CN107858711A - Metallic matrix electro-plating method - Google Patents
Metallic matrix electro-plating method Download PDFInfo
- Publication number
- CN107858711A CN107858711A CN201711212706.4A CN201711212706A CN107858711A CN 107858711 A CN107858711 A CN 107858711A CN 201711212706 A CN201711212706 A CN 201711212706A CN 107858711 A CN107858711 A CN 107858711A
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- Prior art keywords
- metallic matrix
- plating
- electro
- matrix
- plating method
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of metallic matrix electro-plating method, including：Degreasing degreasing processing is carried out to metallic matrix；Immersed the metallic matrix after degreasing degreasing as anode, insoluble electric-conductor as negative electrode in the electrochemical polish liquid that temperature is 30 80 DEG C, the polishing electric current that current density is 5 30ASD is passed through to metallic matrix and insoluble electric-conductor, energization polishing time is 10 180s, and electrochemical polish is carried out to metallic matrix；Metallic matrix after electrochemical polish is clean through deionized water rinsing；Metallic matrix after rinsing well is electroplated；It is clean through deionized water rinsing to the metallic matrix after plating.High bright high smooth coating can be obtained using foregoing invention.
Description
Technical field
The present invention relates to technical field of surface, more specifically, is related to a kind of electro-plating method to metallic matrix.
Background technology
To obtain the coating of the high smooth bright low roughness of height, metallic matrix is required to carry out complicated preceding place before plating
Reason, it usually needs prolonged mechanical grinding processing, to reduce roughness and remove oxide film dissolving.But current mechanical treatment
Method is time-consuming longer, and dust is easily produced in bruting process, very detrimental effect be present to environment and operating personnel.
In addition, the uniformity of the metal base surface after mechanical grinding is handled can not be guaranteed, cause that coating effect is poor, product
Can be unstable etc..
Also, part of the part containing metal insert is directed to, can not be polished using mechanical grinding, using the polishing mode
With certain limitation, all metallic matrixes are not particularly suited for.
The content of the invention
In view of the above problems, it is an object of the invention to provide a kind of metallic matrix electro-plating method, to solve current metalwork
Coating effect existing for electro-plating method is poor, for the part containing metal insert, and can not carry out mechanical polishing causes product plating not
Ideal, the problems such as unstable product quality.
Metallic matrix electro-plating method provided by the invention, including degreasing degreasing processing is carried out to metallic matrix；Degreasing is removed
Metallic matrix after oil is immersed in the electrochemical polish liquid that temperature is 30-80 DEG C as anode, insoluble electric-conductor as negative electrode,
The polishing electric current that current density is 5-30ASD is passed through to metallic matrix and insoluble electric-conductor, energization polishing time is 10-
180s, electrochemical polish is carried out to metallic matrix；Metallic matrix after electrochemical polish is clean through deionized water rinsing；Liquidate
Metallic matrix after wash clean is electroplated；It is clean through deionized water rinsing to the metallic matrix after plating.
Furthermore it is preferred that scheme be that insoluble electric-conductor is graphite piece, titanium alloy, lead part or Al-alloy parts.
Furthermore it is preferred that scheme be, metallic matrix be steel and iron parts, copper alloy part, zinc alloy piece, metal powder metallurgy part,
Metal powder metallurgy part, metal insert or steel modeling engaging member.
Furthermore it is preferred that scheme be that the temperature of electrochemical polish liquid is 50 DEG C, and the current density for polishing electric current is 15ADS,
Polishing time is 50s.
Furthermore it is preferred that scheme be, electrochemical polish liquid include 20% sulfuric acid, 40% phosphoric acid, 30% Macrogol 600 and
10% water.
Furthermore it is preferred that scheme be, during being electroplated to the metallic matrix after rinsing well：By metallic matrix
As negative electrode part, anode member and metallic matrix are immersed simultaneously energization plating is carried out in nickel plating solution.
Furthermore it is preferred that scheme be that the electroplating time of anode member and metallic matrix is 1-5min, the temperature of nickel plating solution
For 45-60 DEG C, the electroplating current for the plating that is powered is 10-30A.
Furthermore it is preferred that scheme be that the electroplating time of anode member and metallic matrix is 4min, and the temperature of nickel plating solution is
55 DEG C, the electroplating current for the plating that is powered is 25A.
Furthermore it is preferred that scheme be, nickel plating solution include deionized water solvent, nickel sulfate 240ml/L, nickel chloride
100ml/L, boric acid 30ml/L and additive 10ml/L.
