JP2010033933A - Substrate mounting terminal block and printed wiring board used for the same - Google Patents

Substrate mounting terminal block and printed wiring board used for the same Download PDF

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JP2010033933A
JP2010033933A JP2008196001A JP2008196001A JP2010033933A JP 2010033933 A JP2010033933 A JP 2010033933A JP 2008196001 A JP2008196001 A JP 2008196001A JP 2008196001 A JP2008196001 A JP 2008196001A JP 2010033933 A JP2010033933 A JP 2010033933A
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terminal block
printed wiring
wiring board
thermal fuse
board
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JP4785895B2 (en
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Hidenori So
秀紀 宗
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate mounting terminal block and a printed wiring board used for the block allowing low cost soldering of a temperature fuse to the printed wiring board without degrading its quality. <P>SOLUTION: In a terminal block to which the temperature fuse is assembled and the substrate mounting terminal block with the terminal block soldered to the printed wiring board, at least one rib closely attached to the printed wiring board is disposed on a soldered surface of the terminal block to surround a space including a lead of the temperature fuse, or an open part is provided in the vicinity of the lead of the temperature fuse or a connection pattern or part of the connection pattern between a soldered land part of the temperature fuse and a soldered land part of the terminal block is thinned or the distance between them is increased to be wired. The substrate mounting terminal block is characterized by providing a plurality of test lands on each of patterns at both ends of the temperature fuse. The printed wiring board is used for the substrate mounting terminal block. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、温度ヒューズを組み付ける基板実装端子台と、この端子台をプリント配線板にはんだ付けした基板実装端子台において、温度ヒューズをプリント配線板へはんだ付けしたときに、そのはんだ付け作業で発生するはんだ屑によるショートやはんだブリッジの発生を防止したり、はんだ付け時の熱による温度ヒューズの溶断や特性劣化を防止することに関するものである。   This invention is caused by soldering work when a thermal fuse is soldered to a printed wiring board in a board mounting terminal block to which the thermal fuse is assembled and the terminal mounting terminal block in which the terminal block is soldered to the printed wiring board. The present invention relates to preventing the occurrence of short circuits and solder bridges due to solder scraps, and preventing the thermal fuse from fusing and deterioration of characteristics due to heat during soldering.

従来の温度ヒューズを組み付ける基板実装端子台において、温度ヒューズがはんだ付けの熱により溶断しないようにする対策としては、温度ヒューズのリードを放熱性の優れたコンタクトへ接続し、そのコンタクトをはんだ付けする例などがあった（例えば、特許文献１参照）。
また、はんだ付けによるブリッジ対策としては、フローはんだ付けにおいて、部品貫通穴からのはんだ乗り上げ防止用リブを貫通穴の付近に設ける例などがあった（例えば、特許文献２参照）。 As a measure to prevent the thermal fuse from fusing due to the heat of soldering in the board-mounted terminal block to which the conventional thermal fuse is assembled, connect the thermal fuse lead to a contact with excellent heat dissipation and solder the contact. There was an example etc. (for example, refer to patent documents 1).
Further, as a bridge countermeasure by soldering, there has been an example in which a solder climbing prevention rib from a component through hole is provided in the vicinity of the through hole in flow soldering (for example, see Patent Document 2).

特開２００２−２４６０８１号公報(［０００６］、［０００９］、［００１０］、図１)Japanese Patent Laid-Open No. 2002-246081 ([0006], [0009], [0010], FIG. 1) 特開平１１−１８９３５号公報（［０００９］、［００３２］、図５）Japanese Patent Laid-Open No. 11-18935 ([0009], [0032], FIG. 5)

