JP2009264909A - Electrostatic device method for manufacturing and electrostatic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic device having a simple structure, achieving remarkable reduction in size, can be easily manufactured, and remarkably reduce the manufacturing costs. <P>SOLUTION: A tilt sensor as the electrostatic device is manufactured by a method including a structure creating step of creating two electrode structures and a bonding step of bonding the created two electrode structures. The two electrode structures are created by a method including an electrode offset printing step and an electrode curing step. In the electrode offset printing step, a mold 89 for electrode formation in which an electrostatic electrode pattern is formed by a process combining an ultraviolet lithography and electroforming is mounted on a roll 87 of an offset printing device 86 to perform offset printing of a photosensitive resin 90 having electric conductivity on a molding 1. In the electrode curing step, the printed photosensitive resin 90 is cured to form the electrostatic electrode on the molding 1. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing an electrostatic device such as a capacitive sensor, an electrostatic actuator, and an electrostatic switch.

  Conventionally, electrostatic capacitance type sensors are widely used as various sensors such as an inclination angle sensor, a pressure sensor, and an acceleration sensor. For example, the tilt angle sensor is configured to immerse an appropriate liquid in two electrodes and detect a change in liquid level due to the tilt as a change in capacitance. In addition, the pressure sensor and the acceleration sensor make use of the fact that when one of the two electrodes is fixed and the other is movable, the capacitance between the electrodes changes when the position of the movable electrode changes due to pressure or acceleration. Is.

  In this type of capacitive sensor, in order to allow the liquid to freely move between the electrodes or to make the distance between the electrodes variable, the electrodes are evacuated or air or the like is used. It has been practiced to use a gas with a low dielectric constant. However, in this method, the dielectric constant, which is a determinant of the amount of charge accumulated in the capacitor, is lowered, and the electrode area has to be increased in order to improve the sensitivity of the sensor. This has led to an increase in the element area, which has been a cause of a decrease in yield during manufacture of the sensor and an obstacle to miniaturization.

In this regard, for example, Non-Patent Document 1 discloses a capacitive pressure sensor that performs signal amplification using a field effect transistor (FET). Non-Patent Document 1 assumes that this configuration can detect pressure and acceleration with high sensitivity.
S. Buschnakowski, A.B. Bertz, W.M. Brauer, S .; Heinz, R.A. Schuberth, G.M. Ebest and T.W. Gessner: "DEVELOPMENT AND CHARACTERISATION OF A HIGH ASPECT RATIO VERTICAL FET SENSOR FOR MOTION DETECTION" TRANSDUCERS '03, Boston, June 8-12, 2003. 1391-1394.

On the other hand, Patent Document 1 points out that the structure of Non-Patent Document 1 described above is complicated in structure and manufacturing process, and in order to solve this, a capacitive sensor having the following structure is used. is suggesting. That is, the capacitive sensor of Patent Document 1 includes a substrate and a gate electrode plate. The substrate has two main surfaces facing each other, and a first conductivity type source region and a first conductivity type drain region are provided at a predetermined interval on one surface thereof. In the substrate, a region of the second conductivity type located between the source region and the drain region is a channel region. The gate electrode plate faces the channel region. The gate electrode plate is provided so as to be movable in one direction parallel to the surface of the channel region, and is applied to the gate electrode plate based on a change in the facing area between the channel region and the gate electrode plate. Detect force. Patent Document 1 assumes that this configuration can provide a capacitive sensor that has a simple structure and is easy to manufacture.
JP 2007-71846 A

In addition, the capacitance type sensor disclosed in Patent Document 2 is provided at a position facing a first substrate having a thin film portion that is displaced by an external force and a movable electrode formed on the thin film portion, and the movable electrode. And at least one second substrate having a fixed electrode. A gap is formed between the movable electrode and the fixed electrode, and a fixing member for fixing the central portion of the thin film portion so as not to be displaced is provided. According to Patent Document 2, it is assumed that a capacitive sensor capable of obtaining a sensor output with excellent linearity can be obtained by this configuration.
JP-A-8-320268

  However, although the configuration disclosed in the above patent document is easy to manufacture to a certain extent, there is still room for improvement in terms of space factor and cost performance.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrostatic device that has a simple structure, can achieve remarkable downsizing, can be easily manufactured, and can significantly reduce manufacturing costs. is there.

Means and effects for solving the problems

  The problems to be solved by the present invention are as described above. Next, means for solving the problems and the effects thereof will be described.

  According to the viewpoint of this invention, the following manufacturing methods of the electrostatic device by which the electrostatic electrode was opposingly arranged are provided. That is, this method for manufacturing an electrostatic device includes a structure manufacturing step for manufacturing a plurality of structures and a bonding step for bonding the plurality of manufactured structures. At least one of the structures to be bonded is manufactured by a method including an electrode offset printing process and an electrode curing process in the structure manufacturing process. In the electrode offset printing step, a conductive resin is prepared by mounting an electrode forming die on which an electrostatic electrode pattern is formed by a process combining ultraviolet lithography or X-ray lithography and electroforming to a roll of an offset printing apparatus. Is offset printed on a resin substrate. In the electrode curing step, the electrostatic electrode is formed on the resin substrate by curing the printed resin.

  By this method, a fine-shaped electrostatic electrode can be easily formed by offset printing. Accordingly, the electrostatic device can be remarkably reduced in size, the process for forming the electrostatic electrode can be greatly simplified, and a large-scale apparatus is not required, so that the equipment cost can be greatly reduced. Moreover, since the amount of water, chemicals, and electric power used in the manufacturing process can be greatly reduced by the simplification of the process, the manufacturing cost can be reduced well and the burden on the environment can be suppressed.

  In the manufacturing method of the electrostatic device, the following is preferable. That is, in the electrode offset printing step, a plurality of electrostatic electrode patterns for one resin base material are formed using an electrode forming mold in which a plurality of electrostatic electrode patterns for a plurality of electrostatic devices are repeatedly formed. Simultaneously offset printing. Thereafter, the resin substrate is separated for each electrostatic device.

  By this method, a plurality of electrostatic devices can be processed at a time, so that the throughput can be greatly improved and the manufacturing cost can be further reduced.

  In the manufacturing method of the electrostatic device, the electrode offset printing step and the electrode curing step simultaneously form the wiring portion drawn from the electrostatic electrode together with the electrostatic electrode on the resin base material. Is preferred.

  This method also simplifies the manufacturing of the wiring portion, and thus can further simplify the process and reduce the cost.

  In the manufacturing method of the electrostatic device, the following can be performed. That is, the electrode forming mold is manufactured by a method including a resist structure manufacturing step, a conductive layer forming step to be a nickel electroforming seed layer, a nickel electroforming step, and a removing step. In the resist structure manufacturing step, a resist structure is manufactured on the substrate by an ultraviolet lithography method or an X-ray lithography method. In the conductive layer forming step, a conductive layer is formed so as to cover the resist structure. In the nickel electroforming step, nickel is deposited so as to cover the conductive layer. In the removing step, the substrate, the resist structure, and the conductive layer are removed.

