JP2009229607A - Method for manufacturing array substrate , array substrate, counter substrate, and method for manufacturing liquid crystal panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an array substrate which considerably reduces the time required for manufacturing process and the cost, an array substrate manufactured by this method, a counter substrate, and a method for manufacturing a liquid crystal panel using these. <P>SOLUTION: In the method for manufacturing the array substrate using a printing method of using a plate having a pattern having a prescribed shape formed thereon to transfer an ink layer patterned on a blanket surface to an array substrate and then calcinate it, the printing method is used to form a color filter by transferring an ink layer for color filter to the array substrate and then calcinating it in a first step, and the printing method is used to transfer at least an ink layer for spacer or an ink layer for alignment projections to the array substrate having the color filter formed thereon and then calcinate it in a second step, whereby at least spacers or an aligning function element are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an array substrate manufacturing method, an array substrate, a counter substrate, and a liquid crystal panel manufacturing method.

  Conventionally, in a thin film transistor (hereinafter referred to as “TFT”) type liquid crystal panel, a liquid crystal having a color filter on array (hereinafter sometimes referred to as “COA”) structure in which a color filter is directly formed on an array substrate. Panels are known. FIG. 9 is a cross-sectional view showing an example of the configuration of a TFT type liquid crystal panel 90 having a COA structure. The TFT type liquid crystal panel 90 having the COA structure includes a color filter on array substrate 91 and a counter substrate 92 as shown in FIG. The color filter on array substrate 91 includes a switching active element 94 in which signal lines and scanning lines are formed on a glass substrate 93a, a light shielding film (black film) 95, a color filter 96, and a transparent electrode 97. The On the transparent electrode 97, in order to widen the viewing angle of the liquid crystal panel 90, hemispherical alignment protrusions (not shown) are formed. In the counter substrate 92, a transparent electrode 98 is formed on a glass substrate 93b. Alignment films 99a and 99b are formed on the mutually opposing surfaces of the color filter on array substrate 91 and the counter substrate 92. The peripheral edges of the glass substrates 93a and 93b are closed with a sealant 100, and are fixed through spherical or columnar spacers 101, and the liquid crystal 102 is filled in the gaps. Is formed. A polarizing plate or a polarizing film is affixed to the front and back surfaces of the TFT type liquid crystal panel 90, and other optical films are affixed depending on the application of the TFT type liquid crystal panel 90.

  As a method for forming a color filter in the TFT type liquid crystal panel 90 having the COA structure as described above, for example, in Patent Document 1 and Patent Document 2, a pigment dispersion method is used.

  In the pigment dispersion method, for example, when three color filters of red (R), green (G), and blue (B) and a black (K) light-shielding film are formed, the black pigment is first dispersed. After the ink is applied to the array substrate, a colored layer having a predetermined pattern is formed through steps such as pre-baking (pre-drying), exposure, development, and baking. Subsequently, the same process is repeated to form colored layers of red (R), green (G), and blue (B), and thus the process is long and complicated. In addition, since a process using such a photolithographic method requires the same number of colors as the number of expensive exposure machines and developing machines, the installation area of the production facility becomes large and a large amount of money is required. Furthermore, since the heat treatment is performed many times, the array substrate is liable to be defective, and the probability of discarding the expensive array substrate is increased, leading to a further cost increase.

  In recent years, a method for forming a color filter using a letterpress reversal offset printing method has attracted attention as a method for solving the above problems. The letterpress reversal offset printing method is a method in which an ink composed of a polymer resin or the like is applied to a blanket surface such as a silicon blanket so that the film thickness is uniform, and then a blanket having an ink layer formed on the surface and the letterpress. This is a printing method in which an unnecessary ink layer is transferred to and removed from a convex portion of a relief printing plate, and the ink layer remaining on the blanket surface is transferred to a printing material. In Patent Document 3, by using the above-described relief reversal offset printing method capable of continuous lamination (wet-on-wet), a significant cost reduction can be achieved and the same accuracy as a color filter manufactured by a pigment dispersion method can be achieved. Manufactures color filters.

  As described above, there is a growing recognition that the letterpress inversion offset printing method is very suitable as a method for forming a color filter on a high-value-added array substrate on which switching active elements are formed.

JP 2000-29069 A JP 2001-330851 A JP 2001-56405 A

  In the array substrate manufacturing method disclosed in Patent Documents 1 to 3, a spacer 101 made of glass or the like is used, and a pattern is formed on the alignment protrusions using a photoresist or the like, which is thermally fused to form a hemisphere. Since a material having a shape or the like is used, there is a problem in that each material and manufacturing method are different, the installation area of the manufacturing facility becomes large, the time required for the manufacturing process becomes long, and the cost increases.

  In addition, in the conventional method for manufacturing a liquid crystal panel, after bonding the array substrate and the counter substrate, for example, a film having a polarizing function such as a polarizing film, a retardation function, and an illumination function is pasted on the back surface of the liquid crystal panel. In order to match, it is necessary to provide a process for inverting the back surface of the liquid crystal panel, and there is a problem that the production efficiency is poor.

  The present invention has been made in view of the above-mentioned problems, and its purpose is to reduce the installation area of the manufacturing equipment, greatly reduce the time required for the manufacturing process, and achieve a significant cost reduction. It is to provide a method for manufacturing an array substrate, an array substrate manufactured by the method, a counter substrate, and a method for manufacturing a liquid crystal panel using them.

The present invention is an array substrate manufacturing method using a printing method in which an ink layer patterned on a blanket surface is transferred to an array substrate using a plate on which a pattern having a predetermined shape is formed, and then baked.
A method of manufacturing an array substrate, comprising: forming a color filter by transferring an ink layer for a color filter to the array substrate using the printing method and then baking the ink layer.

  Further, the present invention uses the printing method to transfer at least the spacer ink layer or the alignment functional element ink layer to the array substrate on which the color filter is formed, and then firing it, thereby at least the spacer or alignment. And a step of forming a functional element.

  The array substrate manufacturing method of the present invention is configured such that the viscosity of the spacer ink is greater than the viscosity of the alignment functional element ink, and the spacer ink viscosity is 2 cps to 100 cps, The viscosity of the ink for the orientation functional element is 2 cps to 50 cps.

  The array substrate manufacturing method of the present invention is characterized in that, in the second step, when the spacer and the alignment functional element are formed, the spacer is formed first.

  In the array substrate manufacturing method of the present invention, the printing method is a relief reversal offset printing method.

In the array substrate manufacturing method of the present invention, in the first step, whether or not the array substrate to which the ink layer has been transferred is defective after transferring the color filter ink layer and before firing. A first inspection step for determining whether or not
A first removal step of removing the ink layer of the array substrate determined to be a defective product,
The array substrate from which the ink layer has been removed is reused in the first step.

In the array substrate manufacturing method of the present invention, in the second step, at least after the transfer of the spacer ink layer or the alignment functional element ink layer and before firing, at least the spacer ink layer or the A second inspection step for determining whether or not the array substrate to which the alignment functional element ink layer has been transferred is defective;
A second removal step of removing the ink layer of the array substrate determined to be a defective product,
The array substrate from which the ink layer has been removed is reused in the second step.

  The array substrate manufacturing method of the present invention is characterized in that, in the first removal step and the second removal step, the ink layer is removed by washing with a cleaning liquid composed of an organic solvent or an aqueous solvent.

  In the array substrate manufacturing method of the present invention, the organic solvent is acetone, ethanol or propylene glycol methyl ether acetate.

  In the array substrate manufacturing method of the present invention, the aqueous solvent is obtained by adding a surfactant to water or an alkaline solution.

  Moreover, this invention is manufactured by the said array substrate manufacturing method, It is an array substrate characterized by the above-mentioned.

Further, the present invention is a counter substrate constituting a liquid crystal panel by being bonded to the array substrate,
The counter substrate is configured by laminating a film having a polarizing function, a common electrode function, a phase difference function, and an illumination function on a transparent substrate, or by laminating a film having a phase difference function and an illumination function. This is a counter substrate.

  In the counter substrate of the present invention, the transparent substrate is made of transparent glass or transparent resin.

  The present invention is also a method for manufacturing a liquid crystal panel, wherein the array substrate and the counter substrate are bonded together, and liquid crystal is sealed in a gap between the array substrate and the counter substrate.

  According to the present invention, in an array substrate manufacturing method using a printing method in which an ink layer patterned on a blanket surface is transferred to an array substrate using a plate on which a pattern having a predetermined shape is formed, and then fired, Using the printing method, the color filter is formed by transferring the ink layer for the color filter to the array substrate and then baking. Subsequently, using the printing method, at least the spacer ink layer or the alignment functional element ink layer is transferred to the array substrate on which the color filter is formed and then baked, thereby at least the spacer or alignment layer. A functional element is formed.

  As a result, all of the color filters, spacers, and alignment functional elements can be formed by a printing method using ink as a material, so that the installation area of the manufacturing facility can be reduced, and the time required for the manufacturing process can be shortened. Further, the cost for manufacturing the COA array substrate can be reduced. Therefore, it is possible to provide an array substrate manufacturing method capable of reducing the installation area of the manufacturing facility, greatly reducing the time required for the COA array substrate manufacturing process, and achieving a significant cost reduction.

