CN112736106A - Packaging body, camera module and electronic equipment - Google Patents
Packaging body, camera module and electronic equipment Download PDFInfo
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- CN112736106A CN112736106A CN202110026451.2A CN202110026451A CN112736106A CN 112736106 A CN112736106 A CN 112736106A CN 202110026451 A CN202110026451 A CN 202110026451A CN 112736106 A CN112736106 A CN 112736106A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000010410 layer Substances 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 210000001503 joint Anatomy 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 14
- 238000009434 installation Methods 0.000 description 12
- 238000010146 3D printing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000007747 plating Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
Abstract
The application discloses packaging body, camera module and electronic equipment. The electric circuit of the packaging body passes through the first surface and the outer side surface from the conductive terminal on the first surface of the packaging body and extends to the electric connector on the second surface. This application is through setting up the circular telegram circuit with conductive terminal electric connection on the surface of packaging body in advance to at the packaging body surface setting with circular telegram circuit connection's electric connector, make circular telegram circuit accessible electric connector and exterior electric connection in order to accomplish the transmission of signal, be convenient for simplify and install the process on exterior structure with the packaging body, improve encapsulation efficiency. The conductive terminals connected with the electrified circuit and the electrified circuit are respectively arranged on two opposite surfaces of the packaging body, so that one end of the electrified circuit, which is electrically connected with an external structure, can be directly arranged on the surface of the packaging body, and the mounting space occupied by the packaging body is convenient to reduce. Further make camera module and the electronic equipment who installs above-mentioned packaging body also can satisfy miniaturized design requirement.
Description
Technical Field
The application relates to the technical field of electronic equipment packaging, in particular to a packaging body, a camera module and electronic equipment.
Background
In the field of camera modules, the packaging and manufacturing process of the camera module affects the module volume, packaging efficiency and production cost. In the related art, when the package body is packaged, the bare chip is directly arranged on the circuit board, then the binding gold wire is arranged between the bare chip and the circuit board by adopting the binding gold wire device, and the bare chip and the circuit board are electrically conducted through the binding gold wire. Meanwhile, the binding gold wire needs to occupy a large space, and the packaging colloid is needed to wrap the gold wire to protect the binding gold wire, so that the binding gold wire occupies a large installation space.
Disclosure of Invention
In order to solve the above problem, the present application provides a package, a camera module and an electronic device.
In a first aspect, an embodiment of the present application provides a package body, which includes a first surface and a second surface that are disposed opposite to each other, a plurality of outer side surfaces that connect the first surface and the second surface, a conductive terminal disposed on the first surface, and an electrical connector disposed on the second surface. The packaging body further comprises a conducting circuit arranged on the surface of the packaging body, the conducting circuit passes through the first surface and the outer side surface from the conductive terminal on the first surface and extends to the electric connector on the second surface, and the conducting circuit is electrically connected with the conductive terminal and the electric connector.
Based on the packaging body that this application embodiment provided, set up the circular telegram circuit with conductive terminal electric connection on the surface of packaging body in advance to set up the electric connector with circular telegram circuit connection on the surface of packaging body, make circular telegram circuit accessible electric connector and exterior electric connection in order to accomplish the transmission of signal, be convenient for simplify and install the process on the exterior structure with the packaging body, improve encapsulation efficiency. The conductive terminals connected with the electrified circuit and the electrified circuit are respectively arranged on two opposite surfaces of the packaging body, so that one end of the electrified circuit, which is electrically connected with the external structure, can be directly arranged on the surface of the packaging body, and the installation space occupied by the packaging body on the external structure is convenient to reduce.
In some exemplary embodiments, the number of the conductive terminals is at least one, the first surface is further provided with a sensing layer electrically connected with the conductive terminals, and the conductive terminals are arranged on the periphery of the sensing layer.
Based on the above embodiment, the connection between the power-on circuit and the electrical connection terminal is facilitated, and the conductive terminal and the power-on circuit are prevented from influencing the signal receiving and sending of the sensing layer.
In some exemplary embodiments, the electrical traces are plated electrical traces.
