JP2009242888A - Composite plated material and method for manufacturing the same - Google Patents
Composite plated material and method for manufacturing the same Download PDFInfo
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Abstract
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本発明は、錫層中に炭素粒子が分散した複合材からなる皮膜が素材上に形成された複合めっき材およびその製造方法に関し、特に、挿抜可能な接続端子などの材料として使用される複合めっき材およびその製造方法に関する。 The present invention relates to a composite plating material in which a film made of a composite material in which carbon particles are dispersed in a tin layer is formed on the material, and a method for producing the same, and in particular, composite plating used as a material such as a connectable / detachable connection terminal. The present invention relates to a material and a manufacturing method thereof.
従来、挿抜可能な接続端子の材料として、銅や銅合金などの導体素材の最外層に錫めっきを施した錫めっき材が使用されている。特に、錫めっき材は、接触抵抗が低く、車載用や民生用の電気配線に使用するワイヤーハーネス用コネクタの端子やプリント回路基板用コネクタの(オス)端子(以下「PCB端子」という)などの材料として使用されている。 Conventionally, a tin-plated material obtained by applying tin plating to the outermost layer of a conductor material such as copper or copper alloy has been used as a material for a connection terminal that can be inserted and removed. In particular, tin-plated materials have low contact resistance, such as wire harness connector terminals used for in-vehicle and consumer electrical wiring and printed circuit board connector (male) terminals (hereinafter referred to as “PCB terminals”). Used as a material.
一般に、プリント回路基板用コネクタには、多数のPCB端子が取り付けられており、これらのPCB端子の各々は、プリント回路基板に半田付けされる一端側の半田付け部と、相手材の被嵌合部に嵌合して通電を確保する他端側の電気接触部としての嵌合部とを備えている。このようなPCB端子の材料として錫めっき材を使用すると、接触抵抗が低く且つ耐食性に優れた嵌合部と、半田付け性が良好な半田付け部とを備えた接続端子を得ることができる。 Generally, many PCB terminals are attached to a printed circuit board connector, and each of these PCB terminals is fitted with a soldering portion on one end soldered to the printed circuit board and a mating member. And a fitting portion as an electrical contact portion on the other end side that is fitted to the portion and ensures energization. When a tin plating material is used as a material for such a PCB terminal, a connection terminal having a fitting portion with low contact resistance and excellent corrosion resistance and a soldering portion with good solderability can be obtained.
近年、PCB端子の小型化および高密度化(単位面積当りの数の増加)の要求が高まっており、そのため、PCB端子の嵌合部を相手材の被嵌合部に嵌合させる際の挿入力を小さくすることが求められている。しかし、錫めっき材の最外層の錫めっき皮膜は、軟質の金属であるため、PCB端子の嵌合部を相手材の被嵌合部に嵌合させる際に容易に塑性変形して、大きな挿入力が必要になる。 In recent years, there has been an increasing demand for miniaturization and high density of PCB terminals (increase in the number per unit area). Therefore, insertion when fitting a fitting portion of a PCB terminal to a mating portion of a mating member is performed. There is a need to reduce power. However, since the tin plating film on the outermost layer of the tin plating material is a soft metal, it is easily plastically deformed when the fitting portion of the PCB terminal is fitted to the mating portion of the mating material, and a large insertion Power is needed.
このようなPCB端子の嵌合部の挿入力を低下させるために、錫めっき皮膜を薄くすることが考えられるが、錫めっき皮膜を薄くすると、半田付け部の半田付け性が悪化するという問題がある。また、黄銅などの銅合金の母材の表面に、順次、ニッケルめっき層、銅めっき層および錫めっき層を積層した後、リフロー処理を施して最外層の錫めっき層の一部を銅錫合金層に転化することにより、最外層の硬度を高めて、端子の挿入力を低下させることが提案されている
(例えば、特許文献1参照)。また、Cu板条からなる母材の表面に、Cuめっき層とSnめっき層を順次形成した後、リフロー処理を行って、母材の表面にCu−Sn合金被覆層とSn被覆層をこの順に形成することにより、端子の挿入力を低下させることも提案されている(例えば、特許文献2参照)。さらに、炭素粒子および芳香族カルボニル化合物を添加した錫めっき液を使用して電気めっきを行うことにより、錫層中に炭素粒子を含有する複合材からなる皮膜を素材上に形成することにより、端子の挿入力を低下させることも提案されている(例えば、特許文献3参照)。
In order to reduce the insertion force of the fitting part of such a PCB terminal, it is conceivable to make the tin plating film thin. However, if the tin plating film is made thin, there is a problem that the solderability of the soldering part deteriorates. is there. In addition, a nickel plating layer, a copper plating layer, and a tin plating layer are sequentially laminated on the surface of a copper alloy base material such as brass, and then a reflow process is performed to partially transfer the copper tin alloy layer. It has been proposed to increase the hardness of the outermost layer and reduce the insertion force of the terminal by converting into a layer (see, for example, Patent Document 1). In addition, a Cu plating layer and a Sn plating layer are sequentially formed on the surface of the base material made of Cu plate, and then reflow treatment is performed, so that the Cu—Sn alloy coating layer and the Sn coating layer are formed on the surface of the base material in this order. It has also been proposed to reduce the insertion force of the terminal by forming it (see, for example, Patent Document 2). Further, by performing electroplating using a tin plating solution to which carbon particles and an aromatic carbonyl compound are added, a film made of a composite material containing carbon particles in a tin layer is formed on the material, thereby forming a terminal. It has also been proposed to reduce the insertion force (see, for example, Patent Document 3).