温度ヒューズを組み付けた基板実装端子台において、温度ヒューズがはんだ付けの熱により溶断しないようにするために、前記従来例においては、放熱性コンタクトを新たに設ける必要があり、構造が複雑となり、部品点数も増えるためコストが高くなるという問題があった。
また、温度ヒューズのリード線を直接はんだ付けする方法としては、基板実装端子台をプリント配線板にフローはんだ付けし冷却した後に、温度ヒューズを基板実装端子台に取り付け、その温度ヒューズのリードへ放熱部材等を接触させながらコテはんだ付けにより温度ヒューズをはんだ付けし、その後に放熱部材を取り外す方法がある。しかし、コテはんだ付けをするにはプリント配線板を裏返してはんだ付けをする必要があり、このときプリント配線板の温度ヒューズ実装穴からはんだが垂れ落ち、そのはんだ屑が振動等により移動し、電子回路の異極間同士をショートさせるなどの不具合を発生する危険があった。
また、はんだ屑が長く伸びた場合には、温度ヒューズのリードと端子台の端子間がブリッジする危険もあった。
そこでこの対策が必要となるが、前記従来例においては、樹脂外装基板を使用したフローはんだ付けによる対応であり、樹脂外装基板は特殊な基板であるためコストが高くなることと、これがフローはんだ付けへの対応であるため、基板を裏返して行う手はんだ付けに対しては効果が得られないという問題があった。 In the board-mounted terminal block with the thermal fuse assembled, in order to prevent the thermal fuse from fusing due to the heat of soldering, it is necessary to newly provide a heat dissipating contact in the conventional example, the structure becomes complicated, and the parts There is a problem that the cost increases because the number of points increases.
Also, as a method of directly soldering the lead wire of the thermal fuse, after the board mounting terminal block is flow soldered to the printed wiring board and cooled, the thermal fuse is attached to the board mounting terminal block and heat is dissipated to the thermal fuse lead. There is a method in which a thermal fuse is soldered by iron soldering while contacting a member or the like, and then a heat radiating member is removed. However, in order to perform soldering, it is necessary to turn the printed wiring board over and solder it. At this time, the solder drips from the temperature fuse mounting hole of the printed wiring board, and the solder debris moves due to vibration, etc. There was a risk of causing problems such as short-circuiting between different poles of the circuit.
In addition, when the solder waste extends for a long time, there is a risk of bridging between the lead of the thermal fuse and the terminal of the terminal block.
Therefore, this measure is necessary, but in the above-mentioned conventional example, it is a response by flow soldering using a resin outer substrate, and the resin outer substrate is a special substrate, which increases the cost and this is flow soldering. Therefore, there is a problem that the effect cannot be obtained for the manual soldering performed by turning the substrate upside down.

この発明は、上記のような課題を解決するためになされたもので、温度ヒューズはんだ付け作業が品質を損なうことなく、低コストで実現できる基板実装端子台を得ることを目的とし、また温度ヒューズへの熱的不具合を防止するプリント配線板を得ることを第２の目的としている。   The present invention has been made to solve the above-described problems, and it is an object of the present invention to obtain a board-mounted terminal block that can be realized at low cost without deteriorating the quality of the thermal fuse soldering operation. It is a second object to obtain a printed wiring board that prevents thermal troubles.

この発明に係る基板実装端子台は、温度ヒューズを組み付ける端子台と、この端子台をプリント配線板にはんだ付けした基板実装端子台において、端子台のはんだ付け面に温度ヒューズのリードを含む空間を囲むようにプリント配線板と密着したリブを設けたことを特徴とする。また、温度ヒューズを組み付ける端子台にはんだ付けされるプリント配線板において、温度ヒューズのはんだ付けランド部と端子台のはんだ付けランド部間の接続パターン乃至その一部を細く、長く配線することを特徴とする。また、温度ヒューズの両端のパターンに各複数のテストランドを設けたことを特徴とする。   The board-mounted terminal block according to the present invention includes a terminal block for assembling a thermal fuse, and a board-mounted terminal block in which the terminal block is soldered to a printed wiring board. A rib that is in close contact with the printed wiring board is provided so as to surround it. In the printed wiring board to be soldered to the terminal block to which the thermal fuse is assembled, the connection pattern between the soldering land portion of the thermal fuse and the soldering land portion of the terminal block or a part of the connection pattern is thin and long. And In addition, a plurality of test lands are provided in the pattern on both ends of the thermal fuse.

この発明の基板実装端子台は、上記構成により、温度ヒューズを手はんだ付けするときに、温度ヒューズ実装穴から垂れ落ちたはんだが、端子台のはんだ面とプリント配線板の部品面の間から流出することを防ぎ、他の電子回路においてショートする等の不具合発生を防止でき、また、この発明のプリント配線板は、はんだ付け時の熱伝導を低下させ熱的不具合を防止する効果を有する。   In the board mounting terminal block of the present invention, due to the above configuration, when the thermal fuse is manually soldered, the solder dripping from the thermal fuse mounting hole flows out between the solder surface of the terminal block and the component surface of the printed wiring board. The printed wiring board of the present invention has the effect of reducing thermal conduction during soldering and preventing thermal problems.

