JP2010051983A - Manufacturing apparatus of microwave circuit substrate and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and method of manufacturing a microwave circuit substrate, in which higher-speed and higher-precision machining is made possible by laser. <P>SOLUTION: The manufacturing apparatus of a microwave circuit substrate is equipped with a laser oscillator 1, a placing table 9, a first and a second laser irradiation members 2, 3, a laser beam path switching member 7, and an image processor 22. The first and the second laser irradiation members 2, 3 are each equipped with a scanner 4, a focusing lens 5, and a condensing lens 6. The image processor 22 includes an image pickup light 23, an imaging part 24, and a read processor 25. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a three-dimensional circuit board for manufacturing a three-dimensional circuit board by irradiating a laser on a substrate to remove a metal conductive film provided on the processed surface of the substrate or to perform exposure processing on a resist provided on the processed surface of the substrate. The present invention relates to a circuit board manufacturing apparatus and a manufacturing method thereof.

  Conventionally, there has been a method for manufacturing a three-dimensional circuit board by irradiating a laser on a substrate to remove a metal conductive film provided on the processed surface of the substrate or to expose a resist provided on the processed surface of the substrate. Are known.

As a conventional method, for example, a single scanner that scans while irradiating a processing surface of a substrate with a laser from a laser oscillator, and a multi-degree-of-freedom positioning mechanism that combines a parallel link mechanism and a serial link mechanism in three-axis directions There is one using a jig configured to be rotatable and capable of posture control (see Patent Document 1). Then, the substrate is placed on the jig, and the jig is rotated in any one or more of the three axial directions to be in various postures, so that the upper surface of the substrate is scanned while being irradiated with laser from various directions. A three-dimensional circuit is formed.
JP 2001-68817 A

  However, as in the jig described in Patent Document 1, a multi-degree-of-freedom positioning mechanism based on a hybrid of a parallel link mechanism and a serial link mechanism is associated with members that rotate in three axial directions. Therefore, for example, when changing the posture by rotating in the axial direction of one axis, a member for rotating in the axial direction of the other axis must be moved at the same time. As a result, it is difficult to change the posture by quickly rotating it in a desired direction, and it is difficult to process at a higher speed, and at the time of changing the posture, an accumulated error due to the error of each of the above members occurs, and it is difficult to perform high-precision processing. There is a problem that there is also a fear.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a three-dimensional circuit board manufacturing apparatus and a manufacturing method thereof capable of performing further high-speed and high-precision processing with a laser.

In order to solve the above-mentioned problem, the invention of claim 1 manufactures a three-dimensional circuit board by processing a three-dimensional circuit on the processing surface of the substrate by irradiating the processing surface of the substrate with a laser from a laser oscillator. An apparatus for manufacturing a three-dimensional circuit board, comprising: a plurality of scanners that receive a laser from the laser oscillator and scan the irradiated surface of the substrate while irradiating the processed laser; and any one of the scanners A laser beam path switching member that selectively switches the laser beam path by sending a laser;
Each of the scanners is configured so that a laser irradiation direction with respect to a processing surface of the substrate is different.

  The invention of claim 2 is a three-dimensional circuit board manufacturing apparatus for manufacturing a three-dimensional circuit board by processing a three-dimensional circuit on the processing surface of the substrate by irradiating the processing surface of the substrate with a laser from a laser oscillator. A plurality of laser irradiation members that receive the laser from the laser oscillator and irradiate the processed surface of the substrate with the received laser, and selectively send the laser to any one of the laser irradiation members. A laser beam path switching member for switching the laser beam path, wherein the laser beam irradiation member includes a first laser beam irradiation member and at least one laser beam irradiation direction different from the first laser beam irradiation member with respect to the processing surface of the substrate. A second laser irradiation member, and each of the first laser irradiation member and the second laser irradiation member adjusts the focal point of the laser when irradiating the laser beam onto the processing surface of the substrate. A focus adjusting lens, a scanner that scans the processed surface of the substrate while irradiating a laser beam that has passed through the focus adjusting lens, and a condensing lens disposed between the scanner and the substrate. It is the manufacturing apparatus of the three-dimensional circuit board characterized by the above-mentioned.

  According to a third aspect of the present invention, the manufacturing apparatus of the three-dimensional circuit board further includes an image processing unit having an imaging unit that images a processed surface of the substrate processed by the laser irradiation member, and imaging of the image processing unit It is a manufacturing apparatus of the three-dimensional circuit board characterized by being able to check the process by a laser irradiation member based on the image imaged by the part.

  According to a fourth aspect of the present invention, the image processing unit includes an imaging light that irradiates light to a processing surface of a substrate processed by any one of the laser irradiation members, and the imaging light includes the imaging light. The light is passed through the focus adjustment lens, the scanner, and the condenser lens of any one of the laser irradiation members, and the imaging unit is reflected from the processing surface of the substrate to be any one of the laser irradiation members The apparatus for manufacturing a three-dimensional circuit board is configured to capture light that has passed through the condenser lens, the scanner, and the focus adjustment lens, and to capture an image of the processed surface of the substrate.

  The invention of claim 5 is characterized in that both the scanner of the first laser irradiation member and the scanner of the second laser irradiation member are configured to be able to scan the laser with the same origin and coordinate axes. It is a manufacturing apparatus of a three-dimensional circuit board.

