JP2010027704A5 - - Google Patents

Download PDF

Info

Publication number
JP2010027704A5
JP2010027704A5 JP2008184564A JP2008184564A JP2010027704A5 JP 2010027704 A5 JP2010027704 A5 JP 2010027704A5 JP 2008184564 A JP2008184564 A JP 2008184564A JP 2008184564 A JP2008184564 A JP 2008184564A JP 2010027704 A5 JP2010027704 A5 JP 2010027704A5
Authority
JP
Japan
Prior art keywords
led element
electrode
diced
chromaticity
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008184564A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010027704A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008184564A priority Critical patent/JP2010027704A/ja
Priority claimed from JP2008184564A external-priority patent/JP2010027704A/ja
Publication of JP2010027704A publication Critical patent/JP2010027704A/ja
Publication of JP2010027704A5 publication Critical patent/JP2010027704A5/ja
Pending legal-status Critical Current

Links

JP2008184564A 2008-07-16 2008-07-16 蛍光体セラミック板を用いた発光装置の製造方法 Pending JP2010027704A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008184564A JP2010027704A (ja) 2008-07-16 2008-07-16 蛍光体セラミック板を用いた発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008184564A JP2010027704A (ja) 2008-07-16 2008-07-16 蛍光体セラミック板を用いた発光装置の製造方法

Publications (2)

Publication Number Publication Date
JP2010027704A JP2010027704A (ja) 2010-02-04
JP2010027704A5 true JP2010027704A5 (https=) 2011-08-04

Family

ID=41733277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008184564A Pending JP2010027704A (ja) 2008-07-16 2008-07-16 蛍光体セラミック板を用いた発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP2010027704A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015254A (ja) 2010-06-30 2012-01-19 Nitto Denko Corp 蛍光体セラミックスおよび発光装置
JP2012039031A (ja) * 2010-08-11 2012-02-23 Nitto Denko Corp 発光装置
EP2620972A4 (en) * 2010-09-26 2014-04-02 Oceans King Lighting Science FIELD EMISSION PLATE, FIELD EMISSION LIGHT SOURCE AND MANUFACTURING METHOD FOR A LIGHT SOURCE
JP5746553B2 (ja) * 2011-04-28 2015-07-08 株式会社東芝 基板加工システム、および基板加工プログラム
WO2014061748A1 (ja) 2012-10-17 2014-04-24 宇部興産株式会社 波長変換部材及びそれを用いた発光装置
US9284485B2 (en) * 2012-11-07 2016-03-15 Rolex Sa Persistent phosphorescent composite material
JP2018010188A (ja) * 2016-07-14 2018-01-18 日本電気硝子株式会社 波長変換部材の製造方法及び波長変換部材群
WO2023229022A1 (ja) * 2022-05-27 2023-11-30 パナソニックＩｐマネジメント株式会社 蛍光体デバイス及び光源モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP2003168711A (ja) * 2001-11-30 2003-06-13 Shin Etsu Handotai Co Ltd キャリア濃度測定方法及びｉｉｉ−ｖ族化合物半導体ウェーハの製造方法
EP1760794B1 (en) * 2004-06-24 2014-01-15 Ube Industries, Ltd. White light emitting diode device
CN101032035A (zh) * 2004-09-28 2007-09-05 皇家飞利浦电子股份有限公司 具有改进转化层的发光器件

Similar Documents

Publication Publication Date Title
JP2010027704A5 (https=)
EP2390917A3 (en) Light emitting device and lighting apparatus
WO2009051178A1 (ja) Ｌｅｄパッケージ基板およびそれを用いたｌｅｄパッケージ
JP2013526075A5 (https=)
EP2466657A3 (en) LED package
TW200746474A (en) Semiconductor device and semiconductor device fabrication method
RU2012147484A (ru) Светоизлучающий прибор и способ его изготовления
JP2009188201A5 (https=)
WO2009005311A3 (en) Light emitting device and method of fabricating the same
EP2372796A3 (en) Light emitting diode package and light unit having the same
JP2013543280A5 (https=)
EP2293332A3 (en) Digital image sensor with curved silicon chip
EP2065948A3 (en) Semiconductor light emitting device and lighting device
EP2093814A3 (en) Light-emitting diode, electronic apparatus, and light-emitting diode manufacturing method
WO2008099933A1 (ja) 半導体パッケージ
EP2711994A3 (en) Light emitting diode
JP2016042449A5 (https=)
WO2007011511A3 (en) Die package with asymmetric leadframe connection
JP2010500779A5 (https=)
EP1804302A3 (en) Light emitting semiconductor device and method for manufacturing the same
EP2071641A3 (en) Light-emitting diode package
TW200627555A (en) Method for wafer level package
EP2466659A3 (en) Wafer substrate bonding structure and light emitting device comprising the same
JP2007208136A5 (https=)
JP2016006821A5 (https=)