しかし、特許文献1〜3端子では、嵌合部の挿入力を低下させることはできるが、半田付け部の半田濡れ性が低下するという問題があり、また、特許文献1および2の端子では、リフロー処理を行う必要があるので、その分だけ工数やコストが増加するという問題もある。そのため、嵌合部の挿入力の低下と半田付け部の半田濡れ性の向上の両立が可能な端子の材料として使用することができるめっき材が望まれている。 However, in Patent Literatures 1 to 3, the insertion force of the fitting portion can be reduced, but there is a problem that the solder wettability of the soldering portion is reduced. In addition, in the terminals of Patent Literatures 1 and 2, Since it is necessary to perform reflow processing, there is a problem that man-hours and costs increase accordingly. Therefore, there is a demand for a plating material that can be used as a material for a terminal capable of both reducing the insertion force of the fitting portion and improving the solder wettability of the soldering portion.
したがって、本発明は、このような従来の問題点に鑑み、リフロー処理を行う必要がなく、摩擦係数が低く、嵌合部の挿入力の低下と半田付け部の半田濡れ性の向上の両立が可能な端子の材料として使用することができる、複合めっき材およびその製造方法を提供することを目的とする。 Therefore, in view of such a conventional problem, the present invention does not require reflow processing, has a low friction coefficient, and achieves both reduction in insertion force of the fitting portion and improvement in solder wettability of the soldering portion. It aims at providing the composite plating material which can be used as a material of a possible terminal, and its manufacturing method.
本発明者らは、上記課題を解決するために鋭意研究した結果、錫めっき液に炭素粒子を添加した複合めっき液を使用して電気めっきを行うことにより、錫層中に炭素粒子を含有する複合材からなる皮膜を素材上に形成する複合めっき材の製造方法において、複合めっき液のレイノルズ数を18000以上にした状態で電気めっきを行えば、リフロー処理を行う必要がなく、摩擦係数が低く、嵌合部の挿入力の低下と半田付け部の半田濡れ性の向上の両立が可能な端子の材料として使用することができる、複合めっき材を製造することができることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the inventors of the present invention include carbon particles in a tin layer by performing electroplating using a composite plating solution in which carbon particles are added to a tin plating solution. In the method of manufacturing a composite plating material for forming a coating film made of a composite material, if electroplating is performed in a state where the Reynolds number of the composite plating solution is 18000 or more, there is no need to perform reflow treatment, and the friction coefficient is low. And found that a composite plating material can be produced that can be used as a material for a terminal capable of both reducing the insertion force of the fitting portion and improving the solder wettability of the soldering portion, and completed the present invention. It came to do.
すなわち、本発明による複合めっき材の製造方法は、錫めっき液に炭素粒子を添加した複合めっき液を使用して電気めっきを行うことにより、錫層中に炭素粒子を含有する複合材からなる皮膜を素材上に形成する複合めっき材の製造方法において、複合めっき液のレイノルズ数を18000以上にした状態で電気めっきを行うことを特徴とする。この複合めっき材の製造方法において、複合めっき液を攪拌翼の回転により攪拌することによってレイノルズ数を18000以上にしてもよいし、あるいは、複合めっき液をポンプで圧送して攪拌することによってレイノルズ数を18000以上にしてもよい。また、複合めっき液に芳香族カルボニル化合物が添加されているのが好ましい。 That is, the method for producing a composite plating material according to the present invention includes a film comprising a composite material containing carbon particles in a tin layer by performing electroplating using a composite plating solution in which carbon particles are added to a tin plating solution. In the method for producing a composite plating material on the material, electroplating is performed in a state where the Reynolds number of the composite plating solution is 18000 or more. In this method of manufacturing a composite plating material, the Reynolds number may be increased to 18000 or more by stirring the composite plating solution by rotating a stirring blade, or the Reynolds number by pumping and stirring the composite plating solution. May be 18000 or more. Moreover, it is preferable that an aromatic carbonyl compound is added to the composite plating solution.
また、本発明による複合めっき材は、錫層中に炭素粒子を含有する複合材からなる皮膜が素材上に形成され、同種同士の摩擦係数が0.19以下であり、フラックスによる処理を行わないで半田濡れ性を評価した際のゼロクロスタイムが5秒以下であることを特徴とする。この複合めっき材において、上記の摩擦係数が0.15以下であるのが好ましく、皮膜の厚さが0.5〜3.0μm以下であるのが好ましい。また、皮膜中の炭素含有量が1.0〜3.0質量%であるのが好ましく、接触抵抗が1.0mΩ以下であるのが好ましい。 In the composite plating material according to the present invention, a coating made of a composite material containing carbon particles in a tin layer is formed on the material, and the friction coefficient between the same species is 0.19 or less, and the treatment with flux is not performed. The zero cross time when evaluating the solder wettability is 5 seconds or less. In this composite plating material, the coefficient of friction is preferably 0.15 or less, and the thickness of the film is preferably 0.5 to 3.0 μm or less. Further, the carbon content in the film is preferably 1.0 to 3.0% by mass, and the contact resistance is preferably 1.0 mΩ or less.
本発明によれば、リフロー処理を行う必要がなく、摩擦係数が低く、嵌合部の挿入力の低下と半田付け部の半田濡れ性の向上の両立が可能な端子の材料として使用することができる、複合めっき材を製造することができる。 According to the present invention, it is not necessary to perform a reflow process, the friction coefficient is low, and it can be used as a material for a terminal capable of both reducing the insertion force of the fitting portion and improving the solder wettability of the soldering portion. A composite plating material can be manufactured.
