JP2009283797A - Substrate with built-in distributed constant circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in distributed constant circuit capable of improving impedance matching in a portion where electrical parts and a distributed constant circuit are connected, and capable of forming a dielectric layer with a high-dielectric constant, as a single layer, which constitutes the distributed constant circuit. <P>SOLUTION: The substrate 100 with the built-in distributed constant circuit is a multilayer substrate which includes a print wiring board 110, a print wiring board 120 in which a distributed constant circuit 122 and an electronic part 121 for a high frequency circuit connected to the distributed constant circuit 122 are arranged in a signal conductor layer 140, and a dielectric layer 130 having a dielectric constant higher than the dielectric constant of a dielectric portion of the print wiring board 120, wherein the printed wiring board 110, the printed wiring board 120, and the dielectric layer 130 are integrated in such an arrangement that the dielectric layer 130 is sandwiched between the printed wiring board 110 and the printed wiring board 120 configured such that the distributed constant circuit 122 and a ground conductor layer 150 face one surface and the other surface of the dielectric layer 130, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer substrate incorporating a distributed constant circuit.

  As a conventional substrate with a built-in distributed constant circuit, there is a multilayer substrate in which a triplate type distributed constant circuit and a component-mounted circuit are configured as separate layers for miniaturization (see, for example, Patent Document 1).

Here, a conventional substrate with a distributed constant circuit will be described.
As shown in FIG. 5, all the electronic components are arranged on the signal conductor layer 13 on the surface layer of the distributed constant circuit built-in substrate 10 which is a multilayer substrate. The distributed constant circuit is disposed on the triplate type signal line conductor layer 14. The signal conductor layer 13 is connected to the signal conductor layer 14 by a through-hole conductor 16.

Here, the dielectric layer 11 is a low dielectric constant dielectric layer having a relative dielectric constant smaller than 10. The dielectric layer 12 is a high dielectric constant dielectric layer having a relative dielectric constant of 10 or more. The signal conductor layer 13 is a signal conductor layer on which electronic components are arranged. The signal conductor layer 14 is a signal conductor layer in which a distributed constant circuit is disposed. The ground conductor layer 15 is a ground conductor layer of a triplate type distributed constant circuit.
JP-A-5-259720

  However, in the conventional distributed constant circuit built-in substrate 10, the signal conductor layer 13 in which the electronic components are arranged and the signal conductor layer 14 in which the distributed constant circuit is arranged are separate layers. It is necessary to connect the conductor layer 14 with the through-hole conductor 16, and there is a problem that impedance mismatch occurs. In addition, since the distributed constant circuit is configured in a triplate type, two or more dielectric layers 12 having a high dielectric constant are required, and there is a problem that productivity of the multilayer substrate is low.

  Therefore, the present invention has been made in view of the above problems, and can improve impedance matching in a portion connecting an electronic component and a distributed constant circuit, and can be a high dielectric constant dielectric that constitutes the distributed constant circuit. It is an object of the present invention to provide a distributed constant circuit built-in substrate capable of forming a single layer.

In order to achieve the above object, a distributed constant circuit built-in substrate according to the present invention has the following characteristics.
(1) A substrate with a built-in distributed constant circuit according to the present invention includes (a) a first printed wiring board, (b) a signal conductor layer, a distributed constant circuit, and an electronic component connected to the distributed constant circuit. A second printed wiring board disposed; and (c) a dielectric layer made of a material having a dielectric constant higher than the dielectric constant of the dielectric portion of the second printed wiring board, The first printed wiring board and the second printed wiring board so that the distributed constant circuit and the ground conductor layer of the first printed wiring board face one surface and the other surface of the dielectric layer. And a multilayer substrate in which the first printed wiring board, the second printed wiring board, and the dielectric layer are integrated.

  As a result, a high-frequency signal can be transmitted between the distributed constant circuit and the second electronic component in the same signal conductor layer without using a through-hole conductor, so that the width and thickness of the signal line can be controlled. Thus, impedance matching can be improved. In addition, since the distributed constant circuit and the ground conductor layer of the first printed wiring board are arranged so as to face the dielectric layer having a high dielectric constant, the high dielectric constant dielectric that contributes to the miniaturization of the distributed constant circuit. The body layer can be made into a single layer. Furthermore, the productivity of the multilayer substrate can be improved by forming a single dielectric layer having a high dielectric constant.

  (2) The substrate with a built-in distributed constant circuit according to (1) is characterized in that: (a) the first printed wiring board is formed by a through-hole conductor that passes through the dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. The ground conductor layer may be connected to the ground conductor layer of the second printed wiring board.

  As a result, the ground conductor layer of the distributed constant circuit can be moved to the high dielectric constant dielectric layer side, and the high dielectric constant dielectric layer that contributes to miniaturization of the distributed constant circuit can be made into a single layer. .