  According to the invention, the viscosity of the spacer ink is configured to be larger than the viscosity of the alignment functional element ink, and the spacer ink has a viscosity of 2 cps to 100 cps, and the alignment function The viscosity of the ink for the element is preferably 2 cps to 50 cps. Thereby, the ink layer for spacers and the ink layer for alignment protrusions having a suitable film thickness can be more reliably formed.

  According to the invention, in the second step, when forming the spacer and the alignment functional element, it is preferable to form the spacer first. Since the viscosity of the spacer ink is higher than the viscosity of the alignment protrusion ink, the shape of the spacer ink layer is easier to maintain than the alignment protrusion ink layer after transfer to the array substrate. Therefore, by forming the spacer first, it is possible to more reliably form the ink layer for the spacer and the ink layer for the alignment protrusion having a suitable shape.

  According to the invention, it is preferable that the printing method is a letterpress reverse offset printing method. As described above, in the first step, the color filter is formed using the letterpress reverse offset printing method, and in the second step, the spacer and the alignment protrusion are similarly formed using the letterpress reverse offset printing method. Since the same operation may be performed with the same apparatus in the first step and the second step, the array substrate is more efficiently compared with the case where different printing methods are used in the first step and the second step. Can be manufactured. Therefore, the time required for the manufacturing process can be further shortened, and a significant cost reduction can be achieved.

  According to the invention, in the first step, the array substrate to which the ink layer is transferred is a defective product after the color filter ink layer is transferred in the first inspection step and before firing. In the first removal step, the ink layer of the array substrate determined to be defective is removed. The array substrate from which the ink layer has been removed is preferably reused in the first step. As a result, a significant cost reduction can be achieved as compared with the case where the color filter is formed using a pigment dispersion method in which the ink layer for the color filter is removed and the array substrate cannot be reused. it can.

  According to the invention, in the second step, at least after the transfer of at least the spacer ink layer or the alignment functional element ink layer in the second inspection step and before firing, at least for the spacer. It is determined whether or not the array substrate to which the ink layer or the alignment functional element ink layer has been transferred is a defective product, and the ink layer of the array substrate that has been determined to be a defective product in the second removal step. Remove. The array substrate from which the ink layer has been removed is preferably reused in the second step. As a result, it becomes possible to reuse the array substrate by removing the spacers and alignment protrusions, which have been difficult to remove in the prior art, so that a significant cost reduction can be achieved.

  According to the invention, it is preferable that the ink layer is removed by washing with a cleaning liquid composed of an organic solvent or an aqueous solvent in the first removal step and the second removal step. As a result, the ink layer can be removed without damaging the array substrate, so that the array substrate can be reused more reliably and a significant cost reduction can be achieved.

  According to the invention, the organic solvent is preferably acetone, ethanol or propylene glycol methyl ether acetate. As a result, the ink layer can be easily removed at a lower cost, so that the time required for the manufacturing process can be further shortened, and a significant cost reduction can be achieved.

  According to the invention, it is preferable that the aqueous solvent is obtained by adding a surfactant to an alkaline solution. As a result, the ink layer can be easily removed at a lower cost, so that the time required for the manufacturing process can be further shortened, and a significant cost reduction can be achieved.

  Further, according to the present invention, an array substrate that is much cheaper than the conventional one can be provided by being manufactured by the array substrate manufacturing method.

  According to the invention, in the counter substrate constituting the liquid crystal panel by being bonded to the array substrate, the counter substrate has a common electrode function, a polarization function, a phase difference function, and an illumination function on the transparent substrate. A film is laminated or laminated. Alternatively, a film having a polarization function, a retardation function, and an illumination function is laminated or laminated. Thus, by pasting or laminating various films required in advance, it is provided when laminating or laminating the various films after laminating or laminating the array substrate and the counter substrate. Since the process of inverting the back surface of the liquid crystal panel can be omitted, the production efficiency can be further improved.

  Moreover, according to this invention, it is preferable that the said transparent substrate is comprised from transparent glass or transparent resin.

  According to the invention, in the liquid crystal panel manufacturing method of the invention, the array substrate and the counter substrate are bonded together, and liquid crystal is sealed in a gap between the array substrate and the counter substrate, or a peripheral portion of the array substrate. A UV curable sealant is applied to the substrate, and an appropriate amount of liquid crystal is dropped into the mold, and then the array substrate and the counter substrate are overlapped with each other so that the alignment films face each other. Is cured to produce a liquid crystal panel. As a result, it is possible to provide a liquid crystal panel manufacturing method capable of reducing the installation area of the manufacturing facility, greatly reducing the time required for the manufacturing process, improving the production efficiency, and achieving a significant cost reduction.

  The array substrate manufacturing method of the present invention is an array substrate manufacturing method using a printing method in which an ink layer patterned on a blanket surface is transferred to an array substrate using a plate on which a pattern having a predetermined shape is formed and then baked. Then, using the printing method in the first step, a color filter is formed by transferring the color filter ink layer to the array substrate and then firing, and using the printing method in the second step. Then, at least the spacer or the alignment functional element is formed by transferring at least the ink layer for the spacer or the ink layer for the alignment functional element to the array substrate on which the color filter is formed and then baking it.

  As a result, all of the color filters, spacers, and alignment protrusions can be formed by printing using ink as a material, so that the installation area of the manufacturing facility can be reduced, the time required for the manufacturing process can be shortened, and The cost for manufacturing the array substrate can be reduced. Therefore, it is possible to provide an array substrate manufacturing method capable of reducing the installation area of the manufacturing facility, greatly reducing the time required for the array substrate manufacturing process, and achieving a significant cost reduction.

[Array substrate manufacturing method]
Hereinafter, the printing method used in the array substrate manufacturing method of the present invention will be described. As a printing method used in the array substrate manufacturing method of the present invention, a relief reversal offset printing method may be mentioned. FIG. 1 is a cross-sectional view illustrating an outline of a letterpress reverse offset printing method, and FIG. 2 is a schematic diagram illustrating an example of a configuration of a multicolor printing machine 20 using the letterpress reverse offset printing method.

  In the relief reversal offset printing method, first, as shown in FIG. 1A, while the blanket 10 is rotated, ink is applied to the surface of the blanket 10 by the die coater 12 so that the film thickness becomes uniform. 11 is formed. Next, as shown in FIG. 1 (b), the relief plate 13 having a predetermined pattern is brought into contact with the blanket 10 to which the ink layer 11 has been applied, so that an unnecessary portion of the ink layer 11 is brought into contact with the projection 14 of the relief plate 13. Transfer to and remove. Then, as shown in FIG. 1C, after the ink layer 11 patterned on the surface of the blanket 10 is transferred to the surface of the printing body 15, the printing body 15 to which the ink layer 11 is transferred is baked. This is a printing method for printing a desired pattern on a substrate.

  A predetermined pattern is formed on the surface of the relief plate 13 used in the relief reverse printing method. That is, the convex portion 14 and the concave portion 16 are formed corresponding to the pattern actually formed on the substrate 15. The shape of the concave portion 16 between the convex portions 14 corresponds to the shape of a desired pattern. Therefore, the ink layer 11 corresponding to the shape of the desired pattern remains on the surface of the blanket 10 after the unnecessary portion of the ink layer 11 is removed. The constituent material of the relief plate 13 is not particularly limited, and examples thereof include glass, metal, and resin. The size of the relief plate 13 is preferably larger than the size of the printing medium 15.

  As shown in FIG. 2, for example, the multi-color printing machine 20 using the above-described relief reversal offset printing method includes a fixed frame 21, a platen plate 22, a printing platen 23, and four printing units 24a, 24b, 24c, 24d.

  Note that each member constituting the multicolor printing machine 20 includes four members corresponding to four types of inks configured to have different colors, viscosities, and the like. In this specification, four members corresponding to the type of ink are distinguished from each other by adding alphabets a, b, c, and d to the end of the reference symbols, and when referring collectively, only the reference symbols are used. Represented by

  The platen surface plate 22 and the printing surface plate 23 are provided on the fixed frame 21 so as to be arranged in this order from the side closer to the printing unit 24, and are configured to be movable on the fixed frame 21 in the horizontal direction. The platen plate 22 supports the four relief plates 13a, 13b, 13c, and 13d so as to correspond to the four printing units 24a, 24b, 24c, and 24d, respectively. The printing surface plate 23 supports the printing medium 15.

  The printing unit 24 is configured to be movable in the vertical direction by a lifting means (not shown), and includes a blanket 10 and a die coater 12 as shown in FIG.

  The blanket 10 is a roller-like member having releasability such as a resin repellent function and a peeling function on the surface, for example, a sheet having releasability on the surface of a body that is a roll-shaped member made of metal, resin, or the like. And those obtained by treating the surface of the body with a release agent. Examples of the sheet having releasability include a sheet made of silicon resin, fluorine resin, or the like. As described above, the blanket 10 having releasability on the surface is used to ensure that the ink layer 11 is formed on the surface of the convex portion 14 of the relief plate 13 and the surface of the printing medium 15 by utilizing the resin repellent function and the peeling function. This is for transferring. In this embodiment, as the blanket 10, a body made of iron or aluminum and having a silicon rubber sheet wound thereon is used.

  The blanket 10 is rotatably provided, and its rotational position is adjusted with high accuracy. For example, relative positioning with respect to the blanket 10, the relief plate 13 and the substrate 15 can be precisely performed by a method of forming a positioning pattern in advance. In the present embodiment, the roller blanket 10 is used. However, the present invention is not particularly limited to this, and for example, a flat plate or a belt may be used.

