JP2009522810A - 動的処理制御による電気化学処理 - Google Patents

動的処理制御による電気化学処理 Download PDF

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Publication number
JP2009522810A
JP2009522810A JP2008549523A JP2008549523A JP2009522810A JP 2009522810 A JP2009522810 A JP 2009522810A JP 2008549523 A JP2008549523 A JP 2008549523A JP 2008549523 A JP2008549523 A JP 2008549523A JP 2009522810 A JP2009522810 A JP 2009522810A
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JP
Japan
Prior art keywords
substrate
processing
zone
conductive
determining
Prior art date
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Pending
Application number
JP2008549523A
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English (en)
Japanese (ja)
Other versions
JP2009522810A5 (enExample
Inventor
イーシュワー コラタ，
アントイン マネンス，
ピエール フォンタレンスキー，
グレゴリー シー． リー，
アラン ドゥボウスト，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2009522810A publication Critical patent/JP2009522810A/ja
Publication of JP2009522810A5 publication Critical patent/JP2009522810A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008549523A 2006-01-06 2006-12-21 動的処理制御による電気化学処理 Pending JP2009522810A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/326,646 US20070158201A1 (en) 2006-01-06 2006-01-06 Electrochemical processing with dynamic process control
PCT/US2006/062476 WO2007120357A2 (en) 2006-01-06 2006-12-21 Electrochemical processing with dynamic process control

Publications (2)

Publication Number Publication Date
JP2009522810A true JP2009522810A (ja) 2009-06-11
JP2009522810A5 JP2009522810A5 (enExample) 2009-10-15

Family

ID=38231698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008549523A Pending JP2009522810A (ja) 2006-01-06 2006-12-21 動的処理制御による電気化学処理

Country Status (4)

Country Link
US (1) US20070158201A1 (enExample)
JP (1) JP2009522810A (enExample)
TW (1) TW200733216A (enExample)
WO (1) WO2007120357A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113430614A (zh) * 2020-03-23 2021-09-24 铠侠股份有限公司 阳极化装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192605B2 (en) * 2009-02-09 2012-06-05 Applied Materials, Inc. Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures
WO2014149330A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
US9286930B2 (en) * 2013-09-04 2016-03-15 Seagate Technology Llc In-situ lapping plate mapping device
CN113622015B (zh) * 2021-10-12 2021-12-24 深圳市景星天成科技有限公司 在线式电解抛光监测系统
CN115142112A (zh) * 2022-09-01 2022-10-04 徐州千帆标识系统工程有限公司 一种金属标牌多角度高效电镀装置及方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
JP2002110592A (ja) * 2000-09-27 2002-04-12 Sony Corp 研磨方法および研磨装置
US20030155255A1 (en) * 2002-01-22 2003-08-21 Applied Materials, Inc. Electropolishing of metallic interconnects
WO2003080899A1 (fr) * 2002-03-26 2003-10-02 Sony Corporation Appareil et procede de polissage electrolytique, procede de fabrication d'un dispositif semi-conducteur
US20030230491A1 (en) * 2001-01-17 2003-12-18 Basol Bulent M. Method and system monitoring and controlling film thickness profile during plating and electroetching
JP2004531885A (ja) * 2001-04-24 2004-10-14 アプライド　マテリアルズ　インコーポレイテッド 電気化学的機械的研磨のための導電性研磨物品
WO2004108358A2 (en) * 2003-06-06 2004-12-16 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
JP2005516383A (ja) * 2002-01-22 2005-06-02 アプライド　マテリアルズ　インコーポレイテッド 電気化学的機械研磨のプロセス制御
JP2005539384A (ja) * 2002-09-16 2005-12-22 アプライド　マテリアルズ　インコーポレイテッド 電気化学的に支援されたｃｍｐにおける除去プロファイルの制御
JP2007123907A (ja) * 2005-10-28 2007-05-17 Applied Materials Inc 電圧モード電流制御

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA929891A (en) * 1968-08-07 1973-07-10 Inoue Kiyoshi Adaptive ion-control system for electrochemical machining
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6582281B2 (en) * 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093761A (ja) * 2000-09-19 2002-03-29 Sony Corp 研磨方法、研磨装置、メッキ方法およびメッキ装置
JP2002110592A (ja) * 2000-09-27 2002-04-12 Sony Corp 研磨方法および研磨装置
US20030230491A1 (en) * 2001-01-17 2003-12-18 Basol Bulent M. Method and system monitoring and controlling film thickness profile during plating and electroetching
JP2004531885A (ja) * 2001-04-24 2004-10-14 アプライド　マテリアルズ　インコーポレイテッド 電気化学的機械的研磨のための導電性研磨物品
US20030155255A1 (en) * 2002-01-22 2003-08-21 Applied Materials, Inc. Electropolishing of metallic interconnects
JP2005516383A (ja) * 2002-01-22 2005-06-02 アプライド　マテリアルズ　インコーポレイテッド 電気化学的機械研磨のプロセス制御
WO2003080899A1 (fr) * 2002-03-26 2003-10-02 Sony Corporation Appareil et procede de polissage electrolytique, procede de fabrication d'un dispositif semi-conducteur
JP2005539384A (ja) * 2002-09-16 2005-12-22 アプライド　マテリアルズ　インコーポレイテッド 電気化学的に支援されたｃｍｐにおける除去プロファイルの制御
WO2004108358A2 (en) * 2003-06-06 2004-12-16 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
JP2007123907A (ja) * 2005-10-28 2007-05-17 Applied Materials Inc 電圧モード電流制御

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113430614A (zh) * 2020-03-23 2021-09-24 铠侠股份有限公司 阳极化装置

Also Published As

Publication number Publication date
WO2007120357A3 (en) 2008-01-03
TW200733216A (en) 2007-09-01
US20070158201A1 (en) 2007-07-12
WO2007120357A2 (en) 2007-10-25

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