  (3) The substrate with a built-in distributed constant circuit described in (1) above is (a) a first dielectric layer as the dielectric layer in the same layer, and a dielectric constant of the first dielectric layer. And a second dielectric layer made of a material having a low dielectric constant, and (b) the first printed circuit board facing the portion where the distributed constant circuit is disposed in the second printed wiring board. The first printed wiring board and the second printed wiring are disposed such that a dielectric layer is disposed and the second dielectric layer is disposed so as to face a portion other than the portion where the distributed constant circuit is disposed. A first printed wiring board, the second printed wiring board, the first dielectric layer, and the second dielectric layer, wherein the first dielectric layer and the second dielectric layer are sandwiched between the first dielectric layer and the substrate. It may be a multilayer substrate in which the second dielectric layer is integrated.

As a result, it is possible to contribute to downsizing of the distributed constant circuit without giving the second electronic component the influence of the first dielectric layer made of a high dielectric constant material.
(4) The substrate with a built-in distributed constant circuit according to (3) is configured such that the first printed wiring board is formed by a through-hole conductor that passes through the first dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. The ground conductor layer may be connected to the ground conductor layer of the second printed wiring board.

  As a result, the ground conductor layer of the distributed constant circuit can be moved to the high dielectric constant dielectric layer side, and the high dielectric constant dielectric layer that contributes to miniaturization of the distributed constant circuit can be made into a single layer. .

  According to the present invention, the distributed constant circuit and the high-frequency circuit electronic component connected to the distributed constant circuit are arranged on the same signal conductor layer. As a result, high-frequency signals can be transmitted between the distributed constant circuit and the high-frequency circuit electronic components in the same signal conductor layer without using through-hole conductors, so that the width and thickness of signal lines can be controlled. Thus, impedance matching can be improved.

  The distributed constant circuit and the ground conductor layer of the first printed wiring board are arranged so as to face the dielectric layer having a high dielectric constant. Then, the ground conductor layer of the first printed wiring board is connected to the ground conductor layer of the second printed wiring board by the through-hole conductor. As a result, the ground conductor layer of the distributed constant circuit can be moved to the high dielectric constant dielectric layer side, and the high dielectric constant dielectric layer that contributes to miniaturization of the distributed constant circuit can be made into a single layer. . Furthermore, the productivity of the multilayer substrate can be improved by forming a single dielectric layer having a high dielectric constant.

(Embodiment 1)
Embodiment 1 according to the present invention will be described below.
<Overview>
The substrate with a built-in distributed constant circuit in the present embodiment has the characteristics shown in (C1) and (C2) below.

  (C1) (a) a first printed wiring board; (b) a second printed wiring board in which a distributed constant circuit and electronic components connected to the distributed constant circuit are arranged on the signal conductor layer; c) a dielectric layer made of a material having a dielectric constant higher than that of the dielectric portion of the second printed wiring board, and (d) a distributed constant circuit and a ground conductor layer of the first printed wiring board. Are arranged such that the dielectric layer is sandwiched between the first printed wiring board and the second printed wiring board so that the first printed wiring board and the second printed wiring board face each other. 2 is a multilayer substrate in which the printed wiring board 2 and the dielectric layer are integrated.

  (C2) The ground conductor layer of the first printed wiring board is connected to the ground conductor layer of the second printed wiring board by the through-hole conductor that passes through the dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. Yes.

Based on the above points, the present embodiment will be described with reference to the drawings.
<Board with distributed constant circuit>
First, the distributed constant circuit built-in substrate in the present embodiment will be described.

  As shown in FIG. 1, the distributed constant circuit built-in substrate 100 includes a printed wiring board 110, a printed wiring board 120, and a dielectric layer 130. The printed wiring board 110, the printed wiring board 120, and the dielectric layer 130 are integrated by sandwiching the dielectric layer 130 between the printed wiring board 110 and the printed wiring board 120.

The printed wiring board 110 is a printed wiring board having a single layer or a multilayer structure. General electronic components 111 are arranged on both sides or one side of the printed wiring board 110.
The printed wiring board 120 is a printed wiring board having a single layer or a multilayer structure. General electronic components (not shown) are arranged on both sides or one side of the printed wiring board 120. Furthermore, the high-frequency circuit electronic component 121 and the distributed constant circuit 122 are disposed on the same signal conductor layer.

  Here, the distributed constant circuit 122 and the high-frequency circuit electronic component 121 connected to the distributed constant circuit 122 are arranged on the printed wiring board 120 so as to face the dielectric layer 130.

