JP2009246151A - Method of manufacturing imaging device package and imaging device package - Google Patents

Method of manufacturing imaging device package and imaging device package Download PDF

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Publication number
JP2009246151A
JP2009246151A JP2008091149A JP2008091149A JP2009246151A JP 2009246151 A JP2009246151 A JP 2009246151A JP 2008091149 A JP2008091149 A JP 2008091149A JP 2008091149 A JP2008091149 A JP 2008091149A JP 2009246151 A JP2009246151 A JP 2009246151A
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double
pickup device
image pickup
sided adhesive
adhesive sheet
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Inventor
Hiroshi Watanabe
弘志 渡辺
Ichiji Maeda
一司 前田
Kazuhiro Ienaka
和浩 家中
Katsuyuki Fujimoto
勝之 藤本
Katsumi Tenjin
勝己 天神
Kozo Kanemoto
耕三 金本
Takayuki Hayashi
隆之 林
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate

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  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an imaging device package capable of facilitating a process for preventing dust, or the like, from infiltrating a portion between an imaging device and a glass substrate. <P>SOLUTION: The method includes: a process for bonding a double-sided adhesive sheet 8, which is formed larger than the imaging device 1, is thermosetting, and has openings 9, and the like, formed corresponding to a light-receiving surface 3 of the imaging device 1 and a conductive paste 6, and the like, onto the glass substrate 2; a process for applying the conductive paste 6 to a prescribed part in an electrode pattern 5 exposed from the openings 9, and the like, of the double-sided adhesive sheet 8; a process for placing the imaging device 1 onto the double-sided adhesive sheet 8 so that the light-receiving surface 3 of the imaging device 1 is fitted into the opening 9 of the double-sided adhesive sheet 8 and terminals 4, and the like of the imaging element 1 correspond to the electrode pattern; and a process for heating the double-sided adhesive sheet 8 with the conductive paste 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、デジタルカメラ等の機器に用いられる撮像素子パッケージの製造方法及び撮像素子パッケージに関する。   The present invention relates to an image pickup device package manufacturing method and an image pickup device package used for devices such as a digital camera.

従来、撮像素子パッケージとして、図２に示すように、撮像素子１及びガラス基板２が並設される撮像素子パッケージが知られている（例えば、特許文献１）。撮像素子１は、ガラス基板２側の面において、光を受ける受光面３が中央部に設けられると共に、複数の端子４，…が端部に設けられる。   2. Description of the Related Art Conventionally, as an image pickup device package, an image pickup device package in which an image pickup device 1 and a glass substrate 2 are provided side by side as shown in FIG. The imaging element 1 has a light receiving surface 3 that receives light at the center portion and a plurality of terminals 4 at the end portion of the surface on the glass substrate 2 side.

そして、撮像素子１は、各端子４と、ガラス基板２に設けられる各電極パターン５との間に介設される導電性ペースト６により、各電極パターン５と電気的に接続されている。また、電極パターン５は、導電性ペースト６を介して、外部と電気的に接続するための外部接続端子（例えば、半田ボール）７が電気的に接続されている。   The imaging device 1 is electrically connected to each electrode pattern 5 by a conductive paste 6 interposed between each terminal 4 and each electrode pattern 5 provided on the glass substrate 2. The electrode pattern 5 is electrically connected to an external connection terminal (for example, a solder ball) 7 for electrical connection with the outside via a conductive paste 6.

ところで、撮像素子パッケージは、撮像素子１とガラス基板２との間に塵埃等の侵入を防止すべく、撮像素子１とガラス基板２との間の空間に、エポキシやポリマ樹脂からなるシーリング材（図示しない）が側方の外側（図３（ｂ）における矢印Ａの方向）から流入されて、かかる空間を封止されている。   By the way, in order to prevent intrusion of dust and the like between the image pickup device 1 and the glass substrate 2, the image pickup device package has a sealing material (epoxy or polymer resin) in the space between the image pickup device 1 and the glass substrate 2. A space (not shown) is introduced from the outside of the side (in the direction of arrow A in FIG. 3B) to seal the space.

そして、特許文献１に係る発明においては、シーリング材が受光面３に至る内部（図３（ｂ）における矢印Ｂの方向）にまで流入するのを防止すべく、ダム（図示しない）が設けられている。
特開２００２−１１８２０７号公報 In the invention according to Patent Document 1, a dam (not shown) is provided to prevent the sealing material from flowing into the interior (in the direction of arrow B in FIG. 3B) reaching the light receiving surface 3. ing.
JP 2002-118207 A

しかしながら、例えば、シーリング材の流入量が少ないと、塵埃等の侵入が防止できなかったり、撮像素子１とガラス基板２との接着強度が低下したりするという問題が発生する。さらに、例えば、シーリング材の流入量が多いと、特許文献１に係る発明のようなダム等の流入防止手段を設けない限り、受光面３までシーリング材が流入するという問題が発生する。   However, for example, when the amount of inflow of the sealing material is small, there are problems that it is not possible to prevent intrusion of dust or the like, and the adhesive strength between the image sensor 1 and the glass substrate 2 is reduced. Furthermore, for example, if the amount of inflow of the sealing material is large, there arises a problem that the sealing material flows into the light receiving surface 3 unless an inflow prevention means such as a dam as in the invention according to Patent Document 1 is provided.

したがって、撮像素子１とガラス基板２との間の空間にシーリング材を流し込むことは、かかる空間が微小であるため細かい作業となるだけでなく、シーリング材を適量に流入するのも難しい作業となるため、技術的に非常に難しい。   Therefore, pouring the sealing material into the space between the image pickup device 1 and the glass substrate 2 is not only a fine work because the space is small, but also a difficult work to flow an appropriate amount of the sealing material. Therefore, it is technically very difficult.

