JP2009247918A - Method of discharging liquid material, method of manufacturing color filter and method of manufacturing organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of discharging a liquid material capable of efficient application of a liquid material even when directions of arrangement of film formation areas on the substrate are different mutually and a method of manufacturing color filters and method of manufacturing organic EL devices using the discharging method. <P>SOLUTION: The method of discharging a liquid material has a first discharging process of carrying out twice or more scanning operations comprising discharging droplets into the film formation areas 3r, 3g and 3b on a mother substrate P having the first application areas E1 in which film formation areas 3r, 3g and 3b are arranged and the second application area E2 in which film formation areas 3r', 3g' and 3b' are arranged and discharging at least one droplet into the film formation areas 3r', 3g' and 3b' and a second discharging process of discharging the liquid material at least in such amounts as to supplement the shortages of amounts required for the film formation areas 3r', 3g' and 3b'. The longitudinal direction of the film formation areas 3r, 3g and 3b is perpendicular to that of the film formation areas 3r', 3g' and 3b'. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a method for discharging a liquid material containing a functional material, a method for manufacturing a color filter using the same, and a method for manufacturing an organic EL device.

As a method of discharging a liquid containing a functional material, an inkjet head having a plurality of nozzles and a stage on which an object to be coated with a film forming material is placed, the inkjet head and / or the stage moves, and the stage Has a coating process in which the object is scanned while discharging ink from the inkjet head using a film forming apparatus having a function of rotating 360 degrees, and the object is overcoated from two or more different directions A film forming method is known (Patent Document 1).

According to the film forming method, it is possible to reduce unevenness in drying and unevenness due to wetting and spreading after landing of droplets ejected from nozzles of an ink jet head, and to form a uniform thin film on an object. Examples of the thin film include an alignment film that aligns a liquid crystal material in a predetermined direction in a liquid crystal display device.

Japanese Patent Laying-Open No. 2005-296854, page 4

In the conventional film forming method using the droplet discharge method (inkjet method), overcoating is performed to form a uniform thin film on an object. However, a decrease in productivity is inevitable by performing overcoating.
The film forming method using the droplet discharge method has a problem that both the formation of a uniform thin film and the securing of productivity are required.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] In the liquid material discharge method according to this application example, a plurality of nozzles are formed on a substrate in which a plurality of film formation regions are arranged in a first direction and a second direction orthogonal to the first direction. The liquid forming method discharges the liquid material as droplets from at least one of the nozzles during the scanning to the film forming region, and the film forming region has an alignment direction. Are formed of a first film formation region and a second film formation region that are orthogonal to each other, and the substrate includes a first coating region in which a plurality of the first film formation regions are arranged, and a first coating region in which a plurality of the second film formation regions are arranged. The first film forming region, wherein the plurality of nozzles are relatively arranged so that the number of the nozzles applied to the first film forming region is larger than that of the second film forming region. And performing a plurality of scans for discharging the droplets at the same time, A first ejection step for ejecting at least one droplet to the second film formation region; and the plurality of nozzles to increase the number of nozzles applied to the second film formation region as compared to the first film formation region. And a second discharge step of discharging the liquid material, which is insufficient with respect to a predetermined amount, at least in the second film formation region as the droplets.

According to this method, in the first ejection step, at least one drop is applied to the second film formation region whose arrangement direction is orthogonal to the first film formation region during the scan for ejecting the liquid material to the first film formation region. Liquid droplets are discharged. Accordingly, it is possible to reduce the number of droplets arranged in the second film formation region in the scanning of the second ejection process. Therefore, it is possible to reduce the number of scans for discharging the liquid material as droplets. Therefore, the scanning time for discharging the liquid material to the first application region and the second application region on the substrate can be shortened, so that the liquid material can be applied with improved productivity.

Application Example 2 In the liquid discharge method according to the application example, the area of the first film formation region is smaller than the area of the second film formation region, and the area of the first application region is the second application region. It is characterized by being smaller than the area of the region.
When scanning with a plurality of nozzles arranged relative to each other so as to increase the number of nozzles applied to the second film formation region having a large area, the nozzles applied to the first film formation region having a small area are scanned. It becomes difficult to secure the number. According to this method, in the first ejection step, the plurality of nozzles are relatively arranged so that the number of nozzles applied to the first film formation region having a smaller area than that of the second film formation region is increased. Therefore, the liquid material is efficiently applied to the first application region having the smaller area first, and then the liquid material is applied to the second film forming region having the larger area in the second discharge step. Since at least one droplet is ejected in advance in the second film formation region, the liquid material can be efficiently applied by the first application region and the second application region of the substrate.

Application Example 3 In the liquid discharge method according to the application example described above, in the second discharge step, the substrate is planarly disposed relative to the relative arrangement of the substrate and the plurality of nozzles in the first discharge step. It is preferable to rotate 90 degrees and make a relative arrangement.
According to this method, when the arrangement of the plurality of nozzles becomes higher definition than the arrangement of the first film formation region and the second film formation region, it is more preferable to rotate the substrate by 90 degrees. As compared with the above, it is possible to easily position the plurality of nozzles so that more nozzles are applied to the second film formation region and efficiently discharge the liquid material.

Application Example 4 In the liquid discharge method according to the application example, the first film formation region and the second film formation region
The predetermined amount of the liquid material discharged to the film formation region is set to the first discharge step and the second discharge amount, respectively.
It is preferable to discharge the droplets in a distributed manner with respect to the discharging step.
According to this method, the combination of nozzles applied to the same film formation region differs between the first discharge process and the second discharge process. Therefore, by changing the combination of nozzles applied to the same film formation region, it is possible to suppress variations in the amount of liquid material applied due to variations in the droplet discharge amount between the nozzles.

Application Example 5 In the liquid material discharge method according to the application example, the first discharge step includes the second discharge step.
When the number of scans required to apply the predetermined amount of the liquid material as the droplets to the second film formation region in the ejection step is m (m is a natural number of 2 or more), the predetermined amount At least 1 / m of the liquid material may be discharged as the droplets to the second film formation region.
According to this method, since 1 / m of a predetermined amount is discharged in advance to the second film formation region in the first discharge step, the number of scans in the second discharge step can be reduced at least once. That is, productivity can be improved by reducing the number of scans.

Application Example 6 In the liquid material discharge method according to the application example, the second discharge step includes the first discharge step.
When the droplets are ejected in the ejection step, at least one droplet of the droplets with respect to a portion where the droplets cannot be disposed in the first film formation region in the scanning with the plurality of nozzles and the substrate Is preferably discharged.
According to this method, liquid droplets can be landed evenly on the first film formation region and the liquid material can be spread.

Application Example 7 A color filter manufacturing method according to this application example is a method of manufacturing a color filter having a plurality of colored layers in a plurality of film formation regions on a substrate, and the plurality of film formation regions are arranged in an array. The substrate includes a first film formation region and a second film formation region that are orthogonal to each other, and the substrate includes a first application region in which a plurality of the first film formation regions are arranged, and a plurality of the second film formation regions. Second
A discharge step of discharging a plurality of color liquid materials including a coloring layer forming material to the plurality of film formation regions using the liquid discharge method of the application example, and the discharged liquid A film forming step of solidifying the body to form the colored layers of the plurality of colors.

According to this method, the liquid material is efficiently discharged to the first film formation region and the second film formation region whose arrangement directions are orthogonal to each other, and at least two kinds of color filters having different arrangement directions of the colored layers are produced with high production. It can be manufactured with sex.