実施の形態１．
図１は、この発明の実施の形態１における基板実装端子台と温度ヒューズ、プリント配線板の組立図であり、（ａ）は正面図、（ｂ）は左側面図、（ｃ）は右側面図、（ｄ）は上面図、（ｅ）は底面図である。図２は、基板実装端子台のプリント配線板に接するはんだ付け面から見た平面図、図３は、図１のＡ−Ａ線の断面図である。尚、各図は、本実施の形態１の説明上必要な箇所に限定されている略図である。
図において、基板実装端子台１は、空気調和機の室内機、室外機間を電気的に接続し、相互の電力供給や通信などをする内外接続電線（図示せず）を接続するためのものであり、その内外接続電線は電線挿入穴２から挿入され、基板実装端子台１内部の金属性の端子３やばね等により電気的、機械的に接続されている。その金属性の端子３は、さらにプリント配線板４の実装穴５に挿入され、その周囲に設けられた端子用ランド６とはんだ７によりはんだ付けされ、電気的、機械的に接続されている。この端子用ランド６はパターン８を介して空気調和機の電子回路や電源等（図示せず）と接続されている。また、金属性の端子３は、必要に応じてTAB端子も兼ねており、ファストン端子等により空気調和機の電子回路や電源等（図示せず）と接続されている。 Embodiment 1 FIG.
1 is an assembly diagram of a board mounting terminal block, a thermal fuse, and a printed wiring board according to Embodiment 1 of the present invention, where (a) is a front view, (b) is a left side view, and (c) is a right side view. (D) is a top view and (e) is a bottom view. FIG. 2 is a plan view seen from the soldering surface in contact with the printed wiring board of the board mounting terminal block, and FIG. 3 is a cross-sectional view taken along the line AA of FIG. Each figure is a schematic diagram that is limited to parts necessary for the description of the first embodiment.
In the figure, a board-mounted terminal block 1 is used for electrically connecting an indoor unit and an outdoor unit of an air conditioner, and connecting an internal / external connection wire (not shown) for mutual power supply and communication. The inner and outer connection electric wires are inserted from the electric wire insertion holes 2 and are electrically and mechanically connected by metallic terminals 3 and springs inside the board mounting terminal block 1. The metallic terminal 3 is further inserted into the mounting hole 5 of the printed wiring board 4 and soldered with a terminal land 6 and solder 7 provided around the mounting hole 5 to be electrically and mechanically connected. This terminal land 6 is connected to an electronic circuit, a power source and the like (not shown) of the air conditioner via a pattern 8. Further, the metallic terminal 3 also serves as a TAB terminal as necessary, and is connected to an electronic circuit, a power source and the like (not shown) of the air conditioner by a faston terminal or the like.

ここで内外接続電線の基板実装端子台１への挿入不足などにより金属性の端子３やばね等との接触抵抗が大きくなるとその接触抵抗による発熱も大きくなり、発煙・発火に至る可能性もあり、それを防ぐために温度ヒューズ９が端子台１に設けられた凹部１０に取り付けられている。また、温度ヒューズのリード１１は折り曲げられた後、プリント配線板４の実装穴１２から出て、その周囲に設けられた温度ヒューズ用ランド１３とはんだ１４によりはんだ付けされ、パターン８を介して端子台の金属性の端子３の端子用ランド６や空気調和機の電子回路等へ接続されている。ここで温度ヒューズ9を基板実装端子台１のはんだ面と反対側の凹部１０へ取り付けることにより、はんだ付けの熱による温度ヒューズ本体の温度上昇を抑制できるとともに、温度ヒューズ交換作業が容易になる利点がある。
また、基板実装端子台１の温度ヒューズのリード１１や金属性の端子３の近傍のプリント配線板４と近接するはんだ面とプリント配線板４の部品面の間には空間１５が設けられており、この空間の開放部を塞ぐようにプリント配線板４と密着したリブ１６が基板実装端子台１のはんだ面に設けられている。ここで、基板実装端子台１のはんだ面とプリント配線板４の部品面が密着せずに、空間１５を設けているのは、これによりはんだ付け時に発生するガスを抜け易くし、はんだ付け性を向上させるためである。 Here, if the contact resistance with the metallic terminal 3 or the spring increases due to insufficient insertion of the internal / external connection wires into the board mounting terminal block 1, the heat generated by the contact resistance increases, which may lead to smoke or ignition. In order to prevent this, a thermal fuse 9 is attached to a recess 10 provided in the terminal block 1. Further, the lead 11 of the thermal fuse is bent and then comes out of the mounting hole 12 of the printed wiring board 4 and is soldered by the thermal fuse land 13 and the solder 14 provided around the lead hole 11. It is connected to the terminal land 6 of the metallic terminal 3 of the base, the electronic circuit of the air conditioner, and the like. Here, by attaching the thermal fuse 9 to the recess 10 on the side opposite to the solder surface of the board-mounted terminal block 1, it is possible to suppress the temperature rise of the thermal fuse body due to the heat of soldering and to facilitate the thermal fuse replacement work. There is.
A space 15 is provided between the solder surface adjacent to the printed wiring board 4 in the vicinity of the thermal fuse lead 11 and the metallic terminal 3 of the board mounting terminal block 1 and the component surface of the printed wiring board 4. The ribs 16 that are in close contact with the printed wiring board 4 are provided on the solder surface of the board mounting terminal block 1 so as to close the open portion of the space. Here, the space 15 is provided so that the solder surface of the board mounting terminal block 1 and the component surface of the printed wiring board 4 are not in close contact with each other. It is for improving.

次に組み立て方法について説明する。
上述の構成において、まずフローはんだ付けにより基板実装端子台１をプリント配線板４へはんだ付けし、冷却した後に、温度ヒューズ９を基板実装端子台１の凹部１０に挿入するとともに温度ヒューズのリード１１をプリント配線板４の実装穴１２へ挿入し、それを裏返した後、コテはんだ付けにより温度ヒューズのリード１１をプリント配線板４の温度ヒューズ用ランド１３とはんだ付けする。このときに実装穴１２からはんだ１４がプリント配線板４の部品面と基板実装端子台１のはんだ面の間の空間１５に垂れ落ちたとしても、このはんだはリブ１６があることにより外部への開放部がないために、空間１５以外への流出を防ぐことができる。 Next, an assembly method will be described.
In the above-described configuration, the board mounting terminal block 1 is first soldered to the printed wiring board 4 by flow soldering and cooled, and then the thermal fuse 9 is inserted into the recess 10 of the board mounting terminal block 1 and the thermal fuse lead 11 is inserted. Is inserted into the mounting hole 12 of the printed wiring board 4 and turned upside down, and the temperature fuse lead 11 is soldered to the temperature fuse land 13 of the printed wiring board 4 by soldering with a soldering iron. Even if the solder 14 hangs down from the mounting hole 12 into the space 15 between the component surface of the printed wiring board 4 and the solder surface of the board mounting terminal block 1 at this time, the solder is exposed to the outside due to the rib 16. Since there is no open portion, it is possible to prevent outflow to spaces other than the space 15.

以上のように、基板実装端子台１のはんだ面に、温度ヒューズのリード１１を含む空間を囲むようにプリント配線板４と密着したリブ１６を設けたことにより、温度ヒューズ用実装穴１２から垂れ落ちたはんだが、基板実装端子台１のはんだ面とプリント配線板４の部品面とリブ１６で囲まれた空間から流出することを防止でき、垂れ落ちたはんだによるショート等の不具合の発生を防止することができる。尚、本実施例では、リブを直線状の形状としているが、基板実装端子台１のはんだ面とプリント配線板４の部品面の空間の開口部を塞ぐ構造となっていれば、他の形状でも構わない。また、図における温度ヒューズの形状は一例であり、ラジアル等の他の形状の温度ヒューズであってもよい。また、端子台の電線固定方法は、ばねを使用した速結方式としているが、ねじを使用したねじ方式でもよい。また、リブの配置箇所は、本実施例では温度ヒューズ９と基板実装端子台１の端子の間の一辺に設けているが、端子と開放部間に配置したり、開口部に応じて複数の辺に配置してもよい。   As described above, the rib 16 that is in close contact with the printed wiring board 4 is provided on the solder surface of the board mounting terminal block 1 so as to surround the space including the lead 11 of the thermal fuse, thereby dripping from the mounting hole 12 for the thermal fuse. The fallen solder can be prevented from flowing out of the space surrounded by the solder surface of the board mounting terminal block 1, the component surface of the printed wiring board 4 and the rib 16, and the occurrence of problems such as a short circuit due to the dripped solder can be prevented. can do. In this embodiment, the rib has a linear shape, but other shapes can be used as long as the opening of the space between the solder surface of the board-mounted terminal block 1 and the component surface of the printed wiring board 4 is closed. It doesn't matter. Further, the shape of the thermal fuse in the drawing is an example, and a thermal fuse having another shape such as a radial shape may be used. Moreover, although the electric wire fixing method of the terminal block is a fast connection method using a spring, a screw method using a screw may be used. In addition, in the present embodiment, the ribs are arranged on one side between the thermal fuse 9 and the terminal of the board mounting terminal block 1. It may be arranged on the side.

実施の形態２．
実施の形態２を説明する。
図４は、基板実装端子台のはんだ面の平面図である。図５は実施の形態２における図１のＡ−Ａ線の断面図である。尚、Ａ−Ａ線の断面図については、本実施の形態２も実施の形態１と略同一である。尚、各図は、本実施の形態２の説明上必要な箇所に限定されている略図である。
図において、温度ヒューズのリード１１の近傍に温度ヒューズのリード１１を囲むようにプリント配線板４の部品面と密着した第二のリブ１７が設けてある。その結果、基板実装端子台１のはんだ面と第二のリブ１７とプリント配線板４の部品面で囲まれた空間１８ができる。 Embodiment 2. FIG.
Embodiment 2 will be described.
FIG. 4 is a plan view of the solder surface of the board-mounted terminal block. FIG. 5 is a cross-sectional view taken along the line AA of FIG. As for the cross-sectional view taken along the line AA, the second embodiment is also substantially the same as the first embodiment. Each figure is a schematic diagram that is limited to parts necessary for the description of the second embodiment.
In the figure, a second rib 17 that is in close contact with the component surface of the printed wiring board 4 is provided so as to surround the lead 11 of the thermal fuse in the vicinity of the lead 11 of the thermal fuse. As a result, a space 18 surrounded by the solder surface of the board-mounted terminal block 1, the second rib 17, and the component surface of the printed wiring board 4 is formed.

以上のように、温度ヒューズのリード１１の近傍に第二のリブを設けることにより、温度ヒューズをコテはんだ付けしたときに、垂れ落ちたはんだの量が多く長く伸びた場合でも、第一のリブ１６と第二のリブ１７の間の距離を確保することにより、温度ヒューズリード間や端子との間でショートしたり、絶縁距離が不足となることを防止することができる。
また、第二のリブ１７を温度ヒューズのリード１１を完全に囲むようにすることにより、垂れ落ちたはんだがそのリブにより囲まれた空間から流出することを防止することができる。
尚、本実施の形態２では、第二のリブ１７を温度ヒューズのリード周辺を完全に囲むように設けているが、一部リブを設けずに完全に囲まなくても垂れ落ちたはんだの進行を食い止めたり、進行方向を制限することができる効果を有する。また、単純に直線状のリブを近傍に設けるだけでも効果を有する。また、第二のリブ１７は必要に応じて、二個以上の複数個設けてもよい。また、第二のリブ１７の設置位置は、実装穴により近づけても、遠ざけてもよい。 As described above, by providing the second rib in the vicinity of the lead 11 of the thermal fuse, even when the amount of dripped solder is long and long when the thermal fuse is soldered with the iron, the first rib By securing the distance between the 16 and the second rib 17, it is possible to prevent a short circuit between the thermal fuse leads and between the terminals and an insufficient insulation distance.
Further, by making the second rib 17 completely surround the lead 11 of the thermal fuse, it is possible to prevent the dripped solder from flowing out of the space surrounded by the rib.
In the second embodiment, the second rib 17 is provided so as to completely surround the periphery of the lead of the thermal fuse. It has the effect of stopping or restricting the traveling direction. Also, simply providing a straight rib in the vicinity has an effect. Moreover, you may provide the 2nd rib 17 two or more plurality as needed. Further, the installation position of the second rib 17 may be closer to or farther from the mounting hole.

実施の形態３．
実施の形態３を説明する。
図６は、この発明の実施の形態３における基板実装端子台と温度ヒューズ、プリント配線板の組立図であり、（ａ）は正面図、（ｂ）は左側面図、（ｃ）は右側面図、（ｄ）は上面図、（ｅ）は底面図である。図７は、図６のＢ−Ｂ線の断面図である。尚、各図は、本実施の形態３の説明上必要な箇所に限定されている略図である。
図において、基板実装端子台１の温度ヒューズのリード１１近傍に開放部１９を設けてある。
図における開放部１９の形状は一例であり、放熱部材に合わせてあれば、形状を立方型形状、円筒状形状等、またその大きさも任意の大きさに変化させてもよい。放熱部材の例としては、リードを挟むことで接触させる金属性のクリップや、リード上に載せることで接触させる金属性のブロックなどがある。 Embodiment 3 FIG.
A third embodiment will be described.
6 is an assembly diagram of a board mounting terminal block, a thermal fuse, and a printed wiring board according to Embodiment 3 of the present invention, where (a) is a front view, (b) is a left side view, and (c) is a right side view. (D) is a top view and (e) is a bottom view. 7 is a cross-sectional view taken along line BB in FIG. Each figure is a schematic diagram that is limited to parts necessary for the description of the third embodiment.
In the figure, an open portion 19 is provided in the vicinity of the lead 11 of the thermal fuse of the board mounting terminal block 1.
The shape of the opening 19 in the figure is an example, and the shape may be a cubic shape, a cylindrical shape, etc., and the size thereof may be changed to any size as long as it matches the heat dissipation member. Examples of the heat radiating member include a metallic clip that is brought into contact by sandwiching a lead, and a metallic block that is brought into contact by being placed on the lead.

以上のように、基板実装端子台１の温度ヒューズのリード１１近傍に開放部１９を設けることにより、開放部１９がない場合に比べてより容易に放熱部材を接触させることができ、温度ヒューズのリード１１をはんだ付けしたときの温度ヒューズ本体の温度上昇を抑えることができる。開放部１９の形状は、立方型形状、円筒状形状、またその大きさは任意に選択できる。   As described above, by providing the open portion 19 in the vicinity of the lead 11 of the thermal fuse of the board-mounted terminal block 1, the heat radiation member can be brought into contact more easily than when the open portion 19 is not provided. The temperature rise of the thermal fuse body when the lead 11 is soldered can be suppressed. The shape of the opening part 19 can be arbitrarily selected from a cubic shape, a cylindrical shape, and its size.

実施の形態４．
実施の形態４を説明する。
図８は、この発明の実施の形態４における基板実装端子台１と温度ヒューズ、プリント配線板のはんだ面から見た平面図である。尚、図は、本実施の形態４の説明上必要な箇所に限定されている略図である。
図において、温度ヒューズのリード１１のランド１２と金属性の端子３の端子用ランド６間を接続するパターン２０の一部を細く長く配線している。
一般にプリント配線板の部品実装穴には、スルーホールと非スルーホールがあるが、非スルーホールにおいては、部品はプリント配線板のはんだ面側のはんだのみで固定されることになる。そのため、はんだ付け部の強度を向上させるための手段として、フローはんだ付け後にコテはんだ付けにより、はんだを追加することがあるが、本実施の形態４においてこの作業を金属製端子３のランド６に実施すると、同一パターン２０上に配置された温度ヒューズ９のはんだ付けランドも温度が上昇することになる。 Embodiment 4 FIG.
A fourth embodiment will be described.
FIG. 8 is a plan view seen from the solder surface of the board-mounted terminal block 1, the thermal fuse, and the printed wiring board according to Embodiment 4 of the present invention. In addition, the figure is a schematic diagram limited to parts necessary for the description of the fourth embodiment.
In the figure, a part of the pattern 20 that connects between the land 12 of the lead 11 of the thermal fuse and the terminal land 6 of the metallic terminal 3 is thin and long.
Generally, there are through holes and non-through holes in the component mounting holes of the printed wiring board. In the non-through holes, the components are fixed only by the solder on the solder surface side of the printed wiring board. Therefore, as a means for improving the strength of the soldered portion, solder may be added by soldering after the flow soldering. In the fourth embodiment, this work is applied to the land 6 of the metal terminal 3. If implemented, the temperature of the soldering land of the thermal fuse 9 arranged on the same pattern 20 will also rise.

本実施の形態４におけるように、温度ヒューズと端子間を接続するパターンの一部を細く又は長く配線することにより、端子にコテはんだ付けによりはんだを追加する作業をしたときの、温度ヒューズはんだ付け部への熱伝導を低下させることができ、その結果通常配線のパターンと比べて、温度ヒューズ本体の温度上昇も抑制でき、温度ヒューズが溶断することを防止することができる。尚、本実施の形態４では、温度ヒューズと端子間を接続するパターンの一部を細く長く配線しているが、細くするか、長くするかのいずれかだけでも効果があることは言うまでもない。また、細く、長くするほど効果は大きく、そのパターンに流れる電流値や周辺のパターン等に応じてより細く、より長く配線することにより効果は大きくなる。   Thermal fuse soldering when the solder is added to the terminals by iron soldering by narrowing or extending a part of the pattern connecting the thermal fuse and the terminals as in the fourth embodiment As a result, the temperature rise of the thermal fuse body can be suppressed and the thermal fuse can be prevented from fusing as compared with the normal wiring pattern. In the fourth embodiment, a part of the pattern connecting the thermal fuse and the terminal is thinly elongated, but it goes without saying that it is effective to make it thin or long. Further, the thinner and longer the effect is, the greater the effect is. The effect is increased by making the wiring thinner and longer according to the value of the current flowing in the pattern and the surrounding pattern.