  The invention according to claim 6 is the manufacture of a three-dimensional circuit board characterized in that the substrate is placed on a placement member, and the placement member is configured to be rotatable about one axis. Device.

  According to a seventh aspect of the present invention, the substrate is mounted on a mounting member, and the mounting member includes a mounting surface on which the substrate is mounted on an upper surface, and is perpendicular to the mounting surface. The first laser irradiation member is configured to be capable of irradiating a laser in an axial direction of the vertical axis, and the imaging light has light from the imaging light being emitted from the first light. The focus adjustment lens, the scanner, and the condenser lens of one laser irradiation member are configured to pass through, and the imaging unit is reflected from the processing surface of the substrate to be reflected by the condenser lens of the first laser irradiation member and the scanner. The apparatus for manufacturing a three-dimensional circuit board is configured to capture light that has passed through a focus adjustment lens and to image a processed surface of the substrate.

  In order to solve the above-mentioned problem, the invention of claim 8 is directed to a plurality of scanners having different laser irradiation directions with respect to the processed surface of the substrate and receiving the laser from the laser oscillator. A three-dimensional circuit board manufacturing apparatus having a laser optical path switching member that selectively sends a laser to any one of the scanners to switch the optical path of the laser, and processes the three-dimensional circuit on the processing surface of the substrate. A method of manufacturing a circuit board, wherein a laser from the laser oscillator is sent to one of the plurality of scanners, and scanning is performed by irradiating the processed surface of the board with the one scanner. Next, the laser from the laser oscillator is transferred to another scanner different from the one scanner by the laser beam path switching member. The three-dimensional circuit is characterized in that the processing is performed by switching the optical path and scanning the processing surface of the substrate by irradiating the laser from a direction different from the laser irradiation direction of the one scanner by the other scanner. A method for manufacturing a substrate is provided.

  The invention according to claim 9 is a method of manufacturing a three-dimensional circuit board, further comprising: an image processing unit having an imaging unit that images a processed surface of the substrate processed by the laser; and a mounting member on which the substrate is mounted. Using the apparatus, the two substrates are placed on the mounting member, processed by irradiating one of the substrates with a laser by the one scanner, and then processed by the other scanner. A method of manufacturing a three-dimensional circuit board, wherein the other surface of the substrate is scanned while being irradiated, and a processed surface processed on one of the substrates is imaged by the imaging unit of the image processing unit during the scanning. It is.

  According to the first and eighth aspects of the present invention, the laser is selectively sent to any one of the plurality of scanners configured to have different laser irradiation directions with respect to the processing surface of the substrate, and the laser. And a laser beam path switching member that switches the beam path.

  As a result, the laser from one laser oscillator can be selectively sent to one of the scanners by the laser optical path switching member, and the processed surface of the substrate can be irradiated from different directions by the scanner that has received the laser.

  Therefore, for example, irradiation can be performed from various directions without moving the mounting member on which the substrate is mounted, and the mounting member can be configured in a simple manner as compared with the conventional configuration in which the mounting member is rotated in the three-axis direction.

  Further, since the members that rotate in the respective axial directions are not interlocked as in the prior art, they can be rotated quickly and can be moved at a higher speed than the conventional one. In addition, it is possible to prevent a cumulative error due to the interlocking of the members during the movement as in the conventional case, and the movement can be performed with high accuracy. Therefore, the processing surface of the substrate can be processed with higher speed and higher accuracy than in the past.

  According to the second aspect of the present invention, the first laser irradiation member and the second laser irradiation member are each a focus adjustment lens, and a scanner that scans while irradiating the processed surface of the substrate with the laser that has passed through the focus adjustment lens. And a condensing lens disposed between the scanner and the substrate.

  Thereby, for example, it is possible to irradiate from various directions without moving the mounting member on which the substrate is mounted, and it is possible to make the configuration simpler than that in which the mounting member is rotated in the conventional three-axis direction. Therefore, the mounting member can be moved at a higher speed than the conventional one. In addition, it is possible to prevent a cumulative error due to the interlocking of the members during the movement as in the conventional case, and the movement can be performed with high accuracy.

  Further, the focus adjustment lens eliminates the need to adjust the height direction of the scanner with respect to the work surface of the substrate to be scanned while irradiating the laser, thereby simplifying the configuration and scanning the laser at high speed.

  According to the third aspect of the present invention, the three-dimensional circuit board manufacturing apparatus includes an imaging unit that images the processed surface of the substrate processed by the laser irradiation member. Accordingly, for example, when the processing start position is processed by the laser irradiation member or when the solid circuit is processed by the laser irradiation member, the processing can be inspected based on the image captured by the imaging unit. Therefore, it is possible to adjust the processing by the laser irradiation member so as to be a predetermined position of the substrate, and it is also possible to eliminate the processing during the processing step when the processing is outside the setting.

  According to the fourth aspect of the present invention, the image processing unit includes an imaging light, and the imaging light is configured so that light from the imaging light passes through the focus adjustment lens, the scanner, and the condenser lens of the laser irradiation member. It is configured to pass. The imaging unit is configured to be able to image the processed surface of the substrate by light reflected from the processed surface of the substrate and passing through the condenser lens, the scanner, and the focus adjustment lens.

