JP6999402B2 - Laser processing equipment - Google Patents

Description

The present invention relates to a laser processing apparatus and a laser processing method.

The main surface of a substrate such as a semiconductor wafer is partitioned by a plurality of streets formed in a grid pattern, and elements, circuits, terminals, and the like are formed in advance in each of the partitioned regions. Chips are obtained by dividing the substrate along a plurality of streets formed in a grid pattern. For example, a laser processing device or the like is used for dividing the substrate.

The laser processing apparatus of Patent Document 1 has a beam splitter that disperses a laser beam oscillated by the laser oscillator in order to simultaneously laser process two substrates using one laser oscillator. Compared with the case of using two laser oscillators, which are more expensive than the beam splitter, the manufacturing cost of the laser processing device can be reduced.

Japanese Unexamined Patent Publication No. 2008-110383

The laser processing apparatus may have a plurality of moving units including a substrate holding portion for holding the substrate, a driving portion for moving the substrate holding portion, and a base portion to which the driving unit is attached in order to improve throughput.

When the laser processing apparatus has a plurality of moving units, it has been desired to improve the processing accuracy of the substrate held by each moving unit. Examples of the substrate processing include a laser processing process, an alignment process, an inspection process, and the like.

The present invention has been made in view of the above problems, and mainly provides a laser processing apparatus capable of improving the processing accuracy of a substrate held by each moving unit when the laser processing apparatus has a plurality of moving units. The purpose.

In order to solve the above problems, according to one aspect of the present invention,
A substrate holding portion that holds a substrate, a driving portion that moves the substrate holding portion in a direction parallel to the substrate holding surface of the substrate holding portion, a base portion that supports the driving portion, and a fixing fixed to the base portion. Having multiple moving units including frames at intervals,
Among the laser oscillator that oscillates the laser beam, the condensing irradiation unit that condenses and irradiates the substrate held by the substrate holding unit, and the plurality of moving units installed at intervals from each other. It has a switching unit for switching the moving unit in which the path of the laser beam is formed to the substrate held by the substrate holding unit.
The condensing irradiation unit is attached to the fixed frame of each moving unit.
A focus adjustment guide that is fixed to the fixed frame and extends in a direction perpendicular to the substrate holding surface of the substrate holding portion.
A laser processing device is provided that holds the focused irradiation unit and has a focusing slider that moves along the focusing guide .

According to one aspect of the present invention, when the laser processing apparatus has a plurality of moving units, the laser processing apparatus capable of improving the processing accuracy of the substrate held by each moving unit is provided.

FIG. 1 is a perspective view showing a substrate before processing by the substrate processing system according to the embodiment. FIG. 2 is a plan view showing a substrate processing system according to an embodiment. FIG. 3 is a flowchart of a substrate processing method according to an embodiment. FIG. 4 is a plan view showing a laser machined portion according to an embodiment. FIG. 5 is a front view showing a laser machined portion according to an embodiment. FIG. 6 is a diagram showing a switching unit according to one embodiment. FIG. 7 is a diagram showing a modified example of the switching portion of FIG. FIG. 8 is a diagram showing the components of the control unit according to the embodiment as functional blocks. FIG. 9 is a time chart for explaining a laser processing method according to an embodiment. FIG. 10 is a diagram showing a vibration isolator according to an embodiment.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each drawing, the same or corresponding configurations are designated by the same or corresponding reference numerals and the description thereof will be omitted. In the following description, the X direction, the Y direction, and the Z direction are directions perpendicular to each other, the X direction and the Y direction are the horizontal direction, and the Z direction is the vertical direction. The rotation direction centered on the vertical axis is also called the θ direction. In the present specification, the lower direction means the lower part in the vertical direction, and the upper side means the upper part in the vertical direction.

FIG. 1 is a perspective view showing a substrate before processing by the substrate processing system according to the embodiment. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The first main surface 11 of the substrate 10 is partitioned by a plurality of streets formed in a grid pattern, and elements, circuits, terminals, and the like are formed in advance in each of the partitioned regions. Chips are obtained by dividing the substrate 10 along a plurality of streets formed in a grid pattern. The planned division line 13 is set on the street.

A protective tape (not shown) is attached to the first main surface 11 of the substrate 10. The protective tape protects the first main surface 11 of the substrate 10 and protects the elements, circuits, terminals and the like previously formed on the first main surface 11 during processing such as laser processing and thinning. The protective tape covers the entire first main surface 11 of the substrate 10.

The protective tape is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The pressure-sensitive adhesive may be one that cures when irradiated with ultraviolet rays and reduces the adhesive strength. After the adhesive strength is reduced, the protective tape can be easily peeled off from the substrate 10 by a peeling operation.

