JP2009543360A - ボールグリッドアレイ接続システム及び関連方法及びボールソケット - Google Patents
ボールグリッドアレイ接続システム及び関連方法及びボールソケット Download PDFInfo
- Publication number
- JP2009543360A JP2009543360A JP2009518615A JP2009518615A JP2009543360A JP 2009543360 A JP2009543360 A JP 2009543360A JP 2009518615 A JP2009518615 A JP 2009518615A JP 2009518615 A JP2009518615 A JP 2009518615A JP 2009543360 A JP2009543360 A JP 2009543360A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- base
- conductive
- grid array
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
- プリント回路板の上に集積回路パッケージを取り付けるための方法であって、
集積回路パッケージ又はプリント回路板のうちの1つの上に行列パターンに配置されるボールグリッドアレイを形成する複数の伝導性ボールと、その上にボールグリッドアレイを有さないプリント回路板又は集積回路パッケージのそれぞれの他方の上に対応する行列パターンに配置されるそれぞれの複数のボールソケットとを提供するステップを含み、各ボールソケットは、それぞれの集積回路パッケージ又はプリント回路板と係合する側と、伝導性ボールを位置付けるために構成される反対の側とを含み、ベースに固定され且つベースから延び、前記伝導性ボールを前記ベースと接触して受容し且つ保持するよう構成される複数の突起を含み、
1つの側に前記ボールを位置付け且つ板反りを補償するために他の側にはんだをウィッキングすることを助ける各ボールソケットの前記ベースの上に圧痕を形成するステップを含み、
前記集積回路パッケージ、前記プリント回路板、前記伝導性ボール、及び、前記ボールソケットを組立体として一体に相互接続するステップを含む、
方法。 - 実質的に球形円弧に構成され且つ前記伝導性ボールの最大方面地域と係合するような大きさとされるボール係合区画を含むよう、各ボールソケットの突起を形成するステップをさらに含む、請求項1に記載の方法。
- 電鋳技法を使用して前記ボールソケットを形成するステップをさらに含む、請求項1に記載の方法。
- 伝導性接点の行列パターンに配置されるボールグリッドアレイを形成する複数の伝導性ボールを含む集積回路パッケージと、
プリント回路板と、
該プリント回路板の上に対応する行列パターンに配置される複数のボールソケットとを含み、
各ボールソケットは、前記プリント回路板と係合する1つの側と伝導性ボールを位置付けるために構成される反対の側とを有するベースと、伝導性ボールを前記1つの側に位置付け且つ板反りを補償するために前記反対の側にはんだをウィッキングするのを助ける前記ベースの上に形成される圧痕とを含み、前記ベースに固定され且つ前記ベースから延び、前記伝導性ボールを前記ベースト接触して受容し且つ保持するよう構成される複数の突起を含む、
ボールグリッドアレイ接続システム。 - 前記ボールソケットの各突起は、実質的に球形円弧に構成され且つ前記伝導性ボールの最大表面地域と係合するような大きさとされるボール係合区画を含む、請求項4に記載のボールソケット及びボールグリッドアレイ接続システム。
- 各ボールソケットは、超小型電鋳部材を含む、請求項4に記載のボールグリッドアレイ接続システム。
- ボールグリッドアレイのボールを接続するために使用されるボールソケットであって、
プリント回路板を係合するために構成される1つの側と、前記ボールグリッドアレイの伝導性ボールを位置付けるために構成される反対の側とを有するベースを含み、該ベースは、該ベースの上に形成される圧痕をさらに含み、該圧痕は、前記1つの側の上に伝導性ボールを位置付け、且つ、板反りを補償するために前記他の側の上にはんだをウィッキングするのを助け、
前記ベースに固定され且つ前記ベースから延び、前記伝導性ボールを前記ベースと接触して受容し且つ保持するよう構成される複数の突起を含む、
ボールソケット。 - 各突起は、実質的に球形円弧に構成され、前記伝導性ボールの最大表面地域と係合する大きさとされるボール係合区画を含む、請求項7に記載のボールソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/428,902 | 2006-07-06 | ||
US11/428,902 US7695287B2 (en) | 2006-07-06 | 2006-07-06 | Ball grid array (BGA) connection system and related method and ball socket |
PCT/US2007/072758 WO2008005989A1 (en) | 2006-07-06 | 2007-07-03 | Ball grid array (bga) connection system and related method and ball socket |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009543360A true JP2009543360A (ja) | 2009-12-03 |
JP4885273B2 JP4885273B2 (ja) | 2012-02-29 |
Family
ID=38657100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009518615A Expired - Fee Related JP4885273B2 (ja) | 2006-07-06 | 2007-07-03 | ボールグリッドアレイ接続システム及び関連方法及びボールソケット |
Country Status (8)
Country | Link |
---|---|
US (1) | US7695287B2 (ja) |
EP (1) | EP2044821B1 (ja) |
JP (1) | JP4885273B2 (ja) |
KR (1) | KR101040506B1 (ja) |
CN (1) | CN101485238B (ja) |
CA (1) | CA2656639C (ja) |
TW (1) | TWI360928B (ja) |
WO (1) | WO2008005989A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011047650A (ja) * | 2007-12-28 | 2011-03-10 | Alps Electric Co Ltd | プローブカード |
