JP2009280129A - Car-mounted electronic controller - Google Patents

Car-mounted electronic controller Download PDF

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JP2009280129A
JP2009280129A JP2008135453A JP2008135453A JP2009280129A JP 2009280129 A JP2009280129 A JP 2009280129A JP 2008135453 A JP2008135453 A JP 2008135453A JP 2008135453 A JP2008135453 A JP 2008135453A JP 2009280129 A JP2009280129 A JP 2009280129A
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circuit
signal circuit
circuit board
signal
sub
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JP5255326B2 (en
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Takahiro Yasui
崇博 安井
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Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
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Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To suppress a noise obstacle to a CPU or the like from a relay or the like. <P>SOLUTION: A power circuit in which at least a relay 22 is mounted, and a main signal circuit in which signal system electric components including at least a CPU 32, are formed in different circuit boards (power circuit board 21 and a main signal circuit board 31), respectively. A sub signal circuit in which signal system electric components other than the CPU are provided separately from the main signal circuit, and this sub signal circuit is interposed between the power circuit board 21 and the main signal circuit board 31, in the state where a circuit board (sub signal circuit board 41) different from the power circuit board and the main signal circuit board, is installed. The sub signal is ground-connected to the ground of a power circuit different from that of the main signal circuit. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、自動車用の電気接続箱に収容される車載用電子制御装置(以下、「ECU」という。)に関し、より詳しくは、ノイズ障害を低減できるようなECUに関する。   The present invention relates to an on-vehicle electronic control device (hereinafter referred to as “ECU”) accommodated in an electric junction box for automobiles, and more particularly to an ECU capable of reducing noise disturbance.

ECUは、プリント配線板上に電気部品が実装された回路基板がケース内に収納されて構成されており、実装される電気部品等は車種やグレード、仕向けごとに異なる。   The ECU is configured such that a circuit board on which an electrical component is mounted on a printed wiring board is housed in a case, and the mounted electrical component differs depending on the vehicle type, grade, and destination.

また、ECUに収納される回路基板には多数の電気部品が必要であるとともに、複数の回路が必要であるため、回路基板は、バスバー等、大電流用の配線板を用いる。   In addition, since the circuit board housed in the ECU requires a large number of electrical components and a plurality of circuits, the circuit board uses a high current wiring board such as a bus bar.

しかし、上記のようにECUが車種等によって異なるものであるため、この大電流用の配線板にも、多様な形状のものが必要となる。   However, since the ECU differs depending on the vehicle type as described above, the wiring board for large current needs to have various shapes.

ところが、バスバーは、サイズが大きくなり、また重いという課題があり、近年の小型化軽量化のニーズに合致しにくくなってきている。   However, the bus bar has a problem that it is large in size and heavy, and has become difficult to meet the recent needs for downsizing and weight reduction.

このような状況の中、下記特許文献1、2に開示されているように、バスバーに対する依存度を低める提案がなされている。   Under such circumstances, as disclosed in Patent Documents 1 and 2 below, proposals have been made to reduce the dependency on the bus bar.

また、特許文献1、2にも開示されているように、高電流のパワー回路を備えるパワー基板と、低電流のシグナル回路を備えるシグナル基板とに基板を分けることが行われているが、2個の基板を接続する必要があるため、ジャンパなどで接続することが行われている。   Further, as disclosed in Patent Documents 1 and 2, the substrate is divided into a power substrate including a high current power circuit and a signal substrate including a low current signal circuit. Since it is necessary to connect the individual substrates, the connection is performed using a jumper or the like.

しかし、上記のようにジャンパを用いて並設した場合には、回路設計において、パワー回路かシグナル回路のどちらか一方の回路の一部を、他方の回路と同じ基板上に設ける必要がある。   However, when juxtaposed using jumpers as described above, in circuit design, it is necessary to provide a part of either the power circuit or the signal circuit on the same substrate as the other circuit.

例えば、シグナル基板にパワー回路の一部を設けると、パワー回路の電流経路が長くなり、そこからシグナル基板上のシグナル回路へノイズが伝播しやすくなる問題が発生する。   For example, when a part of the power circuit is provided on the signal board, the current path of the power circuit becomes long, and there is a problem that noise easily propagates from there to the signal circuit on the signal board.

また、パワー基板にシグナル回路の一部を設けると、パワー回路から発生するノイズが、パワー基板上のシグナル回路へ伝播しやすくなる問題が発生する。
特開2006−93210号公報 特開2001−16746号公報
Further, when a part of the signal circuit is provided on the power board, a problem that noise generated from the power circuit easily propagates to the signal circuit on the power board occurs.
JP 2006-93210 A JP 2001-16746 A

そこで、この発明は、ノイズ障害を抑制できる車載用電子制御装置を得ることを主たる目的とする。   Accordingly, the main object of the present invention is to obtain an on-vehicle electronic control device that can suppress noise disturbance.

