid 37 is selected as a preferable material. In this embodiment, for example, a ceramic green sheet is used. Yes. The green sheet is obtained, for example, by dispersing a ceramic powder in a predetermined solution, forming a kneaded product formed by adding a binder into a sheet-like long tape shape, and cutting it into a predetermined length Is.

  The first substrate 34 and the second substrate 35 can be formed by laminating and sintering green sheets molded into the illustrated shape. In this case, the first substrate 34 is a substrate that constitutes the bottom of the package 36, and the second substrate 35 that is stacked on the first substrate 34 has a frame shape by removing the internal material from the above-described green sheet as a plate shape. As shown in FIG. 10, the internal space S shown in FIG. 10 is formed, and the crystal resonator element 1 is accommodated using the internal space S. A lid 37 made of a metal such as ceramic, glass or Kovar is bonded to the package 36 via a bonding material such as a Kovar ring or a sealing material 47. Thereby, the package 36 is hermetically sealed.

The first substrate 34 and the second substrate are formed on the first substrate 34 after a necessary conductive pattern is formed using a conductive paste such as silver or palladium or a conductive paste such as tungsten metallization. After sintering 35, nickel and gold or silver are sequentially plated to form the electrode portion 32 described above.
As shown in FIG. 10, the electrode portion 32 is connected to the mounting terminal 41 exposed on the bottom surface of the package 36 by a conductive pattern (not shown). The conductive pattern for connecting the electrode portion 32 and the mounting terminal 41 may be formed on the surface of a castellation (not shown) used when the package 36 is formed, and the outer surface of the package 36 may be routed. Alternatively, the connection may be made by a conductive through hole penetrating the first substrate 34.

In FIG. 9, an excitation electrode 11 is formed on the surface 1 </ b> A of the crystal vibrating piece 1 as a main electrode for driving. The excitation electrode 11 is formed in a region where the crystal vibrating piece 1 is actively vibrated, and is used to efficiently generate an electric field in the crystal vibrating piece 1 by applying a drive voltage. . In each of the end portions of the quartz crystal vibrating piece 1 in the length direction, lead electrodes 11a are formed at both ends in the width direction. One of the extraction electrodes 11 a is connected to the excitation electrode 11.
The excitation electrode 11 and the extraction electrode 11a are also formed in the same form on the back surface 1B of the crystal vibrating piece 1. Each extraction electrode 11a on the front surface 1A goes around the side surface of the crystal vibrating piece 1 and is connected to each extraction electrode 11a on the back surface 1B.

As shown in FIG. 9, such a quartz crystal vibrating piece 1 is formed by applying a conductive adhesive 43 on each electrode portion 32 on the package 36 side and applying the conductive adhesive 43 on the electrode portion 32 in FIG. 9. The base or one end 33a on which each of the described extraction electrodes 11a is formed is placed, and these conductive adhesives 43 are cured to be joined in a cantilever manner.
As a result, the drive voltage supplied from the outside of the package 36 via the mounting terminal 41 is supplied to the excitation electrode 11 from the electrode part 32 on the package 36 side via the conductive adhesive 43 and the extraction electrode 11a of the crystal vibrating piece 1. To be applied. Thereby, the quartz crystal vibrating piece 1 is driven by being vibrated by a piezoelectric action.

  Here, as the conductive adhesive 43, one obtained by adding conductive particles such as silver particles to a binder component made of a predetermined synthetic resin can be used. Further, the crystal vibrating piece 1 is not necessarily a cantilever type, and may be configured such that a part of the distal end side 31b is placed on a stand called “pillow” (not shown) provided on the package 36 side.

  Therefore, according to the present embodiment, since the broken connecting portion 2 is prevented from being left in the crystal vibrating piece 1, the gap between the internal space S and the crystal vibrating piece 1 in the internal space S in the package 36 is small. Even so, the package 36 can be reduced in size as the quartz crystal resonator element 1 is downsized without the crystal resonator element 1 coming into contact with the package 36 and being damaged, and the crystal unit 30 can be downsized. In addition, when the crystal vibrating piece 1 comes into contact with the package 36 and is damaged, broken chips enter the package and adhere to the crystal vibrating piece 1, thereby preventing vibration of the crystal vibrating piece 1 and causing abnormal vibration frequency. It is possible to suppress causing or making it difficult to oscillate.

  And since it is suppressed that the fracture | ruptured connection part 2 remains in the quartz crystal vibrating piece 1, even if the clearance gap between the internal space S and the quartz crystal vibrating piece 1 in the internal space S in the package 36 is slight, The crystal resonator 30 can be reduced in size as the crystal resonator element 1 is downsized without the crystal resonator element 1 coming into contact with the package 36 and damaged, and the crystal resonator 30 can be downsized. Can be provided.