Furthermore it is preferred that scheme be that metallic matrix is copper alloy matrix, electro-plating method includes：Copper alloy matrix is carried out
Degreasing degreasing processing；By the copper alloy matrix after degreasing degreasing be placed in temperature for 50 DEG C and containing 20% sulfuric acid, 40% phosphoric acid,
Energization polishing, electrical current 10ASD, conduction time are in the electrochemical polish liquid of 30% Macrogol 600 and 10% water
30s；Copper alloy matrix after electrochemical polish is clean through deionized water rinsing；Copper alloy matrix after rinsing well immerses
Be powered plating in the nickel plating solution that temperature is 55 DEG C, electrical current 15A, conduction time 3min；Copper after plating is closed
Auri body is clean through deionized water rinsing.
Using above-mentioned metallic matrix electro-plating method, before being electroplated to metallic matrix, electricity is carried out to metallic matrix in advance
Chemical polishing, the pre-treatment of mechanical grinding can be saved, oxide-film and the reduction of metal base surface are removed by chemical polishing
Its surface roughness, and then the metallic matrix after electrochemical polish is electroplated, high-flatness and high brightness can be obtained
Coating.
In order to realize above-mentioned and related purpose, one or more aspects of the invention include the spy that will be explained in below
Sign.Some illustrative aspects of the present invention are described in detail in following explanation and accompanying drawing.However, these aspect instructions are only
It is some modes in the various modes for can be used the principle of the present invention.In addition, it is contemplated that including all these aspects with
And their equivalent.
Brief description of the drawings
By reference to the explanation below in conjunction with accompanying drawing, and with the present invention is more fully understood, of the invention is other
Purpose and result will be more apparent and should be readily appreciated that.In the accompanying drawings：
Fig. 1 is the metallic matrix electro-plating method flow chart according to the embodiment of the present invention；
Fig. 2 is the copper alloy matrix electro-plating method flow chart according to the embodiment of the present invention；
Fig. 3 is the stainless steel base electro-plating method flow chart according to the embodiment of the present invention.
Identical label indicates similar or corresponding feature or function in all of the figs.
Embodiment
In the following description, for purposes of illustration, in order to provide the comprehensive understanding to one or more embodiments, explain
Many details are stated.It may be evident, however, that these embodiments can also be realized in the case of these no details.
In other examples, for the ease of describing one or more embodiments, known structure and equipment are shown in block form an.
For the metallic matrix electro-plating method of the present invention is described in detail.Specific embodiment below with reference to accompanying drawing to the present invention
It is described in detail.
Fig. 1 shows metallic matrix electro-plating method flow according to embodiments of the present invention.
As shown in figure 1, the metallic matrix electro-plating method of the embodiment of the present invention, comprises the following steps：
S110：Degreasing degreasing processing is carried out to metallic matrix.
S120：Metallic matrix after degreasing degreasing is handled immerses jointly as anode, insoluble electric-conductor as negative electrode
Temperature is in 30-80 DEG C of electrochemical polish liquid, and it is 5-30ASD's that current density is passed through to metallic matrix and insoluble electric-conductor
Electric current is polished, energization polishing time is 10-180s, to carry out electrochemical polish to metallic matrix.
S130：Metallic matrix after electrochemical polish is clean through deionized water rinsing.
S140：Electrochemical polish and the metallic matrix rinsed well are electroplated.
S150：It is clean through deionized water rinsing again to the metallic matrix after plating.
Wherein, insoluble electric-conductor can select the often similar structures part such as graphite piece, titanium alloy, lead part, Al-alloy parts,
For example, insoluble electric-conductor is graphite, titanium alloy sheet, titanium alloy reticulated, stereotype or aluminium alloy plate etc..
Further, metallic matrix can be the metalwork of various shapes, and metal material is unrestricted, and steel can be selected
Part, copper alloy part, zinc alloy piece, metal powder metallurgy part, the inserts containing metal or steel modeling engaging member etc..
In the specific embodiment of the present invention, the temperature of electrochemical polish liquid is 50 DEG C, polishes the electric current of electric current
For 15ASD, energization polishing time is 50s.
In another embodiment of the present invention, electrochemical polish liquid gathers including 20% sulfuric acid, 40% phosphoric acid, 30%
The water of ethylene glycol 600 and 10%.