この発明は、ノイズ発生源となるノイズ発生電気部品を実装するパワー回路と、信号系である信号系電気部品を実装するメインシグナル回路がそれぞれ別の回路基板に形成されるとともに、前記メインシグナル回路とは別に、信号系電気部品を実装するサブシグナル回路が備えられ、該サブシグナル回路が、前記メインシグナル回路とは別の回路基板に搭載された状態で前記メインシグナル回路と前記パワー回路の間に介装され、前記サブシグナル回路のグランドが前記メインシグナル回路のグランドとは別の前記パワー回路のグランドに接続された車載用電子制御装置であることを特徴とする。   According to the present invention, a power circuit for mounting a noise generating electrical component serving as a noise generating source and a main signal circuit for mounting a signal electrical component that is a signal system are formed on separate circuit boards, respectively, and the main signal circuit Separately, a sub-signal circuit for mounting a signal system electrical component is provided, and the sub-signal circuit is mounted on a circuit board different from the main signal circuit between the main signal circuit and the power circuit. And the ground of the sub signal circuit is connected to the ground of the power circuit different from the ground of the main signal circuit.

この発明の態様として、前記メインシグナル回路の信号系電気部品を、CPUを含む信号系の電気部品とし、前記サブシグナル回路の信号系電気部品を、CPU以外の信号系の電気部品とすることができる。   As an aspect of the present invention, the signal system electrical component of the main signal circuit is a signal system electrical component including a CPU, and the signal system electrical component of the sub signal circuit is a signal system electrical component other than the CPU. it can.

また、この発明の態様として、前記サブシグナル回路を、前記パワー回路とは別の回路基板に搭載することができる。   Further, as an aspect of the present invention, the sub signal circuit can be mounted on a circuit board different from the power circuit.

この場合には、前記サブシグナル回路を搭載した回路基板を、前記パワー回路を形成したパワー回路基板と前記メインシグナル回路を形成したメインシグナル回路基板を跨る位置に設けることができる。   In this case, the circuit board on which the sub-signal circuit is mounted can be provided at a position straddling the power circuit board on which the power circuit is formed and the main signal circuit board on which the main signal circuit is formed.

また、前記サブシグナル回路を搭載した回路基板を、樹脂製のハウジングを介して設けることができる。   A circuit board on which the sub-signal circuit is mounted can be provided via a resin housing.

この発明の態様として、前記メインシグナル回路を、共通の信号系電気部品を実装して形成するとともに、前記サブシグナル回路を、仕様別の信号系電気部品を実装して形成することができる。   As an aspect of the present invention, the main signal circuit can be formed by mounting a common signal system electrical component, and the sub signal circuit can be formed by mounting a signal system electrical component according to specifications.

上記仕様別とは、車種別、グレード別、あるいは仕向け別であることを含む。   The above specification includes the classification by vehicle type, grade, or destination.

この発明によれば、ノイズ障害を抑制できる車載用電子制御装置を得ることができる。   According to this invention, the vehicle-mounted electronic control apparatus which can suppress a noise disturbance can be obtained.

この発明を実施するための一形態を、以下図面を用いて説明する。
図1は、車載用電子制御装置、すなわちECU11の構造を示す概略図であり、この図に示すように、ECU11は複数の回路基板21,31,41がケース51内に収納されて構成されている。
An embodiment for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic diagram showing the structure of an in-vehicle electronic control unit, that is, an ECU 11. As shown in this figure, the ECU 11 is configured by housing a plurality of circuit boards 21, 31, 41 in a case 51. Yes.

回路基板21,31,41には、それぞれ別体で3種類のものがある。リレー22等のようにノイズ発生源となるノイズ発生電気部品としての高電流を必要とする電気部品を実装するパワー回路25(図2参照)を搭載したパワー回路基板21と、CPU(中央処理装置)32のような信号系である信号系電気部品を実装するメインシグナル回路35を搭載したメインシグナル回路基板31と、CPU以外の信号系の電気部品を実装するサブシグナル回路45を搭載したサブシグナル回路基板41である。前記メインシグナル回路35は、従来技術のシグナル回路に対応している。メインシグナル回路基板31は、前記のCPU32なしで、通信回路だけを実装したものでもよい。   There are three types of circuit boards 21, 31 and 41, respectively. A power circuit board 21 mounted with a power circuit 25 (see FIG. 2) on which an electrical component that requires a high current as a noise generating electrical component such as a relay 22 is mounted, and a CPU (Central Processing Unit) ) A sub signal having a main signal circuit board 31 on which a main signal circuit 35 for mounting a signal system electrical component such as 32 is mounted and a sub signal circuit 45 for mounting a signal system electrical component other than the CPU. This is a circuit board 41. The main signal circuit 35 corresponds to a conventional signal circuit. The main signal circuit board 31 may have only the communication circuit mounted without the CPU 32.

