AU2751801A - Improvements in solder printers - Google Patents

Improvements in solder printers

Info

Publication number
AU2751801A
AU2751801A AU27518/01A AU2751801A AU2751801A AU 2751801 A AU2751801 A AU 2751801A AU 27518/01 A AU27518/01 A AU 27518/01A AU 2751801 A AU2751801 A AU 2751801A AU 2751801 A AU2751801 A AU 2751801A
Authority
AU
Australia
Prior art keywords
solder printers
printers
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU27518/01A
Inventor
Augustus Ashton
Robert J. Balog
A. William Johnson
Frank Marszalkowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedline Technologies Inc
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Publication of AU2751801A publication Critical patent/AU2751801A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0809—Machines for printing sheets with cylindrical or belt-like screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
AU27518/01A 1999-11-08 2000-11-08 Improvements in solder printers Abandoned AU2751801A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US16395099P 1999-11-08 1999-11-08
US60163950 1999-11-08
US70696600A 2000-11-06 2000-11-06
US09706966 2000-11-06
PCT/US2000/042003 WO2001035703A1 (en) 1999-11-08 2000-11-08 Improvements in solder printers

Publications (1)

Publication Number Publication Date
AU2751801A true AU2751801A (en) 2001-06-06

Family

ID=26860117

Family Applications (1)

Application Number Title Priority Date Filing Date
AU27518/01A Abandoned AU2751801A (en) 1999-11-08 2000-11-08 Improvements in solder printers

Country Status (2)

Country Link
AU (1) AU2751801A (en)
WO (1) WO2001035703A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007008992A2 (en) * 2005-07-12 2007-01-18 3M Innovative Properties Company Apparatus and methods for continuously depositing a pattern of material onto a substrate
US20080171422A1 (en) * 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits
DE102016219557B4 (en) * 2016-10-07 2019-05-29 Continental Automotive Gmbh Method for printing connection materials on contact surfaces on a circuit carrier

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604966A (en) * 1985-10-10 1986-08-12 International Business Machine Corp. Continuous solder paste dispenser
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
JPH0247891A (en) * 1988-08-10 1990-02-16 Hitachi Ltd Solder printing device
JPH03237794A (en) * 1990-02-15 1991-10-23 Fujitsu Ltd Rotary press system solder paste printing method
US5938106A (en) * 1996-08-01 1999-08-17 International Business Machines Corporation Method and apparatus for applying solder and forming solder balls on a substrate

Also Published As

Publication number Publication date
WO2001035703A1 (en) 2001-05-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase