JP2009302081A - Method for producing molded interconnect device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a precise three-dimensional conductive circuit which exhibits excellent adhesion properties without roughening the surface of a substrate, and saves on the resource of precious noble metals contained in a catalyst. <P>SOLUTION: An OH group 1a is formed on the surface of a first substrate 1, and then the first substrate is coated with a functional molecular adhesive 2 consisting of a thiol-reactive alkoxysilane compound and then heated and dried. After the non-reacted functional molecular adhesive 2 is removed by alcoholic cleaning, a coating material 3 consisting of polyglycolic acid is applied partially to form a second substrate 4. After a catalyst 5 is imparted to the surface of the second substrate 4, the catalyst remaining on the surface of the coating material 3 is washed with water and removed. The part not coated with the coating material 3 is then subjected to electroless plating A of acid or neutral bath composition, and the coating material 3 is removed by an alkaline aqueous solution. The functional molecular adhesive 2 is chemically bonded to the OH group on the surface of the first substrate 1 to form a thiol group, and the thiol group is chemically bonded to the electroless plating A firmly through the catalyst 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a molded circuit component in which a three-dimensional conductive circuit is formed on a base made of an insulating material, and in particular, a functional molecular adhesive is applied to the base made of an insulating material. The present invention relates to a method for manufacturing a molded circuit component in which a conductive circuit is formed on a substrate by electroless plating or the like via an agent.

  Conventionally, various methods of manufacturing a molded circuit component have been proposed in which a conductive circuit is selectively formed on the surface of a base made of an insulating material by electroless plating. In these manufacturing methods, it is necessary to ensure the adhesion between the electroless plating layer and the base body to be plated. Therefore, conventionally, as a means for ensuring the adhesion between the electroless plating layer and the base, a means for etching the surface of the base in advance with an alkaline solution or the like to roughen the surface has been proposed (for example, Patent Document 1, 2 and 3).

  In any of these methods for producing molded circuit components, the surface of the roughened substrate is partially coated with a coating material, and after the catalyst is applied, the coating material is removed. And since it was not coat | covered with the coating | covering material, the electroconductive plating is performed to the surface part of the base | substrate to which the catalyst adhered, and a conductive circuit is formed. Therefore, it is desirable that the coating material can be easily eluted and removed in the step after applying the catalyst. For this reason, in the manufacturing methods described in Patent Documents 1 and 2, a polyvinyl alcohol-based resin, which is a polymer material that can be easily dissolved in water and removed, is used as the coating material. In the production method described in Patent Document 3, polylactic acid, which is a polymer material that can be easily hydrolyzed and removed with an alkaline solution, is used.

  Further, as another means for ensuring the adhesion between the electroless plating layer and the substrate, there is provided means for applying a functional molecular adhesive that is a thiol-reactive alkoxysilane compound (see Patent Document 4). In this means, after generating OH groups on the surface of the substrate by plasma treatment or the like, a functional molecular adhesive is applied and dried by heating. By this heat drying, the alkoxysilyl group of the alkoxysilane compound reacts with the OH group generated on the surface of the substrate to chemically bond, and a reactive thiol group (SH group) is introduced to the surface of the substrate. Next, the substrate into which the SH group has been introduced is covered with a mask made of resin or the like made of a portion where a conductive circuit is to be formed, and is irradiated with ultraviolet rays. The SH group irradiated with ultraviolet rays changes to a disulfide group (SS group), but the SH group state is maintained as it is in a portion that should be formed with a mask and not exposed to ultraviolet irradiation. The

Next, the mask is removed and a catalyst is applied to the substrate. The catalyst chemically bonds with the SH group introduced on the surface of the substrate, but does not bond with the SS group irradiated with ultraviolet rays. When washed with water, the catalyst adhering to the portion other than the portion where the conductive circuit is to be formed easily drops off, and the catalyst remains only in the portion where the conductive circuit is to be formed. Thus, when the base | substrate which provided the catalyst is immersed in the electroless-plating liquid, electroless-plating will precipitate only in the part which should form the electroconductive circuit with which a catalyst remains. This electroless plating is firmly bonded to the substrate through chemical bonds with SH groups introduced onto the surface of the substrate via a catalyst.
JP-A-11-145583 (pages 1 to 4) JP 2000-80480 A (pages 1 to 8) JP 2002-344116 A (pages 1 to 4) JP 2008-005041 A (pages 1 to 14)