  Thereby, the light from the imaging light can be condensed by passing through the focus adjustment lens. Further, the light condensed by the focus adjustment lens can be applied to the substrate while being further condensed by passing through the condenser lens. Further, since the light reflected from the substrate passes through the condenser lens and the focus adjustment lens, the light can be condensed without being diffused. And since a board | substrate is imaged in an imaging part with the condensed light, a board | substrate can be imaged clearly.

  According to the fifth aspect, the scanner of the first laser irradiation member and the scanner of the second laser irradiation member are both configured to be able to scan the laser with the same origin and coordinate axes. As a result, the same numerical value can be used for each scanner as the numerical value indicating the coordinate point on the substrate when the laser is scanned on the substrate by each scanner, and the operation and data management of each scanner can be facilitated. .

  According to the sixth aspect, the mounting member on which the substrate is mounted is configured to be able to rotate around one axis. Thereby, even when the processed surface of the substrate is three-dimensional, for example, the horizontal surface of the processed surface of the substrate can be irradiated with the laser by the first laser irradiation member. On the other hand, the second laser irradiation member can irradiate a laser on a surface perpendicular to the horizontal surface, for example. Further, even when the vertical surface is directed to the front, back, left, or right direction, for example, the laser can be sequentially irradiated with one second laser irradiation member by rotating the mounting member.

  According to the seventh aspect, the first laser irradiation member can irradiate the laser in the axial direction of the vertical axis, and the imaging light has the light from the imaging light and the focus adjustment lens of the first laser irradiation member. It is configured to pass through the scanner and the condenser lens. The imaging unit is configured to capture the light reflected from the processing surface of the substrate and passing through the condenser lens, the scanner, and the focus adjustment lens of the first laser irradiation member and image the processing surface of the substrate. Has been.

  Thereby, the to-be-processed surface of a board | substrate can be imaged from a perpendicular direction, and when a to-be-processed surface of a board | substrate is three-dimensional, an exact dimension can be read from the imaged image. Therefore, for example, if inspection is performed based on the captured image, a product with high processing accuracy can be obtained.

  According to the ninth aspect, the other surface of the substrate is scanned while being irradiated by the other scanner, and the processed surface processed on one side of the substrate is imaged by the imaging unit of the image processing unit.

  Thereby, the surface processed simultaneously can be imaged and inspected while continuously processing the substrate with the laser. Therefore, the three-dimensional circuit can be manufactured in a short time, and defective ones can be excluded during the manufacturing process.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic explanatory diagram of an apparatus for manufacturing a three-dimensional circuit board according to an embodiment of the present invention.

  The apparatus for manufacturing a three-dimensional circuit board according to this embodiment includes a laser oscillator 1, a mounting table 9 as a mounting member on which a substrate 100 as a processing target is mounted, and 2 for irradiating the substrate 100 with a laser. Two laser irradiation members 2 and 3 and a laser beam path switching member 7 are provided.

  In this embodiment, the laser oscillator 1 is provided with a laser oscillator controller 11, and the laser oscillation amount is controlled by the laser oscillator controller 11. The laser oscillator controller 11 receives information such as the oscillation amount from the communicably connected main controller 10 and performs the above control based on the received information such as the oscillation amount.

  An upper surface of the mounting table 9 constitutes a mounting surface 91. The placement surface 91 is disposed so as to be substantially horizontal, and the substrate 100 is placed and fixed on the placement surface 91.

  The substrate 100 is irradiated with laser from above on the upper surface (surface to be processed) of the substrate 100 in a state where the substrate 100 is mounted on the mounting surface 91 of the mounting table 9. Further, as shown in FIG. 4, the mounting table 9 is rotatable about a Z axis 103 in a direction perpendicular to the mounting surface 91.

  In this embodiment, the laser irradiation members 2 and 3 include a first laser irradiation member 2 and a second laser irradiation member 3 as shown in FIG. The first laser irradiation member 2 is configured to be able to irradiate the laser from the laser oscillator 1 in the axial direction of the Z axis 103.

  On the other hand, the second laser irradiation member 3 is configured to be able to irradiate a laser in a direction different from that of the first laser irradiation member 2. As shown in FIG. 4, the second laser irradiation member 3 of this embodiment is disposed on the diagonally right side of the first laser irradiation member 2, and irradiates the substrate 100 with the laser beam from the diagonally upper right side. It is configured as follows.

  Each of the first laser irradiation member 2 and the second laser irradiation member 3 includes a scanner 4, a focus adjustment lens 5, and a condenser lens 6, as shown in FIG. The scanner 4 scans while irradiating the laser from the laser oscillator 1 on the upper surface of the substrate 100, and includes two reflection mirrors 41.

  Each of the reflection mirrors 41 is provided with a galvano motor (not shown) as a drive motor, and the direction (angle) with respect to the upper surface of the substrate 100 placed on the placement table 9 is activated by the operation of the galvano motor. It is configured to change.

  As a result, as shown in FIG. 4, the laser beam is orthogonal to the axial direction of the X axis 101 perpendicular to the Z axis 103 on the upper surface of the substrate 100 placed on the placement table 9 and to the X axis 101 and the Z axis 103. Scanning can be performed while irradiating in the axial direction of the Y axis 102.

  Further, the laser is spread over a range from one end on the upper surface of the substrate 100 mounted on the mounting table 9 as shown in FIG. 2A to the other end on the upper surface as shown in FIG. 2B. The laser can be scanned.

  Further, by changing the direction of the reflection mirror 41, it is possible to irradiate the laser within a certain angle range with respect to the upper surface of the substrate 100. In this embodiment, the reflection mirror 41 of the scanner 4 of the first laser irradiation member 2 can irradiate in a range where the angle α is approximately 30 ° to 90 ° with respect to the Z axis 103 as shown in FIG. Yes.

  Therefore, the scanner 4 of the first laser irradiation member 2 has a gentle inclination on the upper surface of the substrate 100 with respect to the Z axis 103 with an angle α larger than 30 ° and smaller than 90 ° (30 ° <α <90 °). The laser is irradiated on the surface and the horizontal plane (α = 90 °). In this way, the scanner 4 of the first laser irradiation member 2 has a gently inclined surface and a horizontal plane (in FIG. 3, the angle α is 30 ° or less and is a surface indicated by a one-dot chain line, hereinafter, the gently inclined surface and the horizontal plane. Is called a substantially horizontal plane), and a laser is irradiated to process and form a substantially horizontal plane of the three-dimensional circuit.

  The first laser irradiation member 2 of this embodiment processes and forms a three-dimensional circuit by scanning while irradiating a laser, and forms a processing start point mark 104a when processing the three-dimensional circuit 104. .

  The processing start point mark 104a of this embodiment is processed and formed at a position away from a reference point 100a provided in advance on the upper surface of the substrate 100 by a set distance, as shown in FIGS.

  On the other hand, as shown in FIG. 3, the reflection mirror 41 of the scanner 4 of the second laser irradiation member 3 can irradiate up to a range where the angle α is 0 ° to 30 ° with respect to the Z axis 103.

  Therefore, the scanner 4 of the second laser irradiation member 3 has a steep inclination on the upper surface of the substrate 100 with respect to the Z axis 103 with an angle α larger than 0 ° and smaller than 30 ° (0 ° <α ≦ 30 °). The laser is irradiated on the surface and the vertical surface (α = 0 °). In this way, the scanner 4 of the second laser irradiation member 3 has a steeply inclined surface and a vertical surface (a surface indicated by a two-dot chain line in FIG. And the standing surface of the three-dimensional circuit is processed and formed.

  In this embodiment, the reflection mirror 41 of the first laser irradiation member 2 and the reflection mirror 41 of the second laser irradiation member 3 are both configured to be able to scan the laser with the same origin and coordinate axes.

  Specifically, the galvano motors that move the reflection mirror 41 of the first laser irradiation member 2 and the reflection mirror 41 of the second laser irradiation member 3 can communicate with the scanner controllers 20 and 30, respectively, as shown in FIG. It is connected. The movable movement of the reflection mirror 41 is controlled by the scanner controllers 20 and 30.

  The scanner controllers 20 and 30 are communicably connected to the main controller 10. For example, the scanner controllers 20 and 30 control the movement of the reflection mirror 41 based on information input and transmitted to the main controller 10. To do.

  At that time, the reflection mirror 41 of the first laser irradiation member 2 and the reflection mirror 41 of the second laser irradiation member 3 are both the same origin O, the X axis 101, and the Y axis 102 as shown in FIG. Is set to have a coordinate axis consisting of

  Therefore, the same numerical values can be used for the reflection mirror 41 of the first laser irradiation member 2 and the reflection mirror 41 of the second laser irradiation member 3 as numerical values indicating the point on the coordinate axis for scanning the laser.

  Therefore, for example, if the same numerical value is input to the respective reflection mirrors 41 to the main controller 10, the respective reflection mirrors 41 cause the lasers to scan through the same path via the scanner controllers 20 and 30. Can do. Therefore, the control of the reflection mirror 41 of the first laser irradiation member 2 and the reflection mirror 41 of the second laser irradiation member 3 can be made easy and easy to use.

  Next, the focus adjustment lens 5 will be described. As shown in FIG. 1, the focus adjustment lens 5 is for adjusting the focal point of the laser when irradiating the upper surface of the substrate 100 with the laser on the upper surface of the substrate 100, and includes a plurality of lenses. Yes.

  More specifically, the focus adjustment lens 5 includes a plurality of lenses such as a diaphragm lens 51 and a movable lens 52 that can move in a direction in which the diaphragm lens 51 retreats and approaches.

  The moving lens 52 moves in the direction of retreating and approaching the diaphragm lens 51, thereby adjusting the focal point of the laser to a high position or a low position.

  The condensing lens 6 of the laser irradiation members 2 and 3 is disposed between the scanner 4 and the substrate 100, and condenses the laser by passing a laser sent from the scanner 4.

  In addition, the apparatus for manufacturing a three-dimensional circuit board in this embodiment includes an image processing unit 22. The image processing unit 22 in this embodiment images the upper surface of the substrate 100 processed by the first laser irradiation member 2 or the second laser irradiation member 3, and reads a predetermined dimension from the image based on the captured image. Is configured to do. The image processing unit 22 includes an imaging light 23, an imaging unit 24, and a reading processing unit 25.

  The imaging light 23 irradiates light on the upper surface of the substrate 100 when imaging the upper surface of the processed substrate 100. In this embodiment, the imaging light 23 is a substrate whose light passes through the focus adjustment lens 5, the scanner 4, and the condenser lens 6 of the first laser irradiation member 2 through the irradiation light reflection member 23 a. 100 is configured to hit the upper surface of 100.

  Specifically, an irradiation light reflecting member 23a capable of reflecting light is disposed above the focus adjustment lens 5 of the first laser irradiation member 2. Further, the irradiation light reflecting member 23a moves in a range from an optical path position 27a substantially on the optical path of a first laser optical path 71, which will be described later, to a retreat position 27b retracted laterally from the first laser optical path 71. It is possible.

  The irradiation light reflecting member 23a is arranged at the position 27a on the optical path when the laser is sent to the second laser irradiation member 3. In this state, the light from the imaging light 23 is reflected by the irradiation light reflecting member 23 a and passes through the focus adjustment lens 5, the scanner 4, and the condenser lens 6 of the first laser irradiation member 2. .

  The imaging unit 24 images the upper surface of the processed substrate 100. In this embodiment, the light of the imaging light 23 that has passed through the condensing lens 6, the scanner 4, and the focus adjustment lens 5 of the first laser irradiation member 2 from the upper surface of the substrate 100 is used as the imaging light reflecting member 24a. It is comprised so that it may receive through and may image.

  The imaging light reflecting member 24a has substantially the same configuration as the irradiation light reflecting member 23a, and is movable above the focus adjustment lens 5 within a range from the optical path position 27a to the retracted position 27b. It is said that.

  The imaging light reflecting member 24a is positioned at the optical path position 27a when the laser is sent to the second laser irradiation member 3 by the laser optical path switching member 7. In this state, the light of the imaging light 23 that has passed through the condenser lens 6, the scanner 4, and the focus adjustment lens 5 from the upper surface of the substrate 100 is reflected and sent to the imaging unit 24.

  The reading processing unit 25 reads the position (distance) of the processing start point mark 104a with respect to the reference point 100a illustrated in FIGS. 5 to 8 based on the image captured by the imaging unit 24. The reading processing unit 25 reads the position (distance) of a preset point in the three-dimensional circuit 104 processed and formed with respect to the reference point 100a.

  The dimension data read by the reading processing unit 25 of the image processing unit 22 in this way is transmitted to the main controller 10 connected to the image processing unit 22 so as to be communicable. Then, the main controller 10 determines whether or not it is within the allowable range based on the dimension data and a preset value stored in advance.

  Next, the laser light path switching member 7 will be described. The laser light path switching member 7 is for selectively sending a laser to any one of the first laser irradiation member 2 and the second laser irradiation member 3 to switch the optical path of the laser.

  The laser beam path switching member 7 of this embodiment is made of a material that can reflect a laser. The laser beam path switching member 7 is arranged so that it can move on the laser beam path between the laser oscillator 1 and the first laser irradiation member 2, and the reflected laser is directed toward the second laser irradiation member 3. It is installed.

  Specifically, in this embodiment, as shown in FIG. 1, the laser oscillated from the laser oscillator 1 is directed toward the focus adjustment lens 5 of the first laser irradiation member 2. A first laser beam path 71 through which the laser passes is formed between the laser oscillator 1 and the first laser irradiation member 2.

  The laser beam path switching member 7 is movable in a range from a blocking position 7 a that blocks the first laser beam path 71 on the optical path to a retracted position 7 b that is retracted to the side.

  Then, in a state where the laser light path switching member 7 is arranged at the retracted position 7 b retracted from the first laser light path 71, the laser oscillated from the laser oscillator 1 is not reflected by the laser light path switching member 7. It proceeds along the laser beam path 71 and enters the first laser irradiation member 2.

  On the other hand, the laser oscillated from the laser oscillator 1 in a state where the laser beam path switching member 7 is arranged at the blocking position 7 a is reflected by the laser beam path switching member 7 and travels in the direction of the second laser irradiation member 3. Thereby, a second laser light path 72 is formed between the laser light path switching member 7 and the second laser irradiation member 3. Therefore, in this state, the laser beam path switching member 7 switches the laser beam path from the first laser beam path 71 to the second laser beam path 72.

  In FIG. 1, for convenience of explanation, the first laser beam path 71 and the second laser beam path 72 are shown as bent. However, in reality, the laser beam travels straight except for the laser beam path switching member 7 and is a straight laser. It is an optical path. However, by using an optical path switching member similar to the laser optical path switching member 7, the laser optical path can be bent, and can be appropriately changed and used.

  Next, an example of the operation when manufacturing a substrate having a three-dimensional circuit using the apparatus configured as described above will be described. In this embodiment, two substrates are mounted on the mounting table 9, and the first step to the fourth step are processed as one cycle.

  As shown in FIG. 9, the top surfaces of the substrates 100, 200, and 300 are configured by the substantially horizontal surface 1111 and the standing surface. Further, a surface of the standing surface facing the first side surface 112a of the substrate is referred to as a first standing surface 112, and a surface facing the second side surface 113a of the substrate is referred to as a second standing surface 113. The surface facing the third side surface 114a of the substrate is defined as a third standing surface 114, and the surface facing the fourth side surface 115a of the substrate is defined as a fourth standing surface 115. In the following embodiments, the second standing surface 113 to the fourth standing surface 115 in the standing surface are processed by the second laser irradiation member 3 and the first standing surface 112 is not processed.

