JP2010053310A - Manufacturing method of laser half-cut processed product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for manufacturing a processed product which is processed into a desired form by half-cutting processing without cutting a separator, when an adhesive sheet made of a base material sheet containing a hardly-processable material as a constituent is subject to half-cutting processing by laser beam. <P>SOLUTION: The manufacturing method comprises producing a half-cut processed product by irradiating laser beam on an adhesive sheet having a base material sheet which contains a hardly-processable material layer and an adhesive layer, and has a separator laminated on the surface of adhesive layer. In the method, the separator containing a metal is used, infrared laser beam is preferably used for laser beam, and a plastic film on which metal foil or a metallized metal material layer is laminated is preferably used for a metal-containing separator. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a laser half-cut product. Specifically, the separator sheet is irradiated with laser light on a pressure-sensitive adhesive sheet having a difficult-to-process material layer in a base material sheet constituting the pressure-sensitive adhesive sheet, It is related with the manufacturing method of the processed goods which gave the half cut to the adhesive sheet.

Usually, various pressure-sensitive adhesive sheets have a structure in which a base sheet and a pressure-sensitive adhesive layer are laminated, and a release-treated separator is laminated on the surface for the purpose of covering and protecting the surface of the pressure-sensitive adhesive layer until use. In addition, these various adhesive sheets are subjected to external processing such as punching into a predetermined shape while leaving only the separator, or are subjected to external processing by so-called half cut leaving only the separator. (See Figure 3)
In particular, with the recent miniaturization of electrical and electronic components, the miniaturization and high definition of components have progressed, and it has become necessary to perform high-definition outer shape processing with a processing accuracy of ± 50 μm or less on the adhesive sheet. However, when half-cut processing is applied to the adhesive sheet, the processing with conventional die-cut rolls and sealing blades has a processing accuracy of about ± 100 μm, so the above-mentioned demands for miniaturization and high definition can be fully met. The actual situation is not.

  Therefore, in recent years, a processing technique using a laser with high output and low price has attracted attention, and a half-cut technique of various adhesive sheets using a laser beam as described in Patent Document 1 is proposed. Has been. However, in the case of half-cut processing with laser light, the output stability of the laser light oscillator and the material and thickness of the base material sheet in the adhesive sheet may have a significant effect on laser processability. There is a risk that even a separator that should remain without being cut.

In particular, as shown in FIG. 4 (a), when the base material sheet includes a material layer that is difficult to cut even by laser light irradiation, as shown in FIG. Before the sheet is cut, the separator located in the lower part is thermally cut, and as a result, the pressure-sensitive adhesive sheet is fully cut, and a desired half-cut shape may not be obtained.
JP 2003-33389 A

  Therefore, the present inventors prevent the cutting of the separator, which is a problem when the adhesive sheet using the base sheet having the difficult-to-process material layer in the configuration as described above is half-cut with a laser beam. As a result of intensive studies, it was found that by replacing the separator laminated on the surface of the pressure-sensitive adhesive layer with a metal-containing separator, a processed product that was half-cut into a desired shape without cutting the separator was obtained. The present invention has been achieved.

  That is, the present invention comprises a substrate sheet including a difficult-to-process material layer and an adhesive layer, and the adhesive sheet formed by laminating a separator on the surface of the adhesive layer is irradiated with laser light from the substrate sheet side. A laser half-cut manufacturing method for cutting a substrate sheet to a pressure-sensitive adhesive layer and selectively leaving only the separator, wherein the separator is a metal-containing separator. The manufacturing method of this is provided.

  As described above, according to the manufacturing method of the present invention, the surface of the pressure-sensitive adhesive layer is covered and protected by a specific separator even if a difficult-to-work material layer is included in the base sheet. The cutting process with light is performed only up to the separator surface, and the effect of being capable of half-cutting into a desired shape is achieved.

  The workpiece to be used in the method for producing a laser half-cut product of the present invention includes a base material sheet and a pressure-sensitive adhesive layer including a layer made of a material difficult to cut by laser (hereinafter referred to as a difficult-to-work material layer). The pressure-sensitive adhesive sheet is a pressure-sensitive adhesive sheet obtained by laminating a separator on the surface of the pressure-sensitive adhesive layer, and includes a difficult-to-work material layer in the substrate sheet.

  Such a base sheet may be composed of only a difficult-to-work material layer, or may be a laminated structure of a difficult-to-work material layer and another material layer. That is, the base sheet is preferably formed from a plurality of layers in order to impart various properties such as brightness improvement, mechanical strength improvement, surface protection, and gas barrier properties to the entire base sheet.