The protective tape may be attached to the frame so as to cover the opening of the ring-shaped frame, and may be attached to the substrate 10 at the opening of the frame. In this case, the substrate 10 can be conveyed while holding the frame, and the handleability of the substrate 10 can be improved.

FIG. 2 is a plan view showing a substrate processing system according to an embodiment. In FIG. 2, the inside of the carry-in cassette 35 and the inside of the carry-out cassette 45 are shown by breaking the carry-in cassette 35 and the carry-out cassette 45.

The substrate processing system 1 performs various processing such as laser processing of the substrate 10 and thinning of the substrate 10. The board processing system 1 includes a control unit 20, a carry-in unit 30, a carry-out unit 40, a transfer path 50, a transfer unit 58, and various processing units. The processing unit is not particularly limited, but for example, a laser processing unit 100 and a thinning unit 200 are provided.

The control unit 20 is composed of, for example, a computer, and has a CPU (Central Processing Unit) 21, a storage medium 22 such as a memory, an input interface 23, and an output interface 24, as shown in FIG. The control unit 20 performs various controls by causing the CPU 21 to execute the program stored in the storage medium 22. Further, the control unit 20 receives a signal from the outside at the input interface 23 and transmits the signal to the outside at the output interface 24.

The program of the control unit 20 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical desk (MO), a memory card, and the like. The program may be downloaded and installed from the server via the Internet.

In the carry-in unit 30, the carry-in cassette 35 is carried in from the outside. The carry-in unit 30 includes a mounting plate 31 on which the carry-in cassette 35 is placed. A plurality of mounting plates 31 are provided in a row in the Y direction. The number of mounting plates 31 is not limited to the one shown in the figure. The carry-in cassette 35 stores a plurality of unprocessed substrates 10 at intervals in the Z direction.

In the carry-in cassette 35, in order to suppress deformation such as rolling of the protective tape, the substrate 10 may be stored horizontally with the protective tape facing up. The substrate 10 taken out from the carry-in cassette 35 is turned upside down and then conveyed to a processing unit such as a laser processing unit 100.

In the carry-out unit 40, the carry-out cassette 45 is carried out to the outside. The carry-out unit 40 includes a mounting plate 41 on which the carry-out cassette 45 is placed. A plurality of mounting plates 41 are provided in a row in the Y direction. The number of mounting plates 41 is not limited to the one shown in the figure. The carry-out cassette 45 stores a plurality of processed substrates 10 at intervals in the Z direction.

The transport path 50 is a passage in which the transport section 58 transports the substrate 10 to the carry-in section 30, the carry-out section 40, and the plurality of processing sections, and extends in the Y direction, for example. The transport path 50 is provided with a Y-axis guide 51 extending in the Y direction, and the Y-axis slider 52 is movable along the Y-axis guide 51.

The transport unit 58 holds the substrate 10 and moves along the transport path 50 to transport the substrate 10. The transport unit 58 may hold the substrate 10 via the frame. The transport unit 58 vacuum-adsorbs the substrate 10, but may electrostatically adsorb it. The transport unit 58 includes a Y-axis slider 52 and the like as a transport base, and moves along the Y direction. The transport unit 58 is movable not only in the Y direction but also in the X direction, the Z direction, and the θ direction.

The transport unit 58 may have a plurality of holding units for holding the substrate 10. The plurality of holding portions are provided side by side at intervals in the Z direction. The plurality of holding portions may be used properly according to the processing stage of the substrate 10.

The carry-in section 30, the carry-out section 40, and the plurality of processing sections are provided adjacent to the transport path 50 in a vertical direction. For example, the longitudinal direction of the transport path 50 is the Y direction. A carry-in section 30 and a carry-out section 40 are provided adjacent to each other on one side of the transport path 50 in the X direction (left side in FIG. 2, hereinafter also referred to as “front side”). Further, a laser processing section 100 and a thinning section 200 are provided adjacent to each other on the opposite side of the transport path 50 in the X direction (right side in FIG. 2, hereinafter also referred to as “rear side”).

The arrangement and number of processing units are not limited to the arrangement and number shown in FIG. 2, and can be arbitrarily selected. Further, the plurality of processing units may be distributed or integrated in any unit. Hereinafter, each processing unit will be described.

The laser processing unit 100 performs laser processing on the substrate 10. For example, the laser processing unit 100 performs laser processing (so-called laser dicing) for dividing the substrate 10 into a plurality of chips. In this laser processing, the substrate 10 may be divided or a starting point of division may be formed on the substrate 10.