  Further, for convenience of explanation, a processing start point mark 104a is processed on the substrate 100 (the nth substrate, hereinafter referred to as the previous substrate 100) first mounted on the mounting table 9, as shown in FIG. At the same time, it is assumed that the position of the processing start point mark 104a has been imaged and inspected. Furthermore, the fourth standing surface 115 (see FIG. 9) facing the fourth side surface 115a side is processed, and the state where the fourth standing surface 115 is rotated 180 degrees counterclockwise from the state of being placed on the placement table 9 is set. . Further, the laser light path switching member 7 is arranged at the retracted position 7b as shown in FIG. 1, and the irradiation light reflecting member 23a and the imaging light reflecting member 24a are arranged at the blocking position 27b. .

  In the first step, as shown in FIG. 5, a substantially horizontal plane on the substrate 100 is processed by the scanner 41 of the first laser irradiation member 2. During the processing, the substrate 200 to be newly processed (the (n + 1) th substrate, hereinafter referred to as the subsequent substrate 200) is mounted on the mounting table 9.

  Next, the processing start point mark 104 a is processed on the subsequent substrate 200 by the scanner 41 of the first laser irradiation member 2. Thereafter, the laser beam path switching member 7 moves from the retracted position 7b to the blocking position 7a (see FIG. 1), the laser beam path is switched from the first laser beam path 71 to the second laser beam path 72, and the laser is switched to the second laser irradiation member 3. to go into.

  And the 3rd standing surface 114 (refer FIG. 9) which faced the 3rd side surface 114a in the previous board | substrate 100 by the 2nd laser irradiation member 3 is processed. Further, in accordance with the movement of the laser light path switching member 7, the irradiation light reflection member 23a and the imaging light reflection member 24a move to the blocking position 27a (see FIG. 1).

  As a result, the light from the imaging light 23 strikes the upper surface of the subsequent substrate 200 through the focus adjustment lens 5, the scanner 4, and the condenser lens 6 of the first laser irradiation member 2. The light hitting the upper surface of the subsequent substrate 200 further passes through the condenser lens 6, the scanner 4, and the focus adjustment lens 5 and enters the imaging unit 24 via the imaging light reflecting member 24 a. And the imaging part 24 images the upper surface of the board | substrate 200 after that with the light.

  At this time, the light from the imaging light 23 can be condensed without being diffused by passing through the focus adjustment lens 5 having the aperture lens 51, and can be further condensed by passing through the condenser lens 6. Further, the light hitting the upper surface of the subsequent substrate 200 can be condensed without being diffused more reliably by passing through the condensing lens 6 and the focus adjustment lens 5, and the subsequent substrate 200 during imaging in the imaging unit 24. The upper surface of the image can be clearly imaged.

  The captured image is sent to the reading processing unit 25, and the reading processing unit 25 that receives the image reads the position of the processing start point mark 104a with respect to the reference point 100a of the subsequent substrate 200 based on the image.

  The read position data is sent to the main controller 10, and the main controller 10 that has received the position data determines whether the position of the processing start point mark 104a is acceptable. If the main controller 10 determines that the position is good, the subsequent substrate 200 is moved to the next step, whereas if determined not, the subsequent substrate 200 is removed from the placement table 9. The above is the first step.

  Next, the second step will be described. As shown in FIG. 6, the mounting table 9 rotates by 90 ° counterclockwise. From this state, the second standing surface 113 (see FIG. 9) facing the second side surface 113a of the previous substrate 100 is processed by the second laser irradiation member 3.

  Thereafter, the fourth standing surface 115 (see FIG. 9) facing the fourth side surface 115a of the subsequent substrate 200 is processed by the second laser irradiation member 3. Further, while the processing by the second laser irradiation member 3 is being performed, the imaging unit 24 images the upper surface of the previous substrate 100, and based on the captured image, the first laser irradiation member 2 and the second laser. The position of the set point in the circuit processed by the irradiation member 3 is read with respect to the reference point 100a.

  The read position data is sent to the main controller 10 in the same manner as the position data of the processing start point mark 104a described above, and the main controller 10 determines the quality of the circuit position. Thereafter, the previous substrate 100 on which the determination of the quality of the circuit is made is removed from the mounting table 9. The above is the second step.

  Next, the third step will be described. As shown in FIG. 7, the mounting table 9 is further rotated by 90 ° counterclockwise, the laser beam path switching member 7 is moved from the blocking position 7a to the retracted position 7b (see FIG. 1), and the laser beam path is second. The laser beam path 72 is switched to the first laser beam path 71, and the laser enters the first laser irradiation member 2.

  Then, the substantially horizontal plane of the subsequent substrate 200 is processed by the first laser irradiation member 2. During the processing, the next new substrate 300 ((n + 2) th substrate, hereinafter, the next substrate) is placed on the placement table 9. Thereafter, the processing start point mark 104 a is processed on the next substrate 300 by the first laser irradiation member 2.

  Next, the laser beam path switching member 7 moves from the retracted position 7 b to the blocking position 7 a, the laser beam path is switched from the first laser beam path 71 to the second laser beam path 72, and the laser enters the second laser irradiation member 3. And the 3rd standing surface 114 (refer FIG. 9) which faced the 3rd side surface 114a in the said board | substrate 200 after the said 2nd laser irradiation member 3 is processed.

