JP2009542451A5 - - Google Patents

Download PDF

Info

Publication number
JP2009542451A5
JP2009542451A5 JP2009518606A JP2009518606A JP2009542451A5 JP 2009542451 A5 JP2009542451 A5 JP 2009542451A5 JP 2009518606 A JP2009518606 A JP 2009518606A JP 2009518606 A JP2009518606 A JP 2009518606A JP 2009542451 A5 JP2009542451 A5 JP 2009542451A5
Authority
JP
Japan
Prior art keywords
polishing
layer
polishing pad
pad according
light transmissive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009518606A
Other languages
English (en)
Japanese (ja)
Other versions
JP5277163B2 (ja
JP2009542451A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/072690 external-priority patent/WO2008005951A2/en
Publication of JP2009542451A publication Critical patent/JP2009542451A/ja
Publication of JP2009542451A5 publication Critical patent/JP2009542451A5/ja
Application granted granted Critical
Publication of JP5277163B2 publication Critical patent/JP5277163B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009518606A 2006-07-03 2007-07-02 複数の部分を有する窓をもつ研磨パッド Active JP5277163B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81842306P 2006-07-03 2006-07-03
US60/818,423 2006-07-03
PCT/US2007/072690 WO2008005951A2 (en) 2006-07-03 2007-07-02 Polishing pad with window having multiple portions

Publications (3)

Publication Number Publication Date
JP2009542451A JP2009542451A (ja) 2009-12-03
JP2009542451A5 true JP2009542451A5 (https=) 2010-08-12
JP5277163B2 JP5277163B2 (ja) 2013-08-28

Family

ID=38895428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009518606A Active JP5277163B2 (ja) 2006-07-03 2007-07-02 複数の部分を有する窓をもつ研磨パッド

Country Status (4)

Country Link
US (2) US7942724B2 (https=)
JP (1) JP5277163B2 (https=)
TW (1) TWI370039B (https=)
WO (1) WO2008005951A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
TWI521625B (zh) * 2010-07-30 2016-02-11 應用材料股份有限公司 使用光譜監測來偵測層級清除
JP5918254B2 (ja) * 2010-11-18 2016-05-18 キャボット マイクロエレクトロニクス コーポレイション 透過性領域を含む研磨パッド
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
SG11201806662WA (en) * 2016-02-26 2018-09-27 Applied Materials Inc Window in thin polishing pad
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
WO2018045039A1 (en) * 2016-08-31 2018-03-08 Applied Materials, Inc. Polishing system with annular platen or polishing pad
JP7022647B2 (ja) 2018-05-08 2022-02-18 株式会社荏原製作所 光透過性部材、研磨パッドおよび基板研磨装置
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US12275116B2 (en) 2020-12-29 2025-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with window having transparency at low wavelengths and material useful in such window
TWI901193B (zh) * 2023-05-19 2025-10-11 智勝科技股份有限公司 研磨墊及其製造方法以及研磨方法
US20250303515A1 (en) * 2024-03-29 2025-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multifunctional endpoint detection window

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
JP3367496B2 (ja) * 2000-01-20 2003-01-14 株式会社ニコン 研磨体、平坦化装置、半導体デバイス製造方法、および半導体デバイス
WO2000060650A1 (en) * 1999-03-31 2000-10-12 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
KR100858392B1 (ko) 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
JP2003285259A (ja) * 2002-03-28 2003-10-07 Toray Ind Inc 研磨パッド、研磨装置及び半導体デバイスの製造方法
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
WO2005104199A1 (ja) * 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法

Similar Documents

Publication Publication Date Title
JP2009542451A5 (https=)
TW200531788A (en) Method of forming a layered polishing pad
US20140375200A1 (en) Heat insulation door for a refrigerator having 3 dimensional shapes
EP1988575A3 (en) Semiconductor device
JP2009506165A5 (https=)
EP1813658A3 (en) Polishing liquid for barrier layer
WO2008005951A3 (en) Polishing pad with window having multiple portions
WO2008030468A3 (en) Microphotonic waveguide including core/cladding interface layer
DE602005022682D1 (de) Substrat, wie glassubstrat, mit hydrophober oberfläche und verbesserter dauerhaftigkeit hydrophober eigenschaften
SG131023A1 (en) Semiconductor heterostructure and method for forming a semiconductor heterostructure
JP2006005358A5 (https=)
WO2011129959A3 (en) Molding windows in thin pads
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
JP2008517448A5 (https=)
WO2020117431A3 (en) Integrated circuit substrate for containing liquid adhesive bleed-out
JP2024155994A (ja) 車両用モールディング
JP2007526652A5 (https=)
WO2007078686A3 (en) Method of polishing a semiconductor-on-insulator structure
TW200729409A (en) Method for fabricating semiconductor device
EP1845557A3 (en) Bonded wafer and method of producing the same
JP2019116400A (ja) 筐体、電子機器及び筐体の製造方法
WO2006055310A3 (en) Article with patterned layer on surface
TW200713420A (en) Method of fabricating shallow trench isolation structure
JP2010258363A5 (https=)
TWI527707B (zh) 網版印刷用掩模的製備方法及其製備而成的掩模結構