JP2010050771A - Imaging device module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging device module in which a high-precision image is provided by reducing electric interference between an imaging element, an electronic component and an external connection terminal, and heat is efficiently dissipated through an external connection terminal, and which is mounted on a vehicle or the like with a high positioning accuracy. <P>SOLUTION: The imaging device module M includes: an imaging element substrate 2 where an imaging element 6 is mounted on a first main surface 2a and a connection terminal 7a for externally outputting an electric signal supplied from the imaging element 6 is mounted on a second main surface 2b; a cylindrical lens holding member 3 fixed to the first main surface 2a of the imaging element substrate 2 for holding lenses 1a to 1c collecting light on the imaging element 6; and a mold resin 10 surrounding areas from the side surfaces of the lens holding member 3 to the second main surface 2b of the imaging element substrate 2. Thus, a high-precision image having little electric interference among the imaging element 6, the electronic component and the external connection terminal 5, is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an imaging apparatus module using an imaging element such as a semiconductor image sensor.

  For example, in Patent Document 1, as a small imaging device module, a semiconductor image sensor such as a CCD image sensor is used as an imaging device that converts light from a subject into an electrical signal, an imaging substrate on which the imaging device is mounted, A holder provided with a lens support tube portion for supporting a lens for condensing light, and a part thereof is inserted and supported by the holder, and a protruding portion penetrates the imaging substrate so that the imaging element faces the lens. An imaging device module including a plurality of support pins that support a substrate is disclosed.

  Further, in the imaging device module disclosed in Patent Document 1, the holder is provided with a support pin and an outer portion located outside the imaging substrate, and an opening peripheral portion of a case having a separately prepared recess is used as the outer portion. The imaging substrate is housed and protected in the space formed by the contact. This case has a wiring member to which an external cable for inputting / outputting an electric signal is connected between the imaging device module and an external electric device. The wiring member communicates from the inside of the space for housing the imaging board to the outside, and is electrically connected by a connector mounted on the imaging board and a wiring cable.

As the wiring cable, for example, a flexible cable that is made of a bundle of coated wires in which a copper wire is covered with a resin tube and can be deformed (curved) in any direction is used. To attach the case to the holder, for example, prepare a wiring cable that is longer than the distance from the connector to the wiring member, and connect one end of the wiring cable to the connector and connect the other end to the wiring member. Then, the case is brought close to the holder while the wiring cable is bent, the opening peripheral edge of the case is brought into contact with the outer portion of the holder, and the both are fixed.
Japanese Unexamined Patent Publication No. 2007-28430 (FIG. 4)

  However, in the assembly process described above, the conventional imaging device module has a problem that the wiring cable is difficult to be determined at a predetermined position in a space such as a case for housing the imaging substrate.

  The image pickup substrate is mounted with an image sensor and an electronic component for configuring an electric circuit for operating the image sensor, and various electric signals flow through the electronic component. In such a state, the position of the wiring cable is not fixed at a position determined in a space such as a case for housing the imaging board. Therefore, depending on the position of the wiring cable, an electrical connection between the imaging board and the wiring cable may not be achieved. There has been a problem that the electric signal passing through the wiring cable becomes unstable due to large interference.

  Also, even if the heat generated in the electric circuit is radiated to the outside via the wiring cable, the extra length of the wiring cable prevents the heat from being efficiently dissipated, and the heat stays in the wiring cable. There is also a problem that the internal temperature of the device module is not stable and stable imaging characteristics cannot be obtained.

  Further, in the conventional imaging device module, the imaging element and the signal processing circuit are mounted on the same imaging substrate for miniaturization. However, in a signal processing circuit, a large amount of power is required to generate and process a signal. For this reason, the image sensor itself generates heat, and the heat affects the image sensor, resulting in thermal noise and imaging characteristics. There was also a problem of adverse effects. In addition, noise generated from the signal processing circuit also has an adverse effect on the image pickup device, which deteriorates the characteristics of the image pickup device.

