JP2010040344A - Contact and connection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection device capable of improving contact reliability and prolonging a lifetime especially as compared to a conventional one. <P>SOLUTION: A metal layer 34 formed of Ni or a Ni alloy, and a coating part 33 formed of fluorine resin particles 35 dispersed in the metal layer 34 and exposing a part of the fluorine resin particles 35 from a surface are formed on a surface of a core part of a contact. An intermediate layer 36 formed of platinum group elements is formed on the surface of the metal layer 34 except for surfaces of the exposed fluorine resin particles 35. Furthermore, an outermost layer 37 formed of Au having a thickness smaller than that of the intermediate layer 36 is formed on a surface of the intermediate layer 36. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a contact that comes into contact with an electrode of an electronic component such as an IC package, and more particularly to a contact that can improve contact reliability and achieve a long life and a connection device using the contact.

  Patent Document 1 below discloses a connection device including a contact having a plurality of spiral elastic arms. A plurality of spherical electrodes are provided on the bottom surface of an electronic component such as an IC package, and each electrode is elastically pressed by an elastic arm, and the electrodes and the contacts are individually connected in a one-to-one relationship.

FIG. 4F of Patent Document 1 shows a cross-sectional shape of a contact having an outermost surface layer (conductive member 40 in Patent Document 1) formed of, for example, gold (Au).
JP 2005-032708 A

  However, in the above configuration, when the electrode of the electronic component is formed of solder, there is a problem that an intermetallic compound is generated between the electrode and the contact, and solder transfer occurs to the contact. For this reason, contact reliability was lacking, and shortening of the connection device became a problem.

  In particular, when the connecting device is used for inspection and is repeatedly used for attachment and detachment with respect to an electronic component, the above-described conventional problems become prominent. Furthermore, when the contact of the connecting device is formed of a material and shape that can be elastically deformed, the electrode is in sliding contact with the contact. In such sliding contact, the above-mentioned conventional problem becomes more prominent due to adhesion wear.

  In order to use Au as the outermost surface layer, which is chemically stable and capable of reducing the contact resistance, and to improve the contact reliability as compared with the conventional case, the surface side of the contact with the electrode It was necessary to improve the structure.

  Accordingly, the present invention is to solve the above-described conventional problems, and in particular, an object of the present invention is to provide a connection device that can improve contact reliability and extend the life compared to the conventional art. .

The present invention provides a contactor electrically connected to an electrode formed of solder of an electronic component,
A conductive core,
At least a surface of the core portion that contacts the electrode, a metal layer made of Ni or Ni alloy, and a coating portion formed with fluororesin particles dispersed in the metal layer;
An intermediate layer made of a platinum group element formed on the surface of the covering portion;
The intermediate layer has a laminated structure with an outermost surface layer made of Au formed in a thickness thinner than that of the intermediate layer.

In the present invention, a part of the fluororesin particles are exposed on the surface of the covering portion, except for the exposed surface of the fluororesin particles, the intermediate layer is formed on the surface of the metal layer,
It is preferable that the outermost surface layer and the fluororesin particles are exposed on the surface of the contact.

  As described above, in the present invention, the coating portion contains the fluororesin particles. Preferably, a part of the fluororesin particles is exposed on the surface of the contact. In the present invention, an intermediate layer made of a platinum group element and an outermost surface layer made of Au and thinner than the intermediate layer are laminated on the surface of the metal layer exposed on the surface of the covering portion. With such a configuration, it is possible to improve solder transfer, stability of contact resistance, improvement of freedom of use environment, improvement of environmental resistance characteristics, etc., and thus obtain contact reliability superior to conventional ones. This makes it possible to extend the service life.

  In the present invention, the intermediate layer is preferably formed of Pd. In the intermediate layer, ultrathin PdO (palladium oxide) is formed and stabilized, and the catalytic action is suppressed. Thereby, generation of atomic oxygen having a large oxidizing power is suppressed, and the degree of freedom of the use environment can be improved more effectively.