In addition, during step S140 electroplates to metallic matrix, using metallic matrix as negative electrode part, and provide
Corresponding anode member, anode member and metallic matrix are immersed simultaneously energization plating is carried out in nickel plating solution.
Further, nickel plating solution includes deionized water solvent, nickel sulfate 240ml/L, nickel chloride 100ml/L, boric acid
30ml/L and additive 10ml/L.The electroplating time of anode member and metallic matrix is 1-5min, and the temperature of nickel plating solution is 45-
60 DEG C, the electroplating current for the plating that is powered is 10-30A.Specifically, the electroplating time of anode member and metallic matrix is 4min, plating
The temperature of nickel solution is 55 DEG C, and the electroplating current for the plating that is powered is 25A.
Fig. 2 shows the flow of copper alloy matrix electro-plating method according to embodiments of the present invention.
As shown in Fig. 2 the copper alloy matrix electro-plating method of the embodiment of the present invention, comprises the following steps：
S210：Degreasing degreasing processing is carried out to copper alloy matrix.
Wherein, it is 1.5mm from thickness, long 40mm, wide 18mm copper alloy are as matrix.
S220：By the copper alloy matrix after degreasing degreasing be placed in temperature for 50 DEG C and containing 20% sulfuric acid, 40% phosphoric acid,
Energization polishing, electrical current 10ASD, conduction time are in the electrochemical polish liquid of 30% Macrogol 600 and 10% water
30s。
S230：Copper alloy matrix after electrochemical polish (i.e. step S220 processing procedures) is done through deionized water rinsing
Only.
S240：Copper alloy matrix after rinsing well immerses in the nickel plating solution that temperature is 55 DEG C the plating that is powered, and leads to
Electric current is 15A, conduction time 3min.
S250：It is clean through deionized water rinsing to the copper alloy matrix after plating.
Wherein, after above-mentioned electrochemical polish and electroplating processes, copper alloy surface roughness Ra can reach copper alloy matrix
To 0.21 micron.
Fig. 3 shows the flow of stainless steel base electro-plating method according to embodiments of the present invention.
As shown in figure 3, the stainless steel base electro-plating method of the embodiment of the present invention, comprises the following steps：
S310：Degreasing degreasing processing is carried out to stainless steel base.
Wherein, it is 1.5mm from thickness, long 40mm, wide 18mm 304 stainless steels are as matrix.
S320：Stainless steel base after degreasing degreasing is handled is placed in temperature for 50 DEG C and containing 20% sulfuric acid, 40% phosphorus
Energization polishing, electrical current 15ASD, conduction time are in the electrochemical polish liquid of acid, 30% Macrogol 600 and 10% water
50s。
S330：Stainless steel base after electrochemical polish (i.e. step S320 processing procedures) is done through deionized water rinsing
Only.
S340：Stainless steel base after rinsing well immerses in the nickel plating solution that temperature is 55 DEG C the plating that is powered, and leads to
Electric current is 15A, conduction time 4min.
S350：Stainless steel base after plating is cleaned up through deionized water.
Wherein, stainless steel base is after above-mentioned electrochemical polish and electroplating processes, the surface roughness Ra of stainless steel base
0.13 micron can be reached.
Metallic matrix electro-plating method provided by the invention can be seen that by above-mentioned embodiment, by electrochemical polish with
Plating is combined, and is not required to carry out the pre-treatment of mechanical grinding, removes the oxide-film of metal base surface by chemical polishing first
And its surface roughness is reduced, then the metallic matrix after electrochemical polish is electroplated, technique is simple, efficiency high, can
The quick coating for obtaining high-flatness and high brightness, product quality temperature.
Metallic matrix electro-plating method according to the present invention is described in an illustrative manner above with reference to accompanying drawing.But this area
It will be appreciated by the skilled person that the metallic matrix electro-plating method proposed for the invention described above, can also not depart from the present invention
Various improvement are made on the basis of content.Therefore, protection scope of the present invention should be true by the content of appended claims
It is fixed.
