JP2009501280A - 基材上に材料模様を連続的に付着させるための装置及び方法 - Google Patents

基材上に材料模様を連続的に付着させるための装置及び方法 Download PDF

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Publication number
JP2009501280A
JP2009501280A JP2008521572A JP2008521572A JP2009501280A JP 2009501280 A JP2009501280 A JP 2009501280A JP 2008521572 A JP2008521572 A JP 2008521572A JP 2008521572 A JP2008521572 A JP 2008521572A JP 2009501280 A JP2009501280 A JP 2009501280A
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JP
Japan
Prior art keywords
mask
substrate
drum
control system
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008521572A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009501280A5 (zh
Inventor
ジェイ． マックルーア，ドナルド
エイチ． トキー，ジェフリー
エイチ． カールソン，ダニエル
エヌ． ドブス，ジェイムズ
ティー． ストランド，ジョン
ピー． スワンソン，ロナルド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009501280A publication Critical patent/JP2009501280A/ja
Publication of JP2009501280A5 publication Critical patent/JP2009501280A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0831—Machines for printing webs
    • B41F15/0836—Machines for printing webs by means of cylindrical screens or screens in the form of endless belts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/12—Screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2008521572A 2005-07-12 2006-07-11 基材上に材料模様を連続的に付着させるための装置及び方法 Withdrawn JP2009501280A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17941805A 2005-07-12 2005-07-12
PCT/US2006/027063 WO2007008992A2 (en) 2005-07-12 2006-07-11 Apparatus and methods for continuously depositing a pattern of material onto a substrate

Publications (2)

Publication Number Publication Date
JP2009501280A true JP2009501280A (ja) 2009-01-15
JP2009501280A5 JP2009501280A5 (zh) 2009-07-30

Family

ID=37637931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008521572A Withdrawn JP2009501280A (ja) 2005-07-12 2006-07-11 基材上に材料模様を連続的に付着させるための装置及び方法

Country Status (4)

Country Link
EP (1) EP1902601A2 (zh)
JP (1) JP2009501280A (zh)
CN (1) CN100596256C (zh)
WO (1) WO2007008992A2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012188687A (ja) * 2011-03-09 2012-10-04 Toppan Printing Co Ltd 成膜装置
JP2012193438A (ja) * 2011-03-17 2012-10-11 Toppan Printing Co Ltd 成膜方法
JP2013504693A (ja) * 2009-09-11 2013-02-07 ゼネラル・エレクトリック・カンパニイ Ｏｌｅｄ基材上にパターン形成コーティングを形成するための装置および方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080171422A1 (en) * 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits
JP5467531B2 (ja) * 2008-06-26 2014-04-09 株式会社ニコン 表示素子の製造方法及び製造装置
US8339573B2 (en) 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
KR101201755B1 (ko) * 2010-11-02 2012-11-15 삼성에스디아이 주식회사 진공 증착 장치 및 이를 이용한 진공 증착 방법
JP5937876B2 (ja) * 2012-04-18 2016-06-22 名古屋メッキ工業株式会社 めっき繊維製造装置及び方法
CN103668047A (zh) * 2012-09-03 2014-03-26 香港纺织及成衣研发中心有限公司 真空镀膜图案生成装置及方法
CN112226730A (zh) * 2020-09-30 2021-01-15 广州国显科技有限公司 柔性掩膜版和蒸镀装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248039B (en) * 1990-08-31 1994-12-07 Ricoh Kk Printer using a stencil
GB2259661A (en) * 1991-09-18 1993-03-24 Ibm Depositing solder on printed circuit boards
AU2751801A (en) * 1999-11-08 2001-06-06 Speedline Technologies, Inc. Improvements in solder printers
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US7296717B2 (en) 2003-11-21 2007-11-20 3M Innovative Properties Company Method and apparatus for controlling a moving web

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013504693A (ja) * 2009-09-11 2013-02-07 ゼネラル・エレクトリック・カンパニイ Ｏｌｅｄ基材上にパターン形成コーティングを形成するための装置および方法
JP2012188687A (ja) * 2011-03-09 2012-10-04 Toppan Printing Co Ltd 成膜装置
JP2012193438A (ja) * 2011-03-17 2012-10-11 Toppan Printing Co Ltd 成膜方法

Also Published As

Publication number Publication date
CN100596256C (zh) 2010-03-24
WO2007008992A2 (en) 2007-01-18
WO2007008992A3 (en) 2007-05-24
EP1902601A2 (en) 2008-03-26
CN101223834A (zh) 2008-07-16

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