  Furthermore, in the conventional imaging device module, when it is attached to a vehicle or the like, it is necessary to attach it to a separate bracket for attachment to the vehicle, and to attach the bracket to the vehicle. In the case of using the vehicle-mounted camera, it is necessary to attach it to the vehicle with high positional accuracy when using it. However, by attaching the imaging device module to the bracket and further attaching the bracket to the vehicle, the displacement of the attachment becomes large. As a result, it is difficult to pick up an appropriate imaging area and a blind spot occurs, making it difficult to operate the parking, or it becomes difficult to recognize the distance from people near the vehicle, other vehicles, and obstacles. There was a point.

  The present invention has been completed to solve the above-described problems in the prior art, and its purpose is to reduce electrical interference between the electronic component and the external connection terminal and to pass through the external connection terminal. It is an object of the present invention to provide an imaging device module that can obtain a high-accuracy image by stabilizing an electric signal, can efficiently dissipate heat through an external connection terminal, and can be attached to a vehicle or the like with high positional accuracy.

  The imaging device module according to the present invention includes an imaging device having an imaging device mounted on a first main surface and a connection terminal for outputting an electrical signal output from the imaging device to the outside on a second main surface. A substrate, a cylindrical lens holding member that holds a lens that collects light on the imaging element and is fixed to the first main surface of the imaging element substrate, and the imaging element from a side surface of the lens holding member And a mold resin surrounding the second main surface of the substrate.

  In addition, the imaging device module of the present invention is preferably arranged to face the second main surface of the imaging element substrate, and on one main surface facing the second main surface, the connection terminal and A signal processing circuit board provided with a relay connection terminal to be connected and formed with a signal processing circuit for controlling the imaging device based on the electrical signal is further present in the mold resin. Is.

  In the imaging device module of the present invention, it is preferable that the signal processing circuit board extends on the other main surface along a direction orthogonal to the other main surface, and one end is exposed to the outside from the mold resin. The external connection terminal is provided.

  In the imaging device module of the present invention, it is preferable that the mold resin has an overhang portion on which a mounting portion for mounting to an external device is formed.

  In the imaging device module of the present invention, preferably, the lens holding member is made of a metal material mainly composed of aluminum or iron, and a plating layer made of nickel, gold, or tin is formed on a part of the surface. And fixed to the first main surface of the image pickup device substrate via solder.

  According to the imaging device module of the present invention, an imaging device in which an imaging device is mounted on the first main surface and a connection terminal for outputting an electrical signal output from the imaging device to the outside is provided on the second main surface. An element substrate, a cylindrical lens holding member that holds a lens for condensing light on the imaging element and is fixed to the first main surface of the imaging element substrate, and a second side of the imaging element substrate from the side surface of the lens holding member Since the case of housing the image pickup device substrate is unnecessary, the wiring cable provided in the space of the case is unnecessary. As a result, there is no electrical interference between the image sensor and electronic components and the wiring cable, and the electric signal output from the image sensor is stabilized.

  In addition, the heat generated by the image sensor and electronic components can be quickly dissipated to the outside without going through a wiring cable, so that heat can be dissipated efficiently and the imaging device module's internal temperature is stable and stable. can get.

  In addition, a case for accommodating the image pickup element substrate is not required, and the image pickup apparatus module is reduced in size and weight.

  Furthermore, the imaging device module can be formed into a free shape according to the method of use and purpose of use.

  In addition, according to the imaging device module of the present invention, the relay connection is arranged so as to face the second main surface of the imaging element substrate, and is connected to the connection terminal on one main surface facing the second main surface. When a signal processing circuit board provided with terminals and having a signal processing circuit for controlling the imaging device based on an electrical signal is further present in the mold resin, the signal processing circuit board is separated from the imaging device board. And provided in the mold resin. As a result, it is possible to greatly reduce the influence of heat generated on the signal processing circuit board on the image sensor, and to effectively suppress deterioration of characteristics due to heat of the image sensor.

  Further, it is possible to easily surround only the signal processing circuit board with the shielding conductor, and it is possible to obtain an imaging device module having excellent noise characteristics.