本発明による複合めっき材の製造方法の実施の形態では、錫めっき液に炭素粒子を添加した複合めっき液を使用して電気めっきを行うことにより、錫層中に炭素粒子を含有する複合材からなる皮膜を素材上に形成する複合めっき材の製造方法において、複合めっき液の流れの状態を示すレイノルズ数を18000以上にした状態で電気めっきを行う。複合めっき液のレイノルズ数を18000以上にするために、複合めっき液を攪拌翼の回転により攪拌してもよいし、複合めっき液をポンプで圧送して攪拌してもよい。 In the embodiment of the method for producing a composite plating material according to the present invention, by performing electroplating using a composite plating solution in which carbon particles are added to a tin plating solution, the composite material containing carbon particles in the tin layer is used. In the method for manufacturing a composite plating material for forming a coating film on a material, electroplating is performed in a state where the Reynolds number indicating the flow state of the composite plating solution is 18000 or more. In order to set the Reynolds number of the composite plating solution to 18000 or more, the composite plating solution may be stirred by rotation of a stirring blade, or the composite plating solution may be pumped and stirred.
複合めっき液のレイノルズ数を18000以上にすることにより、従来の錫層中に炭素粒子が分散した複合めっき層(Sn−Cめっき層)の半田濡れ性を劇的に向上させることができる。このように複合めっき液のレイノルズ数を18000以上にした状態で電気めっきにより形成されためっき層を顕微鏡で観察すると、めっき層の表面が平滑になり、Snの粒界のサイズが小さくなるのが観察され、このようなめっき層の表面の平滑化とSnの粒界のサイズが減少により、複合めっき材の半田濡れ性が向上すると考えられる。 By setting the Reynolds number of the composite plating solution to 18000 or more, the solder wettability of the composite plating layer (Sn—C plating layer) in which carbon particles are dispersed in the conventional tin layer can be dramatically improved. Thus, when the plating layer formed by electroplating in a state where the Reynolds number of the composite plating solution is 18000 or more is observed with a microscope, the surface of the plating layer becomes smooth, and the size of the Sn grain boundary becomes small. It is observed that the solder wettability of the composite plating material is improved by smoothing the surface of the plating layer and reducing the size of the Sn grain boundary.
なお、レイノルズ数(Re)は、流れの状態を表す無次元数であり、流れの状態は、Re<2100の場合に層流、2100<Re<4000の場合に遷移流、Re>4000の場合に乱流に分類される。 The Reynolds number (Re) is a dimensionless number representing the flow state. The flow state is laminar when Re <2100, transition flow when 2100 <Re <4000, and Re> 4000. Classified as turbulent.
図1に示すように、めっき槽12として円筒形の容器を使用し、ポンプ14でめっき液16を矢印の方向に送液することによってめっき液16を攪拌するめっき装置10を使用する場合、めっき液の粘度をμ(kg/(m・s))、めっき液の密度をρ(kg/m3)、流れの代表長さをd(m)、流速をu(m/s)とすると、レイノルズ数(Re)は、Re=duρ/μで表される。例えば、めっき液の粘度μ=1mPa・s=0.001kg/(m・s)、めっき液の密度ρ=1130kg/m3、流れの代表長さd=0.30m、流速u=0.18m/sとすれば、Re=61020になる。
As shown in FIG. 1, when using a cylindrical container as the
また、図2に示すように、めっき槽112として円筒形の容器を使用し、このめっき槽112内に配置された攪拌翼114を矢印の方向に回転させることによってめっき液116を攪拌するめっき装置110を使用する場合、めっき液の粘度をμ(kg/(m・s))、めっき液の密度をρ(kg/m3)、攪拌翼の直径をd(m)、攪拌翼の回転数をn(1/s)とすると、レイノルズ数(Re)は、Re=nd2ρ/μで表される。例えば、めっき液の粘度μ=1mPa・s=0.001kg/(m・s)、めっき液の密度ρ=1130kg/m3、攪拌翼の直径d=0.035m、攪拌翼の回転数n=1000rpm=1000/60(1/s)とすれば、Re=23071になる。なお、図2において、参照符号118は陽極(Sn電極)、120は陰極(ワーク)を示している。
Further, as shown in FIG. 2, a plating apparatus that uses a cylindrical container as the
錫めっき液としては、硫酸や有機酸などからなる様々な錫めっき液を使用することができるが、アルカノールスルホン酸からなる錫めっき液を使用するのが好ましい。この錫めっき液に添加する炭素粒子としては、様々な炭素粒子を使用することができるが、鱗片状や土状のグラファイト粒子を使用するのが好ましい。 As the tin plating solution, various tin plating solutions made of sulfuric acid or organic acid can be used, but a tin plating solution made of alkanol sulfonic acid is preferably used. Various carbon particles can be used as the carbon particles added to the tin plating solution, but it is preferable to use scale-like or earth-like graphite particles.
また、錫めっき液に炭素粒子を添加した複合めっき液には、さらに芳香族カルボニル化合物を添加するのが好ましい。芳香族カルボニル化合物としては、芳香族アルデヒドまたは芳香族ケトンを使用するのが好ましい。錫めっき液に芳香族カルボニル化合物を添加することにより、錫めっき液中において炭素粒子が弱い凝集の分散状態になり、錫マトリクス中に炭素粒子が島状に分散された皮膜を形成することができる。このように錫マトリクス中の炭素粒子の凝集状態を制御することによって非常に低い摩擦係数の皮膜を形成することができる。 Moreover, it is preferable to further add an aromatic carbonyl compound to the composite plating solution obtained by adding carbon particles to the tin plating solution. As the aromatic carbonyl compound, an aromatic aldehyde or an aromatic ketone is preferably used. By adding an aromatic carbonyl compound to the tin plating solution, the carbon particles become weakly aggregated and dispersed in the tin plating solution, and a film in which the carbon particles are dispersed in an island shape in the tin matrix can be formed. . Thus, a film having a very low friction coefficient can be formed by controlling the aggregation state of the carbon particles in the tin matrix.