Application Example 8 An organic EL device manufacturing method according to this application example is a method for manufacturing an organic EL device including an organic EL element having a functional layer including a light emitting layer in a plurality of film formation regions on a substrate, The plurality of film formation regions includes a first film formation region and a second film formation region whose arrangement directions are orthogonal to each other, and the substrate includes a first application region in which a plurality of the first film formation regions are arranged, A discharge step of discharging a liquid material containing a light emitting layer forming material to the plurality of film formation regions by using the liquid material discharge method of the above application example. And a film forming step of solidifying the discharged liquid material to form the light emitting layer.

According to this method, at least two types of organic EL devices in which the arrangement directions of the organic EL elements are different from each other by efficiently discharging the liquid material to the first film formation region and the second film formation region whose arrangement directions are orthogonal to each other. It can be manufactured with high productivity.

Hereinafter, the liquid material discharge method of the present embodiment will be described by taking a color filter manufacturing method to which this is applied as an example. Note that the drawings used for explanation are appropriately reduced or enlarged with respect to actual dimensions for explanation.

(Embodiment 1)
<Droplet ejection device>
First, a droplet discharge apparatus capable of discharging and drawing a liquid containing a functional material as droplets on the surface of an object to be discharged will be described with reference to FIGS. FIG. 1 is a schematic perspective view showing the configuration of the droplet discharge device.

As shown in FIG. 1, the droplet discharge device 10 includes a workpiece moving mechanism 20 that moves a mother substrate P that is a discharge target in a main scanning direction (X-axis direction) as a first direction, and a head unit 9. And a head moving mechanism 30 that moves in the sub-scanning direction (Y-axis direction) as a second direction orthogonal to the main scanning direction.

The workpiece moving mechanism 20 places a pair of guide rails 21, a moving table 22 that moves along the pair of guide rails 21, and a mother substrate P that is disposed on the moving table 22 via the rotating mechanism 6. Stage 5 is provided.
The moving table 22 is moved in the main scanning direction by an air slider and a linear motor (not shown) provided inside the guide rail 21. The moving table 22 is provided with an encoder 12 (see FIG. 4) as a timing signal generator.
The encoder 12 moves along the guide rail 21 with the relative movement of the movable table 22 in the main scanning direction.
The scale of a linear scale (not shown) arranged in parallel is read to generate an encoder pulse as a timing signal. In addition, arrangement | positioning of the encoder 12 is not restricted to this, For example,
When the movable table 22 is configured to relatively move along the rotation axis in the X-axis direction and a drive unit that rotates the rotation shaft is provided, the encoder 12 may be provided in the drive unit. Examples of the drive unit include a servo motor.
The stage 5 can suck and fix the mother substrate P, and the rotation mechanism 6 can accurately align the reference axis in the mother substrate P in the main scanning direction and the sub-scanning direction.
Further, the mother substrate P can be rotated by, for example, 90 degrees in accordance with the arrangement of the film formation region on which the liquid material is discharged on the mother substrate P.

The head moving mechanism 30 includes a pair of guide rails 31 and a moving table 32 that moves along the pair of guide rails 31. The moving table 32 is provided with a carriage 8 suspended via a rotation mechanism 7.
A head unit 9 on which a plurality of droplet discharge heads 50 (see FIG. 2) is mounted is attached to the carriage 8.
A liquid supply mechanism (not shown) for supplying a liquid to the droplet discharge head 50;
A head driver 48 (see FIG. 4) for performing electrical drive control of the plurality of droplet discharge heads 50 is provided.
The moving table 32 moves the carriage 8 in the Y-axis direction so that the head unit 9 is disposed opposite to the mother substrate P.

In addition to the above-described configuration, the droplet discharge device 10 has a maintenance mechanism that performs maintenance such as nozzle clogging of a plurality of droplet discharge heads 50 mounted on the head unit 9 and removal of foreign matters and dirt on the nozzle surface. The plurality of droplet discharge heads 50 are disposed at a position facing the droplet discharge heads 50.
Further, a weight measuring mechanism 60 (see FIG. 4) having a measuring instrument such as an electronic balance for receiving the liquid discharged from each droplet discharge head 50 and measuring the weight thereof is provided. And the control part 40 which controls these structures comprehensively is provided.
In FIG. 1, the maintenance mechanism and the weight measuring mechanism 60 are not shown.

FIG. 2 is a schematic view showing the structure of the droplet discharge head. FIG. 4A is a perspective view, and FIG. 4B is a plan view showing a nozzle arrangement state.

As shown in FIG. 2A, the droplet discharge head 50 is a so-called two-unit type, a liquid material introduction portion 53 having two connection needles 54, and a head substrate stacked on the introduction portion 53. 55 and a head main body 56 which is disposed on the head substrate 55 and has a liquid-in-head flow path formed therein. The connection needle 54 is connected to the above-described liquid material supply mechanism (not shown) via a pipe, and supplies the liquid material to the flow path in the head. The head substrate 55 is provided with two connectors 58 connected to the head driver 48 (see FIG. 4) via a flexible flat cable (not shown).

The head main body 56 includes a pressurizing unit 57 having a cavity formed of a piezoelectric element as a driving unit, and a nozzle plate 51 in which two nozzle rows 52a and 52b are formed in parallel to each other on the nozzle surface 51a. ing.

As shown in FIG. 2B, in the two nozzle rows 52a and 52b, a plurality (180) of nozzles 52 are arranged at substantially equal intervals with a pitch P1, and the pitch P2 is shifted by half of the pitch P1. In this state, it is disposed on the nozzle surface 51a. In this case, the pitch P1 is approximately 141 μm. Accordingly, when viewed from the direction orthogonal to the nozzle row 52c, 360 nozzles 52 are arranged at a nozzle pitch of approximately 70.5 μm. The diameter of the nozzle 52 is approximately 27 μm.

In the droplet discharge head 50, when a drive signal as an electric signal is applied from the head driver 48 to the piezoelectric element, the volume of the cavity of the pressurizing unit 57 fluctuates. The liquid material can be discharged as droplets from the nozzle 52 under pressure.

The driving means in the droplet discharge head 50 is not limited to a piezoelectric element. An electromechanical transducer that displaces a diaphragm as an actuator by electrostatic adsorption, or a nozzle 52 by heating a liquid.
Alternatively, an electrothermal conversion element (thermal method) that is discharged as droplets may be used.

FIG. 3 is a schematic plan view showing the arrangement of the droplet discharge heads in the head unit. Specifically, it is a view seen from the side facing the mother substrate P.

As shown in FIG. 3, the head unit 9 includes a head plate 9a on which a plurality of droplet discharge heads 50 are disposed. A total of six droplet ejection heads 50, that is, a head group 50 </ b> A composed of three droplet ejection heads 50 and a head group 50 </ b> B composed of three droplet ejection heads 50 are mounted on the head plate 9 a. In this case, the head R1 (
The droplet discharge head 50) and the head R2 (droplet discharge head 50) of the head group 50B discharge the same type of liquid. The same applies to the other heads G1 and G2, and heads B1 and B2. That is, it has a configuration capable of discharging three different liquid materials.

The drawing width that can be drawn by one droplet discharge head 50 is L _0, and this is set as the nozzle row 52.
Let c be the effective length. Hereinafter, the nozzle row 52 c refers to a configuration including 360 nozzles 52.

In this case, in the head R1 and the head R2, the nozzle rows 52c adjacent to each other when viewed from the main scanning direction (X-axis direction) are continuously arranged with one nozzle pitch in the sub-scanning direction (Y-axis direction) orthogonal to the main scanning direction. Thus, they are arranged in parallel in the main scanning direction. Therefore, the effective drawing width L ₁ of the heads R1 and R2 that discharge the same kind of liquid is twice the drawing width L ₀ . Similarly, the heads G1 and G2 and the heads B1 and B2 are arranged in parallel in the main scanning direction.

The number of nozzle rows 52c provided in the droplet discharge head 50 is not limited to two, but may be one. Further, the arrangement of the droplet discharge heads 50 in the head unit 9 is not limited to this.

Next, the control system of the droplet discharge device 10 will be described. FIG. 4 is a block diagram showing a control system of the droplet discharge device. As shown in FIG. 4, the control system of the droplet discharge device 10 includes a drive unit 46 having various drivers for driving the droplet discharge head 50, the workpiece moving mechanism 20, the head moving mechanism 30, the weight measuring mechanism 60, and the like. And a control unit 40 that comprehensively controls the droplet discharge device 10 including the drive unit 46.

The drive unit 46 drives and controls the moving driver 47 that drives and controls the linear motors of the workpiece moving mechanism 20 and the head moving mechanism 30, the head driver 48 that drives and controls the droplet discharge head 50, and the weight measuring mechanism 60. And a weight measurement driver 49.
In addition, a maintenance driver for driving and controlling the maintenance mechanism is provided, but the illustration is omitted.

The control unit 40 includes a CPU 41, a ROM 42, a RAM 43, and a P-CON 44, which are connected to each other via a bus 45. The host computer 11 is connected to the P-CON 44. The ROM 42 has a control program area for storing a control program to be processed by the CPU 41, and a control data area for storing control data for performing a drawing operation, a function recovery process, and the like.

The RAM 43 is a drawing data storage unit that stores drawing data for drawing on the mother substrate P, and position data that stores position data of the mother substrate P and the droplet discharge head 50 (actually, the nozzle arrays 52a and 52b). It has various storage units such as a storage unit and is used as various work areas for control processing. Various drivers and the like of the drive unit 46 are connected to the P-CON 44, and the logic circuit for supplementing the function of the CPU 41 and handling interface signals with peripheral circuits is configured and incorporated. For this reason, the P-CON 44 receives various commands from the host computer 11 as they are or processes them and loads them into the bus 45, and in conjunction with the CPU 41, the data and control signals output from the CPU 41 and the like to the bus 45 are directly received. Or it processes and outputs to the drive part 46. FIG.

Then, the CPU 41 inputs various detection signals, various commands, various data, etc. via the P-CON 44 according to the control program in the ROM 42, processes various data, etc. in the RAM 43, and then drives via the P-CON 44. The entire droplet discharge device 10 is controlled by outputting various control signals to the unit 46 and the like. For example, the CPU 41 controls the droplet discharge head 50, the workpiece moving mechanism 20, and the head moving mechanism 30 to place the head unit 9 and the mother substrate P so as to face each other. Then, in synchronization with the relative movement between the head unit 9 and the mother substrate P, the liquid material is discharged as droplets from the plurality of nozzles 52 of each droplet discharge head 50 mounted on the head unit 9 to the mother substrate P. A control signal is sent to the head driver 48. In this case, discharging the liquid material in synchronization with the movement of the mother substrate P in the X-axis direction is called main scanning, and moving the head unit 9 in the Y-axis direction is called sub-scanning. The droplet discharge device 10 of this embodiment can discharge and draw a liquid material by combining main scanning and sub-scanning and repeating a plurality of times. The main scanning is not limited to the movement of the mother substrate P in one direction with respect to the droplet discharge head 50, but can be performed by reciprocating the mother substrate P.

The encoder 12 is electrically connected to the head driver 48, and generates an encoder pulse with main scanning. In the main scanning, the moving table 22 is moved at a predetermined moving speed, so that encoder pulses are periodically generated.

For example, assuming that the moving speed of the moving table 22 in main scanning is 200 mm / sec and the driving frequency for driving the droplet discharge head 50 (in other words, the discharge timing when droplets are continuously discharged) is 20 kHz, the main scan is performed. The droplet discharge resolution in the direction is 10 μm because it is obtained by dividing the moving speed by the drive frequency. That is, it is possible to dispose droplets on the mother substrate P with a pitch of 10 μm. The actual droplet ejection timing is based on a latch signal generated by counting periodically generated encoder pulses.

The host computer 11 sends control information such as a control program and control data to the droplet discharge device 10. In addition, it has a function of an arrangement information generation unit that generates arrangement information as ejection control data for arranging a predetermined amount of liquid as droplets for each film formation region on the mother substrate P. The arrangement information includes the droplet discharge position in the film formation region (in other words, the relative position between the mother substrate P and the nozzle 52), the number of droplets disposed (in other words, the number of discharges for each nozzle 52), and a plurality of main scans. The information such as ON / OFF of the nozzle 52 and the discharge timing is represented as a bitmap, for example. The host computer 11 can not only generate the arrangement information but also modify the arrangement information once stored in the RAM 43.

<Liquid Material Discharge Method and Color Filter Manufacturing Method>
Next, a method for manufacturing a color filter to which the liquid material discharge method of the present embodiment is applied will be described with reference to FIGS. FIG. 5A is a schematic plan view showing a color filter.
b) is a cross-sectional view taken along the line AA 'in FIG. 6A, FIG. 6 is a flowchart showing a method for manufacturing a color filter, and FIGS. 7A to 7D are schematic views showing a method for manufacturing a color filter. It is sectional drawing.

As shown in FIGS. 5 (a) and 5 (b), the color filter 2 is a red (R), green (G), and blue (B) three color filter element on a transparent glass substrate 1 or the like. Layer 3 is provided. The rectangular film forming regions 3r, 3g, and 3b on which the colored layer 3 is formed are partitioned in a matrix by the partition walls 4. The color filter 2 of the present embodiment is a so-called stripe type color filter in which colored layers 3 of the same color are arranged linearly.

As shown in FIG. 5B, the partition 4 has a two-layer structure including a first partition 4a and a second partition 4b. The first partition 4a is made of, for example, a metal thin film such as Cr or Al and has a light shielding property. The 2nd partition part 4b consists of resin materials, for example. In addition, it is not limited to a two-layer structure, The single layer structure which comprises the partition part 4 with the resin material containing the member which has light-shielding property may be sufficient.

The colored layer 3 is made of a translucent resin material containing a coloring material. In the present embodiment, such a color filter 2 is manufactured using a droplet discharge method (inkjet method).

As shown in FIG. 6, in the manufacturing method of the color filter 2 of the present embodiment, the partition wall forming step (step S1) for forming the partition wall 4 and the surface of the substrate 1 on which the partition wall 4 is formed are surface-treated. Surface treatment step (step S2), liquid discharge step (step S3) for discharging the liquid containing the colored layer forming material, and drying step (step S3) for drying the discharged liquid to form the colored layer 3
Step S4) is basically provided.

In step S <b> 1 of FIG. 6, first, a metal thin film such as Cr or Al is formed on the surface of the substrate 1. Examples of the film forming method include a vacuum deposition method and a sputtering method. The film thickness is, for example, about 0.1 μm so as to obtain a light shielding property. This is patterned by a photolithography method to form a first partition 4a having an opening.
Next, a photosensitive resin is applied to a thickness of about 2 μm so as to cover the first partition wall portion 4a, and patterned by the same photolithography method to form the second partition wall portion 4b on the first partition wall portion 4a.
As a result, as shown in FIG. 7A, rectangular film formation regions 3r, 3g,
3b is formed. Then, the process proceeds to step S2.

In step S2 of FIG. 6, the surface of the substrate 1 is subjected to a lyophilic process so that the discharged liquid material lands on the film forming regions 3r, 3g, and 3b and spreads in the subsequent liquid material discharging process. Even if a part of the discharged liquid material lands on the second partition wall 4b, the film formation regions 3r, 3g,
At least the top of the second partition wall 4b is subjected to a liquid repellent treatment so as to be within 3b.

As the surface treatment method, a plasma treatment using O ₂ as a treatment gas and a plasma treatment using a fluorine-based gas as a treatment gas are performed on the substrate 1 on which the partition walls 4 are formed. That is, the film formation regions 3r, 3g, and 3b are subjected to lyophilic treatment, and then the surface (including the wall surface) of the second partition wall portion 4b made of a photosensitive resin is subjected to lyophobic treatment. In addition, if the material itself which forms the 2nd partition part 4b has liquid repellency, the latter process can also be skipped. Then, the process proceeds to step S3.

In step S <b> 3 of FIG. 6, the surface-treated substrate 1 is placed on the stage 5 of the droplet discharge device 10. Three color liquids containing different colored layer forming materials are respectively discharged. Therefore, the configuration of the head unit 9 shown in FIG. 3 is adopted.
Then, as shown in FIGS. 7B and 7C, in synchronization with the relative movement of the substrate 1 and the droplet discharge head 50 in the main scanning direction, three colors from the nozzle 52 of the droplet discharge head 50 are obtained. Each of the liquid materials is discharged as droplets D to the desired film formation regions 3r, 3g, 3b. Film formation region 3r,
The application amount of the liquid material discharged to 3g, 3b is a discharge in which the selection pattern of the nozzle 52 selected for each of the film formation regions 3r, 3g, 3b, the number of droplets D, etc. are set for each main scan. Based on the data, an appropriate control signal is sent from the CPU 41 of the control unit 40 to the head driver 48 to be controlled. As a result, a substantially constant amount of liquid is applied to each of the film forming regions 3r, 3g, 3b. Then, the process proceeds to step S4.

In step S4 of FIG. 6, as shown in FIG. 7D, the solvent component is evaporated from the liquid material discharged onto the substrate 1 to form the colored layer 3 made of the colored layer forming material. In the present embodiment, the substrate 1 is set in a reduced pressure drying apparatus capable of drying with a constant vapor pressure of the solvent and dried under reduced pressure to form the colored layers 3 of three colors R, G, B. The process of discharging and drying one color liquid may be repeated three times.

In the previous liquid discharge step (step S3), the thickness of the colored layer 3 may be set for each color, and the three colors are not necessarily the same. A predetermined amount of liquid material may be discharged to the corresponding film forming regions 3r, 3g, 3b based on the required film thickness setting.

When unevenness occurs on the surface of the substrate 1 on which the colored layer 3 is formed, a transparent planarizing layer made of, for example, an acrylic resin material may be formed so as to cover the partition wall 4 and each colored layer 3.

The size of the substrate 1 on which the color filter 2 is formed depends on the size of a display device using the substrate. Further, even if the display devices have the same size, when the pixels are arranged at high density, the arrangement of the colored layers 3 of the corresponding color filter 2 is also required to be arranged at high density.

As a method for producing the color filter 2 more efficiently, generally, a method of taking a multi-surface pattern on a mother substrate P having a larger area than the substrate 1 is employed. However, the size of the color filter 2 that is efficient in terms of area is determined by the size of the mother substrate P. If the color filter 2 having an area inefficient size is taken multiple times, an empty space is generated. Therefore, there is a method in which the mother substrate P is used without waste in terms of area by imposing the color filters 2 of different sizes in the empty space.
When imposing color filters 2 of different sizes on the mother substrate P, the film formation region 3r
, 3g, 3b, that is, the stripe direction may be orthogonal to each other.
As described above, the arrangement of the droplets in the film formation regions 3r, 3g, and 3b is realized by counting the encoder pulse of the encoder 12 in the main scanning to define the ejection timing and ejecting the droplet based on this. Is done.
The interval between the plurality of nozzles 52 viewed from the main scanning direction is 70.5 μm as described above.
Therefore, when the arrangement direction of the rectangular film formation regions 3r, 3g, 3b on the mother substrate P is different, the number of nozzles 52 applied to the film formation regions 3r, 3g, 3b differs depending on the arrangement direction. Therefore, there is a problem that a method of generating arrangement information in main scanning becomes complicated.

Therefore, the manufacturing method of the color filter 2 using the droplet discharge device 10 and the liquid discharge method of the present embodiment is based on the arrangement of the film formation regions 3r, 3g, 3b on the mother substrate P. The discharge method is provided. Details will be described with reference to an embodiment.

(Example)
8-11 is schematic which shows the manufacturing method of the color filter of an Example. For more information,
FIG. 8 is a schematic plan view showing the relative arrangement of the head unit and the mother substrate in the first discharge process, and FIGS. 9A and 9B are schematic plan views showing the arrangement of droplets in the first discharge process.
FIG. 10 is a schematic plan view showing the relative arrangement of the head unit and the mother substrate in the second ejection step, and FIGS. 11A and 11B are schematic plan views showing the arrangement of droplets in the second ejection step. is there.

As shown in FIG. 8, the mother substrate P in the present embodiment includes a plurality of (seven) impositioned first application regions E1 along the long side and a plurality of matrix substrates along the long side and the short side. (Four) impositioned second application region E2. The area of the first application region E1 is the second application region E2.
Is smaller than the area.

In the first application region E1, rectangular film formation regions 3r, 3g, 3b as first film formation regions
Are arranged in a matrix. Similarly, in the second coating region E2, a plurality of rectangular film forming regions 3r ′, 3g ′, 3b ′ as second film forming regions are arranged in a matrix.
The areas of the film formation regions 3r, 3g, 3b are smaller than the areas of the film formation regions 3r ′, 3g ′, 3b ′.
The film forming regions 3r, 3g, 3b and the film forming regions 3r ′, 3g ′, 3b ′ are orthogonal to each other in the stripe direction in which the same kind (same color) of liquid is ejected.
Further, a predetermined amount of a desired liquid material is applied to each to form the colored layer 3. Therefore, hereinafter, the first application region E1 may be referred to as a color filter E1, and the second application region E2 may be referred to as a color filter E2.

The discharge process (step S3) for discharging three kinds (three colors) of liquid materials as droplets onto the mother substrate P includes a first discharge process and a second discharge process.

In the first ejection step, the mother substrate P is formed on the head unit 9 (shown as head units U1 to U8 in FIG. 8) arranged in a plurality (eight) in the sub-scanning direction (Y-axis direction) in the head moving mechanism 30. The mother substrate P is positioned so that the long sides are substantially parallel.
Then, while moving the stage 5 in the main scanning direction (X-axis direction), the liquid material is discharged from the droplet discharge head 50 mounted on the head unit 9 toward the mother substrate P.

In this case, the stripe direction of the film forming regions 3r, 3g, 3b matches the sub-scanning direction (Y-axis direction). The stripe direction of the film forming regions 3r ′, 3g ′, 3b ′ is in agreement with the main scanning direction (X-axis direction).

As shown in FIG. 9A, nozzle rows 52a and 52b (nozzle row 52c) including a plurality of nozzles 52 are arranged along the longitudinal direction of the rectangular film forming regions 3r, 3g, and 3b. For example, in the main scanning, the film formation area 3r liquid material of red is ejected, three nozzles 52 takes to discharge droplets D ₁ from each. Droplets D ₁ can be landed in a substantially central portion in the main scanning direction of the film formation area 3r by controlling the discharge timing. As a result, three droplets D ₁ are applied to each film formation region 3r. The landed droplets D ₁ spread out in the film formation region 3r, but the landing position in the sub-scanning direction (Y-axis direction) depends on the arrangement pitch and nozzle pitch in the sub-scanning direction of the film formation region 3r (as described above). In the present embodiment, the film formation region 3r is not necessarily the same because of the relationship of approximately 70.5 μm). The other film formation region 3g of the first coating region E1, the desired liquid bodies similarly in 3b discharges by three drops as droplets D _1.

As shown in FIG. 9B, in the main scanning, for example, two nozzles 52 are applied to the film forming region 3r ′ having a large area and orthogonal to the film forming region 3r. Then, a plurality (eight drops) of droplets D ₁ are discharged from each nozzle 52 in the main scanning direction. As a result, 16 droplets D ₁ are applied to each film forming region 3r ′.
By controlling the discharge timing, it is possible to land the droplet D ₁ near the center of the film forming region 3r ′ in the main scanning direction. On the other hand, the landing position in the sub-scanning direction (Y-axis direction) is not necessarily the same even though two nozzles 52 are applied to each film-forming region 3r ′ due to the relationship between the arrangement pitch of the film-forming region 3r ′ in the sub-scanning direction and the nozzle pitch. Not necessarily.
The other film formation region 3g of the second application area E2 ', 3b' of the desired liquid bodies also in discharging by 16 drops as droplets D _1.

As described above, in the first discharge step, the head unit 9 and the mother substrate are arranged such that more nozzles 52 are applied to the film formation regions 3r, 3g, 3b having a smaller area with respect to the film formation regions 3r ′, 3g ′, 3b ′. Position P and perform at least one main scan. As a result, the droplet D ₁ is discharged to the film forming regions 3r, 3g, 3b and the film forming regions 3r ′, 3g ′, 3b ′.

Next, as shown in FIG. 10, in the second discharge step, the rotation mechanism 6 of the droplet discharge device 10 (FIG. 1).
And the mother board P is rotated 90 degrees about the rotation center P ₀ and positioned.
Thereby, the stripe direction of the film forming regions 3r, 3g, 3b is the main scanning direction (X-axis direction).
The stripe directions of the film formation regions 3r ′, 3g ′, 3b ′ are in the sub-scanning direction (Y-axis direction).
Will match.

As shown in FIG. 11A, in the main scanning, eight nozzles 52 are applied to the film forming region 3r ′ which has a large area with respect to the film forming region 3r and whose arrangement direction is orthogonal. Then, two droplets D ₂ are discharged from each nozzle 52. By controlling the ejection timing, it is possible to land the droplet D ₂ near the center of the film forming region 3r ′ in the main scanning direction (X-axis direction).
As a result, a total of 32 droplets are applied to the film formation region 3r ′. Landing positions of the droplets D ₂ in the sub-scanning direction (Y axis direction) is not identical for each necessarily film formation area 3r '.
The other film formation region 3g of the second application area E2 ', 3b' of the desired liquid bodies also in discharging by 16 drops as droplets D _2.

As shown in FIG. 11B, in the main scanning, one nozzle 52 is applied to the film forming region 3r whose area is small and the arrangement direction is orthogonal to the film forming region 3r ′. Then, three droplets D ₂ are ejected from the nozzle 52. In this case, the droplet D ₁ ejected in the first ejecting step are landed in a substantially central portion in the sub-scanning direction (Y axis direction) of the film forming region 3r. On the other hand, the droplet D ₂ ejected in the second ejection step is not necessarily in the sub-scanning direction (Y of the film forming region 3r) due to the relationship between the arrangement pitch in the sub-scanning direction (Y-axis direction) of the film forming region 3r and the nozzle pitch. It does not always land on the substantially central part in the axial direction). However, by controlling the discharge timing, it is possible to land the droplet D ₂ at a position where it could not be landed in the first discharge process.

For example, in FIG. 11 (b), the in side of the membrane forming region 3r near the nozzle rows 52c, with respect to the droplet D ₁ landed earlier, one shot th discharge position of the droplet D ₂ of the main scanning is left The discharge timing is set so that In the far side of the membrane forming region 3r from the nozzle row 52c, with respect to the droplet D ₁ landed earlier, 3 shot th discharge position of the droplet D ₂ of the main scan is set ejection timing such that the right .
Thereby, six droplets can be landed almost uniformly for each film formation region 3r.

According to the liquid material ejection method of the above-described embodiment, 1/2 of a predetermined amount (amount of 32 droplets) in the film formation regions 3r ′, 3g ′, 3b ′ having a large area in advance in the first ejection step. since the liquid material to be ejected as droplets D _1, the liquid material remaining 1/2 may be discharged as droplets D ₂ in the second discharge step. Therefore, the number of times of main scanning can be reduced as compared with the case where the liquid material is completely applied to the first application region E1 and the second application region E2.

Further, in the film forming regions 3r, 3g, 3b and the film forming regions 3r ′, 3g ′, 3b ′, a predetermined amount of the liquid material to be discharged is divided into the first discharge step and the second discharge step. Discharge. In the second discharge process, since the liquid material is discharged after the mother substrate P is turned 90 degrees, the combination of the nozzles 52 applied in the main scanning is different from the first discharge process. Therefore, even if the discharge amount of the liquid droplets varies between the nozzles 52, the liquid droplets are discharged to the same type and the same film forming region by a combination of different nozzles 52. The body can be applied stably.
Further, since the mother substrate P is rotated 90 degrees with respect to the plurality of head units 9 arranged in the sub-scanning direction (Y-axis direction), the plurality of head units 9 are positioned with respect to the fixed mother substrate P. Compared to the case, the apparatus configuration is simplified, and positioning with respect to the droplet discharge head 50 can be easily performed with high accuracy.

In the liquid discharge method of the present embodiment, in the second discharge step, the nozzles 52 arranged in the sub-scanning direction are arranged, although the longitudinal directions of the film forming regions 3r, 3g, 3b having small areas coincide with the main scanning direction. In relation to the nozzle pitch, each film forming region 3r for discharging the same kind of liquid material
There may be a case where one nozzle 52 is not necessarily applied. At that time, a required amount (in this case, the amount of 6 droplets) of the liquid material is dropped into the droplet D in the first discharge step in which the nozzle 52 is surely applied.
1 and the head unit 9 is sub-scanned in the second discharge step to discharge droplets D.
There is a method of discharging a liquid material that is insufficient with respect to a predetermined amount as droplets D2 to all the film formation regions 3r by repeating main scanning for discharging 2.

Further, the predetermined amount of the liquid material applied to each film forming region 3r, 3g, 3b, 3r ′, 3g ′, 3b ′ is the amount of each film forming region 3r, 3g, 3b, 3r ′, 3g ′, 3b ′. It is not necessarily the same depending on the area and the intended film thickness of the functional film to be formed (in this case, the colored layer 3).
Therefore, in the first discharge process, if at least one droplet is discharged to the film formation regions 3r ′, 3g ′, 3b ′ having a large area, the film formation regions 3r ′, 3g ′, 3b ′ in the second discharge step.
It is possible to reduce the number of main scans.

Furthermore, as shown in FIGS. 9A and 11B, when focusing on the film formation regions 3r, 3g, and 3b of the first application region E1 having a small area, three nozzles are used in the first discharge step. 52
Is used for main scanning, and in the second ejection step, main scanning is performed using one nozzle 52. If the second discharge process is performed first, depending on the discharge resolution of the droplet discharge device 10, a predetermined amount of liquid material is discharged as droplets onto the film formation regions 3r, 3g, 3b. The number of times may increase. On the other hand, if the liquid discharge method of the present embodiment is used, a plurality of nozzles 52 are provided.
Can be efficiently used to discharge droplets to the film formation regions 3r, 3g, 3b and the film formation regions 3r ′, 3g ′, 3b ′. That is, three types of liquid materials can be applied more efficiently.

According to the manufacturing method of the color filter 2 to which the liquid material discharge method of the present embodiment is applied, a substantially predetermined amount of liquid material is not wasted in each of the film forming regions 3r, 3g, 3b, 3r ′, 3g ′, 3b ′. Since it is applied stably, the colored layer 3 having a substantially constant film thickness can be formed.
In addition, three types of liquid materials are efficiently discharged onto the mother substrate P, and the color filter E1 and the color filter E2 can be manufactured with high productivity.

(Embodiment 2)
Next, an organic EL (Electro-Luminessence) to which the liquid material discharge method of Embodiment 1 is applied.
) A method for manufacturing the apparatus will be described with reference to FIGS. Figure 12 shows organic EL
FIG. 13A to FIG. 13F are schematic cross-sectional views showing a method for manufacturing an organic EL device.

<Organic EL device>
As shown in FIG. 12, the organic EL device 600 of this embodiment includes an element substrate 601 having a light emitting element portion 603 as an organic EL element, and a sealing substrate 620 sealed with a space 622 from the element substrate 601. And. The element substrate 601 includes a circuit element portion 602 on the element substrate 601, and the light emitting element portion 603 is formed so as to overlap with the circuit element portion 602.
It is driven by the circuit element unit 602. In the light-emitting element portion 603, three-color light-emitting layers 617R, 617G, and 617B made of an organic light-emitting material are formed in the light-emitting layer forming region A as a film forming region, and have a stripe shape. The element substrate 601 includes three color light emitting layers 6.
The three light emitting layer forming regions A corresponding to 17R, 617G, and 617B are set as a set of picture elements, and the picture elements are arranged in a matrix on the circuit element portion 602 of the element substrate 601. That is, the organic EL device 600 emits light from the light emitting element portion 603 to the element substrate 601 side.

The sealing substrate 620 is made of glass or metal, and the element substrate 60 is interposed through a sealing resin.
The getter agent 621 is attached to the sealed inner surface. The getter agent 621 absorbs water or oxygen that has entered the space 622 between the element substrate 601 and the sealing substrate 620 and prevents the light emitting element portion 603 from being deteriorated by the water or oxygen that has entered. The getter agent 621 may be omitted.

The element substrate 601 has a plurality of light emitting layer forming regions A on the circuit element unit 602, and is formed in the banks 618 partitioning the plurality of light emitting layer forming regions A and the plurality of light emitting layer forming regions A. An electrode 613 and a hole injection / transport layer 617a stacked on the electrode 613 are provided. In addition, a light emitting element portion 603 having light emitting layers 617R, 617G, and 617B formed by applying three kinds of liquid materials including a light emitting layer forming material in a plurality of light emitting layer forming regions A is provided. The bank 618 is formed using an insulating material, and the electrode 61 is arranged so that the light emitting layers 617R, 617G, and 617B stacked on the hole injection / transport layer 617a and the electrode 613 are not electrically short-circuited.
3 is covered.

The element substrate 601 is made of a transparent substrate such as glass, for example. A base protective film 606 made of a silicon oxide film is formed on the element substrate 601, and an island-like semiconductor film made of polycrystalline silicon is formed on the base protective film 606. 607 is formed. Note that a source region 607a and a drain region 607b are formed in the semiconductor film 607 by high concentration P ion implantation. A portion where P ions are not introduced is a channel region 607c. Further, a transparent gate insulating film 608 covering the base protective film 606 and the semiconductor film 607 is formed, and a gate electrode 609 made of Al, Mo, Ta, Ti, W, or the like is formed on the gate insulating film 608.
The transparent first interlayer insulating film 6 is formed on the gate electrode 609 and the gate insulating film 608.
11a and a second interlayer insulating film 611b are formed. The gate electrode 609 is a semiconductor film 607
Is provided at a position corresponding to the channel region 607c. The first interlayer insulating film 611
Contact holes 612a and 612b are formed through the a and the second interlayer insulating film 611b and connected to the source region 607a and the drain region 607b of the semiconductor film 607, respectively. A transparent electrode 613 made of ITO (Indium Tin Oxide) or the like is patterned and arranged in a predetermined shape on the second interlayer insulating film 611b, and one contact hole 612a is connected to the electrode 613. The other contact hole 612 b is connected to the power supply line 614. In this manner, the driving thin film transistor 615 connected to each electrode 613 is formed in the circuit element portion 602. Note that a storage capacitor and a switching thin film transistor are also formed in the circuit element portion 602.
In FIG. 12, these are not shown.

The light-emitting element portion 603 includes an electrode 613 as an anode, a hole injection / transport layer 617a sequentially stacked on the electrode 613, and light-emitting layers 617R, 617G, and 617B (collectively, a light-emitting layer Lu).
And a cathode 604 laminated so as to cover the bank 618 and the light emitting layer Lu. The hole injection / transport layer 617a and the light emitting layer Lu constitute a functional layer 617 in which light emission is excited. Note that if the cathode 604, the sealing substrate 620, and the getter agent 621 are formed of a transparent material, light emitted from the sealing substrate 620 side can be emitted.

The organic EL device 600 has a scanning line (not shown) connected to the gate electrode 609 and a signal line (not shown) connected to the source region 607a, and a switching thin film transistor by a scanning signal transmitted to the scanning line. When (not shown) is turned on, the potential of the signal line at that time is held in the storage capacitor, and the driving thin film transistor 615 is changed according to the state of the storage capacitor.
ON / OFF state is determined. Then, the channel region 6 of the driving thin film transistor 615 is obtained.
Current flows from the power supply line 614 to the electrode 613 via 07c, and the hole injection / transport layer 6
A current flows to the cathode 604 through 17a and the light emitting layer Lu. The light emitting layer Lu emits light according to the amount of current flowing through it. The organic EL device 600 can display desired characters, images, and the like by such a light emission mechanism of the light emitting element portion 603. In addition, the organic EL device 6
00, because the light emitting layer Lu is formed by using the liquid discharge method of the first embodiment,
A predetermined amount of liquid is stably applied to each light emitting layer forming region A, and has high display quality with few display defects such as light emission unevenness and luminance unevenness.

<Method for manufacturing organic EL device>
Next, a method for manufacturing the organic EL device 600 of this embodiment will be described with reference to FIG.
In FIGS. 13A to 13F, the circuit element section 60 formed on the element substrate 601 is used.
2, the illustration is omitted.

In the method of manufacturing the organic EL device 600 according to the present embodiment, the step of forming the electrodes 613 at positions corresponding to the plurality of light emitting layer forming regions A of the element substrate 601 and the bank 618 are formed so as to partially cover the electrodes 613. And a bank forming process. In addition, the surface treatment of the light emitting layer formation region A partitioned by the bank 618, and the hole injection /
A step of applying and drawing a hole injection / transport layer 617a by applying a liquid containing a transport layer forming material; and a step of forming a hole injection / transport layer 617a by drying the discharged liquid. ing. Further, a discharge step of discharging three types of liquid materials including the light emitting layer forming material in the light emitting layer forming region A,
A film forming step of forming the light emitting layer Lu by drying the three kinds of discharged liquid materials. Furthermore, the step of forming the cathode 604 so as to cover the bank 618 and the light emitting layer Lu, and the light emitting element portion 6
And a sealing step of bonding the element substrate 601 on which 03 is formed and the sealing substrate 620 to each other. The application of each liquid material to the light emitting layer forming region A is performed using the liquid material discharge method of the first embodiment. Therefore, the arrangement of the droplet discharge heads 50 in the head unit 9 shown in FIG. 3 is applied.

In the electrode (anode) forming step, an electrode 613 is formed at a position corresponding to the light emitting layer forming region A of the element substrate 601 as shown in FIG. As a formation method, for example, the element substrate 6
A transparent electrode film is formed on the surface of 01 by sputtering or vapor deposition in vacuum using a transparent electrode material such as ITO. Thereafter, a method of forming the electrode 613 by etching while leaving only a necessary portion by a photolithography method can be given. Then, the process proceeds to the bank formation process.

In the bank formation step, as shown in FIG. 13B, first, a lower layer bank 618a is formed so as to cover a part of the plurality of electrodes 613 of the element substrate 601. As the material of the lower layer bank 618a, insulating SiO ₂ (silicon oxide) which is an inorganic material is used. Lower layer bank 618
As a method of forming a, for example, the surface of each electrode 613 is masked using a resist or the like corresponding to a light emitting layer Lu to be formed later. Then, there is a method of forming the lower layer bank 618a by putting the masked element substrate 601 into a vacuum apparatus and performing sputtering or vacuum deposition using SiO ₂ as a target or a raw material. Masking such as resist is peeled off later. Since the lower layer bank 618a is formed of SiO ₂ , it has sufficient transparency if its film thickness is 200 nm or less, and the hole injection / transport layer 617a and the light emitting layer Lu are laminated later. However, it does not inhibit luminescence.

Subsequently, the upper layer bank 618b is formed on the lower layer bank 618a so as to substantially partition each light emitting layer forming region A. The material of the upper layer bank 618b is desirably one having durability against the solvent of the three types of liquids 100R, 100G, and 100B including the light emitting layer forming material described later, and further, a fluorine-based gas is used as the processing gas. It is preferable to use an organic material such as an acrylic resin, an epoxy resin, or a photosensitive polyimide. As a method for forming the upper layer bank 618b, for example, the lower layer bank 618b is used.
The photosensitive organic material is applied to the surface of the element substrate 601 on which a is formed by a roll coating method or a spin coating method and dried to form a photosensitive resin layer having a thickness of about 2 μm. And
There is a method of forming the upper layer bank 618b by exposing and developing a mask having an opening corresponding to the size of the light emitting layer forming region A and facing the element substrate 601 at a predetermined position. Accordingly, the bank 618 having the lower layer bank 618a and the upper layer bank 618b.
Is formed. And it progresses to a surface treatment process.

In the step of surface-treating the light emitting layer forming region A, the element substrate 601 on which the bank 618 is formed.
First, the surface of the substrate is plasma-treated using O ₂ gas as a processing gas. As a result, the surface of the electrode 613 and the surface of the bank 618 (including the wall surface) are activated to perform lyophilic treatment. Next, plasma processing is performed using a fluorine-based gas such as CF ₄ as a processing gas. As a result, the fluorine-based gas reacts only on the surface of the upper layer bank 618b made of a photosensitive resin, which is an organic material, and the liquid repellent treatment is performed. Then, the process proceeds to the hole injection / transport layer forming step.

In the hole injection / transport layer formation step, as shown in FIG. 13C, a liquid 90 containing a hole injection / transport layer formation material is applied to the light emitting layer formation region A. As a method of applying the liquid 90, the liquid discharge method of the first embodiment is used. The liquid 90 discharged from the droplet discharge head 50 lands on the electrode 613 of the element substrate 601 as a droplet and spreads wet. A predetermined amount of the liquid 90 is ejected as droplets according to the area of the light emitting layer forming region A. Then, the process proceeds to the drying / film formation process.

In the drying / film formation process, the element substrate 601 is heated by a method such as lamp annealing to dry and remove the solvent component of the liquid 90 and inject holes into a region partitioned by the bank 618 of the electrode 613. / Transport layer 617a is formed. In this embodiment, hole injection /
3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) was used as the transport layer forming material. In this embodiment, the hole injection / transport layer 617a made of the same material is formed in each light emitting layer forming region A. However, the material of the hole injection / transport layer 617a corresponding to the light emitting layer Lu formed later. May be changed for each light emitting layer forming region A. Then, the process proceeds to the next liquid discharge process.

In the liquid discharge process, as shown in FIG. 13D, three types of light emitting layer forming materials containing a light emitting layer forming material A from a plurality of liquid droplet discharging heads 50 to a plurality of light emitting layer forming regions A are used. Liquid 1
00R, 100G, and 100B are assigned. The liquid body 100R includes a material for forming the light emitting layer 617R (red), the liquid body 100G includes a material for forming the light emitting layer 617G (green), and the liquid body 100B includes a material for forming the light emitting layer 617B (blue). It is out.

As each light emitting layer forming material, a known light emitting material capable of emitting fluorescence or phosphorescence is used.
Specifically, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP)
Polysilanes such as polyvinylcarbazole (PVK), polythiophene derivatives, and polymethylphenylsilane (PMPS) are preferably used. In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.

Each of the landed liquids 100R, 100G, and 100B wets and spreads in the light emitting layer forming region A and the cross-sectional shape rises in an arc shape. As a method for applying these liquids 100R, 100G, and 100B, the liquid discharge method of the first embodiment was used. Then, the process proceeds to the drying / film formation process.

In the drying / film-forming process, as shown in FIG.
The solvent components 0G and 100B are removed by drying, and the light emitting layers 617R, 617G, and 617B are stacked on the hole injection / transport layer 617a in each light emitting layer forming region A. As a drying method of the element substrate 601 on which each of the liquid materials 100R, 100G, and 100B is discharged, it is preferable to dry under reduced pressure so that the evaporation rate of the solvent can be made substantially constant. And it progresses to a cathode formation process.

In the cathode forming step, as shown in FIG. 13F, each light emitting layer 617R,
A cathode 604 is formed so as to cover 617G and 617B and the surface of the bank 618. Cathode 6
As the material of 04, it is preferable to use a combination of metals such as Ca, Ba and Al and fluorides such as LiF. In particular, it is preferable to form a film of Ca, Ba, or LiF having a small work function on the side close to the light emitting layers 617R, 617G, and 617B and a film of Al or the like having a large work function on the far side. Further, a protective layer such as SiO ₂ or SiN may be laminated on the cathode 604. In this way, oxidation of the cathode 604 can be prevented. Examples of the method for forming the cathode 604 include vapor deposition, sputtering, and CVD. In particular, the light emitting layer 617R,
The vapor deposition method is preferable in that damage due to heat of 617G and 617B can be prevented.

The element substrate 601 thus completed has a predetermined amount of each liquid material 100R, 100G.
, 100B are applied as droplets to the light-emitting layer forming region A with quantitative variations suppressed, and the respective light emission in which the film thickness after drying and film formation is substantially constant in each light-emitting layer forming region A Layers 617R, 617G, and 617B (collectively, light-emitting layer Lu) are included. And it progresses to a sealing process.

In the sealing step, the element substrate 601 on which the light emitting element portion 603 is formed and the sealing substrate 620 are opposed to each other, and a space 622 is placed and bonded using an adhesive (see FIG. 12). As the adhesive, it is preferable to use, for example, an epoxy resin adhesive which is durable and thermosetting. Thereby, the light emitting element portion 603 is sealed.

According to the manufacturing method of the organic EL device 600 of the second embodiment, the liquid bodies 100R and 100G.
, 100B, droplets are ejected using the liquid material ejection method of the first embodiment. Accordingly, a predetermined amount of each of the liquid materials 100R, 100G, 1 in each light emitting layer forming region A.
00B is applied stably. Accordingly, each light emitting layer Lu in which the film thickness after drying and film formation is substantially constant in each light emitting layer forming region A is obtained.
Since the film thickness of each light emitting layer Lu is substantially constant, the resistance for each light emitting layer Lu is substantially constant. Therefore, when the circuit element unit 602 applies a driving voltage to the light emitting element unit 603 to emit light, unevenness in light emission and luminance due to uneven resistance in each light emitting layer Lu are reduced. That is,
The organic EL device 600 with less light emission unevenness and brightness unevenness can be manufactured with high yield.

  Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1) In the color filter 2 of the first embodiment, the arrangement and shape of the colored layers 3 of R, G, B, and three colors are not limited to this. FIGS. 14A to 14D are schematic plan views showing the arrangement and shape of the colored layer according to the modification. For example, as shown in FIG. 14A, a mosaic method in which colored layers 3 of the same color are arranged in an oblique direction, or as shown in FIG. 14B, colored layers 3 of each color are arranged at the positions of the vertices of a triangle. The manufacturing method of the color filter 2 of the first embodiment can also be applied to the delta color filter.
Furthermore, the shape of the colored layer 3, that is, the film formation regions 3r, 3g, 3b is not limited to a rectangle,
The manufacturing method of the color filter 2 of the first embodiment can also be applied to a parallelogram as shown in FIG. 14C and a “shape” as shown in FIG.

(Modification 2) The configuration of the color filter 2 to which the method for manufacturing the color filter 2 of the first embodiment is applied is not limited to the one having the three colored layers 3. For example, a multi-color configuration in which other colors are added to R, G, B, and three colors can be applied.

(Modification 3) In the organic EL device 600 of the second embodiment, the configuration of the light emitting element portion 603 as an organic EL element is not limited to this. For example, the functional layer 617 capable of obtaining white light emission is formed in the light emitting layer formation region A. By disposing the color filter 2 on the sealing substrate 620 side, a top emission type organic EL device 600 capable of full color display and having high color reproducibility can be provided.

The schematic perspective view which shows the structure of a droplet discharge apparatus. (A) is a perspective view which shows a droplet discharge head, (b) is a top view which shows the arrangement | positioning state of a nozzle. FIG. 3 is a schematic plan view showing the arrangement of droplet discharge heads in the head unit. The block diagram which shows the control system of a droplet discharge apparatus. (A) is a schematic plan view which shows the structure of a color filter, (b) is sectional drawing cut | disconnected by the AA 'line of (a). The flowchart which shows the manufacturing method of a color filter. The schematic sectional drawing which shows the manufacturing method of a color filter. FIG. 3 is a schematic plan view showing a relative arrangement of a head unit and a mother substrate in a first discharge process. (A) And (b) is a schematic plan view which shows arrangement | positioning of the droplet in a 1st discharge process. The schematic plan view which shows the relative arrangement | positioning of the head unit and mother board | substrate in a 2nd discharge process. (A) And (b) is a schematic plan view which shows arrangement | positioning of the droplet in a 2nd discharge process. FIG. 2 is a schematic cross-sectional view showing the main structure of the organic EL device. (A)-(f) is a schematic sectional drawing which shows the manufacturing method of an organic electroluminescent apparatus. (A)-(d) is a schematic plan view which shows arrangement | positioning and shape of the colored layer of a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Color filter, 3 ... Colored layer, 3r, 3g, 3b ... Film formation area as 1st film formation area, 3r ', 3g', 3b '... Film formation area as 2nd film formation area 52 ... Nozzle, 100R, 100G, 100B ... Liquid body containing light emitting layer forming material, 601 ... Element substrate as substrate, 603 ... Light emitting element portion as organic EL element, 617 ... Functional layer, 617R,
617G, 617B ... light emitting layer, A ... light emitting layer forming region as a film forming region, E1 ... first coating region, E2 ... second coating region, P ... mother substrate as a substrate.

Claims (8)

By relatively scanning a plurality of nozzles with respect to a substrate in which a plurality of film formation regions are arranged in a first direction and a second direction orthogonal to the first direction, at least one is provided during the scanning. A liquid material discharge method for discharging a liquid material as droplets from the two nozzles to the film forming region,
The film formation region includes a first film formation region and a second film formation region whose arrangement directions are orthogonal to each other,
The substrate has a first application region in which a plurality of the first film formation regions are arranged, and a second application region in which a plurality of the second film formation regions are arranged,
A plurality of the plurality of nozzles are arranged relative to each other so that the number of the nozzles applied to the first film formation region is larger than that of the second film formation region, and a plurality of droplets are discharged to the first film formation region. A first ejection step of performing at least one scan and ejecting at least one droplet of the droplet onto the second film formation region;
The plurality of nozzles are relatively arranged so that the number of nozzles applied to the second film formation region is larger than that of the first film formation region, and at least the second film formation region is insufficient with respect to a predetermined amount. And a second discharge step of discharging the liquid material as the droplet. The area of the first film formation region is smaller than the area of the second film formation region, and the area of the first application region is smaller than the area of the second application region. Liquid material discharge method. 2. The second discharge step is characterized in that the substrate is rotated 90 degrees in a plane and relatively arranged relative to the relative arrangement of the substrate and the plurality of nozzles in the first discharge step. Or the discharge method of the liquid body of 2. Allocating the predetermined amount of the liquid material to be discharged to the first film forming region and the second film forming region to the first discharge step and the second discharge step, respectively, to discharge the droplets. The method for discharging a liquid material according to claim 1, wherein the liquid material is discharged. In the first discharge step, the number of scans required to apply the predetermined amount of the liquid material as the droplets to the second film formation region in the second discharge step is m (m is a natural number of 2 or more). 5. The method of discharging a liquid material according to claim 4, wherein when the number of times is set, the liquid material of at least 1 / m of the predetermined amount is discharged as the droplets to the second film forming region. In the second ejection step, when the droplets are ejected in the first ejection step, the droplets cannot be disposed in the first film formation region in the scanning with the plurality of nozzles and the substrate. The method for discharging a liquid material according to claim 4, wherein at least one droplet of the droplet is discharged. A method for producing a color filter having a plurality of colored layers in a plurality of film forming regions on a substrate,
The plurality of film formation regions include a first film formation region and a second film formation region whose arrangement directions are orthogonal to each other,
The substrate has a first application region in which a plurality of the first film formation regions are arranged, and a second application region in which a plurality of the second film formation regions are arranged,
A discharge step of discharging a plurality of color liquid materials including a colored layer forming material to the plurality of film forming regions using the liquid material discharge method according to any one of claims 1 to 6.
And a film forming step of solidifying the discharged liquid material to form the colored layers of the plurality of colors. A method for manufacturing an organic EL device comprising a plurality of organic EL elements each having a functional layer including a light emitting layer in a plurality of film formation regions on a substrate,
The plurality of film formation regions include a first film formation region and a second film formation region whose arrangement directions are orthogonal to each other,
The substrate has a first application region in which a plurality of the first film formation regions are arranged, and a second application region in which a plurality of the second film formation regions are arranged,
A discharge step of discharging a liquid containing a light emitting layer forming material to the plurality of film forming regions using the liquid discharge method according to any one of claims 1 to 6.
And a film forming step of solidifying the discharged liquid material to form the light emitting layer. A method for manufacturing an organic EL device, comprising:

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