  According to the imaging device module of the present invention, the signal processing circuit board extends on the other main surface along a direction orthogonal to the other main surface and has one end portion exposed to the outside from the mold resin. When the terminal is provided, the electrical signal input / output to / from the signal processing circuit board is drawn out along the direction orthogonal to the other main surface of the signal processing circuit board by the external connection terminal, so that the signal processing is performed on the external connection terminal. It is possible to suppress the noise generated in the circuit from being superimposed. Therefore, an imaging device module having excellent noise characteristics (S / N ratio) can be obtained.

  Further, according to the imaging device module of the present invention, when the mold resin has an overhanging portion (bracket portion) formed with an attachment portion for attaching to an external device on the surface, the imaging device module is formed as a separate bracket. It is not necessary to attach the bracket to the vehicle or the like, and the positional deviation due to the attachment can be reduced. As a result, an appropriate imaging area can be imaged, and an imaging device module with high accuracy of the imaging area is obtained.

  According to the imaging device module of the present invention, the lens holding member is made of a metal material mainly composed of aluminum or iron, and a plating layer made of nickel, gold, or tin is formed on a part of the surface. When fixed to the first main surface of the image pickup device substrate via solder, heat generated in the signal processing circuit substrate is transferred to the mold resin, and the heat is transferred to the lens holding member made of a metal material via the resin. It becomes easy to transmit, and heat can be radiated to the outside from the exposed portion of the lens holding member. Therefore, an imaging device module having excellent heat dissipation characteristics can be obtained.

  Hereinafter, embodiments of an imaging device module of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the side opposite to the subject side of the imaging device module is referred to as the back (back) side.

  FIG. 1 shows an example of an embodiment of an imaging device module according to the present invention. FIG. 1 (a) is a plan view of the imaging device module, and FIG. 2 (b) is a rear view (bottom view) of the imaging device module. ). 2 is a cross-sectional view taken along the line AA ′ of the imaging device module of FIG. 1, FIG. 3 is a longitudinal sectional view of a lens unit in the imaging device module of FIG. 1, and FIGS. 4 and 5 are imaging device modules of FIG. It is the disassembled perspective view and longitudinal cross-sectional view for demonstrating the assembly method of this.

  In the imaging apparatus module M of this example, the imaging device 6 is mounted on the first main surface 2a, and the connection terminal 7a that outputs the electrical signal output from the imaging device 6 to the second main surface 2b is provided. An image pickup device substrate 2 provided, a cylindrical lens holding member 3 that holds a lens that collects light on the image pickup device 6 and is fixed to the first main surface 2a of the image pickup device substrate 2, and a lens holding member 3 and a mold resin 10 surrounding the second main surface 2b of the image pickup device substrate 2 from the side surface.

  With the above configuration, the case or the like that accommodates the image pickup device substrate 2 in the conventional module is not necessary, and as a result, the wiring cable provided in the space of the case or the like is not required. There is no electrical interference between the components and the wiring cable, and the electrical signal output from the image sensor 6 is stabilized.

  In addition, the heat generated in the image sensor 6 and the electronic components can be quickly dissipated to the outside without going through a wiring cable, so that heat can be dissipated efficiently. As a result, the internal temperature of the image pickup apparatus module M is stabilized and stabilized. Imaging characteristics can be obtained.

  Further, a case for accommodating the image pickup device substrate 2 is not required, and the image pickup device module M is reduced in size and weight.

  Furthermore, the imaging device module M can be formed in a free shape according to the method of use and the purpose of use.

  In FIG. 2 showing the overall structure of the imaging device module M, 1 is a lens unit, 4 is a signal processing circuit board, 5 is an external connection terminal, 7b is a relay connection terminal, 8 is a signal processing IC, LSI, or the like. An electronic component, 9 is a power supply IC, 10 is a mold resin, and 11b is a large diameter portion of the external connection terminal 5.