錫めっき液中の炭素粒子の濃度は、50g/L未満であるのが好ましく、1〜40g/Lであるのがさらに好ましく、5〜30g/Lであるのが最も好ましい。1g/L未満では、炭素粒子が表面構造を構築して複合化するには不十分であり、50g/L以上では、炭素粒子が複合化する量が増加して、錫マトリクス中において炭素粒子が適切な凝集状態で分散された皮膜を形成することができないからである。 The concentration of carbon particles in the tin plating solution is preferably less than 50 g / L, more preferably 1 to 40 g / L, and most preferably 5 to 30 g / L. If it is less than 1 g / L, the carbon particles are insufficient to build a surface structure and complex, and if it is 50 g / L or more, the amount of carbon particles to be complexed increases, so that the carbon particles are contained in the tin matrix. This is because it is impossible to form a film dispersed in an appropriate aggregated state.
また、電気めっきの際の電流密度は5〜15A/dm2であるのが好ましい。5A/dm2未満では生産性が悪く、15A/dm2を超えるとめっきやけが生じるからである。 Moreover, it is preferable that the current density in the case of electroplating is 5-15 A / dm < 2 >. If it is less than 5 A / dm 2 , the productivity is poor, and if it exceeds 15 A / dm 2 , plating burns occur.
なお、皮膜を形成する素材としては、黄銅などの銅合金の他、鉄系またはアルミニウム系の素材を使用することができる。また、電気めっきの前に、素材の表面に(電解脱脂、水洗、酸洗、水洗などの)前処理を行うのが好ましい。 In addition, as a raw material which forms a film | membrane, an iron-type or aluminum-type raw material other than copper alloys, such as brass, can be used. Moreover, it is preferable to perform a pretreatment (such as electrolytic degreasing, washing with water, pickling, washing with water) on the surface of the material before electroplating.
本発明による錫めっき材の実施の形態は、最表面の構造に特徴があり、下地に影響されないので、下地めっきは、素材や用途に応じてSn、Cu、Niなどの様々な下地めっきから選択することができる。また、下地めっきとしてSnめっきを施すと、最表面の炭素粒子の凝集構造を変化させることなく、膜厚を厚くして耐摩耗性を向上させることができる。 Since the embodiment of the tin plating material according to the present invention is characterized by the structure of the outermost surface and is not affected by the base, the base plating is selected from various base platings such as Sn, Cu, and Ni depending on the material and application. can do. Further, when Sn plating is performed as the base plating, the wear resistance can be improved by increasing the film thickness without changing the aggregate structure of the carbon particles on the outermost surface.
上述した本発明による錫めっき材の製造方法の実施の形態により、適度に凝集した炭素粒子が錫層中に適度に分散した複合材からなる皮膜を素材上に形成され、同種同士の摩擦係数が0.19以下、好ましくは0.15以下、フラックスによる処理を行わないで半田濡れ性を評価した際のゼロクロスタイムが5秒以下、皮膜の厚さが0.5〜3.0μm、好ましくは0.5〜1.0μm、皮膜中の炭素含有量が1.0〜3.0質量%、接触抵抗が1.0mΩ以下の複合めっき材を製造することができる。 According to the embodiment of the method for producing a tin-plated material according to the present invention described above, a film made of a composite material in which appropriately aggregated carbon particles are appropriately dispersed in a tin layer is formed on the material, and the friction coefficient between the same types 0.19 or less, preferably 0.15 or less, zero cross time when solder wettability is evaluated without performing treatment with flux is 5 seconds or less, and film thickness is 0.5 to 3.0 μm, preferably 0 A composite plating material having a thickness of 0.5 to 1.0 μm, a carbon content in the film of 1.0 to 3.0 mass%, and a contact resistance of 1.0 mΩ or less can be produced.
以下、本発明による複合めっき材およびその製造方法の実施例について詳細に説明する。 Hereinafter, examples of the composite plating material and the manufacturing method thereof according to the present invention will be described in detail.
[実施例1]
まず、60g/Lの金属錫(金属錫塩としてアルカノールスルホン酸錫(ユケン工業製のメタスSM)600mL/Lを含む)と113g/Lの遊離酸(遊離酸としてアルカノールスルホン酸(ユケン工業製のメタスAM)130mL/Lを含む)とを含む錫めっき液を用意した。この錫めっき液に、良好な錫めっき皮膜を得るために錫めっき用の界面活性剤(ユケン工業製のメタスLSA−M)20mL/Lを添加し、平均粒径3.4μmの鱗片状グラファイト粒子(エスイーシー社製のグラファイトSGP−3)5g/Lを添加して分散させるとともに、グラファイト粒子の凝集状態を制御するために芳香族カルボニル化合物としてベンズアルデヒド30mL/Lを添加して、複合めっき液を用意した。なお、グラファイト粒子の平均粒径は、グラファイト粒子0.5gを0.2質量%のヘキサメタリン酸ナトリウム溶液50gに分散させ、さらに超音波により分散させた後、レーザー光散乱粒度分布測定装置を用いて測定し、累積分布で50%の粒径を平均粒径とすることにより求めた。
[Example 1]
First, 60 g / L of metallic tin (containing 600 mL / L of tin alkanol sulfonate (Metas SM manufactured by Yuken Industry) as a metal tin salt) and 113 g / L of free acid (alkanol sulfonic acid (manufactured by YUKEN Industry Co., Ltd. as a free acid)) METASU AM) containing 130 mL / L) was prepared. In order to obtain a good tin plating film, 20 mL / L of a tin plating surfactant (Metas LSA-M manufactured by Yuken Industry) was added to the tin plating solution, and flaky graphite particles having an average particle size of 3.4 μm. (Graphic SGP-3 manufactured by ESC) 5 g / L was added and dispersed, and benzaldehyde 30 mL / L was added as an aromatic carbonyl compound to control the aggregation state of the graphite particles, and a composite plating solution was prepared. did. The average particle size of the graphite particles was determined by dispersing 0.5 g of graphite particles in 50 g of a 0.2 mass% sodium hexametaphosphate solution and further dispersing by ultrasonic waves, and then using a laser light scattering particle size distribution measuring device. It was determined by measuring and taking 50% of the cumulative distribution as the average particle size.