US8449307B2 (en) * | 2011-09-23 | 2013-05-28 | Hon Hai Precision Industry Co., Ltd. | Socket connector having contact with multiple beams jointly grasping ball of IC package |
US8449306B2 (en) * | 2011-09-23 | 2013-05-28 | Hon Hai Precision Industry Co., Ltd. | Contact terminal unit and socket connector incorporated with the same |
US9059240B2 (en) | 2012-06-05 | 2015-06-16 | International Business Machines Corporation | Fixture for shaping a laminate substrate |
US9048245B2 (en) | 2012-06-05 | 2015-06-02 | International Business Machines Corporation | Method for shaping a laminate substrate |
US9129942B2 (en) | 2012-06-05 | 2015-09-08 | International Business Machines Corporation | Method for shaping a laminate substrate |
CN112086780B (zh) | 2014-10-23 | 2022-11-01 | 安费诺富加宜(亚洲)私人有限公司 | 夹层式电连接器 |
CN106363312B (zh) * | 2016-11-23 | 2019-03-08 | 京信通信技术(广州)有限公司 | 焊接基体 |
US10404014B2 (en) | 2017-02-17 | 2019-09-03 | Fci Usa Llc | Stacking electrical connector with reduced crosstalk |
US20180263136A1 (en) * | 2017-03-11 | 2018-09-13 | Microsoft Technology Licensing, Llc | Flexible or rotatable connectors in electronic devices |
CN110800171B (zh) | 2017-04-28 | 2021-11-02 | 富加宜(美国)有限责任公司 | 高频bga连接器 |
WO2018200904A1 (en) | 2017-04-28 | 2018-11-01 | Fci Usa Llc | High frequency bga connector |
US10276539B1 (en) * | 2017-10-30 | 2019-04-30 | Micron Technology, Inc. | Method for 3D ink jet TCB interconnect control |
US10741951B2 (en) | 2017-11-13 | 2020-08-11 | Te Connectivity Corporation | Socket connector assembly for an electronic package |
US11392744B2 (en) * | 2020-10-09 | 2022-07-19 | Dell Products L.P. | Systems and methods for automatically verifying BGA package orientation |
WO2022125921A1 (en) * | 2020-12-11 | 2022-06-16 | Penn Engineering & Manufacturing Corp. | Circuit board fastener assembly |
US11959939B2 (en) | 2021-09-07 | 2024-04-16 | Nanya Technology Corporation | Chip socket, testing fixture and chip testing method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10508417A (ja) * | 1994-09-06 | 1998-08-18 | ザ ウィタカー コーポレーション | ボールグリッドアレーソケット |
JP2000501241A (ja) * | 1995-11-30 | 2000-02-02 | ザ ウィタカー コーポレーション | 電子パッケージ用表面実装型ソケット及びそれに用いられるコンタクト |
JP2000315555A (ja) * | 1999-04-28 | 2000-11-14 | Nec Corp | 半導体パッケージ用ソケット |
JP2001305182A (ja) * | 2000-04-25 | 2001-10-31 | Advantest Corp | Icソケット用コンタクト・icソケット |
JP2005158536A (ja) * | 2003-11-26 | 2005-06-16 | Yamaichi Electronics Co Ltd | ソケットおよび電子部品 |
JP2005156522A (ja) * | 2003-10-27 | 2005-06-16 | Sumitomo Electric Ind Ltd | コンタクトの製造方法とその方法により製造されたコンタクト |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6069481A (en) * | 1995-10-31 | 2000-05-30 | Advantest Corporation | Socket for measuring a ball grid array semiconductor |
US5702255A (en) * | 1995-11-03 | 1997-12-30 | Advanced Interconnections Corporation | Ball grid array socket assembly |
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
US6045416A (en) * | 1996-04-02 | 2000-04-04 | Aries Electronics, Inc. | Universal production ball grid array socket |
US5730606A (en) * | 1996-04-02 | 1998-03-24 | Aries Electronics, Inc. | Universal production ball grid array socket |