  This method makes it possible to form an uneven fine pattern with high precision on an electrode forming mold, and is particularly suitable for forming a shape with an aspect ratio of 1 or less.

  In the method of manufacturing the electrostatic device, the following can be performed. That is, the electrode forming mold is manufactured by a method including a conductive layer forming step as a nickel electroforming seed layer, a resist structure manufacturing step, a nickel electroforming step, and a removing step. In the conductive layer forming step, a conductive layer is formed so as to cover the mold manufacturing substrate. In the resist structure manufacturing step, a resist structure is formed on the conductive layer by an ultraviolet lithography method or an X-ray lithography method. In the nickel electroforming step, nickel is deposited so as to cover the resist structure and a nickel electroforming seed layer in which the resist structure does not exist. In the removing step, the mold manufacturing substrate, the conductive layer, and the resist structure are removed.

  By this method, it is possible to form an uneven fine pattern with high precision on the electrode forming mold, and it is particularly suitable when a shape having an aspect ratio of 1 or more is formed.

  In the manufacturing method of the electrostatic device, the following is preferable. That is, the mold manufacturing substrate is made of silicon, glass, ceramic, or quartz. The resist structure is made of a photosensitive resin. The conductive layer is made of metal. The nickel is formed with a thickness of 0.1 mm or more.

  By this method, an electrostatic device can be manufactured at low cost by a durable and precise electrode forming mold.

  In the electrostatic device manufacturing method, at least one of the structures to be bonded is manufactured by a method including an insulating portion offset printing step and an insulating portion curing step in the structure manufacturing step. The In the insulating part offset printing step, an insulating part forming mold on which an insulating part pattern is formed by a process combining ultraviolet lithography or X-ray lithography and electroforming is mounted on a roll of an offset printing apparatus to achieve electrical insulation. The resin having is offset printed on the resin substrate. In the insulating portion curing step, the insulating portion is formed on the resin base material by curing the printed resin.

  By this method, the insulating portion can be further formed by offset printing, so that the process can be further simplified and the cost can be reduced.

  In the manufacturing method of the electrostatic device, the following is preferable. That is, for at least one of the structures to be bonded, in the structure manufacturing step, the substrate molding die is formed using a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the resin base material is performed before the electrode offset printing process. Through holes for forming through holes are formed in the resin base material by the substrate molding step.

  By this method, by controlling the shape of the resin base material before the electrode is formed, the degree of freedom in designing the electrostatic device can be increased, which can contribute to the reduction of the manufacturing cost. In addition, since the through hole can be easily formed, further cost reduction can be achieved.

  In the manufacturing method of the electrostatic device, the following is preferable. That is, for at least one of the structures to be bonded, in the structure manufacturing step, the substrate molding die is formed using a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the resin base material is performed before the electrode offset printing process. In the substrate molding step, the resin base material is pressure-molded by passing the resin base material through a roller device on which the substrate molding die is mounted.

  By this method, by controlling the shape of the resin base material before the electrode is formed, the degree of freedom in designing the electrostatic device can be increased, which can contribute to the reduction of the manufacturing cost. Moreover, a fine pattern can be easily formed on the surface of the resin substrate.

  In the manufacturing method of the electrostatic device, the following is preferable. That is, for at least one of the structures to be bonded, in the structure manufacturing step, the substrate molding die is formed using a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the resin base material is performed before the electrode offset printing process. In the substrate molding step, the resin base material is molded using the substrate molding die.

  By this method, by controlling the shape of the resin base material before the electrode is formed, the degree of freedom in designing the electrostatic device can be increased, which can contribute to the reduction of the manufacturing cost. Moreover, a fine pattern can be easily formed on the surface of the resin substrate.

  Preferably, the method for manufacturing an electrostatic device further includes a capacitance medium filling step of filling a predetermined amount of capacitance medium between the opposed electrostatic electrodes.

  By this method, a capacitance sensor using a capacitance medium can be provided at a low cost.

  According to another aspect of the present invention, an electrostatic device manufactured by the manufacturing method, specifically, a capacitive sensor, an electrostatic actuator, and an electrostatic switch are provided.

  Next, embodiments of the invention will be described. First, the structure and operating principle of a tilt sensor as an example of an electrostatic device (capacitive sensor) will be described with reference to FIG. FIGS. 1A and 1B are schematic cross-sectional views showing the principle of the tilt sensor 11.

  As shown in FIGS. 1A and 1B, the inclination sensor 11 includes a sensor housing 12 formed in a hollow shape, one common electrode 13, a first counter electrode 14, and a second counter electrode. 15. These electrodes (electrostatic electrodes) 13, 14, 15 are thin plate-like electrodes and are provided on the inner wall of the sensor housing 12. The common electrode 13 is formed in a circular shape, and the two counter electrodes 14 and 15 are both formed in a semicircular shape.

  The inner space of the sensor housing 12 is formed in a circular shape having a predetermined thickness, and the common electrode 13 is disposed on the inner wall on one side in the thickness direction of the inner space. On the other hand, the two counter electrodes 14 and 15 are arranged on the inner wall located on the opposite side to the common electrode 13. A predetermined gap is formed between the counter electrodes 14 and 15 and the common electrode 13 in the thickness direction of the internal space.

  The two counter electrodes 14 and 15 are arranged with a slight gap therebetween. The first counter electrode 14 is disposed so as to correspond to one half of the common electrode 13, and the second counter electrode 14 is disposed so as to correspond to the remaining half of the common electrode 13.

  A predetermined amount of liquid (specifically, silicon oil) is sealed in the internal space of the sensor housing 12. When the sensor housing 12 is tilted in this configuration, the liquid level 16 of silicon oil as the capacitance medium changes relatively, so that the area where the two counter electrodes 14 and 15 are immersed changes. By detecting this as a change in capacitance, the inclination direction and the inclination angle θ of the member or the like to which the sensor housing 12 is attached can be acquired.

  Next, a detailed configuration of the tilt sensor 11 will be described with reference to FIG. FIG. 2 is an exploded perspective view of the tilt sensor 11.

  As shown in FIG. 2, the inclination sensor 11 is configured by joining a first electrode structure 31 and a second electrode structure 32 to each other. The first electrode structure 31 has a configuration in which the counter electrodes 14 and 15 are formed on a surface on one side in the thickness direction of a resin substrate 51 formed to have a predetermined thickness, and an insulating resin layer 53 is further laminated. It has become. In FIG. 2, the resin substrate 51 and the insulating resin layer 53 are illustrated in a separated state in order to better illustrate the configuration of the insulating resin layer 53.

  A hollow portion 54 is formed in the insulating resin layer 53 so as to penetrate therethrough. The hollow portion 54 corresponds to the internal space of the sensor housing 12 included in the inclination sensor 11. The hollow portion 54 communicates with an oil injection port 55 formed in the resin substrate 51. The oil injection port 55 is formed as a hole for injecting a predetermined amount of the silicon oil into the hollow portion 54, and after the injection, the oil injection port 55 is closed by a sealing plug 56.

