JP2010080691A - Shielding structure and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shielding structure, giving full shielding capability, without having to add new members, including an electroconductive tape, as a means for plugging the hole part of a shielding case 5 which is disposed when a component 2 which emits noise and a first connector 4a are housed inside the shielding case 5. <P>SOLUTION: The shielding structure includes, a first substrate 1, a first component 2 which emits noise arranged on the first substrate; and a second component 3 which is affected by the noise, the first connector 4a, a second connector 4b and the shielding case 5, where a first electrode wiring 8 for grounding disposed on a second substrate 6, on which the second connector 4b is arranged, is electrically connected to the outer area of the hole part 9 of the shielding case 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a shield structure used in an electronic device such as a mobile phone, and more particularly to a technique for reducing noise emission in a shield structure having a connector inside.

2. Description of the Related Art In recent years, electronic devices such as mobile phones have been mounted with many components that serve as noise radiation sources due to their higher functionality. Accordingly, in order to maintain the radio performance and control function of the antenna and the like, a shielding technique for reducing noise radiation from a component serving as a noise radiation source has become important. In general, in order to reduce noise radiation, a part serving as a noise radiation source disposed on a substrate is covered with a shield case.
In addition, when a connector is placed near a component that is a noise radiation source, the connector is placed inside one shield case together with a component that is a noise radiation source due to the recent demand for miniaturization. It has come to be.

FIG. 6 is a cross-sectional view showing an example in which a connector is arranged together with a component that radiates noise inside one shield case.
In the figure, reference numeral 1 denotes a first substrate serving as a base material for mounting various electronic components. 2 is a component that is mounted on the first substrate 1 and emits noise, and 3 is a component that is mounted on the first substrate 1 and is affected by noise. Reference numeral 4a denotes a first connector arranged in the vicinity of the component 2 that emits noise, and 4b denotes a second connector fitted to the first connector. Reference numeral 6 denotes a second substrate on which the second connector is mounted. Reference numeral 7 denotes an electrode wiring connected to the second connector 4b. Reference numeral 5 denotes a shield case that accommodates the component 2 that radiates noise and the first connector 4a. When the component 2 that radiates noise and the first connector 4a are accommodated in one shield case 5 as described above, a hole is formed in the upper part of the shield case 5 in order to fit the connectors. It is necessary to provide the part 9.

  However, when the hole 9 is provided in the shield case 5 as shown in FIG. 6, there is a concern that noise leaks from the hole 9 and the component 3 affected by the noise does not operate correctly. . Specifically, when the antenna is disposed in the vicinity of the shield case, there is a concern about the deterioration of the antenna radio performance due to the noise.

  In order to solve such a problem, as shown in FIG. 7, after the electrode wiring 7 connected to the second connector 4b is drawn out from the inside of the shield case 5 through the hole 9, the shield such as the conductive tape 13 is used. The hole 9 is covered with a member. Thereby, noise radiation from the hole 9 is reduced.

  However, in the case of this structure, use of a new shield member such as the conductive tape 13 causes an additional member and an increase in cost.

  This invention is made | formed in view of the said subject, and it aims at providing the shield structure which satisfy | fills sufficient shielding performance with respect to noise, without requiring a conductive tape.

    In order to solve the above-described problems, the present invention provides a first substrate, a first component that is disposed on the first substrate and radiates noise, and a second component that is affected by the noise, A first connector mounted on the first board; a second connector fitted to the first connector; a second board on which the second connector is mounted; and the second board. A shield structure comprising: a first ground electrode wiring formed on the first substrate; and a shield case mounted on the first substrate and covering the first component and the first connector. Has a hole for fitting the first connector and the second connector, and when the first connector and the second connector are fitted, the first connector Ground electrode wiring is in the hole of the shield case It is electrically connected to the outer region of the.

  As described in detail above, the shield structure according to the present invention has an excellent effect of providing a shield structure that satisfies a sufficient shielding performance against noise.

First, a first embodiment will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a schematic configuration of a shield structure according to the present invention. 2 is an exploded perspective view seen from the front when the connectors according to the first embodiment of the present invention are fitted together, and FIG. 3 is seen from the side when the connectors are fitted together in the same embodiment. FIG.
The shield structure according to the present invention is mainly composed of a first substrate 1, a first component 2 that radiates noise (hereinafter referred to as “component 2 that radiates noise”), disposed on the first substrate 1. A second component 3 affected by noise (hereinafter referred to as “component 3 affected by noise”), a first connector 4a, a second connector 4b, and a shield case 5 are included.
<First substrate>
The first substrate 1 is made of an insulating member and serves as a base material for supporting various electronic components and the like. Further, a second ground electrode wiring 10 made of, for example, copper foil, ITO, aluminum or the like, or an electrode wiring for a signal or a power source is formed on the surface or inside of the first substrate 1, and these have connection portions. Except for this, it is covered with an insulating covering member such as a cover film. The second ground electrode wiring 10, the signal or power supply electrode wiring, and the like are formed in a predetermined pattern by a conventionally known thin film technique or the like.
<Electronic parts>
A mounting area for mounting various electronic components and connectors is provided on the first substrate 1. Various electronic components include electronic components having various functions such as a component 2 that emits noise, a component 3 that is affected by noise, a circuit component for transmission, and a circuit component for reception. Examples of the component 2 that emits noise include components that handle switching signals, clock signals, and data signals, such as power supply circuits, baseband circuits, LCD circuits, and crystal oscillators. Examples of the component 3 affected by noise include components that handle weak signals, such as electronic components on which an antenna and a receiving circuit are mounted.
<First connector>
The 1st connector 4a mounted on the 1st board | substrate 1 is fitted by the 2nd connector 4b mentioned later. The 1st connector 4a is accommodated in the inside of the shield case mentioned later with the component 2 which radiates | emits noise.
<Shield case>
The shield case 5 has a recess, and can accommodate the first connector 4a, a component 2 that emits noise, and the like in the recess. The shield case 5 confines the noise generated by the component 2 that emits noise in the recess, thereby reducing the influence of the noise on other electronic components, particularly the component 3 affected by the noise. Specifically, the shield case 5 surrounds the noise-radiating component 2 and the first connector 4a in order to isolate the noise-radiating component 2 and the noise-affected component 3 from each other. 1 is arranged. Such a shield case 5 is made of, for example, a metal plate processed by sheet metal.
The shield case 5 is provided with a hole 9 in the upper part of the shield case 5 in order to fit the second connector 4b with the first connector 4a. The hole 9 only needs to have a size that allows the second connector 4b to be fitted into the first connector 4a, and is as small as possible to prevent noise from leaking outside. Is preferred.
<Second substrate>
A second substrate 6 is disposed at a position facing the first substrate. The second substrate 6 includes a second connector mounting area and serves as a base material for supporting the second connector 4 b and the electrode wiring 7. Further, on the surface or inside of the second substrate 6, a first ground electrode wiring 8 made of, for example, copper foil, ITO, aluminum or the like, an electrode wiring 7 for signal or power supply, and the like are formed. Is covered with an insulating covering member such as a cover film. The first ground electrode wiring 8 and the signal or power supply electrode wiring 7 are formed in a predetermined pattern by a conventionally known thin film technique or the like.
<Second connector>
The second connector 4b for mating with the first connector 4a is mounted on the second substrate 6 and connected to the signal or power electrode wiring 7 formed on the second substrate 6. ing.
<Electrode wiring and first ground electrode wiring>
The electrode wiring 7 and the first ground wiring 8 are arranged in parallel on the same layer of the second substrate 6. The first ground electrode wiring 8 is formed so as to surround the connection portion between the second connector 4 b and the electrode wiring 7 except for the region where the electrode wiring 7 is formed.
This connecting portion is formed along one side of the second connector 4b, for example. Alternatively, the connection portion may be formed along two sides.
The first ground electrode wiring 8 extends in the respective regions on both sides of the electrode wiring 7 along the electrode wiring 7 connected to the second connector 4b.
<Shield case and first ground electrode wiring>
The first ground electrode wiring 8 is electrically connected to the outer region of the hole of the shield case 5 mounted on the first substrate 1 around the connector 4b.

  The electrical connection of the first ground electrode wiring 8 to the outer region of the hole 9 of the shield case 5 is a region of the first ground electrode wiring 8 that is in contact with the outer region of the hole 9 of the shield case 5. The cover film is peeled off and exposed, and the exposed portion is brought into contact with the outer region of the hole of the shield case 5 using the elastic force of the cover film. As a result, it is possible to provide a shield structure that can reduce noise emission from the hole without adding a new shield member such as a conductive tape.

Next, a second embodiment of the present invention will be described with reference to the drawings.
FIG. 4 is a perspective view seen from the side when the connectors according to the second embodiment of the present invention are fitted together.
In the second embodiment, an electrode wiring 7 formed on the second substrate 6 and connected to the second connector 4b, and a first ground electrode wiring 8 formed on the second substrate 6 are provided. Are formed in different layers. Specifically, a first ground electrode wiring 8 is formed in a layer relatively close to the first substrate 1 (hereinafter referred to as a first layer) of the shield case 5, and the first substrate 1 is relatively formed. An electrode wiring 7 connected to the second connector 4b is formed in a layer far from the layer (hereinafter referred to as a second layer). In addition, an insulating film is disposed between the two. In the vicinity of the second connector 4 b, the first ground electrode wiring 8 in the first layer avoids the area where the second connector 4 b is mounted, and around it, that is, in the hole 9 of the shield case 5. An annular portion surrounding the periphery is formed at a position corresponding to the outer region. Since this annular portion is electrically connected to the outer peripheral region of the hole 9 of the shield case 5, it is exposed from the cover film. Further, since the electrode wiring 7 formed in the second layer is connected to the second connector 4b, the cover film is peeled off at the portion of the connection portion with the second connector 4b, and the metal is exposed. The terminal of the connector is connected to the exposed portion. The exposed metal portion of the first ground electrode wiring 8 is electrically connected to the upper portion of the shield case 5 and outside the hole portion 9.

  In this case, since the annular portion connected to the outer peripheral region of the hole 9 of the shield case 5 surrounds the periphery of the hole 9 in an annular shape, it is possible to effectively reduce noise emission. Even if the first ground electrode wiring 8 is not formed in a ring shape in the first layer, noise is generated by electrically connecting the first ground electrode wiring 8 to the outer region of the hole 9 of the shield case 5. Needless to say, it is possible to reduce the radiation.

  As described above in detail, according to the first or second embodiment of the present invention, it is possible to effectively reduce noise emission from the shield case.

  The present invention is not limited to the application to the above-described embodiments, and various modifications may be made. Needless to say, the present invention is replaced with the above-described first or second embodiment as follows. May be. That is, as a difference from the first embodiment, the second substrate 2 has a first ground electrode wiring 8 provided in the same layer as the electrode wiring 7 and is further relative to the same layer. In particular, the third ground electrode wiring may be provided in a layer far from the first substrate 1. The first ground electrode wiring 8 and the third ground electrode wiring are preferably electrically connected via a via hole or the like. Since the third ground electrode wiring is formed in a layer relatively far from the first substrate 1, the hole including the connection portion between the electrode wiring 7 and the second connector 4b can be covered. . Thereby, radiation of noise can be reduced.

Further, the first ground electrode wiring 8 and the second ground electrode wiring 10 formed on the first substrate 1 may be connected via the shield case 5.
According to this configuration, the ground electrode wirings between the first substrate 1 and the second substrate 6 can be connected to each other via the shield case 5, and the first connector 4a and the second connector 4b are connected. It is not necessary to separately provide a connection terminal for electrically connecting the ground electrode wirings to each other. In addition, in addition to connecting the ground electrode wirings via the shield case 5, when connecting the ground electrode wirings via the connection terminals of the first connector 4a and the second connector 4b, Since an electrically parallel circuit can be formed, the withstand voltage performance is improved.

Next, an electronic device having the above-described shield structure will be described with reference to FIG. An electronic apparatus according to an embodiment of the present invention includes any one of the shield structures described above and a housing 12 that houses the shield structure therein. In addition, the housing 12 includes a rib 11 at a position facing the outer peripheral region of the hole 9 of the shield case 5 through the ground electrode wiring, and the rib 11 contacts the second substrate 2. It is possible to contact. Here, the rib 11 may actually press the second substrate 2, or may be in light contact so that the second substrate does not warp in a direction away from the shield case. Alternatively, the ribs 11 may contact the second substrate 6 only when the second substrate 6 is greatly deformed. Further, the shape of the rib 11 is not limited to that illustrated in FIG. 5, and may be in contact with the entire second substrate or may be in contact with a part thereof.
According to such an electronic device, the rib 11 and the second substrate 6 can be brought into contact with each other, whereby the electrical connection state between the first ground electrode wiring 8 and the shield case 5 is stably maintained. be able to.

It is sectional drawing which shows schematic structure of the shield structure concerning this invention. It is the disassembled perspective view seen from the front at the time of the connectors concerning 1st Example of this invention being fitted. It is the perspective view seen from the side surface when the connectors in the 1st Example of the present invention are fitted. It is the perspective view seen from the side surface at the time of the connectors concerning 2nd Example of this invention being fitted. It is sectional drawing which shows schematic structure of a shield structure among the electronic devices which have the shield structure which concerns on this invention. It is sectional drawing 1 which shows schematic structure of the conventional shield structure. It is sectional drawing 2 which shows schematic structure of the conventional shield structure.

Explanation of symbols

1: First substrate 2: First component that emits noise 3: Second component 4a affected by noise: First connector 4b: Second connector 5: Shield case 6: Second substrate 7 : Electrode wiring
8: First ground electrode wiring 9: Hole 10: Second ground electrode wiring 11: Rib 12: Housing 12
13: Conductive tape

Claims (5)

A first substrate;
A first component disposed on the first substrate and emitting noise and a second component affected by the noise;
A first connector mounted on the first substrate;
A second connector fitted to the first connector;
A second substrate on which the second connector is mounted;
A first ground electrode wiring formed on the second substrate;
A shield case mounted on the first substrate and covering the first component and the first connector;
In a shield structure comprising:
The shield case has a hole for fitting the first connector and the second connector;
When the first connector and the second connector are fitted, the first ground electrode wiring is electrically connected to an outer region of the hole of the shield case. Shield structure.   A second ground electrode wiring is formed on the first substrate, and the first ground electrode wiring and the second ground electrode wiring are electrically connected via the shield case. 2. The shield structure according to claim 1, wherein:   The shield structure according to claim 1, wherein the first ground electrode wiring is provided so as to surround the second connector.   An electrode wiring connected to the second connector is disposed on the second substrate, and the first ground electrode wiring is disposed around the second connector except for a region where the electrode wiring is formed. The shield structure according to claim 1, wherein the shield structure is provided so as to surround. The shield structure according to claim 1, and a housing 12 that accommodates the shield structure therein,
In an electronic device comprising:
The housing 12 includes a rib at a position facing the outer peripheral region of the hole of the shield case through the first ground electrode wiring, and the rib contacts the second substrate. The electronic device according to claim 1, wherein the electronic device can be contacted.