次に、図1に示しためっき装置のめっき槽(直径300mm円筒状の容器)内に、厚さ0.25mmのCu−Ni−Sn合金材(DOWAメタルテック株式会社製のNB−109EH)からなる素材と、陽極としての錫板を配置し、上記の複合めっき液を充填し、複合めっき液の流速が0.18m/s(複合めっき液の粘度が0.001kg/(m・s)、複合めっき液の比重が1130kg/m3であり、レイノルズ数(Re)は、Re=duρ/μ=61020)になるようにポンプの送液量を設定して、ポンプでめっき液を送液することにより攪拌しながら、液温25℃、電流密度10A/dm2で電気めっきを行い、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。なお、複合めっき皮膜の膜厚は、蛍光X線膜厚測定法により4点の平均値から算出した。 Next, from the Cu-Ni-Sn alloy material (NB-109EH manufactured by DOWA Metaltech Co., Ltd.) having a thickness of 0.25 mm in the plating tank (300 mm diameter cylindrical container) of the plating apparatus shown in FIG. The material and the tin plate as the anode are arranged and filled with the above composite plating solution, the flow rate of the composite plating solution is 0.18 m / s (the viscosity of the composite plating solution is 0.001 kg / (m · s), The liquid feeding amount of the pump is set so that the specific gravity of the composite plating solution is 1130 kg / m 3 and the Reynolds number (Re) is Re = duρ / μ = 61020), and the plating solution is fed by the pump. While being stirred, electroplating was performed at a liquid temperature of 25 ° C. and a current density of 10 A / dm 2 to prepare a composite plating material on which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed. In addition, the film thickness of the composite plating film was calculated from the average value of 4 points by the fluorescent X-ray film thickness measurement method.
得られた複合めっき材について、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行った。半田濡れ性はゼロクロスタイムから評価し、摩擦係数、ゼロクロスタイム、炭素含有量および接触抵抗の測定は、それぞれ3回行って、その平均値によって評価した。 About the obtained composite plating material, the friction coefficient, solder wettability, carbon content, and contact resistance were evaluated. The solder wettability was evaluated from the zero cross time, and the coefficient of friction, zero cross time, carbon content, and contact resistance were measured three times, and the average value was evaluated.
複合めっき材の摩擦係数については、得られた複合めっき材から切り出した2つの試験片同士の摩擦係数を求めた。この摩擦係数は、得られた錫めっき材から切り出した一方の試験片を金型プレスによってインデント加工(R3mm)して圧子とするとともに、平板状の他方の試験片をベース側の評価試料とし、ロードセルを使用して、圧子を接触加重3Nで評価試料の表面に押し付けながら摺動速度60mm/分で滑らせ、摩擦係数測定器(株式会社山崎精機研究所製の電気接点シュミレータCRS−1)により、摺動距離7mmのうち摺動距離2〜5mmにおける摩擦係数の平均値を算出することによって求めた。その結果、本実施例では、摩擦係数は0.07であった。 About the friction coefficient of the composite plating material, the friction coefficient of the two test pieces cut out from the obtained composite plating material was calculated | required. This coefficient of friction was obtained by indenting (R3 mm) one test piece cut out from the obtained tin-plated material into an indenter, and using the other flat test piece as a base side evaluation sample, Using a load cell, the indenter was slid at a sliding speed of 60 mm / min while pressing the indenter against the surface of the evaluation sample with a contact load of 3 N. The average value of the coefficient of friction at a sliding distance of 2 to 5 mm out of a sliding distance of 7 mm was obtained. As a result, in this example, the coefficient of friction was 0.07.
複合めっき材の半田濡れ性を評価は、得られた複合めっき材から切り出した試験片(10mm×25mm)にフラックス(タムラ化研製のUFL-300R)による処理を行った試験片と行わなかった試験片を、それぞれ半田浴(Sn−37Pb、200℃±1℃)に浸漬速度20±5mm/秒、浸漬時間10±1秒、浸漬深さ2mmで浸漬したときのゼロクロスタイム(浸漬してから浸漬部分が濡れるまでの時間(半田濡れ時間))を測定することによって行った。なお、この測定は、JIS
C 0053のメニスコ条件に従って、メニスコ試験機(株式会社レスカ製のSAT-5100)により行った。その結果、フラックスによる処理を行った場合のゼロクロスタイムは1.6秒であり、フラックス処理を行わない場合のゼロクロスタイムは3.1秒であった。特に、複合めっき材の半田濡れ性は、フラックスによる処理を行わないで評価した方が直接評価することができ、フラックスによる処理を行わない場合のゼロクロスタイムが5秒以下の場合(5秒以内で濡れる場合)に半田濡れ性が良好であると評価した。
The evaluation of the solder wettability of the composite plating material was performed using a test piece (10 mm × 25 mm) cut out from the obtained composite plating material and a test piece that was treated with a flux (UFL-300R manufactured by Tamura Chemical Research). Zero cross time when the pieces were immersed in a solder bath (Sn-37Pb, 200 ° C. ± 1 ° C.) at an immersion speed of 20 ± 5 mm / second, an immersion time of 10 ± 1 second, and an immersion depth of 2 mm (immersion after immersion) This was carried out by measuring the time until the part was wet (solder wet time). This measurement is based on JIS
According to the menisco conditions of C 0053, the test was performed with a menisco testing machine (SAT-5100 manufactured by Reska Co., Ltd.). As a result, the zero cross time when the flux treatment was performed was 1.6 seconds, and the zero cross time when the flux treatment was not performed was 3.1 seconds. In particular, the solder wettability of the composite plating material can be directly evaluated if it is evaluated without performing the treatment with the flux, and the zero cross time when the treatment with the flux is not performed is 5 seconds or less (within 5 seconds). When wet, the solder wettability was evaluated as good.
複合めっき皮膜中の炭素含有量は、得られた複合めっき材(素材を含む)から切り出した試験片を錫および炭素の分析用にそれぞれ用意し、試験片中の錫の含有量X(質量%)と複合めっきを施していない素材中の錫の含有量Y(質量%)をICP装置(ジャーレルアッシュ社製のIRIS/AR)を用いてプラズマ分光分析法によって求めるともに、試験片中の炭素の含有量Z(質量%)を微量炭素・硫黄分析装置(堀場製作所製のEMIA−U510)を用いて燃焼赤外線吸収法によって求め、Z×100/(X−Y+Z)として算出した。その結果、本実施例では、炭素含有量が1.4質量%であった。 The carbon content in the composite plating film was determined by preparing test pieces cut out from the obtained composite plating material (including raw materials) for the analysis of tin and carbon, respectively, and the tin content X (mass%) in the test pieces. ) And tin content Y (mass%) in the material not subjected to composite plating is obtained by plasma spectroscopy using an ICP apparatus (IRIS / AR manufactured by Jarrel Ash), and carbon in the test piece Content Z (mass%) was determined by a combustion infrared absorption method using a trace carbon / sulfur analyzer (EMIA-U510 manufactured by Horiba Seisakusho) and calculated as Z × 100 / (XY + Z). As a result, in this example, the carbon content was 1.4% by mass.
複合めっき材の接触抵抗は、JIS C5402の交流四端子法によって、開放電圧200mV、電流10mAで摺動荷重を0〜100gfに変化させ、100gfのときの値を測定した。その結果、接触抵抗は0.60mΩであった。 The contact resistance of the composite plating material was measured by changing the sliding load from 0 to 100 gf with an open circuit voltage of 200 mV and a current of 10 mA by the AC four-terminal method of JIS C5402, and measuring the value at 100 gf. As a result, the contact resistance was 0.60 mΩ.
[実施例2]
円筒形のめっき槽の内径が100mmの図2のめっき装置と同様のめっき装置を用意し、直径35mmで高さ14mmの攪拌翼と、70mm×80mmの大きさの陰極(Sn電極)と、70mm×100mmの大きさの陽極(ワーク)を使用し、めっき槽内に実施例1と同様の複合めっき液0.9Lを入れて複合めっき液の高さ115mmとし、攪拌翼を1000rpmで回転させて攪拌しながら(レイノルズ数(Re)は、Re=nd2ρ/μ=23071になるように)電気めっきを行った以外は、実施例1と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.07、フラックスによる処理を行った場合のゼロクロスタイムは1.5秒、フラックス処理を行わない場合のゼロクロスタイムは3.7秒、炭素含有量は1.6質量%、接触抵抗は0.62mΩであった。
[Example 2]
A plating apparatus similar to the plating apparatus of FIG. 2 having an inner diameter of a cylindrical plating tank of 100 mm is prepared, a stirring blade having a diameter of 35 mm and a height of 14 mm, a cathode (Sn electrode) having a size of 70 mm × 80 mm, and 70 mm Using an anode (workpiece) with a size of × 100 mm, putting 0.9 L of the same composite plating solution as in Example 1 in the plating tank to a height of 115 mm of the composite plating solution, and rotating the stirring blade at 1000 rpm Except for performing electroplating while stirring (reynolds number (Re) is Re = nd 2 ρ / μ = 23071), tin and graphite having a film thickness of 1.0 μm are formed in the same manner as in Example 1. A composite plating material on which a composite plating film of particles was formed was produced. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.07 and the process by a flux was performed. In this case, the zero cross time was 1.5 seconds, the zero cross time when the flux treatment was not performed was 3.7 seconds, the carbon content was 1.6 mass%, and the contact resistance was 0.62 mΩ.
[実施例3]
錫めっき液に添加するグラファイト粒子の量を20g/Lにし、攪拌翼の回転数を800rpm(レイノルズ数Re=18457)にした以外は、実施例2と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.10、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.8秒、炭素含有量は1.4質量%、接触抵抗は0.71mΩであった。
[Example 3]
A tin film having a thickness of 1.0 μm was formed in the same manner as in Example 2 except that the amount of graphite particles added to the tin plating solution was 20 g / L and the rotation speed of the stirring blade was 800 rpm (Reynolds number Re = 18457). A composite plating material on which a composite plating film of graphite particles was formed was prepared. About the obtained composite plating material, when the friction coefficient, the solder wettability, the carbon content and the contact resistance were evaluated by the same method as in Example 1, the friction coefficient was 0.10, and the treatment with the flux was performed. The zero cross time in the case was 1.8 seconds, the zero cross time in the case where the flux treatment was not performed was 3.8 seconds, the carbon content was 1.4 mass%, and the contact resistance was 0.71 mΩ.