  The counter electrodes 14 and 15 are formed at positions sandwiched between the resin substrate 51 and the insulating resin layer 53. In addition, a pair of wiring portions 57 are provided on one surface of the resin substrate 51 (the surface facing inward during bonding), and the wiring portions 57 are formed so as to be drawn out from the counter electrodes 14 and 15, respectively. The At a position corresponding to one end of each wiring portion 57, a through-hole electrode hole 58 is formed in the resin substrate 51, and a wiring electrode 59 is disposed inside the electrode hole 58. Each wiring electrode 59 is disposed so as to be exposed on the surface facing the outside of the resin substrate 51, and is electrically connected to the counter electrodes 14 and 15 via the wiring portion 57.

  The second electrode structure 32 has a configuration in which the common electrode 13 is formed on a surface on one side in the thickness direction of the resin substrate 52 formed to have a predetermined thickness (a surface facing inward during bonding). . Further, a wiring part 71 is provided on one surface of the resin substrate 52, and the wiring part 71 is formed so as to be drawn out from the common electrode 13. At positions corresponding to the wiring portions 71, electrode holes 72 and 73 are formed in the resin substrate 51 and the insulating resin layer 53, and wiring electrodes 74 are disposed inside the electrode holes 72 and 73. The wiring electrode 74 is disposed so as to be exposed on the surface facing the outside of the resin substrate 51, and is electrically connected to the common electrode 13 through the wiring portion 71.

  By joining the first electrode structure 31 and the second electrode structure 32 having the above configuration in the thickness direction, the sensor housing 12 in which the common electrode 13 and the counter electrodes 14 and 15 are arranged is formed, and the inclined The sensor 11 can be manufactured.

  Next, with reference to FIG. 3 and FIG. 4, a process of manufacturing the first electrode structure 31 will be schematically described. FIG. 3 is an explanatory view schematically showing a manufacturing method of the tilt sensor. FIG. 4 is a side view showing a state in which a resin having conductivity is offset printed.

  In the manufacturing method of the present embodiment, first, a molded product (resin base material) 1 is manufactured using an injection molding device 81. The molded product 1 has a shape in which a plurality of the resin substrates 51 are arranged side by side and these resin substrates 51 are connected to each other by a runner portion.

  The injection molding apparatus 81 is equipped with a substrate molding die 82 on which a fine pattern is formed by a process combining ultraviolet lithography and electroforming. In addition, a plurality of molding patterns for the inclination sensor 11 are repeatedly arranged in the substrate molding die 82, so that the fine shape of the resin substrate 51 (for example, the oil injection port 55 and the electrode hole 58). , 72, etc.) can be formed at a time.

  Next, the offset printing device 86 prints the pattern of the counter electrodes 14 and 15 and the wiring part 57 on the molded product 1 by using a conductive paste-like photosensitive resin (resin ink) 90. As a method for imparting conductivity to the resin, a method of dispersing nanoparticles of an appropriate metal (for example, silver) in the resin can be considered.

  The offset printing apparatus 86 includes a roll 87 and a blanket 88 as a transfer body. On the outer peripheral surface of the roll 87, there is mounted an electrode forming mold 89 in which fine electrostatic electrode patterns and wiring portion patterns are formed by a process combining ultraviolet lithography and electroforming. The electrode forming mold 89 is provided with a plurality of electrostatic electrode patterns of the inclination sensor 11 as in the case of the substrate forming mold 82. Thereby, a plurality of fine counter electrodes 14 and 15 and wiring portions 57 can be formed at a time.

  As shown in FIG. 4, an electrode forming mold 89 is attached to the outer periphery of the roll 87 in the offset printing apparatus 86 so as to be wound. The electrode forming mold 89 is formed with fine concave portions corresponding to the shapes of the counter electrodes 14 and 15 and the wiring portion 57, and the photosensitive resin 90 is supplied to the concave portions. A blade 91 for scraping off the excess photosensitive resin 90 is disposed in the vicinity of the roll 87. Further, the blanket 88 is disposed so as to face the roll 87 and rotates in directions opposite to each other.

  With this configuration, when the roll 87 and the blanket 88 are rotationally driven, the photosensitive resin 90 that has entered the recess of the electrode forming mold 89 is sucked by the outer peripheral surface of the blanket 88. The photosensitive resin 90 transferred to the blanket 88 is transferred to the molded product 1 by the rotation of the blanket 88. A desired fine pattern can be printed on the molded product 1 by this electrode offset printing process.

  Next, the photosensitive resin 90 is cured by the ultraviolet lamp 92 shown in FIG. 3, and the counter electrodes 14 and 15 and the wiring part 57 are formed. 3 shows only the first counter electrode 14 as a model, but the second counter electrode 15 and the wiring portion 57 are also formed simultaneously by the electrode offset printing process and the curing process. Furthermore, a plurality of resin substrates 51 including the counter electrodes 14 and 15 and the wiring portion 57 can be manufactured by performing a separation step of separating the resin substrate 51 from the runner portion in the molded product 1.

  Although not shown in FIG. 3, in the present embodiment, a step of performing offset printing of the pattern made of the insulating resin on the molded product in which the counter electrodes 14 and 15 and the wiring portion 57 are formed (insulating portion) An offset printing step) and a step of forming the insulating resin layer 53 by photosensitive curing of the insulating resin (insulating portion curing step) are performed before the separation step. Thereby, the insulating resin layer 53 can be laminated on the resin substrate 51. In this insulating part offset printing process, an insulating part forming mold is used instead of the electrode forming mold 89, and a photosensitive resin paste having electrical insulation is used instead of the conductive resin. Since this is the same as the electrode offset printing process except for printing, the description is omitted.

  Next, a method for manufacturing the electrode forming mold 89 used in the offset printing apparatus 86 will be described with reference to FIG. FIG. 5 is a diagram showing a first example of a method for manufacturing an electrode forming mold.

  First, a mold production substrate 21 made of a silicon wafer is prepared (FIG. 5A), and a resist 22 is applied thereon (FIG. 5B). For example, an ultraviolet resist can be used as the resist 22. Next, the resist 22 is selectively exposed to ultraviolet rays using the mask 23 (exposure process, FIG. 5 (3)), and unexposed portions are removed (development process, FIG. 5 (4)). The resist structure 24 can be formed on the mold manufacturing substrate 21 by this ultraviolet lithography method.

  Next, a film-like seed layer (conductive layer) 25 is formed so as to cover the resist structure 24 (conductive layer forming step, FIG. 5 (5)). As this seed layer 25, what consists of metals, such as titanium or copper, can be used. Next, nickel is deposited so as to cover the seed layer 25 (nickel electroforming process, FIG. 5 (6)). Next, the mold manufacturing substrate 21, the resist structure 24, and the seed layer 25 are removed using an appropriate chemical or the like (removal step, FIGS. 5 (7) to 5 (9)). Finally, the nickel electroformed layer 26 is cut out in a predetermined range, and the back surface thereof is processed (FIG. 5 (10)). As described above, the electrode forming mold 89 as shown in FIG. 5 (11) can be manufactured.

  The electrode forming die 89 can also be manufactured by the method of FIG. FIG. 6 is a diagram showing a second example of a method for manufacturing an electrode forming mold.

