JP2010060341A - Magnetic sensor - Google Patents

Magnetic sensor Download PDF

Info

Publication number
JP2010060341A
JP2010060341A JP2008224297A JP2008224297A JP2010060341A JP 2010060341 A JP2010060341 A JP 2010060341A JP 2008224297 A JP2008224297 A JP 2008224297A JP 2008224297 A JP2008224297 A JP 2008224297A JP 2010060341 A JP2010060341 A JP 2010060341A
Authority
JP
Japan
Prior art keywords
magnetic
magnetoresistive element
magnetosensitive
electrode
magnetoresistive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008224297A
Other languages
Japanese (ja)
Other versions
JP4735686B2 (en
Inventor
Tamotsu Minamitani
保 南谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2008224297A priority Critical patent/JP4735686B2/en
Priority to EP09251952A priority patent/EP2159586B1/en
Priority to KR1020090081261A priority patent/KR20100027979A/en
Priority to CN200910170660.3A priority patent/CN101666864B/en
Publication of JP2010060341A publication Critical patent/JP2010060341A/en
Application granted granted Critical
Publication of JP4735686B2 publication Critical patent/JP4735686B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/0005Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic sensor having a structure that uniformizes temperatures of a plurality of magnetoresistive elements. <P>SOLUTION: Magnetosensitive sections 121-124 forming a magnetoresistive element MR1 and magnetosensitive sections 131-134 forming a magnetoresistive element MR2 are formed on a substrate 11. The magnetosensitive sections 121-124 and 131-134 are includes long semiconductor films. Moreover, on the semiconductor films of the magnetosensitive sections 121-124, short-circuiting electrodes made up of an electrically conductive material are arranged at predetermined intervals in the longitudinal direction. The magnetosensitive sections 121-124 and 131-134 are formed close to each other and arranged so that their respective longitudinal directions are in parallel. In this case, the magnetosensitive sections 121-124 and 131-134 are formed so as to be arranged in the order of the magnetosensitive sections 131 and 132 of the magnetoresistive element MR2, the magnetosensitive sections 121 and 122 of the magnetoresistive element MR1, the magnetosensitive sections 133 and 134 of the magnetoresistive element MR2, and the magnetosensitive sections 123 and 124 of the magnetoresistive element MR1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、被検出体に備えられた磁気パターン等の磁気情報を検出する磁気センサに関するものである。   The present invention relates to a magnetic sensor for detecting magnetic information such as a magnetic pattern provided on a detection object.

従来、紙幣等の被検出体に組み込まれた磁気パターンや磁気情報を検出する磁気センサが各種考案されている。   2. Description of the Related Art Conventionally, various magnetic sensors for detecting a magnetic pattern and magnetic information incorporated in a detection object such as a bill have been devised.

例えば、特許文献1には、基板上にミアンダ形状の磁気抵抗効果膜が形成されてなる一般的な差動型の磁気センサが示されている。また、特許文献2にも、磁気抵抗素子を複数備えた差動型の磁気センサが示されている。ここで、より具体的に特許文献2の図24に示すように、各磁気抵抗素子は、長尺状からなる複数の感磁部を有し、該複数の感磁部は被検出体の検知範囲において一方向に並んで配置されるとともに直列接続されている。   For example, Patent Document 1 discloses a general differential type magnetic sensor in which a meander-shaped magnetoresistive film is formed on a substrate. Patent Document 2 also shows a differential magnetic sensor including a plurality of magnetoresistive elements. More specifically, as shown in FIG. 24 of Patent Document 2, each magnetoresistive element has a plurality of long magnetic sensing portions, and the plurality of magnetic sensing portions are detected by a detection target. They are arranged side by side in one direction and connected in series.

そして、このように磁気抵抗素子を直列接続して分圧した電圧を出力すること、すなわち差分出力することで、磁気抵抗素子の有する温度により抵抗値が変化する抵抗温度特性の影響を抑制している。
特開2002−84015号公報 特開2005−37337号公報
And, by connecting the magnetoresistive elements in series and outputting the divided voltage, that is, by outputting the difference, the influence of the resistance temperature characteristic that the resistance value changes depending on the temperature of the magnetoresistive element is suppressed. Yes.
Japanese Patent Laid-Open No. 2002-84015 JP-A-2005-37337

しかしながら、上述のような従来の磁気センサでは、差分出力に利用する複数の磁気抵抗素子の形成位置が離間している。ここで、磁気センサは、例えば、当該磁気センサが搭載される機器内に設置されており、当該機器内の熱源で発生する熱等が磁気センサ全体に均一に伝達されるとは限らない。このため、各磁気抵抗素子の形成位置で温度が異なってしまい、上述のような抵抗温度特性による影響の抑制効果が得られなくなる。その結果、温度が異なることにより、複数の磁気抵抗素子間で抵抗値の変化が大きくなり、差分出力が変動してしまう。   However, in the conventional magnetic sensor as described above, the formation positions of a plurality of magnetoresistive elements used for differential output are separated. Here, the magnetic sensor is installed in, for example, a device on which the magnetic sensor is mounted, and heat generated by a heat source in the device is not necessarily transmitted uniformly to the entire magnetic sensor. For this reason, the temperature differs depending on the formation position of each magnetoresistive element, and the effect of suppressing the influence due to the resistance temperature characteristic as described above cannot be obtained. As a result, when the temperatures are different, the resistance value changes greatly between the plurality of magnetoresistive elements, and the differential output fluctuates.

したがって、本発明の目的は、複数の磁気抵抗素子の温度を均一にできる構造の磁気センサを実現することにある。   Therefore, an object of the present invention is to realize a magnetic sensor having a structure capable of making the temperatures of a plurality of magnetoresistive elements uniform.

この発明は、通過磁束により抵抗値の変化する感磁部を基板表面に形成してなる複数の磁気抵抗素子を直列接続し、該直列接続された複数の磁気抵抗素子によって分圧される電圧を出力信号とする磁気検出部を備えた磁気センサに関するものである。そして、この磁気センサの各磁気抵抗素子は、それぞれが長尺状に形成された複数の感磁部と、該複数の感磁部を直列接続する接続導体部と、を有する。さらに、複数の磁気抵抗素子をそれぞれ構成する複数の感磁部は、一方向に並んで配置され、一つの磁気抵抗素子を構成する少なくとも一つの感磁部が当該一つの磁気抵抗素子を構成する他の複数の感磁部に対して両側から隣り合わないように、全ての磁気抵抗素子の感磁部が配置される。   In the present invention, a plurality of magnetoresistive elements formed by forming a magnetosensitive part whose resistance value is changed by a passing magnetic flux on a substrate surface are connected in series, and a voltage divided by the plurality of magnetoresistive elements connected in series is obtained. The present invention relates to a magnetic sensor including a magnetic detection unit as an output signal. Each magnetoresistive element of the magnetic sensor has a plurality of magnetic sensing portions each formed in a long shape, and a connection conductor portion connecting the plurality of magnetic sensing portions in series. Further, the plurality of magnetosensitive parts constituting each of the plurality of magnetoresistive elements are arranged in one direction, and at least one magnetosensitive part constituting one magnetoresistive element constitutes the one magnetoresistive element. The magnetic sensitive parts of all the magnetoresistive elements are arranged so as not to be adjacent to the other magnetic sensitive parts from both sides.

この構成では、全ての磁気抵抗素子に対して、単体の磁気抵抗素子を構成する全ての感磁部が一箇所に集合して形成されない。例えば、第1磁気抵抗素子と第2磁気抵抗素子とからなる二つの磁気抵抗素子がそれぞれ第1感磁部、第2感磁部の二つを有する場合、第1磁気抵抗素子の第1感磁部、第2磁気抵抗素子の第1感磁部、第1磁気抵抗素子の第2感磁部、第2磁気抵抗素子の第2感磁部の順に並んで形成される。このため、従来のように各磁気抵抗素子をそれぞれ構成する感磁部群が異なる領域にそれぞれ設置される場合と比較して、各磁気抵抗素子の感磁部で感温される温度の差が低減される。   In this configuration, all the magnetosensitive parts constituting the single magnetoresistive element are not collectively formed at one place with respect to all the magnetoresistive elements. For example, when two magnetoresistive elements including a first magnetoresistive element and a second magnetoresistive element have two first and second magnetosensitive parts, respectively, the first sensation of the first magnetoresistive element. The magnetic part, the first magnetosensitive part of the second magnetoresistive element, the second magnetosensitive part of the first magnetoresistive element, and the second magnetosensitive part of the second magnetoresistive element are arranged in this order. For this reason, compared with the case where the magnetosensitive part group which comprises each magnetoresistive element each is installed in a different area | region conventionally, the difference of the temperature sensed by the magnetosensitive part of each magnetoresistive element is different. Reduced.

また、この発明の磁気センサは、複数の磁気抵抗素子が異なる感度を有し、一つの磁気抵抗素子の一つの感磁部と、一つの磁気抵抗素子と感度の異なる別の磁気抵抗素子の一つの感磁部とが隣り合うように配置された一対の配列が複数形成されている。   In the magnetic sensor of the present invention, a plurality of magnetoresistive elements have different sensitivities, one magnetosensitive part of one magnetoresistive element, and one magnetoresistive element having a different sensitivity from one magnetoresistive element. A plurality of pairs of arrays are formed so that two magnetic sensing portions are adjacent to each other.

この構成では、異なる感度からなる複数の磁気抵抗素子を構成する感磁部同士が、隣り合うことで一つの感磁部対として構成される。そして、これら異なる感度の感磁部の組からなる感磁部対が順次配列される構成になることで、それぞれに異なる磁気抵抗素子を構成する感度の異なる各感磁部群間での温度差がより一層低減される。   In this configuration, the magnetosensitive parts constituting a plurality of magnetoresistive elements having different sensitivities are adjacent to each other so as to be configured as one magnetosensitive part pair. Then, by arranging the magnetic sensing part pairs composed of the magnetic sensing parts having different sensitivities in sequence, the temperature difference between the magnetic sensitive parts having different sensitivities constituting the respective magnetoresistive elements. Is further reduced.

また、この発明の磁気センサは、複数の磁気抵抗素子をそれぞれ構成する複数の感磁部が長尺方向に垂直な方向に沿って平行になるように配置されている。   In the magnetic sensor of the present invention, the plurality of magnetic sensing parts respectively constituting the plurality of magnetoresistive elements are arranged in parallel along a direction perpendicular to the longitudinal direction.

この構成では、隣り合う感磁部同士での最も離れた部分間の距離が、長尺方向に沿って並ぶ場合よりも短くなる。すなわち、長尺方向に並ぶ場合では感磁部の長尺方向の長さの約2倍であるのに対して、長尺方向に垂直な方向に並ぶ場合では感磁部の短い幅の約2倍でしかない。このような構成とすることで、異なる磁気抵抗素子の隣り合う感磁部同士での感温は略同じとなる。これにより、複数の磁気抵抗素子の温度が略均一になる。   In this configuration, the distance between the farthest portions between the adjacent magnetic sensing portions is shorter than that in the case where they are arranged along the longitudinal direction. That is, in the case of being arranged in the longitudinal direction, it is about twice the length in the longitudinal direction of the magnetic sensing part, whereas in the case of being arranged in the direction perpendicular to the longitudinal direction, it is about 2 of the short width of the magnetic sensing part. It is only double. By setting it as such a structure, the temperature sensitivity in the adjacent magnetosensitive part of a different magnetoresistive element becomes substantially the same. Thereby, the temperature of a some magnetoresistive element becomes substantially uniform.

また、この発明の磁気センサは、長尺方向が被検出体の搬送方向に平行である。   In the magnetic sensor of the present invention, the longitudinal direction is parallel to the conveyance direction of the detection target.

この構成では、各磁気抵抗素子での被検出体からの磁気検出タイミングが一致する。このため、例えば、磁気抵抗素子間で感度が異なるように設定されていれば、感度が低い側の磁気抵抗素子の出力が、感度の高い側の磁気抵抗素子の出力に打ち消され、単純な波形の出力が得られる。この際、各磁気抵抗素子の抵抗温度特性は異ならず、温度も同じであるので、抵抗温度特性の影響を抑圧することができる。   In this configuration, the magnetic detection timing from the detection object in each magnetoresistive element matches. For this reason, for example, if the sensitivity is set to be different between the magnetoresistive elements, the output of the magnetoresistive element on the low sensitivity side is canceled by the output of the magnetoresistive element on the high sensitivity side, and a simple waveform is obtained. Is obtained. At this time, the resistance temperature characteristics of the magnetoresistive elements are not different and the temperature is the same, so that the influence of the resistance temperature characteristics can be suppressed.

また、この発明の磁気センサは、感磁部を接続する接続電極が、基板の感磁部を有する面とともに、当該面に対して感磁部を覆うように形成された絶縁層の表面にも形成されている。   In addition, the magnetic sensor of the present invention has a connection electrode for connecting the magnetic sensitive part on the surface of the insulating layer formed to cover the magnetic sensitive part with respect to the surface of the substrate having the magnetic sensitive part. Is formed.

この構成では、感磁部が形成された基板の表面に、全ての接続電極を形成しなくても良いので、基板表面での感磁部の密集率を向上させることができる。これにより、複数の磁気抵抗素子の温度をより均一にできる。また、感磁部や接続電極の引き回しが容易になる。   In this configuration, since it is not necessary to form all the connection electrodes on the surface of the substrate on which the magnetic sensitive portion is formed, the density of the magnetic sensitive portions on the substrate surface can be improved. Thereby, the temperature of a some magnetoresistive element can be made more uniform. Further, the magnetic sensing part and the connection electrode can be easily routed.

また、この発明の磁気センサは、磁気検出部を複数備え、該複数の磁気検出部に対して、一つの磁気抵抗素子を構成する一つの感磁部が当該一つの磁気抵抗素子を構成する他の複数の感磁部に対して両側から隣り合わないように、全ての磁気抵抗素子の感磁部を配置している。   In addition, the magnetic sensor of the present invention includes a plurality of magnetic detection units, and one magnetosensitive unit constituting one magnetoresistive element constitutes the one magnetoresistive element with respect to the plurality of magnetic detection units. The magnetosensitive parts of all the magnetoresistive elements are arranged so as not to be adjacent to the plurality of magnetosensitive parts from both sides.

この構成では、複数の磁気検出部を構成する各磁気抵抗素子の感磁部が、磁気抵抗素子毎に集中せず、上述のように各磁気抵抗素子の感磁部が配列方向に沿って交代しながら順に配置される。これにより、複数の磁気検出部を有する構成であっても、各磁気検出部を構成する磁気抵抗素子の感磁部の温度が均一になる。   In this configuration, the magnetosensitive elements of the magnetoresistive elements constituting the plurality of magnetic detectors are not concentrated for each magnetoresistive element, and as described above, the magnetosensitive elements of the magnetoresistive elements alternate along the arrangement direction. Are arranged in order. Thereby, even if it is the structure which has a some magnetic detection part, the temperature of the magnetic sensing part of the magnetoresistive element which comprises each magnetic detection part becomes uniform.

この発明によれば、磁気センサを構成する複数の磁気抵抗素子の温度を均一にすることができるので、磁気抵抗素子が有する抵抗温度特性の影響を抑制することができる。これにより、抵抗温度特性による出力信号の変化を補正する必要が無く、高精度な磁気検知を実現することができる。   According to this invention, since the temperature of the several magnetoresistive element which comprises a magnetic sensor can be made uniform, the influence of the resistance temperature characteristic which a magnetoresistive element has can be suppressed. Thereby, it is not necessary to correct the change of the output signal due to the resistance temperature characteristic, and highly accurate magnetic detection can be realized.

本発明の第1の実施形態に係る磁気センサについて図を参照して説明する。   A magnetic sensor according to a first embodiment of the present invention will be described with reference to the drawings.

図1(A)は本実施形態の磁気センサの磁気検出部10の構成を示す平面図であり、図1(B)は磁気検出部10の等価回路図である。   FIG. 1A is a plan view showing the configuration of the magnetic detection unit 10 of the magnetic sensor of this embodiment, and FIG. 1B is an equivalent circuit diagram of the magnetic detection unit 10.

磁気検出部10は、図1(A)に示すように、感磁部と、該感磁部を接続する接続ライン電極と、電圧入出力やグランドへの接続に用いる外部接続用電極とを、基板11上に形成することで、図1(B)に示すような回路を構成する。すなわち、磁気抵抗素子MR1,MR2が電圧入力端子Vinとグランド端子GNDとの間に直列接続され、磁気抵抗素子MR1,MR2の接続点に電圧出力端子Voutが接続される回路を構成する。以下に、具体的な構成について示す。   As shown in FIG. 1A, the magnetic detection unit 10 includes a magnetic sensing unit, a connection line electrode that connects the magnetic sensing unit, and an external connection electrode that is used for voltage input / output and ground connection. By forming on the substrate 11, a circuit as shown in FIG. That is, the magnetoresistive elements MR1 and MR2 are connected in series between the voltage input terminal Vin and the ground terminal GND, and the voltage output terminal Vout is connected to the connection point of the magnetoresistive elements MR1 and MR2. A specific configuration will be described below.

基板11は、例えばSi基板からなり、当該Si基板の表面に上述の回路を構成する感磁部(半導体膜)や電極が形成される。なお、基板としては、Si基板等の絶縁性基板の他に、GaAs:SiO2等の半絶縁性基板を用いることができる。基板11における磁気検出部10の形成領域の第一方向(図1(A)における縦方向)に沿った一方端には、電圧入力端子Vinに対応する電圧入力用電極191、グランド端子GNDに対応するグランド接続用電極192が形成されており、他方端には、電圧出力端子Voutに対応する電圧出力用電極193が形成されている。これら電圧入力用電極191、グランド接続用電極192、および電圧出力用電極193は導電性材料からなる。また、電圧入力用電極191、グランド接続用電極192、および電圧出力用電極193は、形成領域の第一方向に垂直な第二方向(図1(A)における横方向)に延びる形状からなる。 The substrate 11 is made of, for example, a Si substrate, and a magnetically sensitive portion (semiconductor film) and electrodes constituting the above-described circuit are formed on the surface of the Si substrate. As the substrate, a semi-insulating substrate such as GaAs: SiO 2 can be used in addition to an insulating substrate such as a Si substrate. A voltage input electrode 191 corresponding to the voltage input terminal Vin and a ground terminal GND correspond to one end along the first direction (vertical direction in FIG. 1A) of the formation region of the magnetic detection unit 10 in the substrate 11. A ground connection electrode 192 is formed, and a voltage output electrode 193 corresponding to the voltage output terminal Vout is formed at the other end. The voltage input electrode 191, the ground connection electrode 192, and the voltage output electrode 193 are made of a conductive material. Further, the voltage input electrode 191, the ground connection electrode 192, and the voltage output electrode 193 have a shape extending in a second direction (lateral direction in FIG. 1A) perpendicular to the first direction of the formation region.

基板11における電圧入力用電極191およびグランド接続用電極192と、電圧出力用電極193との間の領域には、磁気抵抗素子MR1を構成する感磁部121〜124および接続ライン電極141〜145と、磁気抵抗素子MR2を構成する感磁部131〜134および接続ライン電極151〜155とが形成されている。   In a region between the voltage input electrode 191 and the ground connection electrode 192 and the voltage output electrode 193 on the substrate 11, the magnetic sensing parts 121 to 124 and the connection line electrodes 141 to 145 constituting the magnetoresistive element MR 1 are provided. Magnetic sensing portions 131 to 134 and connection line electrodes 151 to 155 constituting the magnetoresistive element MR2 are formed.

磁気抵抗素子MR1の感磁部121〜124は、例えば、InSbを材質とする半導体膜により形成され、長さが幅よりも大きい長尺状のパターンからなる。感磁部121〜124は、長尺方向に沿って、半導体膜上に所定間隔で導電体からなる短絡電極が形成されており、これら短絡電極の形成パターンにより磁界に対する感度が設定されている。ここで磁界に対する感度とは、感磁部を通過する磁束密度に応じて変化する抵抗値を意味し、磁束密度が所定量変化する場合に抵抗値が大きく変化するほど、高感度であると定義される。   The magnetic sensing parts 121 to 124 of the magnetoresistive element MR1 are formed of, for example, a semiconductor film made of InSb, and have a long pattern whose length is larger than the width. In the magnetic sensing parts 121 to 124, short-circuit electrodes made of a conductor are formed on the semiconductor film at predetermined intervals along the longitudinal direction, and the sensitivity to the magnetic field is set by the formation pattern of these short-circuit electrodes. Here, the sensitivity to the magnetic field means a resistance value that changes in accordance with the magnetic flux density that passes through the magnetic sensing portion, and is defined as a higher sensitivity as the resistance value changes greatly when the magnetic flux density changes by a predetermined amount. Is done.

感磁部121〜124は、長尺方向が前記第二方向に平行になるように配置されている。感磁部121と感磁部122は第一方向において近接して配置され、感磁部123と感磁部124も第一方向において近接して配置される。また、第一方向において、感磁部121,122が平行して形成された領域と、電圧入力用電極191およびグランド接続用電極192が形成された領域との間は、磁気抵抗素子MR2を構成する感磁部131,132が形成可能な距離だけ離間されている。さらに、第一方向において、感磁部121,122が平行して形成された領域と感磁部123,124が平行して形成された領域との間は、磁気抵抗素子MR2を構成する感磁部133,134が形成可能な距離だけ離間されている。そして、感磁部123,124が平行して形成された領域は、電圧出力用電極193に近接している。   The magnetic sensitive parts 121 to 124 are arranged so that the longitudinal direction is parallel to the second direction. The magnetic sensitive part 121 and the magnetic sensitive part 122 are arranged close to each other in the first direction, and the magnetic sensitive part 123 and the magnetic sensitive part 124 are also arranged close to each other in the first direction. Further, in the first direction, a magnetoresistive element MR2 is configured between a region where the magnetic sensitive portions 121 and 122 are formed in parallel and a region where the voltage input electrode 191 and the ground connection electrode 192 are formed. The magnetic sensitive parts 131 and 132 to be separated are separated by a distance that can be formed. Further, in the first direction, a magnetic sensing element constituting the magnetoresistive element MR2 is formed between a region in which the magnetic sensing parts 121 and 122 are formed in parallel and a region in which the magnetic sensing parts 123 and 124 are formed in parallel. The parts 133 and 134 are separated by a distance that can be formed. A region where the magnetic sensitive portions 123 and 124 are formed in parallel is close to the voltage output electrode 193.

磁気抵抗素子MR1の接続ライン電極141〜145は、電圧入力用電極191、グランド接続用電極192および電圧出力用電極193と同じ導電性材料により基板11表面に形成されており、例えば、電圧入力用電極191、グランド接続用電極192および電圧出力用電極193と同時にパターン形成されている。   The connection line electrodes 141 to 145 of the magnetoresistive element MR1 are formed on the surface of the substrate 11 by the same conductive material as the voltage input electrode 191, the ground connection electrode 192, and the voltage output electrode 193. A pattern is formed simultaneously with the electrode 191, the ground connection electrode 192, and the voltage output electrode 193.

接続ライン電極141は、互いに離間されたグランド接続用電極192と感磁部121とを電気的に接続するパターンからなり、接続ライン電極142は、互いに近接する感磁部121と感磁部122とを電気的に接続するパターンからなる。接続ライン電極143は、互いに離間された感磁部122と感磁部123とを電気的に接続するパターンからなり、接続ライン電極144は、互いに近接する感磁部123と感磁部124とを電気的に接続するパターンからなる。さらに、接続ライン電極145は、互いに近接する感磁部124と電圧出力用電極193とを接続するパターンからなる。これら接続ライン電極141〜145は、感磁部121〜124の長尺方向の両端に存在する領域に形成されている。   The connection line electrode 141 has a pattern for electrically connecting the ground connection electrode 192 and the magnetic sensing part 121 which are separated from each other, and the connection line electrode 142 is composed of the magnetic sensing part 121 and the magnetic sensing part 122 which are close to each other. It consists of the pattern which connects electrically. The connection line electrode 143 has a pattern that electrically connects the magnetic sensing part 122 and the magnetic sensing part 123 that are separated from each other, and the connection line electrode 144 connects the magnetic sensing part 123 and the magnetic sensing part 124 that are close to each other. It consists of an electrically connected pattern. Further, the connection line electrode 145 has a pattern for connecting the magnetic sensing part 124 and the voltage output electrode 193 that are close to each other. These connection line electrodes 141 to 145 are formed in regions existing at both ends in the longitudinal direction of the magnetic sensitive portions 121 to 124.

