JP2009226582A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2009226582A
JP2009226582A JP2009162884A JP2009162884A JP2009226582A JP 2009226582 A JP2009226582 A JP 2009226582A JP 2009162884 A JP2009162884 A JP 2009162884A JP 2009162884 A JP2009162884 A JP 2009162884A JP 2009226582 A JP2009226582 A JP 2009226582A
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JP
Japan
Prior art keywords
film
semiconductor wafer
chip
dicing
semiconductor device
Prior art date
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Pending
Application number
JP2009162884A
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English (en)
Japanese (ja)
Inventor
Katsuki Uchiumi
勝喜 内海
Takahiro Kumakawa
隆博 隈川
Masami Matsuura
正美 松浦
Yoshihiro Matsushima
芳宏 松島
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Panasonic Corp
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Panasonic Corp
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Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009162884A priority Critical patent/JP2009226582A/ja
Publication of JP2009226582A publication Critical patent/JP2009226582A/ja
Pending legal-status Critical Current

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  • Micromachines (AREA)
  • Dicing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
JP2009162884A 2006-06-09 2009-07-09 半導体装置の製造方法 Pending JP2009226582A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009162884A JP2009226582A (ja) 2006-06-09 2009-07-09 半導体装置の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006160927 2006-06-09
JP2009162884A JP2009226582A (ja) 2006-06-09 2009-07-09 半導体装置の製造方法

Related Parent Applications (1)

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JP2007001227A Division JP4480728B2 (ja) 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法

Publications (1)

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JP2009226582A true JP2009226582A (ja) 2009-10-08

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ID=38937828

Family Applications (1)

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JP2009162884A Pending JP2009226582A (ja) 2006-06-09 2009-07-09 半導体装置の製造方法

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JP (1) JP2009226582A (zh)
CN (1) CN101086956B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013154427A (ja) * 2012-01-30 2013-08-15 Renesas Electronics Corp 半導体集積回路装置の製造方法
US8952467B2 (en) 2012-10-19 2015-02-10 Seiko Epson Corporation Electronic device and its manufacturing method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8012785B2 (en) * 2009-04-24 2011-09-06 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating an integrated CMOS-MEMS device
CN102464296A (zh) * 2010-11-05 2012-05-23 中芯国际集成电路制造(上海)有限公司 一种mems结构切割分离方法
JP5833411B2 (ja) * 2011-11-11 2015-12-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法ならびに液晶表示装置
US20140217577A1 (en) * 2013-02-04 2014-08-07 Infineon Technologies Ag Semiconductor Device and Method for Manufacturing a Semiconductor Device
WO2015098372A1 (ja) * 2013-12-27 2015-07-02 株式会社村田製作所 圧電振動子及び圧電振動子の周波数調整方法
KR102221484B1 (ko) * 2014-03-24 2021-02-26 린텍 가부시키가이샤 보호막 형성 필름, 보호막 형성용 시트 및 가공물의 제조 방법
CN105984836B (zh) * 2015-02-16 2021-02-26 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制作方法
CN108884594B (zh) * 2016-03-24 2021-01-22 日本碍子株式会社 晶种基板的制造方法、13族元素氮化物结晶的制造方法及晶种基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077729A (ja) * 1998-08-27 2000-03-14 Nissan Motor Co Ltd センサの製造方法
JP2005342808A (ja) * 2004-05-31 2005-12-15 Oki Electric Ind Co Ltd Ｍｅｍｓデバイスの製造方法
JP2006088268A (ja) * 2004-09-24 2006-04-06 Nippon Telegr & Teleph Corp <Ntt> 半導体装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100486359C (zh) * 2003-08-12 2009-05-06 中国科学院声学研究所 一种传声器芯片制备方法
CN1694577B (zh) * 2005-06-09 2011-04-06 复旦大学 单片硅基微型电容式麦克风及其制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077729A (ja) * 1998-08-27 2000-03-14 Nissan Motor Co Ltd センサの製造方法
JP2005342808A (ja) * 2004-05-31 2005-12-15 Oki Electric Ind Co Ltd Ｍｅｍｓデバイスの製造方法
JP2006088268A (ja) * 2004-09-24 2006-04-06 Nippon Telegr & Teleph Corp <Ntt> 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013154427A (ja) * 2012-01-30 2013-08-15 Renesas Electronics Corp 半導体集積回路装置の製造方法
US8952467B2 (en) 2012-10-19 2015-02-10 Seiko Epson Corporation Electronic device and its manufacturing method

Also Published As

Publication number Publication date
CN101086956A (zh) 2007-12-12
CN101086956B (zh) 2011-04-13

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