JP2010037635A - Electroplating method, and apparatus therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To uniformize the thickness of an electroplated film always stably and easily so as not to be affected by the variation of the working accuracy of an article to be treated, without making the facility complicated and increasing the cost. <P>SOLUTION: In an electroplating process of plating the surface of the article to be treated 14 by passing an electric current between an electrode 13 and the article to be treated 14 which have been immersed in a plating solution 12 in a plating tank 11, this electroplating method includes: surrounding the periphery of the article to be treated 14 with a non-electroconductive surrounding member 16 at a predetermined space, while opening the surface to be plated 14a of the article to be treated 14 which is directed toward the electrode 13 in the plating tank 11; projecting the top end of the electrode 13 side of the surrounding member 16 to the electrode 13 side more than the surface to be plated 14a of the article to be treated 14; and in this state, passing the electric current between the electrode 13 and the article to be treated 14. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electroplating method and apparatus and belongs to the technical field of surface treatment of metal materials.

  Conventionally, in a plating tank, an electrode and an object to be processed are immersed in a plating solution containing plating metal ions, and electricity is passed between these electrodes and the object to be processed, thereby plating metal on the surface of the object to be processed. Electroplating for depositing these films is well known.

  In particular, in recent years, parts around automobile engines, such as piston rings for reciprocating engines and side housings for rotary engines, have been manufactured with light alloy members such as aluminum for weight reduction. In order to improve the property or corrosion resistance, nickel plating or chromium plating is often applied by electroplating.

  Here, in general, in electroplating, as shown in FIG. 8, the electrode has a larger area than the plated surface of the object to be processed so that the current reaches the entire plated surface of the object to be processed. Then, the current generated from the portion of the electrode outside the plating surface of the object to be processed concentrates on the peripheral portion of the plating surface in an attempt to reach a place as short as possible, and as a result, the plating metal is uniformly distributed on the plating surface. There is a problem of non-uniform plating film thickness, in which the plating film becomes thicker at the peripheral part of the plated surface without electrodeposition, and the plated film becomes thinner at the central part of the plated surface.

  Therefore, as shown in FIG. 9, the object to be processed is fitted into a conductive holder and accommodated, and electroplating is performed by facing the electrode in a state where the plating surface of the object to be processed and the front surface of the holder are flush with each other. Proposed to do. In this case, the plating metal is electrodeposited not only on the plating surface of the workpiece but also on the front surface of the outer holder. In this case, the plating surface of the workpiece or the portion of the electrode outside the holder front surface. Since the current generated from the center is concentrated on the peripheral portion of the front surface of the holder, when the workpiece is taken out from the holder after plating, a plating film having a uniform thickness is formed on the plated surface of the workpiece. .

  Further, Patent Document 1 states that the unevenness of the plating film thickness is caused by unevenness in the flow rate of the circulation of the plating solution and unevenness in the density of the current from the electrode, and the plating surface of the workpiece immersed in the plating solution Describes a technique for suppressing unevenness in circulation flow rate and current density of the plating solution by performing electroplating while rotating through a shaft connected to a rotation driving means and a support member for supporting an object to be processed. Yes.

JP2004-300462 (paragraphs 0007, 0008, 0022)

  However, in the method in which the object to be processed is accommodated in the conductive holder and electroplating is performed, it is difficult to always make the plating surface of the object to be processed and the front surface of the holder flush with each other due to variations in processing accuracy of the object to be processed. There is a problem that. As a result, when the plated surface of the object to be processed protrudes from the front surface of the holder toward the electrode, as shown in FIG. 10A, the current generated from the electrode has a short peripheral distance on the plated surface of the object to be processed. Concentrating on the part, the plating film becomes thick at the part. On the contrary, when the plated surface of the workpiece is retracted from the electrode front side from the holder front surface, as shown in FIG. 10B, the current generated from the electrode is concentrated on the inner peripheral edge of the holder front surface with a short reach distance. As a result, the current is deficient at the peripheral portion of the plated surface of the object to be processed, and the plating film becomes thin. Furthermore, there is a problem that the labor for removing the plating film deposited on the front surface of the holder is increased and the productivity is lowered.