US5950072A (en) * | 1997-07-25 | 1999-09-07 | Stmicroelectronics, Inc. | Low-profile removable ball-grid-array integrated circuit package |
JP3252255B2 (ja) | 1997-10-29 | 2002-02-04 | 日本航空電子工業株式会社 | Icソケット |
TW367415B (en) * | 1998-06-18 | 1999-08-21 | United Microelectronics Corp | Test method for ball grid array integrated circuit |
TW437037B (en) * | 1998-09-23 | 2001-05-28 | Wells Cti Inc | Vertically actuated bag socket |
US6155845A (en) * | 1998-12-28 | 2000-12-05 | Hon Hai Precision Ind. Co., Ltd. | Electrical contact for ball grid array socket |
TW385092U (en) * | 1998-12-28 | 2000-03-11 | Hon Hai Prec Ind Co Ltd | Electrical connectors |
US6352437B1 (en) * | 1999-10-20 | 2002-03-05 | John O. Tate | Solder ball terminal |
US6781390B2 (en) * | 2001-07-20 | 2004-08-24 | Nhk Spring Co., Ltd. | Conductive coil contact member |
US6501665B1 (en) * | 2001-08-10 | 2002-12-31 | Lotes Co., Ltd. | Structure of a ball grid array IC mounting seat |
US7021944B2 (en) * | 2001-10-03 | 2006-04-04 | Molex Incorporated | Socket and contact of semiconductor package |
US6702594B2 (en) * | 2001-12-14 | 2004-03-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical contact for retaining solder preform |
TW595811U (en) * | 2002-05-17 | 2004-06-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US6843662B2 (en) * | 2003-03-31 | 2005-01-18 | Ted Ju | Electric connector housing supporting a plurality of solder balls and including a plurality of protruding blocks respectively supporting the plurality of solder balls |
US20050009385A1 (en) * | 2003-06-23 | 2005-01-13 | Korsunsky Iosif R. | Electrical connector having improved contacts |
JP4602649B2 (ja) * | 2003-07-23 | 2010-12-22 | ティーエヌジー コーポレーション リミテッド | 電子部品用ソケット |
TW200401899A (en) * | 2003-08-11 | 2004-02-01 | Speed Tech Corp | Matrix type connector |
US6881074B1 (en) * | 2003-09-29 | 2005-04-19 | Cookson Electronics, Inc. | Electrical circuit assembly with micro-socket |
US7009413B1 (en) * | 2003-10-10 | 2006-03-07 | Qlogic Corporation | System and method for testing ball grid arrays |
US7029292B2 (en) * | 2003-12-16 | 2006-04-18 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and contact |
US7001190B2 (en) * | 2004-04-26 | 2006-02-21 | Tyco Electronics Corporation | Repairable ball grid array contact |
US6955545B1 (en) * | 2004-04-27 | 2005-10-18 | Tyco Electronics Corporation | Two piece ball grid array |
US7442045B1 (en) * | 2007-08-17 | 2008-10-28 | Centipede Systems, Inc. | Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling |
-
2006
- 2006-07-06 US US11/428,902 patent/US7695287B2/en not_active Expired - Fee Related
-
2007
- 2007-07-03 CA CA2656639A patent/CA2656639C/en not_active Expired - Fee Related
- 2007-07-03 EP EP07799288A patent/EP2044821B1/en not_active Expired - Fee Related
- 2007-07-03 WO PCT/US2007/072758 patent/WO2008005989A1/en active Application Filing
- 2007-07-03 JP JP2009518615A patent/JP4885273B2/ja not_active Expired - Fee Related
- 2007-07-03 CN CN2007800255189A patent/CN101485238B/zh not_active Expired - Fee Related
- 2007-07-03 KR KR1020097002420A patent/KR101040506B1/ko not_active IP Right Cessation