  The inventor of the present application applies the above-described functional molecular adhesive to the entire surface of the base made of an insulating material, and partially covers the surface of the functional molecular adhesive with a coating material by injection molding. The idea of the manufacturing method of the molded circuit component which forms the three-dimensional electroconductive circuit by electroless plating in the part which is not carried out was obtained. However, it has been found that this manufacturing method has the following problems to be solved. That is, in the methods described in Patent Documents 1 and 2 described above, a catalyst material is used as the coating material because a polymer material such as a water-soluble polyvinyl alcohol resin that can be easily removed and removed in the subsequent process is used as the coating material. In the application step, the surface of the coating material swells to become hydrophilic, and as a result, there is a problem that the catalyst attached to the surface of the coating material cannot be removed even by washing. For this reason, when the coating material is dissolved and removed in the subsequent step, the catalyst is also mixed into the solution, and the mixed catalyst is discarded along with the disposal of the solution. However, since rare metals such as palladium and gold are used for the catalyst, it is necessary to save resources for these precious metals.

  Further, in the method described in Patent Document 3, a polymer material such as hydrolyzable polylactic acid or aliphatic polyester is used as a coating material, and after applying a catalyst, an alkaline solution that promotes hydrolysis is used. In order to remove the coating material, in this coating material removal process, even the catalyst applied to the surface portion of the substrate that is not coated with the coating material, that is, the portion that forms the conductive circuit, is washed with this alkaline solution. As a result, there is a problem that electroless plating is not sufficiently deposited on the portion where the conductive circuit is formed.

  Further, in each of the means of Patent Documents 1 to 4 described above, since electroless plating is performed after removing the covering material, so-called barrel plating (that is, the substrate is placed in a container in a disjointed state) In the initial stage of electroless plating, the catalyst-applied surfaces rub against each other and the catalyst falls off, and plating failure is likely to occur.

  Accordingly, the object of the present invention is to provide an environment that can easily form a three-dimensional conductive circuit excellent in adhesion to a substrate made of an insulating material, and can save resources of precious metals contained in the catalyst. An object of the present invention is to provide a method for manufacturing an excellent molded circuit component.

  The feature of the method for producing a molded circuit component according to the present invention is that, instead of roughening the surface of the substrate, the surface of the substrate and the electroless plating are firmly adhered via a functional molecular adhesive. Generate OH groups on the surface of the substrate before applying the molecular adhesive, use an acid-resistant resin as a covering material that partially covers the surface of the substrate to form a conductive circuit, and coat after applying the catalyst The catalyst remaining on the surface of the material is removed by washing with water, the electroless plating is performed with an acidic or neutral bath composition, and the coating material is removed after the electroless plating.

  That is, the first feature of the method of manufacturing a molded circuit component is that a first step of forming a first base made of an insulator and a second step of generating OH groups on the surface of the first base are provided. The third step of applying a functional molecular adhesive that is one or more of the thiol-reactive alkoxysilane compounds represented by the following general formula (Formula 1) to the surface of the first substrate on which the OH group is generated A fourth step of drying the first substrate to which the functional molecular adhesive has been applied by either heating or decompressing, a fifth step of washing the dried first substrate with alcohol, and the alcohol The surface of the cleaned first substrate is partially coated with a coating material made of polyglycolic acid or polylactic acid alone, a mixture of polylactic acid and aliphatic polyester, or a copolymer. Shaped substrate A sixth step of applying a catalyst to the surface of the second substrate, an eighth step of removing the catalyst remaining on the surface of the coating material with water, and a surface of the second substrate. In addition, a ninth step of performing electroless plating A whose bath composition is either acidic or neutral on a portion not covered with the coating material and a tenth step of removing the coating material are provided. It is in.

(In the above chemical formula, R ₁ represents a hydrogen atom or a hydrocarbon group, R ₂ represents a hydrocarbon chain or a hydrocarbon chain in which a hetero atom or a functional group may be interposed, and X represents a hydrogen atom or A hydrocarbon group, Y represents an alkoxy group, n is an integer from 1 to 3, and M is an alkali metal.)

  The second feature of the method of manufacturing the molded circuit component is that the sixth step is moved between the second step and the third step.

A third feature of this method for producing a molded circuit component is that R ₂ is a hydrocarbon chain in which one of a sulfur atom, a nitrogen atom, or a carbamoyl group or a urea group is interposed.

A fourth aspect of the manufacturing method of the molded circuit component, wherein _R 1 _{is, H-, CH 3 -, C} 2 H 5 -, n-C 3 H 7 -, CH 2 = CHCH 2 -, n-C ₄ H ₉ —, C ₆ H ₅ —, or C ₆ H ₁₁ —, and R ₂ represents —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ —, —CH ₂ CH. ₂ CH ₂ CH ₂ CH ₂ CH ₂ —, —CH ₂ CH ₂ SCH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ SCH ₂ CH ₂ CH ₂ , —CH ₂ CH ₂ NHCH ₂ CH ₂ CH ₂ —, — _{(CH 2 CH 2) 2 NCH} 2 CH 2 CH 2 -, - C 6 H 4 -, - C 6 H 4 C 6 H 4 -, - CH 2 C 6 H 4 CH 2 -, - CH 2 CH 2 CH _{2 CH 2 CH 2 CH 2 CH} 2 CH 2 CH 2 CH 2 -, - CH 2 C _{2 OCONHCH 2 CH 2 CH 2 -} , - CH 2 CH 2 NHCONHCH 2 CH 2 CH 2 -, or _{- (CH 2 CH 2) 2} CHOCONHCH 2 CH 2 CH 2 - is any one of the X is, _{H-, CH 3 -, C 2} H 5 -n-C 3 H 7 -, i-C 3 H 7, n-C 4 H 9 -, i-C 4 H 9 - or _t-C 4 _{H 9,} - is any one of the Y _{is, CH 3 O-, C 2 H} 5 O-, n-C 3 H 7 O-, i-C 3 H 7 O-, n-C 4 H 9 O _{-, i-C 4 H 9} O-, or a _{t-C 4 H} 9 O- 1 of any of the M is, some Li, Na, K or be any one of Cs, .

  A fifth feature of the method of manufacturing a molded circuit component is that, in any one of the first to fourth features, between the ninth step and the tenth step, on the surface of the electroless plating A, The object is to include a 9.5A step of laminating the electrolytic plating A having either an acidic or neutral bath composition.

  The sixth feature of the method for producing a molded circuit component is that, in any one of the first to fourth features, the bath composition is acidic on the surface of the electroless plating A after the tenth step, The object is to include an 11A step of laminating either one of the neutral or alkaline electrolytic plating B or the electroless plating B.

  A seventh feature of the method of manufacturing a molded circuit component is that, in any one of the first to fourth or sixth features, the electroless plating is performed between the ninth step and the tenth step. The object is to include a 9.5B step of laminating the electroless plating C having either an acidic or neutral bath composition on the surface of A.

  An eighth feature of the method of manufacturing a molded circuit component is that, in the fifth feature, after the tenth step, the bath composition is either acidic, neutral, or alkaline on the surface of the electrolytic plating A. There is an 11B step of laminating either one of the electroplating D or electroless plating D.

  Here, the “first substrate made of an insulator” is not limited to a three-dimensional solid shape, and may be a flat plate shape, in which different surfaces such as front and back surfaces are connected by an opening hole. Including. The “insulator” is preferably a thermoplastic resin, but may be a thermosetting resin. Examples of the resin include aromatic liquid crystal polymer, polysulfone, polyether polysulfone, polyarylsulfone, polyetherimide, polyester, acrylonitrile / butadiene / styrene copolymer resin, polyamide, modified polyphenylene oxide resin, norbornene resin, phenol resin, Epoxy resin is applicable.

  These resins may contain various blends or additive components for adding required properties and functions. For example, when reinforcing to prevent deformation due to heat, fillers such as carbon black, calcium carbonate, talc, clay, kaolin, wet and dry silica, rayon, nylon, polyester, vinylon, steel, Kevlar (from DuPont) (Trade name), carbon fiber or fiber such as glass fiber or cloth may be added, or a crosslinking agent such as peroxide or a polyfunctional monomer may be added.

  As means for “generating OH groups”, known means such as corona discharge treatment, atmospheric pressure plasma treatment, or UV irradiation can be used. The “applying a functional molecular adhesive” means, for example, a means of immersing in a functional molecular adhesive solution, or spraying or brushing the solution. Here, the functional molecular adhesive solution refers to functional molecular adhesives such as water, alcohols such as methanol, ethanol, isopropanol, ethylene glycol or diethylene glycol, ketones such as acetone or methyl ethyl ketone, and ethyl acetate. Esters such as, halides such as methylene chloride, olefins such as butane or hexane, ethers such as tetrahydrofuran or butyl ether, aromatics such as benzene or toluene, amides such as dimethylformamide or methylpyrrolidone, or the like Means dissolved in a mixed solvent.

