CN101640982A - Terminal table for substrate installation and printed circuit board for the same - Google Patents
Terminal table for substrate installation and printed circuit board for the same Download PDFInfo
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- CN101640982A CN101640982A CN200910003599A CN200910003599A CN101640982A CN 101640982 A CN101640982 A CN 101640982A CN 200910003599 A CN200910003599 A CN 200910003599A CN 200910003599 A CN200910003599 A CN 200910003599A CN 101640982 A CN101640982 A CN 101640982A
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- Prior art keywords
- thermal cutoffs
- terminal
- substrate installation
- terminal table
- soldering
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- Coupling Device And Connection With Printed Circuit (AREA)
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Abstract
The invention provides a terminal table for substrate installation and a printed circuit board for the same, wherein the terminal table for substrate installation can not allow soldering of the temperature fuses to the printed circuit board with low cost and damage to the product. The terminal table for substrate installation, which is soldered on the printed circuit boards, is assembled with temperature fuses. In the terminal table for substrate installation, at least one rib in close contact with the printed circuit board is provided on the soldering surface of the terminal table in order toenclose the space accommodating conductive wires of the temperature fuses, or the opening portion is provided close to the conductive wires of the temperature fuses, or the connection pattern betweenthe soldering combination area portion of the temperature fuses and the soldering combination areas portion of the terminal table, even a part of the connection pattern is made into thin and long wires. Furthermore, the plurality of test combination area portion is provided on patterns on both ends of the temperature fuses.
Description
Technical field
[0001] the present invention relates to assemble the terminal table for substrate installation of Thermal Cutoffs, with in the terminal table for substrate installation of this terminal board soldering on printing distributing board, prevent with Thermal Cutoffs on printing distributing board during soldering, be short-circuited the fusing of the Thermal Cutoffs that the heat when preventing because of soldering causes or the technology of deterioration in characteristics or the bridge joint phenomenon because of what the welding slag that produces caused in this brazing operation.
Background technology
[0002] in the terminal table for substrate installation of existing assembling Thermal Cutoffs, as can not be because of the countermeasure of the heat fusing-off temperature fuse of soldering, there has been lead on the good contactor of exothermicity, to connect with Thermal Cutoffs, (for example, with reference to the patent documentations 1) such as examples of this contactor of soldering.
In addition, as the countermeasure of the bridge joint that causes because of soldering, had will be used for preventing the rib that the soldering of flowing is crossed over from the solder of parts through hole be arranged on through hole near example (for example, with reference to patent documentation 2).
[0003]
Patent documentation 1: TOHKEMY 2002-246081 communique ([0006] section, [0009] section, [0010] section, Fig. 1)
Patent documentation 2: Japanese kokai publication hei 11-18935 communique ([0009] section, [0032] section, Fig. 5)
Summary of the invention
Invent problem to be solved
[0004] in the terminal table for substrate installation of having assembled Thermal Cutoffs, in order to make Thermal Cutoffs can not fuse, in above-mentioned conventional example, the exothermicity contactor need be set newly because of the heat of soldering, it is complicated that structure becomes, and existing because of number of components also increases the problem that makes cost up.
In addition, method as the lead of direct brazing temperature fuse has following method: with terminal table for substrate installation after having carried out mobile soldering and cooling on the printing distributing board, Thermal Cutoffs is installed on the terminal table for substrate installation, when making heat release member etc. and the lead of this Thermal Cutoffs contact, come the brazing temperature fuse by flatiron, take off the heat release member then.But, in order to carry out iron soldering, printing distributing board need be turned over and carry out soldering, at this moment exist generation and can drip solder from the Thermal Cutoffs installing hole of printing distributing board, this welding slag moves because of vibration, makes the danger of undesirable condition such as short circuit each other between the different poles of electronic loop.
In addition, under the situation of welding slag elongation, also exist the danger of bridge joint between the terminal of the lead of Thermal Cutoffs and terminal board.
Therefore, though need this countermeasure, but in above-mentioned conventional example, be to tackle by the mobile soldering of using resin to adorn substrate outward, exist following problem: because resin is adorned substrate outward is special substrate, thus the cost height, and because by the soldering reply of flowing, so the manual soldering for substrate being turned over carrying out can not obtain good effect.
