JP2009526383A - １つまたはそれ以上のターゲットリンク構造を除去するレーザベースの方法およびシステム - Google Patents

１つまたはそれ以上のターゲットリンク構造を除去するレーザベースの方法およびシステム Download PDF

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Publication number
JP2009526383A
JP2009526383A JP2008553540A JP2008553540A JP2009526383A JP 2009526383 A JP2009526383 A JP 2009526383A JP 2008553540 A JP2008553540 A JP 2008553540A JP 2008553540 A JP2008553540 A JP 2008553540A JP 2009526383 A JP2009526383 A JP 2009526383A
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JP
Japan
Prior art keywords
laser
pulse
pulses
link structure
wavelength
Prior art date
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Pending
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JP2008553540A
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English (en)
Japanese (ja)
Inventor
グ，ボ
スマート，ドナルド，ヴイ．
コーディングリー，ジェイムス，ジェイ．
リー，ジョーハン
スベトコフ，ドナルド，ジェイ．
ジョンソン，シェパード，ディー．
エルマン，ジョナサン，エス．
Original Assignee
ジーエスアイ・グループ・コーポレーション
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Application filed by ジーエスアイ・グループ・コーポレーション filed Critical ジーエスアイ・グループ・コーポレーション
Publication of JP2009526383A publication Critical patent/JP2009526383A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
JP2008553540A 2006-02-03 2007-02-05 １つまたはそれ以上のターゲットリンク構造を除去するレーザベースの方法およびシステム Pending JP2009526383A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76540106P 2006-02-03 2006-02-03
PCT/US2007/061592 WO2007092803A2 (fr) 2006-02-03 2007-02-05 Procédé laser et système de suppression d'une ou plusieurs structures de liaison

Publications (1)

Publication Number Publication Date
JP2009526383A true JP2009526383A (ja) 2009-07-16

Family

ID=38345903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008553540A Pending JP2009526383A (ja) 2006-02-03 2007-02-05 １つまたはそれ以上のターゲットリンク構造を除去するレーザベースの方法およびシステム

Country Status (5)

Country Link
JP (1) JP2009526383A (fr)
KR (1) KR101370156B1 (fr)
CN (1) CN101410219A (fr)
TW (1) TWI379724B (fr)
WO (1) WO2007092803A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012522374A (ja) * 2009-03-27 2012-09-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 短レーザパルスのテイラードバーストによるレーザマイクロマシニング
JP2013531380A (ja) * 2010-07-02 2013-08-01 ショット アクチエンゲゼルシャフト インターポーザおよびインターポーザに孔を生成する方法
JP2016513989A (ja) * 2013-02-27 2016-05-19 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法
JP2018043034A (ja) * 2017-11-27 2018-03-22 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552373B2 (ja) 2010-06-02 2014-07-16 浜松ホトニクス株式会社 レーザ加工方法
TWI454006B (zh) * 2011-11-18 2014-09-21 Ind Tech Res Inst 雷射控制裝置
KR101483759B1 (ko) * 2013-07-19 2015-01-19 에이피시스템 주식회사 멀티 레이저를 이용한 취성 기판 가공 장치 및 방법
CN106330329B (zh) * 2016-08-22 2018-07-03 浙江大学 基于直接调制dpssl的无线光通信装置及其方法
JP6781649B2 (ja) * 2017-03-13 2020-11-04 株式会社ディスコ レーザー加工装置
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
US10782343B2 (en) 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
US20200316722A1 (en) * 2019-04-02 2020-10-08 Asm Technology Singapore Pte Ltd Optimised laser cutting
RU2736126C1 (ru) * 2020-02-10 2020-11-11 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Способ трехстадийной лазерной наплавки
KR102363962B1 (ko) * 2020-04-21 2022-02-17 국방과학연구소 광자 기반의 표적 탐지 시스템, 방법, 컴퓨터 판독 가능한 기록매체 및 컴퓨터 프로그램

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914663A (en) * 1988-04-22 1990-04-03 The Board Of Trustees Of Leland Stanford, Jr. University Generation of short high peak power pulses from an injection mode-locked Q-switched laser oscillator
US5745284A (en) * 1996-02-23 1998-04-28 President And Fellows Of Harvard College Solid-state laser source of tunable narrow-bandwidth ultraviolet radiation
JP2007516600A (ja) * 1997-03-21 2007-06-21 イムラ アメリカ インコーポレイテッド 先進材料処理応用のためのピコ秒−ナノ秒パルス用高エネルギ光ファイバ増幅器
US20040134894A1 (en) 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US20020016758A1 (en) 2000-06-28 2002-02-07 Grigsby Calvin B. Method and apparatus for offering, pricing, and selling securities over a network
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
US7131968B2 (en) * 2003-06-02 2006-11-07 Carl Zeiss Meditec Ag Apparatus and method for opthalmologic surgical procedures using a femtosecond fiber laser
US7143769B2 (en) * 2003-08-11 2006-12-05 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012522374A (ja) * 2009-03-27 2012-09-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 短レーザパルスのテイラードバーストによるレーザマイクロマシニング
JP2013531380A (ja) * 2010-07-02 2013-08-01 ショット アクチエンゲゼルシャフト インターポーザおよびインターポーザに孔を生成する方法
JP2016513989A (ja) * 2013-02-27 2016-05-19 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法
JP2018043034A (ja) * 2017-11-27 2018-03-22 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法

Also Published As

Publication number Publication date
WO2007092803A2 (fr) 2007-08-16
TW200735992A (en) 2007-10-01
CN101410219A (zh) 2009-04-15
KR101370156B1 (ko) 2014-03-06
KR20090061607A (ko) 2009-06-16
WO2007092803A3 (fr) 2008-09-18
TWI379724B (en) 2012-12-21

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