Based on the above embodiment, the plated power-on line can be arranged on the surface of the package body in the modes of electroplating or 3D printing and the like, and the processing mode is simple and high in feasibility. The electrified circuit plated on the surface of the packaging body can meet the requirements of electrical conduction of the electric connector and the conductive terminal only by a thin layer, so that the thickness of the electrified circuit can be far smaller than that of a binding gold wire arranged by adopting the binding gold wire equipment in the related technology, and the installation space of the whole structure of the packaging body is saved.
In some exemplary embodiments, the power lines are copper power lines.
Based on the above embodiment, after the conductive circuit made of metal materials such as copper or silver is plated on the surface of the package body, the conductive circuit can form a larger adhesive force on the surface of the package body and cannot easily fall off, so that the stability of the package body in the using process is ensured.
In some exemplary embodiments, the end of the conductive line on the second surface is provided with a conductive layer electrically connected thereto, the conductive layer is electrically connected to the electrical connector, and the width of the conductive layer is greater than the width of the end of the conductive line connected to the conductive layer.
Based on the embodiment, the conducting layer with the larger area is arranged at the end part of the electrified circuit to be connected with the electric connecting piece, so that the conducting layer and the electric connecting piece are ensured to have a sufficient effective contact area, and the connection stability of the electrified circuit and the electric connecting piece is further improved.
In some exemplary embodiments, the electrical connector is a metal cylinder or a metal ball, and an end of the metal cylinder or the metal ball is electrically connected with the electrical circuit.
Based on the embodiment, the end part of the metal cylinder or the metal ball can be melted and cooled and then is electrically connected with the electrified circuit, and the end part of the melted and cooled metal cylinder or metal ball can be better attached to the surface of the electrified circuit, so that the connection stability of the electric connector and the end part of the electrified circuit is improved. The volume of the metal cylinder or the metal ball can be adjusted according to the surface area of the end part of the power line and the distance between the second surface of the packaging body and the external structure by selecting the meltable metal cylinder or the metal ball, so that the packaging body can be more flexibly arranged on the external structure.
In some exemplary embodiments, the metal cylinder or the metal ball is surrounded by a protective layer, which also extends to connect with the power line and the second surface.
Based on the above embodiment, the protection layer may further extend to cover the second surface and the surface of the circuit board, and the connection structure between the metal pillar or the metal ball and the power line or the second surface is isolated from the outside by the protection layer, so as to improve the mounting stability of the package body mounted on the circuit board. The protective layer arranged between the second surface circuit boards can also provide support for packaging, and the packaging body is prevented from being inclined under the action of external impact force, so that the electric connecting piece, the power-on circuit and other connecting structures are prevented from loosening.
In some exemplary embodiments, the electrical connector is a lead frame, the lead frame includes a mounting frame and a gold wire disposed on the mounting frame, the mounting frame is connected to the second surface, and the gold wire is electrically connected to the electrical circuit.
Based on above-mentioned embodiment, the effective area of contact of installation frame and second surface is improved to the structure of accessible design installation frame, is convenient for improve the stability of being connected of second surface and installation frame to improve the stability of being connected of high-pass circuit and lead wire gold silk. And the electrical circuit can be flexibly and electrically connected with an external structure by designing the length of the lead gold wire and the routing position of the lead gold wire.
In a second aspect, an embodiment of the present application provides a camera module, which includes a circuit board, a protective shell, and the package body as described above. The sensing layer is a photosensitive chip, the circuit board is provided with an electric connecting terminal, and the electric connecting piece is electrically connected with the electric connecting terminal; the protective housing is arranged on the circuit board and covers the end of the packaging body, a light through hole for light to pass through is formed in the protective housing, and the light through hole is in butt joint with the photosensitive chip.
Based on the camera module that this application embodiment provided, adopt as above the packaging body, the circular telegram circuit is located the packaging body surface and is passed through electric connector and the electric connection terminal electric connection on the circuit board, can effectively reduce the installation space that the packaging body took on the circuit board, further can reduce the volume of camera module. The power-on circuit is arranged on the surface of the packaging body in advance and is electrically connected with the electric connection terminal through the electric connection piece, the packaging process of the camera module can be simplified, and the packaging efficiency is improved.
In some exemplary embodiments, the camera module further includes a lens assembly, the lens assembly is mounted on the protective shell, and the lens assembly is disposed at an end of the light-passing hole away from the package body.
Based on the above embodiment, the light passing through the lens assembly can pass through the light through hole of the protective shell and be projected onto the photosensitive chip, and the photosensitive chip can convert the light into an image signal and transmit the image signal to the conductive circuit on the circuit board.
In a third aspect, an embodiment of the present application provides an electronic device, including:
the casing and as above the camera module, camera module installs in the casing.
Based on the electronic equipment that this application embodiment provided, adopt as above the camera module, on the basis that the miniaturized design can be realized to the camera module, the electronic equipment of installing above-mentioned camera module also can realize miniaturized design.
The application provides a packaging body, camera module and electronic equipment, through set up the circular telegram circuit with conductive terminal electric connection on the surface of packaging body in advance to at the packaging body surface setting with circular telegram circuit connection's electric connector, make circular telegram circuit accessible electric connector and exterior electric connection in order to accomplish the transmission of signal, be convenient for simplify and install the packaging body in the process on the exterior, improve encapsulation efficiency. The conductive terminals connected with the electrified circuit and the electrified circuit are respectively arranged on two opposite surfaces of the packaging body, so that one end of the electrified circuit, which is electrically connected with an external structure, can be directly arranged on the surface of the packaging body, and the mounting space occupied by the packaging body is convenient to reduce. Further make camera module and the electronic equipment who installs above-mentioned packaging body also can satisfy miniaturized design requirement.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view of an electronic device in an embodiment of the present application;
FIG. 2 is a cross-sectional view of a light module according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of a camera module according to an embodiment of the present disclosure;
FIG. 4 is a first schematic perspective view of a package according to an embodiment of the present disclosure;
FIG. 5 is a partial cross-sectional view of a package according to an embodiment of the present application;
fig. 6 is a schematic perspective view illustrating a package according to an embodiment of the present application;
fig. 7 is a schematic perspective view of a package according to another embodiment of the present application;
fig. 8 is a partial cross-sectional view of a package according to another embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The inventor finds that when the packaging body is packaged in the related art, the packaging mode of binding the gold wire is arranged between the surface of the packaging body and the circuit board, the gold wire equipment needs to be bound for auxiliary operation, the process flow is complex, the processing process requirement is high, and the arranged binding gold wire can increase the mounting space occupied by the whole packaging body. Based on the findings of the inventor, the embodiments of the present application provide a package body, which solves the problems encountered in the package body packaging process by optimizing the structure of the package body.
The optical module mentioned in the embodiment of the present application refers to a physical module including one or more packages and a circuit board, wherein the packages are mounted on the circuit board, the circuit board is provided with an electrical connection terminal, and the packages are provided with an electrical connection structure electrically connected with the electrical connection terminal to realize signal transmission between the packages and the circuit board. The optical module can further comprise a protective shell, the protective shell can be arranged on the circuit board and covers the end of the packaging body, and external dust is prevented from entering the optical module to pollute the packaging body. The optical module described in the embodiment of the present application may be a camera module, a light emitting module, or the like.
The technical scheme described in the embodiment of the application is suitable for various electronic devices using the optical module, such as mobile phones, tablet computers, electronic readers, notebook computers, vehicle-mounted devices, wearable devices and the like. The electronic equipment that this application embodiment described still includes the installation casing, and the optical module is installed in the installation casing. It should be understood that the technical solutions described in the embodiments of the present application are not limited to be applied to the electronic devices described above, and can also be applied to all devices using the optical module described above.
Specifically, as shown in fig. 1, which is a front view of an electronic device 100 according to an embodiment of the present disclosure, the electronic device 100 may include a housing 120, a circuit board of an optical module 200 is mounted in the housing 120, a package of the optical module 200 is disposed on the surface of the circuit board, and the package of the optical module 200 may sense a signal from the outside or send a signal to the outside. For example, the electronic device 100 may include a screen 110, the screen 110 is covered on the housing 120, and the optical module 200 may be a camera module 220 for receiving light from the screen 110, converting the light into an image signal and transmitting the image signal to a circuit board; alternatively, the optical module 200 may be a light emitting module 210, and the light emitting module 210 receives a control signal transmitted from a conductive circuit on a circuit board and emits light to the screen 110.