  Moreover, in this invention, it is preferable that the said core part is equipped with the conductive layer formed with Cu or Cu alloy.

Moreover, in this invention, it is preferable that the said coating | coated part has covered the circumference | surroundings of the said core part.
Further, the present invention is particularly effective when the elastically deformable portion is provided and the electrode is in sliding contact with the contact. In the present invention, adhesion wear can be effectively suppressed as compared with the prior art, contact reliability can be improved, and a longer life can be achieved.

Further, the present invention provides a connection device including a contactor that is electrically connected to an electrode formed of solder of an electronic component.
The contact is formed by any of the above-described inventions.

  Further, the present invention is particularly effective when the contactor is used for inspection in which the electronic component having the electrode is repeatedly attached and detached. Even if the attachment / detachment of the electronic component is repeated, the solder transfer due to the connection between the electrode and the contact can be effectively suppressed as compared with the conventional case.

  According to the contact and the connection device of the present invention, it is possible to obtain contact reliability superior to that of the prior art and to extend the life.

  1 is a partial cross-sectional view of the connection device according to the present embodiment, FIG. 2 is an enlarged cross-sectional view showing the vicinity of the contact of the connection device shown in FIG. 1, and FIG. 3 is a plan view of the contact according to the present embodiment. 4 is a cross-sectional view showing a cut surface obtained by cutting the elastic arm portion of the contactor along the line AA in FIG. 3 from the film thickness direction, and FIG. 5 shows the vicinity of the surface of the contactor shown in FIG. Enlarged partial enlarged sectional views, FIGS. 6 and 7 are comparative examples, and are partial enlarged sectional views in which the vicinity of the surface of the contact is enlarged.

  A connection device 1 shown in FIG. 1 has a base 10. The planar shape of the base 10 is, for example, a quadrangular shape, and side walls 10 a that rise substantially vertically are formed on each of the four sides of the base 10. A region surrounded by the four side wall portions 10 a is a concave portion, and the upper surface of the bottom portion 10 b is the support surface 12. A connection sheet 15 is installed on the support surface 12. The connection sheet 15 has, for example, a configuration in which a plurality of contacts 20 are provided on the surface of the flexible base sheet 16.

  As shown in FIG. 2, a large number of through holes 16 a are formed in the base sheet 16, and a conductive layer 17 is formed on the inner peripheral surface of each through hole 16 a by means such as plating. A front-side connection land 17 a that is electrically connected to the conductive layer 17 is formed on the surface of the base material sheet 16, and a back-side connection land 17 b that is electrically connected to the conductive layer 17 is formed on the back surface of the base material sheet 16.

  The contact 20 is formed, for example, by punching a thin conductive metal plate and further plated, and each contact 20 is joined to the surface of the connection land 17a with a conductive adhesive or the like. . Alternatively, the contact 20 is formed by a plating process using a conductive material such as copper or nickel. For example, a plurality of contacts 20 are formed in a plating process on the surface of a sheet separate from the substrate sheet 16, and the sheets are superimposed on the substrate sheet 16, and each contact 20 is made of a conductive adhesive or the like. To be joined to the connection land 17a.

  After each contactor 20 is installed on the base sheet 16, for example, an external force is applied to form the contact 20. At this time, the internal residual stress is removed by the heat treatment, and the contact 20 can exhibit an elastic force in a three-dimensional shape.

  As shown in FIG. 2, bump electrodes 18 made of a conductive material that are individually connected to the connection lands 17 b are formed on the back surface side of the base material sheet 16. As shown in FIG. 1, when the connection sheet 15 is installed on the support surface 12 that is the surface of the bottom portion 10 b of the base 10, the bump electrode 18 is connected to the conductive portion provided on the support surface 12.

  The arrangement pitch of the contacts 20 on the support surface 12 is, for example, 2 mm or less, or 1 mm or less. The maximum external dimension of the contact 20 is also 2 mm or less, or 1 mm or less.

  The configuration of the connection sheet 15 is an example. For example, in FIG. 2, the through hole 16 a is provided in the base material sheet 16, but the through hole 16 a may not be formed, and a wiring pattern that is electrically connected to the contact 20 may be formed on the surface of the base material sheet 16. .

  As shown in FIGS. 2 and 3, the contact 20 has a support portion 21 and an elastic arm 22 formed integrally and continuously. The elastic arm 22 is formed in a spiral shape, for example, and a base portion 22 a that is a winding start end of the elastic arm 22 is integrated with the support portion 21. The distal end portion 22b, which is the winding end of the elastic arm 22, is located substantially at the center of the spiral. In the form shown in FIG. 2, the support portion 21 constituting the contact 20 is connected to the connection land 17 a, and the elastic arm 22 is three-dimensionally molded so that the tip end portion 22 b is separated from the support surface 12.

  In addition, the contact 20 may be a planar shape without being three-dimensionally formed. The elastic arm 22 is not limited to a spiral shape. The elastic arm 22 may have a belt shape (straight shape), a curved shape, or the like. Further, only one side of the elastic arm 22 is supported by the support portion 21, but a configuration in which both sides are supported by the support portion may be employed.

  As shown in the sectional view of FIG. 4, the elastic arm 22 includes a core portion 30, a covering portion 33 that covers the entire circumference of the surface of the core portion 30, and an intermediate layer that is partially formed on the surface of the covering portion 33. 36 and an outermost surface layer 37. The core portion 30 is formed by covering the entire periphery of the conductive layer 31 with an elastic layer 32. The conductive layer 31 is a single layer of copper (Cu) or an alloy containing copper. As the copper alloy, a Corson alloy having Cu, Si, Ni having high electric conductivity and high mechanical strength is preferably used. The Corson alloy is, for example, Cu—Ni—Si—Mg, Cu 96.2 mass%, Ni 3.0 mass%, Si 0.65 mass%, and Mg 0.15 mass%. The

  The elastic layer 32 is a metal material that is electrically conductive and exhibits high mechanical strength and high flexural modulus, and is a nickel (Ni) layer or an alloy layer containing Ni. As the Ni alloy, a Ni—X alloy (where X is one or more of P, W, Mn, Ti, Be, Co, and B) is used. The elastic layer 32 is formed by performing electrolytic plating or electroless plating around the conductive layer 31. The elastic layer 32 is preferably a Ni-P alloy formed by electroless plating. In the Ni-P alloy, by setting the concentration of phosphorus (P) to 10 at% or more and 30 at% or less (more preferably 17 to 25 at%), at least a part becomes amorphous (preferably the whole is amorphous). ), High elastic modulus and high tensile strength can be obtained. Alternatively, the elastic layer 32 is formed of a Ni—W alloy. Also in this case, by setting the tungsten (W) concentration to 10 at% or more and 30 at% or less, at least a part becomes amorphous (preferably the whole is amorphous), and a high elastic modulus and a high tensile strength can be obtained. Can do.

  In FIG. 4, the cross-sectional area of the elastic layer 32 is preferably 20% or more and 80% or less of the cross-sectional area of the core part 30. Within this range, the core 30 can exhibit both functions of conductivity and springiness. In the cross-sectional view of FIG. 4, it is preferable that the thickness dimension and the width dimension of the core part 30 are both 10 μm or more and 100 μm or less.

  As shown in FIG. 5, the covering portion 33 includes a metal layer 34 and a large number of fluororesin particles 35 dispersed in the metal layer 34.

  The metal layer 34 is formed of Ni or Ni alloy. The Ni alloy is preferably a Ni-X alloy (where X is any one or more of P, W, Mn, Ti, Be, Co, and B). When the metal layer 34 is formed of a Ni alloy, it is preferable that the metal layer 34 is formed of a Ni—P alloy or a Ni—W alloy as with the elastic layer 32. The concentrations of P and W in the Ni-P alloy and Ni-W alloy in the metal layer 34 are adjusted within a range of 10 at% to 30 at% (preferably 17 to 25 at%). The metal layer 34 is preferably amorphous in order to function in the same manner as the elastic layer 32.

  The fluororesin particles 35 are made of, for example, polytetrafluoroethylene (PTFE).

  As shown in FIG. 5, the fluororesin particles 35 are exposed on the surface 33 a of the covering portion 33. A portion of the fluororesin particles 35 are exposed on the surface 33a of the covering portion 33, and there may be fluororesin particles 35 that are completely buried inside the covering portion 33 as shown in FIG.

  In the form of FIG. 5, the average film thickness of the covering portion 33 is equal to or greater than the average particle diameter of the fluororesin particles 35. The average film thickness of the covering portion 33 is obtained by averaging the film thickness in the entire area of the covering portion 33 (regardless of whether the metal layer 34 or the fluororesin particles 35 are present). Calculates the average film thickness of the covering portion 33 by averaging the film thicknesses at a plurality of arbitrarily determined measurement points. The average film thickness of the covering portion 33 may be smaller than the average particle diameter of the fluororesin particles 35. However, the protrusion amount from the surface 33a of the fluororesin particles 35 becomes too large due to this, the contact reliability is lowered, and the amount of the absolute metal layer 34 is reduced, so that the space between the covering portion 33 and the core portion 30 is reduced. The bonding strength of the steel tends to decrease. Therefore, it is preferable to adjust the average film thickness of the covering portion 33 to be equal to or larger than the average particle diameter of the fluororesin particles 35. However, if the fluororesin particles 35 are buried inside the covering portion 33, the effect of providing the fluororesin particles 35 is not properly exhibited. Therefore, after the covering portion 33 is formed by plating, the surface of the covering portion 33 is removed. Etching is performed to expose the surface of the fluororesin particles 35 on the surface of the covering portion 33, and preferably a part (for example, about half) of the fluororesin particles 35 on the outermost portion is projected.

  The average particle size of the fluororesin particles 35 is preferably about 0.1 to 5 μm. The fluororesin particles 35 are not particularly limited, such as a spherical shape, a semi-elliptical sphere shape, and a scale shape. Set to “Diameter”. The average particle diameter of the fluororesin particles 35 is specified, for example, by measuring the particle diameters of the plurality of fluororesin particles 35 with a scanning electron microscope (SEM) and calculating the average.

The average film thickness of the covering portion 33 is preferably about 0.5 to 6 μm.
Further, the fluororesin particles 35 are preferably contained in the covering portion 33 in an amount of 10 to 50 vol%. Thereby, the effect which provided the coating | coated part 33 can be enlarged, and also the electrical conductivity between the coating | coated part 33 and the protrusion electrode 42 of an electronic component can be ensured appropriately.

  As shown in FIG. 5, in this embodiment, an intermediate layer 36 made of a platinum group element is formed on the surface of the metal layer 34 exposed on the surface 33 a of the covering portion 33. That is, the intermediate layer 36 is not formed on the exposed surface of the fluororesin particles 35. Further, an outermost surface layer 37 made of Au is formed on the surface of the intermediate layer 36.

  As shown in FIG. 5, the film thickness of the outermost surface layer 37 is thinner than the film thickness of the intermediate layer 36. The film thickness of the outermost surface layer 37 is preferably in the range of 0.01 to 0.6 μm (preferably 0.06 μm or less). Moreover, it is suitable for the film thickness of the intermediate | middle layer 36 to exist in the range of 0.1-1 micrometer.

  As shown in FIG. 1, an electronic component 40 is installed in the connection device 1. The electronic component 40 is an IC package or the like, and various electronic elements such as an IC bare chip are sealed in the main body 41. A plurality of protruding electrodes 42 are provided on the bottom surface 41 a of the main body 41, and each protruding electrode 42 is electrically connected to a circuit in the main body 41. In the electronic component 40 of this embodiment, the protruding electrode 42 has a spherical shape. The protruding electrode 42 may have a truncated cone shape or the like.

  The protruding electrode 42 is formed of a conductive alloy containing tin. That is, it is formed of solder containing no lead, such as a tin / bismuth alloy or a tin / silver alloy.

  The connection device 1 according to the present embodiment is, for example, for inspecting an electronic component 40, and the electronic component 40 that is an object to be inspected is mounted in the recess of the base 10 as shown in FIG. 1. At this time, the electronic component 40 is positioned such that each protruding electrode 42 provided on the bottom surface 41 a of the main body 41 is placed on the contact 20. A pressing lid (not shown) is provided on the base 10. When the lid is placed on the base 10, the electronic component 40 is pressed in the direction of arrow F by the lid. With this pressing force, each protruding electrode 42 is pressed against the elastic arm 22, the three-dimensional elastic arm 22 is crushed, and the protruding electrode 42 and the elastic arm 22 are individually connected.

  When the connection device 1 is used for so-called burn-in inspection, a current is applied to the protruding electrode 42 from the external inspection circuit through the contact 20 in a state where the ambient temperature is set to about 150 ° C. Then, it is inspected whether the circuit in the main body 41 of the electronic component 40 is disconnected. Alternatively, a predetermined signal is given from the contact 20 to the protruding electrode 42, and an operation test of the circuit in the main body 41 is performed.

  The electronic component 40 that has been inspected is taken out from the connection device 1, the electronic component 40 to be inspected next is installed in the connection device 1, and the inspection is performed in the same manner. This inspection is repeated. Therefore, the protruding electrodes 42 of the new electronic components 40 come in contact with the elastic arms 22 of the contact 20 one after another.

  In the present embodiment, as described with reference to FIG. 4, the elastic arm 22 has the covering portion 33 formed on the surface of the core portion 30 formed of a conductive metal. And fluororesin particles 35 dispersed in the metal layer 34 and partially exposed on the surface.

  By forming the above-described covering portion 33 on the surface of the conductive core portion 30, the repulsion function and separation / peeling function (non-adhesiveness to metal) of the fluororesin particles 35 act appropriately.

  In the present embodiment, the outermost surface layer 37 made of Au is opposed to the metal layer 34 exposed on the surface 33a of the covering portion 33 in order to reduce the contact stability with the protruding electrode 42 and the contact resistance. At this time, the outermost surface layer 37 is not directly formed on the metal layer 34, and the intermediate layer 36 formed of a platinum group element is interposed between the outermost surface layer 37 and the metal layer 34. ing.

  FIG. 6 is a comparative example 1 in which an outermost surface layer 37 made of Au is directly formed on the surface of the exposed metal layer 34. In the structure of Comparative Example 1, the constituent elements of the core (particularly, the conductive layer 31 formed of Cu or Cu alloy) are diffused and corroded near the surface of the metal layer 34 due to the manufacturing process and heating during use. In order to suppress this, the outermost surface layer 37 must be formed very thick. For example, the outermost surface layer 37 made of Au is formed with a film thickness of about 0.2 to 1 μm. As described above, in Comparative Example 1, since the film thickness of the outermost surface layer 37 formed of Au cannot be reduced, the amount of solder transfer cannot be sufficiently reduced.

  On the other hand, FIG. 7 shows a comparative example 2 in which only the intermediate layer 36 made of a platinum group element is formed on the surface of the exposed metal layer 34. In the configuration of Comparative Example 2, the intermediate layer 36 is the outermost surface layer. However, in the configuration of Comparative Example 2, due to the catalytic action of the exposed intermediate layer 36, the organic environment is contaminated depending on the usage environment, and the usage environment is limited, such as the inability to use the lubricating oil together.

  Therefore, in this embodiment, the intermediate layer 36 and the outermost surface layer 37 are laminated on the surface of the metal layer 34 excluding the exposed surface of the fluororesin particles 35. That is, in the present embodiment, the intermediate layer 36 made of a platinum group element is formed on the surface of the metal layer 34 exposed on the surface 33 a of the covering portion 33. The intermediate layer 36 formed of a platinum group element effectively suppresses diffusion corrosion near the surface of the metal layer 34 of an element constituting the core (particularly, the conductive layer 31 formed of Cu or Cu alloy). .

  The intermediate layer 36 is preferably Pd. The standard electrode potential of Pd and Au is larger for Au than for Pd. Therefore, the intermediate layer 36 and the outermost surface layer 37 made of Au are formed so as to overlap each other, so that the intermediate layer 36 has a metal oxide (PdO) on the surface (interface with the outermost surface layer 37, etc.). To form and stabilize. The metal oxide is an ultrathin film and has a thickness of about 1 to 500 mm. Therefore, the catalytic action of the intermediate layer 36 is suppressed, and generation of atomic oxygen having a large oxidizing power can be effectively suppressed.

  Further, in the present embodiment, the outermost surface layer 37 made of Au is formed on the surface of the intermediate layer 36. As described above, diffusion corrosion near the surface of the metal layer 34 of the elements constituting the core (particularly, the conductive layer 31 formed of Cu or Cu alloy) is caused by the intermediate layer 36 formed of platinum group elements. Since it is effectively suppressed by the formation, it is not necessary to form the outermost surface layer 37 thickly as in the comparative example 1 of FIG. In the present embodiment, the film thickness of the outermost surface layer 37 can be made thinner than the film thickness of the intermediate layer 36. By providing the outermost surface layer 37 formed of Au as described above, the contact resistance can be reduced and the contact stability can be improved, and the thickness of the outermost surface layer 37 can be reduced. Can be drastically reduced as compared with Comparative Example 1.

  As described above, in the present embodiment, a part of the fluororesin particles 35 is exposed on the surface of the contact 20, and in other regions (surface of the metal layer 34 made of Ni or Ni alloy), the platinum group element is used. The intermediate layer 36 and the outermost surface layer 37 made of Au having a thinner film thickness than the intermediate layer 36 are laminated. The outermost surface layer 37 is exposed on the surface of the contact 20 together with the fluororesin particles 35. With such a configuration, it is possible to improve solder transfer, stability of contact resistance, improvement of freedom of use environment, improvement of environmental resistance characteristics, and the like. Therefore, contact reliability superior to the conventional one can be obtained, and the life can be extended.

  The covering portion 33, the intermediate layer 36, and the outermost surface layer 37 can all be formed by electroless plating or electrolytic plating.

  Further, as described above, the intermediate layer 36 is not formed on the surface of the fluororesin particles 35 in the covering portion 33 but only on the surface of the metal layer 34. The planar shape of the outermost surface layer 37 is formed in a mesh shape, for example. In the present embodiment, not only the outermost surface layer 37 and the fluororesin particles 35 but also a part of the intermediate layer 36 may be exposed on the surface of the contact 20. It is preferable that the outermost surface layer 37 completely covers the intermediate layer 36. For example, the outermost surface layer 37 is formed with a very thin film thickness, and pinholes are formed in the outermost surface layer 37. As in the case, a configuration in which the outermost surface layer 37 does not cover the entire surface of the intermediate layer 36 is also included in the present embodiment.

  In addition, the embodiment includes a form in which the fluororesin particles 35 are not exposed on the surface of the covering portion 33. At this time, the intermediate layer 36 and the outermost surface layer 37 are formed on the entire surface of the covering portion 33. In the case where the intermediate layer 36 and the outermost surface layer 37 are thin, the intermediate layer 36 and the outermost surface layer 37 may be formed on the surface of the covering portion 33 in an island shape or a lattice shape.

  In this embodiment, since the bonding strength between the fluororesin particles 35 near the surface of the covering portion 33 and the metal layer 34 or the intermediate layer 36 is weak (because of low adhesion), the fluororesin particles 35 are slightly slid. The metal layer covering the top is transferred to the protruding electrode 42 side, and the fluororesin particles 35 are exposed. And it becomes almost the same as the form as shown in FIG.

  As described above, the connection device 1 in this embodiment is used for inspection, for example. At this time, even when the electronic component 40 is repeatedly attached and detached, the connection between the protruding electrode 42 and the contact 20 is effectively performed. This makes it possible to suppress the solder transfer due to.

  In the present embodiment, the contact 20 is provided with an elastic arm 22 that can be elastically deformed. The elastic arm 22 contacts the protruding electrode 42 of the electronic component 40. As shown in FIG. 1, by pressing the electronic component 40 in the direction of arrow F, the elastic arm 22 is crushed and the protruding electrode 42 and the elastic arm 22 are made conductive. At this time, the protruding electrode 42 is in sliding contact with the elastic arm 22. In the present embodiment, even in such sliding contact, adhesion and wear can be prevented by the lubrication and repulsion effect by the fluororesin particles 35, thereby improving the contact reliability and extending the life.

  In addition, the contact 20 in this embodiment may be used for uses other than the connection apparatus 1 shown in FIG.

The fragmentary sectional view of the connecting device which is this embodiment, The expanded sectional view which shows the contactor vicinity of the connection apparatus shown in FIG. The top view of the contact of this embodiment, Sectional drawing which shows the cut surface which cut | disconnected the part of the elastic arm of the contactor from the film thickness direction along the AA line of FIG. The partial expanded sectional view which expanded the surface vicinity of the contact shown in FIG. The partial expanded sectional view which expanded the surface vicinity of the contact of comparative example 1, Partial enlarged sectional view in which the vicinity of the surface of the contact of Comparative Example 2 is enlarged,

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Connection apparatus 10 Base 12 Support surface 15 Connection sheet 16 Base material sheet 20 Contact 21 Support part 22 Elastic arm 30 Core part 31 Conductive layer 32 Elastic layer 33 Cover part 34 Metal layer 35 Fluoro resin particle 36 Intermediate layer 37 Outermost surface Layer 40 Electronic component 42 Projecting electrode

Claims (8)

In the contactor electrically connected to the electrode formed of solder of the electronic component,
A conductive core,
At least a surface of the core portion that contacts the electrode, a metal layer made of Ni or Ni alloy, and a coating portion formed with fluororesin particles dispersed in the metal layer;
An intermediate layer made of a platinum group element formed on the surface of the covering portion;
A contactor comprising a laminated structure with an outermost surface layer made of Au formed on the surface of the intermediate layer so as to be thinner than the intermediate layer. A part of the fluororesin particles are exposed on the surface of the covering portion, except for the exposed surface of the fluororesin particles, the intermediate layer is formed on the surface of the metal layer,
The contactor according to claim 1, wherein the outermost surface layer and the fluororesin particles are exposed on a surface of the contactor.   The contact according to claim 1, wherein the intermediate layer is made of Pd.   The contact according to claim 1, wherein the core includes a conductive layer formed of Cu or a Cu alloy.   The contact according to claim 1, wherein the covering portion covers the periphery of the core portion.   The contact according to claim 1, further comprising an elastically deformable portion, wherein the electrode is in sliding contact with the contact. In a connection device including a contactor electrically connected to an electrode formed of solder of an electronic component,
7. The connecting device according to claim 1, wherein the contact is formed by the invention described in any one of claims 1 to 6.   The connection device according to claim 7, wherein the connection device is used for inspection in which mounting and dismounting of the electronic component having the electrode is repeatedly performed on the contact.

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