  When the imaging device module M is a camera module used for in-vehicle use, for example, it has a function of imaging a white line on the road or a function of imaging a driver's blind spot, and an electronic control that controls driving of the automobile The operation is controlled by a unit (ECU). Note that the electrical signal of the video output from the camera module is displayed on a display or the like installed in front of the driver's seat via the ECU.

  The image pickup device substrate 2 is a substrate on which an image pickup device 6 that converts light from a subject into an electric signal is mounted on the first main surface 2a, for example, a substrate formed by impregnating a glass cloth with an epoxy resin, or It consists of a printed wiring board formed by adding a glass filler to an epoxy resin.

  The image pickup device 6 mounted on the image pickup device substrate 2 is a semiconductor image sensor device such as a CCD image sensor or a CMOS image sensor housed in a package made of ceramics, resin or the like. The package is, for example, a ceramic wiring board mainly composed of alumina, a printed wiring board (sub board) formed by impregnating a glass cloth with an epoxy resin, or a printed wiring board (sub board) formed by adding a glass filler to an epoxy resin. ) Is mounted with a semiconductor image sensor element. The semiconductor image sensor element and the wiring conductor of the sub-board are electrically connected by a bonding wire, the upper part of the semiconductor image sensor element is covered with a glass lid (glass lid), and the periphery of the semiconductor image sensor element is made of resin. Sealed, and solder ball electrodes are formed on the lower electrodes of the sub-board.

  The amount of glass cloth and glass filler used for the image pickup device substrate 2 is such that the thermal expansion coefficient of the package of the image pickup device 6 and the thermal expansion coefficient of the image pickup device substrate 2 are reduced in order to reduce the thermal stress generated between them. Are preferably set to be the same.

  Further, on the surface and inside of the image sensor substrate 2, wiring conductors for electrical connection and mechanical connection with the electrical connection terminals of the package of the image sensor 6 and the connection terminals 7 a connected to the signal processing circuit board 4. In addition, a grounding conductor or the like (not shown) is formed. Wiring conductors and grounding wiring conductors are made of conductive metals such as copper and gold, and are plated, or a method in which a metal foil on which a wiring pattern has been previously formed is bonded, or a substrate on which the metal foil is applied over the entire surface. By using a method in which unnecessary portions are removed by etching or the like, it is formed on the surface or inside of the printed wiring board constituting the imaging element substrate 2.

  Moreover, the image pick-up element board | substrate 2 prepares the copper sticking board | substrate which adhere | attached copper foil on the whole surface, for example, front and back, cut | disconnects this copper sticking board | substrate to desired magnitude | size, and copper foil is desired by acidic solutions, such as dilute hydrochloric acid. The wiring pattern is manufactured by etching. If necessary, a through hole is formed using laser light irradiation or drilling, and a through conductor is formed by filling the through hole with a metal paste. They can also be electrically connected.

  On the second main surface 2b on the back side of the image pickup device substrate 2, that is, the main surface on the opposite side to the side on which the image pickup device 6 is disposed, the electric signal from the image pickup device 6 is sent to the signal processing circuit board. A connection terminal 7a for outputting to 4 is connected to the wiring conductor.

  The signal processing circuit board 4 is provided with a relay connection terminal 7b for inputting / outputting electric signals to / from the image pickup device substrate 2 on a main surface (one main surface) 4a on the image pickup device substrate 2 side. On one main surface 4a or the other main surface 4b of the signal processing circuit board 4, a so-called digital signal processor (DSP) 8 which is a signal processing electronic component for processing an electric signal is mounted. Yes. Further, a power supply IC 9 for driving the image sensor 6 and the DSP 8 and various electronic components are also mounted.

  On the other main surface 4b of the signal processing circuit board 4, an external connection terminal 5 for transmitting and receiving electric signals to and from an external ECU (not shown) is disposed. The external connection terminal 5 is made of a metal such as aluminum, copper, iron, or an alloy containing one or more of them. A metal plating layer made of gold, nickel or the like is formed on the surface of the external connection terminal 5, and the presence of the metal plating layer allows the external connection terminal 5 to be connected to a wiring conductor or electrode pad of the signal processing circuit board 4 and solder. When joining via, it can be easily and firmly joined.

