JP2009532899A5 - - Google Patents
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- Publication number
- JP2009532899A5 JP2009532899A5 JP2009504203A JP2009504203A JP2009532899A5 JP 2009532899 A5 JP2009532899 A5 JP 2009532899A5 JP 2009504203 A JP2009504203 A JP 2009504203A JP 2009504203 A JP2009504203 A JP 2009504203A JP 2009532899 A5 JP2009532899 A5 JP 2009532899A5
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- chamber
- chambers
- substrate
- chuck system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000012530 fluid Substances 0.000 claims 102
- 239000000758 substrate Substances 0.000 claims 19
- 238000005452 bending Methods 0.000 claims 2
Claims (20)
第1および第2の対向するサイドを有するチャック本体と、
第1と第2の流体チャンバと流体連通している圧力制御システムと、
を備え、
前記第1のサイドは縦列と横列に配置された前記流体チャンバのアレイを有し、前記流体チャンバのアレイは前記基板の第1部分に重なる前記第1の流体チャンバと、前記基板の第2部分と重なる前記第2の流体チャンバを有し、それぞれの流体チャンバは、間隔をおいて配置される第1と第2の支持区域を定めるための、間隔を置いて配置された第1と第2の凹溝を有し、前記第1の支持区域は前記第2の支持区域と前記第1と第2の凹溝を取り囲み、前記第2の支持区域は前記第2の凹溝を取り囲み、前記基板は前記第1と第2の支持区域に支えら、これらの構成により、前記第1の凹溝とそれに重なる前記基板の一部分が第1のチャンバを決定し、第2の凹溝とそれに重なる前記基板の一部分が第2のチャンバを決定し、それぞれの前記第1のチャンバと、それぞれの前記第2のチャンバは異なる流体ソースに流体連通して前記流体チャンバのアレイの流れを制御し、前記第1の流体チャンバの前記第1のチャンバは真空状態にあり、前記第1の流体チャンバの前記第2のチャンバおよび前記第2の流体チャンバの前記第1と第2のチャンバは異なる圧力下にあることを特徴とするシステム。 A chuck system for holding a first portion of a substrate and simultaneously curving the second portion of the substrate,
A chuck body having first and second opposing sides;
A pressure control system in fluid communication with the first and second fluid chambers;
With
The first side has an array of fluid chambers arranged in columns and rows, the array of fluid chambers overlying the first portion of the substrate and the second portion of the substrate. Said second fluid chambers overlapping each other, each fluid chamber being spaced apart first and second to define spaced apart first and second support areas The first support area surrounds the second support area and the first and second grooves, the second support area surrounds the second groove, The substrate is supported by the first and second support areas. With these configurations, the first groove and the portion of the substrate that overlaps the first groove define the first chamber, and the second groove and the second groove. A portion of the substrate determines a second chamber and each front A first chamber and each of the second chambers is in fluid communication with a different fluid source to control the flow of the array of fluid chambers, and the first chamber of the first fluid chamber is in a vacuum state. The system, wherein the second chamber of the first fluid chamber and the first and second chambers of the second fluid chamber are under different pressures.
第1および第2の対向するサイドを有するチャック本体と、
第1と第2の流体チャンバと流体連通している圧力制御システムと、
を備え、
前記第1のサイドは前記第1の流体チャンバと前記第2の流体チャンバを含む流体チャンバのアレイを有し、それぞれの流体チャンバは、間隔をおいて配置される第1と第2の支持区域を定めるための、間隔を置いて配置された第1と第2の凹溝を有し、前記第1の支持区域は前記第2の支持区域と前記第1と第2の凹溝を取り囲み、前記第2の支持区域は前記第2の凹溝を取り囲み、前記基板は前記第1および第2の支持区域に支えられ、これらの構成により、前記第1の凹溝とそれに重なる前記基板の一部分が第1のチャンバを決定し、第2の凹溝とそれに重なる前記基板の一部分が第2のチャンバを決定し、
前記圧力制御システムは、前記第1の流体チャンバと前記第2の流体チャンバの前記第1と第2のチャンバのそれぞれに流体連通することで、前記第1の流体チャンバの前記第1と第2のチャンバは正の圧力を有し、前記第2の流体チャンバの前記第1と第2のチャンバが負の圧力を有するように前記第1および第2のチャンバ内の圧力を制御し、前記第1の流体チャンバが前記流体チャンバと重なる前記基板の一部に対して負の力を掛けるように前記第1及び第2の凹溝の間の面積の比率が決定され、前記第1の流体チャンバの前記第1と第2のチャンバ内には正の圧力、および前記第2の流体チャンバの前記第1と第2のチャンバ内には負の圧力が与えられることを特徴とするチャック・システム。 A chuck system for holding a first portion of a substrate and simultaneously bending the second portion of the substrate,
A chuck body having first and second opposing sides;
A pressure control system in fluid communication with the first and second fluid chambers;
With
The first side has an array of fluid chambers including the first fluid chamber and the second fluid chamber, each fluid chamber being spaced apart by first and second support areas. Spaced apart first and second grooves, the first support area surrounding the second support area and the first and second grooves, The second support area surrounds the second concave groove, and the substrate is supported by the first and second support areas, and by these configurations, the first concave groove and a portion of the substrate that overlaps the first concave groove. Determines the first chamber, the second groove and the portion of the substrate overlapping it determine the second chamber,
The pressure control system is in fluid communication with each of the first and second chambers of the first fluid chamber and the second fluid chamber, whereby the first and second of the first fluid chamber. Control the pressure in the first and second chambers such that the first and second chambers of the second fluid chamber have a negative pressure, and the first fluid chamber has a positive pressure, A ratio of the area between the first and second grooves is determined such that one fluid chamber exerts a negative force on a portion of the substrate overlapping the fluid chamber; The chuck system is characterized in that a positive pressure is applied in the first and second chambers and a negative pressure is applied in the first and second chambers of the second fluid chamber.
第1および第2の対向するサイドを有するチャック本体と、
複数の流体ソースを有する圧力制御システムと、
を備え、
前記第1のサイドは横列および縦列に配置され、且つ第1の流体チャンバと第2の流体チャンバを含んだ流体チャンバのアレイを有し、前記第1及び第2の流体チャンバのそれぞれは、間隔をおいて配置される第1と第2の支持区域を定めるための、間隔を置いて配置された第1と第2の凹溝を有し、前記第1の支持区域は前記第2の支持区域と前記第1と第2の凹溝を取り囲み、前記第2の支持区域は前記第2の凹溝を取り囲み、前記基板は前記第1および第2の支持区域に支えられ、これらの構成により、前記第1の凹溝とそれに重なる前記基板の一部分が第1のチャンバを決定し、第2の凹溝とそれに重なる前記基板の一部分が第2のチャンバを決定し、
前記圧力制御システムは、前記複数の流体ソースとは異なる流体ソースと流体連通する前記第1の各縦列と前記第2チャンバの横列を備え、これらの構成により、前記第1の流体チャンバの前記第1および第2チャンバが正の圧力を有し、前記第2の流体チャンバの前記第1および第2チャンバが負の圧力を有するように前記第1および第2チャンバ内の圧力を制御し、前記第1の流体チャンバが前記流体チャンバと重なる前記基板の一部に対して負の力を掛けるように前記第1及び第2の凹溝の間の面積の比率が決定され、前記第1の流体チャンバの前記第1と第2のチャンバ内には正の圧力、および前記第2の流体チャンバの前記第1と第2のチャンバ内には負の圧力が与えられることを特徴とするチャック・システム。 A chuck system for holding a first portion of a substrate and simultaneously bending the second portion of the substrate,
A chuck body having first and second opposing sides;
A pressure control system having a plurality of fluid sources;
With
The first side is arranged in rows and columns and has an array of fluid chambers including a first fluid chamber and a second fluid chamber, each of the first and second fluid chambers being spaced apart Having first and second recessed grooves spaced apart to define first and second support areas disposed at a distance, wherein the first support area is the second support area. An area and the first and second grooves, the second support area surrounds the second groove, and the substrate is supported by the first and second support areas. The first groove and a portion of the substrate overlapping it determine a first chamber, the second groove and a portion of the substrate overlapping it determine a second chamber;
The pressure control system includes each of the first columns in fluid communication with a fluid source different from the plurality of fluid sources and a row of the second chambers, with these configurations, the first fluid chamber in the first fluid chamber. Controlling the pressure in the first and second chambers such that the first and second chambers have a positive pressure and the first and second chambers of the second fluid chamber have a negative pressure; An area ratio between the first and second grooves is determined such that the first fluid chamber applies a negative force to a portion of the substrate overlapping the fluid chamber, and the first fluid A chuck system wherein a positive pressure is provided in the first and second chambers of the chamber and a negative pressure is provided in the first and second chambers of the second fluid chamber. .