The laser processing unit 100 irradiates a point on the planned division line 13 (see FIG. 1) with a laser beam, and moves the irradiation point on the planned division line 13 to perform laser processing on the substrate 10. In the laser processing of the substrate 10, a modified layer that is a starting point of fracture may be formed inside the substrate 10, or a laser processing groove may be formed on the laser irradiation surface of the substrate 10. The laser machined groove may or may not penetrate the substrate 10 in the plate thickness direction.

When the modified layer is formed inside the substrate 10, a laser beam having transparency to the substrate 10 is used. The modified layer is formed, for example, by locally melting and solidifying the inside of the substrate 10. On the other hand, when a laser machined groove is formed on the laser irradiation surface of the substrate 10, a laser beam having absorbency with respect to the substrate 10 is used.

The thinning unit 200 thins the substrate 10 by processing the second main surface 12 opposite to the first main surface 11 protected by the protective tape of the laser-processed substrate 10. When the laser processing portion 100 forms the starting point of division, the processing stress acts on the substrate 10 in the thinning portion 200, so that cracks develop from the starting point of division in the plate thickness direction, and the substrate 10 is divided into a plurality of chips. Will be done. Further, when the modified layer is formed inside the substrate 10 by the laser processing unit 100, the modified layer is removed by thinning the substrate 10 by the thinning unit 200.

Next, a substrate processing method using the substrate processing system 1 having the above configuration will be described. FIG. 3 is a flowchart of a substrate processing method according to an embodiment.

As shown in FIG. 3, the substrate processing method includes a carry-in step S101, a laser processing step S102, a thinning plate thinning step S103, and a carry-out step S104. These steps are carried out under the control of the control unit 20. The order of these steps is not limited to the order shown in FIG. For example, the laser processing step S102 may be performed after the thinning step S103.

In the carry-in step S101, the transfer unit 58 takes out the substrate 10 from the carry-in cassette 35 placed in the carry-in unit 30, and conveys the taken-out substrate 10 to the laser processing unit 100.

In the laser processing step S102, the laser processing unit 100 performs laser processing on the substrate 10. While the laser processing of the substrate 10 is performed, the first main surface 11 of the substrate 10 is protected by a protective tape. The laser-machined substrate 10 in the laser-machined unit 100 is transported to the thinning unit 200 by the transporting unit 58.

In the thinning step S103, the thinning portion 200 processes the second main surface 12 of the substrate 10 to thin the substrate 10. While the substrate 10 is thinned, the first main surface 11 of the substrate 10 is protected by a protective tape.

In the unloading step S104, the transporting section 58 transports the substrate 10 from the thinning section 200 to the unloading section 40, and the unloading section 40 stores the substrate 10 inside the unloading cassette 45. The carry-out cassette 45 is carried out from the carry-out unit 40. The substrate 10 carried out together with the carry-out cassette 45 is picked up for each chip. In this way, the chip is manufactured.

FIG. 4 is a plan view showing a laser machined portion according to an embodiment. In FIG. 4, “101” is a movable area of the substrate holding portion 111. FIG. 5 is a front view showing a laser machined portion according to an embodiment. In this embodiment, the laser processing unit 100 corresponds to the laser processing apparatus described in the claims. The laser processing unit 100 is installed on the floor 2 (see FIG. 5) of a building such as a factory.

The laser processing unit 100 has a plurality of moving units 110 at intervals. The plurality of moving units 110 are provided, for example, at intervals in the Y direction. Each moving unit 110 includes a substrate holding unit 111, a driving unit 113, a base unit 119, and a fixed frame 120.

The board holding portion 111 holds the board 10. For example, the substrate holding portion 111 holds the substrate 10 horizontally with the second main surface 12 (see FIG. 1) of the substrate 10 facing up. As the substrate holding portion 111, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used.

The drive unit 113 moves the substrate holding unit 111 with respect to the floor 2 in a direction parallel to the substrate holding surface of the substrate holding unit 111. For example, the drive unit 113 moves the substrate holding unit 111 in the X direction, the Y direction, and the θ direction. The drive unit 113 may also move the substrate holding unit 111 in the Z direction. As a drive source for moving the substrate holding portion 111, for example, a servomotor or the like is used. The rotary motion of the servomotor may be converted into a linear motion of the substrate holding portion 111 by a ball screw or the like.

The drive unit 113 has an X-axis guide 114 extending in the X direction and an X-axis slider 115 moved along the X-axis guide 114. Further, the drive unit 113 has a Y-axis guide 116 extending in the Y direction and a Y-axis slider 117 moved along the Y-axis guide 116. Further, the drive unit 113 has a rotating plate 118 that is moved in the θ direction.