  The lens holding member 3 has a large-diameter portion 3a bonded to the first main surface 2a of the image sensor substrate 2 at the lower end portion, and houses the package of the image sensor 6 inside the large-diameter portion 3a. The cylindrical lens holding member 3 houses and fixes the lens unit 1 in the inner cavity 3b. In this example, the lens holding member 3 is also a lens unit holding member that holds the lens unit 1.

  The lens unit 1 has a function of condensing light from the subject on the image sensor 6. For example, as shown in FIG. 3, the lens unit 1 has a convex shape on the subject side in order to collect light from the subject at a wide angle. The lens group includes a first lens 1a, a second lens 1b for bringing the light that has passed through the first lens 1a closer to parallel light, and a third lens 1c. When the lens unit 1 includes the above-described three lenses 1a to 1c, for example, the optical axes of the first lens 1a, the second lens 1b, and the third lens 1c from the subject side toward the imaging device 6 are used. Are arranged inside the lens barrel 1d so as to overlap each other.

  The lens unit 1 in the imaging device module M of the present example has the first to third lenses 1a to 1c fixed inside the lens barrel 1d by an annular fixture (retainer) 1e as a pressing jig. Yes. In the third lens 1c, the outer peripheral portion of the lower surface is locked by a step provided on the inner wall of the lens barrel 1d, and the outer peripheral portion of the upper surface is pressed and fixed by the annular spacer 1g. In the second lens 1b, the outer peripheral portion of the lower surface is locked by the annular spacer 1g, and the outer peripheral portion of the upper surface is pressed and fixed by the first lens 1a. In the first lens 1a, the outer peripheral portion of the lower surface is in contact with the outer peripheral portion of the upper surface of the second lens 1b, and the outer peripheral portion of the upper surface is pressed and fixed by the fixture 1e.

  Further, between the lens barrel 1d and the first lens 1a, a waterproof packing made of nitrile rubber, silicone rubber or the like, or an annular sealing member 1f as a seal ring or O-ring may be disposed for waterproofing. Thereby, it is possible to prevent moisture from entering the imaging device module M.

  As shown in FIG. 4, a metal plating layer made of Ni, Au or the like is formed on the end surface 3c of the large-diameter portion 3a of the lens holding member 3. The end surface 3c of the large-diameter portion 3a The bonding pad 2c formed around the mounting position of the package of the image pickup device 6 on the substrate 2 is firmly bonded via solder.

  As shown in FIG. 5, the lens unit 1 is fixed to the lens holding member 3 by the inner peripheral portion of the upper end surface of the lens holding member 3 and the lens holding member 3 on the side peripheral surface of the lens barrel 1 d of the lens unit 1. By joining the part in contact with the inner peripheral portion of the upper end surface with laser light and performing so-called laser welding that instantaneously melts and fixes, the joining can be easily performed.

The fixture 1e and the lens holding member 3 are produced by the following method, for example.
The lens holding member 3 is prepared with an injection mold having a cavity provided in accordance with its shape, and a raw material for forming the lens holding member 3 is poured into the cavity of the mold, It is formed into a predetermined shape by solidifying and forming. For this molding, a conventionally known injection molding method can be used. Moreover, the fixing tool 1e can also be produced by molding in the same manner.

  As a material for the fixture 1e and the lens holding member 3, for example, aluminum or an alloy of aluminum and iron is used to reduce the weight. In addition, in order to suppress the generation | occurrence | production of the thermal stress between both combining the thermal expansion and thermal contraction of the fixing tool 1e and the lens holding member 3, it is preferable to produce both with the same material.

  The internal structure of the imaging device module M is surrounded by a mold resin 10 made of epoxy resin or the like, and the mold resin 10 is formed by a transfer molding method. The mold resin 10 has the internal structure of the imaging device module M arranged in the mold such that the portion from the middle in the longitudinal direction to the tip of the fixture 1c and the external connection terminal 5 protrudes from the transfer mold. To be molded. It should be noted that the distal end portion of the external connection terminal 5 is preferably formed in advance by a mold so as to have a connector shape suitable for connection with an external connector (not shown).