磁気抵抗素子MR2の感磁部131〜134は、例えば、InSbを材質とする半導体膜からなり、長さが幅よりも大きい長尺状のパターンである。感磁部131〜134は、半導体膜上に短絡電極が形成されていない。これにより、感磁部131〜134は、感磁部121〜124よりも磁束に対して低感度に設定されている。   The magnetic sensitive portions 131 to 134 of the magnetoresistive element MR2 are made of a semiconductor film made of InSb, for example, and are long patterns whose length is larger than the width. In the magnetic sensitive portions 131 to 134, no short-circuit electrode is formed on the semiconductor film. Thereby, the magnetic sensitive parts 131-134 are set to be less sensitive to magnetic flux than the magnetic sensitive parts 121-124.

感磁部131〜134は、長尺方向が前記第二方向に平行になるように配置されている。感磁部131と感磁部132は第一方向において近接して配置され、感磁部133と感磁部134も第一方向において近接して配置される。   The magnetic sensitive parts 131 to 134 are arranged so that the longitudinal direction is parallel to the second direction. The magnetic sensitive part 131 and the magnetic sensitive part 132 are arranged close to each other in the first direction, and the magnetic sensitive part 133 and the magnetic sensitive part 134 are also arranged close to each other in the first direction.

感磁部131,132は、第一方向において、上述の電圧入力用電極191およびグランド接続用電極192が形成された領域と磁気抵抗素子MR1の感磁部121,122が形成された領域との間に、配置されている。この際、磁気抵抗素子MR2の感磁部131,132と磁気抵抗素子MR1の感磁部121〜124は長尺方向が平行となるように配置される。さらに、磁気抵抗素子MR2の感磁部132と磁気抵抗素子MR1の感磁部121とは、第1方向において近接して配置される。   In the first direction, the magnetic sensitive portions 131 and 132 are formed by dividing the region where the voltage input electrode 191 and the ground connection electrode 192 are formed and the region where the magnetic sensitive portions 121 and 122 of the magnetoresistive element MR1 are formed. In between. At this time, the magnetic sensitive parts 131 and 132 of the magnetoresistive element MR2 and the magnetic sensitive parts 121 to 124 of the magnetoresistive element MR1 are arranged so that their longitudinal directions are parallel to each other. Further, the magnetic sensitive part 132 of the magnetoresistive element MR2 and the magnetic sensitive part 121 of the magnetoresistive element MR1 are arranged close to each other in the first direction.

感磁部133,134は、第一方向において、上述の磁気抵抗素子MR1の感磁部121,122が形成された領域と磁気抵抗素子MR1の感磁部123,124が形成された領域との間に配置されている。この際、磁気抵抗素子MR2の感磁部133,134と磁気抵抗素子MR1の感磁部121〜124は、長尺方向が平行となるように配置される。さらに、磁気抵抗素子MR2の感磁部133と磁気抵抗素子MR1の感磁部122は、第1方向において近接して配置されるとともに、磁気抵抗素子MR2の感磁部134と磁気抵抗素子MR1の感磁部123も、第1方向において近接して配置される。   In the first direction, the magnetic sensitive parts 133 and 134 are formed by dividing the region where the magnetic sensitive parts 121 and 122 of the magnetoresistive element MR1 are formed and the region where the magnetic sensitive parts 123 and 124 of the magnetoresistive element MR1 are formed. Arranged between. At this time, the magnetic sensitive parts 133 and 134 of the magnetoresistive element MR2 and the magnetic sensitive parts 121 to 124 of the magnetoresistive element MR1 are arranged so that their longitudinal directions are parallel to each other. Further, the magnetic sensing part 133 of the magnetoresistive element MR2 and the magnetic sensitive part 122 of the magnetoresistive element MR1 are arranged close to each other in the first direction, and the magnetic sensitive part 134 of the magnetoresistive element MR2 and the magnetoresistive element MR1 are The magnetic sensitive part 123 is also arranged close to the first direction.

接続ライン電極151は、互いに近接する電圧入力用電極191と感磁部131とを電気的に接続するパターンからなり、接続ライン電極152は、互いに近接する感磁部131と感磁部132とを電気的に接続するパターンからなる。接続ライン電極153は、互いに離間された感磁部132と感磁部133とを電気的に接続するパターンからなり、接続ライン電極154は、互いに近接する感磁部133と感磁部134とを電気的に接続するパターンからなる。さらに、接続ライン電極155は、互いに離間された感磁部134と電圧出力用電極193とを接続するパターンからなる。これら接続ライン電極151〜155は、感磁部131〜134の長尺方向の両端に存在する領域に形成されている。   The connection line electrode 151 has a pattern that electrically connects the voltage input electrode 191 and the magnetic sensing part 131 that are close to each other, and the connection line electrode 152 includes the magnetic sensing part 131 and the magnetic sensing part 132 that are close to each other. It consists of an electrically connected pattern. The connection line electrode 153 has a pattern that electrically connects the magnetic sensing part 132 and the magnetic sensing part 133 that are separated from each other, and the connection line electrode 154 connects the magnetic sensing part 133 and the magnetic sensing part 134 that are close to each other. It consists of an electrically connected pattern. Further, the connection line electrode 155 has a pattern for connecting the magnetic sensing part 134 and the voltage output electrode 193 that are separated from each other. These connection line electrodes 151 to 155 are formed in regions existing at both ends in the longitudinal direction of the magnetic sensitive portions 131 to 134.

以上のように、本実施形態の構成では、基板11上の磁気センサ10の形成領域において、第一方向に沿って、一方端(図1(A)の上端)から順に、(i)電圧入力用電極191およびグランド接続用電極192の電極群、(ii)磁気抵抗素子MR2の感磁部131,132、(iii)磁気抵抗素子MR1の感磁部121,122、(iv)磁気抵抗素子MR2の感磁部133,134、(v)磁気抵抗素子MR1の感磁部123,124、(vi)電圧出力用電極193が互いに近接して形成された構造となる。これは、すなわち、磁気抵抗素子MR1の感磁部の形成領域と、磁気抵抗素子MR2の感磁部の形成領域とが、第一方向に沿って、交互に配置されるとともに、これらが近接して配置されていることを意味する。これにより、磁気抵抗素子MR1の形成領域と磁気抵抗素子MR2の形成領域とが集中して離間されないので、磁気抵抗素子MR1の温度と磁気抵抗素子MR2の温度とが略同等になる。特に、本実施形態のように、磁気抵抗素子MR1の感磁部と磁気抵抗素子MR2の感磁部とが交互に複数回繰り返されて配置されることで、単に磁気抵抗素子MR1の感磁部と磁気抵抗素子MR2の感磁部とが隣接して配置されるよりも、さらに温度を同等にすることができる。そして、このような構成とすることで、図1(B)に示すような差動型の出力電圧信号を得る場合に、磁気抵抗素子MR1と磁気抵抗素子MR2との間での温度差を無くすことができるので、磁気抵抗素子MR1,MR2の抵抗温度特性に影響されることなく、磁気抵抗素子MR1,MR2の感磁量に応じた正確な出力電圧信号を得ることができる。   As described above, in the configuration of the present embodiment, in the formation region of the magnetic sensor 10 on the substrate 11, (i) voltage input in order from the one end (the upper end in FIG. 1A) along the first direction. Electrode group 191 and ground connection electrode 192, (ii) magnetosensitive parts 131 and 132 of magnetoresistive element MR2, (iii) magnetosensitive parts 121 and 122 of magnetoresistive element MR1, and (iv) magnetoresistive element MR2. (V) Magnetosensitive parts 123 and 124 of the magnetoresistive element MR1, and (vi) Voltage output electrode 193 are formed close to each other. In other words, the magnetic sensitive element MR1 formation region and the magnetoresistive element MR2 formation region are alternately arranged along the first direction, and they are close to each other. Means that it is arranged. As a result, the formation region of the magnetoresistive element MR1 and the formation region of the magnetoresistive element MR2 are not concentrated and separated from each other, so that the temperature of the magnetoresistive element MR1 and the temperature of the magnetoresistive element MR2 are substantially equal. In particular, as in the present embodiment, the magnetosensitive part of the magnetoresistive element MR1 and the magnetosensitive part of the magnetoresistive element MR2 are alternately and repeatedly arranged a plurality of times, so that the magnetosensitive part of the magnetoresistive element MR1 is simply arranged. And the magnetosensitive element MR2 are arranged adjacent to each other, the temperature can be made equal. With such a configuration, when a differential output voltage signal as shown in FIG. 1B is obtained, the temperature difference between the magnetoresistive element MR1 and the magnetoresistive element MR2 is eliminated. Therefore, it is possible to obtain an accurate output voltage signal corresponding to the magnetosensitive amount of the magnetoresistive elements MR1 and MR2 without being affected by the resistance temperature characteristics of the magnetoresistive elements MR1 and MR2.

さらに、上述の第二方向を被検出体の搬送方向とすることで、磁気抵抗素子MR1,MR2を構成する感磁部121〜124、131〜134の配列方向が、被検出体の搬送方向に直交する。これにより、被検出体による通過磁束の変化に応じた磁気抵抗素子MR1の抵抗値変化と磁気抵抗素子MR2の抵抗値変化とが時間軸上で一致する。ここで、上述のように、磁気抵抗素子MR2の感度を磁気抵抗素子MR1の感度よりも低くすることで、磁気抵抗素子MR2の抵抗値変化が、磁気抵抗素子MR1の抵抗値変化により打ち消される。   Furthermore, by setting the above-mentioned second direction as the transport direction of the detected object, the arrangement direction of the magnetic sensitive parts 121 to 124 and 131 to 134 constituting the magnetoresistive elements MR1 and MR2 is the transport direction of the detected object. Orthogonal. Thereby, the resistance value change of the magnetoresistive element MR1 and the resistance value change of the magnetoresistive element MR2 according to the change of the passing magnetic flux by the detection object coincide on the time axis. Here, as described above, by making the sensitivity of the magnetoresistive element MR2 lower than the sensitivity of the magnetoresistive element MR1, the change in resistance value of the magnetoresistive element MR2 is canceled by the change in resistance value of the magnetoresistive element MR1.

図2は本実施形態の構成の磁気センサの磁気検出部10と従来の構成(上述の特許文献2の図24の構成)の磁気センサの磁気検出部との出力電圧信号の波形を説明するための図であり、図2(A)が本実施形態の磁気センサの磁気検出部10の場合を示し、図2(B)が従来の構成の磁気センサの磁気検出部の場合を示す。   FIG. 2 is a diagram for explaining waveforms of output voltage signals from the magnetic detection unit 10 of the magnetic sensor having the configuration of the present embodiment and the magnetic detection unit of the magnetic sensor having the conventional configuration (the configuration of FIG. 24 of Patent Document 2 described above). FIG. 2A shows the case of the magnetic detection unit 10 of the magnetic sensor of the present embodiment, and FIG. 2B shows the case of the magnetic detection unit of the magnetic sensor having the conventional configuration.

図2(A)に示すように、本実施形態の構成を用いることで、出力電圧信号は、被検出体Mの通過に伴い発生するピーク(P0)が一つのみの波形となり、被検出体Mを正確に検知することができる。この際、上述のように磁気抵抗素子MR1,MR2の温度(T°)が一致するので、抵抗温度特性の影響を相殺でき、被検出体Mの磁束密度の大きさに応じた正確な出力電圧信号レベルが得られる。一方で、図2(B)に示すように、従来の構成を用いると、出力電圧信号は被検出体Mが磁気抵抗素子MR1を通過した際のピーク(P1)と、被検出体が磁気抵抗素子MR2を通過した際のピーク(P2)との二つのピークを有することになる。このため、一つの被検出体に対して二つのピークが検知されることになってしまう。そして、これらのピークは、それぞれの磁気抵抗素子MR1,MR2の形成位置の温度に依存するので、これら形成位置の温度が相違すれば、これらを単に加減算や乗除算しても、抵抗温度特性の影響を相殺することができず、被検出体の磁束密度の大きさに応じた出力電圧信号レベルを正確に検知することができない。   As shown in FIG. 2 (A), by using the configuration of the present embodiment, the output voltage signal has a waveform with only one peak (P0) generated along the passage of the detected object M, and the detected object. M can be detected accurately. At this time, since the temperatures (T °) of the magnetoresistive elements MR1 and MR2 coincide with each other as described above, the influence of the resistance temperature characteristics can be offset, and an accurate output voltage corresponding to the magnitude of the magnetic flux density of the detection target M can be obtained. A signal level is obtained. On the other hand, as shown in FIG. 2B, when the conventional configuration is used, the output voltage signal has a peak (P1) when the detected object M passes the magnetoresistive element MR1, and the detected object is magnetoresistive. It has two peaks, a peak (P2) when passing through the element MR2. For this reason, two peaks will be detected with respect to one to-be-detected body. Since these peaks depend on the temperatures of the formation positions of the magnetoresistive elements MR1 and MR2, if the temperatures of these formation positions are different, even if they are simply added or subtracted or multiplied and divided, The influence cannot be canceled out, and the output voltage signal level corresponding to the magnitude of the magnetic flux density of the detected object cannot be detected accurately.

次に、第2の実施形態に係る磁気センサについて図を参照して説明する。   Next, a magnetic sensor according to a second embodiment will be described with reference to the drawings.

図3(A)は本実施形態の磁気センサの磁気検出部20の構成を示す平面図であり、図3(B)は磁気センサの磁気検出部20の等価回路図である。   FIG. 3A is a plan view showing the configuration of the magnetic detection unit 20 of the magnetic sensor of the present embodiment, and FIG. 3B is an equivalent circuit diagram of the magnetic detection unit 20 of the magnetic sensor.

本実施形態に示す磁気検出部20も、第1の実施形態に示した磁気検出部10と同様に、基板21上に感磁部や導電性の電極を形成することで、図3(B)に示す回路を構成する。そして、基板21、感磁部、導電性の電極の材質も第1の実施形態と同じである。   Similarly to the magnetic detection unit 10 shown in the first embodiment, the magnetic detection unit 20 shown in the present embodiment also forms a magnetic sensitive part and a conductive electrode on the substrate 21, so that FIG. The circuit shown in FIG. And the material of the board | substrate 21, a magnetic sensing part, and an electroconductive electrode is the same as 1st Embodiment.

基板21における磁気検出部20の形成領域の第二方向(図3(A)における横方向)に沿った一方端には、電圧入力用電極291、グランド接続用電極292が形成されており、他方端には、電圧出力用電極293が形成されている。   A voltage input electrode 291 and a ground connection electrode 292 are formed at one end along the second direction (lateral direction in FIG. 3A) of the formation region of the magnetic detection unit 20 in the substrate 21, and the other A voltage output electrode 293 is formed at the end.

基板21における電圧入力用電極291およびグランド接続用電極292と、電圧出力用電極293との間の領域には、磁気抵抗素子MR1を構成する感磁部221〜225および接続ライン電極241〜246と、磁気抵抗素子MR2を構成する感磁部231〜235および接続ライン電極251〜256とが形成されている。   In the region between the voltage input electrode 291 and the ground connection electrode 292 and the voltage output electrode 293 on the substrate 21, the magnetic sensing portions 221 to 225 and the connection line electrodes 241 to 246 constituting the magnetoresistive element MR 1 are provided. Magnetic sensing portions 231 to 235 and connection line electrodes 251 to 256 constituting the magnetoresistive element MR2 are formed.

磁気抵抗素子MR1の感磁部221〜225は、長さが幅よりも大きい長尺状のパターンであり、長尺方向に沿って、半導体膜上に所定間隔で導電体からなる短絡電極が形成されている。感磁部221〜225は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetosensitive elements 221 to 225 of the magnetoresistive element MR1 are long patterns whose length is larger than the width, and short-circuit electrodes made of a conductor are formed on the semiconductor film at predetermined intervals along the long direction. Has been. The magnetic sensitive parts 221 to 225 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部221と感磁部222は第一方向において近接して配置され、感磁部222と感磁部223は第一方向において磁気抵抗素子MR2の感磁部232,233が形成可能な距離だけ離間されている。感磁部223と感磁部224は第一方向において近接して配置され、感磁部224と感磁部225は第一方向において磁気抵抗素子MR2の感磁部234,235が形成可能な距離だけ離間されている。   The magnetic sensitive part 221 and the magnetic sensitive part 222 are arranged close to each other in the first direction, and the magnetic sensitive part 222 and the magnetic sensitive part 223 are distances that the magnetic sensitive parts 232 and 233 of the magnetoresistive element MR2 can form in the first direction. Are only separated. The magnetic sensitive part 223 and the magnetic sensitive part 224 are arranged close to each other in the first direction, and the magnetic sensitive part 224 and the magnetic sensitive part 225 are distances that the magnetic sensitive parts 234 and 235 of the magnetoresistive element MR2 can form in the first direction. Are only separated.

感磁部221とグランド接続用電極292は、接続ライン電極241により電気的に接続され、感磁部221,222は接続ライン電極242により電気的に接続される。感磁部222,223は接続ライン電極243により電気的に接続され、感磁部223、224は接続ライン電極244により電気的に接続される。感磁部224,225は接続ライン電極245により電気的に接続され、感磁部225と電圧出力用電極293は接続ライン電極246により電気的に接続される。   The magnetic sensitive part 221 and the ground connection electrode 292 are electrically connected by the connection line electrode 241, and the magnetic sensitive parts 221 and 222 are electrically connected by the connection line electrode 242. The magnetic sensitive parts 222 and 223 are electrically connected by the connection line electrode 243, and the magnetic sensitive parts 223 and 224 are electrically connected by the connection line electrode 244. The magnetic sensitive parts 224 and 225 are electrically connected by the connection line electrode 245, and the magnetic sensitive part 225 and the voltage output electrode 293 are electrically connected by the connection line electrode 246.

磁気抵抗素子MR2の感磁部231〜235は、長さが幅よりも大きい長尺状のパターンであり、短絡電極が形成されていない。感磁部231〜235は、感磁部221〜225と同様に、長尺方向が前記第二方向に平行になるように配置されている。   The magnetosensitive elements 231 to 235 of the magnetoresistive element MR2 are long patterns whose length is larger than the width, and no short-circuit electrode is formed. Similarly to the magnetic sensing units 221 to 225, the magnetic sensing units 231 to 235 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部231は、磁気抵抗素子MR1の感磁部221に対して感磁部222と対向する側で、感磁部221に近接して配置されている。   The magnetic sensing part 231 is arranged close to the magnetic sensing part 221 on the side facing the magnetic sensing part 222 with respect to the magnetic sensing part 221 of the magnetoresistive element MR1.

感磁部232と感磁部233は第一方向において近接するように、上述の磁気抵抗素子MR1の感磁部222と感磁部223との間の領域に配置されている。感磁部234と感磁部235は第一方向において近接するように、上述の磁気抵抗素子MR1の感磁部224と感磁部225との間の領域に配置されている。   The magnetic sensing part 232 and the magnetic sensing part 233 are arranged in a region between the magnetic sensing part 222 and the magnetic sensing part 223 of the magnetoresistive element MR1 so as to be close to each other in the first direction. The magnetic sensitive part 234 and the magnetic sensitive part 235 are arranged in a region between the magnetic sensitive part 224 and the magnetic sensitive part 225 of the magnetoresistive element MR1 so as to be close to each other in the first direction.

感磁部231と電圧入力用電極291は、接続ライン電極251によりに電気的に接続され、感磁部231,232は接続ライン電極252により電気的に接続される。感磁部232,233は接続ライン電極253により電気的に接続され、感磁部233、234は接続ライン電極254により電気的に接続される。感磁部234,235は接続ライン電極255により電気的に接続され、感磁部235と電圧出力用電極293は接続ライン電極256により電気的に接続される。   The magnetic sensing part 231 and the voltage input electrode 291 are electrically connected by the connection line electrode 251, and the magnetic sensing parts 231 and 232 are electrically connected by the connection line electrode 252. The magnetic sensitive parts 232 and 233 are electrically connected by the connection line electrode 253, and the magnetic sensitive parts 233 and 234 are electrically connected by the connection line electrode 254. The magnetic sensitive parts 234 and 235 are electrically connected by the connection line electrode 255, and the magnetic sensitive part 235 and the voltage output electrode 293 are electrically connected by the connection line electrode 256.

このような構成とすることで、二つの磁気抵抗素子MR1の感磁部221〜225と磁気抵抗素子MR2の感磁部231〜235は、第一方向に沿って、感磁部231、感磁部221、感磁部222、感磁部232、感磁部233、感磁部223、感磁部224、感磁部234、感磁部235、感磁部225の順に配列される。   With this configuration, the magnetic sensing parts 221 to 225 of the two magnetoresistive elements MR1 and the magnetic sensing parts 231 to 235 of the magnetoresistive element MR2 are arranged along the first direction. The parts 221, the magnetic sensitive part 222, the magnetic sensitive part 232, the magnetic sensitive part 233, the magnetic sensitive part 223, the magnetic sensitive part 224, the magnetic sensitive part 234, the magnetic sensitive part 235, and the magnetic sensitive part 225 are arranged in this order.

ここで、本実施形態では、構成する磁気抵抗素子が異なる組み合わせからなる隣り合う感磁部間の距離、例えば感磁部231と感磁部221との距離が、構成する磁気抵抗素子が同じ組み合わせからなる隣り合う感磁部間の距離、例えば感磁部221と感磁部222との距離よりも、さらに短く設定されている。   Here, in the present embodiment, the distance between adjacent magnetic sensing parts composed of different combinations of the magnetoresistive elements, for example, the distance between the magnetic sensitive part 231 and the magnetic sensitive part 221 is the same combination of the constituting magnetoresistive elements. Is set to be shorter than the distance between adjacent magnetic sensing parts, for example, the distance between the magnetic sensing part 221 and the magnetic sensing part 222.

このような構成により、磁気抵抗素子MR2の感磁部231と磁気抵抗素子MR1の感磁部221と組み合わせのように、異なる磁気抵抗素子を構成する感磁部同士が極近接された位置に配置される。これにより、第1の実施形態よりも、さらに磁気抵抗素子MR1,MR2間での温度差が無くなり、抵抗温度特性の影響をより効果的に抑制した出力電圧信号を得ることができる。   With such a configuration, the magnetic sensitive parts constituting the different magnetoresistive elements are arranged in close proximity to each other like the magnetic sensitive part 231 of the magnetoresistive element MR2 and the magnetic sensitive part 221 of the magnetoresistive element MR1. Is done. As a result, the temperature difference between the magnetoresistive elements MR1 and MR2 is further eliminated than in the first embodiment, and an output voltage signal in which the influence of the resistance temperature characteristic is more effectively suppressed can be obtained.

また、本実施形態においても感磁部の配列方向を被検出体搬送方向に直交させることで、被検出体の検知を正確に行うことができる。   Also in this embodiment, the detection object can be detected accurately by making the arrangement direction of the magnetic sensing parts orthogonal to the detection object conveyance direction.

次に、第3の実施形態に係る磁気センサについて図を参照して説明する。   Next, a magnetic sensor according to a third embodiment will be described with reference to the drawings.

図4(A)は本実施形態の磁気センサの磁気検出部30の構成を示す平面図であり、図4(B)は磁気センサの磁気検出部30の等価回路図である。   FIG. 4A is a plan view showing the configuration of the magnetic detection unit 30 of the magnetic sensor of this embodiment, and FIG. 4B is an equivalent circuit diagram of the magnetic detection unit 30 of the magnetic sensor.