Note that a plurality of high-frequency circuit electronic components 121 may be arranged on the printed wiring board 120, or a plurality of distributed constant circuits 122 may be arranged.
The dielectric material of the printed wiring board 110 is a low dielectric constant material having a relative dielectric constant smaller than 10. As the dielectric material of the printed wiring board 120, a low dielectric constant material having a relative dielectric constant smaller than 10 is used. The dielectric layer 130 is made of a high dielectric constant material having a relative dielectric constant of 10 or more.

  2, the ground conductor layer 160 of the electronic component circuit of the printed wiring board 120 and the ground conductor layer 150 facing the dielectric layer 130 in the printed wiring board 110 are connected to the dielectric layer 130 and the printed wiring. The through-hole conductors 170 that penetrate the substrate 120 are connected.

  Here, the through-hole conductor 170 is formed as close to the input / output portion of the distributed constant circuit 122 as possible. As a result, the dielectric layer 130 is sandwiched between the signal conductor layer 140 of the distributed constant circuit 122 and the ground conductor layer 150, and the electric field 180 of the distributed constant circuit 122 is confined in the dielectric layer 130. The area of the distributed constant circuit is almost inversely proportional to the dielectric constant of the dielectric layer in which the electric field is confined. Therefore, the distributed constant circuit 122 can be reduced in size by sandwiching the dielectric layer 130 having a high dielectric constant between the signal conductor layer 140 and the ground conductor layer 150.

<Summary>
As described above, according to the present embodiment, the high-frequency circuit electronic component and the distributed constant circuit can be signal-connected by the same signal conductor layer without the through-hole conductor. Thus, impedance matching can be easily performed by controlling the width and thickness of the signal line. Further, the dielectric layer having a high dielectric constant that contributes to the miniaturization of the distributed constant circuit can be formed as a single layer. As a result, the productivity of the multilayer substrate can be improved.

(Embodiment 2)
Embodiment 2 according to the present invention will be described below.
<Overview>
The substrate with a built-in distributed constant circuit in the present embodiment has the characteristics shown in (C3) and (C4) below.

  (C3) (a) In the same layer, a first dielectric layer which is a dielectric layer, and a second dielectric layer made of a material having a dielectric constant lower than that of the first dielectric layer (B) the first dielectric layer is disposed so as to face the portion where the distributed constant circuit is disposed in the second printed wiring board, and the portion other than the portion where the distributed constant circuit is disposed. The first dielectric layer and the second dielectric layer are sandwiched between the first printed wiring board and the second printed wiring board so that the second dielectric layer is disposed on the first dielectric layer. The printed wiring board, the second printed wiring board, the first dielectric layer, and the second dielectric layer are integrated multilayer boards.

  (C4) The ground conductor layer of the first printed wiring board becomes the ground conductor layer of the second printed wiring board by the through-hole conductor penetrating the first dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. It is connected.

Based on the above points, the present embodiment will be described with reference to the drawings.
<Board with distributed constant circuit>
First, the distributed constant circuit built-in substrate in the present embodiment will be described.

  As shown in FIG. 3, distributed constant circuit built-in substrate 200 includes dielectric layer 210 and dielectric layer 220 instead of dielectric layer 130 as compared with distributed constant circuit built-in substrate 100 in the first embodiment. . The printed wiring board 110, the printed wiring board 120, the dielectric layer 210, and the dielectric layer 220 are integrated by sandwiching the dielectric layer 210 and the dielectric layer 220 between the printed wiring board 110 and the printed wiring board 120. It is a multilayer substrate.

  Here, the dielectric layer 210 and the dielectric layer 220 are disposed in the same layer so as to be adjacent to each other. Furthermore, the dielectric layer 210 is disposed so as to face the printed wiring board 120 other than the portion where the distributed constant circuit 122 is disposed. A dielectric layer 220 is disposed so as to face a portion of the printed wiring board 120 where the distributed constant circuit 122 is disposed.

The dielectric layer 210 is made of a low dielectric constant material having a relative dielectric constant smaller than 10. The dielectric layer 220 is made of a high dielectric constant material having a relative dielectric constant of 10 or more.
As shown in FIG. 4, the ground conductor layer 160 of the electronic component circuit of the printed wiring board 120 and the ground conductor layer 150 facing the dielectric layer 220 in the printed wiring board 110 are connected to the dielectric layer 220 and the printed wiring. The through-hole conductors 170 that penetrate the substrate 120 are connected.

  Here, the through-hole conductor 170 is formed as close to the input / output portion of the distributed constant circuit 122 as possible. As a result, the dielectric layer 220 is sandwiched between the signal conductor layer 140 and the ground conductor layer 150 of the distributed constant circuit 122, and the electric field 180 of the distributed constant circuit 122 is confined in the dielectric layer 220. The area of the distributed constant circuit is almost inversely proportional to the dielectric constant of the dielectric layer in which the electric field is confined. For these reasons, the distributed constant circuit can be reduced in size by sandwiching the dielectric layer 220 having a high dielectric constant between the signal conductor layer 140 and the ground conductor layer 150.