実施の形態５．
実施の形態５を説明する。
図９は、この発明の実施の形態５における基板実装端子台１と温度ヒューズ、プリント配線板のはんだ面から見た平面図である。尚、図は、本実施の形態５の説明上必要な箇所に限定されている略図である。
図において温度ヒューズ９の両端の温度ヒューズ用ランド１３の近傍に各々２箇所のテストランド２１を設けてある。 Embodiment 5 FIG.
Embodiment 5 will be described.
FIG. 9 is a plan view of the board-mounted terminal block 1, the thermal fuse, and the printed wiring board as viewed from the solder surface according to the fifth embodiment of the present invention. In addition, the figure is a schematic diagram limited to portions necessary for the description of the fifth embodiment.
In the figure, two test lands 21 are provided in the vicinity of the thermal fuse lands 13 at both ends of the thermal fuse 9.

本実施の形態５におけるように、温度ヒューズの両端に各々２箇所のテストランド２１を設けることにより、４端子法にて容易に温度ヒューズの直流抵抗を測定することができ、温度ヒューズがはんだ付けの熱により特性劣化していないか測定することができる。また、テストランド２１の数は、各々２箇所以上でもよく、また各々１つであってもテストピンが２本実装できる大きさであればよい。   As in the fifth embodiment, by providing two test lands 21 at both ends of the thermal fuse, the DC resistance of the thermal fuse can be easily measured by the four-terminal method, and the thermal fuse is soldered. It can be measured whether or not the characteristics are deteriorated due to heat. Further, the number of test lands 21 may be two or more, and each test land 21 may be one as long as two test pins can be mounted.

この発明の実施の形態１における基板実装端子台と温度ヒューズ、プリント配線板の組立図である。It is an assembly drawing of the board | substrate mounting terminal block, thermal fuse, and printed wiring board in Embodiment 1 of this invention. この発明の実施の形態１における基板実装端子台のプリント配線板の部品面に接するはんだ付け面から見た平面図である。It is the top view seen from the soldering surface which contact | connects the component surface of the printed wiring board of the board | substrate mounting terminal block in Embodiment 1 of this invention. この発明の実施の形態１における図１のＡ−Ａ線の断面図である。It is sectional drawing of the AA line of FIG. 1 in Embodiment 1 of this invention. この発明の実施の形態２における基板実装端子台のプリント配線板の部品面に接するはんだ付け面から見た平面図である。It is the top view seen from the soldering surface which contact | connects the component surface of the printed wiring board of the board | substrate mounting terminal block in Embodiment 2 of this invention. この発明の実施の形態２における図１のＡ−Ａ線の断面図である。It is sectional drawing of the AA line of FIG. 1 in Embodiment 2 of this invention. この発明の実施の形態３における基板実装端子台と温度ヒューズ、プリント配線板の組立図である。It is an assembly drawing of the board | substrate mounting terminal block, thermal fuse, and printed wiring board in Embodiment 3 of this invention. この発明の実施の形態３における図６のＢ−Ｂ線の断面図である。It is sectional drawing of the BB line of FIG. 6 in Embodiment 3 of this invention. この発明の実施の形態４における基板実装端子台と温度ヒューズ、プリント配線板のはんだ付け面からみた平面図である。It is the top view seen from the soldering surface of the board | substrate mounting terminal block in Embodiment 4 of this invention, a thermal fuse, and a printed wiring board. この発明の実施の形態５における基板実装端子台と温度ヒューズ、プリント配線板のはんだ付け面からみた平面図である。It is the top view seen from the soldering surface of the board | substrate mounting terminal block, thermal fuse, and printed wiring board in Embodiment 5 of this invention.