  The die coater 12 is an ink application unit, and causes liquid ink to flow out from a gap between opposing dies so that the ink forms an ink layer 11 having a uniform film thickness on the surface of the blanket 10. In the present embodiment, the die coater 12 is used as a means for applying ink to the blanket 10, but is not particularly limited as long as a necessary film thickness can be obtained. For example, a CAP coater, anilox, Wire bar coaters and blades may be used. The CAP coater applies ink by utilizing the capillary phenomenon, and anilox fills and applies ink to fine dents formed in the cylinder, and the wire bar coater and blade are used as a blanket. Ink is applied through a gap formed between the two.

  Hereinafter, the operation of the multicolor printer 20 will be described. First, the four printing units 24a, 24b, 24c, and 24d are filled with ink corresponding to each of the desired four types of ink. Next, while rotating the blankets 10a, 10b, 10c, and 10d, ink is applied to the surfaces by corresponding die coaters 12a, 12b, 12c, and 12d to form ink layers 11a, 11b, 11c, and 11d. At this time, it is preferable to appropriately adjust the order of formation depending on the color of the ink layer to be formed. Next, the printing units 24a, 24b, 24c, and 24d are lowered by an elevating means (not shown) and supported by the platen plate 22, and the relief plates 13a, 13b, 13c, and 13d on which a predetermined pattern is formed, and the ink layers 11a, 11b, 11c, and 11d are brought into contact with each other. Thereafter, the platen plate 22 is horizontally moved in the direction indicated by the arrow A, that is, in the direction from the printing unit 24a to 24d, and the blankets 10a, 10b, 10c, and 10d are rotated to remove unnecessary ink layers 11a, 11b, 11c, and 11d are transferred to and removed from the convex portions 14a, 14b, 14c, and 14d of the relief plates 13a, 13b, 13c, and 13d, respectively. Thereafter, the printing units 24a, 24b, 24c, 24d are once raised, the platen plate 22 is moved horizontally to a position other than the lower side of the printing units 24a, 24b, 24c, 24d, and then again the printing units 24a, 24b, 24c. , 24d is lowered to a position where it can come into contact with the printing medium 15 supported by the printing surface plate 23. Then, the printing surface plate 23 is moved horizontally in the direction of the arrow A and brought into contact with the blankets 10a, 10b, 10c, 10d in order, whereby the ink layers 11a, 11b patterned on the surfaces of the blankets 10a, 10b, 10c, 10d. , 11c, 11d are transferred to the surface of the printing medium 15 in this order. Next, a desired pattern is printed on the printing medium by inspecting and baking the printing medium 15 to which the four color ink layers 11a, 11b, 11c, and 11d are transferred.

  Next, another printing method used in the array substrate manufacturing method of the present invention will be described. Another printing method used in the array substrate manufacturing method of the present invention includes a lithographic waterless offset printing method. FIG. 3 is a cross-sectional view illustrating an outline of the lithographic waterless offset printing method, and FIG. 4 is a schematic diagram illustrating an example of the configuration of the multicolor printing machine 40 that uses the lithographic waterless offset printing method. These are the schematic diagrams which expand and show a part of composition of multi-color printing machine 40 which uses a planographic waterless offset printing method.

  In the lithographic waterless offset printing method, first, as shown in FIG. 3A, a predetermined pattern is formed by the resin-repellent portion 31 and the parent resin portion 32, which are portions subjected to the resin-repellent treatment and the parent resin treatment, respectively. The formed lithographic plate 30 is produced. Next, as shown in FIG. 3B, the ink 34 is applied onto the resin-repellent portion 31 and the parent resin portion 32 formed on the planographic plate 30 using a die coater 33. Thereafter, as shown in FIG. 3C, the ink 34 on the resin-repellent portion 31 is brought into contact with the surface of the applied ink 34 by bringing a blanket 35 having a releasability weaker than that of the resin-repellent portion 31. Is transferred onto the blanket 35. Then, as shown in FIG. 3D, after the ink layer 36 patterned on the surface of the blanket 35 is transferred to the surface of the printing medium 15, the printing medium 15 to which the ink layer 36 has been transferred is inspected and baked. This is a printing method for printing a desired pattern on a printing medium.

  A predetermined pattern is formed on the surface of the planographic plate 30 used in the planographic waterless offset printing method. That is, the resin-repellent portion 31 and the parent resin portion 32 are formed corresponding to the pattern actually formed on the substrate 15. The shape of the resin repellent portion 31 corresponds to the shape of a desired pattern. The parent resin portion 32 is formed in the remaining portion where the resin-repellent portion 31 is not formed. Therefore, the ink layer 36 corresponding to the shape of the desired pattern remains on the surface of the blanket 35 after the ink 34 on the resin-repellent portion 31 is transferred. As the lithographic plate 30, a PS (Pre-sensitized Aluminum) plate generally used for lithographic waterless printing is preferable, and examples thereof include a waterless lithographic negative type manufactured by Toray Industries, Inc. The size of the planographic plate 30 is preferably larger than the size of the printing medium 15.

  As shown in FIG. 4, for example, the multicolor printing machine 40 using the above-described lithographic waterless offset printing method includes a fixed frame 41, a printing surface plate 42, and four printing units 43a, 43b, 43c, and 43d. Prepare.

  Note that each member constituting the multicolor printing machine 40 is provided with four each corresponding to four types of inks configured to have different colors and viscosities. In this specification, four members corresponding to the type of ink are distinguished from each other by adding alphabets a, b, c, and d to the end of the reference symbols, and when referring collectively, only the reference symbols are used. Represented by

  The printing surface plate 42 is provided on the fixed frame 41 and is configured to be movable on the fixed frame 41 in the horizontal direction. The printing surface plate 42 supports the substrate 15 to be printed. As shown in FIG. 5, the printing unit 43 includes a plate cylinder 51, a blanket 35, a die coater 33, and a cleaning unit 52.

  The plate cylinder 51 is obtained by, for example, winding a lithographic plate 30 on which a predetermined pattern is formed by the above-described resin-repellent portion 31 and the parent resin portion 32 around the surface of a body that is a roll-shaped member made of metal, resin, or the like. Is. Thus, the whole apparatus can be reduced in size by making the multi-color printing machine 40 into a roll-type printing machine in which the planographic plate 30 is wound around the body.

  The blanket 35 is a roller-like member having releasability weaker than that of the resin-repellent portion 31 on the surface, for example, a sheet having releasability on the surface of the body that is a roll-shaped member made of metal, resin, or the like. And those obtained by treating the surface of the body with a release agent. Examples of the sheet having releasability include a sheet made of silicon resin, fluorine resin, or the like. Thus, the reason why the blanket 35 having releasability on the surface is used is to reliably transfer the ink layer 36 onto the surface of the printing medium 15 by utilizing the resin repellent function and the peeling function. The reason why the releasability is weaker than that of the resin-repellent portion 31 is to ensure that the ink 34 on the resin-repellent portion 31 is transferred onto the surface of the blanket 35. In this embodiment, a blanket 35 in which a silicon rubber sheet is wound around a body made of iron or aluminum is used.

  The blanket 35 is rotatably provided, and its rotational position is adjusted with high accuracy. For example, the relative alignment with the blanket 35, the plate cylinder 51, and the printing medium 15 can be precisely performed by a method of forming a positioning pattern in advance. In the present embodiment, the roller-shaped blanket 35 is used. However, the present invention is not particularly limited to this, and for example, a plate-shaped or belt-shaped one may be used.

  The die coater 33 is an ink application unit that causes liquid ink to flow out from the gap between the opposing dies so that the ink can uniformly apply the ink 34 to the surface of the plate cylinder 51. In this embodiment, the die coater 33 is used as a means for applying ink to the blanket 35. However, the die coater 33 is not particularly limited as long as a necessary film thickness can be obtained. For example, a CAP coater, a wire bar A coater and a blade may be used. The CAP coater applies ink using the capillary phenomenon, and the wire bar coater and blade apply ink through a gap formed between them and the blanket 35.

  The cleaning unit 52 is a roller-shaped member configured to be rotatable. For example, a cleaning liquid that can dissolve the ink 34, such as ethanol, is immersed in the surface of the body that is a roll-shaped member formed of metal, resin, or the like. Wrapped around a cloth that has been wrapped. When the cleaning unit 52 is pressed against the plate cylinder 51, the ink 34 remaining on the surface of the plate cylinder 51 after the transfer of the ink 34 on the resin-repellent portion 31 is removed.