  Further, by forming a moisture-proof layer (not shown) on the surface of the image pickup device substrate 2 and the surface of the signal processing circuit substrate 4, moisture penetrating the mold resin 10 is wired to the image pickup device 6 and the signal processing circuit substrate 4. It can prevent reaching to a conductor and various electronic components. As a result, electromigration due to moisture can be prevented, and stable imaging characteristics can be maintained for many years.

  In the imaging device module M of this example, preferably, the signal processing circuit board 4 extends along the direction orthogonal to the other main surface 4b and the other main surface 4b, and one end thereof is formed from the mold resin 10. An external connection terminal 5 exposed to the outside is provided. In this case, an electrical signal input / output to / from the signal processing circuit board 4 is drawn out along the direction orthogonal to the other main surface 4b of the signal processing circuit board 4 by the external connection terminal 5, It is possible to suppress the noise generated in the signal processing circuit from being superimposed. Therefore, the imaging device module M having excellent noise characteristics (S / N ratio) can be obtained.

  As shown in FIG. 2, when two or more external connection terminals 5 are provided, they are preferably parallel. This is because if there is a part that is partially non-parallel, noise is likely to be superimposed on that part, and the superposition of noise can be further suppressed by being parallel.

  When two external connection terminals 5 are provided, the phases of the high-frequency signals transmitted by them are preferably opposite to each other. Thereby, since the noise of the high frequency signal each transmitted in the two external connection terminals 5 is canceled, noise can be reduced more.

  In the imaging device module M of this example, preferably, as shown in FIG. 1, the mold resin 10 has an overhanging portion (bracket portion) 12 in which an attachment portion for attachment to an external device is formed on the surface. . In this case, it is not necessary to attach the imaging device module M to a separate bracket and further attach the bracket to a vehicle or the like, and the positional deviation due to the attachment can be reduced. As a result, an appropriate imaging area can be imaged, and the imaging device module M with high imaging area accuracy is obtained.

  In FIG. 1, the bracket portion 12 is formed with attachment holes (through holes) 12a and 12b for attachment to a vehicle or the like. The attachment holes 12a and 12b can be formed integrally with the mold resin 10 and provided in the bracket portion 12 when the mold resin 10 is formed to form the bracket portion 12.

  In the imaging device module M of this example, the lens holding member 3 is preferably made of a metal material mainly composed of aluminum or iron, and a plating layer made of nickel, gold, or tin is formed on a part of the surface. And fixed to the first main surface 2a of the image pickup device substrate 2 via solder. In this case, the heat generated in the signal processing circuit board 4 can be transmitted to the mold resin 10 and this heat can be easily transmitted to the lens holding member 3 made of a metal material via the resin. Heat can be radiated from the exposed part to the outside. Therefore, the imaging device module M having excellent heat dissipation characteristics can be obtained.

The following imaging device module M of this example was manufactured.
First, an aggregate substrate is produced by assembling 20 image sensor substrate 2 composed of a glass epoxy printed circuit board having a length of 20 mm, a width of 20 mm, and a thickness of 0.8 mm. Sn-Ag-Cu solder was printed and applied to the formed electrode pad.

  Next, the connection terminal 7a connected to the relay connection terminal 7b of the signal processing circuit board 4 made of the same glass epoxy printed board as described above is arranged on a predetermined electrode pad of the image pickup element board 2 by an electronic component mounting device (mounter). Then, Sn—Ag—Cu solder was melted and fixed in a reflow furnace.

  Next, Sn-Ag-Cu solder is printed on the bonding pad 2c of the lens holding member 3 to be bonded to the electrode pad formed on the first main surface 2a of the image pickup device substrate 2, and die-cast aluminum. The lens holding member 3 is arranged by a mounter so as to accommodate a package in which a CMOS image sensor as the image sensor 6 is mounted and sealed. At this time, the center of the cavity 3b inside the lens holding member 3 was aligned with the center of the CMOS image sensor, and the Sn—Ag—Cu solder was melted and fixed through a reflow furnace.