  In this method, a mold manufacturing substrate 21 made of a silicon wafer is prepared (FIG. 6A), and a seed layer 25 made of a metal such as titanium or copper is formed thereon (conductive layer forming step, FIG. 6). (2)) Further, a resist 22 is applied, selectively exposed and developed (FIGS. 6 (3) to 6 (5)). Thereby, the resist structure 24 can be formed on the seed layer 25.

  Next, nickel is deposited so as to cover the resist structure 24 (nickel electroforming process, FIG. 6 (6)). Next, the mold manufacturing substrate 21, the seed layer 25, and the resist structure 24 are removed using an appropriate chemical or the like (removal process, FIGS. 6 (7) to 6 (8)). Finally, the nickel electroformed layer 26 is cut out in a predetermined range, and the back surface thereof is processed (FIG. 6 (9)). Thus, an electrode forming mold 89 as shown in FIG. 6 (10) can be obtained.

  The electrode forming mold 89 manufactured by the method of FIG. 5 or 6 has durability to withstand, for example, 300,000 or more offset printings. Therefore, the replacement frequency of the electrode forming mold 89 can be extremely reduced, and the manufacturing cost of the tilt sensor 11 can be effectively reduced.

  As the mold manufacturing substrate 21 used in FIGS. 5 and 6, glass, ceramic, or quartz can be used in addition to a silicon wafer. Further, as the resist 22 used in the method of FIGS. 5 and 6, an ultraviolet resist containing polyvinyl alcohol can be used. However, an X-ray lithography method can be used instead of the ultraviolet lithography method.

  Moreover, as a manufacturing method of the electrode forming mold 89, the method shown in FIG. 5 or the method shown in FIG. 6 may be used. However, when the aspect ratio of the three-dimensional microstructure formed on the electrode forming mold 89 is 1 or less, the method of FIG. 5 is suitable, whereas when the aspect ratio is 1 or more, the method of FIG. Is preferred.

  The method for manufacturing the electrode forming mold 89 shown in FIGS. 5 and 6 can also be applied to the insulating part forming mold for forming the insulating resin layer 53, and the injection molding apparatus 81. This can also be applied to the substrate molding die 82. When applied to the electrode forming die 89 and the insulating portion forming die, the nickel electroforming process is performed for about 3 hours in the nickel electroforming step to form the nickel electroforming layer 26 having a thickness of 0.3 mm or more. It is preferable to do. On the other hand, when applied to the substrate molding die 82, it is preferable to perform an electroforming process for about 72 hours in the nickel electroforming process to form the nickel electroformed layer 26 having a thickness of 3 mm or more.

  Next, the process of producing the first electrode structure 31 and the second electrode structure 32 and bonding them together will be described in more detail with reference to FIGS. FIG. 7 is an explanatory view showing a process of manufacturing the first electrode structure of the tilt sensor, FIG. 8 is an explanatory view showing a process of manufacturing the second electrode structure, and FIG. 9 is an inclination obtained by joining two electrode structures. It is explanatory drawing which shows the process of manufacturing a sensor.

  First, the process for producing the first electrode structure 31 will be described. First, as shown in FIG. 7A, a processed substrate (resin base material) 61 made of resin is prepared, and this is washed with an appropriate chemical or the like. The processed substrate 61 is configured as a single large substrate for forming a plurality of resin substrates 51, and is cut out one sensor at a time in a later step.

  After the processing substrate 61 is cleaned, processing for forming a through hole, a concave portion, or the like is performed according to the shape required for the resin substrate 51 of the tilt sensor 11 (FIG. 7B). By this processing, the oil injection port 55, the electrode holes 58, 72 and the like described above are formed. In FIG. 7 (2), only one inclination sensor 11 is shown as a representative, but in reality, processing for a plurality of sensors is performed at one time, and this is the case with FIG. 7 (3). The same applies to the subsequent processing.

  Next, the electrode forming die 89 manufactured by the method shown in FIG. 5 or FIG. 6 is mounted on the offset printing device 86, and the thermosetting resin 95 having conductivity is printed using the offset printing device 86. (FIG. 7 (3)). Then, the thermosetting resin 95 is cured by laser heat treatment (FIG. 7 (4)). Thereby, the counter electrodes 14 and 15 and the wiring part 57 are formed. 7 (3) and 7 (4) show printing using a thermosetting resin, offset printing using a photosensitive resin may be applied. 7 and 9, only the first counter electrode 14 is shown as a model for simplification, and the second counter electrode 15 and the wiring portion 57 are not shown.

  Next, using an offset printing apparatus equipped with an insulating part forming die formed by the method shown in FIG. 5 or FIG. 6, the ultraviolet photosensitive resin 96 having electrical insulation is printed (FIG. 7 (5)). )), The ultraviolet photosensitive resin 96 is exposed by an ultraviolet lamp 92 and cured (FIG. 7 (6)). Thereby, the insulating resin layer 53 is formed. Thus, the first electrode structure 31 as shown in FIG. 7 (7) can be manufactured.

  A process for producing the second electrode structure 32 will be described. First, a processed substrate (resin base material) 62 made of a resin as shown in FIG. 8 (8) is prepared, and this is washed with an appropriate chemical or the like. After the cleaning, the thermosetting resin 95 having conductivity is printed (FIG. 8 (9)), and the thermosetting resin 95 is cured by laser heating (FIG. 8 (10)). Thereby, the common electrode 13 is formed. As described above, the second electrode structure 32 as shown in FIG.

  Next, the process of joining the two electrode structures 31 and 32 will be described. First, in the processed substrate 61 (first electrode structure 31) produced by the method of FIG. 7, an adhesive is applied to the surface of the insulating resin layer 53 to form an adhesive layer 85 (FIG. 9 (12)). ). And it arrange | positions so that the surface by the side of the common electrode 13 of the process board | substrate 62 (2nd electrode structure 32) produced with the method of FIG. Process, FIG. 9 (13)). As a result, a laminated body 35 is formed. In the laminated body 35, the common electrode 13 provided in the second electrode structure 32 and the counter electrodes 14 and 15 provided in the first electrode structure 31 include the insulating resin layer 53. Will be placed opposite each other.

  Next, the thermosetting resin 95 having conductivity is ink-jet printed (FIG. 9 (14)) and cured by laser heat treatment (FIG. 9 (15)). In the processing of FIGS. 9 (14) and 9 (15), the stacked body 35 is in an upside down state up to FIG. 9 (13). Through the above steps, the wiring electrodes 59 and 74 can be formed.

  Subsequently, the laminated body 35 that has been turned upside down is returned to its original orientation, and silicon oil is injected from the oil injection port 55 (capacitance medium filling step, FIG. 9 (16)). As a result, the hollow portion 54 is filled with a predetermined amount of silicon oil. Thereafter, the oil injection port 55 is closed by the sealing plug 56 (FIG. 9 (17)). In the manufacturing method shown in FIGS. 7 to 9, the oil injection port 55 is opened on the surface opposite to the surface from which the wiring electrodes 59 and 74 are exposed. As described above, the oil injection port 55 may be formed on the surface on the same side as the wiring electrodes 59 and 74.