- 2007-07-05 TW TW096124512A patent/TWI360928B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10508417A (ja) * | 1994-09-06 | 1998-08-18 | ザ ウィタカー コーポレーション | ボールグリッドアレーソケット |
JP2000501241A (ja) * | 1995-11-30 | 2000-02-02 | ザ ウィタカー コーポレーション | 電子パッケージ用表面実装型ソケット及びそれに用いられるコンタクト |
JP2000315555A (ja) * | 1999-04-28 | 2000-11-14 | Nec Corp | 半導体パッケージ用ソケット |
JP2001305182A (ja) * | 2000-04-25 | 2001-10-31 | Advantest Corp | Icソケット用コンタクト・icソケット |
JP2005156522A (ja) * | 2003-10-27 | 2005-06-16 | Sumitomo Electric Ind Ltd | コンタクトの製造方法とその方法により製造されたコンタクト |
JP2005158536A (ja) * | 2003-11-26 | 2005-06-16 | Yamaichi Electronics Co Ltd | ソケットおよび電子部品 |
Also Published As
Publication number | Publication date |
---|---|
EP2044821B1 (en) | 2011-09-21 |
JP4885273B2 (ja) | 2012-02-29 |
US20080007608A1 (en) | 2008-01-10 |
TW200812164A (en) | 2008-03-01 |
EP2044821A1 (en) | 2009-04-08 |
CA2656639C (en) | 2012-02-21 |
CN101485238B (zh) | 2012-10-31 |
WO2008005989A1 (en) | 2008-01-10 |
CA2656639A1 (en) | 2008-01-10 |
KR20090029286A (ko) | 2009-03-20 |
US7695287B2 (en) | 2010-04-13 |
WO2008005989B1 (en) | 2008-03-06 |
CN101485238A (zh) | 2009-07-15 |
KR101040506B1 (ko) | 2011-06-09 |
TWI360928B (en) | 2012-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4885273B2 (ja) | ボールグリッドアレイ接続システム及び関連方法及びボールソケット | |
KR100408948B1 (ko) | 전자부품을 회로기판에 장착하는 방법 | |
JP3413080B2 (ja) | 高密度コネクタおよび製造方法 | |
JP4540707B2 (ja) | 電子部品および回路基板 | |
US8405229B2 (en) | Electronic package including high density interposer and circuitized substrate assembly utilizing same | |
JP2018174017A (ja) | ソケット | |
US6652290B2 (en) | Connecting devices and method for interconnecting circuit components | |
KR20040068169A (ko) | 볼 그리드 배열 패케이지 | |
US7946856B2 (en) | Connector for interconnecting surface-mount devices and circuit substrates | |
US7484971B2 (en) | Electronic component with high density, low cost attachment | |
JP2018174018A (ja) | ソケット | |
WO2000005936A1 (en) | Hybrid solder ball and pin grid array circuit board interconnect system and method | |
US20080032517A1 (en) | Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments | |
CA2327953C (en) | Electrical connector housing | |
EP1088371B1 (en) | Solder ball terminal | |
US20020061687A1 (en) | Solder bearing grid array | |
US6168976B1 (en) | Socketable BGA package | |
JP2011243457A (ja) | ソケット | |
US7897878B2 (en) | Compliant penetrating packaging interconnect | |
US20100323558A1 (en) | High density connector for interconnecting fine pitch circuit packaging structures | |
JP2004079185A (ja) | コネクタと回路基板との組立体及びコネクタの回路基板へのリフロー半田付け方法 | |
JP2007109459A (ja) | 電子部品用接触端子、電子部品用コネクター及びその製造方法及びその実装方法 | |
JP2000138330A (ja) | 変換モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100819 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100831 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110802 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111027 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111122 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111207 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141216 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |