JP2010047024A5 - - Google Patents

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JP2010047024A5
JP2010047024A5 JP2009275476A JP2009275476A JP2010047024A5 JP 2010047024 A5 JP2010047024 A5 JP 2010047024A5 JP 2009275476 A JP2009275476 A JP 2009275476A JP 2009275476 A JP2009275476 A JP 2009275476A JP 2010047024 A5 JP2010047024 A5 JP 2010047024A5
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Prior art keywords
bonding film
head according
ejection head
droplet ejection
liquid droplet
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JP2009275476A
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JP4900457B2 (en
JP2010047024A (en
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Priority claimed from JP2009275476A external-priority patent/JP4900457B2/en
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Publication of JP2010047024A5 publication Critical patent/JP2010047024A5/ja
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Claims (16)

吐出液を貯留する吐出液貯留室が形成された基板と、
前記吐出液貯留室を覆うように前記基板の一方の面に設けられ、前記吐出液を液滴として吐出するノズル孔とを備えるノズルプレートと、
前記吐出液貯留室を覆うように前記基板の他方の面に設けられた封止板とを有し、
前記基板と前記ノズルプレートとが接合膜を介して接合されており、
前記接合膜は、プラズマ重合法により形成されたものであり、シロキサン(Si−O)結合を含み、結晶化度が45%以下であるSi骨格と、該Si骨格に結合する脱離基とを含み、
前記接合膜は、その少なくとも一部の領域にエネルギーを付与したことにより、前記接合膜の表面付近に存在する前記脱離基が前記Si骨格から脱離し、前記接合膜の表面の前記領域に発現した接着性によって、前記基板と前記ノズルプレートとを接合していることを特徴とする液滴吐出ヘッド。
A substrate on which a discharge liquid storage chamber for storing the discharge liquid is formed;
A nozzle plate that is provided on one surface of the substrate so as to cover the discharge liquid storage chamber, and includes a nozzle hole that discharges the discharge liquid as droplets;
A sealing plate provided on the other surface of the substrate so as to cover the discharge liquid storage chamber;
The substrate and the nozzle plate are bonded via a bonding film,
The bonding film is formed by a plasma polymerization method, and includes a Si skeleton including a siloxane (Si—O) bond and a crystallinity of 45% or less, and a leaving group bonded to the Si skeleton. Including
In the bonding film, energy is applied to at least a part of the region, whereby the leaving group existing in the vicinity of the surface of the bonding film is detached from the Si skeleton and is expressed in the region on the surface of the bonding film. A droplet discharge head characterized in that the substrate and the nozzle plate are bonded to each other by the adhesion.
前記接合膜を構成する全原子からH原子を除いた原子のうち、Si原子の含有率とO原子の含有率の合計が、10〜90原子%である請求項1に記載の液滴吐出ヘッド。   2. The liquid droplet ejection head according to claim 1, wherein a sum of a content ratio of Si atoms and a content ratio of O atoms among atoms obtained by removing H atoms from all atoms constituting the bonding film is 10 to 90 atomic%. . 前記接合膜中のSi原子とO原子の存在比は、3:7〜7:3である請求項1または2に記載の液滴吐出ヘッド。   3. The droplet discharge head according to claim 1, wherein an abundance ratio of Si atoms to O atoms in the bonding film is 3: 7 to 7: 3. 前記脱離基は、H原子、B原子、C原子、N原子、O原子、P原子、S原子およびハロゲン系原子、またはこれらの各原子が前記Si骨格に結合するよう配置された原子団からなる群から選択される少なくとも1種で構成されたものである請求項1ないしのいずれかに記載の液滴吐出ヘッド。 The leaving group includes an H atom, a B atom, a C atom, an N atom, an O atom, a P atom, an S atom, and a halogen atom, or an atomic group arranged so that each of these atoms is bonded to the Si skeleton. It claims 1 to those composed of at least one member selected from the group consisting to the liquid droplet ejection head according to any one of the three. 前記脱離基は、アルキル基である請求項に記載の液滴吐出ヘッド。 The liquid droplet ejection head according to claim 4 , wherein the leaving group is an alkyl group. 