  Hereinafter, the operation of the multicolor printer 40 will be described. First, the four printing units 43a, 43b, 43c, and 43d are filled with ink corresponding to each of the desired four types of ink. Next, while rotating the plate cylinders 51a, 51b, 51c, 51d around which the planographic plate 30 on which a predetermined pattern is formed by the resin-repellent portion 31 and the parent resin portion 32 is rotated, the corresponding die coaters 33a, The inks 34a, 34b, 34c, and 34d are applied by 33b, 33c, and 33d. At this time, it is preferable to appropriately adjust the application order according to the color of the ink to be applied. Then, the blankets 35a, 35b, 35c, and 35d are brought into contact with the surfaces of the applied inks 34a, 34b, 34c, and 34d while rotating, whereby the inks 34a, 34b, and 34d on the resin-repellent portions 31a, 31b, 31c, and 31d are rotated. 34c and 34d are transferred onto the blankets 35a, 35b, 35c and 35d. Next, the printing units 43a, 43b, 43c, and 43d are lowered to a position where they can contact the printing medium 15 supported by the printing surface plate 42 by lifting means (not shown). The blanket 35a, 35b, 35c, and the blanket 35a, 35b, 35c, and 35d are brought into contact with the blanket 35a, 35b, 35c, and 35d sequentially by moving the printing surface plate 42 in the direction of the arrow B, that is, in the direction from the printing unit 43a to 43d. The ink layers 36a, 36b, 36c, and 36d patterned on the surface of 35d are transferred to the surface of the printing medium 15 in this order. Next, a desired pattern is printed on the printing medium by inspecting and baking the printing medium 15 to which the four color ink layers 36a, 36b, 36c, and 36d are transferred.

  In the above configuration, the multicolor printers 20 and 40 are configured to be compatible with four colors of ink. However, the present invention is not particularly limited to this, and for example, is configured to be compatible with two colors of ink. Alternatively, it may be configured to be compatible with five or more colors of ink.

  FIG. 6 is a schematic view showing each step of the array substrate manufacturing method of the present invention. As shown in FIG. 6, the array substrate manufacturing method of the present invention includes a first process including a first transfer process, a first inspection process, a first removal process, and a first baking process, a second transfer process, and a second inspection. And a second step including a second removal step and a second firing step.

[First step]
(First transfer process)
In the first transfer step, the color filter ink layer is transferred to an array substrate on which a switching active element is formed, which is a printing body, using the above-described relief printing reverse printing method or lithographic waterless offset printing method. .
Hereinafter, the color filter ink will be described. The color filter ink is not particularly limited, and examples thereof include organic coloring inks. The organic colored ink includes a resin agent and a pigment containing a resin component and a solvent component.

  The resin component is not particularly limited as long as it is a resin that is transparent and dissolves in an appropriate solvent. For example, an acrylic resin, a methacrylic resin, an epoxy resin, a polyester resin, a urethane resin, a melamine resin, etc. At least one of them is used. These resins may be water-soluble. In addition, a material that polymerizes by heat, light, electron beam, etc. after transferring the ink layer for the color filter on which the pattern has been formed, such as a material such as a polyfunctional monomer that is a precursor of the resin component, or a crosslinking agent is mixed. Alternatively, a polymerization initiator or a crosslinking initiator may be added to further accelerate the polymerization reaction of the monomer. The content of the resin component is not particularly limited, but the resin component is preferably 10% by weight to 30% by weight with respect to 100% by weight of the organic colored ink.

  As the solvent component, alcohol-based, ketones, esters, ether-based solvents are preferable. For example, butyl cellosolve, ethyl cellosolve, n-butanol, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, ethyl acetate, butyl acetate Etc. The content of the solvent component is not particularly limited, but the solvent component is preferably 60% by weight to 90% by weight with respect to 100% by weight of the organic colored ink.

  As the colorant, a dye or a pigment can be used, and it is particularly preferable to use a pigment having excellent environmental resistance and heat resistance. Organic and inorganic pigments can be used as the pigment, and specific examples include compounds classified as pigments according to a color index (published by The Society of Dyers and Colorists). These pigments may be used alone or in combination of two or more. Specific examples of preferred pigments are described below.

  Since the pigment used in the present invention is applied to the production of a color filter, each pigment suitable for colored images such as red (R), green (G), blue (B) and black (K) is used. The In the present embodiment, the above four colors are used. Examples of the red pigment include Pigment Red 4BS (manufactured by Sanyo Color Co., Ltd.), examples of the green pigment include phthalocyanine green SAX (manufactured by Sanyo Color Co., Ltd.), and examples of the blue pigment include And phthalocyanine blue SR-150 (manufactured by Sanyo Dye Co., Ltd.). Examples of black pigments include carbon black and titanium black. The content of the pigment is not particularly limited, but is preferably 10 parts by weight or more and 30 parts by weight or less with respect to 100 parts by weight of the resin component.

  As a method for producing an organic colored ink, the above-described constituent components are mixed and dispersed to adjust a colorant corresponding to the color of each pigment. Then, organic coloring ink is produced by diluting these colorants and adjusting so that it may become a desired viscosity.

  The dispersing means used for mixing and dispersing is not particularly limited, and known means can be used. Examples thereof include a three roll mill, a two roll mill, a sand mill, an atrider, a ball mill, a kneader, and a paint shaker. . In mixing and dispersing, a dispersant may be added as appropriate in order to improve the dispersion of the pigment. Since the dispersant has an effect of helping to disperse the pigment and preventing re-aggregation after the dispersion, a color filter having more excellent transparency can be produced.

  Although it does not specifically limit as a dispersing agent, For example, the Big Chemie Japan BYK series (made by Big Chemie Japan Co., Ltd.) etc. are mentioned, What is necessary is just to select suitably with a pigment.

  As a solvent used for viscosity adjustment, solvents such as alcohols, ketones and esters are preferable, and examples thereof include ethyl acetate and propylene glycol methyl ether acetate.

  The viscosity of the color filter ink produced as described above is preferably 2 cps to 50 cps. Thereby, a pigment can fully disperse | distribute and the ink layer for color filters with a suitable film thickness can be formed more reliably. The preferred film thickness of the color filter ink layer is 1 μm to 4 μm. The viscosity herein refers to a value measured with an E-type viscometer at 20 ° C.

  In the first transfer process, when using the letterpress reversal offset printing method, first, the four printing units 24a, 24b, 24c, and 24d of the multicolor printing machine 20 are provided with black (K), red (R), and green. (G) and blue (B) color filter inks are filled in this order. Next, while rotating the blankets 10a, 10b, 10c, and 10d, the above-described inks are applied to the surfaces of the blanket 10a, 10b, 10c, and 10d by the corresponding die coaters 12a, 12b, 12c, and 12d, respectively, and the ink layers 11a, 11b, 11c, 11d is formed. At this time, it is preferable to appropriately adjust the order of formation depending on the color of the ink layer to be formed. Next, the printing units 24a, 24b, 24c, and 24d are lowered by the elevating means, and the relief plates 13a, 13b, 13c, and 13d supported by the plate surface plate 22 and the ink layers 11a, 11b, 11c, and 11d for color filters are used. And contact each other. Thereafter, the platen plate 22 is moved horizontally in the direction indicated by the arrow A and the blankets 10a, 10b, 10c, and 10d are rotated, so that unnecessary portions of the color filter ink layers 11a, 11b, 11c, and 11d are moved. It is transferred to and removed from the convex portions 14a, 14b, 14c and 14d of the relief plates 13a, 13b, 13c and 13d. Thereafter, the printing units 24a, 24b, 24c, 24d are once raised, the platen plate 22 is moved horizontally to a position other than the lower side of the printing units 24a, 24b, 24c, 24d, and then again the printing units 24a, 24b, 24c. , 24d is lowered to a position where it can come into contact with the array substrate 15 on which the switching active element is formed, which is a printing substrate supported by the printing surface plate 23. Then, the printing platen 23 is moved horizontally in the direction of the arrow A and brought into contact with the blankets 10a, 10b, 10c, and 10d in order, whereby the ink for the color filter patterned on the surface of the blankets 10a, 10b, 10c, and 10d. The layers 11a, 11b, 11c, and 11d are transferred to the surface of the array substrate 15 in this order.

  In the first transfer process, when the lithographic waterless offset printing method is used, first, the four printing units 43a, 43b, 43c, and 43d of the multicolor printer 40 are provided with black (K) and red (R ), Green (G) and blue (B) color filter inks 34a, 34b, 34c and 34d, respectively, in this order. Next, while rotating the plate cylinders 51a, 51b, 51c, and 51d, color filter inks 34a, 34b, 34c, and 34d are applied to the surfaces thereof by the corresponding die coaters 33a, 33b, 33c, and 33d, respectively. At this time, it is preferable to appropriately adjust the order of formation depending on the color of the ink to be applied. The ink for color filters on the resin-repellent portions 31a, 31b, 31c, 31d is brought into contact with the surfaces of the applied inks 34a, 34b, 34c, 34d while rotating the blankets 35a, 35b, 35c, 35d. 34a, 34b, 34c and 34d are transferred onto the blankets 35a, 35b, 35c and 35d. Next, the printing units 43a, 43b, 43c, and 43d are lowered to a position where they can contact the array substrate 15 on which the switching active elements are formed, which are supported by the printing surface plate 42, by the lifting means. Then, the printing platen 42 is moved horizontally in the direction of the arrow B and brought into contact with the blankets 35a, 35b, 35c, and 35d in order, whereby the color filter ink patterned on the surfaces of the blankets 35a, 35b, 35c, and 35d. The layers 36a, 36b, 36c, and 36d are transferred to the surface of the array substrate 15 in this order.

  In the above configuration, the black (K), red (R), green (G), and blue (B) color filter inks are filled in the printing units 24 and 43 in this order. However, the ink may be filled in an order different from the above. In particular, it is preferable that the ink is filled in the order in which the ink that is easier to dry is printed first.

(First inspection process)
In the first inspection step, it is determined whether or not the array substrate to which the color filter ink layer has been transferred in the first transfer step is a defective product.