  Next, the laminated body 35 is separated for each of the inclination sensors 11 (FIG. 9 (18)). That is, both of the processed substrates 61 and 62 processed in FIGS. 7 and 8 are processed together for a plurality of sensors, and the laminate 35 obtained by joining them in the process of FIG. It will be equivalent to minutes. Therefore, a plurality of inclination sensors 11 can be obtained from one laminate 35 by cutting the laminate 35 along the dotted line in FIG. 9 (18) and separating them one by one.

  As described above, the tilt sensor 11 according to the present embodiment has a configuration in which the common electrode 13 and the counter electrodes 14 and 15 are disposed to face each other. The tilt sensor 11 is manufactured by a method including a structure manufacturing process for manufacturing the two electrode structures 31 and 32 and a bonding process for bonding the manufactured electrode structures 31 and 32. The two electrode structures 31 and 32 to be joined are both produced by a method including an electrode offset printing step and an electrode curing step in the structure producing step. In the electrode offset printing step, an electrode forming die 89 on which an electrostatic electrode pattern is formed by a process combining ultraviolet lithography and electroforming is mounted on a roll 87 of an offset printing apparatus 86, and heat curing with conductivity is performed. Resin 95 is offset printed on the processed substrate 61 (62). In the electrode curing step, the counter electrodes 14 and 15 (common electrode 13) are formed on the processed substrate 61 (62) by curing the printed thermosetting resin 95.

  Thereby, the fine-shaped common electrode 13 and the counter electrodes 14 and 15 can be easily formed by offset printing. Therefore, the inclination sensor 11 can be remarkably reduced in size, the lead time is short, and the process can be simplified as compared with the lithography process. In addition, the usage amount of chemicals, pure water, etc. can be reduced to reduce the running cost and the environmental load. Furthermore, a large-scale apparatus used for a semiconductor process can be reduced, and the initial cost can be greatly reduced.

  Hereinafter, in order to show the effect of the present embodiment in more detail, a conventional method for manufacturing a tilt sensor using a lot of photolithography will be described with reference to FIGS. 10 to 12 sequentially show the manufacturing process of the conventional capacitive sensor.

  First, as shown in FIG. 10A, a substrate 65 made of a silicon wafer is prepared, an oxide film 66 is formed on the surface (FIG. 10B), and an ultraviolet photosensitive resin is formed on the oxide film 66. A resist 67 made of is applied (FIG. 10 (3)). Further, selective ultraviolet exposure is performed (FIG. 10 (4)) and development is performed (FIG. 10 (5)).

  Subsequently, after selectively removing the oxide film 66 in the portion where the resist is removed (FIG. 10 (6)), the resist is removed (FIG. 10 (7)). Next, a copper film 68 used as an electrostatic electrode on one side is formed by sputtering on the surface opposite to the side from which the oxide film has been selectively removed (FIG. 10 (8)). Then, a resist 67 is applied on the copper film 68 (FIG. 10 (9)), and further selective UV exposure is performed (FIG. 10 (10)).

  Next, development is performed (FIG. 11 (11)), and the copper film 68 is selectively etched (FIG. 11 (12)), and then the resist 67 is removed (FIG. 11 (13)). Subsequently, a resist 67 is applied again (FIG. 11 (14)), selective UV exposure is performed (FIG. 11 (15)), and development is performed (FIG. 11 (16)). Thereby, a portion corresponding to the insulating resin layer 53 is formed.

  Then, a resist 69 is further applied (FIG. 11 (17)), selective UV exposure is performed (FIG. 11 (18)), and development is performed (FIG. 11 (19)). Then, the substrate 65 where the oxide film 66 has been removed is removed (FIG. 11 (20)). Thereby, a through-hole and a recessed part can be formed in a laminated body. The resist 69 also functions as a sacrificial layer for forming the hollow portion 54 in the insulating resin layer 53 in a later step.

  Next, a resist 70 is applied again (FIG. 12 (21)), selective UV exposure is performed (FIG. 12 (22)), and development is performed (FIG. 12 (23)). Next, sputtering is performed to form a conductive film 75 on the inner surfaces of the through holes and the recesses (FIG. 12 (24)). Thereafter, the resist 70 is removed (FIG. 12 (25)), and the through holes 76 are plated in the through holes and the recesses (FIG. 12 (26)). The through hole 76 functions as the wiring electrodes 59 and 74. Next, after the resist 69 is polished and removed by a predetermined thickness (FIG. 12 (27)), a copper film 77 used as an electrostatic electrode on one side is formed by sputtering (FIG. 12 (28)). Thereafter, the resist 69 as a sacrificial layer is removed by etching (FIG. 12 (29)). Thereby, the hollow part for filling silicon oil can be formed (the filling step of silicon oil is omitted). As described above, a tilt sensor as shown in FIG. 12 (29) can be manufactured.

  As described above, in the conventional method for manufacturing a tilt sensor (capacitive sensor), it is necessary to perform the ultraviolet exposure process at least five times. Therefore, a large number of masks made of, for example, chrome for exposure are required, which causes an increase in manufacturing cost. In addition, many processes that require a vacuum and a chemical bath, such as sputtering and etching, are required, leading to a long lead time.

  In this regard, according to the method of the present embodiment, the common electrode 13, the counter electrodes 14, 15 and the insulating resin layer 53 can be easily formed by offset printing. Therefore, as shown in FIGS. 7 to 9, the conventional process can be greatly simplified, and further, a large-scale apparatus is not required, and the equipment cost can be greatly reduced. In addition, due to the simplification of the process, the amount of water, chemicals and electric power used in the manufacturing process can be greatly reduced. Thereby, manufacturing cost can be reduced significantly.

  Next, Table 1 shows a comparison of performance and price between the inclination sensor 11 of the present embodiment and a conventional commercial product.

  As described above, the tilt sensor 11 according to the present embodiment can achieve a significant reduction in size while achieving substantially the same performance as that of a conventional commercial product, and realizes a remarkable low price of 1/10 or less. I understand that I can do it.

  Further, the inclination sensor 11 of the present embodiment uses one electrode forming mold 89 in which a plurality of patterns such as the counter electrodes 14 and 15 of the inclination sensor 11 are repeatedly formed in the electrode offset printing step. A plurality of patterns of the counter electrodes 14, 15, etc. are simultaneously offset printed per processed substrate 61. Thereafter, the processed substrate 61 is separated for each electrostatic device (in the state of the laminated body 35).

  Thereby, since the several inclination sensor 11 can be processed at once, a throughput can be improved significantly and it can contribute to the further reduction of manufacturing cost.

  Further, in the inclination sensor 11 of the present embodiment, the wiring portion 57 drawn out from the counter electrodes 14 and 15 and the counter electrodes 14 and 15 are formed on the processed substrate 61 by the electrode offset printing process and the electrode curing process. Formed simultaneously.

  Thereby, the formation of the wiring part 57 is facilitated, so that further simplification of the process and cost reduction can be realized.