  “Polyglycolic acid” corresponds to the chemical structural formula shown in FIG. “Polylactic acid” corresponds to, for example, Lacia # H-100J / F manufactured by Mitsui Chemicals. “Aliphatic polyester” refers to, for example, an aliphatic polyester composed of polyhydroxycarboxylic acid, hydroxycarboxylic acid, and aliphatic polybasic acid, and a plurality of monomer components selected from hydroxycarboxylic acid and aliphatic polyhydric alcohol And a random copolymer or a block copolymer comprising a plurality of monomer components selected from aliphatic polybasic acids.

  The amount of polylactic acid and aliphatic polyester mixed and copolymerized is preferably about 1 to 10% by weight based on the total amount of the mixture or copolymer. You may mix an alkali decomposition accelerator about 1 to 100 weight% with respect to the whole mixture. Moreover, you may mix the general purpose additive which can be used for synthetic resins, such as an alkali decomposition accelerator, an organic inorganic filler, and a coloring agent, as needed.

  “Partially covering” means that a part other than a part where a conductive circuit is to be formed in a subsequent process is selectively covered. The “second substrate” refers to a first substrate, a functional molecular agent adhesive applied to the surface of the first substrate and subjected to heat treatment, and the functional molecular agent adhesive. It means a member composed of a coated covering material. “Catalyst” means a metal on which electroless plating in a subsequent process is first deposited, and corresponds to a noble metal such as palladium, gold, or silver.

  “Removal by washing with water” means washing away the catalyst remaining on the surface of the coating material maintaining hydrophobicity by washing with water. In this water washing, neutral to alkaline washing water having a pH of 7 or more is used. For example, the second substrate is immersed in washing water at 15 to 70 ° C. for 5 to 120 seconds and stirred, or washed at 100 to 170 ° C. Water vapor is sprayed on the second substrate at a high pressure. “Bath composition” means the pH (hydrogen ion concentration) of the electroless plating solution, and “bath composition is acidic or neutral” means that the pH of the electroless plating solution or electrolytic plating solution is 7 or less. It means that. In the present invention, even if the “bath composition” of electroless plating is weakly alkaline of about 7 to 7.5, it acts in the same manner as an acidic or neutral bath composition, but the electroless plating solution is deteriorated. Care must be taken to speed up.

  As a coating material, polyglycolic acid that can be easily removed by hydrolysis and can maintain hydrophobicity without swelling by a catalyst solution, or a simple substance of polylactic acid, a mixture of polylactic acid and aliphatic polyester, or co-polymer By using the coalescence, it is possible to prevent the catalyst from being firmly adhered to the coating material when the catalyst is applied. By providing a water washing step after applying the catalyst, the catalyst remaining on the hydrophobic surface of the coating material can be easily and reliably removed, so that the catalyst washed out in the washing water can be easily separated and recovered. This makes it possible to save resources on expensive precious metals. In addition, since the coating material has acid resistance, by performing electroless plating or electrolytic plating with either an acidic or neutral bath composition, dissolution of the coating material is prevented, and a conductive circuit is precisely formed. Can be formed.

  Furthermore, the coating material is dissolved and removed after the electroless plating is formed on the part where the conductive circuit is formed, so that the problem with the conventional method of dissolving and removing the coating material before the electroless plating, that is, the removal of the coating material. The alkaline solution used in the step can avoid the problem that even the catalyst applied to the surface of the first substrate that is not coated with the coating material falls off, so that the electroless plating can be sufficiently deposited. . In addition, after removing the coating material, it is no longer necessary to consider the dissolution of the coating material. Therefore, even if the bath composition is acidic, neutral, or alkaline, the electrolytic plating performed before the removal of the coating material is performed. Alternatively, an electrolytic plating or an electroless plating can be further laminated on the electroless plating.

  Moreover, the thickness, intensity | strength, etc. of a molded circuit can be increased by laminating | stacking electroless plating or electrolytic plating on electroless plating or electrolytic plating. Further, by stacking platings of different materials, other useful characteristics such as improved solderability can be imparted to the molded circuit. Further, the covering material is dissolved and removed after the electroless plating is formed, so that in the case of the electroless plating, the periphery of the portion where the conductive circuit is formed is surrounded by the wall of the covering material. be able to. For this reason, even when barrel plating is performed, it is possible to prevent the portions forming the conductive circuit provided with the catalyst from being rubbed against each other by the wall of the covering material, thereby preventing the occurrence of defective plating adhesion. .