前記脱離基としてメチル基を含む接合膜についての赤外光吸収スペクトルにおいて、シロキサン結合に帰属するピーク強度を1としたとき、メチル基に帰属するピーク強度が0.05〜0.45である請求項に記載の液滴吐出ヘッド。 In the infrared light absorption spectrum of the bonding film containing a methyl group as the leaving group, when the peak intensity attributed to the siloxane bond is 1, the peak intensity attributed to the methyl group is 0.05 to 0.45. The droplet discharge head according to claim 5 . 前記接合膜は、ポリオルガノシロキサンを主材料として構成されている請求項1ないしのいずれかに記載の液滴吐出ヘッド。 The bonding film, the liquid droplet ejection head according to any one of claims 1 to 6 is configured polyorganosiloxane as a main material. 前記ポリオルガノシロキサンは、オクタメチルトリシロキサンの重合物を主成分とするものである請求項に記載の液滴吐出ヘッド。 The liquid droplet ejection head according to claim 7 , wherein the polyorganosiloxane is mainly composed of a polymer of octamethyltrisiloxane. 前記プラズマ重合法において、プラズマを発生させる際の高周波の出力密度は、0.01〜100W/cmである請求項1ないしのいずれかに記載の液滴吐出ヘッド。 In the plasma polymerization method, the power density of the high frequency at the time of generating plasma, the liquid droplet ejection head according to any one of claims 1 to 8 is 0.01~100W / cm 2. 前記接合膜の平均厚さは、1〜1000nmである請求項1ないしのいずれかに記載の液滴吐出ヘッド。 The average thickness of the bonding film, the liquid droplet ejection head according to any one of claims 1 to 9 is 1 to 1,000 nm. 前記エネルギーの付与は、前記接合膜にエネルギー線を照射する方法、前記接合膜を加熱する方法、および、前記接合膜に圧縮力を付与する方法のうちの少なくとも1つの方法により行われる請求項1ないし10のいずれかに記載の液滴吐出ヘッド。 The energy is applied by at least one of a method of irradiating the bonding film with energy rays, a method of heating the bonding film, and a method of applying a compressive force to the bonding film. 11. A droplet discharge head according to any one of items 10 to 10 . 前記基板と前記封止板とが、前記接合膜と同様の接合膜を介して接合されている請求項1ないし11のいずれかに記載の液滴吐出ヘッド。 The substrate and the a sealing plate, the liquid droplet ejection head according to any one of claims 1 to 11 is bonded through a bonding film similar to the above bonding film. 前記封止板は、複数の層を積層してなる積層体で構成されており、
前記積層体中の層のうち、隣接する少なくとも1組の層の層間が、前記接合膜と同様の接合膜を介して接合されている請求項1ないし12のいずれかに記載の液滴吐出ヘッド。
The sealing plate is composed of a laminate formed by laminating a plurality of layers,
The droplet discharge head according to any one of claims 1 to 12 , wherein at least one set of adjacent layers among the layers in the stacked body is bonded via a bonding film similar to the bonding film. .
当該液滴吐出ヘッドは、さらに、前記封止板の前記基板と反対側に設けられ、前記封止板を振動させる振動手段を有し、
前記封止板と前記振動手段とが、前記接合膜と同様の接合膜を介して接合されている請求項1ないし13のいずれかに記載の液滴吐出ヘッド。
The liquid droplet ejection head is further provided on the opposite side of the sealing plate from the substrate, and has vibration means for vibrating the sealing plate,
The sealing plate and said vibration means, the liquid droplet ejection head according to any one of the bonding film claims 1 are bonded through the same bonding film and 13.
当該液滴吐出ヘッドは、さらに、前記封止板の前記基板と反対側に設けられたケースヘッドを有し、
前記封止板と前記ケースヘッドとが、前記接合膜と同様の接合膜を介して接合されている請求項1ないし14のいずれかに記載の液滴吐出ヘッド。
The droplet discharge head further includes a case head provided on the opposite side of the sealing plate from the substrate,
Wherein the sealing plate and the case head is the liquid droplet ejection head according to any one of the bonding film claims 1 are bonded through the same bonding film and 14.
請求項1ないし15のいずれかに記載の液滴吐出ヘッドを備えることを特徴とする液滴吐出装置。 Droplet discharge apparatus comprising: a liquid droplet ejection head according to any one of claims 1 to 15.
JP2009275476A 2007-11-05 2009-12-03 Droplet discharge head and droplet discharge apparatus Expired - Fee Related JP4900457B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009275476A JP4900457B2 (en) 2007-11-05 2009-12-03 Droplet discharge head and droplet discharge apparatus

