CN101410219A - 靶连接体结构的基于激光的去除 - Google Patents

靶连接体结构的基于激光的去除 Download PDF

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Publication number
CN101410219A
CN101410219A CNA2007800112965A CN200780011296A CN101410219A CN 101410219 A CN101410219 A CN 101410219A CN A2007800112965 A CNA2007800112965 A CN A2007800112965A CN 200780011296 A CN200780011296 A CN 200780011296A CN 101410219 A CN101410219 A CN 101410219A
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CN
China
Prior art keywords
pulse
laser
target link
wavelength
link structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800112965A
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English (en)
Chinese (zh)
Inventor
古博
唐纳德·V·斯马特
詹姆士·J·考丁雷
乔汉·李
唐纳德·J·斯维特科夫
谢巴德·D·约翰逊
乔纳森·S·艾尔曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novanta Inc
Original Assignee
GSI Lumonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GSI Lumonics Inc filed Critical GSI Lumonics Inc
Publication of CN101410219A publication Critical patent/CN101410219A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CNA2007800112965A 2006-02-03 2007-02-05 靶连接体结构的基于激光的去除 Pending CN101410219A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76540106P 2006-02-03 2006-02-03
US60/765,401 2006-02-03

Publications (1)

Publication Number Publication Date
CN101410219A true CN101410219A (zh) 2009-04-15

Family

ID=38345903

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800112965A Pending CN101410219A (zh) 2006-02-03 2007-02-05 靶连接体结构的基于激光的去除

Country Status (5)

Country Link
JP (1) JP2009526383A (fr)
KR (1) KR101370156B1 (fr)
CN (1) CN101410219A (fr)
TW (1) TWI379724B (fr)
WO (1) WO2007092803A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104289812A (zh) * 2013-07-19 2015-01-21 Ap系统股份有限公司 使用多个激光器加工脆性基底的设备和方法
CN106330329A (zh) * 2016-08-22 2017-01-11 浙江大学 基于直接调制dpssl的无线光通信装置及其方法
CN111805094A (zh) * 2019-04-02 2020-10-23 先进科技新加坡有限公司 优化的激光切割
RU2736126C1 (ru) * 2020-02-10 2020-11-11 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Способ трехстадийной лазерной наплавки

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
JP5552373B2 (ja) 2010-06-02 2014-07-16 浜松ホトニクス株式会社 レーザ加工方法
DE102010025966B4 (de) * 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
TWI454006B (zh) * 2011-11-18 2014-09-21 Ind Tech Res Inst 雷射控制裝置
PT2789061T (pt) 2013-02-27 2017-02-22 Wavelight Gmbh Aparelho laser e método para processamento a laser de um material de destino
JP6781649B2 (ja) * 2017-03-13 2020-11-04 株式会社ディスコ レーザー加工装置
JP2018043034A (ja) * 2017-11-27 2018-03-22 ノバルティス アーゲー レーザー装置および標的材料をレーザー処理するための方法
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
US10782343B2 (en) 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
KR102363962B1 (ko) * 2020-04-21 2022-02-17 국방과학연구소 광자 기반의 표적 탐지 시스템, 방법, 컴퓨터 판독 가능한 기록매체 및 컴퓨터 프로그램

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914663A (en) * 1988-04-22 1990-04-03 The Board Of Trustees Of Leland Stanford, Jr. University Generation of short high peak power pulses from an injection mode-locked Q-switched laser oscillator
US5745284A (en) * 1996-02-23 1998-04-28 President And Fellows Of Harvard College Solid-state laser source of tunable narrow-bandwidth ultraviolet radiation
JP2007516600A (ja) * 1997-03-21 2007-06-21 イムラ アメリカ インコーポレイテッド 先進材料処理応用のためのピコ秒−ナノ秒パルス用高エネルギ光ファイバ増幅器
US20040134894A1 (en) 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US20020016758A1 (en) 2000-06-28 2002-02-07 Grigsby Calvin B. Method and apparatus for offering, pricing, and selling securities over a network
US6777645B2 (en) 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
US7131968B2 (en) * 2003-06-02 2006-11-07 Carl Zeiss Meditec Ag Apparatus and method for opthalmologic surgical procedures using a femtosecond fiber laser
US7143769B2 (en) 2003-08-11 2006-12-05 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104289812A (zh) * 2013-07-19 2015-01-21 Ap系统股份有限公司 使用多个激光器加工脆性基底的设备和方法
CN104289812B (zh) * 2013-07-19 2016-08-24 Ap系统股份有限公司 使用多个激光器加工脆性基底的设备和方法
CN106330329A (zh) * 2016-08-22 2017-01-11 浙江大学 基于直接调制dpssl的无线光通信装置及其方法
CN106330329B (zh) * 2016-08-22 2018-07-03 浙江大学 基于直接调制dpssl的无线光通信装置及其方法
CN111805094A (zh) * 2019-04-02 2020-10-23 先进科技新加坡有限公司 优化的激光切割
RU2736126C1 (ru) * 2020-02-10 2020-11-11 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Способ трехстадийной лазерной наплавки

Also Published As

Publication number Publication date
TWI379724B (en) 2012-12-21
WO2007092803A3 (fr) 2008-09-18
KR20090061607A (ko) 2009-06-16
WO2007092803A2 (fr) 2007-08-16
KR101370156B1 (ko) 2014-03-06
TW200735992A (en) 2007-10-01
JP2009526383A (ja) 2009-07-16

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Application publication date: 20090415