  In addition to the effects peculiar to the present invention as described above, by laminating electroless plating on the surface of the first substrate via a functional molecular adhesive, the following known functions and effects can also be exhibited. it can. That is, the first substrate and the electroless plating can be firmly adhered to each other with the functional molecular adhesive, so that it is necessary to roughen the surface of the first substrate by etching with hexavalent chromic acid as in the past. Disappears. Therefore, hexavalent chromic acid, which is an environmental management material, can be eliminated. Moreover, since the conventional etching with hexavalent chromic acid is a wet process, it is necessary to carry it out from the factory that performs the other dry process to the factory that performs the wet process in the middle of the production process of the generated circuit component. However, by eliminating this wet process, it becomes possible to manufacture the generated circuit components in the factory of the dry process, so that the manufacturing cost can be greatly reduced.

  Further, since the surface of the first substrate is not roughened, an improvement in fatigue strength and an improvement in the smoothness of the electroless plating surface can be obtained.

  A specific example of a method for manufacturing a molded circuit component according to the present invention will be described with reference to FIGS. As shown in FIG. 1, as a first step, an insulating thermoplastic resin is injection-molded to form a block-shaped first substrate 1. Here, an aromatic liquid crystal polymer is used as the thermoplastic resin. Next, as shown in FIG. 2, as a second step, the entire surface of the first substrate 1 is subjected to atmospheric pressure plasma treatment to introduce and bond OH groups 1a. The atmospheric pressure plasma treatment uses a known atmospheric pressure plasma generator (for example, Aiplasuma manufactured by Matsushita Electric Works Co., Ltd.) and the like, for example, plasma treatment speed: 10 to 100 mm / s, power source: 200 or 220 V AC ( 30A), compressed air: 0.5 MPa (1 NL / min), power: 100 W, irradiation time: 0.1 to 60 seconds.

  Next, as shown in FIG. 3, as a third step, a functional molecular adhesive 2 is applied to the surface of the first substrate 1 on which the OH groups 1a are generated. That is, the functional molecular adhesive 2 is triethoxysilylpropyl triazinedithiols (TESTD) having the chemical formula (Chemical Formula 2) shown in FIG. 14, and 0.1 g of the functional molecular adhesive 2 is 100 ml of ethanol / water mixed solvent ( The first substrate 1 on which the OH groups 1a are generated is immersed in a solution dissolved in ethanol (95 g: water 5 g) at a solution temperature of 20 ° C. for 1 minute. Next, as shown in FIG. 4, as the fourth step, the temperature of the first substrate 1 provided with the functional molecular adhesive 2 is set to 50 to 50 ° C. using either an oven, a dryer, high-frequency heating, or the like. Heat to dry at 200 ° C. for 1-60 minutes.

  After the heat drying, as shown in FIG. 15, the functional molecular adhesive 2 has a strong chemical bond because its alkoxysyl group reacts with the OH group 1 a generated on the surface of the first substrate 1. At the same time, a reactive thiol group (SH group) is introduced. Next, as shown in FIG. 5, in the fifth step, when the heat-dried first substrate 1 is washed with alcohol, the unreacted functional molecular adhesive 2 in the upper layer portion that does not come into contact with the OH groups 1a is removed. After the unreacted functional molecular adhesive 2 is removed, an extremely thin layer of the functional molecular adhesive 2 having a thickness of about 1 to several nm, which is firmly chemically bonded to the surface of the first substrate 1, is formed. , Formed on the surface of the first substrate.

  Next, as shown in FIG. 6, as a sixth step, the surface of the first substrate 1 to which the functional molecular adhesive 2 is applied is partially coated with a coating material 3, and the second substrate 4 is formed. Form. As the covering material 3, a single unit of polyglycolic acid is used, but not limited thereto, a single unit of polylactic acid, a mixture of polylactic acid and aliphatic polyester, or a copolymer may be used. These resins have a property of hydrolyzing with an alkaline aqueous solution and have a property of being resistant to an acidic aqueous solution. As a coating method, the first substrate 1 provided with the functional molecular adhesive 2 is set in an injection mold, and a predetermined conductive circuit is formed on the surface of the first substrate. The covering material 3 is integrally formed by covering the portion 2b to be covered with a mold or the like and injecting polylactic acid resin into the cavity formed on the surface of the other portion, that is, the portion 2a where the conductive circuit is not formed. To form. The thickness of the covering material 3 is preferably 0.1 to 1 mm, and more preferably 0.3 to 0.5 mm.