  In the present invention, the difficult-to-process material layer is configured such that even when laser light is irradiated, the laser beam is not absorbed by the difficult-to-process material layer. It has a characteristic that it is difficult to perform a cutting process, and examples thereof include polymer materials such as norbornene resin, polymethyl methacrylate resin (PMMA), and polyethylene resin. In addition, the thickness of such a difficult-to-work material layer is 1-1000 micrometers from the point of laser workability, Preferably it is 10-200 micrometers. In particular, when the thickness exceeds 1000 μm, it is not preferable because laser irradiation may be excessively irradiated to obtain a half-cut shape and heat damage may occur.

  Further, in the base material sheet used in the present invention, as the other material layer that can be laminated on the difficult-to-process material layer as described above, various polymer materials excluding the difficult-to-process material can be used. Examples thereof include epoxy resins, polyimide resins, polyester resins (polyethylene naphthalate resin, polyethylene terephthalate resin, etc.), methacrylic resins, polycarbonate resins, and triacetyl cellulose resins. Further, the thickness of the material layer that can be laminated can be appropriately set in consideration of the required bending resistance, transparency, workability, and the like, but it is usually preferably about 5 to 200 μm.

  The pressure-sensitive adhesive layer formed on the substrate sheet in the present invention is not particularly limited as long as it is a so-called pressure-sensitive adhesive. For example, an acrylic adhesive, a silicone adhesive, a vinyl ether adhesive, a natural rubber adhesive, a synthetic rubber adhesive, an epoxy adhesive, or the like can be used. The thickness of these pressure-sensitive adhesive layers only needs to have sufficient adhesiveness to adhere to the adherend with a desired adhesive force, and is usually 5 to 100 μm, preferably about 10 to 50 μm.

  The workpiece to be applied to the method for producing a processed product of the present invention is formed by laminating a separator on the exposed surface of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheet. The present invention is characterized by the structure of the separator. As the separator, a separator in which only the separator remains when the adhesive sheet is subjected to a half-cut treatment by the laser light irradiation step in the manufacturing method of the present invention, that is, a separator that is not cut by laser light irradiation is used. There is a need.

  In the present invention, as such a separator, it is necessary to use a metal-containing separator as shown in FIG. 1A, and preferably a laminate of a metal material layer and a plastic film is used. At this time, the separator is preferably laminated so that the metal material layer is adjacent to the pressure-sensitive adhesive layer. In other words, in the present invention, when the laser beam is irradiated from the back surface of the base sheet by using the pressure-sensitive adhesive sheet having the configuration as shown in FIG. As shown in FIG. 1B, half-cut processing can be performed cleanly.

  As the above metal material, aluminum, iron, copper, silver, nickel, gold, stainless steel and the like can be used. Of these, aluminum is used in terms of light weight, high malleability and good workability. preferable. These metal materials can be laminated on the separator in the form of a metal foil, a vapor deposition film, an electrolytic plating film, or the like. The thickness of such a metal material layer is preferably in the range of 1 to 1000 μm, preferably 10 to 200 μm, from the viewpoint of easy handling and ease of lamination, etc., without being cut by laser light. .

  The laser light irradiated in the production method of the present invention is not particularly limited as long as it is a laser light that is subjected to a half-cut treatment. Infrared laser, semiconductor laser, carbon dioxide laser, fiber laser, femtosecond laser A YAG laser or the like can be used. Among these, it is more preferable to use an infrared laser because the laser beam irradiated on the metal surface is easily reflected. The irradiation condition of the laser beam is not particularly limited because the output, the scanning speed of the laser beam, and the like are adjusted according to the material and configuration of the pressure-sensitive adhesive sheet that is the workpiece. That is, the energy input per unit length is obtained by dividing the laser power (W) by the scanning speed (mm / s). To perform a desired half-cut process, the laser power or the scanning speed is used. By changing any of the above, the amount of energy input per unit length can be adjusted.

  In the case of the laser half-cut manufacturing method of the present invention, for example, an infrared laser such as a carbon dioxide laser having a wavelength of 9.6 to 10.6 μm or a YAG laser is used, the laser power is 1 to 50 W, and the beam diameter is From the viewpoint of processing efficiency, it is preferable to control 10 to 300 μmφ, a repetition frequency of 1 to 20 kHz, and a scanning speed of about 10 to 200 mm / s.

The present invention will be described in more detail and specifically with reference to the following examples, but the present invention is not limited to these examples.
Example 1
2 μm thick on the surface of a base sheet comprising an 80 μm thick triacetyl cellulose film (TAC), a 40 μm thick polarizer (material: polyvinyl alcohol film), and a 70 μm thick norbornene resin layer as shown in FIG. A pressure-sensitive adhesive sheet was prepared by laminating a surface protective pressure-sensitive adhesive sheet composed of a 38 μm-thick polyethylene terephthalate film (PET) and a 23 μm-thick acrylic pressure-sensitive adhesive layer on the TAC surface of the pressure-sensitive adhesive sheet on which the acrylic pressure-sensitive adhesive layer was laminated.

  Next, a separator containing a metal composed of a 10 μm thick aluminum foil, a 2-3 μm thick acrylic pressure sensitive adhesive layer, and a 25 μm thick polyester film is brought into contact with the pressure sensitive adhesive layer on the exposed surface of the 23 μm thick pressure sensitive adhesive layer. A workpiece was prepared by laminating as described above.

The workpiece obtained as described above was irradiated with a laser beam under the following conditions from the surface protective sheet side, and subjected to half-cut processing to produce a half-cut processed product of the present invention.
<Processing conditions>
・ Laser light source: Carbon dioxide laser ・ Laser wavelength: 10.6 μm
・ Laser power: 10-14.5W
・ Beam diameter: about 150μm
・ Nozzle diameter: 3.5mmφ
・ Repetition frequency: 4 kHz
・ Scanning speed: 100mm / s
As a result of performing the half-cut process under the above conditions, a desired half-cut processed product in which the separator was not cut as shown in FIG. 2B could be obtained.
Comparative Example 1
A workpiece was prepared in the same manner as in Example 1 except that a 38 μm thick polyester film on which no aluminum foil was laminated was used as the separator in Example 1.

As a result of irradiating the obtained workpiece with laser light under the same processing conditions as in Example 1 and performing a half-cut process, even the laser power is controlled, the separator is cut, and the desired half A cut product could not be obtained.
Example 2
Except that the separator in Example 1 was obtained by depositing a 1 μm thick aluminum layer on one side of a 38 μm thick polyester film and laminating the separator so that the aluminum deposited surface was adjacent to the exposed surface of the adhesive layer. A workpiece was produced in the same manner as in Example 1.

  As a result of performing half-cut processing by irradiating the obtained workpiece with laser light under the same processing conditions as in Example 1, by controlling the laser power to 9.6 to 12.6 W, the separator A desired half-cut processed product that was not cut was obtained.

(A) is sectional drawing which shows an example of a structure of the workpiece used for the manufacturing method of this invention, (b) is sectional drawing which shows the processing state at the time of giving the laser processing to the workpiece of (a) It is. (A) is sectional drawing which shows the structure of the workpiece in the specific example shown in Example 1, (b) is sectional drawing which shows the processing state at the time of giving the laser processing to the workpiece of (a). is there. It is sectional drawing which shows an example of the process state at the time of giving a half cut process to the conventional adhesive sheet. It is sectional drawing which shows an example of the processing state at the time of giving a laser processing to the conventional adhesive sheet containing a difficult-to-work material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material sheet 11 Surface protection sheet 12 Triacetyl cellulose film 13 Polarizer 2 Adhesive layer 21 Adhesive layer 3 Separator 31 Separator containing a metal layer 32 Aluminum foil 33 Polyester film 4 Difficult-to-process material layer

Claims (7)

  A pressure-sensitive adhesive sheet comprising a base material sheet containing a difficult-to-work material layer and a pressure-sensitive adhesive layer, and having a separator laminated on the surface of the pressure-sensitive adhesive layer, is irradiated with laser light from the base material sheet side to the pressure-sensitive adhesive. A method for producing a laser half-cut product, which is obtained by cutting up to a layer and selectively leaving only the separator, wherein the separator is a separator containing metal.   2. The method for producing a laser half-cut product according to claim 1, wherein a surface protective sheet is further laminated on the surface of the base sheet.   The method for producing a laser half-cut product according to claim 1 or 2, wherein the substrate sheet comprises a plurality of layers.   The method for producing a laser half-cut product according to claim 1 or 2, wherein the base sheet is made of a polymer material.   The method for producing a laser half-cut product according to claim 1, wherein the difficult-to-process material layer is at least one polymer material selected from norbornene-based resin, polymethyl methacrylate resin, and polyethylene resin.   The method for producing a laser half-cut product according to claim 1, wherein the metal-containing separator is composed of a laminate of a metal material layer and a plastic film, and the metal material layer is adjacent to the pressure-sensitive adhesive layer. The method for producing a laser half-cut product according to claim 1, wherein the laser beam is an infrared laser beam.

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