JP2009224444A - Method of manufacturing metallized film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a metallized film in which even a thin film doesn't receive any heat damage when forming a metal deposition electrode. <P>SOLUTION: A heat applied to a PP film 1 can be reduced by a method which has a patterning process of forming a mask section on the PP film 1 and a deposition process of forming the metal deposition electrode in addition to the mask section and uses the PP film 1 with a thickness of ≤2.5 μm and forms a margin while cooling the PP film 1 in the patterning process. Accordingly, the PP film 1 does not receive any heat damage even if a metallized film 1a is made by using a thin PP film 1 with a thickness of ≤2.5 μm, thereby the metallized film 1a having a superior performance and a superior quality can be stably produced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is used in various electronic equipment, electrical equipment, industrial equipment, automobiles, and the like, and in particular, when manufacturing metallized film capacitors optimal for smoothing, filtering, and snubbing of motor drive inverter circuits in hybrid cars. It is related with the manufacturing method of the metallized film used.

  In recent years, from the viewpoint of environmental protection, all electrical devices are controlled by inverter circuits, and energy saving and high efficiency are being promoted. In particular, in the automobile industry, hybrid vehicles (hereinafter referred to as HEVs) that run on electric motors and engines have been introduced into the market, and the development of technologies relating to energy saving and high efficiency has been activated, which is friendly to the global environment.

  Since such a HEV electric motor has a high operating voltage range of several hundred volts, a metallized film capacitor having high withstand voltage and low loss electric characteristics as a capacitor used in connection with such an electric motor. In addition, the trend of adopting metalized film capacitors with a very long life is conspicuous due to the demand for maintenance-free in the market.

  Such metallized film capacitors are roughly classified into those generally using a metal foil as an electrode and those using a deposited metal provided on a dielectric film as an electrode. Among these, metallized film capacitors that use vapor-deposited metal as an electrode (hereinafter referred to as metal vapor-deposited electrode) have a smaller volume occupied by the electrode compared to that of metal foil and can be reduced in size and weight. High reliability in dielectric breakdown due to recovery function (capacity of metal evaporated electrode around the defective part evaporates and scatters and insulates when the short-circuit occurs in the defective part) Therefore, it has been widely used conventionally.

  FIG. 4 is a schematic cross-sectional view showing the structure of this type of conventional metallized film capacitor, and FIG. 5 is a schematic diagram of a first metallized film used in this metallized film capacitor. , 21 and 21a are dielectric films, 22 and 22a are metal deposition electrodes deposited on the dielectric films 21 and 21a, and 23 and 23a are such metal deposition electrodes formed thick to reduce the resistance value. A resistance part, 24 is a fuse part that divides a divided electrode, which will be described later, when a micro breakdown occurs, 25 and 25a are margin parts where metal deposition is not performed, 25b is a width of the margin parts 25 and 25a, and 26 is connected by the fuse part 24. An electrode partition part for forming a divided electrode, 27 is a width of the low resistance parts 23 and 23a, 28 is a micro block partitioned into divided electrodes by the electrode partition part 26, 29 First metal films, 30 shows a second metallized film.

  The first metallized film 29 and the second metallized film 30 thus configured are opposed to the metal vapor-deposited electrodes 22 and 22a through the dielectric films 21 and 21a as shown in FIG. Thus, a metallized film capacitor was formed by forming an element by winding and forming a metallicon electrode (not shown) by metal spraying on both end faces of the element (Patent Document) 1).

  FIG. 6 is a conceptual diagram showing the configuration of the main part of a winding type vacuum vapor deposition apparatus which is a conventional metallized film manufacturing apparatus for manufacturing a metallized film used in this type of metallized film capacitor. FIG. 7 is a conceptual diagram showing the configuration of the pattern forming unit of the apparatus. In FIGS. 6 and 7, the take-up vacuum deposition apparatus 31 includes a vacuum chamber 32 and an unwinding roller 34 for the raw material film 33. A cooling can roller 35, a take-up roller 36, and an evaporation source 37 for a vapor deposition material, and further includes a pattern forming unit 41, an electron beam irradiator 42, a DC bias power source 43, and a charge eliminating unit 44. .

  The vacuum chamber 32 is connected to an evacuation system such as a vacuum pump (not shown) via pipe connection portions 32a and 32c, and the inside thereof is evacuated to a predetermined degree of vacuum. The internal space of the vacuum chamber 32 is partitioned by a partition plate 32b into a chamber in which the unwinding roller 34, the winding roller 36, and the like are disposed, and a chamber in which the evaporation source 37 is disposed.