  Next, as shown in FIG. 7, as a seventh step, the catalyst 5 is applied to the entire surface of the second substrate 4. The application of the catalyst 5 is performed, for example, by immersing the second substrate 4 in a palladium chloride solution at room temperature for about 5 minutes. The means for applying the catalyst 5 is not limited to the above-described aqueous solution of palladium salt, but the second substrate 4 is immersed in any one aqueous solution such as gold salt, platinum salt, silver salt, or tin chloride. Also good.

  Next, as shown in FIG. 8, when the second substrate 4 to which the catalyst 5 has been applied is washed with water as the eighth step, the coating material 3 is hydrophobic, so that the catalyst 5a remaining on the surface of the coating material is All can be removed. On the other hand, the catalyst 5b applied to the portion where the conductive circuit is not formed, which is not covered with the covering material 3, has a reactive thiol group (SH group) of the functional molecular adhesive 2 as shown in FIG. Since it is strongly chemically bonded, it does not fall off even when washed with water. Therefore, after washing with water, as shown in FIG. 8, the catalyst 5b remains only in a portion where the conductive circuit is to be formed, which is not covered with the covering material 3. This water cleaning is performed by immersing the second substrate 4 in a water tank having a temperature of 15 to 25 ° C. and swinging the workpiece for 5 to 30 seconds.

  Next, as shown in FIG. 9, as the ninth step, as the electroless plating A on the surface of the second substrate 4 that is not coated with the coating material 3, that is, the portion where the catalyst 5 b remains. An electroless nickel plating 6 having an acidic bath composition is performed to form a conductive circuit. For example, the electroless nickel plating 6 is performed by immersing in an acidic bath having a pH of 4.7 and a temperature of 90 ° C. for 35 minutes. As described above, since the electroless plating A is deposited with the catalyst 5 firmly bonded to the first substrate 1 as a nucleus, it adheres firmly to the surface of the first substrate 1.

  Next, as shown in FIG. 10, as a tenth step, the covering material 3 covering the surface of the second substrate 4 is removed with an alkaline solution. As described above, the polylactic acid or the like of the covering material 3 is resistant to an acidic aqueous solution, but is easily hydrolyzed by an alkaline aqueous solution. The coating material 3 is removed by dipping in a caustic (NaOH, KOH, etc.) aqueous solution at 70 ° C. for about 1 to 120 minutes. Therefore, the working efficiency is remarkably improved as compared with the manual mask removal. In this case, since the conductive circuit by the electroless nickel plating 6 has already been formed in the portion not covered with the coating material 3, the catalyst in this portion is removed by the alkaline solution that hydrolyzes the coating material. It is completely unrelated to the conventional problem of doing.

Now, as shown in FIG. 11, the bath composition is acidic on the surface of the electroless plating A between the ninth step (electroless plating A) and the tenth step (removal of the covering material 3). An electrolytic copper plating 7 made of neutral electrolytic plating A is performed, and a 9.5A step of forming a secondary plating layer can be inserted. When performing electrolytic copper plating, the bath composition of the acidic copper sulfate bath is, for example, CuSO ₄ .5H ₂ O (75 g) / lH ₂ SO ₄ (190 g) / lCl (60 ppm) / additive (appropriate amount). The anode material is phosphorous copper, the bath temperature is set to 25 ° C., and the cathode current density is 2.5 A / dm 2.

  As described above, even if the 9.5A step in which the electrolytic copper plating 7 having a bath composition is acidic or neutral is inserted before the tenth step, that is, before the removal of the coating material 3, the coating material is not resistant to acid. Therefore, the secondary plating layer can be accurately formed on the surface of the conductive circuit on which the electroless plating 6 is formed without being dissolved in the electrolytic copper plating solution.

  In FIG. 11, electroless copper plating 7 made of electroless plating C can be performed instead of electrolytic plating A. That is, between the ninth step (electroless nickel plating 6 made of electroless plating A) and the tenth step (removal of coating material 3), the bath composition is acidic or An electroless copper plating 7 made of neutral electroless plating C can be performed to insert a 9.5B step of forming a secondary plating layer.

  Now, FIG. 12 shows the electroless plating A shown in FIG. 10, that is, the electrolytic copper plating 6 made of the electrolytic plating B on the electroless nickel plating 6 after the coating material 3 is removed in the tenth step, or the non-electrolytic plating 6. The 11th A process of laminating any of electroless copper plating 6 which consists of electroplating B is shown. Since this electrolytic plating B or electroless plating B is performed after removing the covering material 3 in the tenth step, the bath composition is not limited to acidic or neutral, and may be alkaline.