  In addition, in the method of performing electroplating by rotating the plating surface of the object to be processed, there is a problem that the equipment becomes complicated or the cost increases.

  Therefore, the present inventors are not affected by variations in the processing accuracy of the workpiece, do not increase the complexity of the equipment or increase the cost, and always stably and easily uniform the thickness of the electroplating plating film. As a result of intensive research and study, the results were sufficiently satisfactory when electroplating was performed with the non-conductive surrounding member surrounding the workpiece under predetermined conditions. The present invention has been completed with the knowledge that can be obtained.

  In order to solve the above problems, the present invention uses the following means. In the following disclosure of the present invention, reference numerals corresponding to embodiments of the invention described later are added for reference.

  The invention according to claim 1 of the present application is an electroplating method for plating the surface of the object to be processed 14 by energizing between the electrode 13 immersed in the plating solution 12 in the plating tank 11 and the object 14 to be processed. In the plating tank 11, a non-conductive surrounding member 16 is opened around the object 14 with a predetermined gap α while opening the plating surface 14 a of the object 14 directed to the electrode 13. And energizing between the electrode 13 and the workpiece 14 in a state where the tip of the surrounding member 16 on the electrode 13 side protrudes from the plating surface 14a of the workpiece 14 to the electrode 13 side. And

  Here, the clearance α between the surrounding member 16 and the workpiece 14 is preferably 5 mm to 10 mm, and the protruding length (β-H) of the distal end portion on the electrode 13 side of the surrounding member 16 is the workpiece 14. The axial length H is preferably 20% to 150%.

  Invention of Claim 2 of this application is the electroplating method of Claim 1, Comprising: The electrode 13 is arrange | positioned facing the whole region of the plating surface 14a of the to-be-processed object 14, It is characterized by the above-mentioned. .

  Invention of Claim 3 of this application is the electroplating method of Claim 1 or 2, Comprising: In the said plating tank 11, the space enclosed by the said surrounding member 16, and the space outside it, The electroplating is performed while circulating the plating solution 12 between the two.

  The invention according to claim 4 of the present application is the electroplating method according to claim 3, wherein electroplating is performed while circulating the plating solution 12 in the plating tank 11, and the circulation of the plating solution 12 is performed. This path is a part of the circulation path of the plating solution 12.

  On the other hand, the invention according to claim 5 of the present application is for plating the surface of the workpiece 14 by energizing the electrode 13 and the workpiece 14 immersed in the plating solution 12 in the plating tank 11. In the electroplating apparatus 1, the plating surface 11 a of the workpiece 14 facing the electrode 13 is opened in the plating tank 11, and the periphery of the workpiece 14 is surrounded with a predetermined gap α, A non-conductive surrounding member 16 whose tip end on the electrode 13 side protrudes toward the electrode 13 from the plating surface 14a of the workpiece 14 is provided.

  Also here, the clearance α between the surrounding member 16 and the workpiece 14 is preferably 5 mm to 10 mm, and the protruding length (β-H) of the distal end portion on the electrode 13 side of the surrounding member 16 is the workpiece 14. The axial length H is preferably 20% to 150%.

  Invention of Claim 6 of this application is the electroplating apparatus 1 of Claim 5, Comprising: The electrode 13 is arrange | positioned facing the whole region of the plating surface 14a of the to-be-processed object 14. Features.

  The invention according to claim 7 of the present application is the electroplating apparatus 1 according to claim 5 or 6, wherein an end portion of the surrounding member 16 on the side opposite to the electrode is a support member that supports the workpiece 14. 15, and the openings 17 and 15 a are provided in the surrounding member 16 and / or the support member 15.

  The invention according to claim 8 of the present application is the electroplating apparatus 1 according to claim 7, wherein a circulation device 21-23 for circulating the plating solution 12 in the plating tank 11 is provided, and this circulation is performed. From the space outside the space surrounded by the surrounding member 16, the ejection port 23 for the plating solution 12 in the apparatus 21-23 is directed toward the openings 17 and 15 a provided in the surrounding member 16 and / or the support member 15. It is characterized by being.

