JP2010050494A - Method of manufacturing power module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a power module for easily electrically connecting a control board to relay terminals. <P>SOLUTION: This method of manufacturing a power module includes processes of: (a) preparing the relay terminals 103 each having one-side end and the other-side end electrically connected to a power semiconductor element 105, and the control board 102 divided into first and second members 102a, 102b fittable to each other; and (b) sandwiching the one-side ends of the relay terminals 103 between the first and second members 102a, 102b. Recessed parts for wrapping the one-side ends of the relay terminals 103 after sandwiching them in the process (b) are formed at least on either of the first and second members 102a, 102b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a power module used as a power control device.

  A power module used as a power control device such as a three-phase inverter generally includes a power semiconductor element that performs switching and a control board for driving the power semiconductor element.

  The power semiconductor element and the control board are electrically connected via a relay terminal. More specifically, the relay terminal electrically connected to the power semiconductor element in advance is inserted into a through hole provided in the control board, and the relay terminal is soldered to the control board, thereby controlling the power semiconductor element. Electrical connection with the substrate is realized.

  Note that prior art document information relating to the invention of this application includes the following.

JP 2004-87605 A JP 2004-22705 A JP-A-9-293941

  The conventional power module has a problem that it is difficult to penetrate the relay terminal into the through hole of the control board because there is little play in the diameter of the through hole of the control board with respect to the diameter of the relay terminal.

  In particular, when the relay terminal is inserted into the through hole of the control board, the relay terminal may bend against the control board surface without entering the through hole of the control board. When such a bending occurs, the relay terminal becomes more difficult to enter the through hole of the control board, and it is necessary to correct the shape of the relay terminal, which complicates the manufacturing process.

  Even if the relay terminal is not bent, the relay terminal may be difficult to enter the through hole of the control board because the formation position of the relay terminal is slightly shifted.

  The present invention has been made in view of the above circumstances, and an object thereof is to realize a method for manufacturing a power module that facilitates electrical connection between a control board and a relay terminal.

  In order to solve the above-described problems, a method for manufacturing a power module according to the present invention includes: (a) a relay terminal having one end and the other end electrically connected to the power semiconductor element; Preparing a control board divided into two members, and (b) sandwiching the one end of the relay terminal between the first and second members, and at least one of the first and second members Is provided with a recess for enclosing the one end of the relay terminal after being sandwiched in the step (b).

  According to the present invention, one end of the relay terminal is sandwiched between the first and second members of the control board that can be fitted, and at least one of the first and second members of the control board includes one end of the relay terminal after the sandwiching. A recess is provided for this purpose. Therefore, the manufacturing method of the power module which does not need the operation | work which penetrates one end of a relay terminal in a control board, and can perform electrical connection with a control board and a relay terminal easily is realizable.

It is a figure which shows the power module manufactured by the manufacturing method which concerns on Embodiment 1. FIG. It is a figure explaining the mode of connection of a power semiconductor element, a control board, and a relay terminal. It is a figure explaining the mode of connection of a power semiconductor element, a control board, and a relay terminal. FIG. 4 is a cross-sectional view taken along a cutting line IV-IV in FIG. 3. FIG. 4 is a cross-sectional view taken along a cutting line IV-IV in FIG. 3. 6 is a diagram showing a method for manufacturing a power module according to Embodiment 2. FIG. 6 is a diagram showing a method for manufacturing a power module according to Embodiment 2. FIG. It is an enlarged view of the attachment part of a relay terminal and a dummy terminal. It is a figure which shows the manufacturing method of the power module which concerns on Embodiment 3. FIG. It is a figure which shows the manufacturing method of the power module which concerns on Embodiment 4. FIG. FIG. 10 is a perspective view showing a method for manufacturing a power module according to Embodiment 4. It is a figure which shows the manufacturing method of the power module which concerns on Embodiment 4. FIG. It is a figure which shows the manufacturing method of the power module which concerns on Embodiment 4. FIG.

<Embodiment 1>
In the present embodiment, the diameter of the through hole of the control board is gradually reduced as the through hole is advanced from the penetration side of the relay terminal, and the diameter at one end of the relay terminal is smaller than the diameter at the other part of the relay terminal. Power module and manufacturing method thereof.

  FIG. 1 is a diagram showing a power module manufactured by the manufacturing method according to the present embodiment. This power module includes a module lid 101, a control board 102, a relay terminal 103, a control board fixing base 104, a power semiconductor element 105, and cooling fins 106. The power semiconductor element 105 is a power semiconductor element that performs switching such as an IGBT (Insulated Gate Bipolar Transistor), and the control board 102 includes a control chip (not shown) for driving the power semiconductor element 105. Control board.

  As shown in FIG. 1, the power semiconductor element 105 is fixed to the cooling fin 106. The control board fixing base 104 is also fixed to the cooling fin 106. The control board 102 is supported by the control board fixing base 104. The surface of the cooling fin 106 is covered with the module lid 101.

  FIG. 2 and FIG. 3 are diagrams for explaining how the power semiconductor element 105, the control board 102, and the relay terminal 103 are connected. In FIGS. 2 and 3, members other than the power semiconductor element 105, the control board 102, and the relay terminal 103 are not shown for simplification of description.

  As shown in FIGS. 2 and 3, one end of the relay terminal 103 is inserted into a through hole 201 a provided in the control board 102. Further, the other end of the relay terminal 103 is electrically connected to the power semiconductor element 105 in advance and is fixed to the power semiconductor element 105.

  In the present application, an example in which the other end of the relay terminal 103 is fixed to the power semiconductor element 105 is shown, but the present invention is not limited to such a relay terminal. For example, the present invention is also applied to a relay terminal that is connected to a power semiconductor element via a wire, such as the relay terminal 5 in FIG. Is possible.

  4 and 5 are cross-sectional views taken along section line IV-IV in FIG. As can be seen from FIG. 4, the diameter of the through hole 201 a is gradually reduced from the penetration side of the relay terminal 103 through the through hole 201 a, and the cross section of the through hole 201 a in the penetration direction of the relay terminal 103 is tapered. Yes.

  Further, the diameter of the relay terminal 103 at one end 103b is smaller than the diameter of the other part of the relay terminal 103, and at the boundary part 103a between the one end 103b and the other part, the relay terminal 103 is directed toward the one end 103b. Gradually decreases in diameter. Therefore, the cross section of the boundary portion 103a in the penetration direction of the relay terminal 103 is also tapered.

  Then, after one end 103b of the relay terminal 103 is inserted into the through hole 201a, the relay terminal 103 is fixed to the control board 102 by spraying solder 107 as shown in FIG. Thereby, the electrical connection between the power semiconductor element 105 and the control board 102 is realized.

  According to the power module and the method for manufacturing the same according to the present embodiment, the diameter of the through hole 201a gradually decreases from the penetration side of the relay terminal 103 through the through hole 201a. Therefore, by making the diameter of the through hole 201a on the penetration side of the relay terminal 103 sufficiently larger than the diameter of the one end 103b of the relay terminal 103, the relay terminal 103 can be easily penetrated into the through hole 201a. Even if there is a deviation in the formation position of the relay terminal 103, the diameter of the through hole 201a gradually decreases from the penetration side of the relay terminal 103 through the through hole 201a. Is guided by the wall surface of the through hole 201a, and the relay terminal 103 can be corrected to an appropriate position. Therefore, it is possible to realize a power module manufacturing method that facilitates electrical connection between the control board 102 and the relay terminal 103.

  Moreover, according to the method for manufacturing the power module according to the present embodiment, the diameter of the relay terminal 103 at the one end 103b is smaller than the diameter of the other part of the relay terminal 103. Therefore, it is easier to penetrate the relay terminal 103 into the through hole 201 a of the control board 102. In addition, at the boundary portion 103a between the one end 103b of the relay terminal 103 and the other portion, the diameter of the relay terminal 103 gradually decreases toward the one end 103b side. The gradually decreasing portion of the diameter can be brought into contact. As a result, the gradually decreasing portion of the diameter of the relay terminal 103 can function as a stopper for the control board 102, and the control board fixing base 104, which is a member that supports the control board 102, can be omitted.

  In the present embodiment, the diameter at the one end 103b of the relay terminal 103 is made smaller than the diameter at the other part of the relay terminal 103, but this is not necessarily required. That is, the aspect which changed only the diameter of the through-hole 201a of the control board 102, without changing about the diameter of the relay terminal 103 may be sufficient.

  This is because even if the relay terminal 103 has a simple rod shape, if the cross section of the through hole 201a is tapered as described above, there is a guide effect by the wall surface of the through hole 201a.

  In the present application, the case where all of the control board 102, the relay terminal 103, and the power semiconductor element 105 are accommodated in the cooling fin 106 is taken as an example, but the present invention is not limited to such a case. For example, the present invention can be applied even when manufacturing a power module in which all of the control board 102, the relay terminal 103, and the power semiconductor element 105 are packaged in a resin seal.

<Embodiment 2>
The present embodiment is a method of manufacturing a power module in which a dummy terminal is attached to a relay terminal, and the dummy terminal is inserted into the through hole, thereby facilitating the penetration of the relay terminal into the control board.