  Next, FIG. 13 shows the result of performing either electroplating or electroless plating both before and after the tenth step of removing the covering material 3. That is, between the ninth step of performing the electroless plating A (electrolytic nickel plating 6) and the tenth step of removing the covering material 3, the electroless plating C (electroless copper plating 8) according to the above-mentioned 9.5B step. After that, the covering material 3 is removed by the tenth step described above. And after removing the coating | covering material 3, either the electrolytic plating B (electrolytic copper plating 9) by the 11th A process mentioned above or the electroless plating B (electroless copper plating 9) is performed. Alternatively, instead of the electroless plating C in the 9.5B step, the electrolytic plating A (electrolytic copper plating 8) in the 9.5A step described above is performed, and after the covering material 3 is removed, the electrolysis in the 11B step is performed. Either plating D (electrolytic copper plating 9) or electroless plating D (electroless copper plating 9) can be performed.

  The electrolytic plating B or electroless plating B in the 11A step described above, or the electrolytic plating D or electroless plating D in the 11B step is performed after removing the covering material 3 in the 10th step. The bath composition is not limited to acidic or neutral, and may be alkaline.

  In addition, the electroless plating C in the 9.5B step, the electroless plating B in the 11A step, and the electroless plating D in the 11B step described above are all replaced with the electroless copper platings 8 and 9 and electroless gold. Other metal plating such as plating can also be performed.

  The method of manufacturing a molded circuit component according to the present invention can easily form a three-dimensional conductive circuit excellent in adhesion to a base made of an insulating material, and can save resources of a precious metal contained in a catalyst. In addition, since it has excellent environmental properties, it can be widely used in industries related to electronic devices and the like.

It is a figure which shows the 1st process of forming a 1st base | substrate. It is a figure which shows the 2nd process which produces | generates OH group on the surface of a 1st base | substrate. It is a figure which shows the 3rd process of apply | coating a functional molecular adhesive agent on the surface of the 1st base | substrate which produced | generated OH group. It is a figure which shows the 4th process of heat-drying the 1st base | substrate which apply | coated the functional molecular adhesive agent. It is a figure which shows the 5th process of removing the unreacted functional molecular adhesive agent by alcohol-washing the 1st base | substrate dried by heating. It is a figure which shows the 6th process which coat | covers the 1st base | substrate which removed the unreacted functional molecular adhesive agent with a coating | covering material, and forms a 2nd base | substrate. It is a figure which shows the 7th process of providing a catalyst to a 2nd base | substrate. It is a figure which shows the 8th process of washing the 2nd base | substrate which provided the catalyst with water, and removing the catalyst which remains on the surface of a coating | covering material. It is a figure which shows the 9th process of performing electroless plating to the part to which the catalyst of the 2nd base | substrate was provided. It is a figure which shows the 10th process of removing the coating | covering material formed in the surface of a 2nd base | substrate. Between the ninth step of performing electroless plating and the tenth step of removing the covering material, either the 9.5A step or the 9.5C step of performing either electrolytic plating or electroless plating is performed. FIG. It is a figure which shows the 11A process of performing either electroplating or electroless-plating after performing electroless plating by a 9th process and then removing a coating | covering material by a 10th process. After the electroless plating is performed in the ninth step, the electrolytic plating by 9.5A or the electroless plating by 9.5B is performed, and then the coating material is removed by the tenth step. It is a figure which shows either the 11A process or the 11B process which performs either of electroplating. It is a chemical formula (Chemical Formula 2) of triethoxysilylpropyltriazinedithiol which is an example of a functional molecular adhesive. It is explanatory drawing which shows the state which the triethoxy silyl propyl triazine dithiol chemically bonded with the 1st base | substrate which produced | generated OH group. It is explanatory drawing which shows the state which the thiol group (SH group) of triethoxysilylpropyl triazine dithiol was chemically bonded with the catalyst. It is a chemical structural formula of polyglycolic acid.

Explanation of symbols

1 First substrate 1a OH group 2 Triethoxysilylpropyltriazine dithiol (functional molecular adhesive)
2a Part not covered with coating material 3 Coating material 4 Second substrate 5 Catalyst 5a Catalyst attached to coating material 6 Electroless nickel plating (electroless plating A)
7 Electrolytic copper plating or electroless copper plating (electrolytic plating A or electroless plating C)
8 Electrolytic copper plating or electroless copper plating (electrolytic plating B or electroless plating B)
9 Electrolytic copper plating or electroless copper plating (electrolytic plating B or electroless plating B, or electrolytic plating D or electroless plating D)

Claims (8)

