JP2009507370A5 - - Google Patents
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- Publication number
- JP2009507370A5 JP2009507370A5 JP2008529029A JP2008529029A JP2009507370A5 JP 2009507370 A5 JP2009507370 A5 JP 2009507370A5 JP 2008529029 A JP2008529029 A JP 2008529029A JP 2008529029 A JP2008529029 A JP 2008529029A JP 2009507370 A5 JP2009507370 A5 JP 2009507370A5
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- JP
- Japan
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/217,276 US7444572B2 (en) | 2005-09-01 | 2005-09-01 | Built-in self test for a thermal processing system |
US11/217,276 | 2005-09-01 | ||
PCT/US2006/026128 WO2007030193A1 (en) | 2005-09-01 | 2006-07-06 | Built-in self test for a thermal processing system |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009507370A JP2009507370A (ja) | 2009-02-19 |
JP2009507370A5 true JP2009507370A5 (ja) | 2010-08-19 |
JP5042225B2 JP5042225B2 (ja) | 2012-10-03 |
Family
ID=37215984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008529029A Expired - Fee Related JP5042225B2 (ja) | 2005-09-01 | 2006-07-06 | 熱処理システムのビルトイン・セルフテスト |
Country Status (4)
Country | Link |
---|---|
US (1) | US7444572B2 (ja) |
JP (1) | JP5042225B2 (ja) |
TW (1) | TWI332131B (ja) |
WO (1) | WO2007030193A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7838072B2 (en) | 2005-01-26 | 2010-11-23 | Tokyo Electron Limited | Method and apparatus for monolayer deposition (MLD) |
US7526699B2 (en) * | 2006-03-31 | 2009-04-28 | Tokyo Electron Limited | Method for creating a built-in self test (BIST) table for monitoring a monolayer deposition (MLD) system |
US7340377B2 (en) * | 2006-03-31 | 2008-03-04 | Tokyo Electron Limited | Monitoring a single-wafer processing system |
US7519885B2 (en) * | 2006-03-31 | 2009-04-14 | Tokyo Electron Limited | Monitoring a monolayer deposition (MLD) system using a built-in self test (BIST) table |
US7302363B2 (en) * | 2006-03-31 | 2007-11-27 | Tokyo Electron Limited | Monitoring a system during low-pressure processes |
US8180594B2 (en) * | 2007-09-06 | 2012-05-15 | Asm International, N.V. | System and method for automated customizable error diagnostics |
US7689887B2 (en) * | 2007-12-21 | 2010-03-30 | International Business Machines Corporation | Automatic shutdown or throttling of a BIST state machine using thermal feedback |
US20100076729A1 (en) * | 2008-09-19 | 2010-03-25 | Applied Materials, Inc. | Self-diagnostic semiconductor equipment |
US20120222009A1 (en) * | 2011-02-24 | 2012-08-30 | Ayewah Nathaniel E | Defective code warning resolution analysis |
JP5973173B2 (ja) * | 2012-01-23 | 2016-08-23 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理装置の制御方法 |
US10401164B2 (en) * | 2012-10-16 | 2019-09-03 | Exxonmobil Research And Engineering Company | Sensor network design and inverse modeling for reactor condition monitoring |
WO2020055555A1 (en) | 2018-09-12 | 2020-03-19 | Applied Materials, Inc. | Deep auto-encoder for equipment health monitoring and fault detection in semiconductor and display process equipment tools |
US10998205B2 (en) * | 2018-09-14 | 2021-05-04 | Kokusai Electric Corporation | Substrate processing apparatus and manufacturing method of semiconductor device |
US11449047B2 (en) * | 2018-09-28 | 2022-09-20 | Rockwell Automation Technologies, Inc. | Systems and methods for retraining a model a target variable in a tiered framework |
TW202310131A (zh) * | 2021-08-24 | 2023-03-01 | 日商東京威力科創股份有限公司 | 基板處理裝置、模型資料產生裝置、基板處理方法、及模型資料產生方法 |
CN117711992A (zh) * | 2024-02-04 | 2024-03-15 | 北京北方华创微电子装备有限公司 | 温控异常处理方法、半导体工艺设备及存储介质 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642296A (en) * | 1993-07-29 | 1997-06-24 | Texas Instruments Incorporated | Method of diagnosing malfunctions in semiconductor manufacturing equipment |
JP3447749B2 (ja) * | 1996-08-29 | 2003-09-16 | 富士通株式会社 | 設備故障診断方法及びその装置並びにその方法に従った処理をコンピュータに実行させるためのプログラムを格納した記緑媒体 |
US5937154A (en) * | 1997-03-05 | 1999-08-10 | Hewlett-Packard Company | Manufacturing functional testing of computing devices using microprogram based functional tests applied via the devices own emulation debug port |
US6195621B1 (en) * | 1999-02-09 | 2001-02-27 | Roger L. Bottomfield | Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components |
JP4493192B2 (ja) * | 2000-09-13 | 2010-06-30 | 東京エレクトロン株式会社 | バッチ式熱処理装置及びその制御方法 |
-
2005
- 2005-09-01 US US11/217,276 patent/US7444572B2/en active Active
-
2006
- 2006-07-06 WO PCT/US2006/026128 patent/WO2007030193A1/en active Application Filing
- 2006-07-06 JP JP2008529029A patent/JP5042225B2/ja not_active Expired - Fee Related
- 2006-09-01 TW TW095132325A patent/TWI332131B/zh not_active IP Right Cessation
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