よって、本発明は、かかる事情に鑑み、撮像素子とガラス基板との間に塵埃等が侵入するのを防止するための工程を容易にすることができる撮像素子パッケージの製造方法及び撮像素子パッケージを提供することを課題とする。   Therefore, in view of such circumstances, the present invention provides an image pickup device package manufacturing method and an image pickup device package that can facilitate a process for preventing dust and the like from entering between an image pickup device and a glass substrate. The issue is to provide.

本発明に係る撮像素子パッケージの製造方法は、撮像素子と、撮像素子をその受光面を内側に向けて搭載するためのガラス基板と、外部接続端子とを備え、撮像素子の端子及び外部接続端子の少なくともいずれか一方と、ガラス基板に形成された電極パターンの所定部位との間に介設される導電性ペーストを加熱することで、撮像素子の端子及び外部接続端子の少なくともいずれか一方と、電極パターンとが電気的に接続される撮像素子パッケージの製造方法において、撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートを、ガラス基板に貼着する工程と、両面接着剤シートの開口部から露出する電極パターンの所定部位に導電性ペーストを塗布する工程と、撮像素子の受光面が両面接着剤シートの開口部内に収まるようにし且つ撮像素子の端子が電極パターンに対応するよう撮像素子をガラス基板に載置する工程と、外部接続端子を載置する工程と、導電性ペーストと共に両面接着剤シートを加熱する工程とを備えることを特徴とする。   An image pickup device package manufacturing method according to the present invention includes an image pickup device, a glass substrate for mounting the image pickup device with its light receiving surface facing inward, and an external connection terminal. By heating a conductive paste interposed between at least one of and a predetermined portion of the electrode pattern formed on the glass substrate, at least one of the terminal of the image sensor and the external connection terminal, In a method of manufacturing an image sensor package in which an electrode pattern is electrically connected, an opening is formed that is larger than the image sensor, has thermosetting properties, and corresponds to the light receiving surface of the image sensor and the conductive paste. A step of attaching the double-sided adhesive sheet to the glass substrate, and a step of applying a conductive paste to a predetermined portion of the electrode pattern exposed from the opening of the double-sided adhesive sheet; A process of placing the image sensor on the glass substrate so that the light receiving surface of the image sensor fits within the opening of the double-sided adhesive sheet, and a terminal of the image sensor corresponding to the electrode pattern; and a process of placing the external connection terminal And a step of heating the double-sided adhesive sheet together with the conductive paste.

本発明によれば、撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートを、ガラス基板に貼着する。そして、撮像素子をその受光面を内側に向けて搭載するためのガラス基板に形成された電極パターンの所定部位に両面接着剤シートの開口部から導電性ペーストを塗布する。   According to the present invention, a double-sided adhesive sheet that is formed larger than an image sensor, has thermosetting properties, and has an opening corresponding to a light receiving surface and a conductive paste of the image sensor is attached to a glass substrate. . Then, the conductive paste is applied from the opening of the double-sided adhesive sheet to a predetermined portion of the electrode pattern formed on the glass substrate for mounting the imaging element with the light receiving surface facing inward.

その後、撮像素子の受光面が両面接着剤シートの開口部内に収まり、且つ撮像素子の端子が電極パターンに対応するよう撮像素子を両面接着剤シートに載置するとともに、外部接続端子を電極パターンの所定部位に載置する。そして、導電性ペーストと共に両面接着剤シートを加熱することにより、電極パターンと、撮像素子及び外部接続端子の少なくともいずれか一方とが導電性ペーストにより電気的に接続されると共に、撮像素子及びガラス基板が両面接着剤シートにより接合されるため、撮像素子とガラス基板との間を封止することができる。   Thereafter, the image sensor is placed on the double-sided adhesive sheet so that the light-receiving surface of the image sensor fits within the opening of the double-sided adhesive sheet and the terminals of the image sensor correspond to the electrode pattern, and the external connection terminals are connected to the electrode pattern. Place on a predetermined site. Then, by heating the double-sided adhesive sheet together with the conductive paste, the electrode pattern and at least one of the image sensor and the external connection terminal are electrically connected by the conductive paste, and the image sensor and the glass substrate Are bonded by the double-sided adhesive sheet, and therefore, the space between the imaging element and the glass substrate can be sealed.

また、本発明に係る撮像素子パッケージの製造方法においては、導電性ペーストを塗布する前に、両面接着剤シートのうちの撮像素子側の面の接着機能を抑制させるべく、両面接着剤シートを予備加熱する工程を備えてもよい。   In addition, in the method for manufacturing an image pickup device package according to the present invention, before applying the conductive paste, a double-sided adhesive sheet is preliminarily used to suppress the bonding function of the surface on the image pickup device side of the double-sided adhesive sheet. You may provide the process of heating.

かかる構成によれば、導電性ペーストを塗布する前に、両面接着剤シートを予備加熱するため、両面接着剤シートのうちの撮像素子側の面の接着機能を抑制することができる。したがって、例えば、導電性ペーストをスクリーン印刷で行う際に、両面接着剤シートのうち撮像素子側の面が接触されたとしても、予備加熱により接着機能を抑制したため、スクリーン印刷を円滑に行うことができる。   According to such a configuration, since the double-sided adhesive sheet is preheated before the conductive paste is applied, it is possible to suppress the bonding function of the surface on the imaging element side of the double-sided adhesive sheet. Therefore, for example, when conducting the conductive paste by screen printing, even if the surface on the imaging element side of the double-sided adhesive sheet is contacted, the adhesion function is suppressed by preheating, so that the screen printing can be performed smoothly. it can.

また、本発明に係る撮像素子パッケージの製造方法においては、両面接着剤シートとして、片面に剥離シートが付けられたものを用い、導電性ペーストを塗布した後に、剥離シートを両面接着剤シートから剥離する工程を備えてもよい。   In the method for manufacturing an image pickup device package according to the present invention, a double-sided adhesive sheet having a release sheet attached on one side is used, and after the conductive paste is applied, the release sheet is peeled from the double-sided adhesive sheet. You may provide the process to do.

かかる構成によれば、両面接着剤シートの片面に剥離シートが付けられているため、例えば、導電性ペーストをスクリーン印刷で行う際に、両面接着剤シートの片面（撮像素子側の面）が接触されたとしても、剥離シートにより両面接着剤シートの接着機能が影響しないため、スクリーン印刷を円滑に行うことができる。   According to this configuration, since the release sheet is attached to one side of the double-sided adhesive sheet, for example, when conducting conductive paste by screen printing, one side of the double-sided adhesive sheet (surface on the imaging element side) is in contact Even if it is done, since the adhesive function of the double-sided adhesive sheet is not affected by the release sheet, screen printing can be performed smoothly.

そして、導電性ペーストを塗布した後に、剥離シートを両面接着剤シートから剥離するため、剥離シートを剥離した両面接着剤シートの片面（撮像素子側の面）に撮像素子を接触（貼着）させて、両面接着剤シートを加熱することにより、撮像素子及びガラス基板を接合させることができる。   And after apply | coating an electrically conductive paste, in order to peel a peeling sheet from a double-sided adhesive sheet, an imaging element is made to contact (adhere) the single side | surface (surface on an image pick-up element side) of the double-sided adhesive sheet which peeled the peeling sheet. And an image sensor and a glass substrate can be joined by heating a double-sided adhesive sheet.

さらに、導電性ペーストを両面接着剤シートと共に加熱することにより、外部接続端子が電極パターンの所定部位との間に介設される導電性ペーストにより電極パターンと電気的に接続されると共に、電極パターンが両面接着剤シートで被覆される。したがって、両面接着剤シートにより電極パターンを保護することができる。   Further, by heating the conductive paste together with the double-sided adhesive sheet, the external connection terminal is electrically connected to the electrode pattern by the conductive paste interposed between the electrode pattern and a predetermined portion, and the electrode pattern Is coated with a double-sided adhesive sheet. Therefore, the electrode pattern can be protected by the double-sided adhesive sheet.

また、本発明に係る撮像素子パッケージは、撮像素子と、撮像素子をその受光面を内側に向けて搭載するためのガラス基板とを備え、ガラス基板に形成された電極パターンの所定部位と、撮像素子の端子及び外部接続端子の少なくともいずれか一方との間に介設される導電性ペーストが加熱されることにより、電極パターンと、撮像素子及び外部接続端子の少なくともいずれか一方とが電気的に接続される撮像素子パッケージにおいて、撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートにより、撮像素子がガラス基板に接合されることを特徴とする。   An image pickup device package according to the present invention includes an image pickup device and a glass substrate for mounting the image pickup device with its light receiving surface facing inward, a predetermined portion of an electrode pattern formed on the glass substrate, and an image pickup By heating the conductive paste interposed between at least one of the element terminal and the external connection terminal, the electrode pattern and at least one of the imaging element and the external connection terminal are electrically connected. In the connected image pickup device package, the image pickup device is made of glass by a double-sided adhesive sheet that is formed larger than the image pickup device, has thermosetting properties, and has a light receiving surface of the image pickup device and an opening corresponding to the conductive paste. It is characterized by being bonded to a substrate.

かかる構成によれば、撮像素子をその受光面を内側に向けて搭載するためのガラス基板に形成された電極パターンの所定部位と、撮像素子の端子及び外部接続端子の少なくともいずれか一方との間に介設される導電性ペーストが加熱されることにより、電極パターンと、撮像素子及び外部接続端子の少なくともいずれか一方とが電気的に接続される。さらに、撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートにより、撮像素子がガラス基板に接合されるため、撮像素子とガラス基板との間を封止することができる。   According to such a configuration, between the predetermined portion of the electrode pattern formed on the glass substrate for mounting the imaging element with its light receiving surface facing inward, and at least one of the terminal of the imaging element and the external connection terminal By heating the conductive paste interposed between the electrode pattern, the electrode pattern and at least one of the image sensor and the external connection terminal are electrically connected. Furthermore, the image sensor is bonded to the glass substrate by a double-sided adhesive sheet that is formed larger than the image sensor, has thermosetting properties, and has a light receiving surface of the image sensor and an opening corresponding to the conductive paste. The space between the image sensor and the glass substrate can be sealed.

以上の如く、本発明に係る撮像素子パッケージの製造方法及び撮像素子パッケージによれば、撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートにより、撮像素子がガラス基板に接合されるため、撮像素子とガラス基板との間を封止することができ、その結果、撮像素子とガラス基板との間に塵埃等が侵入するのを防止するための工程を容易にすることができるという優れた効果を奏する。   As described above, according to the imaging element package manufacturing method and the imaging element package according to the present invention, the opening is formed larger than the imaging element, has thermosetting properties, and corresponds to the light receiving surface of the imaging element and the conductive paste. The image pickup element is bonded to the glass substrate by the double-sided adhesive sheet on which the image pickup element is formed, so that the gap between the image pickup element and the glass substrate can be sealed. There is an excellent effect that the process for preventing the intrusion or the like can be facilitated.

以下、本発明に係る撮像素子パッケージの製造方法及び撮像素子パッケージにおける一実施形態について、図１〜図２を参酌して説明する。なお、図１〜図２において、図３の符号と同一の符号を付した部分は、従来技術と同一の構成又は要素を表す。   Hereinafter, an image sensor package manufacturing method and an image sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 2, the same reference numerals as those in FIG. 3 denote the same components or elements as those in the prior art.