パワー回路基板21には、リレー22等のほか、コネクタ23が実装されている。   In addition to the relay 22 and the like, a connector 23 is mounted on the power circuit board 21.

メインシグナル回路基板31には、CPU32を中心とする電気部品とコネクタ33が実装されている。また、このメインシグナル回路基板31に搭載されるメインシグナル回路35は、車種ごと、グレードごと、あるいは仕向けごとに製造されるECU11において、共通に使用できるものである。一種類または数種類用意される。   On the main signal circuit board 31, electrical components centered on the CPU 32 and a connector 33 are mounted. The main signal circuit 35 mounted on the main signal circuit board 31 can be used in common in the ECU 11 manufactured for each vehicle type, grade, or destination. One or several types are prepared.

サブシグナル回路基板41には、ノイズに弱いCPU以外の電気部品が実装されているが、搭載されるサブシグナル回路45は、車種ごと、グレードごと、仕向けごとに異なる仕様別のものである。このサブシグナル回路基板41は、多種類用意される。   The sub-signal circuit board 41 is mounted with electrical components other than the CPU that is vulnerable to noise, but the mounted sub-signal circuit 45 has different specifications for each vehicle type, grade, and destination. Many types of sub-signal circuit boards 41 are prepared.

すなわち、サブシグナル回路基板41を選択することにより、多様な車種や、グレード、仕向けに応じたECU11を得ることができる。   That is, by selecting the sub-signal circuit board 41, it is possible to obtain ECUs 11 corresponding to various vehicle types, grades, and destinations.

これらの各回路基板21,31,41の接続は、次のように行う。
パワー回路基板21とメインシグナル回路基板31を離間状態で並設し、サブシグナル回路基板41を、パワー回路基板21とメインシグナル回路基板31の端部に跨るような状態で接続する。接続は、正面視よこながH型の樹脂製のハウジング61を介して行う。
These circuit boards 21, 31, 41 are connected as follows.
The power circuit board 21 and the main signal circuit board 31 are juxtaposed in a separated state, and the sub signal circuit board 41 is connected so as to straddle the end portions of the power circuit board 21 and the main signal circuit board 31. The connection is made through a housing 61 made of resin that is H-shaped when viewed from the front.

すなわち、ハウジング61の上側の溝状の空間に、サブシグナル回路基板41の縁部41aを嵌め込んだ状態で水平に固定し、このサブシグナル回路基板41とパワー回路基板21、メインシグナル回路基板31を、棒状の複数本の端子63で接続する。   That is, the sub-signal circuit board 41 is horizontally fixed in the groove-shaped space on the upper side of the housing 61 with the edge 41a fitted therein, and the sub-signal circuit board 41, the power circuit board 21, and the main signal circuit board 31 are fixed. Are connected by a plurality of rod-like terminals 63.

そして、図2に示したように、パワー回路25のグランドG1と、メインシグナル回路35のグランドG2を別にするとともに、サブシグナル回路45をパワー回路25のグランドG1(フレームグランド)にグランド接続して1点グランドとする。   Then, as shown in FIG. 2, the ground G1 of the power circuit 25 and the ground G2 of the main signal circuit 35 are separated, and the sub-signal circuit 45 is connected to the ground G1 (frame ground) of the power circuit 25. One point ground.

このように構成されたECU11では、パワー回路25と、メインシグナル回路35と、サブシグナル回路45が、別の回路基板に形成されている上に、サブシグナル回路41が、メインシグナル回路35のグランドG2とは別のパワー回路25のグランドG1にグランド接続されている。   In the ECU 11 configured as described above, the power circuit 25, the main signal circuit 35, and the sub signal circuit 45 are formed on different circuit boards, and the sub signal circuit 41 is connected to the ground of the main signal circuit 35. It is connected to the ground G1 of the power circuit 25 different from G2.

このため、リレー22のようなノイズの発生源を有するパワー回路25から、伝導や放射(輻射)によって伝播するノイズが、メインシグナル回路35に侵入するのを抑えることができる。   For this reason, it is possible to prevent noise propagating by conduction or radiation (radiation) from entering the main signal circuit 35 from the power circuit 25 having a noise generation source such as the relay 22.