For example, as shown in fig. 2, which is a cross-sectional view of the light emitting module 210 in an embodiment of the present disclosure, the package 300 of the light emitting module 210 is mounted on a side of the circuit board 230 facing the screen 110, the side of the package 300 facing the screen 110 is provided with a light emitting layer 211, and the light emitting layer 211 is electrically connected to the electrical connection terminal 231 on the circuit board 230. The conductive lines on the circuit board 230 transmit control signals through the electrical connection terminals 231, and transmit the control signals to the light emitting layer 211 so that the light emitting layer 211 can emit light to the screen side.
For example, as shown in fig. 3, which is a cross-sectional view of the camera module 220 in an embodiment of the present disclosure, the package 300 of the camera module 220 is mounted on one side of the circuit board 230, the photosensitive chip 221 is disposed on one side of the package 300 away from the circuit board 230, and the photosensitive chip 221 is electrically connected to the electrical connection terminal 231 on the circuit board 230. The camera module 220 further includes a lens assembly 222, the lens assembly 222 is disposed on the protective shell 240, and the lens assembly 222 is disposed at an end of the light passing hole 241 away from the package body 300. Specifically, the lens assembly 222 includes a lens 2221, a voice coil motor 2222 disposed on the periphery of the lens 2221, and a filter 2223 mounted on the protective shell 240 along the optical axis direction of the lens 2221, light from one side of the lens 2221 sequentially passes through the lens 2221, the filter 2223, and the light through hole 241 and then is projected to the light sensing chip 221 of the package 300, and the light sensing chip 221 converts the light into an image signal and transmits the image signal to the conductive circuit on the circuit board 230 through the electrical connection terminal 231. The optical filter 2223, the lens 2221 and the package 300 are spaced apart from each other, and the voice coil motor 2222 can be used to adjust the distance between the lens 2221 and the photo sensor 221 on the package 300, so that the light passing through the lens 2221 can be clearly imaged on the photo sensor 221.
Fig. 4, 5 and 6 are schematic structural diagrams of a package 300 according to an embodiment of the present disclosure. The package 300 includes a first surface 311 and a second surface 312 disposed opposite to each other, a plurality of outer side surfaces 313 connecting the first surface 311 and the second surface 312, conductive terminals 320 disposed on the first surface 311, and electrical connectors 330 disposed on the second surface 312. The package 300 further includes an electrical connection element 340 disposed on the surface thereof, wherein the electrical connection element 330 extends from the conductive terminal 320 on the first surface 311, through the first surface 311 and the outer side surface 313, and extends to the second surface 312, and the electrical connection element 330 is electrically connected to the conductive terminal 320 and the electrical connection element 340.
In the package 300 provided in the embodiment of the present application, the electrical connection line 340 electrically connected to the conductive terminal 320 is disposed on the surface of the package 300 in advance, and the electrical connector 330 connected to the electrical connection line 340 is disposed on the surface of the package 300, so that the electrical connection line 340 can be electrically connected to the external structure through the electrical connector 330 to complete signal transmission, which facilitates the process of mounting the package 300 on the external structure, and improves the packaging efficiency. The conductive terminals 320 connected to the conductive lines 340 and the conductive lines 340 are respectively disposed on two opposite surfaces of the package 300, so that one end of the conductive lines 340 electrically connected to an external structure can be directly disposed on the surface of the package 300, thereby reducing the installation space occupied by the package 300.