  Further, with respect to the signal processing circuit board 4, a chip resistor, a chip capacitor, a chip coil, and the like constituting a peripheral circuit of the signal processing electronic component (DSP) 8 are formed on one main surface 4 a by a mounting process and a reflow process. The circuit component 13 was mounted, and a relay connection terminal 7b for electrical connection with the connection terminal 7a was further provided. The other main surface 4b of the signal processing circuit board 4 is similarly mounted and reflowed by a signal processing electronic component (DSP8), a power supply IC 9 for driving the DSP8 and the CMOS image sensor, and its periphery. Various circuit components constituting the circuit were mounted. As for the signal processing circuit board 4, an aggregate board in which 20 sheets were assembled was produced.

  The above-mentioned two kinds of aggregate substrates were separated into pieces by a router cutter, and the image pickup device substrate 2 and the signal processing circuit substrate 4 were produced.

  Next, the lens unit 1 having three lenses and having a horizontal field angle of 135 degrees and a vertical field angle of 105 degrees is provided in the cavity of the lens holding member 3 installed on the first main surface 2a of the image sensor substrate 2. The image pickup device substrate 2 was inserted into 3b and electrically connected to an image adjustment unit installed in the optical adjustment device. In this state, while adjusting the distance between the lens unit 1 and the image pickup element substrate 2 while imaging the optical adjustment chart installed on the subject side of the lens unit 1, the focus adjustment is performed and the desired position is maintained. As shown in FIG. 2, the contact portion between the inner peripheral portion of the upper end surface of the lens holding member 3 and the side peripheral surface of the lens barrel 1d was laser-welded and fixed immediately.

  Further, an external connection terminal 5 in which a Ni plating layer and an Au plating layer are sequentially formed on the surface of the main body portion made of SUS (stainless steel) 304 is formed on the electrode pad of the other main surface 4b of the signal processing circuit board 4 by Sn-. Joined with Ag-Cu solder.

  Next, the image pickup device substrate 2 on which the lens unit 1 is mounted and the signal processing circuit substrate 4 are electrically and mechanically connected to the connection terminal 7a and the relay connection terminal 7b. Installed in the mold cavity. The mold was composed of an upper mold and a lower mold, each having a cavity forming the outer shape of the mold resin 10. In addition, the mold resin 10 has a bracket portion 12 for attaching to the vehicle.

  In addition, an injection hole for injecting resin is formed in the mold, and the lens barrel 1d of the lens unit 1 is used to prevent the resin from flowing out of the cavity when the upper mold and the lower mold are fitted together. A protrusion 11 a is provided at the upper end of the external connection terminal 5, and a protrusion 11 b is provided at an intermediate position of the external connection terminal 5. The protrusions 11a and 11b are shaped and dimensioned so as to be crushed by the pressure when the upper mold and the lower mold are fitted together.

  As the resin of the mold resin 10, a highly durable and low water-absorbing material containing an epoxy resin as a main raw material and 30% by mass of a glass filler was used. The molding resin 10 was molded by a transfer molding method using the upper mold and the lower mold.

  The manufactured imaging device module M of the present embodiment has a size of the lens portion in plan view of 24 mm long × 24 mm wide (square shape), and includes the bracket portion 12 that is an attachment portion to the vehicle. The size was 30 mm long x 60 mm wide and the height was 24 mm.

  On the other hand, as the imaging device module of the comparative example, a circuit board on which an imaging element and an electronic component for a signal processing circuit are mounted is used. What was made was produced. This case has a wiring cable to which an external cable for inputting and outputting an electric signal is connected between the image sensor and an external electric device. The wiring cable communicates from the inside of the space for housing the circuit board to the outside, and is electrically connected to a connector mounted on the circuit board. As the wiring cable, a flexible cable made of a bundle of coated wires in which a copper wire was covered with a resin tube and capable of being deformed (curved) in any direction was used.