しかも、サブシグナル回路45が、パワー回路基板21とは別の回路基板(サブシグナル回路基板41)に搭載されているので、メインシグナル回路35へのノイズの伝播をよりよく抑えることができる。   In addition, since the sub signal circuit 45 is mounted on a circuit board (sub signal circuit board 41) different from the power circuit board 21, the propagation of noise to the main signal circuit 35 can be better suppressed.

また、サブシグナル回路基板41が、パワー回路基板21とメインシグナル回路基板31を跨る位置に設けられているので、各回路基板21,31,41が並ぶ方向の長さが長くなるのを抑えることができる。   In addition, since the sub signal circuit board 41 is provided at a position straddling the power circuit board 21 and the main signal circuit board 31, it is possible to suppress the length in the direction in which the circuit boards 21, 31, 41 are arranged from becoming long. Can do.

さらに、サブシグナル回路基板41が、樹脂製のハウジング61を介して設けられている。よって、ノイズの影響を受けにくくなる。   Further, a sub signal circuit board 41 is provided via a resin housing 61. Therefore, it becomes difficult to be influenced by noise.

また、ハウジング61の下端部61aは、図1に示したようにパワー回路基板21、メインシグナル回路基板31の下に突出しており、圧入または熱溶着で固定されている。このため、ハウジング61によってパワー回路基板21とメインシグナル回路基板31を固定することができるので、端子63の半田付けの際にも効果的である。   Further, the lower end 61a of the housing 61 protrudes under the power circuit board 21 and the main signal circuit board 31 as shown in FIG. 1, and is fixed by press-fitting or heat welding. For this reason, since the power circuit board 21 and the main signal circuit board 31 can be fixed by the housing 61, it is also effective when the terminals 63 are soldered.

加えて、メインシグナル回路基板31には車種やグレード、仕向けに共通の回路が搭載され、サブシグナル回路基板41には車種やグレード、仕向けごとに異なる仕様別の回路が搭載されている。このため、使用するサブシグナル回路基板41を適宜選択することにより、車種やグレードに応じて柔軟に対応することが可能である。つまり、段替えの容易化や工程製造の削減を図り、容易な製造を実現できる。   In addition, a common circuit is mounted on the main signal circuit board 31 for the vehicle type, grade, and destination, and a circuit for each specification that is different for each vehicle type, grade, and destination is mounted on the sub-signal circuit board 41. For this reason, it is possible to flexibly cope with the vehicle type and grade by appropriately selecting the sub signal circuit board 41 to be used. That is, it is possible to realize easy manufacturing by facilitating changeover and reducing process manufacturing.

また、バスバーを省略できるので、上記の段替えの容易化などを図れる上に、コストを抑えることにも貢献する。   Further, since the bus bar can be omitted, the above-described changeover can be facilitated and the cost can be reduced.

本願のノイズ発生源とは、リレー、ブザー、モータ、ソレノイド、調光制御するランプなどがあり、これらは、インダクタンス負荷もしくはPWM制御(ON/OFFを高速で行う)負荷となるものを指す。   The noise generation source of the present application includes a relay, a buzzer, a motor, a solenoid, a lamp for dimming control, and the like, and these indicate an inductance load or a PWM control (ON / OFF is performed at high speed) load.

以上はこの発明を実施するための一形態であって、この発明は上記の構成のみに限定されるものではなく、その他の形態を採用することができる。
たとえば、サブシグナル回路をパワー回路基板に搭載することもできる。
The above is one form for implementing this invention, This invention is not limited only to said structure, Other forms can be employ | adopted.
For example, the sub-signal circuit can be mounted on the power circuit board.

ECUの概略構造を示す断面図。Sectional drawing which shows schematic structure of ECU. 各回路の設置構造を示す説明図。Explanatory drawing which shows the installation structure of each circuit.

符号の説明Explanation of symbols

11…ECU
21…パワー回路基板
22…リレー
25…パワー回路
31…メインシグナル回路基板
32…CPU
35…メインシグナル回路
41…サブシグナル回路基板
45…サブシグナル回路
61…ハウジング
G1,G2…グランド
11 ... ECU
21 ... Power circuit board 22 ... Relay 25 ... Power circuit 31 ... Main signal circuit board 32 ... CPU
35 ... Main signal circuit 41 ... Sub signal circuit board 45 ... Sub signal circuit 61 ... Housing G1, G2 ... Ground

Claims (6)