本実施形態の磁気センサの磁気検出部30は、上述の第1、第2の実施形態に示したような出力電圧信号が一つ得られる構成ではなく、一つの電圧入力に対して、二つの出力電圧信号が得られる構成である。すなわち、図4(B)に示すように等価回路としては、電圧入力端子Vinとグランド端子(GND)との間に、磁気抵抗素子MR3,MR1の直列回路と、磁気抵抗素子MR2,MR4の直列回路とが並列接続され、磁気抵抗素子MR3,MR1の接続点が電圧出力端子Vout−Aに接続され、磁気抵抗素子MR2,MR4の接続点が電圧出力端子Vout−Bに接続される。   The magnetic detection unit 30 of the magnetic sensor of the present embodiment is not configured to obtain one output voltage signal as shown in the first and second embodiments described above. In this configuration, an output voltage signal can be obtained. That is, as shown in FIG. 4B, as an equivalent circuit, a series circuit of magnetoresistive elements MR3 and MR1 and a series of magnetoresistive elements MR2 and MR4 are provided between the voltage input terminal Vin and the ground terminal (GND). The circuit is connected in parallel, the connection point of the magnetoresistive elements MR3, MR1 is connected to the voltage output terminal Vout-A, and the connection point of the magnetoresistive elements MR2, MR4 is connected to the voltage output terminal Vout-B.

また、本実施形態に示す磁気検出部30も、第1、第2の実施形態に示した磁気検出部10,20と同様に、基板31上に感磁部や導電性の電極を形成することで、図4(B)に示す回路を構成する。そして、基板31、感磁部、導電性の電極の材質も第1、第2の実施形態と同じである。   The magnetic detection unit 30 shown in the present embodiment also forms a magnetic sensitive part and conductive electrodes on the substrate 31 in the same manner as the magnetic detection units 10 and 20 shown in the first and second embodiments. Thus, the circuit shown in FIG. And the material of the board | substrate 31, a magnetic sensing part, and an electroconductive electrode is also the same as 1st, 2nd embodiment.

基板31における磁気検出部30の形成領域の第二方向(図4(A)における横方向)に沿った一方端には、電圧入力端子Vinに対応する二つの電圧入力用電極3911,3912と、電圧出力端子Vout−Aに対応する一つ電圧出力用電極3931が形成されており、他方端には、グランド端子GNDに対応する二つのグランド接続用電極3921,3922と、電圧出力端子Vout−Bに対応する一つ電圧出力用電極3932が形成されている。   Two voltage input electrodes 3911 and 3912 corresponding to the voltage input terminal Vin are provided at one end along the second direction (lateral direction in FIG. 4A) of the formation region of the magnetic detection unit 30 on the substrate 31. One voltage output electrode 3931 corresponding to the voltage output terminal Vout-A is formed, two ground connection electrodes 3921 and 3922 corresponding to the ground terminal GND and the voltage output terminal Vout-B are formed at the other end. One voltage output electrode 3932 corresponding to is formed.

基板31における第二方向の一方端と他方端との間の領域には、磁気抵抗素子MR1を構成する感磁部3211,3221,3231および接続ライン電極3411,3421,3431,3441と、磁気抵抗素子MR2を構成する感磁部3312,3322,3332および接続ライン電極3512,3522,3532,3542と、磁気抵抗素子MR3を構成する感磁部3311,3321および接続ライン電極3511,3521,3441と、磁気抵抗素子MR4を構成する感磁部3212,3222および接続ライン電極3412,3422,3542とが形成されている。ここで、電圧出力用電極3931に接続する接続ライン電極3441は磁気抵抗素子MR1,MR3で共通であり、電圧出力用電極3932に接続する接続ライン電極3542は磁気抵抗素子MR2,MR4で共通である。   In a region between one end and the other end of the substrate 31 in the second direction, magnetic sensitive portions 3211, 3221, 3231 and connection line electrodes 3411, 3421, 3431, 3441 constituting the magnetoresistive element MR1, and a magnetoresistive element Magnetic sensing parts 3312, 3322, 3332 and connection line electrodes 3512, 3522, 3532, 3542 constituting the element MR2, magnetic sensing parts 3311, 3321 and connection line electrodes 3511, 3521, 3441 constituting the magnetoresistive element MR3, Magnetic sensitive portions 3212 and 3222 and connection line electrodes 3412, 3422, and 3542 constituting the magnetoresistive element MR4 are formed. Here, the connection line electrode 3441 connected to the voltage output electrode 3931 is common to the magnetoresistive elements MR1 and MR3, and the connection line electrode 3542 connected to the voltage output electrode 3932 is common to the magnetoresistive elements MR2 and MR4. .

磁気抵抗素子MR1を構成する感磁部3211,3221,3231は、長さが幅よりも大きい長尺状のパターンであり、長尺方向に沿って、半導体膜上に所定間隔で導電体からなる短絡電極が形成されている。感磁部3211,3221,3231は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensitive parts 3211, 3221, 3231 constituting the magnetoresistive element MR1 are long patterns whose length is larger than the width, and are made of a conductor on the semiconductor film at predetermined intervals along the long direction. A short circuit electrode is formed. The magnetic sensitive parts 3211, 3221, 3231 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部3211と感磁部3221は、第一方向において、磁気抵抗素子MR2の感磁部3332、3322、磁気抵抗素子MR4の感磁部3222,3212が形成可能な距離だけ離間されている。感磁部3221と感磁部3231は、第一方向において磁気抵抗素子MR3の感磁部3311,3321が形成可能な距離だけ離間されている。   In the first direction, the magnetic sensing part 3211 and the magnetic sensing part 3221 are separated by a distance that can be formed by the magnetic sensing parts 3332 and 3322 of the magnetoresistive element MR2 and the magnetic sensitive parts 3222 and 3212 of the magnetoresistive element MR4. The magnetic sensitive part 3221 and the magnetic sensitive part 3231 are separated from each other by a distance in which the magnetic sensitive parts 3311 and 3321 of the magnetoresistive element MR3 can be formed in the first direction.

感磁部3211とグランド接続用電極3921は接続ライン電極3411により電気的に接続され、感磁部3211,3221は接続ライン電極3421により電気的に接続され、感磁部3221,3231は接続ライン電極3431により電気的に接続され、感磁部3231と電圧出力用電極3931は接続ライン電極3441により電気的に接続されている。   The magnetic sensing part 3211 and the ground connection electrode 3921 are electrically connected by a connection line electrode 3411, the magnetic sensing parts 3211 and 3221 are electrically connected by a connection line electrode 3421, and the magnetic sensing parts 3221 and 3231 are connected line electrodes. The magnetic sensing portion 3231 and the voltage output electrode 3931 are electrically connected by the connection line electrode 3441.

磁気抵抗素子MR2を構成する感磁部3312,3322,3332は、長さが幅よりも大きい長尺状のパターンであり、長尺方向に沿って、半導体膜上に所定間隔で導電体からなる短絡電極が形成されている。感磁部3312,3322,3332は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensitive parts 3312, 3322, 3332 constituting the magnetoresistive element MR2 are long patterns whose length is larger than the width, and are made of a conductor on the semiconductor film at predetermined intervals along the long direction. A short circuit electrode is formed. The magnetic sensitive parts 3312, 3322, and 3332 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部3332は、磁気抵抗素子MR1の感磁部3211,3221間における、磁気抵抗素子MR1の感磁部3211に近接して設置されている。感磁部3322は、磁気抵抗素子MR1の感磁部3211,3221間における、磁気抵抗素子MR1の感磁部3221に近接して設置されている。この際、磁気抵抗素子MR2の感磁部3332,3322は、第一方向において磁気抵抗素子MR4の感磁部3212,3222が形成可能な距離だけ離間されている。   The magnetic sensing part 3332 is disposed in the vicinity of the magnetic sensing part 3211 of the magnetoresistive element MR1 between the magnetic sensing parts 3211 and 3221 of the magnetoresistive element MR1. The magnetic sensing part 3322 is disposed in the vicinity of the magnetic sensing part 3221 of the magnetoresistive element MR1 between the magnetic sensing parts 3211 and 3221 of the magnetoresistive element MR1. At this time, the magnetic sensing parts 3332 and 3322 of the magnetoresistive element MR2 are separated by a distance that the magnetic sensitive parts 3212 and 3222 of the magnetoresistive element MR4 can be formed in the first direction.

感磁部3312は、第一方向において磁気抵抗素子MR1の感磁部3231に対して感磁部3221,3322と反対側で且つ感磁部3231に近接して配置されている。   The magnetic sensing part 3312 is arranged on the opposite side to the magnetic sensing parts 3221 and 3322 with respect to the magnetic sensing part 3231 of the magnetoresistive element MR1 in the first direction and close to the magnetic sensing part 3231.

感磁部3312と電圧入力用電極3912は接続ライン電極3512により電気的に接続され、感磁部3312,3322は接続ライン電極3522により電気的に接続され、感磁部3322,3332は接続ライン電極3532により電気的に接続され、感磁部3332と電圧出力用電極3932は、接続ライン電極3542により電気的に接続されている。   The magnetic sensing portion 3312 and the voltage input electrode 3912 are electrically connected by a connection line electrode 3512, the magnetic sensitivity portions 3312 and 3322 are electrically connected by a connection line electrode 3522, and the magnetic sensitivity portions 3322 and 3332 are connected line electrodes. The magnetic sensing part 3332 and the voltage output electrode 3932 are electrically connected by a connection line electrode 3542.

磁気抵抗素子MR3を構成する感磁部3311,3321は、長さが幅よりも大きい長尺状のパターンであり、半導体膜上に導電体からなる短絡電極は形成されていない。感磁部3311,3321は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensitive parts 3311 and 3321 constituting the magnetoresistive element MR3 are long patterns whose length is larger than the width, and no short-circuit electrode made of a conductor is formed on the semiconductor film. The magnetic sensitive parts 3311 and 3321 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部3311,3321は、第一方向における磁気抵抗素子MR1の感磁部3221,3231間に、近接するように配置されている。   The magnetic sensitive parts 3311 and 3321 are disposed so as to be close to each other between the magnetic sensitive parts 3221 and 3231 of the magnetoresistive element MR1 in the first direction.

感磁部3311と電圧入力用電極3911は接続ライン電極3511により電気的に接続され、感磁部3311,3321は接続ライン電極3521により電気的に接続され、感磁部3321と電圧出力用電極3931は、接続ライン電極3441により電気的に接続されている。   The magnetic sensing part 3311 and the voltage input electrode 3911 are electrically connected by the connection line electrode 3511, the magnetic sensitivity parts 3311 and 3321 are electrically connected by the connection line electrode 3521, and the magnetic sensing part 3321 and the voltage output electrode 3931 are electrically connected. Are electrically connected by a connection line electrode 3441.

磁気抵抗素子MR4を構成する感磁部3212,3222は、長さが幅よりも大きい長尺状のパターンであり、半導体膜上に導電体からなる短絡電極は形成されていない。感磁部3212,3222は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensitive portions 3212 and 3222 constituting the magnetoresistive element MR4 are long patterns whose length is larger than the width, and no short-circuit electrode made of a conductor is formed on the semiconductor film. The magnetic sensitive parts 3212 and 3222 are arranged so that the longitudinal direction is parallel to the second direction.

感磁部3212,3222は、第一方向における磁気抵抗素子MR2の感磁部3332,3322間に、近接するように配置されている。   The magnetic sensitive parts 3212 and 3222 are disposed so as to be close to each other between the magnetic sensitive parts 3332 and 3322 of the magnetoresistive element MR2 in the first direction.

感磁部3212とグランド接続用電極3922は接続ライン電極3412により電気的に接続され、感磁部3212,3222は接続ライン電極3422により電気的に接続され、感磁部3222と電圧出力用電極3932は、接続ライン電極3542により電気的に接続されている。   The magnetic sensing part 3212 and the ground connection electrode 3922 are electrically connected by the connection line electrode 3412, the magnetic sensing parts 3212 and 3222 are electrically connected by the connection line electrode 3422, and the magnetic sensing part 3222 and the voltage output electrode 3932 are connected. Are electrically connected by a connection line electrode 3542.