Claims (10)
- A kind of 1. metallic matrix electro-plating method, it is characterised in that including：Degreasing degreasing processing is carried out to the metallic matrix；Using the metallic matrix after degreasing degreasing as anode, insoluble electric-conductor the electricity that temperature is 30-80 DEG C is immersed as negative electrode In chemical polishing solution, the polishing electric current that current density is 5-30ASD is passed through to the metallic matrix and the insoluble electric-conductor, Energization polishing time is 10-180s, and electrochemical polish is carried out to the metallic matrix；Metallic matrix after electrochemical polish is clean through deionized water rinsing；Metallic matrix after rinsing well is electroplated；It is clean through deionized water rinsing to the metallic matrix after plating.
- 2. metallic matrix electro-plating method as claimed in claim 1, it is characterised in thatThe insoluble electric-conductor is graphite piece, titanium alloy, lead part or Al-alloy parts.
- 3. metallic matrix electro-plating method as claimed in claim 1, it is characterised in thatThe metallic matrix is steel and iron parts, copper alloy part, zinc alloy piece, metal powder metallurgy part, metal insert or steel modeling knot Component.
- 4. metallic matrix electro-plating method as claimed in claim 1, it is characterised in thatThe temperature of the electrochemical polish liquid is 50 DEG C, and the current density of the polishing electric current is 15ASD, and the polishing time is 50s。
- 5. metallic matrix electro-plating method as claimed in claim 1, it is characterised in thatThe electrochemical polish liquid includes 20% sulfuric acid, 40% phosphoric acid, 30% Macrogol 600 and 10% water.
- 6. metallic matrix electro-plating method as claimed in claim 1, it is characterised in that enter to the metallic matrix after rinsing well During row plating：Using the metallic matrix as negative electrode part, anode member and the metallic matrix are immersed in nickel plating solution simultaneously and led to Electricity plating.
- 7. metallic matrix electro-plating method as claimed in claim 6, it is characterised in thatThe electroplating time of the anode member and the metallic matrix is 1-5min, and the temperature of the nickel plating solution is 45-60 DEG C, The electroplating current for being powered plating is 10-30A.
- 8. metallic matrix electro-plating method as claimed in claim 7, it is characterised in thatThe electroplating time of the anode member and the metallic matrix is 4min, and the temperature of the nickel plating solution is 55 DEG C, described The electroplating current electroplated that is powered is 25A.
- 9. metallic matrix electro-plating method as claimed in claim 6, it is characterised in thatThe nickel plating solution includes deionized water solvent, nickel sulfate 240ml/L, nickel chloride 100ml/L, boric acid 30ml/L and adds Add agent 10ml/L.
- 10. metallic matrix electro-plating method as claimed in claim 1, it is characterised in that the metallic matrix is copper alloy matrix, The electro-plating method includes：Degreasing degreasing processing is carried out to the copper alloy matrix；Copper alloy matrix after degreasing degreasing is placed in temperature for 50 DEG C and containing 20% sulfuric acid, 40% phosphoric acid, 30% poly- second two Be powered polishing in the electrochemical polish liquid of the water of alcohol 600 and 10%, electrical current 10ASD, conduction time 30s；Copper alloy matrix after electrochemical polish is clean through deionized water rinsing；Copper alloy matrix after rinsing well immerses in the nickel plating solution that temperature is 55 DEG C the plating that is powered, and electrical current is 15A, conduction time 3min；It is clean through deionized water rinsing to the copper alloy matrix after plating.
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| CN201711212706.4A CN107858711A (en) | 2017-11-28 | 2017-11-28 | Metallic matrix electro-plating method |
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| CN201711212706.4A CN107858711A (en) | 2017-11-28 | 2017-11-28 | Metallic matrix electro-plating method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041547A (en) * | 2019-12-18 | 2020-04-21 | 常熟颢文电子科技有限公司 | Multi-arc ion aluminizing pretreatment method for threaded stainless steel workpiece |
| CN112030197A (en) * | 2020-11-06 | 2020-12-04 | 浙江华朔科技股份有限公司 | Electroplating process for new energy automobile battery integrated insert |
| CN114606545A (en) * | 2022-02-24 | 2022-06-10 | 东南数字经济发展研究院 | Electrochemical method for surface treatment of strain gauge bonding pad |
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| CN112030197A (en) * | 2020-11-06 | 2020-12-04 | 浙江华朔科技股份有限公司 | Electroplating process for new energy automobile battery integrated insert |
| CN114606545A (en) * | 2022-02-24 | 2022-06-10 | 东南数字经济发展研究院 | Electrochemical method for surface treatment of strain gauge bonding pad |
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