The base portion 119 supports the drive portion 113. For example, the X-axis guide 114 is fixed to the base portion 119. The Y-axis guide 116 is fixed to the X-axis slider 115 that is moved along the X-axis guide 114. A rotating plate 118 is rotatably provided on the Y-axis slider 117 that is moved along the Y-axis guide 116. The substrate holding portion 111 is fixed to the rotating plate 118.

Instead of the X-axis guide 114, the Y-axis guide 116 may be fixed to the base portion 119. In this case, the X-axis guide 114 is fixed to the Y-axis slider 117 that is moved along the Y-axis guide 116. A rotating plate 118 is rotatably provided on the X-axis slider 115 that is moved along the X-axis guide 114.

The fixed frame 120 is fixed to the base portion 119 and supports the condensing irradiation unit 141 described later, the alignment unit 160 described later, and the like. As shown in FIG. 5, for example, the fixed frame 120 is a gate type and has a plurality of support columns 121 installed on the base portion 119 and support beams 122 spanned over the plurality of support columns 121. .. A condensing irradiation unit 141, an alignment unit 160, and the like are attached to the support beam 122.

In addition to the mobile unit 110, the laser processing unit 100 includes a laser oscillator support frame 130, a laser oscillator 140, a condensing irradiation unit 141, a switching unit 150, an alignment unit 160, and the like.

The laser oscillator support frame 130 is installed on the floor 2 and supports the laser oscillator 140 and the like. The laser oscillator support frame 130 has, for example, a plurality of support columns 132 installed on the floor 2 and an upper frame 133 spanned over the plurality of support columns 132. A laser oscillator 140 or the like is attached to the upper frame 133. In addition to the laser oscillator 140, a switching unit 150 may be attached to the upper frame 133.

The laser oscillator 140 oscillates a laser beam. The laser beam is focused and irradiated from, for example, the laser oscillator 140 to one point of the planned division line 13 (see FIG. 1) of the substrate 10 held by the substrate holding unit 111 via the focused irradiation unit 141. An attenuator or the like for adjusting the intensity of the laser beam may be provided in the middle of the path of the laser beam.

When the substrate holding portion 111 is moved in the Y direction with respect to the floor 2, the irradiation point of the laser beam on the substrate 10 moves in the Y direction, and a processing mark extending in the Y direction is formed. The X-direction position and the θ-direction position of the substrate holding portion 111 are controlled in advance so that the machining trace and the planned division line 13 coincide with each other.

After that, the substrate holding portion 111 is moved in the X direction with respect to the floor 2 by a predetermined distance, stopped at a predetermined position in the X direction, and then the substrate holding portion 111 is moved again in the Y direction with respect to the floor 2. By repeating this, a plurality of processing marks extending in the Y direction are formed at intervals in the X direction, and striped processing marks are formed on the substrate 10.

The processing mark extending in the Y direction may be either a dotted line or a straight line. The dotted processing marks are formed by pulse-oscillated laser beams. The linear processing trace is formed by a laser beam oscillated by a continuous wave.

After that, the substrate holding portion 111 is rotated by 90 ° in the θ direction, and a plurality of machining marks extending in the Y direction are formed again at intervals in the X direction. As a result, a grid-like processing mark can be formed on the substrate 10.

The condensing irradiation unit 141 condenses and irradiates the substrate 10 held by the substrate holding unit 111 with a laser beam. The condensing irradiation unit 141 may be attached to the fixed frame 120 so as not to be movable in the X direction and the Y direction, and may be provided for each moving unit 110.

The condensing irradiation unit 141 is provided above the substrate holding unit 111, and condenses and irradiates the substrate 10 with a laser beam from above the substrate 10. The condensing irradiation unit 141 is composed of, for example, a lens or the like. The axial direction of the optical axis of the lens is the Z direction. The light-collecting irradiation unit 141 may be attached to the fixed frame 120 so as to be movable in the Z direction in order to adjust the height of the focal point.

The switching unit 150 switches the mobile unit 110 in which the path of the laser beam is formed to the substrate 10 held by the substrate holding unit 111 among the plurality of mobile units 110 installed at intervals from each other. That is, the switching unit 150 switches the moving unit 110 used for the laser processing of the substrate 10 by switching the paths L1 and L2 of the laser beam formed during the operation of the laser oscillator 140. The laser beam paths L1 and L2 overlap from the laser oscillator 140 to the switching unit 150, branch off at the switching unit 150, and reach the substrate 10 held by each moving unit 110.

FIG. 6 is a diagram showing a switching unit according to one embodiment. The switching unit 150 shown in FIG. 6 has a beam splitter 151 and a plurality of beam shutters 152. Although the beam shutter 152 is provided in front of the condensing irradiation unit 141 (see FIG. 5) in the present embodiment, it may be provided in front of the condensing irradiation unit 141.