[実施例4]
錫めっき液に添加するグラファイト粒子の量を5g/Lにした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.13、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.3秒、炭素含有量は1.0質量%、接触抵抗は0.71mΩであった。
[Example 4]
A composite plating material in which a composite plating film of tin and graphite particles having a thickness of 1.0 μm was formed by the same method as in Example 3 except that the amount of graphite particles added to the tin plating solution was changed to 5 g / L. did. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.13 and it processed with the flux. In this case, the zero cross time was 1.8 seconds, the zero cross time when the flux treatment was not performed was 3.3 seconds, the carbon content was 1.0 mass%, and the contact resistance was 0.71 mΩ.
[実施例5]
めっき時間を調整して複合めっき皮膜の厚さを0.55μmにした以外は、実施例3と同じ方法により、錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.15、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.5秒、炭素含有量は1.0質量%、接触抵抗は0.91mΩであった。
[Example 5]
A composite plating material on which a composite plating film of tin and graphite particles was formed was produced by the same method as in Example 3 except that the plating time was adjusted to 0.55 μm. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.15 and the process by a flux was performed. In this case, the zero cross time was 1.8 seconds, the zero cross time when the flux treatment was not performed was 3.5 seconds, the carbon content was 1.0 mass%, and the contact resistance was 0.91 mΩ.
[実施例6]
めっき時間を調整して複合めっき皮膜の厚さを3.0μmにした以外は、実施例3と同じ方法により、錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.09、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.3秒、炭素含有量は1.5質量%、接触抵抗は0.61mΩであった。
[Example 6]
A composite plating material on which a composite plating film of tin and graphite particles was formed was produced in the same manner as in Example 3 except that the plating time was adjusted to 3.0 μm. About the obtained composite plating material, when the friction coefficient, the solder wettability, the carbon content and the contact resistance were evaluated by the same method as in Example 1, the friction coefficient was 0.09, and the treatment with the flux was performed. The zero cross time in the case was 1.8 seconds, the zero cross time in the case where the flux treatment was not performed was 3.3 seconds, the carbon content was 1.5 mass%, and the contact resistance was 0.61 mΩ.
[実施例7]
めっき液に添加するグラファイト粒子の量を50g/Lにした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.09、フラックスによる処理を行った場合のゼロクロスタイムは1.9秒、フラックス処理を行わない場合のゼロクロスタイムは3.8秒、炭素含有量は2.7質量%、接触抵抗は1.00mΩであった。
[Example 7]
A composite plating material on which a composite plating film of tin and graphite particles having a thickness of 1.0 μm was formed was produced in the same manner as in Example 3 except that the amount of graphite particles added to the plating solution was 50 g / L. . About the obtained composite plating material, when the friction coefficient, the solder wettability, the carbon content and the contact resistance were evaluated by the same method as in Example 1, the friction coefficient was 0.09, and the treatment with the flux was performed. In this case, the zero cross time was 1.9 seconds, the zero cross time without the flux treatment was 3.8 seconds, the carbon content was 2.7% by mass, and the contact resistance was 1.00 mΩ.
[比較例1]
錫めっき液にグラファイト粒子を添加しなかった以外は、実施例1と同じ方法により、無光沢Snめっきを行って、厚さ1.0μmのめっき皮膜を形成した後、400℃で10秒間リフロー処理することにより、リフロー処理されたSnめっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.24、フラックスによる処理を行った場合のゼロクロスタイムは0.9秒、炭素含有量は0質量%、接触抵抗は0.67mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 1]
Except that no graphite particles were added to the tin plating solution, matte Sn plating was performed by the same method as in Example 1 to form a 1.0 μm thick plating film, and then reflow treatment at 400 ° C. for 10 seconds. By doing this, the reflow-processed Sn plating material was produced. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.24 and the process by a flux was performed. In this case, the zero crossing time was 0.9 seconds, the carbon content was 0% by mass, and the contact resistance was 0.67 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例2]
攪拌翼の回転数をゼロ(レイノルズ数Re=0)にした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.16、フラックスによる処理を行った場合のゼロクロスタイムは2.1秒、炭素含有量は1.3質量%、接触抵抗は1.40mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 2]
A composite plating material on which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed by the same method as in Example 3 except that the rotation speed of the stirring blade was set to zero (Reynolds number Re = 0). did. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.16 and the process by a flux was performed. In this case, the zero crossing time was 2.1 seconds, the carbon content was 1.3% by mass, and the contact resistance was 1.40 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例3]
攪拌翼の回転数を50rpm(レイノルズ数Re=1154)にした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.11、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、炭素含有量は1.5質量%、接触抵抗は0.57mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 3]
A composite plating material on which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed by the same method as in Example 3 except that the rotation speed of the stirring blade was changed to 50 rpm (Reynolds number Re = 1154). did. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.11, and the process by a flux was performed. In this case, the zero cross time was 1.8 seconds, the carbon content was 1.5 mass%, and the contact resistance was 0.57 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例4]
攪拌翼の回転数を100rpm(レイノルズ数Re=2307)にした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.11、フラックスによる処理を行った場合のゼロクロスタイムは2.0秒、炭素含有量は1.6質量%、接触抵抗は1.20mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 4]
A composite plating material on which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed by the same method as in Example 3 except that the rotation speed of the stirring blade was changed to 100 rpm (Reynolds number Re = 2307). did. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.11, and the process by a flux was performed. In this case, the zero crossing time was 2.0 seconds, the carbon content was 1.6% by mass, and the contact resistance was 1.20 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例5]
錫めっき液に添加するグラファイト粒子の量を5g/Lにし、攪拌翼の回転数を500rpm(レイノルズ数Re=11535)にした以外は、実施例2と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.13、フラックスによる処理を行った場合のゼロクロスタイムは2.0秒、炭素含有量は1.0質量%、接触抵抗は0.65mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 5]
Except that the amount of graphite particles added to the tin plating solution was changed to 5 g / L and the rotation speed of the stirring blade was changed to 500 rpm (Reynolds number Re = 1535), tin having a film thickness of 1.0 μm was obtained in the same manner as in Example 2. A composite plating material on which a composite plating film of graphite particles was formed was prepared. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.13 and it processed with the flux. In this case, the zero crossing time was 2.0 seconds, the carbon content was 1.0 mass%, and the contact resistance was 0.65 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例6]
攪拌翼の回転数を600rpm(レイノルズ数Re=13847)にした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.09、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、炭素含有量は1.4質量%、接触抵抗は0.83mΩであった。なお、フラックス処理を行わない場合のゼロクロスタイムの測定については、半田を弾いて濡れなかったので、測定することができなかった。
[Comparative Example 6]
A composite plating material on which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed by the same method as in Example 3 except that the rotation speed of the stirring blade was 600 rpm (Reynolds number Re = 13847). did. About the obtained composite plating material, when the friction coefficient, the solder wettability, the carbon content and the contact resistance were evaluated by the same method as in Example 1, the friction coefficient was 0.09, and the treatment with the flux was performed. In this case, the zero crossing time was 1.8 seconds, the carbon content was 1.4% by mass, and the contact resistance was 0.83 mΩ. In addition, about the measurement of the zero crossing time when not performing a flux process, since it did not get wet by flipping a solder, it was not able to be measured.