  5 is manufactured by a method including a resist structure manufacturing step, a conductive layer forming step, a nickel electroforming step, and a removing step. The In the resist structure production step, a resist structure 24 is produced on the mold production substrate 21 by an ultraviolet lithography method. In the conductive layer forming step, a seed layer 25 is formed so as to cover the resist structure 24. In the nickel electroforming process, nickel is deposited so as to cover the seed layer 25. In the removing step, the mold manufacturing substrate 21, the resist structure 24, and the seed layer 25 are removed.

  Thereby, it is possible to accurately form an uneven fine pattern on the electrode forming mold 89, and is particularly suitable for forming a shape having an aspect ratio of 1 or less.

  6 is manufactured by a method including a conductive layer forming process, a resist structure manufacturing process, a nickel electroforming process, and a removing process. The In the conductive layer forming step, the seed layer 25 is formed so as to cover the mold manufacturing substrate 21. In the resist structure production step, a resist structure 24 is produced on the seed layer 25 by an ultraviolet lithography method or an X-ray lithography method. In the nickel electroforming process, nickel is deposited so as to cover the resist structure 24. In the removing step, the mold manufacturing substrate 21, the seed layer 25, and the resist structure 24 are removed.

  This method can form an uneven fine pattern on the electrode forming mold 89 with high accuracy as in the case of FIG. 5, but when forming a shape having an aspect ratio of 1 or more, the method of FIG. It is particularly preferred to use

  In the present embodiment, the mold production substrate 21 is made of silicon. The resist structure 24 is made of a photosensitive resin. The seed layer 25 is made of a metal such as titanium or copper. The nickel electroformed layer 26 is formed with a thickness of 0.1 mm or more.

  Thus, the tilt sensor 11 can be manufactured at low cost by the durable and precise electrode forming mold 89.

  Next, still another method for manufacturing the tilt sensor 11 will be described with reference to FIGS. This manufacturing method is characterized in that pressure forming by a roller device and electrode formation by sputtering are performed. FIG. 13 is an explanatory view showing a process of manufacturing the first electrode structure in another method of manufacturing the tilt sensor. FIG. 14 is an explanatory view showing a process of manufacturing the second electrode structure. FIG. 15 is an explanatory view showing a process of manufacturing a tilt sensor by joining two electrode structures.

  First, the process for producing the first electrode structure 31 will be described. First, a sheet-like processed substrate (resin base material) 61 made of resin is passed through a roller device 93 as shown in FIG. The roller device 93 includes a roller 94 having a substrate molding die 82 mounted on the outer peripheral surface thereof. The uneven shape of the substrate molding die 82 is transferred to the surface of the processed substrate 61 by pressure molding using the roller device 93. Thereby, the process which forms a recessed part can be performed according to the shape required for the resin substrate 51 of the inclination sensor 11 (FIG. 13 (2)).

Next, after cleaning the processed substrate 61, a copper film (metal film) 78 is formed on the surface of the processed substrate 61 including the inside of the recess by sputtering with copper (FIG. 13 (3)). Then, a resin 79 is applied thereon (FIG. 13 (4)), and the resin 79 is removed by O ₂ ashing so as to leave only the portion located at the bottom of the recess (FIG. 13 (5)). . Subsequently, the copper film 78 where the resin 79 is removed is removed by an appropriate means such as etching (FIG. 13 (6)). Thereafter, the resin 79 is completely removed, and the copper film 78 is exposed to form the counter electrodes 14 and 15 (FIG. 13 (7)). Thus, the first electrode structure 31 as shown in FIG. 13 (7) can be manufactured.

  Next, the process for producing the second electrode structure 32 will be described. First, a sheet-like processed substrate (resin base material) 62 made of a resin as shown in FIG. 14 (8) is prepared, and this is washed with an appropriate chemical or the like. After this cleaning, a copper film 78 is formed by sputtering with copper (FIG. 14 (9)). Then, an ultraviolet photosensitive resist resin 80 is applied on the copper film 78 (FIG. 14 (10)), and selective ultraviolet exposure is performed (FIG. 14 (11)). Subsequently, development is performed (FIG. 14 (11)), and the exposed portion of the copper film 78 is removed by an appropriate means such as etching (FIG. 14 (12)). Thereafter, the resist resin 80 is removed (FIG. 14 (13)). Thus, the second electrode structure 32 as shown in FIG. 14 (13) can be manufactured.

  Next, the process of joining the two electrode structures 31 and 32 to each other will be described. First, in the processed substrate 62 (second electrode structure 32) manufactured by the method of FIG. 14, the surface on which the common electrode 13 is formed is irradiated with water vapor (ion beam) in the vacuum chamber 97. (FIG. 15 (16)). Next, the two processed substrates 61 and 62 (electrode structures 31 and 32) are bonded so that the counter electrodes 14 and 15 and the common electrode 13 face each other (FIG. 15 (17)), and bonded by pressure bonding. (FIG. 15 (18)). In addition, the joining temperature at this time shall be below a glass transition temperature. The laminated body 35 is comprised by the above, and the hollow part 98 for silicon oil filling can be formed in the part of the recessed part of the process board | substrate 61. FIG.

  Next, the laminated body 35 is separated for each of the inclination sensors 11 (FIG. 15 (19)). That is, the processed substrates 61 and 62 processed in FIG. 13 and FIG. 14 are processed together by a plurality of sensors as in the case of FIG. 7 and FIG. 8, and these are bonded to each other. Therefore, a plurality of inclination sensors 11 can be obtained from one laminate 35 by separating the laminate 35 along the dotted line in FIG. Finally, in the tilt sensor 11 after separation, the hollow portion 98 is filled with silicon oil, and the oil injection port (not shown) is sealed (FIG. 15 (20)). As described above, the inclination sensor 11 can be obtained.

  Next, still another method for manufacturing the tilt sensor 11 will be described with reference to FIGS. This manufacturing method is characterized in that an electrode and a sensor housing are formed by insert-molding a copper plate. FIG. 16 is an explanatory view showing a process of manufacturing the first electrode structure in yet another method of manufacturing the tilt sensor. FIG. 17 is an explanatory diagram showing a process of manufacturing the second electrode structure. FIG. 18 is an explanatory view showing a process of manufacturing a tilt sensor by joining two electrode structures.

  First, the process of producing the copper plate 83 for insert molding will be described. First, a copper plate 83 as shown in FIG. 16A is cleaned, and an ultraviolet photosensitive resist resin 80 is applied to the surface (FIG. 16B). Thereafter, selective ultraviolet exposure is performed (FIG. 16 (3)) and development is performed (FIG. 16 (4)). Subsequently, the exposed copper plate 83 is selectively removed by etching (FIG. 16 (5)), and the resist resin 80 is further removed (FIG. 16 (6)). By the above, the copper plate 83 in which the through-hole etc. were formed in the appropriate place can be produced.

  Next, the injection molding process will be described. First, two substrate molding dies 82a and 82b as shown in FIG. 17 (7) are prepared. The substrate molding die 82a is for forming a fine pattern including the shape of a hollow portion 98, which will be described later, and the substrate molding die 82b is for forming a through hole for a through hole. It is. These two substrate molding dies 82a and 82b can be manufactured by the method shown in FIG. 5 or FIG. 6, for example.