このような構成とすることで、基板31上の第一方向に沿って、磁気抵抗素子MR1の感磁部3211、磁気抵抗素子MR2の感磁部3332、磁気抵抗素子MR4の感磁部3222,3212、磁気抵抗素子MR2の感磁部3322、磁気抵抗素子MR1の感磁部3221、磁気抵抗素子MR3の感磁部3311,3321、磁気抵抗素子MR1の感磁部3231、磁気抵抗素子MR2の感磁部3312が順に近接して配置される。   With such a configuration, along the first direction on the substrate 31, the magnetic sensitive part 3211 of the magnetoresistive element MR1, the magnetic sensitive part 3332 of the magnetoresistive element MR2, the magnetic sensitive part 3222 of the magnetoresistive element MR4, 3212, the magnetic sensing part 3322 of the magnetoresistive element MR2, the magnetic sensitive part 3221 of the magnetoresistive element MR1, the magnetic sensitive parts 3311 and 3321 of the magnetoresistive element MR3, the magnetic sensitive part 3231 of the magnetoresistive element MR1, and the magnetoresistive element MR2. The magnetic parts 3312 are arranged close to each other in order.

これにより、磁気抵抗素子MR1〜MR4の感磁部は、磁気抵抗素子MR1〜MR4毎に集中せず、入り組んだ構成となる。この結果、一つの入力電圧で二つの出力電圧が得られる磁気センサであっても、上述の各実施形態のように、磁気抵抗素子MR1〜MR4の抵抗温度特性による影響を抑制することができる。   As a result, the magnetosensitive portions of the magnetoresistive elements MR1 to MR4 are not concentrated for each of the magnetoresistive elements MR1 to MR4, and are intricately configured. As a result, even a magnetic sensor that can obtain two output voltages with one input voltage can suppress the influence of the resistance temperature characteristics of the magnetoresistive elements MR1 to MR4 as in the above-described embodiments.

なお、このような磁束変化に対する応答が時間軸上で一致する二つの出力電圧信号が得られることを利用し、これら二つの出力電圧信号の一方を極性反転処理して、二つの出力電圧信号を加算することで、よりピークレベルが高く、ピークが一つとなる検出信号を得ることができる。これにより、磁束密度の差に応じた検出信号のレベル差も大きくなるので、磁束密度に対する検出分解能を向上させることができ、より高精度な磁気センサを実現することができる。   By utilizing the fact that two output voltage signals whose responses to magnetic flux changes coincide on the time axis are obtained, one of these two output voltage signals is subjected to polarity inversion processing, and the two output voltage signals are By adding, a detection signal having a higher peak level and one peak can be obtained. Thereby, since the level difference of the detection signal according to the difference in magnetic flux density is also increased, the detection resolution with respect to the magnetic flux density can be improved, and a more accurate magnetic sensor can be realized.

次に、第4の実施形態に係る磁気センサについて図を参照して説明する。   Next, a magnetic sensor according to a fourth embodiment will be described with reference to the drawings.

図5(A)は本実施形態の磁気センサの磁気検出部40の構成を示す平面図であり、図5(B)は磁気センサの磁気検出部40の等価回路図である。   FIG. 5A is a plan view showing the configuration of the magnetic detection unit 40 of the magnetic sensor of the present embodiment, and FIG. 5B is an equivalent circuit diagram of the magnetic detection unit 40 of the magnetic sensor.

上述の各実施形態の磁気センサの磁気検出部では接続ライン電極の全てを基板の表面に直接形成した例を示したが、本実施形態の磁気センサの磁気検出部40は、接続ライン電極の一部が感磁部等の上面に形成された保護膜42の表面に形成されているものである。   In the magnetic detection unit of the magnetic sensor of each embodiment described above, an example in which all of the connection line electrodes are formed directly on the surface of the substrate is shown. However, the magnetic detection unit 40 of the magnetic sensor of the present embodiment is one of the connection line electrodes. The portion is formed on the surface of the protective film 42 formed on the upper surface of the magnetic sensitive portion or the like.

具体的には、磁気検出部40は以下の構成からなる。
基板41における磁気検出部40の形成領域の第一方向(図5(A)における縦方向)に沿った一方端には、電圧入力用電極491、グランド接続用電極492が形成されており、他方端には、電圧出力用電極493が形成されている。
Specifically, the magnetic detection unit 40 has the following configuration.
A voltage input electrode 491 and a ground connection electrode 492 are formed at one end along the first direction (vertical direction in FIG. 5A) of the formation region of the magnetic detection unit 40 in the substrate 41, and the other A voltage output electrode 493 is formed at the end.

基板41における電圧入力用電極491およびグランド接続用電極492と、電圧出力用電極493との間の領域には、磁気抵抗素子MR1を構成する感磁部421〜424と、磁気抵抗素子MR2を構成する感磁部431〜434とが形成されている。   In a region between the voltage input electrode 491 and the ground connection electrode 492 and the voltage output electrode 493 on the substrate 41, the magnetosensitive elements 421 to 424 configuring the magnetoresistive element MR1 and the magnetoresistive element MR2 are configured. Magnetic sensing parts 431 to 434 are formed.

磁気抵抗素子MR1の感磁部421〜424は、長さが幅よりも大きい長尺状のパターンであり、長尺方向に沿って、半導体膜上に所定間隔で導電体からなる短絡電極が形成されている。感磁部421〜424は、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensing elements 421 to 424 of the magnetoresistive element MR1 are long patterns whose length is larger than the width, and short-circuit electrodes made of a conductor are formed on the semiconductor film at predetermined intervals along the long direction. Has been. The magnetic sensitive parts 421 to 424 are arranged so that the longitudinal direction is parallel to the second direction.

磁気抵抗素子MR2の感磁部431〜434は、長さが幅よりも大きい長尺状のパターンであり、短絡電極が形成されていない。感磁部431〜434は、感磁部421〜424と同様に、長尺方向が前記第二方向に平行になるように配置されている。   The magnetosensitive elements 431 to 434 of the magnetoresistive element MR2 are long patterns whose length is larger than the width, and no short-circuit electrode is formed. Similarly to the magnetic sensing units 421 to 424, the magnetic sensing units 431 to 434 are arranged so that the longitudinal direction is parallel to the second direction.

そして、これら感磁部421〜424,431〜434は、第一方向に沿って、構成する磁気抵抗素子が順に交代するように、近接して配置されている。すなわち、電圧入力用電極491、グランド接続用電極492の形成領域側から順に、磁気抵抗素子MR2の感磁部431、磁気抵抗素子MR1の感磁部421、磁気抵抗素子MR2の感磁部432、磁気抵抗素子MR1の感磁部422、磁気抵抗素子MR2の感磁部433、磁気抵抗素子MR1の感磁部423、磁気抵抗素子MR2の感磁部434、磁気抵抗素子MR1の感磁部424が配置されている。   And these magnetic sensitive parts 421-424,431-434 are arrange | positioned adjacently so that the magnetoresistive element to comprise may change in order along a 1st direction. That is, in order from the formation region side of the voltage input electrode 491 and the ground connection electrode 492, the magnetosensitive part 431 of the magnetoresistive element MR2, the magnetosensitive part 421 of the magnetoresistive element MR1, the magnetosensitive part 432 of the magnetoresistive element MR2, A magnetic sensing part 422 of the magnetoresistive element MR1, a magnetic sensitive part 433 of the magnetoresistive element MR2, a magnetic sensitive part 423 of the magnetoresistive element MR1, a magnetic sensitive part 434 of the magnetoresistive element MR2, and a magnetic sensitive part 424 of the magnetoresistive element MR1. Has been placed.

また、基板41上には、接続ライン電極441,442,443,445,451,455が形成されている。接続ライン電極441はグランド接続用電極492と感磁部421とを電気的に接続し、接続ライン電極442は感磁部421,422を電気的に接続し、接続ライン電極443は感磁部422,423を電気的に接続し、接続ライン電極445は感磁部424と電圧出力用電極493とを電気的に接続する。接続ライン電極451は電圧入力用電極491と感磁部431とを電気的に接続し、接続ライン電極455は感磁部434と電圧出力用電極493とを電気的に接続する。   In addition, connection line electrodes 441, 442, 443, 445, 451, 455 are formed on the substrate 41. The connection line electrode 441 electrically connects the ground connection electrode 492 and the magnetic sensing part 421, the connection line electrode 442 electrically connects the magnetic sensing parts 421 and 422, and the connection line electrode 443 is the magnetic sensing part 422. , 423 are electrically connected, and the connection line electrode 445 electrically connects the magnetic sensing part 424 and the voltage output electrode 493. The connection line electrode 451 electrically connects the voltage input electrode 491 and the magnetic sensing part 431, and the connection line electrode 455 electrically connects the magnetic sensing part 434 and the voltage output electrode 493.

このような感磁部群と接続ライン電極群との表面には、絶縁性を有する保護膜42が形成されている。保護膜42の表面には、接続ライン電極452,453,454,444が形成されている。接続ライン電極452は保護膜42に形成された図示しないビアホールを介して感磁部431,432を電気的に接続し、接続ライン電極453は保護膜42に形成された図示しないビアホールを介して感磁部432,433を電気的に接続し、接続ライン電極454は保護膜42に形成された図示しないビアホールを介して感磁部433,434を電気的に接続する。また、接続ライン電極444は保護膜42に形成された図示しないビアホールを介して感磁部423,424を電気的に接続する。   A protective film 42 having an insulating property is formed on the surfaces of the magnetic sensitive part group and the connection line electrode group. Connection line electrodes 452, 453, 454, and 444 are formed on the surface of the protective film. The connection line electrode 452 electrically connects the magnetic sensing portions 431 and 432 through via holes (not shown) formed in the protective film 42, and the connection line electrode 453 is sensed through via holes (not shown) formed in the protective film 42. The magnetic portions 432 and 433 are electrically connected, and the connection line electrode 454 electrically connects the magnetic sensitive portions 433 and 434 through via holes (not shown) formed in the protective film 42. The connection line electrode 444 electrically connects the magnetic sensitive portions 423 and 424 through via holes (not shown) formed in the protective film 42.

このような構成とすることで、異なる磁気抵抗素子MR1,MR2をそれぞれに構成する複数の感磁部が、一本毎に第一方向に沿って順次交代しながら配置される。これにより、磁気抵抗素子MR1,MR2での温度を、さらに正確に一致させることができる。   By adopting such a configuration, a plurality of magnetosensitive portions that respectively configure different magnetoresistive elements MR1 and MR2 are arranged alternately one by one along the first direction. As a result, the temperatures at the magnetoresistive elements MR1 and MR2 can be matched more accurately.

また、接続ライン電極を二層に分けて配置することで、電極の引き回しパターンを容易にすることができる。   Further, by arranging the connection line electrodes in two layers, the electrode routing pattern can be facilitated.

次に、第5の実施形態に係る磁気センサについて図を参照して説明する。   Next, a magnetic sensor according to a fifth embodiment will be described with reference to the drawings.

図6(A)は本実施形態の磁気センサの磁気検出部50の構成を示す平面図であり、図5(B)は磁気センサの磁気検出部50の等価回路図である。   FIG. 6A is a plan view showing the configuration of the magnetic detection unit 50 of the magnetic sensor of this embodiment, and FIG. 5B is an equivalent circuit diagram of the magnetic detection unit 50 of the magnetic sensor.

本実施形態の磁気センサの磁気検出部50は、第3の実施形態で示したような一入力二出力の磁気センサに対して、第4の実施形態で示した接続ライン電極の二層構造を適用したものである。   The magnetic detection unit 50 of the magnetic sensor according to the present embodiment has the two-layer structure of the connection line electrodes shown in the fourth embodiment as compared with the one-input two-output magnetic sensor as shown in the third embodiment. It is applied.

