JP2009224566A - Circuit and semiconductor circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit capable of achieving miniaturization and surely reflecting a desired electromagnetic wave. <P>SOLUTION: The semiconductor circuit uses a circuit 51 including a power supply plane 12, a ground plane 11, and line element 1 connected between the power supply plane 12 and the ground plane 11, and at least one end of the line element 1 is connected to the power supply plane 12 through a plurality of vias 4, 7. The plurality of vias 4, 7 are placed in a zigzag shape by arranging the plurality of vias 4, 7 substantially vertically with respect to a travel direction of electromagnetic wave 131 propagating between the power supply plane 12 and the ground plane 11, and deviating adjacent vias 4, 7 in a travel direction of the electromagnetic wave 131 only by a distance of odd number times the quarter of the effective value of the wavelength of the electromagnetic wave 131. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit and a semiconductor circuit using the circuit.

  Along with the speeding up of electronic circuits, electromagnetic radiation is generated along with fluctuations in power supply voltage caused by switching elements, and this interferes with the operation of other electric / electronic circuits, causing problems. In the electromagnetic radiation described above, since the flat power plane and ground plane used as the power circuit of the electronic circuit function as a patch antenna, the power voltage fluctuation generated by the switching element is transmitted to the power-ground plane. As a result, the influence of the interference and interference is increased.

  In order to avoid such a phenomenon, a low-impedance line-type decoupling element (line element) is provided between a power line-ground plane and a wiring line connected to the switching element. Since the impedance of the line element is very low compared to the wiring line of the switching element, electromagnetic waves generated based on power supply voltage fluctuations generated by the switching element are reflected and do not reach the power supply-ground plane, thus reducing electromagnetic radiation. it can.

  There are Patent Documents 1 and 2 as techniques related to such a phenomenon.

  Patent Document 1 has a plurality of metal layers including a metal signal line that transmits a high-frequency signal and a ground metal layer for grounding disposed opposite to the metal signal line, and includes an externally exposed portion of the metal layer, In a high-frequency circuit module in which a metal bump is connected to a metal bump pad having a width larger than that of the metal signal line and is connected to an external connection terminal of the mounting board via the metal bump, a high frequency is connected to the mounting board. A high-frequency circuit module in which a slit made of a hole having an opening width smaller than a quarter wavelength of a high-frequency signal is provided at a corresponding position of a ground metal layer opposed to a metal bump pad that is a part of a transmission path for transmitting a signal. Has been.

  According to the high-frequency circuit component of the same document, in the high-frequency circuit module, the metal bump pad that is a part of the transmission path for transmitting the high-frequency signal is located at the corresponding position of the ground metal from the 1/4 wavelength of the high-frequency signal. Since a slit having a small opening width is provided, impedance mismatch at the metal bump pad portion can be reduced, and unnecessary radiation from the slit can be reduced.

Patent Document 2 includes a printed circuit board on which a power supply circuit and a transmission line type noise filter are mounted on the same surface, and the printed circuit board is formed on a mounting surface of the power supply circuit and the transmission line type noise filter. An electronic circuit comprising a predetermined first power line pattern, a predetermined second power line pattern, and a predetermined ground land pattern is described. The transmission line type noise filter includes a signal input terminal, a signal output terminal, and two ground terminals corresponding to each, and removes a high-frequency component of a DC voltage applied to the signal input terminal to output the signal. It is output from the terminal.
Japanese Patent Laying-Open No. 2005-79762 (Claim 1, Paragraph 0044) JP 2007-104266 A (Claim 1)

  However, in Patent Document 1, a slit having an opening width smaller than a quarter wavelength of a high-frequency signal is provided to reduce unnecessary radiation. However, in order to reflect noise in a wide frequency range, the electromagnetic wave is generated. The circuit side will be adversely affected. In Patent Document 2, power supply decoupling is performed using a line element (transmission line type noise filter), but there is no description regarding using a via connected to the line element as a filter. By forming a filter using vias, high performance of the line element can be realized without increasing the extra occupied area.

  As a decoupling method between circuits using a line element, a circuit as shown in FIG. 13 can be considered. FIG. 13 is a schematic plan view and a cross-sectional view showing an application example of the line element to inter-circuit decoupling. Specifically, FIG. 13A shows a plan view of the circuit 50, but for convenience of explanation, the signal wiring layer 109 and the ground plane 110 are omitted and the power supply plane 111 is seen through. FIG. 13B shows a cross-sectional view taken along line D-D ′ of FIG.

  As shown in FIG. 13B, the circuit 50 is formed as a four-layer substrate including a signal wiring layer 109, a ground plane 110, a power supply plane 111, and a signal wiring layer 112 from the upper side. The line element 100 has a structure in which a dielectric film 107 is sandwiched between metal plates 108a and 108b, and is connected between a power plane 111 and a ground plane 110. More specifically, four terminals are connected between the power supply plane 111-the ground plane 110 and a wiring line connected to the switching element. In the circuit 50, the wiring line connected to the switching element is composed of the second power source plane region 102 separated in an island shape and the ground plane 110 that is common throughout. This is because the decoupling effect of the line element 100 is enhanced by separating the power plane 111 into the first power plane area 101 and the second power plane area 102 and providing the line element 100 therebetween. On the other hand, the ground plane 110 is not separated in favor of the low impedance as a whole. The metal plate 108 a of the line element 100 has one end of the power supply wiring connected to the second power supply plane region 102 via the via 103 and the other end of the power supply wiring connected to the first power supply plane region 101 via the via 106. Further, the metal plate 108 b of the line element 100 is connected to the ground plane 110 at both ends of the ground wiring via the vias 104 and 105.

  However, in the circuit 50, the electromagnetic wave 130 is not totally reflected by the line element 100, and is transmitted from the gap between the vias 103 and 106 connected to the line element 100 to the power-ground plane (FIG. 13 ( b) There is a problem of transmission from the middle right to the left. Therefore, there is a problem that many electromagnetic waves including a desired electromagnetic wave cannot be reflected reliably.

  On the other hand, as a request in actual use when reflecting electromagnetic waves using a via connected to a line element as a filter, it is not required to reflect all electromagnetic waves. FIG. 14 is a schematic plan view of an example of a radio circuit in which an RF circuit and a digital circuit are mixedly mounted. In the wireless circuit 115, it is important to suppress electromagnetic waves generated by electromagnetic radiation from the digital circuit 113 from leaking into the RF circuit 114, but the signal frequency band of the RF circuit 114 is limited. For this reason, among the electromagnetic radiation generated in the digital circuit 113, only the component having an influence on the signal frequency band may be filtered by the via connected to the line element. For example, in the wireless LAN IEEE802.11a and IEEE802.11g, the carrier frequency is 2.4 GHz and the signal band is 20 MHz. Also, higher carrier frequencies and wider signal bands are being promoted. The function of reflecting the frequency of such a specific carrier may be filtered by a via connected to the line element.

  In the wireless circuit 115, when the power supply-ground plane of the digital circuit 113 is connected by the line element 100, the internal transmission of the line element 100 (which transmits the metal plates 108 a and 108 b) and the external direct coupling are used as electromagnetic coupling paths. (Electromagnetic wave 130) is considered. By connecting with the line element 100 (refer FIG. 13), both electromagnetic coupling can be interrupted | blocked over a high frequency broadband. However, if all the electromagnetic coupling is transmitted through the inside of the line element 100, the blocking performance of the line element 100 is high, but there is actually a direct coupling via the input of the line element 100 and the outside of the line element 100. Therefore, it is important to reliably block the electromagnetic wave that directly couples the outside of the electromagnetic coupling. In particular, in a radio circuit, it is important to surely block electromagnetic waves that directly couple outside from among the electromagnetic couplings in the specific frequency band.

  The object of the present invention has been made to solve the above problems. More specifically, it is to provide a circuit that can be reduced in size and reliably reflect a desired electromagnetic wave.

  A circuit of the present invention for solving the above-described problem includes a power plane, a ground plane, and a line element connected between the power plane and the ground plane, and at least one end of the line element and the The power plane or the ground plane is connected by a plurality of vias, and the plurality of vias are arranged substantially perpendicular to the traveling direction of the electromagnetic wave propagating between the power plane and the ground plane, and adjacent vias The plurality of vias are arranged in a zigzag shape by shifting in the traveling direction by a distance that is an odd multiple of 1/4 of the effective value of the wavelength of the electromagnetic wave.

  In a preferred aspect of the circuit of the present invention, both ends of the line element are connected to the power plane and the ground plane, respectively.

  In a preferred aspect of the circuit of the present invention, the adjacent vias are arranged shifted in the traveling direction by a distance of 1/4 of the effective value of the wavelength of the electromagnetic wave.

  In a preferred aspect of the circuit of the present invention, the power plane is divided into a first power plane area and a second power plane area, and both ends of the line element are respectively the first power plane area and the second power plane. Connected to the area.

  A semiconductor circuit of the present invention for solving the above-described problems uses the circuit.

  According to the present invention, it is possible to provide a circuit that can be miniaturized and reliably reflect a desired electromagnetic wave. More specifically, with respect to the reflection of electromagnetic waves, transmission of specific frequency components can be suppressed for electromagnetic noise based on switching noise generated in the switching element.

  Hereinafter, examples of the present invention will be described, but the present invention is not limited to the following examples, and can be arbitrarily modified and implemented without departing from the gist of the present invention.

  FIG. 1 is a schematic plan view and a cross-sectional view showing a first embodiment of the circuit of the present invention. Specifically, FIG. 1A shows a plan view of the circuit 51, but for convenience of explanation, the signal wiring layer 10 and the ground plane 11 are omitted and the power supply plane 12 is seen through. FIG. 1B shows a cross-sectional view taken along line A-A ′ of FIG.

  The circuit 51 includes a power plane 12, a ground plane 11, and a line element 1 connected between the power plane 12 and the ground plane 11, and at least both ends of the line element 1 and the power plane 12 are plural. The vias 4 and 7 are connected to each other, and the plurality of vias 4 and 7 are disposed substantially perpendicular to the traveling direction of the electromagnetic wave 131 propagating between the power plane 12 and the ground plane 11, and adjacent vias 4 and 7 are connected to each other. The plurality of vias 4 and 7 are arranged in a zigzag shape by shifting in the traveling direction of the electromagnetic wave 131 by an odd multiple of 1/4 of the effective value of the wavelength of the electromagnetic wave 131. In the circuit 51, both ends of the line element 1 are connected to the power supply plane 12 by a plurality of vias 4 and 7, respectively. However, if the plurality of vias are provided at at least one end of the line element, the effect of the present invention is achieved. Can be played. In the circuit 51, the power plane 12 is divided into a first power plane area 2 and a second power plane area 3 from the viewpoint of a decoupling effect as will be described later, and both ends of the line element 1 are respectively connected to the first power plane. The plane area 2 and the second power plane area 3 are connected. However, the power plane may be provided in a flat plate shape without being divided. Further, the circuit 51 can be used for a semiconductor circuit, but is not limited thereto.

  More specifically, as shown in FIG. 1B, the circuit 51 is formed on a four-layer substrate including the signal wiring layer 10, the ground plane 11, the power supply plane 12, and the signal wiring layer 13 from the upper side. . The line element 1 has a structure in which a dielectric film 8 is sandwiched between metal plates 9a and 9b. The metal plate 9a is a power supply wiring and the metal plate 9b is a ground wiring. The line element 1 is connected between the power plane 12 and the ground plane 11. More specifically, four terminals are connected between the power plane 12-the ground plane 11 and the wiring line connected to the switching element. In the circuit 51, the wiring line connected to the switching element is composed of the second power supply plane region 3 separated in an island shape and the ground plane 11 which is common throughout. This is because the decoupling effect of the line element 1 is enhanced by separating the power plane 12 into the first power plane area 2 and the second power plane area 3 and providing the line element 1 therebetween. On the other hand, the ground plane 11 is not separated in favor of the low impedance as a whole. The metal plate 9a of the line element 1 is connected to the second power plane region 3 and the vias 7a, 7b, 7c. The other end of the power supply wiring is connected to the first power supply plane region 2 through 7d. The metal plate 9 b of the line element 1 has both ends of the ground wiring connected to the ground plane 11 via vias 5 and 6.

  In the circuit 51, the first power plane area 2 and the metal plate 9a of the line element 1 are connected by a plurality of, specifically, four vias 7a, 7b, 7c, 7d, and the second power plane area. 3 and the metal plate 9a of the line element 1 are connected by a plurality of, specifically, four vias 4a, 4b, 4c, and 4d.

  In the circuit 51, a plurality of vias 4 a, 4 b, 4 c, 4 d are arranged substantially perpendicular to the traveling direction of the electromagnetic wave 131 propagating between the power plane 12 and the ground plane 11. Similarly, a plurality of vias 7 a, 7 b, 7 c, 7 d are arranged substantially perpendicular to the traveling direction of the electromagnetic wave 131 propagating between the power plane 12 and the ground plane 11. Further, in the plurality of vias 4a, 4b, 4c, and 4d, the adjacent via 4a and via 4b, via 4b and via 4c, and via 4c and via 4d are each ¼ of the effective value of the wavelength of the electromagnetic wave 131. The four vias 4a, 4b, 4c, and 4d are arranged in a zigzag shape by shifting in the traveling direction of the electromagnetic wave 131 by an odd multiple of the distance g. Similarly, in the plurality of vias 7a, 7b, 7c, and 7d, between the adjacent via 7a and via 7b, via 7b and via 7c, and between via 7c and via 7d, 1 / E of the effective value of the wavelength of the electromagnetic wave 131, respectively. The four vias 7a, 7b, 7c, and 7d are arranged in a zigzag pattern by shifting the electromagnetic wave 131 in the traveling direction by a distance g that is an odd multiple of four. The distance g is determined by measuring at the center of each of the cylindrical vias 4a, 4b, 4c, 4d and the vias 7a, 7b, 7c, 7d. More specifically, in the circuit 51, the distance g is set to ¼ of the effective value of the wavelength of the electromagnetic wave 131. That is, the distance g is set to 1 time out of odd times (1 time, 3 times, 5 times, 7 times,...). Thereby, the circuit 51 can be further downsized.

  In the circuit 51, the arrangement of the connection via row of the line element 1 is a zigzag arrangement as described above, so that among the components leaking out from the connection via row of electromagnetic noise based on the switching noise generated in the switching element, It becomes possible to have a filtering effect on the transmission of the frequency components. The vias 4a, 4b, 4c, and 4d and the vias 7a, 7b, 7c, and 7d are arranged in a zigzag manner at equal intervals from the viewpoint of facilitating design, but it is not always necessary to install them at equal intervals. . Further, the distance between adjacent vias 4a and 4b (the direction perpendicular to the AA ′ cross section in FIG. 1A and the depth direction in FIG. 1B) is equal to the wavelength of the electromagnetic wave 131. The distance. The same applies to the via 4b and the via 4c, the via 4c and the via 4d, the via 7a and the via 7b, the via 7b and the via 7c, and the via 7c and the via 7d. However, the lateral spacing is not particularly limited as long as it is within the scope of the present invention.

  In the circuit 51, the vias 4 and 7 are arranged in a zigzag manner with a predetermined interval, whereby the external direct electromagnetic coupling described above can be suppressed. That is, as described above, in the wireless circuit, when the power supply-ground plane of the digital circuit is connected by the line element, the electromagnetic coupling path may be internal transmission of the line element and direct external coupling. Since both can be cut off, the transmission electromagnetic coupling of the signal band components of the radio circuit and the digital circuit can be completely cut off.

  FIG. 2 is a schematic plan view and a cross-sectional view in which the circuit of the present invention is simplified. Specifically, FIG. 2A shows a plan view of the circuit 52, but for convenience of explanation, the ground plane 11 is omitted and the power supply plane 12 is seen through. FIG. 2B is a cross-sectional view taken along the line B-B ′ of FIG.

  The circuit 52 is the same as the circuit 51 shown in FIG. 1 except that the signal wiring layers 10 and 13 and the vias 5 and 6 are omitted, and the first power plane area 2 and the second power plane area 3 constituting the power plane 12 are 2 The power supply plane area 3 is not surrounded by the first power supply plane area 2 (is separated in the form of islands), but the first power supply plane area 2 and the second power supply plane area 3 are separated from each other. Are arranged.

  In the circuit 52, the distance between the via row 4 and the via row 7 is 40 mm, and the distance g (via transmission direction interval) shifted in the transmission direction of the electromagnetic wave 131 in each of the via rows 4 and 7 is 2.5 mm. The interval in the transmission direction vertical direction (the direction perpendicular to the BB ′ cross section in FIG. 2A and the depth direction in FIG. 2B) is 2.5 mm, and the via diameter is 0.5 mm. The relative dielectric constant of the dielectric in the substrate (in the ground plane 11 and the power plane 12) is 4.3. With regard to this structure, an electromagnetic field simulation was performed with mw-studio, and Ports were provided at both ends, and S parameters were calculated and radiation from the power plane opening was calculated.

  FIG. 8 is a schematic plan view and a cross-sectional view in which a circuit in which the via is not shifted in the traveling direction of the electromagnetic wave is simplified. Specifically, FIG. 8A shows a plan view of the circuit 53, but for convenience of explanation, the ground plane 110 is omitted and the power supply plane 111 is seen through. FIG. 8B is a cross-sectional view taken along line E-E ′ of FIG.

  In the circuit 53, the plurality of vias 103 and 106 are not shifted from the traveling direction of the electromagnetic wave 131 by a distance that is ¼ of the effective value of the wavelength of the electromagnetic wave 131. That is, the vias 103 and 106 are arranged in a line. Specifically, the circuit 53 has the same configuration as the circuit 52 except that the vias 103 and 106 are arranged in a line and the interval is set to 2.5 mm. Similarly to the circuit 52, the circuit 53 was subjected to electromagnetic field simulation with mw-studio, and Ports were provided at both ends, and the S parameter was calculated and the radiation from the opening of the power plane was calculated.

  FIG. 3 is a graph showing the calculation result of the S parameter (S21) of the circuit shown in FIG. FIG. 9 is a graph showing the calculation result of the S parameter (S21) of the circuit shown in FIG. In the case of the dimensions of the circuit 52 shown in FIG. 2, the specific frequency is 14.5 GHz (specific wavelength (wavelength of the electromagnetic wave 131) = 4 × √εr × distance g = 4 × √4.3 × 2.5 mm = 20.7 mm. ). As shown in FIGS. 3 and 9, the circuit 52 in FIG. 2 has an attenuation at 14 GHz as compared with the circuit 53 in FIG. 8. The specific wavelength is calculated by using the multilayer interference equation at the time of vertical incidence. In the circuit 52 of FIG. 2, since a specific wavelength is calculated using a multilayer via as a multilayer film, a slight shift is recognized, but it is considered that the circuit 52 can be sufficiently used as a design standard.

  FIG. 4 is a graph showing radiation from the power plane opening in the circuit shown in FIG. FIG. 10 is a graph showing radiation from the power plane opening in the circuit shown in FIG. As can be seen by comparing FIGS. 4 and 10, the difference between the two is small regarding radiation. In general, there are two types of electromagnetic coupling between a radio circuit and a digital circuit: transmission noise via power supply-ground and spatial noise due to radiation from the power plane opening. Thus, even if the vias are arranged in a zigzag pattern, it is considered that there is no adverse effect on the spatial noise due to the radiation from the power plane opening. In addition, as described above, the transmission noise is reduced.

  As described above, by adopting the circuit configuration of the present invention, transmission of power noise of a specific frequency through the power plane-ground plane can be reduced, while radiation from the power plane opening is not different and adverse effects occur. It was shown not to.

  FIG. 5 is a graph showing the calculation result of the S parameter (S21) when the shift amount of the electromagnetic wave direction of the plurality of vias in the circuit of FIG. 2 is further reduced to 1/5 (g = 0.5 mm). FIG. 11 is a graph showing the calculation result of the S parameter (S21) when the interval between the plurality of vias in the circuit of FIG. 8 is further reduced to 1/5 (0.5 mm). FIG. 6 is a graph showing radiation from the power plane opening when the shift amount of the electromagnetic wave direction of the plurality of vias in the circuit of FIG. 2 is further reduced to 1/5 (g = 0.5 mm). FIG. 12 is a graph showing radiation from the power plane opening when the interval between the plurality of vias in the circuit of FIG. 8 is further reduced to 1/5 (0.5 mm).

  As can be seen by comparing FIGS. 6 and 12, it can be seen that the radiation hardly changes between when the plurality of vias are shifted in the traveling direction of the electromagnetic wave and when the vias are not shifted. On the other hand, as can be seen by comparing FIGS. 5 and 11, the attenuation frequency is around 72.5 GHz, which is five times 14.5 GHz in the dimension (g = 2.5 mm) of the circuit 52 shown in FIG. You can see that it has moved to.

  FIG. 7 is a schematic plan view and a sectional view showing a second embodiment of the circuit of the present invention. Specifically, FIG. 7A shows a plan view of the circuit 54, but for convenience of explanation, the signal wiring layer 10 is omitted and the power supply plane 12 is seen through. FIG. 7B shows a cross-sectional view taken along C-C ′ of FIG.

  The circuit 54 includes a power plane 12, a ground plane 11, and a line element 1 connected between the power plane 12 and the ground plane 11, and at least both ends of the line element 1 and the ground plane 11 include a plurality of lines. The vias 5 and 6 are connected to each other, and the plurality of vias 5 and 6 are arranged substantially perpendicular to the traveling direction of the electromagnetic wave 131 propagating between the power plane 12 and the ground plane 11, and adjacent vias 5 and 6 are connected to each other. The plurality of vias 5 and 6 are arranged in a zigzag shape by shifting in the traveling direction of the electromagnetic wave 131 by an odd multiple of 1/4 of the effective value of the wavelength of the electromagnetic wave 131. In the circuit 54, both ends of the line element 1 are connected to the ground plane 11 by a plurality of vias 5 and 6, respectively. However, if the plurality of vias are provided at at least one end of the line element, the effect of the present invention is achieved. Can be played.

  In the circuit 54, the upper and lower sides of the power plane 12 and the ground plane 11 are switched, and the vias 5 and 6 existing between the power plane 12 and the ground plane 11 connect the metal plate 9 b of the line element 1 and the ground plane 11. The circuit 51 is the same as the circuit 51 shown in FIG. 1 except that the via is connected. Therefore, the same design variation as that described in the circuit 51 can be adopted. Also in the circuit 54, the same effect as the circuit 51 shown in FIG.

  Note that the circuit of the present invention can be configured using vias existing between the power plane and the ground plane of the substrate, regardless of the power supply and the ground, among the connection vias of the line element.

It is the typical top view and sectional view showing the 1st example of the circuit of the present invention. It is the typical top view and sectional drawing which simplified the circuit of this invention. It is a graph which shows the calculation result of S parameter (S21) of the circuit shown in FIG. 3 is a graph showing radiation from a power plane opening in the circuit shown in FIG. It is a graph which shows the calculation result of S parameter (S21) in case the shift amount of the electromagnetic wave direction of several vias of the circuit of FIG. 2 is further set to 1/5 (g = 0.5 mm). 3 is a graph showing radiation from the power plane opening when the amount of shift in the electromagnetic wave direction of a plurality of vias in the circuit of FIG. 2 is further reduced to 1/5 (g = 0.5 mm). It is the typical top view and sectional view showing the 2nd example of the circuit of the present invention. It is the typical top view and sectional drawing which simplified the circuit which does not shift a via to the advancing direction of electromagnetic waves. It is a graph which shows the calculation result of S parameter (S21) of the circuit shown in FIG. It is a graph which shows the radiation | emission from the power plane opening in the circuit shown in FIG. FIG. 9 is a graph showing a calculation result of an S parameter (S21) when the interval between a plurality of vias in the circuit of FIG. 8 is further reduced to 1/5 (0.5 mm). FIG. 9 is a graph showing radiation from the power plane opening when the interval between a plurality of vias in the circuit of FIG. 8 is further reduced to 1/5 (0.5 mm). It is the typical top view and sectional view which show the example of application to the decoupling between circuits of a line element. It is a schematic plan view of an example of a radio circuit in which an RF circuit and a digital circuit are mixedly mounted.

Explanation of symbols

50, 51, 52, 53, 54 Circuit 1,100 Line element 2,101 First power plane area 3,102 Second power plane area 4 (4a, 4b, 4c, 4d), 5, 6, 7 (7a, 7b, 7c, 7d), 103, 104, 105, 106 Via 8, 107 Dielectric film 9 (9a, 9b), 108 (108a, 108b) Metal plate 10, 13, 109, 112 Signal wiring layer 11, 110 Ground Plane 12, 111 Power plane 113 Digital circuit 114 RF circuit 115 Radio circuit 130, 131 Electromagnetic wave

Claims (5)

A power plane, a ground plane, and a line element connected between the power plane and the ground plane,
At least one end of the line element and the power plane or the ground plane are connected by a plurality of vias,
The plurality of vias are disposed substantially perpendicular to the traveling direction of electromagnetic waves propagating between the power plane and the ground plane,
Arranging the plurality of vias in a zigzag manner by shifting adjacent vias in the traveling direction by a distance that is an odd multiple of 1/4 of the effective value of the wavelength of the electromagnetic wave,
A circuit characterized by that.   The circuit according to claim 1, wherein both ends of the line element are connected to the power plane and the ground plane, respectively.   The circuit according to claim 1, wherein the adjacent vias are arranged so as to be shifted in the traveling direction by a distance that is ¼ of an effective value of the wavelength of the electromagnetic wave.   The power plane is divided into a first power plane area and a second power plane area, and both ends of the line element are connected to the first power plane area and the second power plane area, respectively. 4. The circuit according to any one of 3 above.   A semiconductor circuit using the circuit according to claim 1.

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