  According to the invention described in claims 1 and 5 of the present application, in electroplating, a non-conductive surrounding member surrounding the object to be processed is plated while opening the plating surface of the object to be processed directed to the electrode. It is provided in the tank and electroplating is performed in this state. Here, since the surrounding member is non-conductive, no plating film is deposited on the surrounding member. Therefore, the trouble that the plating film deposited on the surrounding member is removed increases and the productivity is not lowered.

  Further, since the tip of the surrounding member on the electrode side protrudes from the plated surface of the workpiece to the electrode side, the plated surface of the workpiece does not protrude from the tip of the surrounding member on the electrode side to the electrode side. . Therefore, the current concentrates on the peripheral portion of the plated surface of the object to be processed, and the problem that the plating film becomes thick at the portion is prevented. Moreover, at this time, as described above, the problem that the plating film is deposited on the tip of the surrounding member on the electrode side and has to be removed is also eliminated. Further, it is not necessary to make the plated surface of the workpiece to be flush with the tip of the surrounding member on the electrode side.

  In addition, since a predetermined gap is provided between the surrounding member and the object to be processed, the surrounding member and the object to be processed are brought into contact with or in close proximity to surround the object to be processed with the surrounding member. The problem that occurs in this case, that is, the problem that the surrounding member is non-conductive, the current is deficient at the peripheral portion of the plated surface of the object to be processed, becomes depopulated, and the plated film becomes thin.

  Thus, in the present invention, basically, the periphery of the object to be processed is surrounded by a non-conductive surrounding member, and then electroplating can be performed as usual in this state. Thus, the thickness of the electroplating film can be made uniform stably and easily without being affected by variations in accuracy and without increasing the complexity of the equipment or increasing the cost.

  According to the second and sixth aspects of the present invention, the entire plated surface of the object to be processed is covered with the electrode, and the plated surface of the object to be processed and the electrode are parallel to each other. The electric current uniformly reaches the entire plated surface of the object to be processed without density unevenness, whereby the thickness of the plating film is further uniformized.

  According to the invention described in claims 3 and 7 of the present application, in the plating tank, electroplating is performed in a state where the plating solution is circulated between the space surrounded by the surrounding member and the outer space. Therefore, a problem caused by surrounding the object to be processed with the surrounding member, that is, a plating film deposited by changing the composition of the plating solution around the plating surface of the object to be processed as plating progresses. The problem of changing the nature of the is solved. As a result, a plating solution having a uniform composition is always stably supplied around the plated surface of the object to be processed, so that a uniform plating film can always be stably obtained.

  According to the invention described in claims 4 and 8 of the present application, since the electroplating is performed in a state where the plating solution is circulated in the plating tank, the plating solution is equalized as the entire plating tank. As a result, it is ensured that a plating solution having a uniform composition is always stably supplied around the plated surface of the workpiece. Hereinafter, the present invention will be described in more detail through the best mode and examples of the present invention.

  FIG. 1 is a schematic overall view of an electroplating apparatus 1 according to the preferred embodiment of the present invention. The basic structure is the same as that of a conventional electroplating apparatus, and a plating solution 12 containing plating metal ions is stored in a plating tank 11. A lead (Pb) electrode 13 and a workpiece 14 are immersed in the plating solution 12. The workpiece 14 is supported by a conductive support member 15. At the time of plating, the Pb electrode 13 is set as an anode (+) and the workpiece 14 is set as a cathode (−), and electricity is passed between these electrodes 13 and the workpiece 14. In this case, the electrode 13 and the plated surface 14a of the workpiece 14 are arranged to face each other, and the electrode 13 is plated so that the current generated from the electrode 13 reaches the entire area of the plated surface 14a. It has an area wider than 14a.