  The raw material film 33 is unwound from the unwinding roller 34 and is wound around the winding roller 36 via a plurality of guide rollers 38, a can roller 35, an auxiliary roller 39, and a plurality of guide rollers 40.

  The can roller 35 is cylindrical and made of metal such as iron, and is provided with a cooling mechanism such as a cooling medium circulation system, a rotation drive mechanism for rotating the can roller 35, and the like. The raw material film 33 is wound around the circumferential surface of the can roller 35 at a predetermined holding angle. The raw material film 33 wound around the can roller 35 is cooled by the can roller 35 at the same time the film forming surface on the outer surface side is formed with the vapor deposition material from the evaporation source 37.

  The evaporation source 37 contains a vapor deposition material and has a mechanism for heat vapor deposition of the vapor deposition material by a known method such as resistance heating, induction heating, or electron beam heating. The evaporation source 37 is disposed below the can roller 35 and deposits vapor of the vapor deposition material on the raw material film 33 on the opposing can roller 35 to form a coating film.

  The pattern forming unit 41 is composed of a flexographic printing unit, and an ink supply roll 45 such as an anilox roll and the ink (oil) supplied from the ink supply roll 45 are transferred to form a film formation surface of the raw material film 33. A plate cylinder 46 for forming a mask pattern, and a pressure cylinder 47 that is opposed to the plate cylinder 46 and sandwiches the raw material film 33 in a pair with the plate cylinder 46.

  A transfer roll 48 is transferred between the plate cylinder 46 and the ink supply roll 45. The transfer roll 48 is supplied with a required amount of ink from the ink supply roll 45, and the supplied ink is supplied to the plate cylinder. Transfer to 46. A relief plate corresponding to the mask pattern is formed on the surface of the plate cylinder 46, and the ink transferred to the convex surface is transferred to the film formation surface of the raw material film 33 to form a mask pattern. The plate cylinder 46 is constituted by a seamless (seamless) sleeve printing plate.

In the winding type vacuum vapor deposition apparatus, which is a conventional metallized film manufacturing apparatus configured as described above, a seamless sleeve printing plate is used for the plate cylinder of the flexographic printing unit that constitutes the mask forming means. A desired mask pattern can be continuously formed with high accuracy on the film-forming surface, thereby improving the productivity of the film capacitor and ensuring the reliability (Patent Document 2). ).
JP 2005-85870 A JP 2006-225710 A

  When the metallized film capacitor as described above is used for automobiles typified by hybrid vehicles, there is a great demand for reduction in size and weight, and the metallized film is the most effective means for meeting such demands. It is conceivable to reduce the thickness of the film. For this reason, both the development of a technique for reducing the thickness of the dielectric film itself and the development of a technique for making full use of the thin dielectric film are carried out every day.

  In addition, as such a dielectric film, a polypropylene film (hereinafter referred to as a PP film) that is currently used on a mass production basis, with a thickness of 3.0 μm being the thinnest, Development of further thinning has been advanced, and today, PP films having a thickness of about 2.0 μm are now available.

  However, the PP film thinned to a thickness of less than 3.0 μm is not only difficult to handle because of its thin thickness, but in particular, a metallized film is formed by forming a metal vapor deposition electrode on the PP film. When the work is performed in the same manner as a conventional PP film having a thickness of 3.0 μm, the heat applied to the PP film is likely to cause damage to the PP film, thereby using this metallized film. There was a problem of adversely affecting the performance of the product.

  In addition, in the conventional PP film having a thickness of 3.0 μm or more, the heat damage generated at the time of vapor deposition is a heat applied to the PP film by taking measures such as cooling a portion where the heat is high in the manufacturing apparatus. Although it was intended to prevent the influence of damage, when using a very thin PP film with a thickness of less than 3.0 μm, it is extremely difficult to cope with only such conventional technology. There is a need to introduce new technology.

  In addition, the occurrence of such heat damage is not only easily affected by heat when forming a metal vapor deposition electrode by vapor deposition because the PP film itself is thin, but also thin due to tension applied to run the PP film. It seems to occur because the PP film becomes easier to stretch.

  The present invention solves such a conventional problem, and even when a metallized film is produced using a thin PP film having a thickness of less than 3.0 μm, excellent performance is achieved by suppressing the occurrence of thermal damage during vapor deposition. It is an object of the present invention to provide a method for producing a metallized film capable of exhibiting quality.

  In order to solve the above-described problems, the present invention forms a pattern forming step of forming a mask portion to be a metal vapor deposition electrode non-formed portion on a dielectric film, and forms a metal vapor deposition electrode on the dielectric film excluding the mask portion. In the method of manufacturing a metallized film having a vapor deposition step, a polypropylene film having a thickness of 2.5 μm or less is used as the dielectric film, and a margin is formed while cooling the dielectric film in the pattern forming step. Of the method.

  As described above, the metallized film manufacturing method according to the present invention can reduce the heat applied to the dielectric film by the method of forming the mask portion while cooling the dielectric film in the pattern forming step. Therefore, even if a metallized film is made using a thin polypropylene film with a thickness of less than 3.0 μm as the dielectric film, the dielectric film will not be damaged by heat, so excellent performance and quality The effect that it becomes possible to stably produce a metallized film capable of exhibiting the above is obtained.

(Embodiment 1)
Hereinafter, the first and second aspects of the present invention will be described with reference to the first embodiment.

  FIG. 1 is a conceptual diagram showing a configuration of a main part of a metallized film manufacturing apparatus for explaining a metallized film manufacturing method according to Embodiment 1 of the present invention. In FIG. 1, 1 is a dielectric film. In this embodiment, a polypropylene film having a thickness of 2 μm is used. Reference numeral 2 denotes a supply unit that feeds out the PP film 1, and 3 denotes a winding unit that winds up the metallized film 1 a produced by forming a metal vapor deposition electrode to be described later on the PP film 1.

  Reference numeral 4 denotes a pattern forming portion for forming a mask portion on which the metal vapor deposition electrode described later is not formed on the PP film 1, and 5 denotes a portion excluding the mask portion formed on the PP film 1 by the pattern forming portion 4. It is a vapor deposition part which forms a metal vapor deposition electrode.

  The pattern forming unit 4 includes an oil tank 6 that vaporizes oil as a metal adhesion preventing agent and ejects the oil from a nozzle, and a transfer roll 7 that rotates by attaching the oil ejected from the nozzle of the oil tank 6 to the peripheral surface. And a pattern-forming relief printing portion on which the oil adhered to the peripheral surface of the transfer roll 7 is transferred to the peripheral surface and rotated in synchronism with the transport of the PP film 1, thereby providing a margin on the surface of the PP film 1. A printing roll 8 that prints a pattern to be formed, and a backup roll 9 that faces the printing roll 8 and that is in contact with the back surface of the PP film 1. 7, at least one of the printing roll 8 and the backup roll 9 is provided with a cooling mechanism (not shown) inside.

  The vapor deposition section 5 heats and evaporates a metal for forming a metal vapor deposition electrode (in this embodiment, aluminum is used, but the present invention is not limited to this), and the evaporated metal Is formed by an evaporation source 10 that vapor-deposits on the surface of the PP film 1, and a cooling roll 11 that faces the evaporation source 10 and contacts the back surface of the PP film 1 to cool the PP film 1 from the back surface. It is what has been.

  The metallized film manufacturing apparatus configured as described above includes the marginal part 25 and the electrode partitioning part 26 of the metallized film described with reference to FIG. After forming the mask part by the pattern forming part 4 by the oil mask method, the metallized film is formed by forming the metal vapor deposition electrode on the part excluding the mask part by the vapor deposition part 5.

  Then, in order to reduce thermal damage that the PP film 1 receives by the vaporized oil by the pattern forming unit 4 that forms the mask unit by the oil mask method, at least one of the transfer roll 7, the printing roll 8, and the backup roll 9 is used. In addition, since the cooling mechanism (not shown) is provided inside, the thermal damage can be suppressed and the efficiency of oil adhesion to the PP film 1 can be improved, so that the dielectric film has a thickness of 2 μm. Even when an extremely thin PP film 1 is used, since the PP film 1 is not subject to thermal damage, a metallized film capable of exhibiting excellent performance and quality can be stably produced. It has a special effect of becoming.

  In addition, for the purpose of confirming such effects, one of the transfer roll 7, the printing roll 8, and the backup roll 9 is provided with a cooling mechanism provided with a cooling mechanism so that the surface temperature of each part does not exceed 100 ° C. The result of confirming the temperature rise, the surface temperature rise of each part when the cooling mechanism is provided in all parts under the above-mentioned conditions, and the presence or absence of thermal damage of the PP film 1, and the conventional example as a comparative example without the cooling mechanism Comparison is shown in (Table 1).

  As apparent from Table 1, the metallized film manufacturing apparatus according to the present embodiment increases the temperature of each part by providing a cooling mechanism in at least one of the transfer roll 7, the printing roll 8, and the backup roll 9. It is understood that it is possible to suppress the thermal damage of the PP film 1 and further, the effect can be obtained more remarkably by providing a cooling mechanism for all, and there is no cooling mechanism. Special effects can be obtained compared to the conventional example.