具体的には、磁気検出部50は以下の構成からなる。
基板51における磁気検出部50の形成領域の第二方向(図6(A)における横方向)に沿った一方端には、電圧入力用電極5911,5912、グランド接続用電極5921,5922が形成されており、他方端には、電圧出力用電極5931,5932が形成されている。
Specifically, the magnetic detection unit 50 has the following configuration.
Voltage input electrodes 5911 and 5912 and ground connection electrodes 5921 and 5922 are formed at one end along the second direction (lateral direction in FIG. 6A) of the formation region of the magnetic detection unit 50 on the substrate 51. At the other end, voltage output electrodes 5931 and 5932 are formed.

また、基板51には、磁気抵抗素子MR1を構成する感磁部5211,5221,5231と、磁気抵抗素子MR2を構成する感磁部5312,5322,5332と、磁気抵抗素子MR3を構成する感磁部5311,5321,5331と、磁気抵抗素子MR4を構成する感磁部5212,5222,5232とが形成されている。   Further, on the substrate 51, magnetic sensitive parts 5211, 5221, 5231 constituting the magnetoresistive element MR1, magnetic sensitive parts 5312, 5322, 5332 constituting the magnetoresistive element MR2, and a magnetic sensitive part constituting the magnetoresistive element MR3. Portions 5311, 5321, and 5331 and magnetic sensitive portions 5212, 5222, and 5232 forming the magnetoresistive element MR4 are formed.

磁気抵抗素子MR1,MR2の感磁部5211,5221,5231、5312,5322,5332は、長さが幅よりも大きい長尺状のパターンであり、短絡電極が形成されておらず、長尺方向が前記第二方向に平行になるように配置されている。   The magnetosensitive elements 5211, 5221, 5231, 5312, 5322, and 5332 of the magnetoresistive elements MR 1 and MR 2 are long patterns whose length is larger than the width, no short-circuit electrode is formed, and the long direction Are arranged so as to be parallel to the second direction.

磁気抵抗素子MR3,MR4の感磁部5311,5321,5331,5212,5222,5232は、長さが幅よりも大きい長尺状のパターンであり、長尺方向に沿って半導体膜上に所定間隔で導電体からなる短絡電極が形成されており、長尺方向が前記第二方向に平行になるように配置されている。   The magnetic sensitive parts 5311, 5321, 5331, 5212, 5222, and 5232 of the magnetoresistive elements MR3 and MR4 are long patterns whose length is larger than the width, and are arranged on the semiconductor film at predetermined intervals along the long direction. The short-circuit electrode made of a conductor is formed, and is arranged so that the longitudinal direction is parallel to the second direction.

そして、これらの感磁部は、第一方向に沿って、構成する磁気抵抗素子が順に一本ずつ交代するように、近接して配置されている。すなわち、磁気検出部50の形成領域における第一方向の一方端(図6(A)の上端)から順に、磁気抵抗素子MR4の感磁部5232、磁気抵抗素子MR3の感磁部5311、磁気抵抗素子MR2の感磁部5332、磁気抵抗素子MR1の感磁部5211、磁気抵抗素子MR4の感磁部5222、磁気抵抗素子MR3の感磁部5231、磁気抵抗素子MR2の感磁部5322、磁気抵抗素子MR1の感磁部5221、磁気抵抗素子MR4の感磁部5212、磁気抵抗素子MR3の感磁部5331、磁気抵抗素子MR2の感磁部5312、磁気抵抗素子MR1の感磁部5231が配置されている。   These magnetic sensitive portions are arranged close to each other so that the magnetoresistive elements constituting the magnetic material change one by one along the first direction. That is, in order from the one end in the first direction (the upper end of FIG. 6A) in the formation region of the magnetic detection unit 50, the magnetic sensing part 5232 of the magnetoresistive element MR4, the magnetic sensing part 5311 of the magnetoresistive element MR3, and the magnetoresistance Magnetic sensing part 5332 of element MR2, magnetic sensing part 5211 of magnetoresistive element MR1, magnetic sensing part 5222 of magnetoresistive element MR4, magnetic sensitive part 5231 of magnetoresistive element MR3, magnetic sensitive part 5322 of magnetoresistive element MR2, magnetic resistance A magnetic sensitive part 5221 of the element MR1, a magnetic sensitive part 5212 of the magnetoresistive element MR4, a magnetic sensitive part 5331 of the magnetoresistive element MR3, a magnetic sensitive part 5312 of the magnetoresistive element MR2, and a magnetic sensitive part 5231 of the magnetoresistive element MR1 are arranged. ing.

また、基板51上には、磁気抵抗素子MR1〜MR4と電圧入力用電極、電圧出力用電極、グランド接続用電極とを接続する接続ライン電極5411,5412,5441,5442,5511,5512,5541,5542が形成されている。   On the substrate 51, connection line electrodes 5411, 5412, 5441, 5442, 5511, 5512, 5541, which connect the magnetoresistive elements MR1 to MR4 to the voltage input electrode, the voltage output electrode, and the ground connection electrode. 5542 is formed.

接続ライン電極5411は磁気抵抗素子MR1の感磁部5211とグランド接続用電極5921とを接続し、接続ライン電極5412は磁気抵抗素子MR4の感磁部5212とグランド接続用電極5922とを接続する。接続ライン電極5441は磁気抵抗素子MR1の感磁部5231と電圧出力用電極5931とを接続し、接続ライン電極5442は磁気抵抗素子MR4の感磁部5232と電圧出力用電極5932とを接続する。接続ライン電極5511は磁気抵抗素子MR3の感磁部5311と電圧入力用電極5911とを接続し、接続ライン電極5512は磁気抵抗素子MR2の感磁部5312と電圧入力用電極5912とを接続する。接続ライン電極5541は磁気抵抗素子MR3の感磁部5331と電圧出力用電極5931とを接続し、接続ライン電極5542は磁気抵抗素子MR2の感磁部5332と電圧出力用電極5932とを接続する。   The connection line electrode 5411 connects the magnetic sensing part 5211 of the magnetoresistive element MR1 and the ground connection electrode 5921, and the connection line electrode 5412 connects the magnetic sensing part 5212 of the magnetoresistive element MR4 and the ground connection electrode 5922. The connection line electrode 5441 connects the magnetic sensing part 5231 of the magnetoresistive element MR1 and the voltage output electrode 5931, and the connection line electrode 5442 connects the magnetic sensing part 5232 of the magnetoresistive element MR4 and the voltage output electrode 5932. The connection line electrode 5511 connects the magnetic sensing part 5311 of the magnetoresistive element MR3 and the voltage input electrode 5911, and the connection line electrode 5512 connects the magnetic sensing part 5312 of the magnetoresistive element MR2 and the voltage input electrode 5912. The connection line electrode 5541 connects the magnetic sensing part 5331 of the magnetoresistive element MR3 and the voltage output electrode 5931, and the connection line electrode 5542 connects the magnetic sensing part 5332 of the magnetoresistive element MR2 and the voltage output electrode 5932.

このような感磁部群と接続ライン電極群との表面には、絶縁性を有する保護膜52が形成されている。保護膜52の表面には、各磁気抵抗素子MR1〜MR4内における複数の感磁部を接続する接続ライン電極5421,5431,5522,5532,5521,5531,5422,5432が形成されている。   A protective film 52 having an insulating property is formed on the surfaces of the magnetically sensitive portion group and the connection line electrode group. On the surface of the protective film 52, connection line electrodes 5421, 5431, 5522, 5532, 5521, 5531, 5422, and 5432 are formed for connecting a plurality of magnetic sensing portions in the magnetoresistive elements MR1 to MR4.

接続ライン電極5421は磁気抵抗素子MR1の感磁部5211,5221を接続し、接続ライン電極5431は磁気抵抗素子MR1の感磁部5221,5231を接続する。接続ライン電極5522は磁気抵抗素子MR2の感磁部5312,5322を接続し、接続ライン電極5532は磁気抵抗素子MR2の感磁部5322,5332を接続する。接続ライン電極5521は磁気抵抗素子MR3の感磁部5311,5321を接続し、接続ライン電極5531は磁気抵抗素子MR3の感磁部5321,5331を接続する。接続ライン電極5422は磁気抵抗素子MR4の感磁部5212,5222を接続し、接続ライン電極5432は磁気抵抗素子MR4の感磁部5222,5232を接続する。なお、図示していないが、これらの接続ライン電極は、保護膜52に形成されたビアホールを介して各感磁部へ接続している。   The connection line electrode 5421 connects the magnetic sensitive parts 5211 and 5221 of the magnetoresistive element MR1, and the connection line electrode 5431 connects the magnetic sensitive parts 5221 and 5231 of the magnetoresistive element MR1. The connection line electrode 5522 connects the magnetic sensing parts 5312 and 5322 of the magnetoresistive element MR2, and the connection line electrode 5532 connects the magnetic sensing parts 5322 and 5332 of the magnetoresistive element MR2. The connection line electrode 5521 connects the magnetic sensing parts 5311 and 5321 of the magnetoresistive element MR3, and the connection line electrode 5531 connects the magnetic sensing parts 5321 and 5331 of the magnetoresistive element MR3. The connection line electrode 5422 connects the magnetic sensing parts 5212 and 5222 of the magnetoresistive element MR4, and the connection line electrode 5432 connects the magnetic sensing parts 5222 and 5232 of the magnetoresistive element MR4. Although not shown in the drawing, these connection line electrodes are connected to each magnetic sensing portion through via holes formed in the protective film 52.

このような構成とすることで、異なる磁気抵抗素子MR1〜MR4をそれぞれに構成する複数の感磁部が、一本毎に第一方向に沿って順次交代しながら配置される。これにより、磁気抵抗素子MR1〜MR4での温度を、さらに正確に一致させることができる。   By setting it as such a structure, the several magnetic sensing part which each comprises different magnetoresistive elements MR1-MR4 is arrange | positioned by changing one by one along a 1st direction one by one. Thereby, the temperature in magnetoresistive element MR1-MR4 can be matched more correctly.

また、接続ライン電極を二層に分けて配置することで、電極の引き回しパターンを容易にすることができる。   Further, by arranging the connection line electrodes in two layers, the electrode routing pattern can be facilitated.

なお、本発明の磁気センサにおいては、上述の磁気検出部の他に、バイアス磁界を印加する磁石(図示せず)を備えてもよい。このようにバイアス磁界を印加することで、磁気センサの通過磁束変化による抵抗値変化をより高感度な領域へシフトさせることができるので、上述の各作用効果と組み合わせることで、さらに高感度且つ高精度な温度依存性の低い磁気センサを構成することができる。   The magnetic sensor of the present invention may include a magnet (not shown) for applying a bias magnetic field in addition to the above-described magnetic detection unit. By applying the bias magnetic field in this way, it is possible to shift the resistance value change due to the magnetic flux passing through the magnetic sensor to a more sensitive region. An accurate magnetic sensor with low temperature dependence can be configured.

第1の実施形態の磁気センサ10の構成を示す平面図および等価回路図である。It is the top view and equivalent circuit diagram which show the structure of the magnetic sensor 10 of 1st Embodiment. 第1の実施形態の構成の磁気センサ10と従来の構成の磁気センサとの出力電圧信号の波形を説明するための図である。It is a figure for demonstrating the waveform of the output voltage signal of the magnetic sensor 10 of the structure of 1st Embodiment, and the magnetic sensor of the conventional structure. 第2の実施形態の磁気センサ20の構成を示す平面図および等価回路図である。It is the top view and equivalent circuit diagram which show the structure of the magnetic sensor 20 of 2nd Embodiment. 第3の実施形態の磁気センサ30の構成を示す平面図および等価回路図である。It is the top view and equivalent circuit diagram which show the structure of the magnetic sensor 30 of 3rd Embodiment. 第4の実施形態の磁気センサ40の構成を示す平面図および等価回路図である。It is the top view and equivalent circuit diagram which show the structure of the magnetic sensor 40 of 4th Embodiment. 第5の実施形態の磁気センサ50の構成を示す平面図および等価回路図である。It is the top view and equivalent circuit diagram which show the structure of the magnetic sensor 50 of 5th Embodiment.