  Further, in the plating tank 11, a circulation device for circulating the plating solution 12 as indicated by an arrow, that is, a pump 21, a guide tube 22, and a jet port 23 are provided.

  In this embodiment, the surrounding member 16 which is a feature of the present invention is provided in the plating tank 11.

  As shown in FIG. 2, the surrounding member 16 has a cylindrical shape corresponding to the workpiece 14 having a columnar shape. For example, the surrounding member 16 is a synthetic resin (such as a vinyl chloride resin or a heat-resistant chlorinated vinyl chloride resin). It is made of non-conductive material such as rubber.

  The surrounding member 16 surrounds the workpiece 14 with a predetermined gap (distance between the inner circumferential surface of the surrounding member 16 and the outer circumferential surface of the workpiece 14) α. Here, the gap α is preferably 5 mm to 10 mm. However, the surrounding member 16 opens the plating surface 14 a of the workpiece 14 that faces the electrode 13.

  The tip of the surrounding member 16 on the electrode 13 side protrudes from the plating surface 14 a of the workpiece 14 toward the electrode 13. On the other hand, the end of the surrounding member 16 on the counter electrode 13 side is connected to a support member 15 that supports the workpiece 14 and is closed by the support member 15. Here, the protruding length (β-H) of the distal end portion on the electrode 13 side of the surrounding member 16 is preferably 20% to 150% of the axial length H of the workpiece 14. Here, β is the axial length of the surrounding member 16.

  As shown in FIG. 1, the electrode 13 and the plating surface 14a of the workpiece 14 are arranged vertically, and the surrounding member 16 is arranged horizontally in the axial direction corresponding to this. The surrounding member 16 is provided with a plurality of openings 17... 17 for allowing the plating solution 12 to flow between the space surrounded by the surrounding member 16 and the outer space. The spout 23 of the circulation device is located immediately below the surrounding member 16 or the workpiece 14, and the spout 23 extends from the space outside the space surrounded by the surrounding member 16 to the surrounding member. 16 is directed to the openings 17. As a result, the flow path of the plating solution 12 through the openings 17... 17 provided in the surrounding member 16 is the circulation of the plating solution 12 through the circulation device (pump 21, guide pipe 22, jet port 23). Part of the path.

  The openings 17... 17 also function as holes for gas generated on the plated surface 14a of the workpiece 14 simultaneously with electrodeposition of the plated metal.

  If electroplating is performed by the electroplating apparatus 1 according to the present embodiment having the above-described configuration, the current generated from the electrode 13 is applied to the entire plating surface 14a of the workpiece 14 as shown in FIG. Thus, the thickness of the plating film P becomes uniform.

  At this time, the depth from the plating surface 14a of the workpiece 14 to the support member 15, in other words, the axial length H (see FIG. 2B) of the workpiece 14 is preferably 5 mm to 20 mm. When the axial length H of the workpiece 14 exceeds 20 mm, the gap α is made of a non-conductive material similar to the surrounding member 16 at a position 5 mm to 20 mm from the plating surface 14 a of the workpiece 14. What is necessary is just to form a bottom.

Here, as the electroplating conditions, for example, in the case of nickel (Ni) plating, the bath composition (composition of the plating solution 12) is NiSO ₄ : 250 g / L and (NH ₄ ) ₂ · SO ₄ : 80 g / L. When the bath temperature is 60 ° C., the current density is 60 A / dm ² , and cobalt (Co) plating is used, the bath composition (the composition of the plating solution 12) is CoSO ₄ .7H ₂ O: 200 g / L and (NH ₄ ) _2. SO ₄ : 150 g / L, bath temperature is 40 ° C., current density is 40 A / dm ^2, etc.

  On the other hand, when the gap α between the surrounding member 16 and the workpiece 14 is excessively narrow, as shown in FIG. There is a problem in that the current is deficient at the peripheral portion of the plated surface 14a of the processed material 14 and becomes depopulated, and the plating film P becomes thin.

  On the other hand, when the gap α between the surrounding member 16 and the workpiece 14 is excessively wide, as shown in FIG. 4B, the current concentrates on the peripheral portion of the plated surface 14a of the workpiece 14, There arises a problem that the plating film P becomes thick at the portion.