  In the above-described embodiment, the crystal wafer is processed using wet etching to form the crystal vibrating piece, the connecting portion, and the holding portion. However, the present invention is not limited to this, and dry etching or machining may be used. . In the above-described steps, the vacuum deposition method is used in the formation of the Cr film and the Au film. However, the present invention is not limited to this, and a sputtering method or the like may be used. Further, instead of the Cr film, a film made of, for example, nickel (Ni) may be formed, and instead of the Au film, a film made of, for example, silver (Ag) may be formed.

  In the above-described embodiment, the crystal resonator is described as an example of the piezoelectric device. However, the present invention is not limited to this, and a crystal oscillator may be used. In addition, although quartz is used as an example of the piezoelectric material, the present invention is not limited to this, and piezoelectric materials such as lithium tantalate and lithium niobate can be used. Further, the shape of the piezoelectric chip is not limited to the flat type, and a convex type or a reverse mesa type resonator element can be used. The vibration mode of the quartz crystal resonator element is not particularly limited, and may be a thickness-slip mode, a bending vibration mode, a surface acoustic wave mode, or the like.

FIG. 3 is a schematic plan view showing a quartz wafer provided with the quartz crystal vibrating piece according to the first embodiment. FIG. 4 is a schematic partial enlarged view of a crystal wafer provided with the crystal resonator element of the first embodiment. The elements on larger scale of the connection part connected with the crystal vibrating piece of 1st Embodiment. 1 is a schematic perspective view of a crystal resonator element according to a first embodiment. The flowchart which shows the manufacturing method of the crystal vibrating piece of 1st Embodiment. FIG. 3 is a schematic process diagram illustrating a method for manufacturing the quartz crystal resonator element according to the first embodiment. FIG. 3 is a schematic process diagram illustrating a method for separating a crystal vibrating piece according to the first embodiment. The elements on larger scale which show the modification of the connection part of 1st Embodiment. The schematic plan view of the crystal oscillator of 2nd Embodiment. The schematic sectional drawing of the crystal oscillator of 2nd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Quartz crystal vibrating piece, 1A ... The surface of a quartz crystal vibrating piece, 1B ... The back surface of a quartz crystal vibrating piece, 2 ... Connection part, 3 ... Holding part, 10 ... Quartz wafer, 11 ... Excitation electrode, 11a ... Extraction electrode, 12 ... Cutting Notched portion, 30A, 30B ... outer pattern, 31 ... electrode pattern, 32 ... stepped portion, 40 ... fixing member, 50 ... breaking member, A ... length of the surface of the crystal vibrating piece, B ... back surface of the crystal vibrating piece length.

Claims (5)

A piezoelectric vibrating piece formed from a piezoelectric wafer, and a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece,
The connecting portion is in contact with the front surface and the back surface of the piezoelectric vibrating piece, includes a plurality of cutout portions formed on either the front surface or the back surface, and is formed in contact with two of the cutout portions. The piezoelectric vibrating piece is characterized in that the connecting portion is broken. The piezoelectric vibrating piece according to claim 1,
A piezoelectric vibrating piece comprising two or more connecting portions. A piezoelectric vibrating piece formed from a piezoelectric wafer, and a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece,
The connecting portion is in contact with the front surface and the back surface of the piezoelectric vibrating piece, includes a plurality of cutout portions formed on either the front surface or the back surface, and is formed in contact with two of the cutout portions. And
A piezoelectric vibrating piece comprising a separation step of breaking the connecting portion and separating the piezoelectric vibrating piece from the piezoelectric wafer by applying a load to the front surface or back surface of the piezoelectric vibrating piece in contact with the connecting portion. Manufacturing method. A piezoelectric vibrating piece formed from a piezoelectric wafer, and a package for housing the piezoelectric vibrating piece,
A piezoelectric device in which the piezoelectric vibrating piece is hermetically sealed in the package,
The piezoelectric wafer includes a connecting portion connected to the piezoelectric vibrating piece,
A plurality of notch portions formed on either the front surface or the back surface, in contact with the front surface and the back surface of the piezoelectric vibrating piece, and formed in contact with two of the notch portions; A piezoelectric device characterized in that is broken and separated from the piezoelectric wafer. A piezoelectric vibrating piece formed from a piezoelectric wafer, a connecting portion connected to the piezoelectric wafer and the piezoelectric vibrating piece, and a package for housing the piezoelectric vibrating piece,
A method of manufacturing a piezoelectric device in which the piezoelectric vibrating piece is hermetically sealed in the package,
In contact with the front surface and the back surface of the piezoelectric vibrating piece, comprising a plurality of cutout portions formed on either the front surface or the back surface, and formed in contact with two of the cutout portions;
A piezoelectric device comprising: a separation step of breaking the connecting portion and separating the piezoelectric vibrating piece from the piezoelectric wafer by applying a load to the front or back surface of the piezoelectric vibrating piece in contact with the connecting portion. Production method.

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