Applications Claiming Priority (3)

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JP2007287909 2007-11-05
JP2007287909 2007-11-05
JP2009275476A JP4900457B2 (en) 2007-11-05 2009-12-03 Droplet discharge head and droplet discharge apparatus

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JP2008171852A Division JP4450256B2 (en) 2007-11-05 2008-06-30 Droplet discharge head and droplet discharge apparatus

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JP2010047024A JP2010047024A (en) 2010-03-04
JP2010047024A5 true JP2010047024A5 (en) 2011-08-18
JP4900457B2 JP4900457B2 (en) 2012-03-21

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JP2008171852A Expired - Fee Related JP4450256B2 (en) 2007-11-05 2008-06-30 Droplet discharge head and droplet discharge apparatus
JP2008171851A Withdrawn JP2009132140A (en) 2007-11-05 2008-06-30 Liquid droplet ejection head and liquid droplet ejector
JP2009275476A Expired - Fee Related JP4900457B2 (en) 2007-11-05 2009-12-03 Droplet discharge head and droplet discharge apparatus
JP2009275477A Expired - Fee Related JP4900458B2 (en) 2007-11-05 2009-12-03 Droplet discharge head and droplet discharge apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012020422A (en) * 2010-07-12 2012-02-02 Seiko Epson Corp Liquid ejecting head, liquid ejecting head unit and liquid ejecting apparatus
JP5666337B2 (en) 2011-02-17 2015-02-12 富士フイルム株式会社 Image forming method
JP5870766B2 (en) * 2012-03-02 2016-03-01 セイコーエプソン株式会社 Droplet discharge head and droplet discharge apparatus
EP3061613B1 (en) * 2015-02-26 2018-03-14 Piotr Jeuté A drop on demand printing head and printing method
US9559037B2 (en) * 2015-06-02 2017-01-31 Intel Corporation Package integrated synthetic jet device
JP6613682B2 (en) * 2015-07-28 2019-12-04 セイコーエプソン株式会社 Electronic devices, liquid ejection heads.
CN105599452A (en) * 2016-03-03 2016-05-25 中国科学院苏州纳米技术与纳米仿生研究所 Multilayer material orifice structure and printer
JP7286999B2 (en) * 2019-02-26 2023-06-06 セイコーエプソン株式会社 Piezoelectric elements, liquid ejection heads, and printers

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JP2980451B2 (en) * 1992-04-22 1999-11-22 キヤノン株式会社 INK JET PRINT HEAD, METHOD FOR MANUFACTURING THE SAME, AND A RECORDING APPARATUS HAVING THE INK JET PRINT HEAD
GB9417445D0 (en) * 1994-08-30 1994-10-19 Xaar Ltd Coating, coating composition and method of forming coating
US6151045A (en) * 1999-01-22 2000-11-21 Lexmark International, Inc. Surface modified nozzle plate
JP3714338B2 (en) * 2003-04-23 2005-11-09 ウシオ電機株式会社 Joining method
JP4496805B2 (en) * 2004-03-02 2010-07-07 セイコーエプソン株式会社 Film forming method and film

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