  In the imaging device module M of the present embodiment, the electromagnetic wave noise level that is the noise characteristic at the external connection terminal 5 was 126 dB. In contrast, the imaging device module of the comparative example had an electromagnetic wave noise level of 120 dB. Therefore, the imaging device module M of the present embodiment was able to obtain a highly accurate image with less flickering and disturbance of the image as compared with the imaging device module of the comparative example.

  Further, the imaging device module M of this example could be directly attached to the automobile by the bracket portion 12. On the other hand, the imaging device module of the comparative example was attached to a separate bracket, and the bracket was further attached to the automobile. When the positional accuracy of the mounting of these imaging device modules was evaluated, the positional displacement of the mounting of the imaging device module M of this example is about ± 1 degree in angle with respect to a predetermined position, and there is no problem with accuracy. Thus, an appropriate imaging area could be obtained. On the other hand, the positional deviation of the mounting of the imaging device module of the comparative example is about ± 3 degrees in angle with respect to the predetermined position, and the deviation from the appropriate imaging area is large, and an appropriate imaging area can be obtained. It was difficult.

  The present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the scope of the present invention. For example, if the entire signal processing circuit board 4 is surrounded by an electromagnetic shielding plate (shielding plate), noise due to electromagnetic radiation generated in the signal processing circuit board 4 can be blocked, which is preferable. Further, it is preferable that heat transfer fins are provided on the surface of the package of the power supply IC 9 and a part of the fins protrudes from the mold resin 10 to improve the heat dissipation characteristics. In the present embodiment, the case where the lens unit 1 has three lenses has been described as an example, but it goes without saying that the number of lenses and the optical design corresponding to the target imaging area may be used.

(A) And (b) is the top view and bottom view which respectively show an example of embodiment of the imaging device module of this invention. It is a longitudinal cross-sectional view in the A-A 'line of the imaging device module shown in FIG. It is a longitudinal cross-sectional view of the lens unit used for the imaging device module shown in FIG. It is a disassembled perspective view which shows the process of joining the image pick-up element board | substrate and a lens holding member in the imaging device module shown in FIG. It is a longitudinal cross-sectional view which shows the process of joining the lens holding member and lens unit in the imaging device module shown in FIG.

Explanation of symbols

1: Lens unit 1a, 1b, 1c: Lens 2: Image sensor substrate 2a: First main surface 2b: Second main surface 3: Lens holding member 4: Signal processing circuit substrate 5: External connection terminal 6: Image sensor 7a: Connection terminal 7b: Relay connection terminal 8: Electronic component for signal processing 9: IC for power supply
10: Mold resin
12: Overhang (bracket)
M: Imaging device module

Claims (5)

  An image pickup device substrate on which an image pickup device is mounted on the first main surface and a connection terminal for outputting an electrical signal output from the image pickup device to the outside is provided on the second main surface; A cylindrical lens holding member that holds the lens that collects light and is fixed to the first main surface of the imaging device substrate; and the second main surface of the imaging device substrate from a side surface of the lens holding member An imaging device module comprising: a mold resin that surrounds the mold resin.   A relay connection terminal that is disposed opposite to the second main surface of the image pickup device substrate and that is connected to the connection terminal is provided on one main surface opposite to the second main surface. The imaging device module according to claim 1, wherein a signal processing circuit board on which a signal processing circuit for controlling the imaging device based on an electrical signal is formed further exists in the mold resin.   The signal processing circuit board is provided with an external connection terminal extending along a direction orthogonal to the other main surface and having one end exposed to the outside from the mold resin on the other main surface. The imaging device module according to claim 2.   The imaging device module according to any one of claims 1 to 3, wherein the mold resin has an overhang portion on a surface of which an attachment portion for attachment to an external device is formed.   The lens holding member is made of a metal material mainly composed of aluminum or iron, and a plating layer made of nickel, gold, or tin is formed on a part of the surface, and the first main surface of the imaging element substrate The imaging apparatus module according to claim 1, wherein the imaging apparatus module is fixed to the board via solder.

Images