<Summary>
As described above, according to the present embodiment, the high-frequency circuit electronic component and the distributed constant circuit can be signal-connected by the same signal conductor layer without the through-hole conductor. Thus, impedance matching can be easily performed by controlling the width and thickness of the signal line. Further, the dielectric layer having a high dielectric constant that contributes to the miniaturization of the distributed constant circuit can be formed as a single layer. As a result, the productivity of the multilayer substrate can be improved. Furthermore, it is possible to contribute to the miniaturization of the distributed constant circuit without giving the influence of the dielectric layer having a high dielectric constant to the high frequency circuit electronic component.

(Other)
Note that the substrate with a built-in distributed constant circuit according to the present invention can be reduced in size by integrating the high-frequency circuit electronic component and the distributed constant circuit. Further, it is possible to reduce the size, and at the same time, it is possible to improve impedance matching at a signal connection portion between the high-frequency circuit electronic component and the distributed constant circuit.

Moreover, the substrate with a built-in distributed constant circuit according to the present invention can be applied to a microwave circuit in a radio communication or a radar having a distributed constant circuit. And it can also contribute to size reduction of these microwave circuits.
The distributed constant circuit built-in substrate according to the present invention may be manufactured by a manufacturing method disclosed in Japanese Patent Application Laid-Open No. 11-220262.

  The present invention can be used as a multilayer substrate having a distributed constant circuit incorporated therein.

3 is a configuration diagram of a substrate with a built-in distributed constant circuit according to Embodiment 1. FIG. 2 is a cross-sectional view of a substrate with a built-in distributed constant circuit according to Embodiment 1. FIG. FIG. 6 is a configuration diagram of a substrate with a built-in distributed constant circuit in a second embodiment. 6 is a cross-sectional view of a distributed constant circuit built-in substrate in Embodiment 2. FIG. It is sectional drawing of the board | substrate with a distributed constant circuit in a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 11 with distributed constant circuit Low dielectric constant dielectric layer 12 High dielectric constant dielectric layer 13 Signal conductor layer 14 of electronic component circuit Signal conductor layer 15 of distributed constant circuit Ground conductor layer 16 of distributed constant circuit Through-hole conductor DESCRIPTION OF SYMBOLS 100 Board | substrate with a distributed constant circuit 110 Printed wiring board 111 General electronic component 120 Printed wiring board 121 Electronic component for high frequency circuits 122 Distributed constant circuit 130 High dielectric constant dielectric layer 140 Signal conductor layer 150 of distributed constant circuit 150 Ground conductor layer 160 Ground conductor layer 170 of electronic component circuit Through-hole conductor 180 Electric field 200 Distributed constant circuit built-in substrate 210 Low dielectric constant dielectric layer 220 High dielectric constant dielectric layer

Claims (4)

A first printed wiring board;
A second printed wiring board in which a distributed constant circuit and electronic components connected to the distributed constant circuit are disposed on the signal conductor layer;
A dielectric layer made of a material having a dielectric constant higher than the dielectric constant of the dielectric portion of the second printed wiring board,
The first printed wiring board and the second printed wiring so that the distributed constant circuit and the ground conductor layer of the first printed wiring board face one surface and the other surface of the dielectric layer. Built-in distributed constant circuit, characterized in that the first printed wiring board, the second printed wiring board, and the dielectric layer are integrated into a multilayer substrate in an arrangement in which the dielectric layer is sandwiched between the substrate and the dielectric layer. substrate. A ground conductor layer of the first printed wiring board is connected to a ground conductor layer of the second printed wiring board by a through-hole conductor that passes through the dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. 2. The distributed constant circuit built-in substrate according to claim 1, wherein: In the same layer, a first dielectric layer that is the dielectric layer, and a second dielectric layer made of a material having a dielectric constant lower than that of the first dielectric layer,
In the second printed wiring board, the first dielectric layer is disposed so as to face a portion where the distributed constant circuit is disposed, and the second dielectric layer is disposed so as to face a portion other than the portion where the distributed constant circuit is disposed. An arrangement in which the first dielectric layer and the second dielectric layer are sandwiched between the first printed wiring board and the second printed wiring board so that the second dielectric layer is arranged. The first printed wiring board, the second printed wiring board, the first dielectric layer, and the second dielectric layer are integrated multilayer boards. The distributed constant circuit built-in substrate described. A ground conductor layer of the first printed wiring board is formed by a through-hole conductor penetrating the first dielectric layer and the vicinity of the input / output portion of the distributed constant circuit. The distributed constant circuit built-in substrate according to claim 3, wherein the substrate is embedded in the distributed constant circuit.

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