JP2010010304A5 - - Google Patents

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Publication number
JP2010010304A5
JP2010010304A5 JP2008166420A JP2008166420A JP2010010304A5 JP 2010010304 A5 JP2010010304 A5 JP 2010010304A5 JP 2008166420 A JP2008166420 A JP 2008166420A JP 2008166420 A JP2008166420 A JP 2008166420A JP 2010010304 A5 JP2010010304 A5 JP 2010010304A5
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JP
Japan
Prior art keywords
processing apparatus
processing
rectifying
porous body
processed
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Application number
JP2008166420A
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Japanese (ja)
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JP5067279B2 (en
JP2010010304A (en
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Priority to JP2008166420A priority Critical patent/JP5067279B2/en
Priority claimed from JP2008166420A external-priority patent/JP5067279B2/en
Priority to TW098121196A priority patent/TW201001607A/en
Priority to KR1020090056499A priority patent/KR101092071B1/en
Priority to CN2009101494883A priority patent/CN101615574B/en
Publication of JP2010010304A publication Critical patent/JP2010010304A/en
Publication of JP2010010304A5 publication Critical patent/JP2010010304A5/ja
Application granted granted Critical
Publication of JP5067279B2 publication Critical patent/JP5067279B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (14)

処理容器の内部に設けられ、被処理体を載置するための載置台と、
被処理体に対して処理を行う処理ガスを前記載置台の上方側から供給するための処理ガス供給手段と、
前記処理容器内の雰囲気を排気するためのガス排気部と、
前記載置台上の被処理体を囲むように設けられた整流部材と、を備え、
前記整流部材の少なくとも処理雰囲気側の表面部は、多孔質体により構成されていることを特徴とする処理装置。 A mounting table provided inside the processing container for mounting the object to be processed;
A processing gas supply means for supplying a processing gas for processing the object to be processed from above the mounting table;
A gas exhaust unit for exhausting the atmosphere in the processing container;
A rectifying member provided so as to surround the object to be processed on the mounting table,
The processing apparatus according to claim 1, wherein at least a surface portion on the processing atmosphere side of the rectifying member is made of a porous body. 前記整流部材は、前記被処理体と前記ガス排気部との間に設けられていることを特徴とする請求項１に記載の処理装置。  The processing apparatus according to claim 1, wherein the rectifying member is provided between the object to be processed and the gas exhaust unit. 前記整流部材は、前記多孔質体よりも強度の大きい支持部材により支持されていることを特徴とする請求項１または２に記載の処理装置。 The rectifying member, the processing apparatus according to claim 1 or 2, characterized in that it is supported by the large supporting member strength than the porous body. 前記整流部材は、多孔質体からなる整流壁を含むことを特徴とする請求項３記載の処理装置。 The processing apparatus according to claim 3 , wherein the rectifying member includes a rectifying wall made of a porous body. 前記支持部材は、前記整流壁の自重を受け止めるように当該整流壁に係合していることを特徴とする請求項４記載の処理装置。 The processing apparatus according to claim 4 , wherein the support member is engaged with the rectifying wall so as to receive the weight of the rectifying wall. 前記整流壁は長さ方向に分割されており、互いに隣接する分割部分同士は多孔質体よりも強度の大きい連結部材により連結され、
この連結部材は、前記整流壁の自重を受け止めるように当該整流壁に係合していることを特徴とする請求項４または５記載の処理装置。 The rectifying wall is divided in the length direction, and the divided parts adjacent to each other are connected by a connecting member having a strength higher than that of the porous body,
The processing apparatus according to claim 4 , wherein the connecting member is engaged with the rectifying wall so as to receive the weight of the rectifying wall. 前記連結部材は、互いに隣接する分割部分同士に跨ってその分割部分の内部に嵌め込まれていることを特徴とする請求項６記載の処理装置。 The processing apparatus according to claim 6 , wherein the connecting member is fitted into the divided parts across the divided parts adjacent to each other. 前記整流部材は、多孔質体よりも強度の大きい本体部分と、この本体部分の処理雰囲気側に配置された多孔質体と、により構成されていることを特徴とする請求項１ないし３のいずれか一つに記載の処理装置。 The rectifying member includes a large body portion of strength than the porous body, any of claims 1 to 3, characterized in that it is configured with a porous body arranged in the processing atmosphere side of the main body portion, by The processing apparatus as described in any one . 前記多孔質体は、前記本体部分から着脱自在に構成されていることを特徴とする請求項８に記載の処理装置。 The processing apparatus according to claim 8 , wherein the porous body is configured to be detachable from the main body portion. 前記多孔質体は、多孔質セラミックスにより構成されていることを特徴とする請求項１ないし９いずれか一つに記載の処理装置。 The porous body, the processing device according to any one of claims 1 to 9, characterized in that it is constituted by a porous ceramic. 前記支持部材は、セラミックスにより構成されていることを特徴とする請求項３ないし７のいずれか一つに記載の処理装置。 The processing apparatus according to claim 3 , wherein the support member is made of ceramics. 前記連結部材は、セラミックスにより構成されていることを特徴とする請求項６または７に記載の処理装置。 The processing apparatus according to claim 6 , wherein the connecting member is made of ceramics. 前記本体部分は、セラミックスにより構成されていることを特徴とする請求項８または９に記載の処理装置。 The processing apparatus according to claim 8 , wherein the main body portion is made of ceramics. 前記支持部材を昇降軸を介して昇降させる昇降機構を備えていることを特徴とする請求項３ないし７、１１及び１２のいずれか一つに記載の処理装置。 The processing apparatus according to claim 3, further comprising an elevating mechanism that elevates and lowers the support member via an elevating shaft.
JP2008166420A 2008-06-25 2008-06-25 Processing equipment Expired - Fee Related JP5067279B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008166420A JP5067279B2 (en) 2008-06-25 2008-06-25 Processing equipment
TW098121196A TW201001607A (en) 2008-06-25 2009-06-24 Treatment apparatus
KR1020090056499A KR101092071B1 (en) 2008-06-25 2009-06-24 Processing apparatus
CN2009101494883A CN101615574B (en) 2008-06-25 2009-06-25 Processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008166420A JP5067279B2 (en) 2008-06-25 2008-06-25 Processing equipment

Publications (3)

Publication Number Publication Date
JP2010010304A JP2010010304A (en) 2010-01-14
JP2010010304A5 true JP2010010304A5 (en) 2011-07-21
JP5067279B2 JP5067279B2 (en) 2012-11-07

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JP2008166420A Expired - Fee Related JP5067279B2 (en) 2008-06-25 2008-06-25 Processing equipment

Country Status (4)

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JP (1) JP5067279B2 (en)
KR (1) KR101092071B1 (en)
CN (1) CN101615574B (en)
TW (1) TW201001607A (en)

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JP5141520B2 (en) * 2008-12-02 2013-02-13 東京エレクトロン株式会社 Plasma processing equipment
JP6368282B2 (en) 2015-06-29 2018-08-01 クアーズテック株式会社 Wafer boat and manufacturing method thereof
CN107808838A (en) * 2017-11-13 2018-03-16 武汉华星光电半导体显示技术有限公司 Drycorrosion apparatus and dry etching method
JP7325256B2 (en) 2019-08-05 2023-08-14 東京エレクトロン株式会社 Plasma processing equipment
CN115682652A (en) * 2021-10-09 2023-02-03 广东聚华印刷显示技术有限公司 Baking equipment and baking method

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JPH1022263A (en) * 1996-06-28 1998-01-23 Sony Corp Plasma etching device
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