JP2009253098A - Led display device - Google Patents

Led display device Download PDF

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Publication number
JP2009253098A
JP2009253098A JP2008100527A JP2008100527A JP2009253098A JP 2009253098 A JP2009253098 A JP 2009253098A JP 2008100527 A JP2008100527 A JP 2008100527A JP 2008100527 A JP2008100527 A JP 2008100527A JP 2009253098 A JP2009253098 A JP 2009253098A
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resin layer
led
display device
led element
conductive resin
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Kentaro Ogura
健太郎 小倉
Yuichi Sasaki
雄一 佐々木
Chiharu Miyazaki
千春 宮崎
Akio Konemori
章雄 小根森
Naohito Oka
尚人 岡
Yoshihiko Konishi
善彦 小西
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2008100527A priority Critical patent/JP2009253098A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain an LED display device that improves wide-viewing property of LED element lighting and reduces unnecessary electromagnetic wave leakage to the front face direction of a screen face. <P>SOLUTION: An LED display device 1 accommodates a printed circuit board 4 that implements a plurality of LED elements 2 on one side surface 4a in such a way that the one side surface 4a faces an opening owned by a metal case 5. On the one side surface 4a of the printed circuit board 4, an insulation resin layer 7 with a height covering the wires 3 is formed by filling a clearance between wires 3 of the LED element 2 with an insulation resin, and the metal case 5 and the wires 3 are electrically insulated. Further, on the surface of the insulation resin layer 7, a conductive resin layer 8 with a height covering the entire LED elements 2 is formed by filling a clearance between the LED elements 2 with a transparent conductive resin, to prevent electromagnetic waves leakage from the LED elements 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、LED表示装置において、特にLED素子の電磁波漏洩防止構造に関するものである。   The present invention relates to an LED display device, and more particularly to an electromagnetic wave leakage prevention structure of an LED element.

主に屋外に設置するための大型ディスプレイとして、複数のLED素子を選択的に点灯制御することによって画面表示を行うLED表示装置がある。図6は、特許文献1で開示されているLED表示装置の構成を示す正面図(a)および断面図(b)である。図6に示すLED表示装置90は、複数のLED素子91をプリント基板92に実装し、そのプリント基板92を金属筐体93に収容してなる。各LED素子91の側面を囲い、かつ各LED素子91より前方へ突き出た遮光板94を設けることにより、斜め方向からLED素子91への太陽光の直射を防ぎ、表示内容を見やすくする構成であった。また、遮光板94を導電性の金属で形成することにより、LED素子91から漏洩する不要電磁波を抑制する構成であった。   2. Description of the Related Art There is an LED display device that performs screen display by selectively controlling lighting of a plurality of LED elements as a large display mainly installed outdoors. FIG. 6 is a front view (a) and a cross-sectional view (b) showing the configuration of the LED display device disclosed in Patent Document 1. An LED display device 90 shown in FIG. 6 is configured by mounting a plurality of LED elements 91 on a printed circuit board 92 and housing the printed circuit board 92 in a metal casing 93. By providing a light shielding plate 94 that surrounds the side surface of each LED element 91 and protrudes forward from each LED element 91, direct sunlight is not incident on the LED element 91 from an oblique direction, and the display contents are easy to see. It was. Further, the light shielding plate 94 is made of a conductive metal, thereby suppressing unnecessary electromagnetic waves leaking from the LED element 91.

特開平11−38905号公報JP 11-38905 A

従来のLED表示装置は以上のように構成されているので、LED表示装置の視野範囲と電磁波シールド効果とがトレードオフの関係にあり、遮光板を短くするか設置しないかするとLED素子の点灯の視野範囲は広がるが、電磁波シールド効果が劣化して不要電磁波の漏洩量が多くなってしまう。そのため、LED素子の点灯に広い視野範囲が要求される場合、遮光板を短くするか設置しないかすることにより、LED素子からの不要電磁波の漏洩量が多くなるという課題があった。   Since the conventional LED display device is configured as described above, the field-of-view range of the LED display device and the electromagnetic wave shielding effect are in a trade-off relationship. Although the visual field range is widened, the electromagnetic wave shielding effect is deteriorated and the leakage amount of unnecessary electromagnetic waves is increased. Therefore, when a wide visual field range is required for lighting the LED element, there is a problem that the amount of leakage of unnecessary electromagnetic waves from the LED element increases by shortening or not installing the light shielding plate.

この発明は、上記のような課題を解決するためになされたもので、LED素子の点灯の広視野化の向上を図ると共に、表示面の正面方向への不要電磁波の漏洩を低減することを目的とする。   The present invention has been made to solve the above-described problems, and aims to improve the wide field of view of lighting of the LED element and to reduce leakage of unnecessary electromagnetic waves in the front direction of the display surface. And

この発明に係るLED表示装置は、複数のLED素子を実装した基板と、開口部を有し、LED素子の実装面が開口部に向くように基板を収容する金属筐体と、金属筐体に収容された基板のLED素子の実装面上に充填した絶縁性樹脂からなり、基板に接続されたLED素子の電極端子を被覆する絶縁性樹脂層と、絶縁性樹脂層上に充填した導電性樹脂からなり、絶縁性樹脂層から露出したLED素子を被覆する導電性樹脂層とを備えるようにしたものである。   An LED display device according to the present invention includes a substrate on which a plurality of LED elements are mounted, an opening, a metal housing that houses the substrate so that the mounting surface of the LED elements faces the opening, and a metal housing An insulating resin layer that covers an electrode terminal of an LED element connected to the substrate, and an electrically conductive resin that is filled on the insulating resin layer. And a conductive resin layer covering the LED element exposed from the insulating resin layer.

この発明によれば、複数のLED素子を実装した基板を、開口部を有する金属筐体に、LED素子の実装面が開口部に向くように収容し、金属筐体に収容された基板のLED素子の実装面上に絶縁性樹脂を充填して、基板に接続されたLED素子の電極端子を被覆すると共に、絶縁性樹脂層上に導電性樹脂を充填して、絶縁性樹脂層から露出したLED素子を被覆するようにしたので、LED素子の点灯の広視野化および電磁波の漏洩防止が可能となる。   According to the present invention, a board on which a plurality of LED elements are mounted is housed in a metal housing having an opening so that the mounting surface of the LED element faces the opening, and the LED on the board housed in the metal housing The mounting surface of the element is filled with insulating resin to cover the electrode terminals of the LED elements connected to the substrate, and the insulating resin layer is filled with conductive resin to be exposed from the insulating resin layer. Since the LED element is covered, it is possible to widen the field of lighting of the LED element and to prevent leakage of electromagnetic waves.

実施の形態1.
図1は、この発明の実施の形態1に係るLED表示装置の構成を示す正面図(a)および断面図(b)である。図1(b)は、図1(a)のA−A’線に沿った断面図である。図1に示すLED表示装置1は、電極端子である2本のワイヤ3を有するLED素子2を、縦横に複数個実装したプリント基板4を金属筐体5に収容してなる。
Embodiment 1 FIG.
FIG. 1 is a front view (a) and a cross-sectional view (b) showing a configuration of an LED display device according to Embodiment 1 of the present invention. FIG.1 (b) is sectional drawing along the AA 'line of Fig.1 (a). The LED display device 1 shown in FIG. 1 includes a metal housing 5 that houses a printed board 4 on which a plurality of LED elements 2 each having two wires 3 that are electrode terminals are mounted vertically and horizontally.

金属筐体5は開口部を有し、プリント基板4はLED素子2が実装された片側表面4aがこの開口部を向くように金属筐体5に収容されている。プリント基板4とLED素子2は金属筐体5の側壁に囲われている。金属筐体5の開口部に面した複数のLED素子2が表示画面を構成する。
金属筐体5の背面には、各LED素子2を実装したプリント基板4の配線パターンと電気的に接続された入出力端子6が設けられている。LED表示装置1は、入出力端子6から入力される信号に従って各LED素子2の点灯を制御することにより、任意の画面表示を行う。
The metal housing 5 has an opening, and the printed circuit board 4 is accommodated in the metal housing 5 so that the one-side surface 4a on which the LED element 2 is mounted faces the opening. The printed circuit board 4 and the LED element 2 are surrounded by the side wall of the metal housing 5. A plurality of LED elements 2 facing the opening of the metal housing 5 constitute a display screen.
On the back surface of the metal housing 5, input / output terminals 6 are provided that are electrically connected to the wiring pattern of the printed circuit board 4 on which the LED elements 2 are mounted. The LED display device 1 performs arbitrary screen display by controlling lighting of each LED element 2 in accordance with a signal input from the input / output terminal 6.

プリント基板4の片側表面4a上には、片側表面4aからLED素子2のワイヤ3を完全に覆う高さまで絶縁性樹脂を充填して、絶縁性樹脂層7が形成されている。この絶縁性樹脂層7がワイヤ3同士の隙間および金属筐体5とワイヤ3との隙間を埋めることにより、金属筐体5とワイヤ3とが電気的に絶縁される。   An insulating resin layer 7 is formed on the one-side surface 4a of the printed board 4 by filling the insulating resin from the one-side surface 4a to a height that completely covers the wire 3 of the LED element 2. The insulating resin layer 7 fills the gap between the wires 3 and the gap between the metal housing 5 and the wire 3, whereby the metal housing 5 and the wire 3 are electrically insulated.

また、絶縁性樹脂層7の表面には、表面からLED素子2を完全に覆う高さまで透明な導電性樹脂を充填して、導電性樹脂層8が形成されている。
図2は、LED素子から漏洩する電磁波を示す説明図である。図2において図1と同一または相当の部分については同一の符号を付し説明を省略する。図2に示すLED素子2の正面方向と斜め方向に電磁波が放射される。
In addition, a conductive resin layer 8 is formed on the surface of the insulating resin layer 7 by filling a transparent conductive resin from the surface to a height that completely covers the LED element 2.
FIG. 2 is an explanatory diagram showing electromagnetic waves leaking from the LED elements. In FIG. 2, the same or corresponding parts as those in FIG. Electromagnetic waves are radiated in the front direction and the oblique direction of the LED element 2 shown in FIG.

従来は、図2に示す電磁波漏洩を効果的に低減するために、図6に示す導電性の遮光板94をLED素子周辺に設置する必要があった。LED素子の側面を取り囲む導電性の遮光板94は、斜め方向の電磁波漏洩を防止することはできるが、正面方向の電磁波漏洩を防止することができなかった。
これに対して、本実施の形態では、導電性樹脂層8がLED素子2の側面だけでなく、頭頂部まで覆う構成であるため、LED素子2の正面方向および斜め方向への電磁波の漏洩を防止することができる。また、LED素子2を覆う導電性樹脂は透明であるため、LED素子2の点灯の視野範囲を狭めることがない。
Conventionally, in order to effectively reduce the electromagnetic wave leakage shown in FIG. 2, it is necessary to install a conductive light shielding plate 94 shown in FIG. 6 around the LED element. The conductive light-shielding plate 94 surrounding the side surface of the LED element can prevent electromagnetic wave leakage in the oblique direction, but cannot prevent electromagnetic wave leakage in the front direction.
On the other hand, in this embodiment, since the conductive resin layer 8 is configured to cover not only the side surface of the LED element 2 but also the top of the head, the leakage of electromagnetic waves in the front direction and the oblique direction of the LED element 2 is prevented. Can be prevented. In addition, since the conductive resin covering the LED element 2 is transparent, the lighting visual field range of the LED element 2 is not narrowed.

さらに、図1に示すように絶縁性樹脂層7または導電性樹脂層8を金属筐体5の内側壁面に密着するように形成して、絶縁性樹脂層7または導電性樹脂層8と金属筐体5との隙間を埋めることにより、防水効果を得ることができる。   Further, as shown in FIG. 1, the insulating resin layer 7 or the conductive resin layer 8 is formed so as to be in close contact with the inner wall surface of the metal casing 5, and the insulating resin layer 7 or the conductive resin layer 8 and the metal casing are formed. By filling the gap with the body 5, a waterproof effect can be obtained.

以上のように、実施の形態1によれば、片側表面4aに複数のLED素子2を実装したプリント基板4を、片側表面4aが金属筐体5の有する開口部に向くように金属筐体5に収容してなるLED表示装置1において、プリント基板4の片側表面4a上に、LED素子2のワイヤ3の隙間を絶縁性樹脂で充填してワイヤ3を覆う高さの絶縁性樹脂層7を形成し、絶縁性樹脂層7の表面上に、LED素子2同士の隙間を透明な導電性樹脂で充填してLED素子2全体を覆う高さの導電性樹脂層8を形成した。そのため、LED素子の点灯の広視野化および電磁波の漏洩防止が可能となる。   As described above, according to the first embodiment, the printed circuit board 4 in which the plurality of LED elements 2 are mounted on the one-side surface 4 a is placed on the metal housing 5 so that the one-side surface 4 a faces the opening of the metal housing 5. In the LED display device 1 housed in the housing, an insulating resin layer 7 having a height that covers the wires 3 by filling the gaps of the wires 3 of the LED elements 2 with an insulating resin on the one-side surface 4a of the printed circuit board 4. Then, on the surface of the insulating resin layer 7, the gap between the LED elements 2 was filled with a transparent conductive resin to form a conductive resin layer 8 having a height that covers the entire LED element 2. Therefore, it is possible to widen the field of lighting of the LED element and to prevent leakage of electromagnetic waves.

実施の形態2.
図3は、この発明の実施の形態2に係るLED表示装置の構成を示す正面図(a)および断面図(b)である。図3(b)は、図3(a)のB−B’線に沿った断面図である。図3に示すLED表示装置20は、上記実施の形態1のLED表示装置1の導電性樹脂層8にかえて、絶縁性樹脂層7の表面からLED素子2の側面を覆う高さまで、導電性樹脂を充填した導電性樹脂層21が形成されている。この導電性樹脂層21には、不透明または黒色に着色した導電性樹脂を用いる。図3において図1と同一または相当の部分については同一の符号を付し説明を省略する。
Embodiment 2. FIG.
FIG. 3: is the front view (a) and sectional drawing (b) which show the structure of the LED display apparatus which concerns on Embodiment 2 of this invention. FIG. 3B is a cross-sectional view taken along line BB ′ of FIG. The LED display device 20 shown in FIG. 3 is conductive from the surface of the insulating resin layer 7 to a height that covers the side surface of the LED element 2 instead of the conductive resin layer 8 of the LED display device 1 of the first embodiment. A conductive resin layer 21 filled with resin is formed. For the conductive resin layer 21, a conductive resin colored opaque or black is used. In FIG. 3, the same or equivalent parts as in FIG.

絶縁性樹脂層7の表面上に、図3(a)に示すようにLED素子2の頭頂部を残して、LED素子2が完全には隠れない程度の高さに不透明または黒色の導電性樹脂層21を形成することで、LED素子2の点灯と導電性樹脂層21の色が対比となり、表示画像のコントラスト向上が実現できる。また、LED素子2の側面を導電性樹脂層2が覆うことにより、電磁波の漏洩を低減できる。   On the surface of the insulating resin layer 7, as shown in FIG. 3A, the top of the LED element 2 is left and the opaque or black conductive resin is high enough to prevent the LED element 2 from being completely hidden. By forming the layer 21, the lighting of the LED element 2 and the color of the conductive resin layer 21 are contrasted, and the contrast of the display image can be improved. Moreover, when the conductive resin layer 2 covers the side surface of the LED element 2, leakage of electromagnetic waves can be reduced.

以上のように、実施の形態2によれば、導電性樹脂層21は、不透明または黒色に着色した導電性樹脂を用いて、絶縁性樹脂層7の表面からLED素子2の側面を覆う高さに形成した。そのため、表示画像のコントラストを向上させることが可能となる。   As described above, according to the second embodiment, the conductive resin layer 21 has a height that covers the side surface of the LED element 2 from the surface of the insulating resin layer 7 using the conductive resin colored opaque or black. Formed. Therefore, it is possible to improve the contrast of the display image.

実施の形態3.
図4は、この発明の実施の形態3に係るLED表示装置の構成を示す正面図(a)および断面図(b)である。図4(b)は、図4(a)のC−C’線に沿った断面図である。図4に示すLED表示装置30は、上記実施の形態1のLED表示装置1において、プリント基板4のグランド層(図示省略)と絶縁性樹脂層8とを接続する金属導体31を設けた構成である。導電性樹脂層8は金属導体31によってプリント基板4のグランド層と電気的に接続されている。さらに、プリント基板4のグランド層が入出力端子6のアースに接続されている。図4において図1と同一または相当の部分については同一の符号を付し説明を省略する。
Embodiment 3 FIG.
FIG. 4 is a front view (a) and a cross-sectional view (b) showing the configuration of the LED display device according to Embodiment 3 of the present invention. FIG. 4B is a cross-sectional view taken along the line CC ′ of FIG. The LED display device 30 shown in FIG. 4 has a configuration in which the metal conductor 31 that connects the ground layer (not shown) of the printed circuit board 4 and the insulating resin layer 8 is provided in the LED display device 1 of the first embodiment. is there. The conductive resin layer 8 is electrically connected to the ground layer of the printed circuit board 4 by the metal conductor 31. Further, the ground layer of the printed circuit board 4 is connected to the ground of the input / output terminal 6. In FIG. 4, the same or equivalent parts as in FIG.

以上のように、実施の形態3によれば、プリント基板4のグランド層と導電性樹脂層8とを電気的に接続する金属導体31を設けた。そのため、導電性樹脂のグランド強化が実現でき、電磁波の漏洩防止能力を向上させることが可能となる。   As described above, according to the third embodiment, the metal conductor 31 that electrically connects the ground layer of the printed circuit board 4 and the conductive resin layer 8 is provided. Therefore, ground reinforcement of the conductive resin can be realized, and the ability to prevent electromagnetic wave leakage can be improved.

なお、上述した説明では、上記実施の形態1で示した構成に対して上記実施の形態2または上記実施の形態3をそれぞれ適用する場合を示したが、これに限らず、上記実施の形態2および上記実施の形態3の構成を適宜組み合わせたものであっても構わない。   In the above description, the case where the second embodiment or the third embodiment is applied to the configuration shown in the first embodiment has been described. However, the present invention is not limited to this. Further, the configuration of the third embodiment may be appropriately combined.

また、上記実施の形態1−3では、防水効果を得るために絶縁性樹脂層または導電性樹脂層を金属筐体の内側壁面に密着するように構成したが、この構成に加えて、基板のLED素子実装面と絶縁性樹脂層との間に防水部材を用いる構成であってもよい。
図5は、この発明の実施の形態1に係るLED表示装置に防水パッキンを設けた構成を示す断面図である。図5において図1と同一または相当の部分については同一の符号を付し説明を省略する。図5に示すLED表示装置10は、プリント基板4のLED素子2を実装した片側表面と絶縁性樹脂層7の間に防水パッキン9を設けた構成である。実施の形態2および3のLED表示装置も同様に防水パッキンを設ける構成としてもよい。これにより防水効果が得られる。
Further, in Embodiment 1-3 above, the insulating resin layer or the conductive resin layer is configured to be in close contact with the inner wall surface of the metal housing in order to obtain a waterproof effect. The structure which uses a waterproof member between an LED element mounting surface and an insulating resin layer may be sufficient.
FIG. 5 is a cross-sectional view showing a configuration in which a waterproof packing is provided in the LED display device according to Embodiment 1 of the present invention. In FIG. 5, the same or corresponding parts as in FIG. The LED display device 10 shown in FIG. 5 has a configuration in which a waterproof packing 9 is provided between one surface of the printed circuit board 4 on which the LED element 2 is mounted and the insulating resin layer 7. Similarly, the LED display devices of Embodiments 2 and 3 may be configured to be provided with waterproof packing. This provides a waterproof effect.

この発明の実施の形態1に係るLED表示装置の構成を示す正面図および断面図である。It is the front view and sectional drawing which show the structure of the LED display apparatus which concerns on Embodiment 1 of this invention. LED素子から漏洩する電磁波を示す説明図である。It is explanatory drawing which shows the electromagnetic waves which leak from a LED element. この発明の実施の形態2に係るLED表示装置の構成を示す正面図および断面図である。It is the front view and sectional drawing which show the structure of the LED display apparatus which concerns on Embodiment 2 of this invention. この発明の実施の形態3に係るLED表示装置の構成を示す正面図および断面図である。It is the front view and sectional drawing which show the structure of the LED display apparatus which concerns on Embodiment 3 of this invention. この発明の実施の形態1に係るLED表示装置に防水パッキンを設けた構成を示す断面図である。It is sectional drawing which shows the structure which provided the waterproof packing in the LED display apparatus which concerns on Embodiment 1 of this invention. 従来のLED表示装置の構成を示す正面図および断面図である。It is the front view and sectional drawing which show the structure of the conventional LED display apparatus.

符号の説明Explanation of symbols

1,10,20,30 LED表示装置、2 LED素子、3 ワイヤ、4 プリント基板、4a 片側表面、5 金属筐体、6 入出力端子、7 絶縁性樹脂層、8,21 導電性樹脂層、9 防水パッキン、31 金属導体、90 従来のLED表示装置、91 LED素子、92 プリント基板、93 金属筐体、94 遮光板。   1, 10, 20, 30 LED display device, 2 LED element, 3 wire, 4 printed circuit board, 4a one side surface, 5 metal housing, 6 input / output terminal, 7 insulating resin layer, 8, 21 conductive resin layer, 9 waterproof packing, 31 metal conductor, 90 conventional LED display device, 91 LED element, 92 printed circuit board, 93 metal housing, 94 light shielding plate.

Claims (6)

複数のLED素子を実装した基板と、
開口部を有し、前記LED素子の実装面が前記開口部に向くように前記基板を収容する金属筐体と、
前記金属筐体に収容された前記基板のLED素子の実装面上に充填した絶縁性樹脂からなり、前記基板に接続された前記LED素子の電極端子を被覆する絶縁性樹脂層と、
前記絶縁性樹脂層上に充填した導電性樹脂からなり、前記絶縁性樹脂層から露出した前記LED素子を被覆する導電性樹脂層とを備えたLED表示装置。
A substrate on which a plurality of LED elements are mounted;
A metal housing that has an opening and accommodates the substrate so that the mounting surface of the LED element faces the opening;
An insulating resin layer made of an insulating resin filled on the mounting surface of the LED element of the substrate housed in the metal casing, and covering the electrode terminal of the LED element connected to the substrate;
An LED display device comprising: a conductive resin filled on the insulating resin layer, and a conductive resin layer covering the LED element exposed from the insulating resin layer.
導電性樹脂層は、透明な導電性樹脂からなり、絶縁性樹脂層から露出したLED素子の全体を被覆することを特徴とする請求項1記載のLED表示装置。   The LED display device according to claim 1, wherein the conductive resin layer is made of a transparent conductive resin and covers the entire LED element exposed from the insulating resin layer. 導電性樹脂層は、不透明な導電性樹脂からなり、絶縁性樹脂層から露出したLED素子の側面までを被覆することを特徴とする請求項1記載のLED表示装置。   The LED display device according to claim 1, wherein the conductive resin layer is made of an opaque conductive resin, and covers the side of the LED element exposed from the insulating resin layer. 導電性樹脂層は、黒色に着色した樹脂であることを特徴とする請求項3記載のLED表示装置。   The LED display device according to claim 3, wherein the conductive resin layer is a resin colored in black. 基板に設けたグランド層と導電性樹脂層とを電気的に接続する金属導体を設けたことを特徴とする請求項1から請求項4のうちのいずれか1項記載のLED表示装置。   5. The LED display device according to claim 1, further comprising a metal conductor that electrically connects a ground layer and a conductive resin layer provided on the substrate. 基板のLED素子の実装面と絶縁性樹脂層との間に防水部材を設けたことを特徴とする請求項1から請求項5のうちのいずれか1項記載のLED表示装置。   6. The LED display device according to claim 1, wherein a waterproof member is provided between the mounting surface of the LED element of the substrate and the insulating resin layer.
JP2008100527A 2008-04-08 2008-04-08 Led display device Pending JP2009253098A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101099419B1 (en) 2010-06-21 2011-12-27 주식회사 삼광산전 Dimming select type led lamp module
US11039532B2 (en) 2018-06-14 2021-06-15 Samsung Electronics Co., Ltd. Printed circuit board and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101099419B1 (en) 2010-06-21 2011-12-27 주식회사 삼광산전 Dimming select type led lamp module
US11039532B2 (en) 2018-06-14 2021-06-15 Samsung Electronics Co., Ltd. Printed circuit board and manufacturing method thereof
US11792924B2 (en) 2018-06-14 2023-10-17 Samsung Electronics Co., Ltd. Printed circuit board and manufacturing method thereof

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