  During the processing, the imaging unit 24 images the upper surface of the next substrate 300 as in the case of the previous substrate 100, and reads the position of the processing start point mark 104a with respect to the reference point 100a. Then, the main controller 10 determines the quality of the position of the processing start point mark 104a. The above is the third step.

  Next, the fourth step will be described. As shown in FIG. 8, the mounting table 9 further rotates by 90 ° counterclockwise. And the 2nd standing surface 113 (refer FIG. 9) which faced the 2nd side surface 113a in the said board | substrate 200 after the said 2nd laser irradiation member 3 is processed.

  Then, the 4th standing surface 115 (refer FIG. 9) which faced the 4th side surface 115a in the following board | substrate 300 by the 2nd laser irradiation member 3 is processed. At almost the same time, the image processing unit 24 reads and processes the position of the circuit processed on the subsequent substrate 200 with respect to the reference point 100a, and the main controller 10 determines whether the circuit position is good or bad. Thereafter, the subsequent substrate 200 on which the determination of the quality of the circuit is performed is removed from the mounting table 9. The above is the fourth step. Then, after the fourth step, the process returns to the first step and the above steps are repeated.

  In the above embodiment, the laser irradiation member is composed of the first laser irradiation member 2 and the second laser irradiation member 3, but the number of laser irradiation members is not particularly limited, and can be changed as appropriate. it can.

  For example, as shown in FIGS. 10 and 11, in addition to the first laser irradiation member 2 and the second laser irradiation member 3 described above, the substrate 100 is disposed on the left side of the first laser irradiation member 2 from the upper left side. A third laser irradiating member 3a for irradiating the first and second laser irradiating members, and a fourth laser irradiating member 3b and a fifth laser for irradiating the substrate 100 with laser beams from the obliquely upper sides of the first and second laser irradiating members 2, respectively. It is good also as what was provided with the irradiation member 3c.

  Further, when the laser irradiation member is composed of three or more as described above, a plurality of laser optical path switching members 7 may be provided so that the laser can be selectively sent to any one of the laser irradiation members. good.

  In addition, as described above, when the second laser irradiation member 3 to the fifth laser irradiation member 3c are disposed on the front, rear, left, and right sides of the first laser irradiation member 2, respectively, the mounting member 9 is set in the horizontal direction. Although it is good also as what can rotate freely, you may comprise from the thing which cannot rotate, and can change suitably.

  Moreover, in the said embodiment, although the 1st laser irradiation member 2 processes and shape | molds the process start point mark 104a, it is not restricted to this form, It can change suitably. For example, the processing start point mark 104a may be processed and formed by the second laser irradiation member 3, or the processing start point mark 104a may be processed and formed by an apparatus different from the present apparatus.

  Moreover, in the said embodiment, although the 1st laser irradiation member 2 and the 2nd laser irradiation member 3 shall be provided with the scanner 4, the focus adjustment lens 5, and the condensing lens 6, in this form Not limited, but can be changed as appropriate. For example, only the scanner 4 may be provided, or the scanner 4 and the focus adjustment lens 5 or the condenser lens 6 may be provided.

  In the above embodiment, the image processing unit 22 is provided. However, the image processing unit 22 may not be provided and can be changed as appropriate. Further, when the image processing unit 22 is provided, the image processing unit 22 is not limited to the type including the imaging light 23, the imaging unit 24, and the reading processing unit 25 as in the above embodiment. It is assumed that only the imaging unit 24 is provided. Alternatively, the image processing unit 22 may include an imaging unit 24 and an imaging light 23 or a reading processing unit 25.

It is a schematic explanatory drawing of the manufacturing apparatus of the three-dimensional circuit board of one embodiment of this invention. FIG. 2A is an explanatory diagram when the laser scans the substrate by the scanner, FIG. 2A is an explanatory diagram in a state where the laser is scanning one end side of the substrate, and FIG. 2B is a laser by the scanner. FIG. 6 is an explanatory diagram of a state in which the other end side of the substrate is being scanned. It is explanatory drawing for demonstrating the laser irradiation angle with respect to the board | substrate of a 1st laser irradiation member and a 2nd laser irradiation member. It is explanatory drawing for demonstrating the coordinate axis when each of a 1st laser irradiation member and a 2nd laser irradiation member scans a laser with respect to a board | substrate. It is a top view of the board | substrate mounted in the mounting member in the case of explaining the 1st step which processes and shape | molds a board | substrate with a 1st laser irradiation member and a 2nd laser irradiation member. It is a top view of the board | substrate mounted in the mounting member in the case of explaining the 2nd step which processes and shape | molds a board | substrate with a 1st laser irradiation member and a 2nd laser irradiation member. It is a top view of the board | substrate mounted in the mounting member in the case of explaining the 3rd step which processes and shape | molds a board | substrate with a 1st laser irradiation member and a 2nd laser irradiation member. It is a top view of the board | substrate mounted in the mounting member in the case of explaining the 4th step which processes and shape | molds a board | substrate with a 1st laser irradiation member and a 2nd laser irradiation member. It is explanatory drawing of the process target surface of the board | substrate to process. It is a schematic top view of the manufacturing apparatus of the three-dimensional circuit board of other embodiment. It is a schematic side view of the manufacturing apparatus of the three-dimensional circuit board of other embodiment of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 1st laser irradiation member 3 2nd laser irradiation member 4 Scanner 5 Focus adjustment lens 6 Condensing lens 7 Laser optical path switching member 9 Mounting table (mounting member)
22 Image Processing Unit 23 Imaging Light 24 Imaging Unit 25 Reading Processing Unit 100 Substrate

Claims (9)

A three-dimensional circuit board manufacturing apparatus for manufacturing a three-dimensional circuit board by processing a three-dimensional circuit on a processing surface of the substrate by irradiating a processing surface of the substrate with a laser from a laser oscillator,
A plurality of scanners that receive the laser from the laser oscillator and scan the irradiated surface of the substrate while irradiating the processed surface of the substrate; and selectively send the laser to any one of the scanners to change the laser beam path A laser beam path switching member for switching,
The apparatus for manufacturing a three-dimensional circuit board, wherein each of the scanners is configured to have different laser irradiation directions with respect to a processing surface of the substrate. A three-dimensional circuit board manufacturing apparatus for manufacturing a three-dimensional circuit board by processing a three-dimensional circuit on a processing surface of the substrate by irradiating a processing surface of the substrate with a laser from a laser oscillator,
A plurality of laser irradiation members that receive the laser from the laser oscillator and irradiate the processed surface of the substrate with the received laser; and a laser beam path by selectively sending the laser to any one of the laser irradiation members A laser beam path switching member for switching
The laser irradiation member includes a first laser irradiation member and at least one second laser irradiation member in which an irradiation direction of the laser with respect to a processing surface of the substrate is different from the first laser irradiation member,
The first laser irradiation member and the second laser irradiation member have passed through a focus adjustment lens that can adjust the focus of the laser when irradiating the laser beam onto the processing surface of the substrate, and the focus adjustment lens, respectively. An apparatus for producing a three-dimensional circuit board, comprising: a scanner that scans while irradiating a surface of the substrate to be processed with a laser; and a condenser lens disposed between the scanner and the substrate. The manufacturing apparatus of the three-dimensional circuit board further includes an image processing unit having an imaging unit that images a processed surface of the substrate processed by the laser irradiation member,
The apparatus for manufacturing a three-dimensional circuit board according to claim 2, wherein the processing by the laser irradiation member can be inspected based on an image picked up by the image pickup section of the image processing section. The image processing unit includes an imaging light that irradiates light to a processing surface of a substrate processed by any laser irradiation member,
The imaging light is configured such that light from the imaging light passes through the focus adjustment lens, the scanner, and the condenser lens of any of the laser irradiation members,
The imaging unit captures the light reflected from the processing surface of the substrate and passed through the condenser lens, the scanner, and the focus adjustment lens of any one of the laser irradiation members, and can image the processing surface of the substrate. The apparatus for manufacturing a three-dimensional circuit board according to claim 3, wherein the apparatus is configured as described above.   5. The scanner according to claim 2, wherein the scanner of the first laser irradiation member and the scanner of the second laser irradiation member are both configured to scan the laser with the same origin and coordinate axes. An apparatus for manufacturing a three-dimensional circuit board according to claim 1. The substrate is mounted on a mounting member;
The apparatus for manufacturing a three-dimensional circuit board according to any one of claims 2 to 5, wherein the mounting member is configured to be rotatable about one axis. The substrate is mounted on a mounting member;
The mounting member includes a mounting surface for mounting the substrate on the upper surface, and is configured to be rotatable about a vertical axis substantially perpendicular to the mounting surface.
The first laser irradiation member can be irradiated with a laser in an axial direction of the vertical axis,
The imaging light is configured such that light from the imaging light passes through the focus adjustment lens, the scanner, and the condenser lens of the first laser irradiation member,
The imaging unit captures the light reflected from the processing surface of the substrate and passed through the condensing lens, the scanner, and the focus adjustment lens of the first laser irradiation member so that the processing surface of the substrate can be imaged. It is comprised by these, The manufacturing apparatus of the three-dimensional circuit board as described in any one of Claims 4-6 characterized by the above-mentioned. A laser from a laser oscillator is received, and the received laser is selectively sent to a plurality of scanners having different laser irradiation directions with respect to the processing surface of the substrate and to any one of the scanners. A method of manufacturing a three-dimensional circuit board by processing a three-dimensional circuit on a processing surface of the substrate using a three-dimensional circuit board manufacturing apparatus having a laser optical path switching member for switching an optical path,
The laser from the laser oscillator is sent to one of the plurality of scanners, and the one scanner scans the substrate while irradiating the processing surface of the substrate.
Next, the laser from the laser oscillator is sent to another scanner different from the one scanner by the laser optical path switching member, and the optical path is switched. A method of manufacturing a three-dimensional circuit board, wherein the processing is performed such that scanning is performed while irradiating a laser from a direction different from the laser irradiation direction of the scanner. Using an apparatus for manufacturing a three-dimensional circuit board, further comprising an image processing unit having an imaging unit that images a processed surface of a substrate processed by the laser, and a mounting member for mounting the substrate,
Place two substrates on the mounting member,
Processed so that one of the substrates is scanned while irradiating a laser with the one scanner,
Next, scanning is performed while irradiating the other of the substrates with the other scanner, and an image of the processing surface processed on one of the substrates is captured by the imaging unit of the image processing unit. The manufacturing method of the three-dimensional circuit board of Claim 8.

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