The beam splitter 151 splits the laser beam incident on the beam splitter 151 into two laser beams. For example, the laser beam is split into transmitted light that passes through the beam splitter 151 and reflected light that is reflected by the beam splitter 151.

The beam shutter 152 is provided at the tip of the beam splitter 151 (forward in the traveling direction of the laser beam), and independently opens and closes a plurality of paths L1 and L2. All of the plurality of routes L1 and L2 may be opened at the same time, or only a part of the plurality of routes L1 and L2 may be opened and the rest may be blocked. The laser beam passes through the open path to the substrate 10 without passing through the blocked path.

FIG. 7 is a diagram showing a modified example of the switching portion of FIG. The switching unit 150 shown in FIG. 7 is used in place of the switching unit 150 shown in FIG. 6, and has a reflecting mirror 155 and a reflecting mirror moving unit 156.

The reflector 155 is provided at a branch point of a plurality of paths L1 and L2, and reflects a laser beam at the branch point. The reflector moving unit 156 moves the reflector 155. The reflector moving unit 156 moves the reflector 155 in, for example, the Z direction. In this case, the reflector 155 is moved between a position where the laser beam is not reflected at the branch point and travels straight through the branch point, and a position where the laser beam is reflected at the branch point.

The reflector moving unit 156 may move the reflector 155 in the θ direction. In this case, the reflector 155 is moved between a position where the laser beam is reflected in the first direction at the branch point and a position where the laser beam is reflected in the second direction at the branch point. The laser beam reflected in the first direction by the reflector 155 reaches the substrate 10 held by one moving unit 110. On the other hand, the laser beam reflected in the second direction by the reflecting mirror 155 reaches the substrate 10 held by another moving unit 110.

According to this embodiment, the moving unit 110 used for the laser processing process is switched without moving the laser oscillator 140. Since the laser oscillator 140 is not moved, the generation of vibration can be suppressed and the processing accuracy of the substrate 10 can be improved. Further, the substrate 10 held by each of the plurality of mobile units 110 can be sequentially processed by using one laser oscillator 140, and the operating rate of the laser oscillator 140 can be improved.

According to the present embodiment, the laser oscillator support frame 130 and each mobile unit 110 are separated from each other and installed on the floor 2. It is possible to suppress the vibration of the laser oscillator 140 together with the specific mobile unit 110, and it is possible to obtain the same processing accuracy regardless of which mobile unit 110 is used for the laser processing of the substrate 10.

According to the present embodiment, the condensing irradiation unit 141 is attached to the fixed frame 120 which is a part of the moving unit 110. In the moving unit 110 during the laser processing, the condensing irradiation unit 141 can be vibrated in synchronization with the vibration of the substrate holding unit 111, and the vibration phase of the substrate holding unit 111 and the vibration phase of the condensing irradiation unit 141 can be obtained. Can be matched. Therefore, the accuracy of the laser processing can be improved.

The alignment unit 160 (see FIGS. 4 and 5) detects the planned division line 13 (see FIG. 1) of the substrate 10 held by the substrate holding unit 111. The planned division line 13 of the substrate 10 is set on a plurality of streets previously formed in a grid pattern on the first main surface 11 of the substrate 10. The alignment portion 160 may be attached to the fixed frame 120 so as not to be movable in the X direction and the Y direction, and may be provided for each moving unit 110.

The alignment portion 160 is provided above, for example, above the substrate holding portion 111, and images a street formed in advance on the lower surface (first main surface 11) of the substrate 10 from above the substrate 10 held by the substrate holding portion 111. .. The alignment unit 160 is composed of, for example, a camera or the like. As the camera, an infrared camera that captures an infrared image transmitted through the substrate 10 may be used. The axial direction of the optical axis of the objective lens of the camera may be the Z direction. The alignment portion 160 may be attached to the fixed frame 120 so as to be movable in the Z direction for adjusting the height of the focal point.

According to this embodiment, the alignment unit 160 is attached to the fixed frame 120 which is a part of the moving unit 110. In the moving unit 110 during the alignment process, the alignment unit 160 can be vibrated in synchronization with the vibration of the substrate holding unit 111, and the vibration phase of the substrate holding unit 111 and the vibration phase of the alignment unit 160 can be matched. can. Therefore, the accuracy of the alignment process can be improved.

The alignment unit 160 converts the captured image of the substrate 10 into an electric signal and transmits it to the control unit 20. The control unit 20 detects the position of the planned division line 13 on the substrate 10 by performing image processing on the received image. The detection method includes a method of matching a street pattern previously formed in a grid pattern on the first main surface 11 of the substrate 10 with a reference pattern, and a center point of the substrate 10 from a plurality of points on the outer periphery of the substrate 10. A known method such as a method of determining the orientation of the substrate 10 is used. The orientation of the substrate 10 is detected from the position of the notch 19 (see FIG. 1) formed on the outer periphery of the substrate 10. An orientation flat may be used instead of the notch 19. As a result, the control unit 20 can grasp the position of the planned division line 13 of the substrate 10 in the coordinate system fixed to the substrate holding unit 111. The image processing may be performed in parallel with the imaging of the image, or may be performed after the imaging of the image.