符号の説明Explanation of symbols

10,20,30,40,50−磁気センサの磁気検出部、11,21,31,41,51−基板、42,52−保護膜、121〜124,131〜134,221〜225,231〜235−感磁部、141〜145,151〜155,241〜246,251〜256−接続用ライン電極、191,291−電圧入力用電極、192,292−グランド接続用電極、193,293−電圧出力用電極、MR1〜MR4−磁気抵抗素子、M−被検出体 10, 20, 30, 40, 50—Magnetic detection part of magnetic sensor, 11, 21, 31, 41, 51—Substrate, 42, 52—Protective film, 121-124, 131-134, 221-225, 231- 235-Magnetic sensing portion, 141-145, 151-155, 241-246, 251-256-connection line electrode, 191,291-voltage input electrode, 192,292-ground connection electrode, 193,293-voltage Output electrode, MR1 to MR4-magnetoresistance element, M-detected body

Claims (6)

通過磁束により抵抗値の変化する感磁部を基板表面に形成してなる複数の磁気抵抗素子を直列接続し、該直列接続された複数の磁気抵抗素子によって分圧される電圧を出力信号とする磁気検出部を備えた磁気センサであって、
前記磁気抵抗素子のそれぞれは、長尺状に形成された複数の前記感磁部と、該複数の前記感磁部を直列接続する接続導体部と、を有し、
前記複数の磁気抵抗素子をそれぞれ構成する複数の感磁部は、一方向に並んで配置され、
一つの磁気抵抗素子を構成する少なくとも一つの感磁部が当該一つの磁気抵抗素子を構成する他の複数の感磁部に対して両側から隣り合わないように、全ての磁気抵抗素子の感磁部が配置されている、磁気センサ。
A plurality of magnetoresistive elements formed by forming a magnetosensitive part whose resistance value is changed by the passing magnetic flux on the substrate surface are connected in series, and a voltage divided by the plurality of magnetoresistive elements connected in series is used as an output signal. A magnetic sensor including a magnetic detection unit,
Each of the magnetoresistive elements includes a plurality of the magnetically sensitive portions formed in a long shape, and a connection conductor portion that connects the plurality of magnetically sensitive portions in series.
The plurality of magnetic sensing parts that respectively constitute the plurality of magnetoresistive elements are arranged in one direction,
Magnetosensitivity of all magnetoresistive elements so that at least one magnetosensitive part constituting one magnetoresistive element is not adjacent to a plurality of other magnetosensitive parts constituting the one magnetoresistive element from both sides. Magnetic sensor in which the part is arranged.
前記複数の磁気抵抗素子は異なる感度を有し、
前記一つの磁気抵抗素子の一つの感磁部と、前記一つの磁気抵抗素子と感度の異なる別の磁気抵抗素子の一つの感磁部とが隣り合うように配置された一対の配列が複数形成されている、請求項1に記載の磁気センサ。
The plurality of magnetoresistive elements have different sensitivities;
A plurality of pairs of arrays in which one magnetosensitive part of the one magnetoresistive element and one magnetosensitive part of another magnetoresistive element having different sensitivity from the one magnetoresistive element are adjacent to each other are formed. The magnetic sensor according to claim 1.
前記複数の磁気抵抗素子をそれぞれ構成する複数の感磁部は、前記長尺方向に垂直な方向に沿って平行になるように配置されている、請求項1または請求項2に記載の磁気センサ。   3. The magnetic sensor according to claim 1, wherein the plurality of magnetosensitive portions respectively constituting the plurality of magnetoresistive elements are arranged so as to be parallel along a direction perpendicular to the longitudinal direction. . 前記長尺方向が被検出体の搬送方向に平行である、請求項1〜請求項3のいずれかに記載の磁気センサ。   The magnetic sensor according to any one of claims 1 to 3, wherein the longitudinal direction is parallel to a conveyance direction of the detection object. 前記感磁部を接続する接続電極は、前記基板の前記感磁部を有する面とともに、当該面に対して前記感磁部を覆うように形成された絶縁層の表面にも形成されている、請求項1〜請求項4のいずれかに記載の磁気センサ。   The connection electrode for connecting the magnetic sensitive part is formed on the surface of the substrate having the magnetic sensitive part and also on the surface of the insulating layer formed so as to cover the magnetic sensitive part with respect to the surface. The magnetic sensor in any one of Claims 1-4. 前記磁気検出部を複数備え、該複数の磁気検出部に対して、前記一つの磁気抵抗素子を構成する一つの感磁部が当該一つの磁気抵抗素子を構成する他の複数の感磁部に対して両側から隣り合わないように、全ての磁気抵抗素子の感磁部を配置する、請求項1〜請求項5のいずれかに記載の磁気センサ。   A plurality of the magnetic detection units are provided, and one magnetic sensing unit constituting the one magnetoresistive element corresponds to the plurality of other magnetic sensing units constituting the one magnetoresistive element. 6. The magnetic sensor according to claim 1, wherein the magnetically sensitive portions of all the magnetoresistive elements are arranged so as not to be adjacent from both sides.
JP2008224297A 2008-09-02 2008-09-02 Magnetic sensor Expired - Fee Related JP4735686B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008224297A JP4735686B2 (en) 2008-09-02 2008-09-02 Magnetic sensor
EP09251952A EP2159586B1 (en) 2008-09-02 2009-08-06 Magnetic sensor
KR1020090081261A KR20100027979A (en) 2008-09-02 2009-08-31 Magnetic sensor
CN200910170660.3A CN101666864B (en) 2008-09-02 2009-09-01 Magnetic sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008224297A JP4735686B2 (en) 2008-09-02 2008-09-02 Magnetic sensor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011025890A Division JP4771015B2 (en) 2011-02-09 2011-02-09 Magnetic sensor

Publications (2)

Publication Number Publication Date
JP2010060341A true JP2010060341A (en) 2010-03-18
JP4735686B2 JP4735686B2 (en) 2011-07-27

Family

ID=41278876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008224297A Expired - Fee Related JP4735686B2 (en) 2008-09-02 2008-09-02 Magnetic sensor

Country Status (4)

Country Link
EP (1) EP2159586B1 (en)
JP (1) JP4735686B2 (en)
KR (1) KR20100027979A (en)
CN (1) CN101666864B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103267955A (en) * 2013-05-28 2013-08-28 江苏多维科技有限公司 Single-chip bridge-type magnetic field sensor
CN110998349A (en) * 2017-08-16 2020-04-10 株式会社村田制作所 Magnetic sensor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7220602B2 (en) * 2005-07-29 2007-05-22 Freescale Semiconductor, Inc. Magnetic tunnel junction sensor method
CN102683582A (en) 2011-03-11 2012-09-19 曲炳郡 Method for manufacturing high sensitivity magnetic sensor chip
JP5867235B2 (en) 2011-05-16 2016-02-24 三菱電機株式会社 Magnetic sensor device
TWI409488B (en) * 2011-09-29 2013-09-21 Voltafield Technology Corp Magnatoresistive sensing component and magnatoresistive sensing device
CN103090888A (en) * 2011-11-04 2013-05-08 新科实业有限公司 Magnetic sensor with bypass layers and manufacturing method of magnetic sensor
WO2018116783A1 (en) * 2016-12-21 2018-06-28 株式会社村田製作所 Magnetic sensor
JP2020519249A (en) * 2017-05-01 2020-07-02 ザ ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティー Accurate temperature measurement method for giant magnetoresistive biosensor array
CN110535456A (en) * 2019-08-26 2019-12-03 基康仪器股份有限公司 A kind of coding control method and switching system based on magnetosensitive

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5011588A (en) * 1973-05-31 1975-02-06
JPS59114412A (en) * 1982-12-21 1984-07-02 Copal Co Ltd Magnetic detector with magneto-resistance element
JPH01300578A (en) * 1988-05-30 1989-12-05 Fujitsu Ltd Magneto-resistance element
JPH08313296A (en) * 1995-05-23 1996-11-29 Sankyo Seiki Mfg Co Ltd Magnetic detecting apparatus
JP2001004728A (en) * 1999-09-02 2001-01-12 Micro Magune Kk Magnetism detecting apparatus
JP2003188438A (en) * 2001-12-18 2003-07-04 Murata Mfg Co Ltd Magneto-resistive element
JP2003215222A (en) * 2002-01-23 2003-07-30 Denso Corp Magneto-resistance effect element sensor
JP2006098088A (en) * 2004-09-28 2006-04-13 Yamaha Corp Magnetometric sensor using huge magnetoresistive element, and manufacturing method of magnetometric sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100698413B1 (en) * 2004-09-28 2007-03-23 야마하 가부시키가이샤 Magnetic sensor using giant magnetoresistive elements and method for manufacturing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5011588A (en) * 1973-05-31 1975-02-06
JPS59114412A (en) * 1982-12-21 1984-07-02 Copal Co Ltd Magnetic detector with magneto-resistance element
JPH01300578A (en) * 1988-05-30 1989-12-05 Fujitsu Ltd Magneto-resistance element
JPH08313296A (en) * 1995-05-23 1996-11-29 Sankyo Seiki Mfg Co Ltd Magnetic detecting apparatus
JP2001004728A (en) * 1999-09-02 2001-01-12 Micro Magune Kk Magnetism detecting apparatus
JP2003188438A (en) * 2001-12-18 2003-07-04 Murata Mfg Co Ltd Magneto-resistive element
JP2003215222A (en) * 2002-01-23 2003-07-30 Denso Corp Magneto-resistance effect element sensor
JP2006098088A (en) * 2004-09-28 2006-04-13 Yamaha Corp Magnetometric sensor using huge magnetoresistive element, and manufacturing method of magnetometric sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103267955A (en) * 2013-05-28 2013-08-28 江苏多维科技有限公司 Single-chip bridge-type magnetic field sensor
JP2016524142A (en) * 2013-05-28 2016-08-12 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Single-chip bridge type magnetic field sensor
CN110998349A (en) * 2017-08-16 2020-04-10 株式会社村田制作所 Magnetic sensor
CN110998349B (en) * 2017-08-16 2021-11-16 株式会社村田制作所 Magnetic sensor

Also Published As

Publication number Publication date
JP4735686B2 (en) 2011-07-27
CN101666864A (en) 2010-03-10
KR20100027979A (en) 2010-03-11
EP2159586A2 (en) 2010-03-03
CN101666864B (en) 2016-02-03
EP2159586A3 (en) 2010-10-13
EP2159586B1 (en) 2013-02-13

Similar Documents

Publication Publication Date Title
JP4735686B2 (en) Magnetic sensor
KR101429356B1 (en) Electronic device comprising hall effect region with three contacts
US20100123458A1 (en) Twin vertical hall sensor
CN107533113B (en) Magnetic field sensor with increased SNR
EP2722681B1 (en) Magnetic field direction detector
JP5888402B2 (en) Magnetic sensor element
JP4798191B2 (en) Magnetic sensor device
JP7020176B2 (en) Magnetic sensor
JP4345813B2 (en) Long magnetic sensor
JP6267613B2 (en) Magnetic sensor and current sensor including the magnetic sensor
JP5413866B2 (en) Current sensor with magnetic sensing element
JP4771015B2 (en) Magnetic sensor
US20200300943A1 (en) Magnetic field sensing device
US8957680B2 (en) Magnetic sensor and pattern for magnetic sensor
JP4914502B2 (en) Magnetic sensor and magnetic encoder
TWI714107B (en) Electric current sensor
JP7119351B2 (en) magnetic sensor
EP3882646A1 (en) Integrated magnetometer and method of detecting a magnetic field
KR20230089608A (en) 3-axis magnetoresistance sensor
JP2017020818A (en) Current detection device and manufacturing method therefor
JP2023046271A (en) magnetic sensor
CN116609712A (en) Magnetic sensor
JP2008060454A (en) Magnetic device
JP2010133854A (en) Magnetic detection circuit element and magnetic sensor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100413

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100614

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20100614

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100817

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101018

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110209

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20110217

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110329

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110411

R150 Certificate of patent or registration of utility model

Ref document number: 4735686

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees