JP2010030089A - Wire saw cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wire saw cutting device effectively removing and recovering cutting powder generated in cutting work. <P>SOLUTION: The wire saw cutting device 1 includes an endless cutting wire 10, a driving pulley 20, a sending side guide pulley 30, a return side guide pulley 40, and tension pulleys 50a, 50b serving as auxiliary pulleys for adjusting the tension of the cutting wire 10. A pulley cover 100 is provided to the sending side guide pulley 30 for surrounding it. The wire saw cutting device includes: a vacuum pump 200 for sucking cutting powder separated from a discharge nozzle 104 of the pulley cover 100; and a drain tank 300 for storing water separated by filtering the cutting powder and circulating the water to the pulley cover 100. The sucked cutting powder is introduced into the drain tank 300 and filtered in the tank, and the filtrate is returned to a cooling water supply nozzle of the pulley cover 100 from the drain tank 300. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wire saw cutting device used for cutting various concrete structures, stones and the like. Specifically, the present invention relates to a wire saw cutting device that efficiently removes and collects chips generated by the progress of cutting.

  Cutting of walls, floors or ceilings of buildings such as buildings, subways or underground malls, piers, dikes or other plants and other concrete structures (including reinforced concrete), concrete products including secondary concrete products such as fume pipes, stones, etc. Conventionally, a wire saw cutting device has been used as the device.

  FIG. 6 shows the appearance of a general wire saw cutting device. The wire saw cutting device 1 ′ is fixed on a cutting target W such as a concrete structure, and is used in a state where an endless cutting wire 10 is stretched over the cutting target W. When the wire drive pulley 20 is rotated in this state, the cutting wire 10 circulates and the concrete structure W is cut. In the wire saw cutting device, the feed-side guide pulley 30 for guiding the intrusion position of the cutting wire 10 with respect to the cutting object W and the cutting wire 10 coming out of the cutting object W to the drive pulley 20 In general, a return guide pulley 40 for guiding is installed. Further, in the wire saw cutting apparatus of FIG. 6, an auxiliary pulley (tension pulley) 50 is installed for eliminating looseness of the cutting wire 10 caused by the progress of cutting and continuing to apply tension to the wire.

  By the way, in the cutting work by the wire saw cutting device, in order to cool the cutting wire heated by friction with the cutting object, the work is often performed by supplying water to the cutting portion of the cutting object W, and therefore Requires a large amount of water. In addition, sludge-like discharged matter kneaded with the supplied water and the chips discharged at the time of cutting scatters around and contaminates the surroundings. From these, when working by simply supplying cooling water, there was a problem of time-consuming curing for securing a large amount of water and preventing contamination.

Regarding the problem of the supply of the cooling water, a method has been proposed that enables a cutting operation while reducing the supply amount of the cooling water. In Patent Document 1, the cut end of the object to be cut is covered and sealed, and the chips discharged from the cut end on the return side of the cutting wire are suctioned and removed by the vacuum means, and then the cooling water is removed from the cutting wire. A wire saw device for spraying and spraying is described.
Japanese Patent No. 3894910

  In the above prior art, vacuum suction of the chips is effective in removing the chips discharged and scattered from the cut end of the cutting object. However, the chips generated from the object to be cut often scatter as dust and are often fixed to the cutting wire. In this regard, the cutting wire is an abrasive with numerous irregularities on the surface, and the cutting wire is easy to adhere to it, and the cutting wire at the time of working is in the object to be cut at a high speed (several 10 to 100 km / h). The adhering chips are firmly attached to the cutting wire and cannot be easily removed. If the chips adhering to the cutting wire are not collected, the amount of the chips scattered increases, and there is a problem that the cutting ability of the wire is lowered as well as not being able to catch up by suction. About the removal and collection | recovery of the chips adhering to such a cutting wire, the said prior art can hardly respond.

  Moreover, in the said prior art, although cooling water is sprayed and sprayed to the wire for a cutting | disconnection, when cooling water is sprayed on the wire which circulates at high speed as above-mentioned, since water will scatter around, this was considered. Since curing is required, it does not reduce the burden of cutting work.

  Therefore, the present invention provides a wire saw cutting device that can collect chips generated during a cutting operation, in particular, can effectively remove and collect chips attached to a cutting wire. In the present invention, it is assumed that the amount of cooling water supplied to the cutting wire is reduced.

  The present invention that solves the above-mentioned problems includes an endless cutting wire that is used in a state of being stretched over a cutting object, a driving pulley that provides power to the cutting wire, and a cutting that is biased by the driving pulley. A feed-side guide pulley that guides the cutting wire to the cutting object, a return-side guide pulley that guides the cutting wire that has come out of the cutting object in the direction of the drive pulley, and the feed-side guide pulley and the return-side guide pulley A wire saw cutting device comprising at least one auxiliary pulley to be installed, comprising a pulley cover surrounding either the feed-side guide pulley or the auxiliary pulley, and the pulley cover entering the cutting wire Before the pulley surrounded by the pulley cover comes into contact with the water supply means for keeping the pulley in a water retaining state, Each piece of pulley is arranged so that the angle formed by the cutting wire before and after contacting with the pulley surrounded by the pulley cover is less than 180 °, and the pulley in the water retaining state adheres to the cutting wire. A wire saw cutting device characterized in that the wire saw is wetted and peeled off.

  In the present invention, as a method of supplying cooling water to the cutting wire, water is not sprayed directly onto the wire as in the above-described prior art, but water is supplied to a pulley (guide pulley, auxiliary pulley) in contact with the wire. The water is supplied to the surface of the pulley, particularly in a groove portion that contacts the wire (water retaining state), thereby supplying water to the wire. In this way, water is supplied via a pulley that rotates at high speed, and the cutting wire is quickly wetted and cooled while using the impact and friction at the time of contact with the pulley to wet the attached chips. be able to. The moistening of the chips is also performed on the chips adhering to the wire, and the chips kneaded with water are in a sludge form (or slurry form) and can be easily removed.

  And in this invention, each pulley is installed so that the angle which the wire for cutting before and behind which contacts with the pulley of a water retention state makes may be less than 180 degrees. By doing in this way, sludge or slurry-like chips can be easily peeled off from the wire. FIG. 1 illustrates this action. As shown in the figure, the angle formed by the cutting wire before and after contacting the feed-side guide pulley is less than 180 °, so that the cutting wire is bent and its traveling direction is changed. The changing force (f) acts, and sludge-like chips are easily peeled off by the bending of the cutting wire. In this respect, as shown in the lower figure of FIG. 1, when the angle formed by the cutting wire before and after contacting the feed guide pulley is 180 °, the chip is not sufficiently peeled off and remains on the cutting wire as it is. Will increase. The advancing angle of the cutting wire can be adjusted by the position of the pulley installed before and after the pulley that wets the cutting wire.

  In the present invention, the auxiliary pulley or the feed-side guide pulley is provided with a cover surrounding the auxiliary pulley or the feed-side guide pulley. In the water supply to the cutting wire via the pulley, although there is little scattering of water to the surroundings, there is no reason It is not. Moreover, since it is thought that there is some scattering of the sludge-like chips, it is a cover for preventing these scattering. Further, by installing the cover, it is possible to install a water supply means and a chip collection means, which will be described later, on the cover, and it is possible to easily assemble the apparatus during operation by integrating the constituent members.

  In the present invention, the collecting means for collecting wet chips generated inside the pulley cover, the water separating means for separating water from the chips collected by the collecting means, and the water separating means It is preferable to have a circulation means for supplying the water to the water supply means of the cover.

  As described above, the wet swarf is peeled off from the cutting wire and falls, but if left as it is, it will accumulate in the pulley cover, so there is no need to install means for collecting the swarf. preferable. The recovered chips contain water, but the separation of this water is relatively easy, and the separated water can be reused as cooling water. Therefore, it is preferable to install a means for separating the collected chips and a means for circulating water. These additional devices include, for example, a suction machine for sucking the inside of the pulley cover and a pipe therefor, and a tank provided with a filtration mechanism is provided in the pipe, and the collected recovered water is supplied to the water supply to the pulley cover. It may be possible to install a pump for feeding liquid.

  In the present invention, it is preferable that the return side guide pulley is provided with a dust suction cover that surrounds the return guide pulley, and further a suction means for sucking dust generated inside the dust suction cover is provided. This is to purify the on-site atmosphere by sucking and removing the chips wound up by the cutting wire from the cutting object.

  The wire saw cutting device according to the present invention is characterized in that a pulley cover is provided on the feeding side, auxiliary pulley or return side guide pulley described above, and a dust absorbing cover is installed on the return side guide pulley as necessary. Other portions are not particularly limited, and a conventional wire saw cutting device can be applied. That is, the number of auxiliary pulleys other than the structure of the cutting wire, the drive pulley, etc., and the sending side and return side pulleys is not particularly limited. In addition, the constituent members such as the drive pulley, the feed side, and the return side guide pulley are not necessarily connected and integrated with one support column, and may be separately fixed to the object to be cut.

