JP2010028601A5 - - Google Patents

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Publication number
JP2010028601A5
JP2010028601A5 JP2008189358A JP2008189358A JP2010028601A5 JP 2010028601 A5 JP2010028601 A5 JP 2010028601A5 JP 2008189358 A JP2008189358 A JP 2008189358A JP 2008189358 A JP2008189358 A JP 2008189358A JP 2010028601 A5 JP2010028601 A5 JP 2010028601A5
Authority
JP
Japan
Prior art keywords
ceramic substrate
circuit pattern
connection pads
view
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008189358A
Other languages
English (en)
Japanese (ja)
Other versions
JP5183340B2 (ja
JP2010028601A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008189358A priority Critical patent/JP5183340B2/ja
Priority claimed from JP2008189358A external-priority patent/JP5183340B2/ja
Publication of JP2010028601A publication Critical patent/JP2010028601A/ja
Publication of JP2010028601A5 publication Critical patent/JP2010028601A5/ja
Application granted granted Critical
Publication of JP5183340B2 publication Critical patent/JP5183340B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008189358A 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器 Expired - Fee Related JP5183340B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008189358A JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008189358A JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

Publications (3)

Publication Number Publication Date
JP2010028601A JP2010028601A (ja) 2010-02-04
JP2010028601A5 true JP2010028601A5 (cg-RX-API-DMAC7.html) 2012-07-12
JP5183340B2 JP5183340B2 (ja) 2013-04-17

Family

ID=41733978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008189358A Expired - Fee Related JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

Country Status (1)

Country Link
JP (1) JP5183340B2 (cg-RX-API-DMAC7.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791199B2 (en) 2006-11-22 2010-09-07 Tessera, Inc. Packaged semiconductor chips
US8569876B2 (en) 2006-11-22 2013-10-29 Tessera, Inc. Packaged semiconductor chips with array
US8405196B2 (en) 2007-03-05 2013-03-26 DigitalOptics Corporation Europe Limited Chips having rear contacts connected by through vias to front contacts
US8193615B2 (en) 2007-07-31 2012-06-05 DigitalOptics Corporation Europe Limited Semiconductor packaging process using through silicon vias
US9640437B2 (en) 2010-07-23 2017-05-02 Tessera, Inc. Methods of forming semiconductor elements using micro-abrasive particle stream
US8796135B2 (en) 2010-07-23 2014-08-05 Tessera, Inc. Microelectronic elements with rear contacts connected with via first or via middle structures
US8791575B2 (en) 2010-07-23 2014-07-29 Tessera, Inc. Microelectronic elements having metallic pads overlying vias
US8847380B2 (en) 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
US8610259B2 (en) 2010-09-17 2013-12-17 Tessera, Inc. Multi-function and shielded 3D interconnects
KR101059490B1 (ko) 2010-11-15 2011-08-25 테세라 리써치 엘엘씨 임베드된 트레이스에 의해 구성된 전도성 패드
US8736066B2 (en) 2010-12-02 2014-05-27 Tessera, Inc. Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
US8637968B2 (en) 2010-12-02 2014-01-28 Tessera, Inc. Stacked microelectronic assembly having interposer connecting active chips
US8587126B2 (en) 2010-12-02 2013-11-19 Tessera, Inc. Stacked microelectronic assembly with TSVs formed in stages with plural active chips
US8610264B2 (en) 2010-12-08 2013-12-17 Tessera, Inc. Compliant interconnects in wafers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151627A (ja) * 2000-11-09 2002-05-24 Hitachi Ltd 半導体装置、その製造方法および実装方法
JP2006019455A (ja) * 2004-06-30 2006-01-19 Nec Electronics Corp 半導体装置およびその製造方法
JP2007067173A (ja) * 2005-08-31 2007-03-15 Kyocera Kinseki Corp 電子部品
JP2008072321A (ja) * 2006-09-13 2008-03-27 Tdk Corp 電子部品
JP4328347B2 (ja) * 2006-11-10 2009-09-09 ホシデン株式会社 マイクロホン及びその実装構造

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