[比較例7]
錫めっき液に添加するグラファイト粒子の量を2g/Lにした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.20、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.5秒、炭素含有量は0.7質量%、接触抵抗は0.81mΩであった。
[Comparative Example 7]
A composite plating material in which a composite plating film of tin and graphite particles having a film thickness of 1.0 μm was formed by the same method as in Example 3 except that the amount of graphite particles added to the tin plating solution was 2 g / L. did. About the obtained composite plating material, when a friction coefficient, solder wettability, carbon content, and contact resistance were evaluated by the same method as Example 1, the friction coefficient was 0.20 and the process by a flux was performed. In this case, the zero cross time was 1.8 seconds, the zero cross time when the flux treatment was not performed was 3.5 seconds, the carbon content was 0.7 mass%, and the contact resistance was 0.81 mΩ.
[比較例8]
錫めっき液に添加するグラファイト粒子の量を60g/Lにした以外は、実施例3と同じ方法により、膜厚1.0μmの錫とグラファイト粒子の複合めっき皮膜が形成された複合めっき材を作製した。得られた複合めっき材について、実施例1と同様の方法により、摩擦係数、半田濡れ性、炭素含有量および接触抵抗の評価を行ったところ、摩擦係数は0.09、フラックスによる処理を行った場合のゼロクロスタイムは1.8秒、フラックス処理を行わない場合のゼロクロスタイムは3.6秒、炭素含有量は3.1質量%、接触抵抗は2.00mΩであった
[Comparative Example 8]
A composite plating material in which a composite plating film of tin and graphite particles having a thickness of 1.0 μm was formed by the same method as in Example 3 except that the amount of graphite particles added to the tin plating solution was changed to 60 g / L. did. About the obtained composite plating material, when the friction coefficient, the solder wettability, the carbon content and the contact resistance were evaluated by the same method as in Example 1, the friction coefficient was 0.09, and the treatment with the flux was performed. In this case, the zero cross time was 1.8 seconds, the zero cross time without the flux treatment was 3.6 seconds, the carbon content was 3.1 mass%, and the contact resistance was 2.00 mΩ.
なお、実施例および比較例の結果を表1に示す。 The results of Examples and Comparative Examples are shown in Table 1.
本発明による複合めっき材は、車載用や民生用の電気配線に使用するワイヤーハーネス用コネクタの端子やPCB端子などの材料として使用することができる The composite plating material according to the present invention can be used as a material for a wire harness connector terminal or a PCB terminal used for in-vehicle or consumer electrical wiring.
10、110 めっき装置、
12、112 めっき槽
14 ポンプ
16、116 めっき液
114 攪拌翼
118 陽極(Sn電極)
120 陰極(ワーク)
10, 110 plating equipment,
12, 112
120 Cathode (work)
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JP2010168643A (en) * | 2008-12-24 | 2010-08-05 | Mitsubishi Shindoh Co Ltd | Method and apparatus for producing plated copper strip material |
CN108004585A (en) * | 2017-12-01 | 2018-05-08 | 泉州市西决三维科技有限公司 | A kind of side clamping rotating electroplating machine for circuit board processing |
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JP2006097062A (en) * | 2004-09-29 | 2006-04-13 | Dowa Mining Co Ltd | Tinning material |
JP2007002285A (en) * | 2005-06-22 | 2007-01-11 | Dowa Holdings Co Ltd | Tinned material, and method for producing the same |
JP2007092144A (en) * | 2005-09-29 | 2007-04-12 | Dowa Metaltech Kk | Composite-plated material and production method therefor |
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JP2006097062A (en) * | 2004-09-29 | 2006-04-13 | Dowa Mining Co Ltd | Tinning material |
JP2007002285A (en) * | 2005-06-22 | 2007-01-11 | Dowa Holdings Co Ltd | Tinned material, and method for producing the same |
JP2007092144A (en) * | 2005-09-29 | 2007-04-12 | Dowa Metaltech Kk | Composite-plated material and production method therefor |
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JP2010168643A (en) * | 2008-12-24 | 2010-08-05 | Mitsubishi Shindoh Co Ltd | Method and apparatus for producing plated copper strip material |
CN108004585A (en) * | 2017-12-01 | 2018-05-08 | 泉州市西决三维科技有限公司 | A kind of side clamping rotating electroplating machine for circuit board processing |
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