The package 300 may be a rectangular parallelepiped or other shape. When the package body 300 is a rectangular parallelepiped, the package body 300 has four outer side surfaces 313 connected in sequence, and the second surface 312 may be disposed as a plane so that the electrical connector 330 is connected with an external structure. For example, when the electrical connector 330 is electrically connected to the electrical connection terminal 231 on the circuit board 230, the surface of the circuit board 230 on which the electrical connection terminal 231 is disposed is also set to be a plane, so that the distances between the second surface 312 and the surface of the circuit board 230 on which the electrical connection terminal 231 is disposed are equal in the direction perpendicular to the second surface 312, and the installation structure of the electrical connector 330 is uniformly adjusted and controlled, so that the connection states of the electrical connector 330 and the power line 340 or the electrical connector 330 and the electrical connection terminal 231 are the same, and the stability of signal transmission is ensured.
The conductive lines 340 pass through the first surface 311 and then sequentially extend to the outer side surfaces 313 and the second surface 312, and the conductive lines 340 located in the middle portion can extend to pass through the plurality of outer side surfaces 313 and then extend to the second surface 312. Preferably, the middle power circuit may be disposed to pass through an outer side 313 and then extend to the second surface 312 for smooth routing.
In some exemplary embodiments, the number of the conductive terminals 320 is at least one, the first surface 311 is further provided with a sensing layer 350 electrically connected to the conductive terminals 320, the sensing layer 350 may be a light emitting layer 211 for emitting light, or the sensing layer 350 may also be a light sensing chip 221 for receiving light. The conductive terminal 320 is disposed at the periphery of the sensing layer 350, so as to facilitate the connection between the conductive line 340 and the electrical connection terminal 231, and prevent the conductive terminal 320 and the conductive line 340 from affecting the transmission and reception of signals by the sensing layer 350.
When the number of the conductive terminals 320 is plural, the conductive terminals 320 may be disposed on one side of the sensing layer 350, or the conductive terminals 320 may be disposed on two adjacent or opposite sides of the sensing layer 350, and the conductive terminals 320 are sequentially disposed on the first surface 311, so that the electrical circuit 340 can be smoothly routed.
Furthermore, all the parts of the conductive lines 340 on the first surface 311, the outer side surface 313 or the second surface 312 are linear conductive lines 340, so that two adjacent conductive lines 340 are arranged at intervals, and the two adjacent conductive lines 340 can be conveniently and smoothly routed, thereby preventing short circuit between the two adjacent lines.
In some exemplary embodiments, the electrical traces 340 are plated electrical traces 340. Specifically, the electrical traces 340 may be plated on the surface of the package 300 by electroplating, 3D printing, or sputter deposition. When the power-on circuit 340 is arranged, the package body 300 can be rotated, so that different surfaces of the package body 300 face the spray heads of the electroplating or 3D printing equipment respectively, or the spray heads of the electroplating or 3D printing equipment can be moved to different surfaces facing the package body 300 until the required power-on circuit 340 is processed on the surface of the package body 300, and the processing mode is simple and high in feasibility. The electrical circuit 340 plated on the surface of the package body 300 can meet the requirements of electrically conducting the electrical connector 330 and the conductive terminal 320 only by a thin layer, so that the thickness of the electrical circuit 340 can be far smaller than the thickness of the binding gold wire arranged by adopting the binding gold wire device in the related art, and the installation space of the whole structure of the package body 300 is saved.
In some exemplary embodiments, the electrical path 340 is a copper electrical path 340 or a silver electrical path 340, and both the copper electrical path 340 and the silver electrical path 340 can be disposed on the surface of the package 300 by plating, and have good electrical conductivity, so that signals can be transmitted between the conductive terminals 320 and the electrical connectors 330 through the electrical path 340. The outer packaging layer of the package 300 can be made of epoxy resin and other materials, and the conductive circuit 340 made of copper or silver and other metal materials is plated on the surface of the package 300, so that the conductive circuit 340 can form a large adhesive force on the surface of the package 300 and cannot easily fall off, and the stability of the package 300 in the using process is ensured.
Further, as shown in fig. 5 and 6, in some exemplary embodiments, a conductive layer 360 may be further disposed at an end of the electrical line 340 on the second surface 312, the conductive layer 360 is electrically connected to the electrical connector 330, and a width of the conductive layer 360 is greater than a width of a connection end of the electrical line 340 and the conductive layer 360. The conductive layer 360 with a large area is arranged at the end part of the electrified line 340 and connected with the electric connector 330, so that a sufficient effective contact area between the conductive layer 360 and the electric connector 330 is ensured, and the connection stability of the electrified line 340 and the electric connector 330 is improved. The conductive layer 360 and the conductive line 340 can be made of the same material as the conductive line 340 and integrally arranged with the conductive line 340, so that the connection stability between the conductive line 340 and the conductive layer 360 is ensured, and the conductive line 340 and the conductive layer 360 can be integrally processed on the surface of the package body 300.