The alignment unit 160 may also serve as an inspection unit for detecting the result of laser processing of the substrate 10 in order to reduce costs and the like. The result of laser processing is, for example, the presence or absence of an abnormality in laser processing. Examples of the presence / absence of abnormalities in laser processing include the presence / absence of deviation between the processing marks of the substrate 10 and the planned division line 13 due to irradiation with a laser beam, and the presence / absence of chipping. The inspection unit may be attached to the fixed frame 120 so as not to be movable in the X direction and the Y direction, and may be provided for each moving unit 110.

The inspection unit captures a processing mark of the substrate 10 by irradiation with a laser beam. The inspection unit is composed of, for example, a camera. As the camera, when the modified layer is formed inside the substrate 10, an infrared camera that captures an infrared image transmitted through the substrate 10 may be used. The axial direction of the optical axis of the objective lens of the camera may be the Z direction. The inspection unit may be attached to the fixed frame 120 so as to be movable in the Z direction for adjusting the height of the focal point.

According to this embodiment, the inspection unit is attached to the fixed frame 120 which is a part of the moving unit 110. In the moving unit 110 during the inspection process, the inspection unit can be vibrated in synchronization with the vibration of the substrate holding unit 111, and the vibration phase of the substrate holding unit 111 and the vibration phase of the inspection unit can be matched. Therefore, the accuracy of the inspection process can be improved.

The inspection unit converts the captured image of the substrate 10 into an electric signal and transmits it to the control unit 20. The control unit 20 detects the result of laser processing of the substrate 10 by performing image processing on the received image. The image processing may be performed in parallel with the imaging of the image, or may be performed after the imaging of the image.

Although the alignment unit 160 also serves as an inspection unit in the present embodiment, it does not have to serve as an inspection unit. That is, the alignment unit 160 and the inspection unit may be provided separately. In that case, the inspection unit may be provided as a part of the laser processing unit 100, or may be provided outside the laser processing unit 100. Further, instead of the alignment unit 160, only the inspection unit may be provided as a part of the laser processing unit 100. In this case, the planned division line 13 is detected outside the laser processing unit 100.

By the way, the laser processing unit 100 has a condensing irradiation unit 141 and an alignment unit 160 for each moving unit 110. Since both the laser processing and the alignment processing are not performed on one substrate 10 at the same time, it is sufficient that the focused irradiation unit 141 and the alignment unit 160 are in focus.

Therefore, the laser processing unit 100 has a focus adjustment guide 161 (see FIG. 4) and a focus adjustment slider 162. The focus adjustment guide 161 extends in a direction (for example, the Z direction) perpendicular to the substrate holding surface of the substrate holding portion 111. The focus adjustment guide 161 is fixed to, for example, the fixed frame 120. The focus adjustment slider 162 holds both the focused irradiation unit 141 and the alignment unit 160, and moves along the focus adjustment guide 161.

According to the present embodiment, one focus adjustment slider 162 holds both the focusing irradiation unit 141 and the alignment unit 160 and moves along the focus adjustment guide 161. Therefore, the number of parts for focus adjustment can be reduced. The focus adjustment guide 161 and the focus adjustment slider 162 may be provided for each moving unit 110.

Further, according to the present embodiment, one focus adjustment slider 162 holds both the focusing irradiation unit 141 and the inspection unit and moves along the focus adjustment guide 161. Therefore, the number of parts for focus adjustment can be reduced. Since the laser processing and the inspection process are not performed on one substrate 10 at the same time, it is sufficient that the focused irradiation unit 141 and the inspection unit, whichever is used, are in focus.

The condensing irradiation unit 141 and the alignment unit 160 may be fixed to different focus adjustment sliders 162 and independently moved in the Z direction in order to reduce the frequency of focus adjustment. Similarly, the focused irradiation unit 141 and the inspection unit may be fixed to different focus adjustment sliders 162 and independently moved in the Z direction in order to reduce the frequency of focus adjustment.

FIG. 8 is a diagram showing the components of the control unit according to the embodiment as functional blocks. Each functional block shown in FIG. 8 is conceptual and does not necessarily have to be physically configured as shown. All or part of each functional block can be functionally or physically distributed / integrated in any unit. Each processing function performed in each function block may be realized by a program executed by a CPU in whole or in an arbitrary part, or may be realized as hardware by wired logic. Although the control unit 20 is provided separately from the laser processing unit 100 in FIG. 2, it may be provided as a part of the laser processing unit 100.