  The inspection apparatus used in the first inspection process is not particularly limited as long as it is generally used, but the array substrate surface is irradiated with white light and the reflected light is detected. It is preferable that the inspection is performed.

  The criteria for determining whether or not the array substrate is defective is not particularly limited, and may be set as appropriate according to the desired array substrate and color filter. In the present embodiment, in the ink layer for the color filter, when the unevenness foreign matter or the appearance defect having a size that impedes the size or shape of the contact hole or the panel formation is observed, it is determined as a defective product and observed. If not, it is determined to be a non-defective product. The array substrate determined to be defective in the first inspection process is transported to the manufacturing line that performs the first removal process, and the array substrate determined to be non-defective is transported to the manufacturing line that performs the first firing process. The

(First removal step)
In the first removal step, the color filter ink layer is removed from the array substrate determined to be defective in the first inspection step.

  The method for removing the ink layer for the color filter is not particularly limited as long as it can remove the ink layer for the color filter. In particular, the ink layer is washed with a cleaning liquid composed of an organic solvent or an aqueous solvent. Is preferred.

  In this way, by using a cleaning liquid composed of an organic solvent or an aqueous solvent, the color filter ink layer can be removed without damaging the array substrate, so the array substrate can be reused more reliably. And a significant cost reduction can be achieved.

  The cleaning liquid composed of an organic solvent is preferably a solvent such as alcohols, ketones, esters, and the like that easily volatilizes, and examples thereof include ethanol and acetone. Propylene glycol methyl ether is preferred.

  As described above, since the cleaning liquid composed of the organic solvent is acetone, ethanol or propylene glycol methyl ether acetate, the ink layer for the color filter can be easily removed at a lower cost. It is possible to further reduce the time required for the process, and to achieve a further significant cost reduction.

  As a cleaning liquid composed of an aqueous solvent, a solution obtained by adding a surfactant to an alkaline solution is preferable. The alkaline solution is an aqueous solution adjusted to be alkaline with a pH of about 7 to 14 with an alkaline substance such as KOH, and its concentration is preferably about 0.01% to 1.0%. Moreover, it does not specifically limit as surfactant added to an alkaline solution, For example, (made by Kao: Emulgen) etc. are mentioned.

  As described above, since the cleaning liquid composed of the aqueous solvent is obtained by adding the surfactant to the alkaline solution, the ink layer for the color filter can be easily removed at a lower cost. The time required for the manufacturing process can be further shortened, and a further significant cost reduction can be achieved.

  The cleaning method is not particularly limited as long as it is a method that can remove the ink layer for the color filter. For example, a method of immersing the array substrate in the above-described cleaning solution or a method in which the above-described cleaning solution is immersed. Examples of the method include removing with a cloth, brush, sponge roll, high-pressure spray, and the like.

  The array substrate from which the color filter ink layer has been removed in the first removal step is transported to the production line for performing the first transfer step, and is reused by transferring a new color filter ink layer. The

  As described above, in the first step of the array substrate manufacturing method of the present invention, the color filter ink layer is transferred after the color filter ink layer is transferred and fired in the first inspection step. It is determined whether the array substrate thus formed is defective or not, and the ink layer on the array substrate determined to be defective is removed in the first removal step. Then, the array substrate from which the ink layer has been removed is reused in the first step.

  When forming a color filter using the pigment dispersion method, the ink layer for the color filter is removed as described above to remove the ink layer for the color filter as described above in order to perform pre-baking, exposure, development, and baking immediately after application of the pigment resist. Is difficult to reuse. Therefore, a significant cost reduction can be achieved as compared with the case where the color filter is formed using the pigment dispersion method.

(First firing step)
In the first firing step, the array substrate determined to be non-defective in the first inspection step is fired to form a color filter having a desired pattern. That is, an array in which ink layers for all color primary colors necessary for pixel formation of the color filter, in this embodiment, red (R), green (G), blue (B), and black (K) color filters are transferred. A color filter is formed by baking a board | substrate at 200 degreeC-260 degreeC for 10 minutes-1 hour. The thickness of the color filter after firing is preferably 0.5 μm to 5 μm.

  In the present embodiment, the color filters of three primary colors are manufactured, but the present invention can also be applied to the formation of color filters of two colors or four colors or more.

[Transparent electrode formation process]
In the transparent electrode forming step, a transparent electrode is formed on the array substrate on which the color filter is formed in the first step.

  The method for forming the transparent electrode is not particularly limited, but lift-off processing can be used. According to the lift-off process, a reverse pattern of the target pattern is patterned on the array substrate with a photoresist or the like. Next, a target thin film, for example, a thin film made of indium tin oxide (hereinafter referred to as “ITO”) is formed by a sputtering method or the like. Then, the transparent electrode formed in the target pattern is formed by removing the photoresist and the like to remove unnecessary portions.

[ITO inspection process and protrusion polishing process]
In the ITO inspection process, it is determined whether or not the array substrate on which the transparent electrode is formed in the transparent electrode forming process is a defective product. The inspection apparatus used in the ITO inspection process is not particularly limited as long as it is generally used.

  The criteria for determining whether or not the array substrate is defective is not particularly limited, and may be set as appropriate according to the desired array substrate and transparent electrode. In the present embodiment, in the transparent electrode, it is determined that the foreign object that may cause a short-circuit with the common electrode of the counter substrate is a defective product when it is observed. judge. The array substrate determined to be a defective projection in the ITO inspection process is transported to the production line that performs the projection polishing process, and the array substrate that is determined to be non-defective is transported to the manufacturing line that performs the second process. .

  In the protrusion polishing step, the protrusion on the transparent electrode of the array substrate determined to be defective in the protrusion inspection step is polished and removed. The polishing method used in the projection polishing step is not particularly limited as long as it is generally used, and examples thereof include tape polishing.

  The array substrate polished in the projection polishing process is transported again to the production line for performing the projection inspection process, and the projection inspection is performed.

[Second step]
(Second transfer process)
FIG. 7A is a top view of the array substrate 15 on which the spacers 70 and the alignment protrusions 71 are formed, and FIG. 7B is a side view of the array substrate on which the spacers 70 and the alignment protrusions 71 are formed. . In the second transfer step, as shown in FIGS. 7A and 7B, at least the ink layer for spacers or the ink layer for alignment protrusions is applied to the color filter 72 using the above-described relief reversal offset printing method. And transferred to the array substrate 15 on which the transparent electrode 73 is formed. The alignment protrusion corresponds to an alignment functional element.

Hereinafter, the ink for spacers and the ink for alignment protrusions will be described.
The spacer ink is not particularly limited. For example, a photosensitive resin composition containing a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent disclosed in JP-A-2006-171160. What added the filler to the thing and diluted so that it might become a desired viscosity etc. are mentioned. The filler is not particularly limited, and examples thereof include inorganic fine particles.

  The ink for the alignment protrusion is not particularly limited, but for example, a photosensitive resin containing a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent disclosed in JP-A-2006-171160. What diluted the composition and adjusted so that it might become desired viscosity etc. are mentioned.

  In the ink for alignment protrusions and spacers, the solvent used for viscosity adjustment is preferably an alcohol, ketone, ester or the like, and examples thereof include ethyl acetate and propylene glycol methyl ether acetate.

  As shown in FIG. 7B, the height of the spacer 70 is larger than the height of the alignment protrusion 71. Therefore, the thickness of the spacer ink layer needs to be formed to be larger than the thickness of the alignment protrusion ink layer. For this reason, the viscosity of the spacer ink is configured to be higher than the viscosity of the alignment protrusion ink, and the spacer ink viscosity is 2 cps to 100 cps, and the alignment protrusion ink viscosity is It is preferably 2 to 50 cps. Thereby, the ink layer for spacers and the ink layer for alignment protrusions having a suitable film thickness can be more reliably formed.

  The preferred film thickness of the spacer ink layer is 1 μm to 8 μm, and the preferred film thickness of the alignment protrusion ink layer is 0.5 μm to 3 μm. The viscosity herein refers to a value measured with an E-type viscometer at 20 ° C.

  In addition, the spacer ink layer having the above-mentioned preferable film thickness is too large to be formed by the lithographic waterless offset printing method. Therefore, it is preferable to use the relief reverse printing method in the second step.

  In the second transfer step, when both the spacer and the alignment protrusion are formed by using the letterpress reversal offset printing method, first, the printing unit 24b of the multicolor printing machine 20 is filled with the ink for the spacer, and another printing is performed. The unit 24d is filled with ink for alignment protrusions. Next, while the blankets 10b and 10d are rotated, the above-described ink is applied to the surfaces by the corresponding die coaters 12b and 12d to form the spacer ink layer 11b and the alignment protrusion ink layer 11d. At this time, it is preferable to appropriately adjust the order of formation depending on the type of ink layer to be formed. Next, the printing units 24b and 24d are lowered by the elevating means, and the relief plates 13b and 13d supported by the plate surface plate 22, the spacer ink layer 11b and the alignment protrusion ink layer 11d are brought into contact with each other. Thereafter, the platen platen 22 is moved horizontally in the direction indicated by the arrow A and the blankets 10b and 10d are rotated so that unnecessary portions of the color filter ink layers 11b and 11d are protruded 14b of the relief plates 13b and 13d. , 14d, and removed. Thereafter, the printing units 24b and 24d are once raised, and the platen plate 22 is moved horizontally to a position other than below the printing units 24a, 24b, 24c and 24d, and then the printing units 24a, 24b, 24c and 24d are printed again. It is lowered to a position where it can come into contact with the array substrate 15 on which a color filter and a transparent electrode are formed, which is a printing substrate supported by the surface plate 23. Then, the printing surface plate 23 is moved horizontally in the direction of the arrow A and brought into contact with the blankets 10b and 10d in order, whereby the spacer ink layer 11b and the alignment protrusion ink layer 11d patterned on the surfaces of the blankets 10b and 10d. Are transferred onto the surface of the array substrate 15 on which the color filters and the transparent electrodes are formed in this order.

  As described above, since the viscosity of the spacer ink is higher than the viscosity of the alignment protrusion ink, the spacer ink layer maintains its shape more than the alignment protrusion ink layer after transfer to the array substrate. Cheap. Therefore, in the second transfer step, when both the spacer and the alignment protrusion are formed by the relief reversal offset printing method, it is preferable to form the spacer first. Accordingly, it is possible to more reliably form the ink layer for the spacer and the ink layer for the alignment protrusion having a suitable shape.

  In this embodiment, among the four printing units 24a, 24b, 24c, and 24d, the printing units 24b and 24d are filled with the spacer ink and the alignment protrusion ink. However, the present invention is not limited to this. When the spacers and the alignment protrusions are formed together, any printing unit 24 may be filled as long as the spacers are filled so as to be formed first. Further, when only one of the spacer and the alignment protrusion is formed, ink corresponding to any one of the four printing units may be filled.

(Second inspection process)
In the second inspection step, it is determined whether or not the array substrate to which at least the spacer ink layer or the alignment protrusion ink layer is transferred in the second transfer step is defective.

  The inspection apparatus used in the second inspection step is not particularly limited as long as it is generally used, but the reflected light is detected by irradiating the surface of the array substrate with laser or white light. It is preferable that the inspection is performed by doing so.

  The criteria for determining whether or not the array substrate is defective is not particularly limited, and may be set as appropriate according to the desired array substrate, spacer, and alignment protrusion. In this embodiment, the spacer ink layer and the alignment protrusion ink layer are determined to be defective when an aperiodic phenomenon is observed or an appearance abnormality is visually recognized, and are not observed. If it is, it is determined to be a non-defective product. The array substrate determined to be a defective product in the second inspection process is transported to a production line for performing a second removal process, and the array substrate determined to be a non-defective product is transported to a manufacturing line for performing a second firing process. The

(Second removal step)
In the second removal step, all the ink layers of at least the spacer ink layer or the alignment protrusion ink layer formed on the array substrate from the array substrate determined to be defective in the second inspection step. (Hereinafter simply referred to as “ink layer”) is removed.

  The method for removing the ink layer is not particularly limited as long as it is a method capable of removing the ink layer, but in particular, a method for washing with a washing liquid composed of an organic solvent or an aqueous solvent is preferable.

  In this way, by using a cleaning liquid composed of an organic solvent or an aqueous solvent, the ink layer can be removed without damaging the array substrate, so the array substrate can be reused more reliably. Greater cost reduction can be achieved.

  The cleaning liquid composed of an organic solvent is preferably a solvent such as alcohols, ketones, esters, and the like that easily volatilizes, and examples thereof include ethanol, acetone, propylene glycol methyl ether acetate, etc. Acetone, ethanol, or propylene glycol methyl ether acetate is preferable.

  As described above, since the cleaning liquid composed of the organic solvent is acetone, ethanol or propylene glycol methyl ether acetate, the ink layer can be easily removed at a lower cost. Further shortening can be achieved, and further significant cost reduction can be achieved.

  As a cleaning liquid composed of an aqueous solvent, a solution obtained by adding a surfactant to an alkaline solution is preferable. The alkaline solution is an aqueous solution adjusted to be alkaline with a pH of about 7 to 14 with an alkaline substance such as KOH, and its concentration is preferably about 0.01% to 1.0%. The surfactant added to the alkaline solution is not particularly limited, and examples thereof include Kao: Emulgen.

  As described above, since the cleaning liquid composed of the aqueous solvent is obtained by adding the surfactant to the alkaline solution, the ink layer can be easily removed at a lower cost. Time can be further shortened, and further significant cost reduction can be achieved.

  The cleaning method is not particularly limited as long as it is a method capable of removing the ink layer. For example, a method of immersing the array substrate in the above-described cleaning liquid, a cloth, a brush in which the above-described cleaning liquid is immersed, Examples of the method include removing with a sponge roll, high-pressure spray, and the like.

  The array substrate from which the ink layer has been removed in the second removal step is transported to the production line for performing the second transfer step, and at least the spacer ink layer or the alignment protrusion ink layer is newly transferred. Reused.

  Thus, in the second step of the array substrate manufacturing method of the present invention, at least after the transfer of at least the spacer ink layer or the alignment protrusion ink layer in the second inspection step and before firing, It is determined whether the array substrate to which the spacer ink layer or the alignment protrusion ink layer has been transferred is a defective product, and the second removal step determines whether the array substrate is a defective product. Remove the ink layer. Then, the array substrate from which the ink layer has been removed is reused in the second step. This makes it possible to remove the spacers and alignment protrusions, which were difficult to remove in the past because the constituent materials are different and the removal methods are different, and the array substrate can be reused. Can be achieved.

(Second firing step)
In the second firing step, the array substrate determined to be non-defective in the second inspection step is fired to form at least spacers or alignment protrusions having a desired pattern. That is, at least spacers or alignment protrusions are formed by baking the array substrate to which at least the spacer ink layer or the alignment protrusion ink layer is transferred at 200 ° C. to 260 ° C. for 10 minutes to 1 hour.

  The spacer after firing preferably has a height of 1 μm to 8 μm and a substantially columnar shape with a bottom surface of 10 μm to 50 μm square, and the alignment protrusions after firing have a height of 0.5 μm to 3 μm and a radius of the bottom surface of 5 μm to 20 μm. The hemispherical shape is preferable.

  As described above, the array substrate manufacturing method of the present invention uses an array that uses a printing method in which an ink layer patterned on a blanket surface is transferred to an array substrate using a plate on which a pattern having a predetermined shape is formed and then baked. A substrate manufacturing method, wherein, in the first step, the printing method is used to form a color filter by transferring an ink layer for a color filter to an array substrate and then firing, and in a second step, the printing is performed. Using the method, at least a spacer or an alignment functional element is formed by transferring at least an ink layer for spacers or an ink layer for alignment protrusions to the array substrate on which a color filter is formed and then baking.

  As a result, all of the color filters, spacers, and alignment protrusions can be formed by printing using ink as a material, so that the installation area of the manufacturing facility can be reduced, the time required for the manufacturing process can be shortened, and The cost for manufacturing the array substrate can be reduced. Therefore, it is possible to provide an array substrate manufacturing method capable of reducing the installation area of the manufacturing facility, greatly reducing the time required for the array substrate manufacturing process, and achieving a significant cost reduction.

  The printing method is preferably a letterpress reverse offset printing method. As described above, in the first step, the color filter is formed using the letterpress reverse offset printing method, and in the second step, the spacer and the alignment protrusion are similarly formed using the letterpress reverse offset printing method. Since the same operation may be performed with the same apparatus in the first step and the second step, the array substrate is more efficiently compared with the case where different printing methods are used in the first step and the second step. Can be manufactured. Therefore, the time required for the manufacturing process can be further shortened, and a significant cost reduction can be achieved.

  Further, by manufacturing the array substrate according to the present invention, an array substrate that is much cheaper than the conventional one can be provided.

[Counter substrate]
FIG. 8 is a schematic view showing an example of the configuration of the counter substrate 80 of the present invention. As shown in FIG. 8, the counter substrate 80 of the present invention has various functions having a polarizing function such as a polarizing film 82 and an optical compensation film 83, a phase difference function, and a common electrode function and an illumination function, as shown in FIG. 8. A film and a resin plate are laminated or laminated.

  The constituent material of the transparent substrate 81 is not particularly limited, and examples thereof include a transparent resin and glass, but a transparent resin is particularly preferable. Specific examples of the transparent resin include acrylic resin, PET resin, PEN resin, epoxy resin, cyclic polyolefin resin, and polycarbonate resin. Among these, acrylic resin is preferable.

  Thus, by forming the transparent substrate 81 from a transparent resin, it is possible to prevent cracking of the transparent substrate 81 and to reduce the weight compared to the case where the transparent substrate 81 is formed from glass. Can be achieved.

  Moreover, the surface where the various films of the transparent substrate 81 are not bonded may be provided with a hard coat layer, an antireflection layer, an antiglare layer, and the like as necessary.

  The order of laminating various films having a polarization function, a retardation function, and an illumination function is not particularly limited, and may be set as appropriate according to visibility. In the counter substrate 80 of the present embodiment, an optical compensation film 83, a triacetyl cellulose film (hereinafter referred to as “TAC film”) 85b, a polarizing film 82, and a TAC film 85a are pasted in this order on one side of the transparent substrate 81. Or laminated. Moreover, the film to be used is not limited to the above, and may be appropriately selected according to the intended function.

  A transparent electrode, that is, an ITO layer 87 may be formed on another side of the counter substrate 81, and the ITO layer may be directly formed on the transparent substrate. However, in this embodiment, the ITO layer 87 is formed on the PET film 86. Further, an alignment film (not shown) made of, for example, polyimide resin is formed on the transparent electrode 87.

  Thus, the counter substrate 80 of the present invention is a counter substrate constituting a liquid crystal panel by being bonded to the array substrate of the present invention. The transparent substrate 81 has a polarization function, a phase difference function, and an unillustrated function. A film or a substrate having an illumination function is configured by being bonded or laminated. In this way, by laminating various necessary films in advance, the back surface of the liquid crystal panel, which is provided when laminating the above various films after the array substrate and the counter substrate are laminated, is reversed. Since the process can be omitted, the production efficiency can be further improved.

[Liquid crystal panel manufacturing method]
In the liquid crystal panel manufacturing method of the present invention, the array substrate of the present invention manufactured as described above and the counter substrate of the present invention are bonded together, and liquid crystal is sealed between the array substrate and the counter substrate. By doing so, a liquid crystal panel is manufactured.

  The method for laminating the array substrate and the counter substrate and the method for enclosing the liquid crystal are not particularly limited, and a general method may be used. In particular, a liquid crystal dropping method (ODF method) is used. It is preferable. In the liquid crystal dropping method, a UV curable sealant is applied to the peripheral edge of the array substrate, an appropriate amount of liquid crystal is dropped into the mold, and then the array substrate and the counter substrate are overlapped so that the alignment films face each other. In addition, the sealing material is cured by UV irradiation and heating. A polarizing film is bonded to the surface on the array substrate side of the liquid crystal panel manufactured as described above.

  Thus, the liquid crystal panel manufacturing method of the present invention manufactures a liquid crystal panel by laminating the array substrate of the present invention onto which an appropriate amount of liquid crystal has been dropped and the counter substrate of the present invention. As a result, it is possible to provide a liquid crystal panel manufacturing method capable of reducing the installation area of the manufacturing facility, greatly reducing the time required for the manufacturing process, improving the production efficiency, and achieving a significant cost reduction.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. However, the present invention is not particularly limited to these Examples as long as the gist thereof is not exceeded.

(Example)
[Manufacture of array substrates]
[First step]
(First transfer process)
[Preparation of ink for color filter]
Pigment Red 4BS (manufactured by Sanyo Dyeing Co., Ltd.) is added to a resin agent containing 70% by weight of a resin component comprising a water-soluble polyester resin and a water-soluble melamine resin and 30% by weight of a solvent component comprising butyl cellosolve, ethyl cellosolve and n-butanol. 60 parts by weight with respect to 100 parts by weight of the resin agent was mixed and dispersed with a three roll mill to prepare a red colorant. Next, the obtained colorant was diluted with ethyl acetate to adjust the viscosity to 4 cp, thereby producing a red (R) organic colored ink. The final content of the resin component and the solvent component in the organic colored ink thus prepared is 30% by weight of the resin component and 70% by weight of the solvent component with respect to 100% by weight of the organic colored ink. became.

  Next, the organic coloring ink of green (G) is the same as the organic coloring ink of red (R) except that Pigment Red 4BS (manufactured by Sanyo Dyeing Co., Ltd.) is replaced with phthalocyanine green SAX (manufactured by Sanyo Dyeing Co., Ltd.). Was made.

  Next, except that Pigment Red 4BS (manufactured by Sanyo Dyeing Co., Ltd.) was replaced with phthalocyanine blue SR-150 (manufactured by Sanyo Dyeing Co., Ltd.), the organic color of blue (B) was the same as that of red (R) organic coloring ink. A colored ink was prepared.

  Next, a black (K) organic coloring ink was prepared in the same manner as the red (R) organic coloring ink except that Pigment Red 4BS (manufactured by Sanyo Dyeing Co., Ltd.) was replaced with carbon black.

[Formation of ink layer for color filter]
First, the organic colors of black (K), red (R), green (G) and blue (B) produced as described above are applied to the four printing units 24a, 24b, 24c and 24d of the multicolor printing machine 20. The inks were filled in this order. Next, while rotating the blankets 10a, 10b, 10c, and 10d, the above-described ink is applied to the surface by the corresponding die coaters 12a, 12b, 12c, and 12d so that the film thickness becomes 3.5 μm. Ink layers 11a, 11b, 11c, and 11d were formed. At this time, the order of formation was appropriately adjusted depending on the color of the ink layer to be formed. Next, the printing units 24a, 24b, 24c, and 24d are lowered, and the relief plates 13a, 13b, 13c, and 13d supported by the platen plate 22 and the ink layers 11a, 11b, 11c, and 11d for the color filters are respectively provided. Made contact. Thereafter, the platen plate 22 is moved horizontally in the direction indicated by the arrow A and the blankets 10a, 10b, 10c, and 10d are rotated, so that unnecessary portions of the color filter ink layers 11a, 11b, 11c, and 11d are moved. It was transferred to the convex portions 14a, 14b, 14c, and 14d of the relief plates 13a, 13b, 13c, and 13d and removed. Thereafter, the printing units 24a, 24b, 24c, 24d are once raised, the platen plate 22 is moved horizontally to a position other than the lower side of the printing units 24a, 24b, 24c, 24d, and then again the printing units 24a, 24b, 24c. , 24d is lowered to a position where it can come into contact with the 0.7 mm thick array substrate 15 on which the switching active elements supported by the printing surface plate 23 are formed. The four color filters patterned on the surfaces of the blankets 10a, 10b, 10c, and 10d are obtained by horizontally moving the printing surface plate 23 in the direction of the arrow A and sequentially contacting the blankets 10a, 10b, 10c, and 10d. Ink layers 11a, 11b, 11c, and 11d were transferred to the surface of the array substrate 15 in this order.

(First inspection process)
The array substrate on which the color filter ink layer obtained in the first transfer step was transferred was subjected to defect inspection to determine whether or not the array substrate was defective. As a criterion for determination, in the color filter ink layer, when unevenness or foreign matter having a diameter of 20 μm or more was observed, it was determined as a defective product, and when it was not observed, it was determined as a non-defective product. The array substrate determined to be a defective product in the first inspection process was transported to the production line for performing the first removal process, and the array substrate determined to be a non-defective product was transported to the manufacturing line for performing the firing process.

(First removal step)
The array substrate determined to be a defective product in the first inspection step was washed with a cleaning liquid composed of acetone, and the color filter ink layer was removed.

  The washed array substrate from which the color filter ink layer was removed was transported to the production line for performing the first transfer step, and reused by transferring a new color filter ink layer.

(First firing step)
The array substrate determined to be non-defective in the first inspection step was baked at 230 ° C. for 1 hour in the air to form a color filter having a thickness of 2.8 μm.

[Transparent electrode formation process]
In the first step, a positive photoresist was patterned into a predetermined pattern on the array substrate on which the color filters were formed, and then a thin film made of ITO was formed by sputtering. Thereafter, the positive type photoresist was removed to form a transparent electrode made of ITO formed in a predetermined pattern.

[ITO inspection process and protrusion polishing process]
A defect inspection was performed on the array substrate on which the transparent electrode was formed in the transparent electrode formation step, and it was determined whether or not the array substrate was a defective product. As a determination criterion, when a projection having a height of 3 μm or more was observed in the transparent electrode, it was determined as a defective product, and when it was not observed, it was determined as a non-defective product. The array substrate determined to be defective in the above inspection is transported to the production line for performing the protrusion polishing process, and after the protrusion is polished by tape polishing, the above protrusion inspection is performed again. Is called.

  The array substrate determined to be a non-defective product by the projection inspection was transported to the production line for performing the second step.

[Second step]
(Second transfer process)
[Preparation of ink for alignment protrusion]
Into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was flowed at 0.02 L / min to form a nitrogen atmosphere, and 200 parts by weight of 3-methoxy-1-butanol and 105 parts by weight of 3-methoxybutyl acetate were added. And heated to 70 ° C. with stirring. Next, 55 parts by weight of methacrylic acid, 3,4-epoxytricyclo [5.2.1.02.6] decyl acrylate (a compound represented by the following formula (1) and a compound represented by the following formula (2) 175 parts by weight and 70 parts by weight of N-cyclohexylmaleimide were dissolved in 140 parts by weight of 3-methoxybutyl acetate, and this solution was added using a dropping pump. Then, the solution was dropped into a flask kept at 70 ° C. over 4 hours. On the other hand, a solution obtained by dissolving 30 parts by weight of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 225 parts by weight of 3-methoxybutyl acetate was added to a flask over another 5 hours using another dropping pump. It was dripped in. After completion of dropping of the polymerization initiator solution, the temperature was maintained at 70 ° C. for 4 hours, and then cooled to room temperature, viscosity (23 ° C.) 114 mPa · s, solid content 32.8%, acid value 34.3 mg-KOH / G binder resin solution was obtained. The obtained binder resin had a weight average molecular weight Mw of 13,600 and a dispersity of 2.54.

  40 parts by weight of dipentaerythritol hexaacrylate (trade name: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.) as a photopolymerizable compound was added to 100 parts by weight of the binder resin solution (solid content: 32.8%) obtained as described above. Photosensitive resin composition by mixing 53 parts by weight of propylene glycol monomethyl ether acetate, 20 parts by weight of 3-ethoxyethyl propionate, 37 parts by weight of 3-methoxy 1-butanol and 87 parts by weight of 3-methoxybutyl acetate as a solvent. I got a thing. Next, the obtained photosensitive resin composition was diluted with ethyl acetate to adjust the viscosity to 2.6 cp, and an ink for alignment protrusion was produced.