(Embodiment 2)
Hereinafter, the second and second embodiments of the present invention will be described.

  The present embodiment is different from the first embodiment in that an insulating margin forming portion is provided in the metallized film manufacturing apparatus for explaining the metallized film manufacturing method described with reference to FIG. Since the configuration other than this is the same as that of the first embodiment, the same reference numerals are given to the same portions and the detailed description thereof is omitted, and only different portions will be described in detail below with reference to the drawings.

  FIG. 2 is a conceptual diagram showing a configuration of a main part of a metallized film manufacturing apparatus for explaining a metallized film manufacturing method according to Embodiment 2 of the present invention. In FIG. 2, 12 is a dielectric film. An insulating margin forming portion 13 for forming an insulating margin which is a portion in which the metal vapor deposition electrode is not formed in the longitudinal direction is provided upstream of the insulating margin forming portion 12, and is in contact with the back surface of the dielectric film to attach the dielectric film. It is the cooling roll arrange | positioned so that it may cool from a back surface.

  The insulating margin forming portion 12 is applied to an oil tank 14 that vaporizes oil as a metal adhesion preventing agent and ejects the oil from the nozzle, and a back surface of the PP film 1 to which the oil ejected from the nozzle of the oil tank 14 adheres. The backup roll 15 is arranged so as to be in contact with the backup roll 15. Further, the backup roll 15 is provided with a cooling mechanism (not shown) inside.

  In addition to the effects obtained by the metallized film manufacturing apparatus according to the first embodiment, the metallized film manufacturing apparatus according to the present embodiment configured as described above has a mask portion that is a part where no metal vapor deposition electrode is formed. In addition to providing a cooling mechanism for the backup roll 15 constituting the insulating margin forming portion 12 having a large area (that is, heat generation is high), the PP film 1 is moved by the cooling roll 13 before the insulating margin forming portion 12. The cooling structure can suppress the temperature rise when forming the insulation margin and improve the efficiency of oil adhesion onto the PP film 1, so that the dielectric film has a thickness of 2 μm. Even when such an extremely thin PP film 1 was used, the PP film 1 was not damaged by heat. The one in which exhibits the significant effect that it is possible to stably produce a metallized film which can exhibit excellent performance and quality.

  Moreover, as a result of examining the cooling mechanism of the cooling roll 13 for the purpose of confirming such an effect, there is an effect in suppressing the thermal damage of the PP film 1 by setting the surface temperature to 80 ° C. or less. I understood.

(Embodiment 3)
The third aspect of the present invention will be described below with reference to the third embodiment.

  The present embodiment is different from the first embodiment in that a protective film forming unit is provided in the metallized film manufacturing apparatus for explaining the metallized film manufacturing method described with reference to FIG. Since the configuration other than this is the same as that of the first embodiment, the same reference numerals are given to the same portions and the detailed description thereof is omitted, and only different portions will be described in detail below with reference to the drawings.

  FIG. 3 is a conceptual diagram showing a configuration of a main part of a metallized film manufacturing apparatus for explaining a metallized film manufacturing method according to Embodiment 3 of the present invention. In FIG. It is a protective film formation part which forms a protective film on the said metal vapor deposition electrode of the metallized film 1a provided by forming the metal vapor deposition electrode on the surface of PP film 1 in the vapor deposition part 5 in the downstream of this.

  The protective film forming portion 16 abuts on an oil tank 17 that evaporates oil as a protective film and ejects the oil from the nozzle, and a back surface of the metallized film 1a to which the oil ejected from the nozzle of the oil tank 17 adheres. The backup roll 18 is arranged as described above, and the backup roll 18 is provided with a cooling mechanism (not shown) inside.

  The metallized film manufacturing apparatus according to the present embodiment configured as described above forms a metal vapor deposition electrode on the surface of the PP film 1 in addition to the effects obtained by the metallized film manufacturing apparatus according to the first embodiment. When the protective film is formed on the metal vapor deposition electrode of the metallized film 1a produced by this, the metallized film 1a is cooled from the back surface by the backup roll 18, so that the protective film is formed. Since the temperature rise can be suppressed and the oil adhesion efficiency to the PP film 1 can be improved, the PP film 1 can be used even when the extremely thin PP film 1 having a thickness of 2 μm is used as the dielectric film. Because it is not subject to thermal damage, it stabilizes the metallized film that can exhibit excellent performance and quality. It is intended to achieve the significant effect that it is possible to produce.