ノイズ発生源となるノイズ発生電気部品を実装するパワー回路と、信号系である信号系電気部品を実装するメインシグナル回路がそれぞれ別の回路基板に形成されるとともに、
前記メインシグナル回路とは別に、信号系電気部品を実装するサブシグナル回路が備えられ、
該サブシグナル回路が、前記メインシグナル回路とは別の回路基板に搭載された状態で前記メインシグナル回路と前記パワー回路の間に介装され、
前記サブシグナル回路のグランドが前記メインシグナル回路のグランドとは別の前記パワー回路のグランドに接続された
車載用電子制御装置。
A power circuit for mounting a noise generating electrical component as a noise generation source and a main signal circuit for mounting a signal system electrical component which is a signal system are formed on separate circuit boards, respectively.
In addition to the main signal circuit, a sub-signal circuit for mounting signal system electrical components is provided,
The sub signal circuit is interposed between the main signal circuit and the power circuit in a state of being mounted on a circuit board different from the main signal circuit,
A vehicle-mounted electronic control device in which the ground of the sub signal circuit is connected to the ground of the power circuit different from the ground of the main signal circuit.
前記メインシグナル回路の信号系電気部品が、CPUを含む信号系の電気部品であり、前記サブシグナル回路の信号系電気部品が、CPU以外の信号系の電気部品である
請求項1に記載の車載用電子制御装置。
The in-vehicle system according to claim 1, wherein the signal system electrical component of the main signal circuit is a signal system electrical component including a CPU, and the signal system electrical component of the sub signal circuit is a signal system electrical component other than the CPU. Electronic control device.
前記サブシグナル回路が、前記パワー回路とは別の回路基板に搭載された
請求項1または請求項2に記載の車載用電子制御装置。
The in-vehicle electronic control device according to claim 1, wherein the sub signal circuit is mounted on a circuit board different from the power circuit.
前記サブシグナル回路を搭載した回路基板が、前記パワー回路を形成したパワー回路基板と前記メインシグナル回路を形成したメインシグナル回路基板を跨る位置に設けられた
請求項3に記載の車載用電子制御装置。
The in-vehicle electronic control device according to claim 3, wherein the circuit board on which the sub signal circuit is mounted is provided at a position straddling the power circuit board on which the power circuit is formed and the main signal circuit board on which the main signal circuit is formed. .
前記サブシグナル回路を搭載した回路基板が、樹脂製のハウジングを介して設けられた
請求項4に記載の車載用電子制御装置。
The on-vehicle electronic control device according to claim 4, wherein a circuit board on which the sub signal circuit is mounted is provided via a resin housing.
前記メインシグナル回路が、共通の信号系電気部品を実装して形成されるものであるとともに、
前記サブシグナル回路が、仕様別の信号系電気部品を実装して形成されるものである
請求項1から請求項5のうちのいずれか一項に記載の車載用電子制御装置。
The main signal circuit is formed by mounting a common signal system electrical component,
The on-vehicle electronic control device according to any one of claims 1 to 5, wherein the sub-signal circuit is formed by mounting a signal electric component according to specifications.
JP2008135453A 2008-05-23 2008-05-23 In-vehicle electronic control unit Active JP5255326B2 (en)

Priority Applications (1)

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JP2008135453A JP5255326B2 (en) 2008-05-23 2008-05-23 In-vehicle electronic control unit

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2604477A1 (en) * 2011-10-26 2013-06-19 Honda Motor Co., Ltd. Control device
JP2015147487A (en) * 2014-02-06 2015-08-20 矢崎総業株式会社 Method of determining earth cable connection points in vehicle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481550A (en) * 1990-07-19 1992-03-16 Mitsubishi Electric Corp Earthed circuit for automobile electronic device
JP2005151613A (en) * 2003-11-11 2005-06-09 Sumitomo Wiring Syst Ltd Circuit structure
JP2006216677A (en) * 2005-02-02 2006-08-17 Denso Corp Wiring structure and electronic device using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481550A (en) * 1990-07-19 1992-03-16 Mitsubishi Electric Corp Earthed circuit for automobile electronic device
JP2005151613A (en) * 2003-11-11 2005-06-09 Sumitomo Wiring Syst Ltd Circuit structure
JP2006216677A (en) * 2005-02-02 2006-08-17 Denso Corp Wiring structure and electronic device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2604477A1 (en) * 2011-10-26 2013-06-19 Honda Motor Co., Ltd. Control device
US9404433B2 (en) 2011-10-26 2016-08-02 Honda Motor Co., Ltd. Control device equipped with multiple grounds
JP2015147487A (en) * 2014-02-06 2015-08-20 矢崎総業株式会社 Method of determining earth cable connection points in vehicle

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