[0005] the present invention makes in order to solve above-mentioned problem, its purpose is, obtain the Thermal Cutoffs brazing operation and can not damage product quality, can be with the terminal table for substrate installation of low cost realization, its second purpose is, is prevented the printing distributing board of the undesirable condition that conducts heat to Thermal Cutoffs.
In order to solve the means of problem
[0006] in terminal table for substrate installation of the present invention, assembled Thermal Cutoffs, and with this terminal board soldering on printing distributing board, it is characterized in that, to be arranged on the faying face of terminal board with the rib that printing distributing board closely contacts, so that surround the space of the lead that contains Thermal Cutoffs.In addition, printing distributing board of the present invention, can by soldering on the terminal board of assembling Thermal Cutoffs, it is characterized in that, the connection pattern between the soldering bonding area part of the soldering bonding area part of Thermal Cutoffs and terminal board and even its part are made thin, long distribution.In addition, have a plurality of tests land is separately positioned on feature on the pattern at two ends of Thermal Cutoffs.
The effect of invention
[0007] terminal table for substrate installation of the present invention, constitute like that by above-mentioned, can prevent when manual brazing temperature fuse, flow out between the solder face from the solder of Thermal Cutoffs installing hole drippage from terminal board and the part side of printing distributing board, undesirable condition such as prevent from other electronic loop, to be short-circuited, in addition, printing distributing board of the present invention, heat conduction when making soldering descends, and has the effect that prevents hot undesirable condition.
Description of drawings
[0020]
Fig. 1 is the assembly drawing of terminal table for substrate installation in the embodiments of the present invention 1 and Thermal Cutoffs, printing distributing board.
Fig. 2 is the vertical view that faying face that the terminal table for substrate installation from embodiments of the present invention 1 contacts with the part side of printing distributing board is seen.
Fig. 3 is the cutaway view of the A-A line of the Fig. 1 in the embodiments of the present invention 1.
Fig. 4 is the vertical view that faying face that the terminal table for substrate installation from embodiments of the present invention 2 contacts with the part side of printing distributing board is seen.
Fig. 5 is the cutaway view of the A-A line of the Fig. 1 in the embodiments of the present invention 2.
Fig. 6 Fig. 1 is the assembly drawing of terminal table for substrate installation in the embodiments of the present invention 3 and Thermal Cutoffs, printing distributing board.
Fig. 7 is the cutaway view of the B-B line of the Fig. 6 in the embodiments of the present invention 3.
Fig. 8 is the vertical view that the faying face of terminal table for substrate installation from embodiments of the present invention 4 and Thermal Cutoffs, printing distributing board is seen.
Fig. 9 is the vertical view that the faying face of terminal table for substrate installation from embodiments of the present invention 5 and Thermal Cutoffs, printing distributing board is seen.
Symbol description
[0021]
1: terminal table for substrate installation 2: inside and outside connection electric wire insertion holes 3: metallic terminal 4: printing distributing board 5: terminal installing hole 6: terminal is used land 7: solder 8: pattern 9: Thermal Cutoffs 10: recess 11: the lead 12 of Thermal Cutoffs: Thermal Cutoffs installing hole 13: Thermal Cutoffs is used land 14: solder 15: space 16: rib 17: second rib 18: space 19: opening portion 20: pattern 21: the test land
Embodiment
[0008] execution mode 1
Fig. 1 is the assembly drawing of terminal table for substrate installation in the embodiments of the present invention 1 and Thermal Cutoffs, printing distributing board, (a) is front view, (b) is left view, (c) is right view, (d) is vertical view, (e) is upward view.Fig. 2 is the vertical view of seeing from the faying face that terminal table for substrate installation contacts with printing distributing board, and Fig. 3 is the cutaway view of the A-A line of Fig. 1.In addition, each figure is defined to for the sketch map at present embodiment 1 needed position is described.
In the drawings, terminal table for substrate installation 1 is to be used to be electrically connected between indoor set at air conditioner, the off-premises station, and the parts of the inside and outside connection electric wire (not shown) of mutual electric power supply or communication etc. are carried out in connection, should inside and outside connect electric wire and insert from electric wire insertion holes 2, metallic terminal 3 by terminal table for substrate installation 1 inside or spring etc. carry out connection electric, machinery.This metallic terminal 3 and then be inserted in the installing hole 5 of printing distributing board 4 carries out soldering with land 6 by solder 7 with the terminal that is arranged on around it, and has carried out electric, mechanical connection.This terminal is being connected through (not shown) such as the electronic loop of pattern 8 and air conditioner or power supplys with land 6.In addition, the also double as required TAB terminal of doing of metallic terminal 3 is being connected by (not shown) such as the electronic loop of flat pattern terminal etc. and air conditioner or power supplys.
[0009] at this, if because inside and outside connection electric wire makes the contact resistance with metallic terminal 3 or spring etc. become big to the insertion deficiency of terminal table for substrate installation 1 etc., then the heating that is caused by this contact resistance also becomes big, also exist and cause the possibility of smoldering and catching fire, in order to prevent their generation, Thermal Cutoffs 9 is installed on the recess 10 that is arranged on the terminal board 1.In addition, the lead 11 of Thermal Cutoffs is after by bending, come out with installing hole 12 from the Thermal Cutoffs of printing distributing board 4, carry out soldering with land 13 by solder 14 with the Thermal Cutoffs that is arranged on around it, be connected with the electronic loop of land 6 or air conditioner etc. through the terminal of pattern 8 and the metallic terminal 3 of terminal board.At this, by with Thermal Cutoffs 9 to the recess 10 of the opposition side of the solder face of terminal table for substrate installation 1 on install, have the temperature that can suppress the Thermal Cutoffs itself that the heat because of solder causes and rise, simultaneously, Thermal Cutoffs is changed the operation easy advantage that becomes.
In addition, between the part side of near approaching solder face of the printing distributing board lead 11 terminal table for substrate installation 1 and Thermal Cutoffs or the metallic terminal 34 and printing distributing board 4, be provided with space 15, the rib 16 that closely contacts with printing distributing board 4 is set on the solder face of terminal table for substrate installation 1, so that stop up the opening portion in this space.At this, the solder face of terminal table for substrate installation 1 and the part side of printing distributing board 4 are not provided with space 15 in intimate contact, are for the gas that produces when the soldering being discharged easily thus, braze ability being improved.
[0010] below assemble method is described.
In above-mentioned structure, at first terminal table for substrate installation 1 is soldered on the printing distributing board 4 by mobile soldering, after cooling, Thermal Cutoffs 9 is inserted in the recess 10 of terminal table for substrate installation 1, simultaneously, the lead 11 of Thermal Cutoffs is inserted with installing hole 12 to the Thermal Cutoffs of printing distributing board 4, after it is turned over, the lead 11 of Thermal Cutoffs and the Thermal Cutoffs of printing distributing board 4 are carried out soldering with land 13 by flatiron.At this moment, even solder 14 is from Thermal Cutoffs drops onto space 15 between the solder face of the part side of printing distributing board 4 and terminal table for substrate installation 1 with installing hole 12, because there is rib 16,, can prevent that therefore solder flows out here beyond space 15 so do not lead to outside opening portion.
[0011] as mentioned above, by being arranged on the solder face of terminal table for substrate installation 1 with the rib 16 that printing distributing board 4 closely contacts, so that surround the space of the lead 11 that contains Thermal Cutoffs, can prevent from Thermal Cutoffs with the solder of installing hole 12 drippage from by the part side of the solder face of terminal table for substrate installation 1, printing distributing board 4 and rib 16 round the space flow out, can prevent the generation of the undesirable conditions such as short circuit that the solder by drippage causes.In addition, in the present embodiment, rib has been made the shape of linearity, as long as but become the structure that the peristome with the space of the part side of the solder face of terminal table for substrate installation 1 and printing distributing board 4 stops up, even other shape also can.In addition, the shape of the Thermal Cutoffs among the figure is an example, also can be the radial Thermal Cutoffs that waits other shapes.In addition, the electric wire fixing means of terminal board has adopted the speed knot mode of using spring, but also can be to use the threaded connection mode of screw.In addition, the configuration position of rib is arranged in the present embodiment on the one side between the terminal of Thermal Cutoffs 9 and terminal table for substrate installation 1, but also can be configured between terminal and the opening portion, perhaps correspondingly is configured on a plurality of limits with peristome.
[0012] execution mode 2
Below execution mode 2 is described.
Fig. 4 is the vertical view of the solder face of terminal table for substrate installation.Fig. 5 is the cutaway view of the A-A line of the Fig. 1 in the execution mode 2.In addition, for the cutaway view of A-A line, present embodiment 2 is also roughly the same with execution mode 1.In addition, each figure is to be defined in for the sketch map at execution mode 2 needed positions is described.
In the drawings, will be arranged on the second rib 17 that the part side of printing distributing board 4 closely contact Thermal Cutoffs lead 11 near so that the lead 11 of encirclement Thermal Cutoffs.Its result, formed by the part side of solder face, second rib 17 and the printing distributing board 4 of terminal table for substrate installation 1 round space 18.
[0013] as mentioned above, near the lead 11 by second rib being arranged on Thermal Cutoffs, by the iron soldering Thermal Cutoffs time, even more than the amount of the solder that drips and under the situation of elongation, by guaranteeing the distance between first rib 16 and the second rib 17, can prevent between the Thermal Cutoffs lead or and terminal between be short-circuited or the insulation distance deficiency.
In addition, second rib 17 is set by the mode of surrounding fully with lead 11 with Thermal Cutoffs, can prevent the solder that drips from by this rib round the space flow out.
In addition, in present embodiment 2, mode with the lead periphery that surrounds Thermal Cutoffs fully is provided with second rib 17, even but a part of rib ground is not set surrounds fully, the continuation that also has the solder that can suppress to drip forms or limits the effect that it continues to form direction.In addition, even only merely nearby being set, the rib of linearity also produces effect.In addition, second rib 17 also can correspondingly be provided with more than two with needs.In addition, second rib 17 the position is set, both can be more closely from installing hole, also can be far.
[0014] execution mode 3
The following describes execution mode 3.
Fig. 6 is the assembly drawing of terminal table for substrate installation in the embodiments of the present invention 3 and Thermal Cutoffs, printing distributing board, (a) is front view, (b) is left view, (c) is that right view, (d) are vertical views, (e) upward view.Fig. 7 is the cutaway view of the B-B line of Fig. 6.In addition, each figure is the sketch map that is defined to for the needed position that present embodiment 3 is described.
In the drawings, opening portion 19 is arranged near the lead 11 of Thermal Cutoffs of terminal table for substrate installation 1.
The shape of the opening portion 19 among the figure is examples, as long as be consistent with the heat release member, just can make alteration of form become the shape of solid figure, shape cylindraceous etc., also can make its size change over size arbitrarily in addition.As the example of heat release member, have by clamping metal holder that lead contacts or by being placed on metallic of contacting on the lead etc.
[0015] as mentioned above, near the lead 11 of the Thermal Cutoffs by opening portion 19 being arranged on terminal table for substrate installation 1, can more easily contact the heat release member when not having opening portion 19, the temperature of the Thermal Cutoffs in the time of can suppressing the lead 11 of brazing temperature fuse itself rises.The shape of opening portion 19 can be selected the shape of solid figure, shape cylindraceous, and its size can be selected arbitrarily.
[0016] execution mode 4
Below execution mode 4 is described.
Fig. 8 is the vertical view that the solder face of terminal table for substrate installation 1 from embodiments of the present invention 4 and Thermal Cutoffs, printing distributing board is seen.In addition, this figure is the sketch map that is defined to for the needed position that present embodiment 4 is described.
In the drawings, make elongated distribution with being connected the land 13 of lead 11 of Thermal Cutoffs and the terminal of metallic terminal 3 with the part of the pattern between the land 6 20.
Usually, as the parts installing hole of printing distributing board through hole and non through hole are arranged, but in non through hole, parts will be only fixed by the solder of the solder face side of printing distributing board.Therefore, the means that improve as the intensity that is used to make soldering portion, sometimes after the soldering of flowing, append solder by flatiron fusing solder, if but the terminal to metal terminal 3 is implemented this operation with land 6 in present embodiment 4, the temperature that then is configured in the soldering land of the Thermal Cutoffs 9 on the same pattern 20 also rises.
[0017] as in the present embodiment 4, make elongated distribution by the part that will be connected the pattern between Thermal Cutoffs and the terminal, can be when being undertaken on terminal, appending the operation of solder by flatiron fusing solder, heat conduction to Thermal Cutoffs soldering portion is reduced, its result, compare with the pattern of common distribution, the temperature that also can suppress Thermal Cutoffs itself rises, and can prevent Thermal Cutoffs fusing.In addition, in present embodiment 4, be that a part that is connected the pattern between Thermal Cutoffs and the terminal is made elongated distribution, but much less, also all be resultful even make in thin or long any one.In addition, thin more long-acting more fruit is big more, and is corresponding with the pattern etc. of value of current flowing on its pattern, periphery, and by making thinner, longer distribution, it is big that effect becomes.
[0018] execution mode 5
Below execution mode 5 is described.
Fig. 9 is the vertical view that the solder face of terminal table for substrate installation 1 from embodiments of the present invention 5 and Thermal Cutoffs, printing distributing board is seen.In addition, figure is the sketch map that is defined to for the needed position that present embodiment 5 is described.
In the drawings, respectively the test land 21 at two positions is arranged on the Thermal Cutoffs at two ends of Thermal Cutoffs 9 with near the land 13.
[0019] as in the present embodiment 5, by respectively the test land 21 at two positions being arranged on the two ends of Thermal Cutoffs, whether the D.C. resistance of can enough 4 terminal methods easily measuring Thermal Cutoffs, the characteristic that can measure Thermal Cutoffs be because of the heat deterioration of soldering.In addition, the quantity of test land 21 also can be respectively more than two, even be one respectively, so long as it is just passable that the size of two test plugs can be installed.
Claims (5)
1. terminal table for substrate installation, described terminal table for substrate installation has been assembled Thermal Cutoffs, and by soldering on printing distributing board, it is characterized in that, to be arranged on the faying face of terminal board with the rib that printing distributing board closely contacts, so that surround the space of the lead that contains Thermal Cutoffs.
2. terminal table for substrate installation as claimed in claim 1 is characterized in that, will be arranged on the second rib that printing distributing board closely contacts near the lead of Thermal Cutoffs of faying face of terminal board.
3. terminal table for substrate installation, described terminal table for substrate installation has been assembled Thermal Cutoffs, and by soldering on printing distributing board, it is characterized in that, the opening portion is arranged near the lead of Thermal Cutoffs.
4. printing distributing board, described printing distributing board by soldering the assembling Thermal Cutoffs terminal board on, it is characterized in that, the connection pattern between the soldering bonding area part of the soldering bonding area part of Thermal Cutoffs and terminal board and even the part of this connection pattern are made distribution thin or distance.
5. printing distributing board, described printing distributing board, be is characterized in that on the terminal board of assembling Thermal Cutoffs by soldering, respectively a plurality of tests land is arranged on the pattern at two ends of Thermal Cutoffs.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008196001 | 2008-07-30 | ||
| JP2008196001A JP4785895B2 (en) | 2008-07-30 | 2008-07-30 | Board mounted terminal block and assembly including the board mounted terminal block |
| JP2008-196001 | 2008-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101640982A true CN101640982A (en) | 2010-02-03 |
| CN101640982B CN101640982B (en) | 2011-09-28 |
Family
ID=41615679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100035993A Active CN101640982B (en) | 2008-07-30 | 2009-01-20 | Terminal table for substrate installation and printed circuit board for the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4785895B2 (en) |
| CN (1) | CN101640982B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61121778U (en) * | 1985-01-16 | 1986-07-31 | ||
| JPS6382382U (en) * | 1986-11-19 | 1988-05-30 | ||
| JPS63150474U (en) * | 1987-03-25 | 1988-10-04 | ||
| JP2000100504A (en) * | 1998-09-21 | 2000-04-07 | Brother Ind Ltd | Connector and printed wiring board |
| JP3732097B2 (en) * | 2001-02-15 | 2006-01-05 | Ｓｍｋ株式会社 | Terminal block with thermal fuse connection contact |
| JP2006079866A (en) * | 2004-09-08 | 2006-03-23 | Smk Corp | Terminal block with temperature fuse |
-
2008
- 2008-07-30 JP JP2008196001A patent/JP4785895B2/en not_active Expired - Fee Related
-
2009
- 2009-01-20 CN CN2009100035993A patent/CN101640982B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101640982B (en) | 2011-09-28 |
| JP2010033933A (en) | 2010-02-12 |
| JP4785895B2 (en) | 2011-10-05 |
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| C14 | Grant of patent or utility model | ||
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