[Preparation of spacer ink]
By adding 15 parts by weight of silicon oxide fine particles as a filler to 100 parts by weight of the photosensitive resin composition obtained in the same manner as the ink for alignment protrusions, and then diluting with ethyl acetate, the viscosity becomes 7.0 cp. Thus, an ink for spacer was prepared.

[Formation of ink layer for spacer and ink layer for alignment protrusion]
First, the printing unit 24b of the multi-color printing machine 20 was filled with the ink for spacers produced as described above, and another printing unit 24d was filled with the ink for alignment protrusions produced as described above. Next, while rotating the blankets 10b and 10d, the above-described inks were applied almost simultaneously to the surfaces by the corresponding die coaters 12b and 12d to form the spacer ink layer 11b and the alignment protrusion ink layer 11d. Next, the printing units 24b and 24d were lowered to bring the relief plates 13b and 13d supported by the platen plate 22 into contact with the spacer ink layer 11b and the alignment protrusion ink layer 11d, respectively. Thereafter, the platen platen 22 is moved horizontally in the direction indicated by the arrow A and the blankets 10b and 10d are rotated so that unnecessary portions of the color filter ink layers 11b and 11d are protruded 14b of the relief plates 13b and 13d. , 14d, and removed. Thereafter, the printing units 24b and 24d are once raised, and the platen plate 22 is moved horizontally to a position other than below the printing units 24a, 24b, 24c and 24d, and then the printing units 24a, 24b, 24c and 24d are printed again. It was lowered to a position where it could come into contact with the array substrate 15 supported by the surface plate 23. Then, the printing surface plate 23 is moved horizontally in the direction of the arrow A and brought into contact with the blankets 10b and 10d in order, whereby the spacer ink layer 11b and the alignment protrusion ink layer 11d patterned on the surfaces of the blankets 10b and 10d. Were simultaneously transferred onto the surface of the array substrate 15 on which the color filter and the transparent electrode were formed in this order.

(Second inspection process)
The array substrate onto which the spacer ink layer and the alignment protrusion ink layer obtained in the second transfer step were transferred was subjected to defect inspection to determine whether the array substrate was defective. As the determination criteria, the ink layer for spacers and alignment protrusions was determined to be defective when an aperiodic phenomenon was observed, and was determined to be good when it was not observed. . The array substrate determined to be defective in the second inspection step is transported to the production line on which the second removal step is performed, and the array substrate determined to be non-defective is transferred to the production line on which the second firing step is performed. Conveyed.

(Second removal step)
The array substrate determined to be defective in the second inspection step was washed with a cleaning liquid composed of acetone, and the spacer ink layer and the alignment protrusion ink layer were removed.
The cleaned array substrate from which the spacer ink layer and the alignment protrusion ink layer have been removed is transported to the second transfer step, and the new spacer ink layer and alignment protrusion ink layer are transferred. Reused.

(Second firing step)
The array substrate determined to be non-defective in the second inspection step is baked at 230 ° C. for 1 hour in the atmosphere, and is a substantially square pillar-shaped spacer having a height of 3 μm and a bottom surface of 50 μm square, and a height of 0 A hemispherical alignment protrusion having a diameter of 0.6 μm and a bottom diameter of 15 μm was produced.

(Preparation of alignment film)
An alignment film (AL1254) made by JSR is applied to the surface of the array substrate on which the alignment protrusions and spacers are formed by flexographic printing and baked in an oven at 230 ° C. for 1 hour to form an alignment film having a thickness of 0.6 μm. Obtained. Next, using a rubbing apparatus, the alignment film on the substrate was subjected to an alignment process to produce an array substrate.

[Manufacture of counter substrate]
A transparent electrode made of an ITO film was formed on a PET film by a low-temperature sputtering method, and an alignment film was formed on the transparent electrode in the same manner as the array substrate, and an alignment treatment was performed by a rubbing apparatus. Next, the surface of the PET film on which the transparent electrode was not formed was bonded to an acrylic plate that was a transparent substrate. A counter substrate is produced by laminating a polarizing film on which a TAC film is bonded and a film on which an optical compensation film is bonded to one side where a PET film of an acrylic plate is not bonded in the configuration shown in the figure. did.

[Manufacture of LCD panels]
A UV curable sealant was applied to the peripheral edge of the array substrate manufactured as described above, and an appropriate amount of liquid crystal was dropped into the mold. Next, the array substrate and the counter substrate manufactured as described above were overlaid so that the respective alignment films face each other, and then the sealing material was cured by UV irradiation and heating. Then, the liquid crystal panel was produced by sticking a polarizing film on the surface at the side of the array substrate.

It is sectional drawing which shows the outline | summary of a letterpress reverse offset printing method. It is the schematic which shows an example of a structure of the multi-color printing machine which uses a letterpress reverse offset printing method. It is sectional drawing which shows the outline | summary of the lithographic waterless offset printing method. It is the schematic which shows an example of a structure of the multicolor printing machine which uses the lithographic waterless offset printing method. It is the schematic which expands and shows a part of structure of the multicolor printing machine which uses the lithographic waterless offset printing method. It is the schematic which shows each process of the array substrate manufacturing method of this invention. FIG. 7A is a top view of the array substrate on which the spacers and alignment protrusions are formed, and FIG. 7B is a side view of the array substrate on which the spacers and alignment protrusions are formed. It is the schematic which shows an example of a structure of the counter substrate of this invention. It is sectional drawing which shows an example of a structure of the TFT type liquid crystal panel which has a COA structure.

Explanation of symbols

10, 35 Blanket 11, 36 Ink layer 12, 33 Die coater 13 Relief plate 14 Relief part 15 Printed object 16 Recessed part 20, 40 Multicolor printing machine 21, 41 Fixed frame 22 Plate surface plate 23, 42 Printing surface plate 24, 43 Printing Unit 30 Flat plate 31 Resin-repellent part 32 Parent resin part 34 Ink 51 Plate cylinder 52 Cleaning unit 70 Spacer 71 Orientation protrusion 72 Color filter 73 Transparent electrode 80 Counter substrate 81 Transparent substrate 82 Polarizing film 83 Optical compensation film 84 Hard coat layer 85 TAC film 86 PET film 87 Transparent electrode

Claims (14)

An array substrate manufacturing method using a printing method in which an ink layer patterned on a blanket surface using a plate in which a pattern of a predetermined shape is formed is transferred to an array substrate and then baked,
A method for manufacturing an array substrate, comprising: forming a color filter by transferring an ink layer for a color filter to the array substrate using the printing method and then baking the ink layer.   Using the printing method, at least spacers or alignment functional elements are formed by transferring at least an ink layer for spacers or an alignment functional element ink layer to the array substrate on which a color filter is formed and then baking. The method for manufacturing an array substrate according to claim 1, further comprising a step.   The viscosity of the spacer ink is configured to be larger than the viscosity of the alignment functional element ink, and the viscosity of the spacer ink is 2 cps to 100 cps, and the viscosity of the alignment functional element ink is The array substrate manufacturing method according to claim 2, wherein the array substrate is 2 cps to 50 cps.   3. The method of manufacturing an array substrate according to claim 2, wherein in forming the spacer and the alignment functional element in the second step, the spacer is formed first.   The array substrate manufacturing method according to claim 1, wherein the printing method is a letterpress reverse offset printing method. In the first step, after transferring the color filter ink layer and before firing, a first inspection step for determining whether or not the array substrate to which the ink layer has been transferred is a defective product;
A first removal step of removing the ink layer of the array substrate determined to be a defective product,
The array substrate manufacturing method according to claim 1, wherein the array substrate from which the ink layer has been removed is reused in the first step. In the second step, at least the spacer ink layer or the alignment functional element ink layer is transferred after transferring at least the spacer ink layer or the alignment functional element ink layer and before firing. A second inspection step for determining whether the array substrate is defective or not;
A second removal step of removing the ink layer of the array substrate determined to be a defective product,
The array substrate manufacturing method according to claim 1, wherein the array substrate from which the ink layer has been removed is reused in the second step.   8. The array substrate manufacturing method according to claim 6, wherein in the first removal step and the second removal step, the ink layer is removed by washing with a cleaning liquid composed of an organic solvent or an aqueous solvent.   9. The array substrate manufacturing method according to claim 8, wherein the organic solvent is acetone, ethanol, or propylene glycol methyl ether acetate.   9. The array substrate manufacturing method according to claim 8, wherein the aqueous solvent is obtained by adding a surfactant to water or an alkaline solution.   An array substrate manufactured by the array substrate manufacturing method according to claim 1. A counter substrate constituting a liquid crystal panel by being bonded to the array substrate according to claim 11,
The counter substrate is configured by laminating or laminating a film having a common electrode function, a polarization function, a retardation function and an illumination function on a transparent substrate, or a film having a polarization function, a retardation function and an illumination function. A counter substrate, wherein the substrate is laminated or laminated.   The counter substrate according to claim 12, wherein the transparent substrate is made of transparent glass or transparent resin.   An array substrate according to claim 11 and a counter substrate according to claim 12 are bonded together, and a liquid crystal is sealed in a gap between the array substrate and the counter substrate.

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