本実施形態に係る撮像素子パッケージは、撮像素子１と、撮像素子１をその受光面３を内側に向けて搭載するためのガラス基板２とを備え、撮像素子１は、両面接着剤シート８によりガラス基板２に接合される。そして、撮像素子パッケージは、外部と電気的に接続するための外部接続端子７，…を備える。   The image pickup device package according to the present embodiment includes an image pickup device 1 and a glass substrate 2 for mounting the image pickup device 1 with its light receiving surface 3 facing inward. The image pickup device 1 is formed by a double-sided adhesive sheet 8. Bonded to the glass substrate 2. The image pickup device package includes external connection terminals 7 for electrically connecting to the outside.

また、撮像素子パッケージは、ガラス基板２に形成された電極パターン５の所定部位と、撮像素子１の端子４との間に介設される導電性ペースト（図２（ｂ）における右側の導電性ペーストであり、以下、「第１導電性ペースト」ともいう）６が加熱されることにより、電極パターン５，…と撮像素子１とが電気的に接続される。   In addition, the image pickup device package has a conductive paste interposed between a predetermined portion of the electrode pattern 5 formed on the glass substrate 2 and the terminal 4 of the image pickup device 1 (the right-side conductive in FIG. 2B). The electrode pattern 5,... And the image sensor 1 are electrically connected by heating the paste 6 (hereinafter also referred to as “first conductive paste”) 6.

なお、導電性ペースト６は、例えば、加熱により溶着する半田ペーストや、加熱により乾燥硬化する導電性接着剤を採用することができるが、環境保護のために用いられる鉛フリー半田ペーストの溶融温度が一般的に２３０〜２４０℃であるのに対して、導電性接着剤の硬化温度が一般的に１５０〜２００℃であるため、ガラス基板や撮像素子への熱衝撃を考慮する場合においては導電性接着剤の方が好ましい。   The conductive paste 6 can employ, for example, a solder paste that is welded by heating or a conductive adhesive that is dried and hardened by heating. However, the melting temperature of the lead-free solder paste used for environmental protection is low. In general, the curing temperature of the conductive adhesive is generally 150 to 200 ° C., whereas it is generally 230 to 240 ° C., so that it is conductive when considering thermal shock to the glass substrate or the image sensor. An adhesive is preferred.

撮像素子１は、矩形状に形成される。そして、撮像素子１は、ガラス基板２側の面（下面）の中央部に、光を受ける（読み取る）受光面３が設けられる。また、撮像素子１は、ガラス基板２側の面（下面）の両端部に、端子（以下、「バンプ」ともいう）４，…が複数設けられる。例えば、撮像素子１は、ＣＣＤセンサやＣＭＯＳセンサを採用することができる。また、端子４は金、銀、銅、および半田バンプなどを採用することができる。   The image sensor 1 is formed in a rectangular shape. The imaging element 1 is provided with a light receiving surface 3 that receives (reads) light at the center of the surface (lower surface) on the glass substrate 2 side. In addition, the imaging device 1 is provided with a plurality of terminals (hereinafter also referred to as “bumps”) 4... At both ends of the surface (lower surface) on the glass substrate 2 side. For example, the image sensor 1 can employ a CCD sensor or a CMOS sensor. The terminal 4 can employ gold, silver, copper, solder bumps, and the like.

ガラス基板２は、例えば、ホウ珪酸ガラスなどを採用することができ、撮像素子１より大きい矩形状に形成される。そして、ガラス基板２は、撮像素子１側の面（上面）に導電性を有する電極パターン５，…が複数設けられる。なお、ガラス基板２は、撮像素子１の受光面３と対向する部位が少なくとも透光可能に構成される。具体的には、ガラス基板２は、撮像素子１の受光面３と対向する部位よりも外方に電極パターン５，…が設けられる。   The glass substrate 2 can employ, for example, borosilicate glass or the like, and is formed in a rectangular shape larger than the imaging element 1. The glass substrate 2 is provided with a plurality of conductive electrode patterns 5,... On the surface (upper surface) on the imaging element 1 side. The glass substrate 2 is configured such that at least a portion facing the light receiving surface 3 of the image sensor 1 can transmit light. Specifically, the glass substrate 2 is provided with electrode patterns 5,... Outside the portion facing the light receiving surface 3 of the image sensor 1.

電極パターン５は、内端部（以下、「（内部の又は内）ランド」ともいう）が撮像素子１のパンプ４と対向して配置され、内端部から外方に向けてガラス基板２の端部に配置される外端部（以下、「（外部の又は外）ランド」ともいう）まで延設されている。具体的には、電極パターン５は、内端部及び外端部が線状の連結部で連結されている。   The electrode pattern 5 has an inner end portion (hereinafter also referred to as “(internal or inner) land”) opposed to the pump 4 of the image pickup device 1, and is formed on the glass substrate 2 outward from the inner end portion. It extends to an outer end portion (hereinafter also referred to as “(external or outer) land”) disposed at the end portion. Specifically, the electrode pattern 5 has an inner end portion and an outer end portion connected by a linear connecting portion.

また、電極パターン５は、両面接着剤シート８に被覆される。具体的には、電極パターン５は、導電性ペースト６が塗布される内端部及び外端部を除く部位、即ち、連結部が両面接着剤シート８に被覆される。   The electrode pattern 5 is covered with a double-sided adhesive sheet 8. Specifically, the electrode pattern 5 is covered with a double-sided adhesive sheet 8 at a portion excluding an inner end and an outer end to which the conductive paste 6 is applied, that is, a connecting portion.