  6 and 7 are diagrams showing a method of manufacturing the power module according to the present embodiment. As shown in both figures, in the present embodiment, a detachable dummy terminal 108 is prepared at one end of the relay terminal 103. FIG. 8 is an enlarged view of a portion where the relay terminal 103 and the dummy terminal 108 are attached.

  In the dummy terminal 108, the diameter at one end 108b is smaller than the diameter at the other part and the diameter of the relay terminal 103, and at the boundary part 108a between the one end 108b and the other part, a dummy is formed toward the one end 108b side. The diameter of the terminal 108 is gradually reduced. The other end of the dummy terminal 108 can be attached to and detached from one end of the relay terminal 103. Then, one end 108b of the dummy terminal 108 functions as an insertion portion into the through hole 201b of the control board 102.

  In the present embodiment, first, the other end of the dummy terminal 108 is attached to one end of the relay terminal 103. More specifically, as shown in FIG. 8, a female part 103c is provided at one end of the relay terminal 103, a male part 108c is provided at the other end of the dummy terminal 108, and the male part 108c is fitted to the female part 103c. do it.

  Next, as shown in FIG. 6, one end 108 b of the dummy terminal 108 is inserted into the through hole 201 b of the control board 102. Unlike the case of the through hole 201a of the first embodiment, in this embodiment, the diameter of the through hole 201b is not changed in the penetration direction of the dummy terminal 108.

  Next, by passing the through hole 201b through the dummy terminal 108, one end of the relay terminal 103 is inserted into the through hole 201b. Thereafter, as shown in FIG. 7, the other end of the dummy terminal 108 is removed from one end of the relay terminal 103.

  According to the method for manufacturing a power module according to the present embodiment, the diameter of one end 108 b of dummy terminal 108 is smaller than the diameter of the other part of dummy terminal 108 and the diameter of relay terminal 103. Therefore, the one end 108 b of the dummy terminal 108 is easily penetrated into the through hole 201 b of the control board 102.

  Further, at the boundary portion 108a between the one end 108b of the dummy terminal 108 and the other portion, the diameter of the dummy terminal 108 gradually decreases toward the one end 108b side, so that even if there is a deviation in the formation position of the relay terminal 103. The boundary portion 108a of the dummy terminal 108 is guided by the wall surface of the through hole 201b with the penetration, and the relay terminal 103 can be corrected to an appropriate position. Therefore, it is possible to realize a power module manufacturing method that facilitates electrical connection between the control board 102 and the relay terminal 103.

  Further, only the diameter of the dummy terminal 108 is different between the one end 108b and the other part, and the diameter of the relay terminal 103 can be made constant. Therefore, there is no thin portion in the relay terminal 103, and an increase in the resistance value of the relay terminal 103 can be suppressed.

<Embodiment 3>
The present embodiment is a modification of the method for manufacturing the power module according to the second embodiment, in which dummy terminals 108 are attached to only some of the plurality of relay terminals 103 in the second embodiment. .

  FIG. 9 is a diagram illustrating a method for manufacturing a power module according to the present embodiment. 9 is the same as FIG. 6 except that the dummy terminals 108 are attached only to the relay terminals 103 at both ends, and the dummy terminals 108 are not attached to the two relay terminals 103 in the center.

  According to the method for manufacturing a power module according to the present embodiment, dummy terminals 108 are attached to some of the plurality of relay terminals 103. Therefore, it is not necessary to attach / detach the dummy terminals 108 to all the relay terminals 103, and the power module manufacturing method according to the second embodiment can be simplified.

<Embodiment 4>
This embodiment is a method of manufacturing a power module that electrically connects the control board and the relay terminal by sandwiching one end of the relay terminal between the control board divided into the first and second members that can be fitted. is there.

  10-13 is a figure which shows the manufacturing method of the power module which concerns on this Embodiment. FIG. 11 is a perspective view of FIG. FIG. 12 is a view showing that the first and second members are being fitted, and FIG. 13 is a view showing when the first and second members are completely fitted.

  10 to 13, the first member 102a and the second member 102b of the control board 102 and the relay terminal 103 in the present embodiment are shown. In these drawings, a state in which one end of the relay terminal 103 is sandwiched between the first member 102a and the second member 102b is shown.

  The first member 102a is provided with a recess 302 for containing one end of the relay terminal 103 after being sandwiched. Further, the second member 102b is provided with a recess 304 for enclosing one end of the relay terminal 103 after being sandwiched.

  Only one of the recesses 302 and 304 may be provided, and one end of the relay terminal 103 may be included therein.