As shown in FIG. 8, the control unit 20 includes a receiving processing unit 25, an alignment processing unit 26, a laser processing unit 27, an inspection processing unit 28, a carry-out processing unit 29, and the like. The receiving processing unit 25 controls the transport unit 58 and the like to execute a receiving process of receiving and holding the substrate 10 passed from the transport unit 58 by the substrate holding unit 111. The alignment processing unit 26 controls the alignment unit 160, the drive unit 113, and the like to execute an alignment process for detecting the planned division line 13 of the substrate 10 held by the substrate holding unit 111. The laser processing unit 27 controls the laser oscillator 140, the switching unit 150, the drive unit 113, and the like to laser-process the substrate 10 along the planned division line 13 of the substrate 10 held by the substrate holding unit 111. Execute the machining process. The inspection processing unit 28 controls the inspection unit, the driving unit 113, and the like to execute an inspection process for detecting the result of laser processing of the substrate 10 held by the substrate holding unit 111. The carry-out processing unit 29 controls the transport unit 58 and the like to execute the carry-out process of passing the substrate 10 held by the board holding unit 111 to the transport unit 58. At this time, the holding of the board 10 by the board holding portion 111 is released.

FIG. 9 is a time chart for explaining a laser processing method according to an embodiment. FIG. 9 shows the timing between the processing of the substrate 10 using one moving unit 110 and the processing of the substrate 10 using another moving unit 110. Using each moving unit 110, the control unit 20 repeatedly performs a series of processes on the substrate 10 by exchanging the substrate 10. The series of processes includes, for example, a receiving process, an alignment process, a laser processing process, an inspection process, and an unloading process.

As shown in FIG. 9, the control unit 20 preprocesses the laser processing of the substrate 10 using another mobile unit 110 (for example, the receiving process) during the laser processing of the substrate 10 using one mobile unit 110. And alignment processing) may be executed. Further, the control unit 20 performs post-processing (for example, inspection processing and unloading processing) of the laser processing of the substrate 10 using another moving unit 110 during the laser processing of the substrate 10 using one moving unit 110. You may do it. By simultaneously performing different processes on the plurality of substrates 10, the throughput of the laser processing unit 100 can be improved.

In FIG. 9, the timing of the laser processing of the substrate 10 using one moving unit 110 and the timing of the laser processing of the substrate 10 using another moving unit 110 do not overlap at all. The parts may overlap.

By the way, in the laser processing, the substrate 10 is repeatedly moved and stopped, and vibration is generated. Therefore, in the present embodiment, a plurality of moving units 110 are installed apart from each other in order to suppress the transmission of vibration. Further, in order to further suppress the transmission of vibration, a vibration isolator 170 (see FIG. 5) is provided in the middle of the vibration transmission path of the plurality of moving units 110.

The vibration isolator 170 absorbs vibration by, for example, converting vibration energy into heat energy or the like. As a result, the transmission of vibration between the plurality of mobile units 110 can be suppressed, and the substrate 10 held by another mobile unit 110 during the laser machining process of the substrate 10 held by one mobile unit 110 can be suppressed. Can be processed with high accuracy.

The vibration isolator 170 is provided, for example, between at least one moving unit 110 and the floor 2. The vibration isolator 170 may absorb the vibration of only one of the vibration from the moving unit 110 toward the floor 2 and the vibration from the floor 2 toward the moving unit 110, or absorb both vibrations. May be good.

As shown in FIG. 5, for example, the vibration isolator 170 is provided between each moving unit 110 and the moving unit support frame 139, and the moving unit support frame 139 is installed on the floor 2. Three or more anti-vibration units 170 may be used for each moving unit 110. The moving unit support frame 139 may not be provided, and the vibration isolator 170 may be installed directly on the floor 2.

FIG. 10 is a diagram showing a vibration isolator according to an embodiment. The vibration isolator 170 shown in FIG. 10 has a spring 171 provided in the middle of the vibration transmission path and a damper 172 that attenuates the vibration of the spring 171. In this case, it is possible to absorb both the vibration from the moving unit 110 toward the floor 2 and the vibration from the floor 2 toward the moving unit 110.

The spring 171 may be an air spring, or may be composed of, for example, an air cylinder. In this case, the air pressure of the air cylinder may be controlled so as to be balanced with the load acting on the vibration isolator portion 170 from the base portion 119. As the damper 172, an oil damper, an air damper, or the like is used.