符号の説明Explanation of symbols

１ 基板実装端子台、２ 内外接続電線挿入穴、３ 金属性の端子、４ プリント配線板、５ 端子用実装穴、６ 端子用ランド、７ はんだ、８ パターン、９ 温度ヒューズ、１０ 凹部、１１ 温度ヒューズのリード、１２ 温度ヒューズ用実装穴、１３ 温度ヒューズ用ランド、１４ はんだ、１５ 空間、１６ リブ、１７ 第二のリブ、１８ 空間、１９ 開放部、２０ パターン、２１ テストランド。   1 PCB mounting terminal block, 2 internal / external connection wire insertion hole, 3 metallic terminal, 4 printed wiring board, 5 terminal mounting hole, 6 terminal land, 7 solder, 8 pattern, 9 thermal fuse, 10 recess, 11 temperature Fuse lead, 12 Thermal fuse mounting hole, 13 Thermal fuse land, 14 Solder, 15 space, 16 rib, 17 Second rib, 18 space, 19 Open part, 20 pattern, 21 Test land.

Claims (5)

温度ヒューズを組み付けられ、プリント配線板にはんだ付けされる基板実装端子台において、端子台のはんだ付け面に温度ヒューズのリードを含む空間を囲むようにプリント配線板と密着したリブを設けたことを特徴とする基板実装端子台。   In a board-mounted terminal block that is assembled with a thermal fuse and soldered to the printed wiring board, a rib that is in close contact with the printed wiring board is provided on the soldering surface of the terminal block so as to surround the space including the lead of the thermal fuse. A board mount terminal block. 端子台のはんだ付け面の温度ヒューズのリード近傍にプリント配線板と密着した第二のリブを設けたことを特徴とする請求項１記載の基板実装端子台。   2. The board-mounted terminal block according to claim 1, wherein a second rib closely contacting the printed wiring board is provided in the vicinity of the lead of the temperature fuse on the soldering surface of the terminal block. 温度ヒューズを組み付けられ、プリント配線板にはんだ付けされる基板実装端子台において、温度ヒューズのリード近傍に開放部を設けたことを特徴とする基板実装端子台。   A board-mounted terminal block in which a thermal fuse is assembled and soldered to a printed wiring board, and an open portion is provided near the lead of the thermal fuse. 温度ヒューズを組み付ける端子台にはんだ付けされるプリント配線板において、温度ヒューズのはんだ付けランド部と端子台のはんだ付けランド部間の接続パターン乃至その接続パターンの一部を細くし、又は距離を長くし配線したことを特徴とするプリント配線板。   In a printed wiring board that is soldered to a terminal block to which a thermal fuse is assembled, the connection pattern between the soldering land portion of the thermal fuse and the soldering land portion of the terminal block or a part of the connection pattern is thinned or the distance is increased. A printed wiring board characterized by wiring. 温度ヒューズを組み付ける端子台にはんだ付けされるプリント配線板において、温度ヒューズの両端のパターンに各々複数のテストランドを設けたことを特徴とするプリント配線板。   A printed wiring board that is soldered to a terminal block to which a thermal fuse is assembled, wherein a plurality of test lands are provided in patterns at both ends of the thermal fuse.
JP2008196001A 2008-07-30 2008-07-30 Board mounted terminal block and assembly including the board mounted terminal block Expired - Fee Related JP4785895B2 (en)

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JP2008196001A JP4785895B2 (en) 2008-07-30 2008-07-30 Board mounted terminal block and assembly including the board mounted terminal block
CN2009100035993A CN101640982B (en) 2008-07-30 2009-01-20 Terminal table for substrate installation and printed circuit board for the same

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121778U (en) * 1985-01-16 1986-07-31
JPS6382382U (en) * 1986-11-19 1988-05-30
JPS63150474U (en) * 1987-03-25 1988-10-04
JP2000100504A (en) * 1998-09-21 2000-04-07 Brother Ind Ltd Connector and printed wiring board
JP2002246081A (en) * 2001-02-15 2002-08-30 Smk Corp Terminal block with temperature fuse connection contact

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006079866A (en) * 2004-09-08 2006-03-23 Smk Corp Terminal block with temperature fuse

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121778U (en) * 1985-01-16 1986-07-31
JPS6382382U (en) * 1986-11-19 1988-05-30
JPS63150474U (en) * 1987-03-25 1988-10-04
JP2000100504A (en) * 1998-09-21 2000-04-07 Brother Ind Ltd Connector and printed wiring board
JP2002246081A (en) * 2001-02-15 2002-08-30 Smk Corp Terminal block with temperature fuse connection contact

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