JP2009280890A5 - - Google Patents

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Publication number
JP2009280890A5
JP2009280890A5 JP2008137089A JP2008137089A JP2009280890A5 JP 2009280890 A5 JP2009280890 A5 JP 2009280890A5 JP 2008137089 A JP2008137089 A JP 2008137089A JP 2008137089 A JP2008137089 A JP 2008137089A JP 2009280890 A5 JP2009280890 A5 JP 2009280890A5
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JP
Japan
Prior art keywords
switching
output
circuit
power supply
short
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JP2008137089A
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English (en)
Japanese (ja)
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JP2009280890A (ja
JP5429771B2 (ja
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Priority claimed from JP2008137089A external-priority patent/JP5429771B2/ja
Priority to JP2008137089A priority Critical patent/JP5429771B2/ja
Priority to CN2009801169298A priority patent/CN102027154B/zh
Priority to PCT/JP2009/059275 priority patent/WO2009145093A1/ja
Priority to KR1020107025302A priority patent/KR101250336B1/ko
Priority to US12/989,438 priority patent/US8404089B2/en
Priority to TW098117298A priority patent/TWI452160B/zh
Publication of JP2009280890A publication Critical patent/JP2009280890A/ja
Publication of JP2009280890A5 publication Critical patent/JP2009280890A5/ja
Publication of JP5429771B2 publication Critical patent/JP5429771B2/ja
Application granted granted Critical
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JP2008137089A 2008-05-26 2008-05-26 スパッタリング方法 Active JP5429771B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008137089A JP5429771B2 (ja) 2008-05-26 2008-05-26 スパッタリング方法
US12/989,438 US8404089B2 (en) 2008-05-26 2009-05-20 Sputtering method
PCT/JP2009/059275 WO2009145093A1 (ja) 2008-05-26 2009-05-20 スパッタリング方法
KR1020107025302A KR101250336B1 (ko) 2008-05-26 2009-05-20 스퍼터링 방법
CN2009801169298A CN102027154B (zh) 2008-05-26 2009-05-20 溅射方法
TW098117298A TWI452160B (zh) 2008-05-26 2009-05-25 Sputtering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008137089A JP5429771B2 (ja) 2008-05-26 2008-05-26 スパッタリング方法

Publications (3)

Publication Number Publication Date
JP2009280890A JP2009280890A (ja) 2009-12-03
JP2009280890A5 true JP2009280890A5 (https=) 2011-04-28
JP5429771B2 JP5429771B2 (ja) 2014-02-26

Family

ID=41376972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008137089A Active JP5429771B2 (ja) 2008-05-26 2008-05-26 スパッタリング方法

Country Status (6)

Country Link
US (1) US8404089B2 (https=)
JP (1) JP5429771B2 (https=)
KR (1) KR101250336B1 (https=)
CN (1) CN102027154B (https=)
TW (1) TWI452160B (https=)
WO (1) WO2009145093A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5124344B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
CN103069928B (zh) * 2010-08-18 2015-03-25 株式会社爱发科 直流电源装置
EP2463890A1 (en) * 2010-12-08 2012-06-13 Applied Materials, Inc. Generating plasmas in pulsed power systems
AT513190B9 (de) * 2012-08-08 2014-05-15 Berndorf Hueck Band Und Pressblechtechnik Gmbh Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
EP2879471B1 (en) * 2012-09-07 2017-05-10 Kyosan Electric Mfg. Co., Ltd. Dc power supply device, and control method for dc power supply device
KR20140038771A (ko) * 2012-09-21 2014-03-31 한국과학기술연구원 기판상에 금속박막을 증착하는 방법
EP3035365A1 (en) * 2014-12-19 2016-06-22 TRUMPF Huettinger Sp. Z o. o. Method of detecting an arc occurring during the power supply of a plasma process, control unit for a plasma power supply, and plasma power supply
US9812305B2 (en) * 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
CN105071657B (zh) * 2015-09-11 2017-12-22 范承 双向可调直流电源
GB2548209B (en) 2016-03-07 2018-03-21 Intelligent Growth Solutions Ltd Controllable power and lighting system
CN110050325B (zh) * 2016-12-19 2021-11-09 应用材料公司 溅射沉积源、具有该溅射沉积源的溅射沉积设备以及将层沉积于基板上的方法
EP3396698A1 (en) * 2017-04-27 2018-10-31 TRUMPF Hüttinger GmbH + Co. KG Power converter unit, plasma processing equipment and method of controlling several plasma processes

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
DE9109503U1 (de) * 1991-07-31 1991-10-17 Magtron Magneto Elektronische Geraete Gmbh, 7583 Ottersweier Schaltungsanordnung für ein Stromversorgungsgerät für Geräte und Anlagen der Plasma- und Oberflächentechnik
US5698082A (en) * 1993-08-04 1997-12-16 Balzers Und Leybold Method and apparatus for coating substrates in a vacuum chamber, with a system for the detection and suppression of undesirable arcing
JP3028292B2 (ja) * 1995-10-20 2000-04-04 株式会社ハイデン研究所 正負パルス式高電圧電源
JP3429957B2 (ja) 1996-08-28 2003-07-28 松下電器産業株式会社 スパッタリング方法及び装置
DE19651811B4 (de) * 1996-12-13 2006-08-31 Unaxis Deutschland Holding Gmbh Vorrichtung zum Belegen eines Substrats mit dünnen Schichten
DE19702187C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren und Einrichtung zum Betreiben von Magnetronentladungen
JPH11146659A (ja) * 1997-11-05 1999-05-28 Haiden Kenkyusho:Kk 正負パルス式スイッチング電源装置
AU2003241958A1 (en) * 2002-05-31 2003-12-19 Shibaura Mechatronics Corporation Discharging power source, sputtering power source, and sputtering device
JP4780972B2 (ja) * 2004-03-11 2011-09-28 株式会社アルバック スパッタリング装置
JP4766368B2 (ja) * 2005-03-10 2011-09-07 独立行政法人物質・材料研究機構 バイポーラパルススパッタリング成膜装置および同装置を用いて作製される薄膜材料の製造方法
EP1864313B1 (de) 2005-03-24 2012-12-19 Oerlikon Trading AG, Trübbach Vakuumplasmagenerator
US9997338B2 (en) * 2005-03-24 2018-06-12 Oerlikon Surface Solutions Ag, Pfäffikon Method for operating a pulsed arc source
CN2873799Y (zh) * 2005-04-08 2007-02-28 北京实力源科技开发有限责任公司 一种具有在线清洗功能的磁控溅射靶
JP4922580B2 (ja) * 2005-07-29 2012-04-25 株式会社アルバック スパッタリング装置及びスパッタリング方法
JP4963023B2 (ja) * 2006-01-11 2012-06-27 株式会社アルバック スパッタリング方法及びスパッタリング装置
JP4320019B2 (ja) * 2006-01-11 2009-08-26 株式会社アルバック スパッタリング装置
DE102006028977B4 (de) * 2006-06-23 2012-04-12 Qimonda Ag Sputterdepositions-Vorrichtung

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