  In addition, as a result of examining the cooling mechanism of the backup roll 18 for the purpose of confirming such an effect, the efficiency of oil adhesion to the PP film 1 can be improved by reducing the surface temperature to 80 ° C. or less, and the degree of vacuum is reduced. It was found that the decrease can be suppressed.

  The method for producing a metallized film according to the present invention can suppress heat generated when producing a metallized film, so even when using a very thin dielectric film having a thickness of less than 3.0 μm, Since the dielectric film is not subject to thermal damage, it is possible to stably produce a metallized film capable of exhibiting excellent performance and quality, and a metallized film capacitor using the same. In particular, it is useful as a capacitor in the field of automobiles that are required to be small and light.

The conceptual diagram which showed the structure of the principal part of the manufacturing apparatus of the metallized film for demonstrating the manufacturing method of the metallized film by Embodiment 1 of this invention. The conceptual diagram which showed the structure of the principal part of the manufacturing apparatus of the metallized film for demonstrating the manufacturing method of the metallized film by Embodiment 2 of this invention. The conceptual diagram which showed the structure of the principal part of the manufacturing apparatus of the metallized film for demonstrating the manufacturing method of the metallized film by Embodiment 3 of this invention. Cross-sectional schematic diagram showing the structure of a conventional metallized film capacitor Schematic diagram of the first metallized film used in the metallized film capacitor The conceptual diagram which showed the structure of the principal part of the winding type vacuum vapor deposition apparatus which is the manufacturing apparatus of the conventional metallized film The conceptual diagram which showed the structure of the pattern formation unit of the apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 PP film 1a Metallized film 2 Supply part 3 Winding part 4 Pattern formation part 5 Deposition part 6, 14, 17 Oil tank 7 Transfer roll 8 Printing roll 9, 15, 18 Backup roll 10 Evaporation source 11, 13 Cooling roll 12 Insulation margin forming part 16 Protective film forming part

Claims (5)

Production of a metallized film having a pattern forming step for forming a mask portion to be a metal vapor deposition electrode non-formed portion on a dielectric film and a vapor deposition step for forming a metal vapor deposition electrode on the dielectric film excluding the mask portion In the method, a method for producing a metallized film, wherein a polypropylene film having a thickness of less than 3.0 μm is used as the dielectric film, and the mask portion is formed while cooling the dielectric film in the pattern forming step. In the pattern formation process, the dielectric film is cooled by an oil tank that vaporizes oil as a metal adhesion inhibitor and ejects it from the nozzle, and the oil ejected from the nozzle of this oil tank adheres to the peripheral surface and rotates. A transfer roll, and a relief plate for pattern formation to which oil attached to the peripheral surface of the transfer roll is transferred to the peripheral surface, and is rotated on the surface of the dielectric film by rotating in synchronization with the conveyance of the dielectric film. The above-described transfer roll, printing roll, and backup of a pattern forming apparatus comprising a printing roll that prints a pattern to be a mask portion, and a backup roll that faces the printing roll and is disposed so as to contact the back surface of the dielectric film The metallized fill according to claim 1, wherein cooling is provided by providing a cooling mechanism in at least one of the rolls. The method of production. An insulating margin forming step is provided in which an insulating margin is formed continuously in the longitudinal direction of the dielectric film so that the metal vapor deposition electrode is not formed, and the insulating margin is formed while cooling the dielectric film in the insulating margin forming step. The method of cooling the dielectric film in the insulating margin forming step is to provide an oil tank that vaporizes oil as a metal adhesion preventing agent and ejects the oil from the nozzle, and a dielectric that adheres the oil ejected from the nozzle of the oil tank. 2. The method for producing a metallized film according to claim 1, wherein a cooling mechanism is provided on the backup roll of an insulation margin forming apparatus comprising a backup roll disposed so as to contact the back surface of the body film. . 4. The method of manufacturing a metallized film according to claim 3, wherein the dielectric film is cooled before passing through the insulating margin forming step. After the vapor deposition step, a protective film forming step is provided for forming a protective film on the metal vapor deposition electrode formed on the surface of the dielectric film. In this protective film forming step, the protective film is formed while cooling the dielectric film. In this protective film forming step, the method of performing the process while cooling the dielectric film attaches the oil tank that evaporates the oil as the protective film and ejects it from the nozzle, and the oil ejected from the nozzle of this oil tank. The manufacturing of the metallized film according to claim 1, wherein a cooling film is provided on the backup roll of a protective film forming apparatus comprising a backup roll disposed so as to contact the back surface of the dielectric film. Method.

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