  As described above, according to the present embodiment, in electroplating, the non-conductive surrounding member 16 surrounding the periphery of the object to be processed 14 is opened while the plating surface 14a of the object to be processed 14 facing the electrode 13 is opened. It is provided in the plating tank 11 and electroplating is performed in this state. Here, since the surrounding member 16 is non-conductive, no plating film is deposited on the surrounding member 16. Therefore, the trouble that the plating film deposited on the surrounding member 16 is removed increases and the productivity is not lowered.

  In addition, since the tip of the surrounding member 16 on the electrode 13 side protrudes from the plated surface 14a of the workpiece 14 to the electrode 13 side, the plated surface 14a of the workpiece 14 has a tip of the surrounding member 16 on the electrode 13 side. It does not protrude further toward the electrode 13 side. Therefore, the current concentrates on the peripheral portion of the plating surface 14a of the workpiece 14 and the problem that the plating film becomes thick at this portion is prevented. Moreover, at this time, as described above, the problem that the plating film is deposited on the tip of the surrounding member 16 on the electrode 13 side and must be removed is also eliminated. Moreover, it is not necessary to make the plating surface 14a of the workpiece 14 and the tip of the surrounding member 16 on the electrode 13 side flush with each other.

  In addition, since a predetermined gap α is provided between the surrounding member 16 and the object to be processed 14, the surrounding member 16 and the object to be processed 14 are brought into contact with or close to each other, so Due to the problem that occurs when the surrounding member 16 is surrounded by the surrounding member 16, that is, the surrounding member 16 is non-conductive, the current is deficient in the peripheral portion of the plating surface 14a of the object 14 to be sparsely plated. The problem of thin film is prevented.

  Thus, according to the present embodiment, basically, the periphery of the workpiece 14 is surrounded by the non-conductive surrounding member 16, and then the electroplating may be performed as usual in this state. The thickness of the electroplating coating P can be made uniform stably and easily without being affected by variations in the processing accuracy of the workpiece 14 and without complicating equipment or increasing costs. be able to.

  Further, since the entire plating surface 14a of the workpiece 14 is covered with the electrode 13, and the plating surface 14a of the workpiece 14 and the electrode 13 are parallel, the current generated from the electrode 13 is subjected to the current 14 to be processed. The entire surface of the plating surface 14a is uniformly distributed without density unevenness, whereby the thickness of the plating film P is made more uniform.

  In the plating tank 11, the plating solution 12 circulates between the space surrounded by the surrounding member 16 and the outer space through the openings 17... 17 provided in the surrounding member 16. Since electroplating is performed, a problem caused by surrounding the workpiece 14 with the surrounding member 16, that is, the plating solution 12 around the plating surface 14a of the workpiece 14 as plating progresses. The problem that the properties of the deposited plating film P fluctuate due to the change in the composition is solved. As a result, the plating solution 12 having a uniform composition is always stably supplied to the periphery of the plating surface 14a of the workpiece 14, and a uniform plating film P is always stably obtained.

  In addition, since electroplating is performed in the plating tank 11 while the plating solution 12 is circulated through the circulation device (pump 21, guide pipe 22, jet port 23), the plating solution 12 as the entire plating tank 11 is used. As a result, it is ensured that the plating solution 12 having a uniform composition is always stably supplied around the plating surface 14a of the workpiece 14.

  Next, FIG. 5 is a schematic overall view similar to FIG. 1 according to the second embodiment of the present invention, in which the arrangement of the electrode 13, the workpiece 14 and the surrounding member 16 is changed.

  In this case, the electrode 13 and the plated surface 14a of the workpiece 14 are disposed horizontally, and the surrounding member 16 is disposed so that the axial direction thereof is vertically corresponding to this. Further, the end of the surrounding member 16 on the side opposite to the electrode 13 is not closed, and is open like the tip on the electrode 13 side. Accordingly, the plating solution 12 can be circulated between the space surrounded by the surrounding member 16 and the outer space without providing an opening in the surrounding member 16.