A first step of forming a first substrate made of an insulator;
A second step of generating OH groups on the surface of the first substrate;
A third step of applying a functional molecular adhesive that is one or more of the thiol-reactive alkoxysilane compounds represented by the following general formula (Formula 1) to the surface of the first substrate on which the OH group is generated; ,
A fourth step of drying the first substrate provided with the functional molecular adhesive by either heating or decompression;
A fifth step of washing the dried first substrate with alcohol;
The surface of the first substrate cleaned with alcohol is partially coated with a coating material comprising polyglycolic acid or polylactic acid alone, a mixture of polylactic acid and aliphatic polyester, or a copolymer. A sixth step of forming a second substrate;
A seventh step of applying a catalyst to the surface of the second substrate;
An eighth step of washing and removing the catalyst remaining on the surface of the coating material;
A ninth step in which electroless plating A having either an acidic or neutral bath composition is applied to a portion of the surface of the second substrate that is not covered with the covering material;
A method for producing a molded circuit component, comprising: a tenth step of removing the covering material.

(In the above chemical formula, R ₁ represents a hydrogen atom or a hydrocarbon group, R ₂ represents a hydrocarbon chain or a hydrocarbon chain in which a different atom or functional group may be interposed, and X represents a hydrogen atom or a hydrocarbon group. And Y represents an alkoxy group, n is an integer from 1 to 3, and M is an alkali metal.) In Claim 1, The said 6th process was moved between the said 2nd process and the 3rd process. The manufacturing method of the molded circuit component characterized by the above-mentioned. 3. The molded circuit component according to claim 1, wherein the R ₂ is a sulfur atom, a nitrogen atom, or a hydrocarbon chain having any one of a carbamoyl group or a urea group interposed therebetween. Production method. In any one of claims 1 to 3, wherein _{R 1 is, H-, CH 3 -, C} 2 H 5 -, n-C 3 H 7 -, CH 2 = CHCH 2 -, n-C 4 H ₉ −, C ₆ H ₅ —, or C ₆ H ₁₁ —.
R ₂ represents —CH ₂ CH ₂ —, —CH ₂ CH ₂ CH ₂ —,
_{-CH 2 CH 2 CH 2 CH 2} CH 2 CH 2 -, - CH 2 CH 2 SCH 2 CH 2 -,
_{-CH 2 CH 2 CH 2 SCH 2} CH 2 CH 2, -CH 2 CH 2 NHCH 2 CH 2 CH 2 -,
_{- (CH 2 CH 2) 2} NCH 2 CH 2 CH 2 -, - C 6 H 4 -, - C 6 H 4 C 6 H 4 -,
_{-CH 2 C 6 H 4 CH 2} -, - CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -,
_{-CH 2 CH 2 OCONHCH 2 CH 2} CH 2 -,
_{-CH 2 CH 2 NHCONHCH 2 CH 2} CH 2 -, or _{- (CH 2 CH 2) 2} CHOCONHCH 2 CH 2 CH 2 - is one of either,
Wherein X _{is, H-, CH 3 -, C} 2 H 5 -n-C 3 H 7 -, i-C 3 H 7, n-C 4 H 9 -,
_i-C 4 _{H 9} -, or _t-C 4 _{H 9} - is any one of,
Wherein Y _{is, CH 3 O-, C 2 H} 5 O-, n-C 3 H 7 O-, i-C 3 H 7 O-,
_{n-C 4 H 9 O-,} i-C 4 H 9 O-, or _{t-C 4 H} 9 O- is any one of,
Said M is one of Li, Na, K, or Cs. The manufacturing method of the molded circuit component characterized by the above-mentioned. 5. The electroplating A having either an acidic or neutral bath composition is laminated on the surface of the electroless plating A between the ninth step and the tenth step. The manufacturing method of the molded circuit component characterized by including the 9.5A process to do. 5. The electroplating B or electroless one of any one of acidic, neutral, and alkaline bath compositions on the surface of the electroless plating A after the tenth step. The manufacturing method of the molded circuit component characterized by including the 11th A process which laminates | stacks either plating B. 7. The electroless apparatus according to claim 1, wherein the bath composition is either acidic or neutral on the surface of the electroless plating A between the ninth step and the tenth step. The manufacturing method of the molded circuit component characterized by including the 9.5B process of laminating | stacking the plating C. 6. The method according to claim 5, wherein after the tenth step, any one of electrolytic plating D having an acid, neutral or alkaline bath composition or electroless plating D is laminated on the surface of the electrolytic plating A. The manufacturing method of the molded circuit component characterized by including the 11B process to do.

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