As shown in fig. 7, the distance between the ends of the two adjacent conductive lines 340 on the second surface 312 may be gradually increased toward the direction away from the outer side surface 313 to increase the distance between the two adjacent conductive layers 360, so as to prevent the two adjacent conductive layers 360 from being too close to each other to short the two adjacent conductive lines 340. In other embodiments, the distance between two adjacent conductive lines 340 at one end of the second surface 312 may also be set to be equal.
In some exemplary embodiments, the electrical connector 330 is a metal cylinder or a metal ball, so that the electrical connector 330 can be disposed on the conductive layer 360 at the end of the conductive path 340 after being melted and cooled, and the manufacturing method is simple and can ensure the conductive effect of the electrical connector 330. The end of the melted and cooled metal cylinder or ball 331 can better adhere to the surface of the live wire 340, improving the stability of the connection between the electrical connector 330 and the conductive layer 360 at the end of the live wire 340. By selecting the meltable metal pillars or balls 331, the volume of the metal pillars or balls 331 can be adjusted according to the surface area of the conductive layer 360 at the end of the conductive path 340 and the distance between the second surface 312 of the package 300 and the external structure, so that the package 300 can be more flexibly mounted on the external structure. For example, the electrical connection member 330 may be a solder ball, a melted solder ball may be directly disposed on the conductive layer 360 at the end of the conductive path 340, and the package body 300 is moved to make the second surface 312 face the circuit board, and the melted solder ball is connected to the electrical connection terminal 231 on the circuit board 230, and the conductive layer 360 and the electrical connection terminal 231 can be electrically connected after the solder ball is cooled and solidified.
When the electrical connector 330 is electrically connected to the conductive layer 360 or the electrical trace 340, the periphery of the electrical connector 330 may also partially extend to be connected to the second surface 312, in some exemplary embodiments, the periphery of the connection structure between the electrical connector 330 (specifically, the metal pillar or the metal ball 331) and the electrical trace 340 or the second surface 312 is covered with a protective layer 370, and the protective layer 370 also extends to cover the surface of the electrical connector 330. The protection layer 370 may be made of an insulating material or a curable adhesive material after cooling, and the connection structure between the electrical connector 330 and the electrical circuit 340 or the second surface 312 is isolated from the outside by the protection layer 370, so as to improve the mounting stability of the package 300 on the circuit board 230. The passivation layer 370 may further extend to cover the periphery of the connection portion between the electrical connector 330 and the external structure, as shown in fig. 2 and fig. 3, for example, the package 300 is mounted on the circuit board 230 of the camera module 200, the passivation layer 370 may further extend to cover the periphery of the connection structure between the electrical connector 330 and the electrical connection terminal 231 on the circuit board 230, further, the passivation layer 370 may further extend to cover the second surface 312 and the surface of the circuit board 230, and the stability of the package 300 mounted on the circuit board 230 is substantially improved by disposing the passivation layer 370. The protective layer 370 disposed between the circuit boards 230 on the second surface 312 also provides support for the package, and prevents the package body 300 from being distorted by external impact force, which may cause the electrical connectors 330, the conductive layer 360, and the electrical connection terminals 231 to be loosened.
In some exemplary embodiments, the electrical connector 330 may also be a lead frame, the lead frame includes a mounting frame 332 and a gold wire lead 333 disposed on the mounting frame, the mounting frame 332 is connected to the second surface 312, the gold wire lead 333 is electrically connected to the electrical circuit 340, so that the electrical circuit 340 is electrically conducted to an external structure (e.g., a circuit board) through the gold wire lead 333 on the lead frame.