Next, FIG. 6 is a schematic overall view of a side housing W of a rotary engine as an object to be processed according to the third embodiment of the present invention. The side housing W of the rotary engine has been reduced in weight by replacing cast iron with an aluminum alloy in order to improve fuel efficiency. In the drawing, the sliding surface W1 with the side seal of the rotor indicated by the chain line needs to be a surface that is low in wear and difficult to seize, and surface modification of the sliding surface W1 is effective. As the surface modification of the sliding surface W1, a hard plating process is effective. Particularly in a rotary engine with a high demand for improvement in fuel consumption, the sliding surface W1 has NiPCo—Si ₃ N ₄ or high speed. CrMo alloy plating or the like is suitable.

  In FIG. 6, the sliding surface W1 is a plated surface, and the symbol W2 is an opening through which the eccentric shaft is inserted.

  FIG. 7A is a plan view of the surrounding member 33 and the support member 31 suitable for the side housing W, and FIG. 7B is a view taken in the direction of arrow III in FIG. 7A. Since the contour shape of the side housing W is relatively complicated and it is basically difficult to cut out the surrounding member 33 from a large resin block, the surrounding member 33 is composed of a plurality of thin resin plates (such as vinyl chloride). ) 33a ... 33a stacked structure.

  Here, reference numeral 31 in the figure denotes a conductive support member. Reference numeral 32 is a conductive pin provided upright on the support member 31, and the pin 32 is inserted through the eccentric shaft opening W <b> 2 of the side housing W. Reference numeral 33 denotes a surrounding member 33 suitable for the side housing W, and reference numeral 34 denotes an opening for accommodating the side housing W. Here, a predetermined gap α is provided between the side housing receiving opening 34 and the outer peripheral surface of the side housing W. Reference numeral 35 denotes an opening for allowing the plating solution 12 to flow between the space surrounded by the surrounding member 33 and the outer space in the plating tank 11. Reference numeral 36 denotes a surface on the electrode side of the surrounding member 33, that is, a front surface.

  In the above-described embodiment, the plating solution 12 is circulated between the space surrounded by the surrounding member 16 and the outer space, as indicated by a chain line in FIGS. 2 (a) and 2 (b). The openings 15a to 15a may be provided in the support member 15 together with the openings 17 to 17 of the surrounding member 16 or instead of the openings 17 to 17 of the surrounding member 16.

  An aluminum alloy disk having a diameter of 60 mm and a thickness of 8 mm is used as an object to be processed, and the clearance α with the surrounding member made of vinyl chloride is 3 mm (Example 1), 5 mm (Example 2), 10 mm (Example) 3) When the thickness was changed to 15 mm (Example 4), the thickness of the plating film at the positions of 5 mm (peripheral part), 15 mm (transient part), and 25 mm (center part) from the peripheral part on the plating surface was measured.

The electroplating conditions were as follows: bath composition: CrO ₃ : 260 g / L, H ₂ SO ₄ : 3.5 g / L, Na ₂ MoO ₄ · 2H ₂ O: 60 g / L and methanedisulfonic acid as catalyst: 30 ml / L L, the bath temperature was 55 ° C., the current density was 40 A / dm ² , and the energization time was 5 hours.

  As a result, in Example 1, the plating film at the peripheral part is slightly thinner than the transition part and the central part, and conversely, in Example 4, the plating film at the peripheral part is slightly thicker than the transition part and the central part. It was. And in Example 2 and 3, the thickness of the plating film was substantially uniform in the peripheral part, the transition part, and the center part. From this, it can be seen that the gap α between the surrounding member and the object to be processed is particularly preferably 5 mm to 10 mm.

  As described above in detail with reference to specific examples, the present invention is not affected by variations in the processing accuracy of the workpiece, does not increase the complexity of the equipment or increase the cost, and is always stable and easy. Since it is a technique capable of making the thickness of the electroplating coating film uniform, it has wide industrial applicability in the technical field of surface treatment of metal materials.