  Next, the substrate molding dies 82a and 82b are mounted on the injection molding apparatus 81, and the mold is closed so as to sandwich the copper plate 83 of FIG. 16 (6) (FIG. 17 (8)). Thereafter, an electrically insulating resin is injected and molded (FIG. 17 (9)). Thereafter, the mold is opened and the molded product 1x is taken out (FIG. 17 (10)). As a result, the counter electrodes 14 and 15 are formed on the copper plate 83. In addition, this molded product 1x has a configuration in which semi-finished products corresponding to a plurality of inclination sensors 11 are connected to each other at a runner portion, similarly to the molded product 1 shown in FIG.

  Next, in the molded product 1x, water vapor (ion beam) is irradiated in the vacuum chamber 97 to the surface on which the counter electrodes 14 and 15 are formed (FIG. 17 (11)). Next, the second copper plate 84 is bonded so as to face the surface on which the counter electrodes 14 and 15 are formed in the molded product 1x (FIG. 17 (12)), and bonded by pressure bonding (FIG. 17). (13)). In addition, the 2nd copper plate 84 can be produced by the method shown to FIG. 16 (1)-FIG. 16 (6) similarly to the said copper plate 83. FIG. Thereby, while being able to obtain the molded product 1x with the 2nd copper plate 84, the common electrode 13 can be formed in the part of the 2nd copper plate 84 which opposes the said counter electrodes 14 and 15. FIG. Further, a hollow portion 98 for filling silicon oil can be formed between the common electrode 13 and the counter electrodes 14 and 15.

  Next, silicon oil is injected from the oil injection port 55, and a predetermined amount of silicon oil is filled in the hollow portion 98 (FIG. 18 (14)). Thereafter, the oil injection port 55 is closed with a sealing plug 56 (FIG. 18 (15)), and a protective film 99 is pasted on the second copper plate 84 so as to cover from above (FIG. 18 (16)). . Next, through-hole plating is applied to the hole portion of the molded product 1x to form wiring electrodes 59 and 74 (FIG. 18 (17)). Further, the protruding portions of the wiring electrodes 59 and 74 are polished (FIG. 18 (18)).

  Finally, the inclination sensor 11 is separated from the runner portion of the molded product 1x (FIG. 18 (19)). Thereby, the some inclination sensor 11 can be obtained from one molded article 1x.

  The manufacturing method as shown in FIG. 3 is not limited to the inclination sensor 11 shown in FIGS. 1 and 2, and can also be applied to manufacturing methods of various electrostatic devices as shown in FIGS. 19 to 23. Hereinafter, these application examples will be described. 19 is a sectional perspective view of a pressure sensor as a capacitance sensor, FIG. 20 is a perspective view of an acceleration sensor as a capacitance sensor, and FIG. 21 is a sectional perspective view of a microphone as a capacitance sensor. 22 is a perspective view and a sectional view of an optical switch as an electrostatic actuator, and FIG. 23 is a perspective view and a sectional view of the optical switch.

  A pressure sensor 101 as an electrostatic device (capacitive sensor) shown in FIG. 19A includes a case 102 and a hollow cylindrical portion 103 supported by the case 102. The cylindrical portion 103 is disposed so as to straddle the inside and outside of the case 102, and a sensor chip 104 is installed at one end of the cylindrical portion 103 disposed inside the case 102. FIG. 19B shows an enlarged cross-sectional view of the sensor chip 104. As shown in FIG. 19B, the sensor chip 104 includes a first electrode 111 and a first electrode 111 arranged to face each other with an appropriate interval. A second electrode 112. The second electrode 112 is provided closer to the cylindrical portion 103 than the first electrode 111 and is formed in a diaphragm shape.

  In this configuration, when the measurement gas is introduced from the outside of the case 102 through the cylindrical portion 103 as shown by the arrow in FIG. 19A and pressure is applied to the sensor chip 104, the second electrode 112 is bent, The capacitance between the two electrodes 111 and 112 changes. Thereby, the pressure of the measurement gas can be detected. The electrodes 111 and 112 of the sensor chip 104 can be formed by offset printing as shown in FIG.

  An acceleration sensor 121 as an electrostatic device (capacitance type sensor) shown in FIG. 20 is configured by disposing a movable electrode 131 and a fixed electrode (capacitance detection electrode) 132 on a base 122. . The movable electrode 131 includes an elastically deformable spring portion 123 and a weight portion 124. With this configuration, when acceleration occurs in the direction of the thick arrow in FIG. 20, the distance between the movable electrode 131 and the fixed electrode 132 changes as the movable electrode 131 moves while elastically deforming the spring portion 123. Therefore, a change in acceleration can be detected as a change in capacitance. The electrodes 131 and 132 of the acceleration sensor 121 can be formed by offset printing as shown in FIG.

  A microphone (sound wave sensor) 141 as an electrostatic device (capacitance type sensor) shown in FIG. 21 includes a first electrode 151 and a second electrode 152 that are arranged to face each other with an appropriate interval. The first electrode 151 is formed in a diaphragm shape, and the space opposite to the first electrode 151 with the second electrode 152 interposed therebetween is a hollow acoustic portion 142. With this configuration, when sound is input to the microphone 141, the first electrode 151 vibrates while being curved, so that the capacitance between the two electrodes 151 and 152 changes. Thereby, a sound quality and a sound volume can be measured. The electrodes 151 and 152 of the microphone 141 can be formed by offset printing as shown in FIG.

  An optical switch 161 as an electrostatic device (electrostatic actuator) shown in FIGS. 22A and 22B includes a base 162, a fulcrum plate 163 disposed on the base 162, and a fulcrum plate 163. And an aluminum mirror 166 fixed to the swing plate 164 via a support column 165. As shown in FIG. 22B, between the base 162 and the swing plate 164, two pairs of electrodes 171 to 174 are arranged to face each other.

  With this configuration, when a voltage is applied to the electrodes 171, 172 or the electrodes 173, 174, an electrostatic force is generated between the electrodes. Thereby, since the rocking plate 164 is tilted around the fulcrum plate 163, the aluminum mirror 166 is tilted, and the emission angle of light reflected by the aluminum mirror 166 can be changed. The four electrodes 171 to 174 of the optical switch 161 can be formed by offset printing as shown in FIG.

  A high-frequency switch (electrostatic switch) 181 as an electrostatic device shown in FIG. 23A and FIG. 23B is disposed above the base 182 with an appropriate interval from the base 182. The first electrode 191, the second electrode 192 and the third electrode 193 installed on the base 182, and the fourth electrode 194 disposed on the lower surface of the first electrode 191 are provided. With this configuration, when a voltage is applied between the first electrode 191 and the second electrode 192, an electrostatic force is generated, and the first electrode 191 is bent so as to protrude downward. Thereby, the 4th electrode 194 contacts the 3rd electrode 193, it supplies with electricity, and a switch will be in an ON state. The four electrodes 191 to 194 of the high frequency switch 181 can be formed by offset printing as shown in FIG.

  Although the preferred embodiment of the present invention has been described above, the method for manufacturing an electrostatic device of the present invention can be used for, for example, an electromagnetic wave detection apparatus, a presence optical switch, etc. in addition to the devices exemplified above. .