そして、電極パターン５は、内端部が撮像素子１の端子４と導電性ペースト６を介して接合されている。また、電極パターン５は、例えば、金、銀、銅及びイリジウムのうち、一つや複数からなる材質で形成することができる。   The inner end portion of the electrode pattern 5 is bonded to the terminal 4 of the image sensor 1 via the conductive paste 6. Further, the electrode pattern 5 can be formed of, for example, one or a plurality of materials among gold, silver, copper, and iridium.

外部接続端子７は、導電性を有し、球状に形成される。そして、外部接続端子７は、例えば、半田ボールを採用することができる。また、外部接続端子７は、電極パターン５の所定部位（外端部）との間に介設される導電性ペースト（図２（ｂ）における左側の導電性ペーストであり、以下、「第２導電性ペースト」ともいう）６が加熱されることにより電極パターン５と電気的に接続される。   The external connection terminal 7 has conductivity and is formed in a spherical shape. For example, a solder ball can be used as the external connection terminal 7. The external connection terminal 7 is a conductive paste (left-side conductive paste in FIG. 2B) interposed between a predetermined portion (outer end portion) of the electrode pattern 5 and hereinafter referred to as “second conductive paste”. 6) is electrically connected to the electrode pattern 5 by heating.

両面接着剤シート８は、例えば変成エポキシ樹脂等からなり、撮像素子１より大きく形成され、熱硬化性を有し、撮像素子１の受光面３及び導電性ペースト６に対応した開口部９，…が形成される。具体的には、両面接着剤シート８は、ガラス基板２と略同じ大きさに形成される。   The double-sided adhesive sheet 8 is made of, for example, a modified epoxy resin, is formed larger than the image sensor 1, has thermosetting properties, and has openings 9 corresponding to the light receiving surface 3 and the conductive paste 6 of the image sensor 1. Is formed. Specifically, the double-sided adhesive sheet 8 is formed in substantially the same size as the glass substrate 2.

また、両面接着剤シート８は、両面が撮像素子１やガラス基板２に貼着可能に構成される。そして、両面接着剤シート８は、予備加熱（例えば、８０〜１００℃で１分間加熱）されることにより硬化して（以下、「仮硬化」ともいう）、表面の接着性（粘着性）が抑制される。   Moreover, the double-sided adhesive sheet 8 is configured such that both surfaces can be attached to the image pickup device 1 and the glass substrate 2. The double-sided adhesive sheet 8 is cured by being preheated (for example, heated at 80 to 100 ° C. for 1 minute) (hereinafter also referred to as “temporary curing”), and has a surface adhesiveness (tackiness). It is suppressed.

さらに、両面接着剤シート８は、仮硬化させる温度よりも高い温度で加熱（例えば、１２０〜１８０℃で６０分間加熱）されることにより、さらに硬化して（以下、「本硬化」ともいう）、接触していた撮像素子１やガラス基板２と固着可能に構成される。   Furthermore, the double-sided adhesive sheet 8 is further cured by heating at a temperature higher than the temperature for temporary curing (for example, heating at 120 to 180 ° C. for 60 minutes) (hereinafter also referred to as “main curing”). The imaging device 1 and the glass substrate 2 that are in contact with each other can be fixed.

したがって、上記のように構成される撮像素子パッケージは、ガラス基板２を透過した光が撮像素子１の受光面３で受光し、端子４、電極パターン５、及び外部接続端子７を介して、受光データをマザーボード（図示しない）等の外部へ出力可能に構成されている。   Therefore, in the image pickup device package configured as described above, light transmitted through the glass substrate 2 is received by the light receiving surface 3 of the image pickup device 1 and received through the terminal 4, the electrode pattern 5, and the external connection terminal 7. Data is output to the outside such as a mother board (not shown).

本実施形態に係る撮像素子パッケージの構成は以上の通りであり、次に、本実施形態にかかる撮像素子パッケージの製造方法について説明する。   The configuration of the image sensor package according to the present embodiment is as described above. Next, a method for manufacturing the image sensor package according to the present embodiment will be described.

まず、ガラス基板２と略同じ大きさに形成された熱硬化性を有する両面接着剤シート８に対して、金型加工やレーザ加工等の加工により、受光面３及び導電性ペースト６に対応する位置に開口部９，…を形成する。   First, the thermosetting double-sided adhesive sheet 8 formed to be approximately the same size as the glass substrate 2 corresponds to the light receiving surface 3 and the conductive paste 6 by processing such as mold processing or laser processing. Openings 9 are formed at the positions.

そして、両面接着剤シート８の下面をガラス基板２の上面に貼着し、各導電性ペースト６を塗布する前に、両面接着剤シート８のうちの撮像素子１側の面（上面）の接着機能を抑制させるべく、両面接着剤シート８を予備加熱（例えば、８０〜１００℃で１分間加熱）して、仮硬化させる。   Then, the lower surface of the double-sided adhesive sheet 8 is adhered to the upper surface of the glass substrate 2 and before the respective conductive pastes 6 are applied, the surface (upper surface) of the double-sided adhesive sheet 8 on the imaging element 1 side is bonded. In order to suppress the function, the double-sided adhesive sheet 8 is preheated (for example, heated at 80 to 100 ° C. for 1 minute) and temporarily cured.

その後、両面接着剤シート８の開口部９，…から露出する電極パターン５の所定部位（内端部及び外端部）に導電性ペースト６を、例えばスクリーン印刷によって塗布する。このとき、両面接着剤シート８を仮硬化したため、両面接着剤シート８の上面等に触れても、各導電性ペースト６の塗布を円滑に行うことができる。   Thereafter, the conductive paste 6 is applied to predetermined portions (inner end portion and outer end portion) of the electrode pattern 5 exposed from the openings 9 of the double-sided adhesive sheet 8 by, for example, screen printing. At this time, since the double-sided adhesive sheet 8 was temporarily cured, each conductive paste 6 can be applied smoothly even if the upper surface of the double-sided adhesive sheet 8 is touched.

そして、撮像素子１の受光面３が両面接着剤シート８の開口部９内に収まるようにして、撮像素子１を両面接着剤シート８に載置すると、撮像素子１の各端子４が電極パターン５の内端部に塗布された第１導電性ペースト６に接触する。これに併せて、各外部接続端子７が電極パターン５の外端部に塗布された第２導電性ペースト６に接触するように、各外部接続端子７をガラス基板２に載置する。   Then, when the image pickup device 1 is placed on the double-sided adhesive sheet 8 so that the light receiving surface 3 of the image pickup device 1 is accommodated in the opening 9 of the double-sided adhesive sheet 8, each terminal 4 of the image pickup device 1 becomes an electrode pattern. 5 contacts the first conductive paste 6 applied to the inner end portion. At the same time, each external connection terminal 7 is placed on the glass substrate 2 so that each external connection terminal 7 is in contact with the second conductive paste 6 applied to the outer end portion of the electrode pattern 5.

さらに、各導電性ペースト６と共に両面接着剤シート８を、リフロー炉や熱風乾燥炉等の加熱炉により加熱して、各導電性ペースト６を溶着又は熱硬化させ、同時に両面接着剤シート８を本硬化させる。例えば、導電性ペースト６として導電性接着剤を用いた場合、１２０〜１８０℃で６０分間加熱する。   Further, the double-sided adhesive sheet 8 together with each conductive paste 6 is heated by a heating furnace such as a reflow furnace or a hot air drying furnace to weld or thermally cure each conductive paste 6, and simultaneously the double-sided adhesive sheet 8. Harden. For example, when a conductive adhesive is used as the conductive paste 6, heating is performed at 120 to 180 ° C. for 60 minutes.

これにより、撮像素子１の端子４及び電極パターン５の内端部、並びに、電極パターン５の外端部及び外部接続端子７が、各導電性ペースト６を介して接合され、撮像素子１、電極パターン５、及び外部接続端子７が電気的に接続されると共に、撮像素子１及びガラス基板２が両面接着剤シート８により接合される。   Thereby, the terminal 4 of the image pick-up element 1 and the inner end part of the electrode pattern 5, and the outer end part of the electrode pattern 5 and the external connection terminal 7 are joined via each conductive paste 6, and the image pick-up element 1 and the electrode The pattern 5 and the external connection terminal 7 are electrically connected, and the imaging element 1 and the glass substrate 2 are joined by the double-sided adhesive sheet 8.

以上より、本実施形態に係る撮像素子パッケージは、撮像素子１より大きく形成され、熱硬化性を有し、撮像素子１の受光面３及び導電性ペースト６，…に対応した開口部９，…が形成される両面接着剤シート８により、撮像素子１がガラス基板２に接合されるため、撮像素子１とガラス基板２との間を封止することができ、その結果、撮像素子１とガラス基板２との間に塵埃等が侵入するのを防止するための工程を容易にすることができる。   As described above, the image pickup device package according to the present embodiment is formed larger than the image pickup device 1, has thermosetting properties, and has openings 9 corresponding to the light receiving surface 3 and the conductive paste 6. Since the image pickup device 1 is bonded to the glass substrate 2 by the double-sided adhesive sheet 8 on which the image pickup device 1 is formed, the space between the image pickup device 1 and the glass substrate 2 can be sealed. A process for preventing dust and the like from entering the substrate 2 can be facilitated.

さらに、従来技術においては、撮像素子１及び電極パターン５間が導電性ペースト６を介して電気的に接続された後に、撮像素子１及びガラス基板２間にシーリング材を充填する必要があるため、シーリング材を塗布及び乾燥硬化する封止工程の時間がさらに必要であるのに対して、本実施形態に係る撮像素子パッケージは、端子４及び外部接続端子７と電極パターン５とを各導電性ペースト６により加熱接続する工程及び撮像素子１とガラス基板２とを両面接着剤シート８を乾燥硬化する工程が少なくとも同時に進行できるため、製造時間を短縮することもできる。   Furthermore, in the prior art, after the image pickup device 1 and the electrode pattern 5 are electrically connected via the conductive paste 6, it is necessary to fill a sealing material between the image pickup device 1 and the glass substrate 2, Whereas the time required for the sealing process of applying and drying and curing the sealing material is further required, the image pickup device package according to the present embodiment includes the terminal 4, the external connection terminal 7, and the electrode pattern 5 in each conductive paste. 6 and the step of drying and curing the double-sided adhesive sheet 8 between the imaging element 1 and the glass substrate 2 at the same time can proceed at least simultaneously, so that the manufacturing time can be shortened.

また、上記実施形態に係る撮像素子パッケージは、各導電性ペースト６を塗布する前に両面接着剤シート８を予備加熱して仮硬化させるため、両面接着剤シート８の上面の接着機能を抑制できる。したがって、例えば、各導電性ペースト６をスクリーン印刷で行う際に、両面接着剤シート８の上面が接触されたとしても、接着機能が抑制されているため、かかるスクリーン印刷を円滑に行うことができる。   Moreover, since the image pick-up element package which concerns on the said embodiment preliminarily heats the double-sided adhesive sheet 8 before apply | coating each electrically conductive paste 6, it can suppress the adhesion function of the upper surface of the double-sided adhesive sheet 8. FIG. . Therefore, for example, when each conductive paste 6 is screen-printed, even if the upper surface of the double-sided adhesive sheet 8 is brought into contact, the adhesive function is suppressed, so that screen printing can be performed smoothly. .

また、上記実施形態に係る撮像素子パッケージは、ガラス基板２と略同じ大きさに形成され且つ各導電性ペースト６に対応した開口部９，…が形成される両面接着剤シート８が電極パターン５を被覆するため、両面接着剤シート８により被覆される電極パターン５，…を保護することができる。   In the image pickup device package according to the above embodiment, the double-sided adhesive sheet 8 that is formed to be approximately the same size as the glass substrate 2 and that has openings 9 corresponding to the respective conductive pastes 6 is the electrode pattern 5. Therefore, the electrode patterns 5 covered with the double-sided adhesive sheet 8 can be protected.

なお、本発明に係る撮像素子パッケージの製造方法及び撮像素子パッケージは、上記した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。   Note that the image pickup device package manufacturing method and the image pickup device package according to the present invention are not limited to the above-described embodiments, and various changes can be made without departing from the scope of the present invention. is there.

例えば、上記実施形態に係る撮像素子パッケージにおいては、撮像素子１の端子４と外部接続端子７の両方が導電性ペースト６を介して電極パターン５と電気的に接続される場合を説明したが、かかる場合に限られず、端子４と外部接続端子７のいずれか一方のみが導電性ペースト６を介して電極パターン５と電気的に接続される場合でもよい。例えば、撮像素子１の端子４を超音波圧着により電極パターン５と電気的に接続し、外部接続端子７は導電性ペースト６を介して電極パターン５と電気的に接続してもよい。   For example, in the imaging device package according to the above-described embodiment, the case where both the terminal 4 and the external connection terminal 7 of the imaging device 1 are electrically connected to the electrode pattern 5 through the conductive paste 6 has been described. The present invention is not limited to this, and only one of the terminal 4 and the external connection terminal 7 may be electrically connected to the electrode pattern 5 via the conductive paste 6. For example, the terminal 4 of the image sensor 1 may be electrically connected to the electrode pattern 5 by ultrasonic pressure bonding, and the external connection terminal 7 may be electrically connected to the electrode pattern 5 via the conductive paste 6.

また、上記実施形態に係る撮像素子パッケージにおいては、導電性ペースト６の塗布工程を円滑に行うべく、両面接着剤シートを加熱して仮硬化させる場合を説明したが、かかる場合に限られず、例えば、両面接着剤シート８として、片面に剥離シートが付けられたものを用い、導電性ペースト６を塗布した後に、剥離シートを両面接着剤シート８から剥離する工程を備える場合でもよい。   Further, in the image pickup device package according to the above-described embodiment, the case where the double-sided adhesive sheet is heated and temporarily cured in order to smoothly apply the conductive paste 6 has been described. The double-sided adhesive sheet 8 may be provided with a step of peeling the release sheet from the double-sided adhesive sheet 8 after applying the conductive paste 6 using one having a release sheet attached on one side.

かかる構成によれば、両面接着剤シート８の片面に剥離シートが付けられているため、例えば、導電性ペースト６をスクリーン印刷で行う際に、両面接着剤シート８の片面（撮像素子１側の面）が接触されたとしても、剥離シートにより両面接着剤シート８の接着機能が影響しないため、スクリーン印刷を円滑に行うことができる。   According to this configuration, since the release sheet is attached to one side of the double-sided adhesive sheet 8, for example, when the conductive paste 6 is performed by screen printing, one side of the double-sided adhesive sheet 8 (on the imaging element 1 side). Even if the surface is touched, the adhesive function of the double-sided adhesive sheet 8 is not affected by the release sheet, so that screen printing can be performed smoothly.

また、上記実施形態に係る撮像素子パッケージにおいては、両面接着剤シート８をガラス基板２に貼着する前に所定位置に開口部９，…を形成する場合を説明したが、かかる場合に限られず、両面接着剤シート８をガラス基板２に貼着した後に開口部９，…を形成する場合でもよい。   Moreover, in the image pick-up element package which concerns on the said embodiment, although the case where the opening part 9, ... was formed in a predetermined position before sticking the double-sided adhesive sheet 8 on the glass substrate 2 was demonstrated, it is not restricted to such a case. Alternatively, the openings 9 may be formed after the double-sided adhesive sheet 8 is adhered to the glass substrate 2.

また、上記実施形態に係る撮像素子パッケージにおいては、導電性ペースト６の塗布をスクリーン印刷で行う場合を説明したが、かかる場合に限られず、例えば、ピン転写で行う場合でもよい。そして、導電性ペースト６の塗布を行う際に、両面接着剤シート８の上面に接触することがない場合は、両面接着剤シート８を仮硬化させる必要はない。   Further, in the image pickup device package according to the above-described embodiment, the case where the conductive paste 6 is applied by screen printing has been described. However, the present invention is not limited to this, and for example, it may be performed by pin transfer. Then, when the conductive paste 6 is applied, it is not necessary to temporarily cure the double-sided adhesive sheet 8 if it does not come into contact with the upper surface of the double-sided adhesive sheet 8.

本発明に係る撮像素子パッケージの製造方法及び撮像素子パッケージは、撮像素子とガラス基板との間に塵埃等が侵入するのを防止するための工程を容易にすることができるため、例えば、フリップチップ実装・ＢＧＡ（Ｂａｌｌ ｇｒｉｄ ａｒｒａｙ）の生産効率を向上させるのに有用である。   The image pickup device package manufacturing method and the image pickup device package according to the present invention can facilitate a process for preventing dust and the like from entering between the image pickup device and the glass substrate. This is useful for improving the production efficiency of mounting and BGA (Ball grid array).