  In addition, the end portion 301 of the first member is provided with a notch 300 having a divergent shape that widens toward the end portion 301, and the end portion 305 of the second member has a notch portion when the relay terminal 103 is sandwiched. A tapered protrusion 306 that fits in 300 is provided. The above-described recess 302 is provided at the innermost part of the notch 300, and the above-described recess 304 is provided at the tip of the projection 306.

  In addition, a plate-like portion 303 that protrudes from the end portion 305 by the same distance as the protrusion distance from the end portion 305 to the tip of the protrusion portion 306 is provided in the adjacent portion of the end portion 305 of the second member 102b. In the end portion 301 of the first member 102a, an adjacent portion of the cutout portion 300 is provided with a storage portion 301b for storing the plate-like portion 303 when the relay terminal 103 is sandwiched (see FIG. 11).

  More specifically, as shown in FIG. 11, in the end portion 301 of the first member 102a, a storage portion 301b is provided between the end surfaces 301a arranged vertically in the thickness direction of the first member 102a. Further, the tapered surface 301 c of the end portion 301 constitutes the cutout portion 300. And the recessed part 302 is provided in the innermost part of the taper surface 301c.

  Further, the plate-like portion 303 of the second member 102b is constituted by a portion 303a that protrudes from between the end surfaces 303b of the end portion 305, which are arranged vertically in the thickness direction of the second member 102b. Further, the tapered surface 303 c of the end portion 305 constitutes the protruding portion 306. And the recessed part 304 is provided in the front-end | tip of the taper surface 303c.

  After the relay terminal 103 is sandwiched between the first member 102 a and the second member 102 b as shown in FIG. 13, the solder terminal is jetted near the relay terminal 103 to spray the relay terminal as in the first embodiment. 103 is fixed to the control board 102. Thereby, the electrical connection between the power semiconductor element 105 and the control board 102 is realized.

  As described above, according to the method for manufacturing the power module according to the present embodiment, one end of the relay terminal 103 is sandwiched between the first and second members 102a and 102b of the control board 102 that can be fitted, and the control board 102 The first and second members 102a and 102b are provided with recesses 302 and 304 for enclosing one end of the relay terminal 103 after being sandwiched. Therefore, it is possible to realize a power module manufacturing method that does not require the operation of penetrating one end of the relay terminal 103 into the control board 102 and that facilitates electrical connection between the control board 102 and the relay terminal 103.

  Further, according to the method of manufacturing the power module according to the present embodiment, the notch 300 is provided at the end 301 of the first member 102a, and the protrusion 306 is provided at the end 305 of the second member 102b. The recess 302 is provided at the innermost part of the notch 300, and the recess 304 is provided at the tip of the protrusion 306. Accordingly, when one end of the relay terminal 103 is sandwiched between the first and second members 102a and 102b, one end of the relay terminal 103 is guided by the notch 300, and one end of the relay terminal 103 is included in the recesses 302 and 304. It becomes easy to be done.

  Furthermore, according to the method for manufacturing the power module according to the present embodiment, the plate-like portion 303 is provided adjacent to the protruding portion 306 in the end portion 305 of the second member 102b, and the end portion of the first member 102a. A storage portion 301 b is provided in a portion adjacent to the cutout portion 302 in 301. As a result, when one end of the relay terminal 103 is sandwiched between the first and second members 102a and 102b, one end of the relay terminal 103 is also guided by the plate-like portion 303, and one end of the relay terminal 103 is further recessed 302, 304. It becomes easy to be included.

  102 control board, 103 relay terminal, 105 power semiconductor element, 108 dummy terminal.

Claims (3)

(A) preparing a relay terminal having one end and the other end electrically connected to the power semiconductor element, and a control board divided into first and second members that can be fitted;
(B) a step of sandwiching the one end of the relay terminal between the first and second members,
A method for manufacturing a power module, wherein at least one of the first and second members is provided with a recess for containing the one end of the relay terminal after being sandwiched in the step (b). It is a manufacturing method of the power module of Claim 1, Comprising:
The first member has an end;
The end portion of the first member is provided with a notch portion having a divergent shape that widens toward the end portion,
The second member has an end;
The end of the second member is provided with a tapered protrusion that fits into the notch when sandwiched in the step (b).
The recess is a method for manufacturing a power module provided at least one of the innermost part of the notch and the tip of the protrusion. It is a manufacturing method of the power module according to claim 2,
A plate-like portion that protrudes from the end portion by the same distance as the protrusion distance from the end portion to the tip of the protrusion portion is provided in the adjacent portion of the end portion of the second member.
The manufacturing method of the power module in which the accommodating part which accommodates the said plate-shaped part at the time of pinching in the said process (b) was provided in the adjacent part of the said notch part among the said edge parts of the said 1st member.

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