1 is a schematic overall view of an electroplating apparatus according to a best embodiment of the present invention. It is a figure which expands and shows the principal part of the said electroplating apparatus, Comprising: (a) is an arrow view by the code | symbol I of the said FIG. 1, (b) is sectional drawing by the code | symbol II of the said FIG. It is sectional drawing similar to the said FIG.2 (b) for demonstrating the principle of the said electroplating apparatus. (A) explains the problem when the gap between the surrounding member and the object to be processed is excessively narrow, and (b) explains the problem when the gap between the surrounding member and the object to be processed is excessively wide. FIG. 4 is a cross-sectional view similar to FIG. FIG. 6 is a schematic overall view similar to FIG. 1 according to the second embodiment of the present invention, in which the arrangement of electrodes, objects to be processed, and surrounding members is changed. It is a schematic whole figure of the side housing of the rotary engine as a to-be-processed object which concerns on the 3rd Embodiment of this invention. (A) is a top view of the surrounding member and support member suitable for the said side housing, (b) is an arrow line view by the code | symbol III of the said FIG. 7 (a). It is explanatory drawing of the problem of a prior art. It is explanatory drawing of another prior art. (A), (b) is explanatory drawing of the problem of the prior art of the said FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electroplating apparatus 11 Plating tank 12 Plating liquid 13 Electrode 14 To-be-processed object 14a Plating surface 15 Support member 15a Opening 16 Enclosure member 17 Opening 21 Circulation apparatus (pump)
22 Circulator (guide pipe)
23 Circulator (jet outlet)
31 Support member 32 Conductive pin 33 Enclosure member 34 Side housing accommodation opening 35 Opening 36 Enclosure member front surface α Gap β Enclosure member axial length H Workpiece axial length P Plated film W Workpiece (side housing )
W1 Plated surface W2 Eccentric shaft opening

Claims (8)

An electroplating method for plating the surface of an object to be processed by energizing between the electrode immersed in a plating solution in the plating tank and the object to be processed,
In the plating tank, while opening the plating surface of the object to be processed that faces the electrode, the periphery of the object to be processed is surrounded by a non-conductive surrounding member with a predetermined gap, and the electrode side of the surrounding member is An electroplating method, wherein a current is passed between the electrode and the object to be processed in a state where the tip end portion protrudes from the plating surface of the object to be processed toward the electrode side. The electroplating method according to claim 1,
An electroplating method, wherein an electrode is disposed so as to face the entire plated surface of an object to be processed. The electroplating method according to claim 1 or 2,
An electroplating method comprising performing electroplating while circulating a plating solution between a space surrounded by the surrounding member and a space outside the space in the plating tank. The electroplating method according to claim 3, wherein
While performing electroplating while circulating the plating solution in the plating tank,
The electroplating method is characterized in that the distribution route of the plating solution is a part of the circulation route of the plating solution. An electroplating apparatus for plating the surface of an object to be processed by energizing between the electrode immersed in the plating solution in the plating tank and the object to be processed,
In the plating tank, the plating surface of the object to be processed facing the electrode is opened, and the periphery of the object to be processed is surrounded by a predetermined gap, and the tip side on the electrode side is the electrode from the plating surface of the object to be processed. An electroplating apparatus comprising a non-conductive surrounding member protruding to the side. The electroplating apparatus according to claim 5,
An electroplating apparatus, wherein the electrode is disposed so as to face the entire plating surface of the object to be processed. The electroplating apparatus according to claim 5 or 6,
The end on the counter electrode side of the surrounding member is closed with a support member that supports the object to be processed,
An electroplating apparatus, wherein an opening is provided in the surrounding member and / or the support member. The electroplating apparatus according to claim 7,
A circulation device is provided for circulating the plating solution in the plating tank,
The electrical outlet is characterized in that the plating solution spray outlet in the circulation device is directed from the space outside the space surrounded by the surrounding member to the opening provided in the surrounding member and / or the support member. Plating equipment.

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