1 is a cross-sectional view schematically showing the principle of a tilt sensor according to an embodiment of the present invention. The exploded perspective view of an inclination sensor. Explanatory drawing which shows the manufacturing method of an inclination sensor typically. The side view which shows a mode that resin which has electroconductivity is offset-printed. The figure which shows the 1st example of the manufacturing method of the metal mold | die for electrode formation. The figure which shows the 2nd example of the manufacturing method of the metal mold | die for electrode formation. Explanatory drawing which shows the process of manufacturing the 1st electrode structure of an inclination sensor. Explanatory drawing which shows the process of manufacturing a 2nd electrode structure. Explanatory drawing which shows the process of joining two electrode structures and manufacturing an inclination sensor. Explanatory drawing of the manufacturing process of the capacitive sensor of a prior art. Explanatory drawing of the manufacturing process of the capacitive sensor of a prior art. Explanatory drawing of the manufacturing process of the capacitive sensor of a prior art. Explanatory drawing which shows the process of manufacturing a 1st electrode structure in another manufacturing method of an inclination sensor. Explanatory drawing which shows the process of manufacturing a 2nd electrode structure. Explanatory drawing which shows the process of joining two electrode structures and manufacturing an inclination sensor. Explanatory drawing which shows the process of manufacturing a 1st electrode structure in another manufacturing method of an inclination sensor. Explanatory drawing which shows the process of manufacturing a 2nd electrode structure. Explanatory drawing which shows the process of joining two electrode structures and manufacturing an inclination sensor. The cross-sectional perspective view of the pressure sensor as an electrostatic capacitance sensor. The perspective view of the acceleration sensor as an electrostatic capacitance sensor. The cross-sectional perspective view of the microphone as an electrostatic capacitance sensor. The perspective view and sectional drawing of the optical switch as an electrostatic actuator. The perspective view and sectional drawing of an optical switch.

Explanation of symbols

11 Tilt sensor (capacitive sensor, electrostatic device)
13 Common electrode (electrostatic electrode)
14, 15 Counter electrode (electrostatic electrode)
31, 32 Electrode structure (structure)
86 Offset printer 89 Electrode forming mold

Claims (15)

A method of manufacturing an electrostatic device in which electrostatic electrodes are arranged opposite to each other,
A structure manufacturing process for manufacturing a plurality of structures;
A bonding step of bonding the plurality of manufactured structures;
Including
At least one of the structures to be bonded is the structure manufacturing step,
An electrode forming mold on which an electrostatic electrode pattern is formed by a process combining ultraviolet lithography or X-ray lithography and electroforming is mounted on a roll of an offset printing apparatus, and an electrically conductive resin is offset printed on a resin substrate. An electrode offset printing process,
An electrode curing step of forming the electrostatic electrode on the resin substrate by curing the printed resin;
A method for manufacturing an electrostatic device, characterized by comprising: It is a manufacturing method of the electrostatic device according to claim 1,
In the electrode offset printing step, a plurality of electrostatic electrode patterns for one resin substrate are simultaneously formed using an electrode forming mold in which a plurality of electrostatic electrode patterns for electrostatic devices are repeatedly formed. Offset printing,
Then, the said resin base material is isolate | separated for every electrostatic device, The manufacturing method of the electrostatic device characterized by the above-mentioned. A method for manufacturing an electrostatic device according to claim 1 or 2,
The method for manufacturing an electrostatic device, wherein a wiring portion drawn from the electrostatic electrode is simultaneously formed on the resin base material together with the electrostatic electrode by the electrode offset printing step and the electrode curing step. It is a manufacturing method of the electrostatic device according to any one of claims 1 to 3,
The electrode forming mold is
A resist structure production step of producing a resist structure on a substrate by an ultraviolet lithography method or an X-ray lithography method;
A conductive layer forming step of forming a conductive layer to be a nickel electroforming seed layer so as to cover the resist structure;
A nickel electroforming step of depositing nickel so as to cover the conductive layer;
A removing step of removing the substrate, the resist structure and the conductive layer;
A method for manufacturing an electrostatic device, comprising: It is a manufacturing method of the electrostatic device according to any one of claims 1 to 3,
The electrode forming mold is
A conductive layer forming step of forming a conductive layer to be a seed layer of nickel electroforming so as to cover the mold manufacturing substrate;
A resist structure production step of producing a resist structure on the conductive layer by an ultraviolet lithography method or an X-ray lithography method;
A nickel electroforming step of depositing nickel so as to cover the resist structure and a nickel electroforming seed layer in which the resist structure does not exist;
A removal step of removing the mold production substrate, the conductive layer and the resist structure;
A method for manufacturing an electrostatic device, comprising: It is a manufacturing method of the electrostatic device according to claim 4 or 5,
The mold production substrate is made of silicon, glass, ceramic or quartz,
The resist structure is made of a photosensitive resin,
The conductive layer is made of metal,
The nickel is formed with a thickness of 0.1 mm or more. A method for manufacturing an electrostatic device according to any one of claims 1 to 6,
At least one of the structures to be bonded is the structure manufacturing step,
An insulating part forming mold having an insulating part pattern formed by a process combining ultraviolet lithography or X-ray lithography and electroforming is mounted on a roll of an offset printing apparatus, and an electrically insulating resin is placed on the resin substrate. Insulating part offset printing process for offset printing,
An insulating part curing step for forming an insulating part on the resin substrate by curing the printed resin; and
A method for manufacturing an electrostatic device, characterized by comprising: A method for manufacturing an electrostatic device according to any one of claims 1 to 7,
For at least one of the structures to be bonded, in the structure manufacturing step, the resin substrate is formed using a substrate molding die manufactured by a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the material is performed before the electrode offset printing process,
Through the substrate forming step, a through hole for forming a through hole is formed in the resin base material. A method for manufacturing an electrostatic device according to any one of claims 1 to 7,
For at least one of the structures to be bonded, in the structure manufacturing step, the resin substrate is formed using a substrate molding die manufactured by a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the material is performed before the electrode offset printing process,
In the substrate molding step, the resin base material is pressure-molded by passing the resin base material through a roller device on which the substrate molding die is mounted. A method for manufacturing an electrostatic device according to any one of claims 1 to 7,
For at least one of the structures to be bonded, in the structure manufacturing step, the resin substrate is formed using a substrate molding die manufactured by a process combining ultraviolet lithography or X-ray lithography and electroforming. A substrate molding process for molding the material is performed before the electrode offset printing process,
In the substrate molding step, the resin base material is molded using the substrate molding die. It is a manufacturing method of the electrostatic device according to any one of claims 1 to 10,
A method of manufacturing an electrostatic device, further comprising a capacitance medium filling step of filling a predetermined amount of capacitance medium between the opposed electrostatic electrodes.   The electrostatic device manufactured by the manufacturing method of the electrostatic device as described in any one of Claim 1-11.   A capacitive sensor as the electrostatic device according to claim 12.   An electrostatic actuator as the electrostatic device according to claim 12.   An electrostatic switch as the electrostatic device according to claim 12.

Images