The configuration of the vibration isolator 170 is not limited to the configuration shown in FIG. The vibration isolator 170 may have rubber instead of, for example, the spring 171. Further, the vibration isolator 170 may be composed of only one of the spring 171 and the damper 172, or rubber.

Although the embodiments of the laser processing apparatus and the laser processing method have been described above, the present invention is not limited to the above embodiments and the like, and various modifications and variations are made within the scope of the gist of the present invention described in the claims. Improvement is possible.

Each moving unit 110 has only one substrate holding portion 111 in the above embodiment, but may have a plurality of substrate holding portions 111. In this case, for example, by simultaneously moving a plurality of substrate holding portions 111 arranged in the X direction in the X direction with respect to the floor 2, it is possible to collectively form processing marks extending in the X direction over the plurality of substrates 10. Alternatively, by simultaneously moving the plurality of substrate holding portions 111 arranged in the Y direction with respect to the floor 2 in the Y direction, it is possible to collectively form processing marks extending in the Y direction over the plurality of substrates 10. The number of substrate holding portions 111 may be the same or different between one moving unit 110 and another moving unit 110.

The number of mobile units 110 to be switched by the switching unit 150 is two in the above embodiment, but may be three or more. For example, the beam splitter 151 may split one laser beam into three or more laser beams. Further, the reflecting mirror 155 may reflect one laser beam in three or more θ directions. The number of beam splitters 151 may be two or more. Similarly, the number of reflectors 155 may be two or more. Further, the beam splitter 151 and the reflector 155 may be used in combination.

2 Floor 10 Substrate 13 Scheduled division line 100 Laser processing section (laser processing equipment)
110 Mobile unit 111 Board holding unit 113 Driving unit 119 Base unit 120 Fixed frame 130 Laser oscillator support frame 140 Laser oscillator 141 Condensing irradiation unit 150 Switching unit 160 Alignment unit (inspection unit)
170 Anti-vibration part

Claims (9)

A substrate holding portion that holds a substrate, a driving portion that moves the substrate holding portion in a direction parallel to the substrate holding surface of the substrate holding portion, a base portion that supports the driving portion, and a fixing fixed to the base portion. Having multiple moving units including frames at intervals,
Among the laser oscillator that oscillates the laser beam, the condensing irradiation unit that condenses and irradiates the substrate held by the substrate holding unit, and the plurality of moving units installed at intervals from each other. It has a switching unit for switching the moving unit in which the path of the laser beam is formed to the substrate held by the substrate holding unit.
The condensing irradiation unit is attached to the fixed frame of each moving unit.
A focus adjustment guide that is fixed to the fixed frame and extends in a direction perpendicular to the substrate holding surface of the substrate holding portion.
A laser processing device having a focus adjustment slider that holds the focused irradiation unit and moves along the focus adjustment guide . It has an alignment unit that detects the planned division line of the substrate held by the substrate holding unit.
The laser processing device according to claim 1 , wherein the alignment unit is attached to the fixed frame of each moving unit. The laser processing apparatus according to claim 2 , wherein the focus adjustment slider holds both the focused irradiation unit and the alignment unit and moves along the focus adjustment guide. It has an inspection unit that detects the result of laser processing of the substrate held by the substrate holding unit.
The laser processing apparatus according to any one of claims 1 to 3 , wherein the inspection unit is attached to the fixed frame of each mobile unit. The laser processing apparatus according to claim 4 , wherein the focus adjustment slider holds both the focused irradiation unit and the inspection unit and moves along the focus adjustment guide. The laser processing apparatus according to any one of claims 1 to 5 , wherein the laser oscillator support frame that supports the laser oscillator and each of the moving units are separated from each other on the floor. The laser machining according to any one of claims 1 to 6 , further comprising a vibration isolator that absorbs the vibration in the middle of a vibration transmission path between the plurality of moving units installed apart from each other. Device. The laser processing device according to claim 7 , wherein the vibration isolator is provided between at least one moving unit and the floor. A substrate holding portion that holds a substrate, a driving portion that moves the substrate holding portion in a direction parallel to the substrate holding surface of the substrate holding portion, a base portion that supports the driving portion, and a fixing fixed to the base portion. Having multiple moving units including frames at intervals,
Among the laser oscillator that oscillates the laser beam, the condensing irradiation unit that condenses and irradiates the substrate held by the substrate holding unit, and the plurality of moving units installed at intervals from each other. It has a switching unit for switching the moving unit in which the path of the laser beam is formed to the substrate held by the substrate holding unit.
The condensing irradiation unit is attached to the fixed frame of each moving unit.
A vibration isolator that absorbs the vibration is provided in the middle of the vibration transmission path between the plurality of moving units installed apart from each other.
The vibration isolator is a laser processing device provided between at least one moving unit and the floor .

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