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78877706P | 2006-04-03 | 2006-04-03 | |
PCT/US2007/007487 WO2007126767A2 (en) | 2006-04-03 | 2007-03-26 | Chucking system comprising an array of fluid chambers |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010248309A Division JP2011077529A (en) | 2006-04-03 | 2010-11-05 | Chucking system including array of fluid chambers |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009532899A JP2009532899A (en) | 2009-09-10 |
JP2009532899A5 true JP2009532899A5 (en) | 2010-04-22 |
JP4667524B2 JP4667524B2 (en) | 2011-04-13 |
Family
ID=38656006
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009504203A Active JP4667524B2 (en) | 2006-04-03 | 2007-03-26 | Chuck system with an array of fluid chambers |
JP2010248309A Pending JP2011077529A (en) | 2006-04-03 | 2010-11-05 | Chucking system including array of fluid chambers |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010248309A Pending JP2011077529A (en) | 2006-04-03 | 2010-11-05 | Chucking system including array of fluid chambers |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2007566A4 (en) |
JP (2) | JP4667524B2 (en) |
KR (1) | KR20090004910A (en) |
CN (1) | CN101415535A (en) |
TW (1) | TWI352874B (en) |
WO (1) | WO2007126767A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4854383B2 (en) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | Imprint method and nano-imprint apparatus |
US8215946B2 (en) * | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
US8652393B2 (en) * | 2008-10-24 | 2014-02-18 | Molecular Imprints, Inc. | Strain and kinetics control during separation phase of imprint process |
US8309008B2 (en) * | 2008-10-30 | 2012-11-13 | Molecular Imprints, Inc. | Separation in an imprint lithography process |
US8913230B2 (en) * | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
JP5875250B2 (en) * | 2011-04-28 | 2016-03-02 | キヤノン株式会社 | Imprint apparatus, imprint method, and device manufacturing method |
JP5893303B2 (en) * | 2011-09-07 | 2016-03-23 | キヤノン株式会社 | Imprint apparatus and article manufacturing method using the same |
CN105792998A (en) * | 2013-12-03 | 2016-07-20 | 哈莫技术股份有限公司 | Holding device, holding system, control method, and conveyance device |
JP6333031B2 (en) | 2014-04-09 | 2018-05-30 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
US10620532B2 (en) | 2014-11-11 | 2020-04-14 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, mold, and article manufacturing method |
JP6647027B2 (en) | 2015-12-03 | 2020-02-14 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP6940944B2 (en) * | 2016-12-06 | 2021-09-29 | キヤノン株式会社 | Imprint device and article manufacturing method |
JP7132739B2 (en) | 2018-04-06 | 2022-09-07 | キヤノン株式会社 | Imprinting apparatus, imprinting method and article manufacturing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244269A (en) * | 1992-09-07 | 1994-09-02 | Mitsubishi Electric Corp | Semiconductor manufacturing apparatus, wafer vacuum chuck device thereof, and gas cleaning and nitride film formation therefor |
JP2000195927A (en) | 1998-12-28 | 2000-07-14 | Sony Corp | Vacuum chuck device |
JP2001127144A (en) * | 1999-08-19 | 2001-05-11 | Canon Inc | Method and device for holding substrate with suction and exposing device and device manufacturing method using the device |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
JP2001127145A (en) * | 1999-08-19 | 2001-05-11 | Canon Inc | Method and device for holding substrate with suction and exposing device and device manufacturing method using the device |
ATE438197T1 (en) * | 2002-11-13 | 2009-08-15 | Molecular Imprints Inc | A SUPPORT SYSTEM AND METHOD FOR MODULATING SUBSTRATE SHAPES |
-
2007
- 2007-03-26 EP EP07754062A patent/EP2007566A4/en not_active Withdrawn
- 2007-03-26 JP JP2009504203A patent/JP4667524B2/en active Active
- 2007-03-26 WO PCT/US2007/007487 patent/WO2007126767A2/en active Application Filing
- 2007-03-26 CN CNA2007800120092A patent/CN101415535A/en active Pending
- 2007-03-26 KR KR1020087024314A patent/KR20090004910A/en not_active Application Discontinuation
- 2007-03-29 TW TW96111034A patent/TWI352874B/en not_active IP Right Cessation
-
2010
- 2010-11-05 JP JP2010248309A patent/JP2011077529A/en active Pending
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