  It is particularly preferable to install the pulley cover on the feed side guide pulley. The feed-side guide pulley is located at a low position close to the object to be cut, and it is easy to collect chips, and the pump's ability (lift) to be used as a circulation means for circulating water separated from the chips. This is because it can be suppressed.

  According to the present invention described above, the chips adhering to the cutting wire can be efficiently removed and the cutting operation can be continued stably.

  Hereinafter, a preferred embodiment of a wire saw cutting device according to the present invention (hereinafter, simply referred to as “device”) will be described with reference to the drawings.

  FIG. 2 shows a wire saw cutting device according to this embodiment. In FIG. 2, the wire saw cutting device 1 includes an endless cutting wire 10, a drive pulley 20, a feed side guide pulley 30, and a return side guide pulley 40. In this embodiment, tension pulleys 50a and 50b, which are auxiliary pulleys for adjusting the tension of the cutting wire 10 as the cutting operation progresses, are provided. These members are attached to the column 60 via brackets 61 and 62, and the column 60 is fixed to the cutting object W via the base 70. The cutting wire 10 is hung on the drive pulley 20, the feed side guide pulley 30, the return side guide pulley 40, and the tension pulleys 50 a and 50 b to cut the cutting object W. In this embodiment, the guide pulley 30 is a feed-side guide pulley and the guide pulley 40 is a return-side guide pulley. The function of these guide pulleys (whether the feed side or the return side) is cut off. It can be changed by switching the traveling direction of the cutting wire (rotation direction of the drive pulley) according to the situation at the site, and the pulley cover is arranged accordingly.

  Further, in the installation of the feed side guide pulley 30 of the wire saw cutting device 1, the angle formed by the cutting wire 10 before and after contacting the feed side guide pulley 30 is less than 180 °. As an angle adjustment method, the angle is adjusted according to the fixed position of the feed pulley. FIG. 3 shows a fixing structure of the feed pulley. The feed pulley 30 is installed by inserting the holder 63 into the bracket 61 and fixing it, fixing the feed pulley 30 directly to the holder 63 (FIG. 3A), and holding the holder 63 as required. Further, the adapter 64 fixed in step (b) in FIG. 3 is used. The position of the feed-side pulley 30 is adjusted by sliding the holder 62 and is fixed by a bolt 65 on the back surface.

  The wire saw cutting device 1 includes a pulley cover 100 that surrounds the feed-side guide pulley 30. FIG. 4 is a diagram illustrating the pulley cover. The pulley cover 100 is a polygonal container that surrounds the feed-side guide pulley 30, and includes a main body 101 and a lid body 102, and slits for entering and exiting a cutting wire are formed in the upper and lower parts of the main body 101. It has been. Further, a cooling water supply nozzle 103 for supplying cooling water to the feed-side guide pulley 30 is installed, and a discharge nozzle 104 for sucking the separated chips is connected. The pulley cover 100 covers and fixes the lid 102 during the cutting operation, and prevents splashing of water and chips to the outside.

  Moreover, the wire saw cutting device 1 accommodates water separated by filtering the vacuum pump 200 for sucking the chips from the discharge nozzle 104 of the pulley cover 100 and filtering the chips, and the water is supplied to the pulley cover 100. A drainage tank 300 for circulation is provided. FIG. 5 is a diagram for explaining in detail the configuration of the pulley cover 100, the vacuum pump 200, and the drainage tank 300. The suction of the chips in the pulley cover 100 is performed by reducing the pressure in the drainage tank connected via the discharge nozzle 104 by the vacuum pump 300. Then, the sucked chips are introduced into the drain tank 300 and filtered by the filter paper 301 in the tank. The chips from which water has been separated by filtration remain in the form of a cake on the filter paper. The filtered water is stored in the drain tank 300 and returned to the cooling water supply nozzle 103 of the pulley cover 100 by the circulation pump 302 in the tank. As described above, the amount of use can be limited by circulating the cooling water.

  On the other hand, a dust suction cover 400 is installed on the return side guide pulley 40. The dust-absorbing cover 400 is a box having an open lower end surface, and the lower end surface is close to the object to be joined W. By doing in this way, the dust which the wire 10 for a cutting rolls up can be removed rapidly. A large vacuum 500 is connected to the dust cover 400, and the inside of the dust cover 400 can be sucked rapidly.

  The operation | movement at the time of the cutting operation | work of such a wire sawing apparatus 1 is demonstrated through the cutting operation | work of the cutting target object W. FIG.

  After the holes H1 and H2 for passing the cutting wire 10 over the cutting object W are opened, the base 20 is installed and fixed on the cutting object W. Then, the guide pulleys 30 and 40 are positioned, and the cutting wire 10 is hooked on the pulleys 20, 30, 40, 50a, and 50b, and is also passed over the object to be cut W. adjust. The wire sawing apparatus 1 is installed as described above.

  After the installation of the wire sawing device 1 is completed, a drive motor (not shown) is operated to rotate the drive pulley 20, and the cutting wire 10 is circulated to start cutting the cutting object W. Further, by moving the tension pulleys 50a, 50b upward, the cutting wire 10 is prevented from being loosened, and the state where tension is applied to the cutting wire 10 is maintained.

  On the other hand, water is stored in the drain tank 300 in advance. Then, before the rotation of the drive pulley 20 that is the start of the operation of the wire sawing device 1 is started, the circulation pump 302 and the vacuum pump 200 are operated to start the water circulation around the feed-side guide pulley. The operation of the circulation pump 302 and the vacuum pump 200 may be started by starting the rotation of the drive pulley 20, but it is preferable to start the operation in advance so that the chips can be removed immediately after the start of the cutting operation.

  Further, it is preferable that the suction cover 400 on the return side guide pulley 40 side also starts suction by operating the large vacuum 500 before the rotation of the drive pulley 20 is started.

  As the cutting of the object to be cut W progresses, chips adhere to the surface of the cutting wire 10, but the cutting wire 10 is wetted by the feed-side guide pulley 30 retained in the pulley cover 100, and the chips are removed. It becomes sludge and peels from the wire. Sludge chips are immediately sucked from the discharge nozzle 104 and filtered by the filter paper 301 in the drain tank 300. The filtered water is once stored in the drain tank 300 but circulated by the circulation pump 302.

  In the above-mentioned wire saw cutting device 1, it was possible to work in a state where there was no scattering of chips and cooling water during the cutting operation and there was no clogging due to cutting powder of the cutting wire. Therefore, it was confirmed that the wire saw cutting device 1 is preferable for improving environmental pollution at the cutting site and improving the efficiency of the cutting work.

The figure explaining the peeling state of the facet in a feed side guide pulley. The figure which shows the outline of the wire saw cutting device which concerns on this embodiment. The figure which shows the fixation structure of the feed side guide pulley in the wire saw cutting device which concerns on this embodiment. The figure which shows the external appearance of the pulley cover used by this embodiment. The figure which shows the vacuum pump and drainage tank which are used by this embodiment. The figure which shows the external appearance of the conventional wire saw cutting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wire saw cutting device 10 Wire for cutting 20 Drive pulley 30 Feed side guide pulley 40 Return side guide pulley 50a, 50b Tension pulley 60 Post 100 Pulley cover 103 Cooling water supply nozzle 104 Discharge nozzle 200 Vacuum pump 300 Drain tank 301 Filter paper 302 Circulation Pump 400 Dust collection cover 500 Large vacuum W Cutting object

Claims (5)

An endless cutting wire used in a state of being hung over the cutting object, a driving pulley for supplying power to the cutting wire, and a cutting wire biased by the driving pulley are guided to the cutting object. A return-side guide pulley and a return-side guide pulley that guides the cutting wire coming out of the object to be cut in the direction of the drive pulley, and at least one auxiliary pulley installed between the feed-side guide pulley and the return-side guide pulley; In a wire saw cutting device comprising:
A pulley cover surrounding either the feed side guide pulley or the auxiliary pulley;
The pulley cover has water supply means for bringing the pulley into a water retaining state before the cutting wire entering the pulley cover comes into contact with the pulley surrounded by the pulley cover,
Furthermore, each pulley is arranged so that the angle formed by the cutting wire before and after contacting with the pulley surrounded by the pulley cover is less than 180 °, and the pulley in a water retaining state adheres to the cutting wire. A wire saw cutting device characterized in that the chips are wetted and peeled off. The wire saw cutting device according to claim 1, further comprising recovery means for recovering the chips separated inside the pulley cover. The wire according to claim 2, further comprising: a water separation means for separating water from the chips collected by the collection means; and a circulation means for supplying the water separated by the water separation means to the water supply means of the pulley cover. Saw cutting device. The wire saw cutting device according to any one of claims 1 to 3, wherein the pulley cover is provided on the feed side guide pulley. The wire saw cutting device according to any one of claims 1 to 4, further comprising: a dust-absorbing cover that surrounds the return-side guide pulley; and a suction unit that sucks dust generated inside the dust-absorbing cover.

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