The effective contact area between the mounting frame 332 and the second surface 312 can be increased by designing the structure of the mounting frame 332, so that the connection stability between the second surface 312 and the mounting frame 332 can be improved, and thus the connection stability between the electrical lines 340 and the gold wire leads 333 can be improved. For example, the mounting frame 332 may be provided with a contour groove, a wall surface of the contour groove may be attached to not only the second surface 312 but also the outer surface 313 and the power lines 340, and the mounting frame 332 may be applied to the outer surface 313 and the second surface 312 from multiple directions, so that the mounting stability of the package 300 may be effectively ensured when the mounting frame 332 is mounted to an external structure. The length of the gold wire 333 and the routing position of the gold wire 333 may also be designed so that the gold wire 333 may extend to electrically connect with the external structure of the orthographic projection peripheral area of the second surface 312, so that the package 300 may be more flexibly and conveniently mounted, and the applicability of the package 300 may be improved.
The technical solution described in the present application takes the camera module 220 having the above-mentioned package 300 described in the present application as a preferred embodiment, and other embodiments with additional or fewer components based on the technical solution described in the present embodiment are also within the scope of the technical solution of the present application.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. A package, comprising:
the circuit board comprises a first surface, a second surface, a plurality of outer side faces, a conductive terminal and an electric connecting piece, wherein the first surface and the second surface are oppositely arranged, the outer side faces are used for connecting the first surface and the second surface, the conductive terminal is arranged on the first surface, and the electric connecting piece is arranged on the second surface;
the package body further comprises a conducting circuit arranged on the surface of the package body, the conducting circuit passes through the first surface and the outer side surface from the conductive terminal on the first surface and extends to the electric connector on the second surface, and the conducting circuit is electrically connected with the conductive terminal and the electric connector.
2. The package according to claim 1, wherein the number of the conductive terminals is at least one, the first surface further comprises a sensing layer electrically connected to the conductive terminals, and the conductive terminals are disposed on a periphery of the sensing layer.
3. The package of claim 1, wherein the electrical traces are plated electrical traces.
4. The package of claim 3, wherein the electrical traces are copper electrical traces.
5. The package according to claim 1, wherein the end of the electrical trace on the second surface is provided with a conductive layer electrically connected to the electrical connector, and the width of the conductive layer is greater than the width of the end of the electrical trace connected to the conductive layer.
6. The package of claim 1, wherein the electrical connector is a metal pillar or a metal ball, and an end of the metal pillar or the metal ball is electrically connected to the electrical circuit.
7. The package of claim 6, wherein the metal posts or the metal ball periphery are coated with a protective layer that extends to connect with the electrical vias and the second surface.
8. The package according to claim 1, wherein the electrical connector is a lead frame, the lead frame includes a mounting frame and a gold wire disposed on the mounting frame, the mounting frame is connected to the second surface, and the gold wire is electrically connected to the electrical circuit.
9. The utility model provides a camera module which characterized in that includes:
the package of any of claims 2-8, wherein the sensing layer is a photo-sensing chip;
the circuit board is provided with an electric connecting terminal, and the electric connecting piece is electrically connected with the electric connecting terminal;
the protective housing is arranged on the circuit board and covered on the end part of the packaging body, a light through hole for light to pass through is formed in the protective housing, and the light through hole is in butt joint with the photosensitive chip.
10. The camera module of claim 9, further comprising a lens assembly, wherein the lens assembly is mounted on the protective shell, and the lens assembly is disposed at an end of the light hole away from the package body.
11. An electronic device, comprising:
the camera module as in claim 9 above; and
the camera module is arranged in the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110026451.2A CN112736106A (en) | 2021-01-08 | 2021-01-08 | Packaging body, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110026451.2A CN112736106A (en) | 2021-01-08 | 2021-01-08 | Packaging body, camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112736106A true CN112736106A (en) | 2021-04-30 |
Family
ID=75590032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110026451.2A Withdrawn CN112736106A (en) | 2021-01-08 | 2021-01-08 | Packaging body, camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112736106A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114170925A (en) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
-
2021
- 2021-01-08 CN CN202110026451.2A patent/CN112736106A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114170925A (en) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
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Application publication date: 20210430 |