本発明の一実施形態に係る撮像素子パッケージの分解斜視図1 is an exploded perspective view of an image sensor package according to an embodiment of the present invention. （ａ）同実施形態に係る撮像素子パッケージの一部分解斜視図（ｂ）同実施形態に係る撮像素子パッケージの要部拡大断面図(A) Partially exploded perspective view of the image sensor package according to the embodiment (b) Enlarged sectional view of the main part of the image sensor package according to the embodiment （ａ）従来の撮像素子パッケージの全体斜視図（ｂ）従来の撮像素子パッケージの要部拡大断面図(A) Whole perspective view of a conventional image sensor package (b) Enlarged sectional view of a main part of a conventional image sensor package

符号の説明Explanation of symbols

１ 撮像素子
２ ガラス基板
３ 受光面
４ 端子（バンプ）
５ 電極パターン
６ 導電性ペースト
７ 外部接続端子
８ 両面接着剤シート
９ 開口部


1 Image sensor 2 Glass substrate 3 Light-receiving surface 4 Terminal (bump)
5 Electrode pattern 6 Conductive paste 7 External connection terminal 8 Double-sided adhesive sheet 9 Opening


Claims (4)

撮像素子と、撮像素子をその受光面を内側に向けて搭載するためのガラス基板と、外部接続端子とを備え、撮像素子の端子及び外部接続端子の少なくともいずれか一方と、ガラス基板に形成された電極パターンの所定部位との間に介設される導電性ペーストを加熱することで、撮像素子の端子及び外部接続端子の少なくともいずれか一方と、電極パターンとが電気的に接続される撮像素子パッケージの製造方法において、
撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートを、ガラス基板に貼着する工程と、両面接着剤シートの開口部から露出する電極パターンの所定部位に導電性ペーストを塗布する工程と、撮像素子の受光面が両面接着剤シートの開口部内に収まるようにし且つ撮像素子の端子が電極パターンに対応するよう撮像素子をガラス基板に載置する工程と、外部接続端子を載置する工程と、導電性ペーストと共に両面接着剤シートを加熱する工程とを備えることを特徴とする撮像素子パッケージの製造方法。 An image pickup device, a glass substrate for mounting the image pickup device with its light receiving surface facing inward, and an external connection terminal are provided on at least one of the image pickup device terminal and the external connection terminal, and the glass substrate. An image sensor in which at least one of the terminal of the image sensor and the external connection terminal is electrically connected to the electrode pattern by heating a conductive paste interposed between the electrode pattern and a predetermined portion In the manufacturing method of the package,
A step of adhering a double-sided adhesive sheet, which is formed larger than the image sensor, has thermosetting properties, and has an opening corresponding to the light receiving surface of the image sensor and the conductive paste, to the glass substrate; A step of applying a conductive paste to a predetermined portion of the electrode pattern exposed from the opening of the sheet, the light receiving surface of the image sensor to be within the opening of the double-sided adhesive sheet, and the terminals of the image sensor corresponding to the electrode pattern A method for manufacturing an image pickup device package, comprising: a step of placing the image pickup device on a glass substrate; a step of placing an external connection terminal; and a step of heating the double-sided adhesive sheet together with the conductive paste. 導電性ペーストを塗布する前に、両面接着剤シートのうちの撮像素子側の面の接着機能を抑制させるべく、両面接着剤シートを予備加熱する工程を備える請求項１に記載の撮像素子パッケージの製造方法。   2. The image pickup device package according to claim 1, further comprising a step of preheating the double-sided adhesive sheet so as to suppress an adhesive function of a surface on the image pickup device side of the double-sided adhesive sheet before applying the conductive paste. Production method. 両面接着剤シートとして、片面に剥離シートが付けられたものを用い、導電性ペーストを塗布した後に、剥離シートを両面接着剤シートから剥離する工程を備える請求項１に記載の撮像素子パッケージの製造方法。   2. The image pickup device package according to claim 1, further comprising a step of peeling the release sheet from the double-sided adhesive sheet after applying the conductive paste, using a double-sided adhesive sheet having a release sheet on one side. Method. 撮像素子と、撮像素子をその受光面を内側に向けて搭載するためのガラス基板とを備え、ガラス基板に形成された電極パターンの所定部位と、撮像素子の端子及び外部接続端子の少なくともいずれか一方との間に介設される導電性ペーストが加熱されることにより、電極パターンと、撮像素子及び外部接続端子の少なくともいずれか一方とが電気的に接続される撮像素子パッケージにおいて、
撮像素子より大きく形成され、熱硬化性を有し、撮像素子の受光面及び導電性ペーストに対応した開口部が形成される両面接着剤シートにより、撮像素子がガラス基板に接合されることを特徴とする撮像素子パッケージ。
An image pickup device and a glass substrate for mounting the image pickup device with its light receiving surface facing inward, a predetermined portion of an electrode pattern formed on the glass substrate, at least one of a terminal of the image pickup device and an external connection terminal In the image pickup device package in which the electrode pattern and at least one of the image pickup device and the external connection terminal are electrically connected by heating the conductive paste interposed therebetween,
The image sensor is bonded to the glass substrate by a double-sided adhesive sheet that is formed larger than the image sensor, has thermosetting properties, and has a light receiving surface of the image sensor and an opening corresponding to the conductive paste. An image pickup device package.
JP2008091149A 2008-03-31 2008-03-31 Method of manufacturing imaging device package and imaging device package Pending JP2009246151A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10916578B2 (en) 2018-02-14 2021-02-09 Canon Kabushiki Kaisha Semiconductor apparatus and camera

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10916578B2 (en) 2018-02-14 2021-02-09 Canon Kabushiki Kaisha Semiconductor apparatus and camera

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