JP2010040725A - Case for cooling apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a case for cooling apparatus for preventing the corrosion, or the like, of the apparatus by the moisture generated by condensation. <P>SOLUTION: The case 1 has a storage chamber 1a for storing an apparatus 2 and is formed with a refrigerant flow path 1b, in which a cooling medium for cooling the apparatus 2 flows, and there is provided a first heat sink wall 1c for partitioning between the refrigerant flow path 1b and the storage chamber 1a. In the case for cooling the apparatus in which a communication hole 1e for providing communication between the storage chamber 1a and the outside of the case 1 formed, there is formed an outside-air intake path 1d from the outside of the case 1 to the inlet of the storage chamber 1a; a communication hole 1e is formed between the outside-air intake path 1d and the storage chamber 1a; and a second heat sink wall for partitioning between the outside air intake path 1d and the refrigerant flow path 1b is provided; and the communication hole 1e is provided with a vent valve 1f having breathability and water vapor permeability. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a device cooling housing, and avoids water from being generated due to dew condensation in the housing and causing corrosion of the device.

  Since an electronic device generates heat when the electronic device operates, it is often housed in a casing having a cooling function.

For example, Patent Documents 1 and 2 are known as housings for housing equipment. The inventions described in Patent Documents 1 and 2 are configured such that an opening is formed in a closed casing, and a ventilation member is configured by attaching a breathing member so as to cover the opening. Dust-proof, water-release and oil-proof properties are improved. An electronic component housed inside the ventilation casing generates heat, and the air inside the ventilation casing expands and contracts, but a ventilation valve composed of a porous membrane capable of ventilation and moisture transmission is provided. Therefore, there is no pressure difference between the inside and outside of the ventilation casing.
JP 2001-168543 A JP 2003-318557 A

  However, for example, in a high-temperature and high-humidity environment such as an air temperature of 85 ° C. and a humidity of 85%, water vapor contained in the air enters the inside of the housing through the ventilation valve. When the water vapor in the housing contacts the wall surface of the heat sink at 60 ° C. and is cooled to 60 ° C., the water vapor is solidified to cause condensation, and the metal parts and electronic parts are corroded due to the water generated by the condensation. This causes malfunctions.

  On the other hand, the casing may be tilted so that moisture generated by condensation is discharged, but the occupied space of the casing increases in the height direction by the tilt of the casing.

  Therefore, an object of the present invention is to provide a device cooling housing that solves the above-described problems.

  According to the first aspect of the present invention, a refrigerant flow path through which a cooling medium for cooling the device flows is formed in a housing having a storage chamber for storing the device. A device cooling housing provided with a first heat sink wall for partitioning and forming a communication hole for communicating the housing chamber and the outside of the housing. An outside air introduction path from the outside of the housing to the entrance of the housing chamber The communication hole is formed between the outside air introduction path and the storage chamber, and a second heat sink wall is provided to partition the outside air introduction path and the refrigerant flow path.

  According to this invention, the outside air that flows between the outside of the housing and the storage chamber passes through the outside air introduction path, and the outside air that flows in from the outside contacts the second heat sink wall in the outside air introduction path. Therefore, the hot and humid outside air flowing from the outside is cooled by the second heat sink wall, the water vapor contained in the outside air is condensed by the cooling, and the moisture generated by the condensation flows into the outside air introduction path. Accordingly, only the outside air having dew condensation and low humidity flows into the storage chamber, and the occurrence of condensation in the storage chamber is suppressed. Meanwhile, the device is cooled by the first heat sink wall.

  According to a second aspect of the present invention, in the device cooling casing according to the first aspect, a vent valve having air permeability and moisture permeability is provided in the communication hole.

  According to this invention, since the vent hole having air permeability and moisture permeability is provided in the communication hole, entry of dust and water droplets into the accommodation chamber is prevented.

  According to a third aspect of the present invention, in the equipment cooling casing according to the first or second aspect, the outside air introduction path is inclined so as to become lower toward the outside of the casing.

  According to the present invention, moisture generated by dew condensation in the outside air introduction path flows downward along the outside air introduction path and is discharged to the outside of the housing. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

  According to a fourth aspect of the present invention, there is provided the device cooling casing according to the first or second aspect, wherein the outside air introduction path is formed with a substantially conical tapered lateral hole so that a bottom surface is lowered toward the outside of the casing. It is characterized by that.

  According to the present invention, moisture generated by condensation in the outside air introduction path flows to the lower side along the bottom surface of the tapered lateral hole and is discharged to the outside of the housing. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

  According to the apparatus cooling housing according to claim 1, the hot and humid outside air that flows in from the outside contacts the second heat sink wall through the outside air introduction path to be cooled and condensed, and moisture generated by the condensation is introduced into the outside air. It flows on the road. Therefore, only the outside air that has condensed and decreased in humidity when passing through the outside air introduction path flows into the accommodation chamber, and the occurrence of condensation in the accommodation chamber is suppressed. For this reason, it is possible to prevent corrosion of metal parts and electronic parts in the storage chamber without expanding the installation space. Moreover, since only the outside air introduction path is formed, the manufacturing cost is low.

  According to the device cooling housing according to the second aspect, since the ventilation hole having the air permeability and the moisture permeability is provided in the communication hole, entry of dust and water droplets into the accommodation chamber is prevented.

  According to the device cooling casing of the third aspect, moisture generated by condensation in the outside air introduction path flows downward along the outside air introduction path and is discharged to the outside of the casing. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

  According to the device cooling casing according to the fourth aspect, moisture generated by dew condensation in the outside air introduction path flows downward along the bottom surface of the tapered lateral hole, and is discharged to the outside of the casing. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

Hereinafter, an embodiment of a device cooling casing according to the present invention will be described based on Embodiments 1 to 3.
(A) Embodiment 1
First, the first embodiment will be described.
(Constitution)
As shown in FIG. 1, a device cooling housing 1 is provided. The device cooling housing 1 is formed with a storage chamber 1a for storing a device. Further, in the present embodiment as a cooling medium for cooling the equipment housed in the housing chamber 1a, a refrigerant flow path 1b for flowing cooling water (for example, 60 ° C. cooling water) is provided below the housing chamber 1a. Is formed. And the said apparatus 2 is mounted in the part of the 1st heat sink wall 1c which partitions off between this refrigerant | coolant flow path 1b and the said storage chamber 1a.

  An outside air introduction path 1d is formed above the refrigerant flow path 1b from the left side, which is outside the housing 1, to the entrance of the accommodation chamber 1a, and a communication hole is formed between the outside air introduction path 1d and the accommodation chamber 1a. 1e is formed.

  A vent valve 1f is provided in the communication hole 1e. The ventilation valve 1f is configured by a porous film or the like that allows passage of outside air and passage of moisture contained in the outside air and prevents passage of dust. There is a portion of the second heat sink wall 1g that partitions the outside air introduction path 1d and the refrigerant flow path 1b, and the outside air that passes through the outside air introduction path 1d is cooled by the second heat sink wall 1g.

In addition, the device cooling housing 1 has a two-part structure so that the device can be stored in the storage chamber 1a, but the illustration is omitted.
(Function)
Next, the operation of the device cooling housing will be described.

  According to the present invention, air as outside air that flows between the outside of the housing 1 and the storage chamber 1a passes through the outside air introduction path 1d, and the air that has flowed in from the outside passes through the outside air introduction path 1d. It contacts the heat sink wall 1g. Accordingly, hot and humid air flowing in from the outside (for example, temperature 85 ° C. and humidity 85%) is cooled by the second heat sink wall 1g, and the water vapor contained in the outside air is condensed by the cooling, and the moisture generated by the condensation is outside air. It flows into the introduction path 1d. Therefore, only the air having dew condensation and the humidity is reduced flows into the storage chamber 1a, and even if the air flowing into the storage chamber 1a contacts the first heat sink wall 1c, it is difficult to condense and the occurrence of condensation is suppressed. The For this reason, it is possible to prevent corrosion of metal parts and electronic parts in the storage chamber without expanding the installation space. Moreover, since only the outside air introduction path is formed, the manufacturing cost is low. On the other hand, the device 2 itself is cooled by the first heat sink wall 1c.

According to the present invention, since the ventilation hole 1f having air permeability and moisture permeability is provided in the communication hole 1e, entry of dust and water droplets into the accommodation chamber 1a is prevented.
(B) Embodiment 2
Next, Embodiment 2 is shown in FIG. Since this embodiment is obtained by changing a part of the first embodiment, the same parts are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.

  In this embodiment, the outside air introduction path 1 d is inclined so as to become lower toward the outside of the housing 1.

  According to the present invention, moisture generated by condensation in the outside air introduction path 1d flows downward along the outside air introduction path 1d and is discharged to the outside of the housing 1. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
(C) Embodiment 3
Finally, Embodiment 3 is shown in FIG. Since this embodiment is also obtained by changing a part of the first embodiment, the same portions are denoted by the same reference numerals, description thereof is omitted, and only different portions are described.

  In this embodiment, the outside air introduction path 1d is formed into a substantially conical tapered lateral hole so that the bottom surface 1h is lowered toward the outside of the housing 1.

  According to the present invention, moisture generated by condensation in the outside air introduction path 1d flows downward along the bottom surface 1h of the tapered horizontal hole that is the outside air introduction path 1d, and is discharged to the outside of the housing 1. Therefore, moisture generated by condensation does not accumulate in the outside air introduction path.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In addition, although Embodiment 1-3 demonstrated the case where the ventilation valve was provided in the communicating hole, it can also be set as the structure which does not provide a ventilation valve.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram showing a device housed in a device cooling housing according to the present invention (Embodiment 1). The block diagram which accommodates and shows an apparatus in the apparatus cooling housing | casing which concerns on this invention (Embodiment 2). FIG. 6 is a configuration diagram showing a device housed in a device cooling housing according to the present invention (Embodiment 3).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Housing 1a ... Accommodating chamber 1b ... Refrigerant flow path 1c ... 1st heat sink wall 1d ... Outside air introduction path 1e ... Communication hole 1g ... 2nd heat sink wall 1h ... Bottom 2 ... Equipment

Claims (4)

A first heat sink wall that forms a coolant channel through which a cooling medium for cooling the device flows is formed in a housing having a storage chamber for storing the device, and partitions the coolant channel from the storage chamber. In an equipment cooling housing provided with a communication hole for communicating between the storage chamber and the outside of the housing,
An outside air introduction path is formed from the outside of the housing to the entrance of the housing chamber, the communication hole is formed between the outside air introduction path and the housing chamber, and the space between the outside air introduction path and the refrigerant channel is formed. A device cooling casing, characterized in that a second heat sink wall for partitioning is provided. In the apparatus cooling housing according to claim 1,
A device cooling housing, wherein a vent valve having air permeability and moisture permeability is provided in the communication hole. In the apparatus cooling housing according to claim 1 or 2,
A device cooling case, wherein the outside air introduction path is inclined so as to become lower toward the outside of the case. In the apparatus cooling housing according to claim 1 or 2,
A device cooling housing characterized in that the outside air introduction path is formed as a substantially conical tapered horizontal hole so that the bottom surface is lowered toward the outside of the housing.

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